CN114223318A - 散热器和电子设备单元 - Google Patents

散热器和电子设备单元 Download PDF

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Publication number
CN114223318A
CN114223318A CN202080057243.2A CN202080057243A CN114223318A CN 114223318 A CN114223318 A CN 114223318A CN 202080057243 A CN202080057243 A CN 202080057243A CN 114223318 A CN114223318 A CN 114223318A
Authority
CN
China
Prior art keywords
base plate
substrate
wall
heat sink
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080057243.2A
Other languages
English (en)
Chinese (zh)
Inventor
太田武志
中岛雄二
矢口裕一朗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Infrastructure Systems and Solutions Corp
Original Assignee
Toshiba Corp
Toshiba Infrastructure Systems and Solutions Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Infrastructure Systems and Solutions Corp filed Critical Toshiba Corp
Publication of CN114223318A publication Critical patent/CN114223318A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
CN202080057243.2A 2019-12-20 2020-10-15 散热器和电子设备单元 Pending CN114223318A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-229997 2019-12-20
JP2019229997A JP6877523B1 (ja) 2019-12-20 2019-12-20 ヒートシンク、および電子機器ユニット
PCT/JP2020/038943 WO2021124665A1 (ja) 2019-12-20 2020-10-15 ヒートシンク、および電子機器ユニット

Publications (1)

Publication Number Publication Date
CN114223318A true CN114223318A (zh) 2022-03-22

Family

ID=75961512

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080057243.2A Pending CN114223318A (zh) 2019-12-20 2020-10-15 散热器和电子设备单元

Country Status (5)

Country Link
JP (1) JP6877523B1 (ko)
KR (1) KR102642224B1 (ko)
CN (1) CN114223318A (ko)
TW (1) TWI785379B (ko)
WO (1) WO2021124665A1 (ko)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1197594A (ja) * 1997-09-19 1999-04-09 Toshiba Corp ヒートシンク固定装置
JP4156132B2 (ja) * 1999-06-15 2008-09-24 株式会社Ｐｆｕ 半導体モジュール装置
US6404634B1 (en) * 2000-12-06 2002-06-11 Hewlett-Packard Company Single piece heat sink for computer chip
CN1443000A (zh) * 2002-03-01 2003-09-17 王松 一种彩色显示屏配套的电子产品的结构设计
ITPR20020040A1 (it) * 2002-07-26 2004-01-26 Sig Technology Ltd Procedimento e dispositivo per l'estrazione di succo di mele, pere, pesche e piu' in genere di frutta e vegetali
KR100728212B1 (ko) * 2005-11-30 2007-06-13 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
CN101018467B (zh) * 2006-02-11 2010-05-26 富准精密工业(深圳)有限公司 散热装置
TWM324129U (en) * 2007-02-16 2007-12-21 Asia Vital Components Co Ltd Screw based fixing structure for heat dissipation module
JP5068098B2 (ja) * 2007-04-25 2012-11-07 三菱電機株式会社 放熱装置
CN102841660A (zh) * 2011-06-23 2012-12-26 鸿富锦精密工业（深圳）有限公司 电脑散热系统
CN203193781U (zh) * 2013-05-06 2013-09-11 深圳市锐吉电子科技有限公司 一种防水电视
KR102391167B1 (ko) * 2017-06-08 2022-04-27 주식회사 만도 방열 어셈블리
JP6400815B1 (ja) 2017-09-29 2018-10-03 株式会社東芝 電子機器
JP6741257B2 (ja) * 2018-11-20 2020-08-19 Ｎｅｃプラットフォームズ株式会社 電子機器の放熱構造及び電子機器

Also Published As

Publication number Publication date
TWI785379B (zh) 2022-12-01
KR102642224B1 (ko) 2024-03-04
JP6877523B1 (ja) 2021-05-26
TW202126157A (zh) 2021-07-01
WO2021124665A1 (ja) 2021-06-24
KR20220047372A (ko) 2022-04-15
JP2021100018A (ja) 2021-07-01

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