TWI785379B - electronic machine unit - Google Patents

Abstract

[Problem] Provide an electronic equipment unit with a new structure that can be adapted to fanless electronic equipment with fewer problems.

[Technical Contents] A heat sink according to an embodiment includes a base plate, a protruding portion, a first fin, a first hub, and a second hub. The protruding portion protrudes from the base support plate in a first direction intersecting the base support plate, and is thermally connected to the first heating element mounted on the first substrate. A plurality of first fins protrude from the base supporting plate in a direction opposite to the first direction, and are juxtaposed in a second direction intersecting with the first direction. The first hub protrudes from the base support plate in a direction opposite to the first direction than the first fins, and a coupling tool for combining the outer wall of the frame with the base support plate can be attached. The second hub protrudes from the base support plate toward the first direction, and can be mounted with a coupling tool for combining the first substrate and the base support plate.

Description

electronic machine unit

Embodiments of the present invention relate to electronic equipment units.

A conventional heat sink includes: a base support plate heat-conductively connected to a heat generating element mounted on a substrate; and a plurality of fins protruding from the base support plate toward the side opposite to the heat generating element.

[Prior Art Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2019-67888

It would be beneficial if such a heat sink could be adapted to a fanless electronic machine and would have a new construction with fewer problems.

The electronic machine unit of the embodiment has a heat sink, the front The radiator includes: a base support plate, a protrusion, a first fin, a first hub, and a second hub. The protruding portion protrudes from the base support plate in a first direction intersecting the base support plate, and is thermally connected to the first heating element mounted on the first substrate. A plurality of first fins protrude from the base supporting plate in a direction opposite to the first direction, and are juxtaposed in a second direction intersecting with the first direction. The first hub protrudes from the base support plate in a direction opposite to the first direction than the first fins, and a coupling tool for combining the outer wall of the frame with the base support plate can be attached. The second hub protrudes from the base support plate toward the first direction, and can be installed with a combination tool for combining the first substrate and the base support plate. The aforementioned electronic machine unit is mounted on the aforementioned heat sink, and The first base plate of the first heat generating body which is set to be thermally connected to the protruding portion of the heat sink, the mounting base in the first direction located on the opposite side of the heat sink of the first base plate, and the The second substrate in the first direction of the mounting base and the storage bracket positioned in the first direction of the second substrate and holding the auxiliary memory device can be installed in the frame in an integrated state, The aforementioned installation base has: a middle wall located between the aforementioned first substrate and the aforementioned second substrate, and protruding from the aforementioned middle wall toward the direction opposite to the aforementioned first direction and capable of mounting the aforementioned first substrate and the aforementioned installation base. The first screw pile for the coupling tool for seat coupling, and the second screw stake for the coupling tool protruding from the middle wall in the first direction and capable of being attached to the coupling tool for coupling the second base plate and the mounting base.

1: Electronic equipment

2: frame

2a: Bottom wall

2b: top wall

2c: front wall

2d: left wall

2e: rear wall

2f: right wall (outer wall)

2h: Rubber feet

2s: Vent

3: Radiator

3a: Base plate

3a1: Surface (first side)

3a2: Back

3b: Fin (first fin)

3b1: Fins

3b2: Fins

3c: protrusion

3c1: front face

3c2: side

3d: hub (first hub)

3e: hub (second hub)

3f: Fin (second fin)

3g: Hub

3h: Concave

3h1: bottom

4: Main substrate (first substrate)

5,7~9: Sub-substrate

6: Secondary substrate (secondary substrate)

6a,7a: connector

10: Electronic machine unit

11: Central processing unit (first heating element)

12: Main memory device (second heating element)

13: Auxiliary memory device

13a: Side (second side)

14: Power button

15: Connector

16: storage bracket

16a: Bottom wall (thermal insulation wall)

18,19,20: binding tools

21: Base cover

22: Middle frame (installation base)

22a: Middle wall

22b: opening

22c: Protruding wall

22d: Screw pile (the first screw pile)

22e: screw pile (second screw pile)

22f: binding tool

23: top cover

24: lamp cover

25: Bottom plate cover

30: heat conduction member

31: Grease

32: flakes

X: the second direction

Y: the first direction

[FIG. 1] A perspective view of an example of an electronic device equipped with an electronic device unit including a heat sink according to the embodiment.

[FIG. 2] An exemplary perspective view of an electronics unit including a heat sink according to an embodiment.

[FIG. 3] An exemplary perspective view from the rear side of the heat sink according to the embodiment.

[FIG. 4] An illustrative and schematic YZ sectional view of the electronic device in FIG. 1.

[FIG. 5] An exemplary and schematic XY cross-sectional view of the electronic device in FIG. 1.

Exemplary embodiments of the present invention are disclosed below. The structure of the embodiment shown below, and the function and effect achieved by this structure are just an example. The present invention can also be realized with configurations other than the configurations disclosed in the following embodiments. And, according to the present invention, at least one of various effects (including derivative effects) obtained by this structure can be obtained.

In addition, in this specification, the serial number is only used for distinguishing a part, and a member, a location, a position, a direction, etc., and is not a display order or priority.

[implementation mode]

FIG. 1 is a perspective view of an electronic device 1 equipped with an electronic device unit 10 (see FIG. 2 ) including a heat sink 3 described later. In addition, in each of the following figures, for convenience, three directions perpendicular to each other are defined. X party The direction is along the depth direction (front-rear direction) of the electronic device 1 and along the width direction of the heat sink 3 . The Y direction is along the width direction (horizontal direction) of the electronic device 1 and along the thickness direction of the heat sink 3 . The Z direction is along the height direction (vertical direction) of the electronic device 1 and along the vertical width direction of the heat sink 3 .

As shown in FIG. 1 , an electronic device 1 is a fanless industrial computer and includes a housing 2 , an electronic device unit 10 (refer to FIG. 2 ) described later, and the like. Furthermore, the electronic device 1 is not limited to this example, and various electronic devices 1 such as a desktop personal computer, a video display device, a television receiver, a game machine, and an information storage device can be used.

The frame body 2 is a box-shaped rectangular parallelepiped short in the Y direction. The housing 2 has a plurality of wall portions including a bottom wall 2a, a ceiling wall 2b, a front wall 2c, a left wall 2d, a rear wall 2e, and a right wall 2f. The bottom wall 2a is also called a lower wall or the like, and the top wall 2b is also called an upper wall or the like. In addition, the front wall 2c, the left wall 2d, the rear wall 2e, and the right wall 2f are also referred to as side walls, peripheral walls, and the like.

Both the bottom wall 2 a and the top wall 2 b extend along a direction (XY plane) perpendicular to the Z direction, and are provided in parallel with a gap between them in the Z direction. The bottom wall 2 a constitutes the lower end of the housing 2 , and the top wall 2 b constitutes the upper end of the housing 2 . The bottom wall 2a is provided with a plurality of rubber feet 2h that protrude in the direction opposite to the Z direction and support the housing 2 in a state where it is separated from a shelf, not shown, and an installation surface such as a table or a stand.

Both the left wall 2d and the right wall 2f extend along a direction (XZ plane) perpendicular to the Y direction, and are provided in parallel with a gap between them in the Y direction. The left wall 2d is one of the ends in the Y direction across the bottom wall 2a and the top wall 2b. The space, the right wall 2f, spans between the ends of the bottom wall 2a and the top wall 2b in the direction opposite to the Y direction. The left wall 2 d constitutes the left end portion of the housing 2 , and the right wall 2 f constitutes the right end portion of the housing 2 .

In addition, a plurality of rubber feet 2h protruding in the Y direction are provided on the left wall 2d (see FIG. 4 ). In this embodiment, the electronic device 1 can be placed in a vertical posture in which the rubber feet 2h of the bottom wall 2a are in contact with the installation surface, and in a horizontal posture in which the rubber feet 2h of the left wall 2d are in contact with the installation surface. status is used. Also, the rubber feet 2h are detachably attached to the housing 2, and when used in one posture, the rubber feet 2h used in the other posture can also be detached.

And the right wall 2f is located in the position which faces the heat sink 3 mentioned later accommodated in the housing|casing 2. As shown in FIG. In the present embodiment, the right wall 2f is coupled to the hub portion 3d of the radiator 3 by a plurality of couplings 18 such as screws and bolts penetrating in the Y direction. The right wall 2f is an example of an outer wall. Also, as shown in FIG. 1, in this embodiment, the right wall 2f and the radiator 3 are fixed at three places by means of the coupling 18, but the number of couplings 18 (hub portion 3d) is not limited to this example. , can also be one or, two, four or more.

Both the front wall 2c and the rear wall 2e extend along the direction (YZ plane) perpendicular to the X direction, and are provided in parallel at intervals in the X direction. The front wall 2c spans between the ends of the bottom wall 2a and the top wall 2b in the X direction, and the rear wall 2e spans between the ends of the bottom wall 2a and the top wall 2b in the opposite direction in the X direction. The front wall 2c constitutes a front end portion of the frame body 2 , and the rear wall 2e constitutes a rear end portion of the frame body 2 . In the front wall 2c, an auxiliary memory device 13, a power button 14, various connectors 15, and the like are provided.

And the bottom wall 2a, the top wall 2b, the left wall 2d, and the right wall 2f are respectively provided with 2 s of air vents. The ventilation port 2s is a portion where a plurality of small holes penetrating each wall are gathered together. In the present embodiment, the above-mentioned vertical posture and horizontal posture can be separately provided by the air vents 2s provided on the bottom wall 2a, the top wall 2b, the left wall 2d, and the right wall 2f. The heat-generating parts in the frame body 2 are cooled by air convection.

The frame body 2 is composed of a combination of a base cover 21, a top cover 23, a lamp cover 24, a floor cover 25, and an intermediate frame 22 (refer to FIG. 2 ), which will be described later. The base cover 21, the top cover 23, the lamp cover 24, the bottom plate cover 25, and the intermediate frame 22 are made of metal materials such as aluminum.

The base cover 21 has a part of the bottom wall 2a, a front wall 2c, a left wall 2d, and the like. The top cover 23 has a top wall 2b, a part (upper part) of each of the left wall 2d, the rear wall 2e, and the right wall 2f, and the like. The lamp cover 24 has a part (central part) of the right wall 2f, a rear wall 2e, and the like. The floor cover 25 has a part (lower part) of the right wall 2f, a part of the bottom wall 2a, and the like. The base cover 21 , the top cover 23 , the lamp cover 24 , and the floor cover 25 are joined (integrated) with each other by a joint 20 such as a bolt.

FIG. 2 is a perspective view of the electronics unit 10 . As shown in FIG. 2 , the electronics unit 10 includes a middle frame 22 , a heat sink 3 , a main substrate 4 , a plurality of sub-substrates 5 to 9 , and a memory holder 16 . The electronics unit 10 is formed by stacking a heat sink 3 , a main substrate 4 , a plurality of sub-substrates 5 to 9 , and a memory frame 16 on a base through the above-mentioned intermediate frame 22 to form a block. The middle frame 22 is an example of a mounting base.

The middle frame 22 has a middle wall 22a, a plurality of studs 22d, 22e, a protruding wall 22c (see FIG. 4 ), which will be described later, and the like. The middle wall 22 a is located substantially in the center of the electronics unit 10 in the Y direction, specifically, between the main board 4 and the sub-board 6 . The middle wall 22a extends along a direction (XZ plane) perpendicular to the Y direction, and is parallel to the left wall 2d and the right wall 2f of the housing 2 described above. The middle wall 22a partitions the inside of the housing 2 into a plurality of spaces in the Y direction. The middle wall 22a is also referred to as a partition wall, a partition wall, or the like.

The screw pile 22d protrudes from the middle wall 22a in a direction opposite to the Y direction, and is located between the middle wall 22a and the main base plate 4 . In this embodiment, in the middle wall 22a, the some screw pile 22d is provided mutually at intervals. The heads of the studs 22d are pressed into the middle wall 22a by clamp processing or the like. The screw 22d is an example of the first screw.

In addition, a female screw portion that engages with a male screw portion of the coupling 19 is provided on the shaft portion of the stud 22d. The coupling tool 19 is a screw, a bolt, or the like, and is coupled to the stud 22d in a state of penetrating the heat sink 3 and the main substrate 4 in the Y direction. That is, in this embodiment, the heat sink 3 and the main substrate 4 are screwed together by the bonding tool 19 . The main board 4 is supported parallel to the middle wall 22a in a state separated from the middle wall 22a in the direction opposite to the Y direction by a plurality of screws 22d.

The screw pile 22e protrudes from the middle wall 22a in the Y direction, and is located between the middle wall 22a and the sub-base plate 6 . In this embodiment, the some screw pile 22e is provided in the middle wall 22a at intervals. Moreover, the screw 22e is located in the position deviated from the screw 22d when it sees in the Y direction. The heads of the studs 22e are pressed into the middle wall 22a by clamp processing or the like. Screw pile 22e is an example of the second screw pile.

In addition, a female thread portion that engages with a male thread portion of the coupling 19 (see FIG. 4 ) is provided on the shaft portion of the screw 22e. The coupling 19 is a screw, a bolt, or the like, and is coupled to the stud 22e in a state of penetrating at least the sub-board 6 in the Y direction. The sub-base plate 6 is supported parallel to the middle wall 22a in a state separated in the Y direction from the middle wall 22a by a plurality of screws 22e. In addition, the coupling tool 19 is not limited to this example, and the sub-substrate 6 and the storage holder 16 may also be screwed together.

As shown in FIG. 2 , the sub-board 5 is housed in the opening 22 b of the intermediate frame 22 . The sub-board 5 extends parallel to the middle frame 22 and is joined to the middle frame 22 by a coupling such as screws and bolts. A plurality of electronic components, a connector 15 and the like are provided on the sub-board 5 . The sub-substrate 5 is also referred to as a DIO substrate, an extension substrate, or the like.

The main substrate 4 is located in the direction opposite to the Y direction of the intermediate frame 22 . The main substrate 4 extends parallel to the middle frame 22 and is mechanically connected to the middle frame 22 through the above-mentioned screw 22d and the joint 19 . Furthermore, in this embodiment, the ground pattern of the main board 4, the intermediate frame 22, and the heat sink 3 are also electrically connected by the bonding tool 19 and the screw 22d.

On the main substrate 4, a plurality of electronic components such as a central processing unit 11 (see FIG. 4 ), which will be described later, and a main memory device 12 (see FIG. 4 ), are mounted. At least a part of the control circuit of the electronic device 1 is constituted by the wiring in the main board 4 and these plural electronic components. The main substrate 4 is an example of a first substrate.

The sub-substrate 6 is located in the Y direction of the middle frame 22 . Vice base The plate 6 extends parallel to the middle frame 22, and is mechanically connected to the middle frame 22 by the above-mentioned screw pile 22e and the coupling tool 19. In addition, in this embodiment, the ground pattern of the sub-substrate 6 and the intermediate frame 22 are also electrically connected by connecting the bonding tool 19 and the screw post 22e. On the sub-board 6, a plurality of electronic components, a connector 15, and the like are provided. The sub-substrate 6 is an example of a second substrate, and is also referred to as an IO substrate, an extension substrate, or the like.

As shown in FIG. 2 , the sub-board 7 is located in the direction opposite to the X-direction of the middle frame 22 . The sub-board 7 extends perpendicularly to the middle frame 22 and is parallel to the rear wall 2e of the above-mentioned frame body 2 . The sub-base plate 7 is mechanically connected to the intermediate frame 22 by the same structure as the screws 22d, 22e and the coupling 19. That is, a vertical wall (not shown) extending in the Y direction is provided at an end portion of the intermediate frame 22 in the direction opposite to the X direction, and screws protrude from the vertical wall toward the sub-base plate 7 .

Moreover, in this embodiment, the ground pattern of the sub-substrate 7 and the intermediate frame 22 are also electrically connected by the above-mentioned bonding tool and the screw being connected. A plurality of electronic components, a connector 7 a (see FIG. 5 ), and the like are provided on the sub-board 7 . The sub-substrate 6, the main substrate 4, and the like are inserted into the connector 7a. The sub-substrate 7 is also referred to as a rear substrate, a rear substrate, an expansion substrate, and the like.

As shown in FIG. 2 , the sub-substrate 8 is located in the Y direction of the sub-substrate 6 and opposite to the Z direction of the auxiliary memory device 13 . The sub-substrate 8 extends parallel to the sub-substrate 6 and the intermediate frame 22, and is supported by a bottom wall 16a of a stocker holder 16 to be described later. A plurality of electronic components, a power supply circuit, and the like are provided on the sub-board 8 . The sub-substrate 8 is also referred to as a power substrate or the like.

The sub-substrate 9 is located in the direction opposite to the Z direction of the intermediate frame 22 . The sub-board 9 extends perpendicularly to the middle frame 22 and is parallel to the bottom wall 2 a of the above-mentioned frame body 2 . A plurality of electronic components and the like are mounted on the sub-board 9 and inserted into the connector 6 a of the sub-board 6 (see FIG. 4 ). The sub-substrate 9 is also referred to as a PCI substrate, an extension substrate, and the like.

The memory holder 16 is located in the Y direction of the sub-board 6 and constitutes an end portion of the electronics unit 10 in the Y direction. The storage bracket 16 supports: the aforementioned sub-board 8 and the auxiliary memory device 13 . The auxiliary memory device 13 is SSD (solid state drive, solid state drive), HDD (hard disk drive, hard disk drive) and the like.

The heat sink 3 is located in the direction opposite to the Y direction of the main substrate 4 and constitutes an end portion of the electronics unit 10 in the direction opposite to the Y direction. The heat sink 3 has a base plate 3a, a plurality of fins 3b, a plurality of bosses 3d, and the like. The plurality of fins 3b protrude from the base plate 3a in a direction opposite to the Y direction, and are arranged in parallel at intervals in the X direction. In this embodiment, the Y direction is an example of the first direction, and the X direction is an example of the second direction. The heat sink 3 is made of a metal material such as aluminum.

The base support plate 3 a extends parallel to the main substrate 4 . In this embodiment, the size of the base holder 3 a is substantially the same as the size of the main substrate 4 . The base plate 3a has a rear surface 3a2 facing the main substrate 4 in the Y direction (see FIG. 3 ), and a surface 3a1 facing the right wall 2f of the housing 2 in the opposite direction to the Y direction (see FIG. 2 ). . On the surface 3a1, the fin 3b, the hub part 3d, etc. are provided. The fin 3b is an example of the first fin, and is also referred to as a heat radiation portion or the like.

The plurality of bosses 3d protrude from the base plate 3a in a direction opposite to the Y direction than the fins 3b, respectively. In the hub portion 3d, a female thread portion that engages with the male thread portion of the coupling 18 described above is provided. The coupling 18 is a screw, a bolt, or the like, and is coupled to the boss 3d while penetrating the right wall 2f of the housing 2 in the Y direction. The hub portion 3d is an example of a first hub portion.

FIG. 3 is a perspective view of the heat sink 3 from the back surface 3a2 side. As shown in FIG. 3, the heat sink 3 also has a protrusion 3c, a plurality of bosses 3e, 3g, a plurality of fins 3f, and the like.

The protruding portion 3c protrudes in the Y direction from the base plate 3a. The protruding portion 3c has a front end surface 3c1 in the Y direction, and a side surface 3c2 spanning between the front end surface 3c1 and the back surface 3a2. The front end surface 3c1 faces the central processing unit 11 mounted on the main substrate 4 (see FIG. 4 ). In other words, the protruding portion 3 c protrudes from the base support plate 3 a toward the central processing unit 11 . The size of the front end surface 3c1 is substantially the same as the size of the surface of the central processing unit 11 .

And in this embodiment, the front end surface 3c1 and the central processing unit 11 are thermally connected through thermally conductive grease or the like. The front end surface 3c1 is also referred to as a top surface, a heat transfer surface, and the like. In addition, the front end surface 3c1 is not limited to this example, and may be provided in a state of being in direct contact with the central processing unit 11 . The central processing unit 11 is an example of the first heating element.

The side surface 3c2 faces the space between the main substrate 4 and the base plate 3a. In the present embodiment, the side surface 3c2 is inclined toward the center of the front end surface 3c1 as it moves away from the back surface 3a2 in the Y direction. In other words, the protruding portion 3c has an approximately trapezoidal cross section. Protrusion 3c, is by this The side 3c2 can improve the formability of the mold extraction slope and increase the surface area of the protrusion 3c.

The plurality of bosses 3g protrude from the base plate 3a in the Y direction, respectively. In the present embodiment, the hub portion 3g is provided adjacent to two corners on the diagonal line of the protruding portion 3c. Fasteners such as screws and bolts for fastening the heat sink 3 and the main substrate 4 are attached to the hub portion 3g.

The heat sink 3 is screwed closer to the protruding part 3c by means of the boss part 3g, so that the Y-direction separation between the protruding part 3c and the central processing unit 11 can be prevented from reducing the thermal conductivity. Moreover, the height of the Y direction of the hub part 3g is lower than the height of the Y direction of the protrusion part 3c and the hub part 3e.

The plurality of hubs 3 e respectively protrude from the base bracket 3 a in the Y direction, and are located between the base bracket 3 a and the main substrate 4 . The boss part 3e is located in the position which overlaps with the above-mentioned stud 22d (refer FIG. 4) when it sees to a Y direction. That is, the coupling 19 for screwing the heat sink 3 and the main substrate 4 described above is attached to the hub portion 3e. The hub parts 3e and 3g are examples of the second hub part.

The plurality of fins 3f protrude from the base plate 3a in the Y direction, respectively, and are arranged in parallel with each other at intervals in the X direction. The fin 3f faces the space between the main substrate 4 and the base plate 3a. The height of the fin 3f in the Y direction is lower than the height of the protrusion 3c in the Y direction.

In this embodiment, the surface area of the heat sink 3 can be increased by such fins 3f, and the back surface 3a2 of the base plate 3a can be reinforced. The fin 3b is an example of the second fin, and is also referred to as a heat radiation portion, a reinforcement portion, or the like.

Fig. 4 is a YZ sectional view of the electronic device 1 in Fig. 1 . As shown in FIG. 4, the middle frame 22 has a protruding wall 22c. The protruding wall 22c protrudes from the middle wall 22a in a direction opposite to the Y direction, and is bent so as to extend along the main substrate 4 at a position away from the middle wall 22a.

The protruding wall 22c faces the main memory device 12 mounted on the main substrate 4 . In other words, the protruding wall 22c protrudes from the middle wall 22a toward the main memory device 12 . The protruding wall 22c is coupled to the middle wall 22a by means of couplings 22f such as screws and bolts. The middle wall 22a is also called a first metal plate or the like, and the protruding wall 22c is also called a second metal plate or the like.

And in this embodiment, the protruding wall 22 c and the main memory device 12 are thermally connected through the heat conducting member 30 . Thus, the heat of the main memory device 12 can be conducted to the middle frame 22 through the heat diffusion through the heat conduction member 30 . The main memory device 12 is an example of the second heating element. Also, the main memory device 12 is mounted on the surface of the main substrate 4 opposite to the central processing unit 11, and is located at a position away from the central processing unit 11 when viewed in the Y direction.

Furthermore, the heat conduction member 30 has a grease 31 and a sheet 32 . The grease 31 is applied to the end surface of the protruding wall 22c in the direction opposite to the Y direction. Grease 31 is a thermally conductive grease containing a conductive material.

The sheet 32 extends along the main substrate 4 and is located between the grease 31 and the main memory device 12 . The sheet 32 is a thermal sheet having thermal conductivity and insulation. In this embodiment, by positioning the sheet 32 between the main memory device 12 and the grease 31 in this way, it is possible to prevent the grease 31 from coming into contact with the terminals of the main memory device 12 and the terminals of the main board 4 to conduct conduction.

And the storage holder 16 has the auxiliary memory device 13 and the bottom wall 16a supported by the sub-board 8 and the like. The bottom wall 16 a extends along the middle frame 22 and covers the side surface 13 a of the auxiliary memory device 13 in the direction opposite to the Y direction and the surface of the sub-board 8 in the direction opposite to the Y direction.

In other words, the bottom wall 16a is located in the middle of the heat transfer path from the middle frame 22 , heat generating elements such as the main memory device 12 and the central processing unit 11 , to the auxiliary memory device 13 and the sub-board 8 . The reservoir holder 16 is made of a heat insulating material such as synthetic resin. The bottom wall 16a is an example of a heat insulating wall, and the side surface 13a is an example of a second surface.

Fig. 5 is an XY sectional view of the electronic device 1 in Fig. 1 . As shown in FIG. 5, in the heat sink 3, the recessed part 3h is provided corresponding to the protrusion part 3c. The concave portion 3h is recessed toward the Y direction from the side opposite to the central processing unit 11 of the protruding portion 3c, that is, from the surface 3a1 in the direction opposite to the Y direction. The surface 3a1 is an example of the first surface.

And the fin 3b has: a plurality of fins 3b1 and a plurality of fins 3b2. The fin 3b1 extends from the surface 3a1 in the direction opposite to the Y direction, and the fin 3b2 extends from the bottom 3h1 of the concave portion 3h in the direction opposite to the Y direction. In this embodiment, the length of the fin 3b1 in the Y direction and the length of the fin 3b2 in the Y direction are substantially the same. Therefore, at the front end of the fin 3b, a concave portion dented in the Y direction by the fin 3b2 is provided.

In this embodiment, with such a structure, the fin 3b2 which overlaps with the central processing unit 11 in the Y direction is arrange|positioned further from the right wall 2f of the housing|casing 2. As shown in FIG. Thereby, it is possible to suppress the local temperature rise of the right wall 2 f due to heat radiation (radiation) from the fin 3 b 2 which tends to become higher in temperature than the fin 3 b 1 among the fins 3 b.

Also, in this embodiment, at least a part of the fins 3b2 is made to correspond to a portion of the right wall 2f where the vent hole 2s is not provided (see FIG. 1 ), and the right wall 2f is covered from the direction opposite to the Y direction. Thereby, the flow velocity of the air which flows in the vicinity of the fin 3b2 can be raised. Therefore, according to the present embodiment, the cooling effect (radiation effect) by the air can be further enhanced in the vicinity of the fin 3b2 where the temperature tends to become the highest among the heat sink 3 .

Next, an example of a method of assembling the electronic device 1 will be described. First, from one side of the middle frame 22 , that is, from the opposite direction to the Y direction, the sub-substrate 5 , the main substrate 4 , and the heat sink 3 are assembled in order ( S1 ). S1 is an example of the first process.

Next, the middle frame 22 is reversed back and forth, and the sub-board 7 is assembled vertically to the middle frame 22 (S2). S2 is an example of the second process.

Next, from the other side of the middle frame 22, that is, from the Y direction, the sub-board 6 and the memory holder 16 are assembled in order, and the sub-boards 8 and 9 are assembled, and the electronics unit 10 is assembled (S3). S3 is an example of the third process.

Next, the electronics unit 10 is assembled to the base cover 21 of the casing 2 (S4). And the top cover 23, the lamp cover 24, and the bottom plate cover 25 are assembled, and the electronic device 1 is assembled (S5). S4 is an example of the fourth process, and S5 is an example of the fifth process.

As described above, in this embodiment, the heat sink 3 is provided with: a base plate 3a, and a base plate 3a protruding from the base plate 3a in the Y direction (first direction) and attached to the main substrate 4 (first direction). substrate) central processing unit 11 (the first heat generating element) is heat-conductively connected to the protruding portion 3c, and a plurality of fins 3b (first fins 3b) protruding from the base plate 3a toward the direction opposite to the Y direction and juxtaposed in the X direction (second direction). fins 3b) and protrude from the base plate 3a in the direction opposite to the Y direction than the fins 3b, and can be attached to the hub for the coupling tool 18 that combines the right wall 2f (outer wall) of the frame body 2 and the base plate 3a. 3d (first hub), and a hub 3e (second hub) protruding in the Y direction from the base plate 3a to which a coupling tool 19 for coupling the main board 4 and the base plate 3a can be attached.

According to this structure, since the interference between the components other than the central processing unit 11 mounted on the main substrate 4 and the base pallet 3a can be avoided by the protruding portion 3c, the base pallet 3a can be placed Furthermore, the heat sink 3 is formed larger and has the same size as the main substrate 4 . As a result, the surface area of the heat sink 3 can be increased, and the temperature rise of the central processing unit 11 can be suppressed more effectively even in the fanless electronic device 1 . Moreover, since the heat sink 3 can be fixed to the frame body 2 and the main substrate 4 by the hubs 3d, 3e protruding from the base support plate 3a and the joints 18, 19, even a relatively large heat sink 3 can be more compact. Hold firmly or more strongly. Furthermore, the ground pattern of the main substrate 4 may be electrically connected to the heat sink 3 and further to the frame body 2 by using the couplings 18, 19 and the hubs 3d, 3e. As a result, the housing 2 can function as a grounding member for the heat sink 3 and the main substrate 4 , thereby taking measures against EMI (Electro Magnetic Interference).

Furthermore, in this embodiment, the protruding portion 3c is provided with a recessed portion 3h that is recessed in the Y direction from the surface 3a1 (first surface) on the opposite side of the central processing unit 11, and forms a fin 3b2 that is a part of the fin 3b. , which protrude from the bottom 3h1 of the concave portion 3h in the direction opposite to the Y direction.

According to this structure, when the lengths along the Y direction of the plurality of fins 3b are formed so as to be approximately the same, the fins 3b2 protruding from the bottom 3h1 of the recessed portion 3h can be further away from the right wall 2f of the frame body 2. . Thereby, it is possible to suppress the local temperature rise of the right wall 2 f due to heat radiation (radiation) from the fin 3 b 2 which tends to become higher in temperature than the fin 3 b 1 among the fins 3 b. Furthermore, assuming that the plurality of fins 3b are formed so as to be aligned in the direction opposite to the Y direction, the length of the fin 3b2 may be longer than the length of the fin 3b1. Thereby, the surface area of the heat sink 3 can be increased, and the cooling effect (radiation effect) of the central processing unit 11 can be further improved.

In addition, in the present embodiment, the heat sink 3 protrudes in the Y direction from the base plate 3a, and includes a plurality of fins 3f (second fins) aligned in the X direction.

According to this structure, since the surface area of the heat sink 3 can be increased by the fins 3f, the cooling effect (radiation effect) of the central processing unit 11 can be further enhanced. Furthermore, the back surface 3a2 of the base bracket 3a opposite to the fin 3b can be reinforced by the fins 3f, thereby preventing the base bracket 3a from being deformed toward the fin 3b due to heat shrinkage.

Furthermore, in this embodiment, the electronic equipment unit 10 is a main unit of the heat sink 3 and the central processing unit 11 on which the heat sink 3 and the protruding portion 3c of the heat sink 3 are attached. Substrate 4, and the middle frame 22 (installation base) of the Y direction that is positioned at the opposite side of the heat sink 3 of the main substrate 4, and the sub-substrate 6 (second substrate) that is positioned at the Y direction of the middle frame 22, and the sub-substrate 6 that is positioned at The Y direction of the auxiliary memory device 13 will keep the storage The memory holder 16 can be attached to the housing 2 in an integrated state.

According to this structure, compared with the case where the heat sink 3, the main substrate 4, the intermediate frame 22, the sub-substrate 6, and the memory frame 16 are individually assembled in the frame body 2, the electronic equipment unit 10 that is bulked has a higher Labor and time required for manufacturing (assembling) the electronic device 1 can be reduced, and the electronic device 1 can be made smaller.

And in this embodiment, the intermediate frame 22 has: a middle wall 22a located between the main substrate 4 and the sub-substrate 6, and protrudes from the middle wall 22a toward the direction opposite to the Y direction, and can be installed with the main substrate 4 and the intermediate frame. 22, a screw pile 22d (first screw pile) for the coupling tool 19 combined with 22, and a screw pile 22e (second screw pile) for the coupling tool 19 that protrudes from the middle wall 22a toward the Y direction and can be installed to combine the sub-base plate 6 and the middle frame 22. screw pile).

According to this structure, the main base plate 4 and the sub-base plate 6 can be relatively simply fixed to the middle frame 22 by the screws 22d, 22e protruding from the middle wall 22a and the coupling tool 19 . Moreover, the ground pattern of the main substrate 4 and the ground pattern of the sub-substrate 6 can be electrically connected with the intermediate frame 22 by using the combination between the bonding tool 19 and the screw posts 22d and 22e. As a result, the intermediate frame 22 can function as a grounding member for the main substrate 4 and the sub-substrate 6 , and further, countermeasures against EMI (Electromagnetic Interference, Electromagnetic Interference) can be performed.

And in this embodiment, there is the main memory device 12 (second heating element) mounted on the main substrate 4 and set to be heat-conductively connected through the intermediate frame 22 and the heat-conducting member 30, and the heat-conducting member 30, is to have: the lubricating grease 31 that is applied on the intermediate frame 22, and the lubricating grease 31 and the sheet 32 between the main memory device 12.

According to this structure, since the heat of the main memory device 12 can be conducted to the intermediate frame 22 by the heat diffusion through the heat conduction member 30, the temperature rise of the main memory device 12 can be suppressed more effectively. Furthermore, the thin sheet 32 located between the grease 31 and the main memory device 12 can prevent the grease 31 from contacting the terminals of the main memory device 12 and the terminals of the main substrate 4 to conduct conduction.

In addition, in this embodiment, the memory holder 16 has 16a (bottom wall) covering at least the side surface 13a (second surface) of the auxiliary memory device 13 in the direction opposite to the Y direction.

According to this structure, since the heat transfer from the intermediate frame 22, the main memory device 12, the central processing unit 11, etc. to the auxiliary memory device 13 can be suppressed by the bottom wall 16a, the temperature of the auxiliary memory device 13 can be suppressed. rise.

As mentioned above, embodiment of this invention is an illustration, and the above-mentioned embodiment is an example, and is not intended to limit the scope of invention. The above-described embodiments can be implemented in other various forms, and various omissions, substitutions, combinations, and changes can be made without departing from the spirit of the invention. In addition, the specifications (structure, type, direction, form, size, length, width, thickness, height, number, arrangement, position, material, etc.) of each structure and shape can be appropriately changed and implemented.

1: Electronic equipment

2: frame

2a: Bottom wall

2b: top wall

2d: left wall

2f: right wall (outer wall)

2h: Rubber feet

3: Radiator

3a: Base plate

3a1: Surface (first side)

3b: Fin (first fin)

3b1: Fins

3b2: Fins

3c: protrusion

3c1: front face

3c2: side

3d: hub (first hub)

3e: hub (second hub)

4: Main substrate (first substrate)

5: Secondary substrate

6: Secondary substrate (secondary substrate)

6a: Connector

8: Secondary substrate

9: Secondary substrate

10: Electronic machine unit

11: Central processing unit (first heating element)

12: Main memory device (second heating element)

13: Auxiliary memory device

13a: Side (second side)

16: storage bracket

16a: Bottom wall (thermal insulation wall)

18: binding tool

19: binding tool

22: Middle frame (installation base)

22a: Middle wall

22b: opening

22c: Protruding wall

22d: Screw pile (the first screw pile)

22e: screw pile (second screw pile)

22f: binding tool

30: heat conduction member

31: Grease

32: flakes

Claims (5)

A kind of electronic equipment unit, has radiator, and above-mentioned radiator has: base support plate; A protruding portion that can be heat-conductively connected to the first heating element; and a plurality of first fins that protrude from the base support plate in a direction opposite to the first direction, and are juxtaposed in a second direction intersecting the first direction; and Protruding from the base support plate in a direction opposite to the first direction than the first fins, a first hub portion for a coupling that can be attached to the outer wall of the frame and the base support plate; and from the above The base support plate protrudes toward the first direction, and the second hub portion for a combination tool for combining the first substrate and the base support plate can be mounted. The electronic equipment unit is mounted on the heat sink and the mounting a first substrate having a first heat generating body in a state of being thermally connected to the protruding portion of the heat sink; and a mounting base in the first direction located on the opposite side of the first substrate to the heat sink and the second substrate located in the first direction of the mounting base, and the storage holder located in the first direction of the second substrate and holding the auxiliary memory device are integrated and can be mounted on the frame. The body, the aforementioned installation base, has: a middle wall located between the aforementioned first substrate and the aforementioned second substrate, and protruding from the aforementioned middle wall toward the direction opposite to the aforementioned first direction and capable of mounting the aforementioned first substrate and the aforementioned A first screw for a coupling tool for coupling the mounting base, and a second screw stake for a coupling tool that protrudes from the middle wall in the first direction and can be attached to the coupling tool for coupling the second substrate and the mounting base. The electronic equipment unit as claimed in claim 1, wherein, in the aforementioned protruding portion, there is provided a concave portion that is recessed from the first surface on the opposite side of the aforementioned first heat generating body toward the aforementioned first direction, and a part of the aforementioned first fin is formed from The bottom of the recess protrudes in a direction opposite to the first direction. The electronic device unit according to claim 1 or 2, further comprising: a plurality of second fins protruding from the base plate in the first direction and arranged in parallel in the second direction. The electronic equipment unit as claimed in claim 1, wherein there is a second substrate mounted on the first substrate or the second substrate and configured to be heat-conductively connected through the mounting base and the heat-conducting member. The heat generating body, the heat conduction member, includes grease applied to the mounting base, and a thin sheet positioned between the grease and the second heat generating body. The electronic equipment unit according to claim 4, wherein the storage holder has a heat insulating wall covering at least a second surface of the auxiliary memory device in a direction opposite to the first direction.

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