JP7002339B2 - Electrical equipment - Google Patents

Description

The present invention relates to a technique for cooling the inside of a housing in an electric device such as a power supply device.

There are many electric devices that take in air from the intake port to cool the electronic parts and the like in the housing. However, in such an electric device, the air taken in is dispersed in the housing, and the air cannot be efficiently guided to the object to be cooled (cooling object) such as a heat-generating component or a heat sink for cooling the heat-generating component. rice field. Therefore, a technique for forming a flow path for guiding air to a cooling target in the housing has been proposed (see, for example, Patent Documents 1 and 2).

Japanese Unexamined Patent Publication No. 2005-166777 Japanese Unexamined Patent Publication No. 2011-100794

However, in the conventional technique, a duct component for forming the flow path (for example, a component in which the left and right side walls and the bottom wall (or the top wall) for forming the flow path are integrally formed) is provided. It was necessary to fix it to the board or housing with screws. For this reason, the structure for cooling the object to be cooled (cooling structure) has to be complicated. Further, in the conventional technique, it is necessary to fix the duct component to the board or the housing in advance before fixing the board in the housing. Therefore, there is a problem that it is difficult to improve workability when assembling electrical equipment.

Therefore, an object of the present invention is to achieve both simplification of the cooling structure and improvement of workability at the time of assembly in an electric device having a cooling structure without lowering the cooling efficiency.

The electric device according to the present invention includes a first substrate, a second substrate, a housing in which these are housed, and a guide plate. The first substrate has an upper surface on which the first heat sink is mounted. The second substrate has a lower surface facing the upper surface of the first substrate, and a plurality of electronic components are mounted on the lower surface. The housing is provided with an intake port for allowing air to flow between the first substrate and the second substrate. The guide plate is erected on the upper surface of the first substrate and forms a flow path for guiding the air from the intake port to the first heat sink. A first protruding portion protruding downward is provided on the lower end edge of the guide plate, and the first substrate is provided with a first slit into which the first protruding portion is inserted. Further, at least two electronic components among the plurality of electronic components are arranged adjacent to each other at a position where the upper portion of the guide plate is sandwiched between them and the standing posture of the guide plate can be maintained.

According to the above-mentioned electric device, the first protrusion provided on the guide plate is inserted into the first slit, and the standing posture is maintained by two electronic components arranged adjacent to each other. It is possible to form a flow path for efficiently flowing the air from the mouth to the first heat sink. Therefore, in the electric device, the cooling structure can be simplified without lowering the cooling efficiency.

Further, according to the above-mentioned electric device, workability at the time of assembly can be improved as follows. When attaching the second board to the first board, the upper part of the guide plate is inserted between two electronic components arranged adjacent to each other. Here, the standing posture of the guide plate when held by the electronic component does not have to be the posture in which the guide plate stands exactly perpendicular to the first substrate, and a flow path can be formed. Moreover, as long as the posture does not generate a large gap, a posture tilted to some extent is acceptable. Therefore, the distance between the two electronic components arranged adjacent to each other to hold the guide plate is different from the one in which the thickness of the first protrusion of the guide plate is substantially matched with the width of the first slit, and the guide plate is used. Can be set larger than the thickness of. Therefore, at the time of assembly, it is necessary to pick up from the second board and insert the guide plate between the two electronic components in the situation where the guide plate is not fixed, but even at that time, the two electrons need to be inserted. A guide plate can be easily inserted between the parts. Therefore, the assembly work is facilitated when the first substrate and the second substrate are arranged in two upper and lower stages and a guide plate is provided between them to form a flow path, and as a result, the workability at the time of assembly is improved. do.

According to the present invention, it is possible to achieve both simplification of the cooling structure and improvement of workability at the time of assembly without lowering the cooling efficiency.

It is an exploded perspective view which conceptually showed the power supply device which is an embodiment of this invention. It is an exploded perspective view which showed the 1st board and 2 guide plates provided in the power supply device. It is a top view which showed the mounting state of two guide plates as seen from the intake port side.

An embodiment in which the present invention is applied to a power supply device will be specifically described with reference to the drawings. FIG. 1 is an exploded perspective view showing a power supply device according to an embodiment of the present invention. As shown in FIG. 1, the power supply device includes a first substrate 1, a second substrate 2, a housing 3, two guide plates 4, and an electrically insulating plate 5.

The first board 1 and the second board 2 are boards constituting the power supply circuit, and are housed in the housing 3 in a state of being arranged in two upper and lower stages. In the present embodiment, the housing 3 has a rectangular parallelepiped box shape. In FIG. 1, among the outer walls constituting the housing 3, the bottom wall 30A, the front wall 30B, and the rear wall 30C are shown, while the top wall and the two side walls are not shown. .. The first substrate 1 and the second substrate 2 are fixed to the inner surface of the bottom wall 30A in a state of being arranged in two upper and lower stages by two fixtures 6A provided on the left and right.

Specifically, both of the two fixtures 6A have a flat plate portion 60 fixed perpendicularly to the bottom wall 30A, and these two flat plate portions 60 are attached to the left and right side edges of the first substrate 1. Each is placed along. Further, a first receiving portion 61 for holding the first substrate 1 in a horizontal posture is provided at the lower portion of each flat plate portion 60, and in the present embodiment, the lower portion of each flat plate portion 60 is provided in the front-rear direction. First receiving portions 61 are provided at three locations. Each of the first receiving portions 61 is provided with a screw hole, and the screw member 71 is screwed into the screw hole through a through hole provided at a side end portion of the first substrate 1.

Further, a second receiving portion 62 for holding the second substrate 2 in a horizontal posture is provided on the upper portion of each flat plate portion 60, and in the present embodiment, the upper portion of each flat plate portion 60 is provided in the front-rear direction. Second receiving portions 62 are provided at three locations. A screw hole is provided in each of the second receiving portions 62, and the screw member 72 is screwed into the screw hole through a through hole provided in the second substrate 2.

According to the above two fixtures 6A, the first substrate 1 and the second substrate 2 are separated from each other in the vertical direction while maintaining the horizontal posture, and the bottom wall is in this state (that is, the state of two upper and lower stages). It can be fixed on 30A.

Further, in the present embodiment, two columns 6B for supporting the second substrate 2 in the upper stage stand on the bottom wall 30A via the first substrate 1 in the lower stage (for example, in a state of penetrating the first substrate 1). It is set up. Specifically, the two columns 6B are erected on the bottom wall 30A at a position near the center of the first substrate 1. A screw hole is provided on the upper end surface thereof, and the screw member 73 is screwed into the screw hole through a through hole provided at a position near the center of the second substrate 2. According to the support column 6B, it is possible to prevent the bending of the second substrate 2 that may occur when the left and right ends of the second substrate 2 are held by the two fixtures 6A. Further, as will be described later, the two columns 6B are arranged at positions in front of and behind the first heat sink 11, and are also used as positioning means for the electrical insulating plate 5.

The front wall 30B and the rear wall 30C of the housing 3 are provided with an intake port 31 and an exhaust port 32 for allowing air to flow between the first substrate 1 and the second substrate 2, respectively. Further, in the present embodiment, a fan 33 for sucking out the air in the housing 3 is provided on the outside of the exhaust port 32. Therefore, by driving the fan 33, air is sucked into the housing 3 from the intake port 31, and the sucked air is between the first substrate 1 and the second substrate 2 (that is, the first substrate 1). It flows into the upper surface side and the lower surface side of the second substrate 2).

It should be noted that simply flowing air between the first substrate 1 and the second substrate 2 disperses the air. Therefore, the air cannot be efficiently guided to the cooling target, and the cooling efficiency is lowered. Therefore, in the present embodiment, the two guide plates 4 described later form a flow path Rf for efficiently guiding the air from the intake port 31 to the cooling target (mainly the first heat sink 11 and the second heat sink 21). ..

The first substrate 1 is held by the fixture 6A with the main surface 1a on which electronic components and the like are mounted facing upward. By having the main surface 1a of the first substrate 1 as the upper surface in this way, it becomes possible to cool the electronic components and the like mounted on the main surface 1a with air. A first heat sink 11 extending in the front-rear direction is mounted on the main surface 1a (upper surface), and a heat generating component such as a switching element that requires heat dissipation is installed on the first heat sink 11. .. In addition to the first heat sink 11, various circuit components (including electronic components, wiring, terminals, etc.) may be mounted on the first substrate 1.

The second substrate 2 is held by the fixture 6A with the main surface 2a on which the electronic components and the like are mounted facing downward. By making the main surface 2a of the second substrate 2 a lower surface facing the main surface 1a (upper surface) of the first substrate 1 in this way, the electronic components and the like mounted on the main surface 2a are cooled by air. Will be possible. A second heat sink 21 and a plurality of capacitors 22 are mounted on the main surface 2a (lower surface), and heat generating parts such as switching elements that require heat dissipation are installed on the second heat sink 21. Has been done. In addition to the second heat sink 21 and the capacitor 22, various circuit components (including electronic components, wiring, terminals, etc.) may be mounted on the second substrate 2.

The capacitor 22 is an electronic component having a smaller heat generation amount than the heat generating component cooled by the second heat sink 21, and in the present embodiment, an electrolytic capacitor is used as the capacitor 22. On the other hand, the capacitor 22 is a component that is preferably prevented from being affected by heat from the heat generating component. Therefore, in the present embodiment, the condenser 22 is arranged on the upstream side of the second heat sink 21 in the direction in which air flows so that the heat discharged from the heat generating component through the second heat sink 21 is difficult to be transferred to the condenser 22. There is. The direction in which the air flows is the direction from the intake port 31 to the exhaust port 32 along the flow path Rf formed by the two guide plates 4 described later (see the white arrows shown in FIG. 1). ..

Further, as for the circuit parts other than the capacitor 22, those that are preferable to prevent the heat influence from the heat generating parts are preferably arranged on the upstream side of the second heat sink 21. Further, when the power supply device includes an electronic component (for example, a transformer) that generates a larger amount of heat than the switching element as a component constituting the power supply circuit, the electronic component is the first component in the direction in which air flows. 2 It may be arranged on the downstream side of the heat sink 21.

The electrical insulating plate 5 covers the upper surface of the first heat sink 11 to ensure electrical insulation between the first heat sink 11 and the second heat sink 21. Further, the thickness of the electric insulating plate 5 is adjusted so that the second heat sink 21 comes into contact with or is close to the electric insulating plate 5 when the second substrate 2 is held by the fixture 6A, so that the second substrate 2 is placed. Can be prevented from bending.

FIG. 2 is an exploded perspective view showing the first substrate 1 and the two guide plates 4. As shown in FIG. 2, in the present embodiment, the entire upper surface of the first heat sink 11 is covered with the electric insulating plate 5. Further, the front end portion 501 and the rear end portion 502 of the electrical insulating plate 5 project back and forth from the first heat sink 11, respectively, and notches 501a and 501b are provided at the center positions thereof, respectively. Two columns 6B arranged in front of and behind the first heat sink 11 are passed through the notches 501a and 501b, respectively, whereby the columns 6B are fitted to the notches 501a and 501b, respectively. Therefore, the positions of the electric insulating plate 5 in the front-rear direction and the left-right direction are defined. Therefore, the columns 6B and the notches 501a and 501b function as positioning means for the electric insulating plate 5.

The second heat sink 21 has a smaller length in the front-rear direction (in this embodiment, the direction in which air flows) than the first heat sink 11, and is first via the first portion 51 on the downstream side of the electrical insulating plate 5. It faces the heat sink 11 (see FIG. 1). The capacitor 22 is provided on the lower surface of the second substrate 2 at a position facing the second portion 52 on the upstream side of the electrical insulating plate 5 (see FIG. 1). That is, the capacitor 22 faces the first heat sink 11 via the second portion 52 of the electrical insulating plate 5. Therefore, it is preferable that the electric insulating plate 5 has a heat insulating property in addition to the electric insulating property so that the heat discharged from the heat generating component through the first heat sink 11 is difficult to be transferred to the capacitor 22. With such an arrangement of circuit components (mainly, the first heat sink 11, the second heat sink 21, and the capacitor 22), it becomes possible to compactly construct the power supply circuit in the housing 3.

As shown in FIG. 2, the two guide plates 4 are erected on the upper surface (main surface 1a) of the first substrate 1 and provide a flow path Rf for guiding the air from the intake port 31 to the first heat sink 11. , Formed together with the first substrate 1 and the second substrate 2. That is, the two guide plates 4 are provided one on each side of the flow path Rf to form a side wall for forming the flow path Rf. In the present embodiment, the intake port 31, the first heat sink 11, and the exhaust port 32 are arranged side by side in a row in the front-rear direction (see FIG. 1), so that the two guide plates 4 have the flow path Rf first. 1 It is formed in a flat shape without bending so as to form a linear flow path from the intake port 31 to the exhaust port 32 through the heat sink 11.

The flow path Rf is not limited to a linear one from the intake port 31 to the exhaust port 32, but is toward the exhaust port 32 from the intake port 31 according to the positional relationship between the intake port 31 and the first heat sink 11. It can be appropriately changed to one that is diagonally straight or one that bends from the intake port 31 toward the exhaust port 32. The two guide plates 4 can be appropriately changed to bent or curved depending on the shape of the flow path Rf.

Specifically, each guide plate 4 has a main body portion 41 erected on the first substrate 1 at a position upstream of the first heat sink 11 (see FIG. 2). Further, a first protruding portion 43A protruding downward is provided on the lower end edge 41a of the main body portion 41. In the present embodiment, the first protruding portions 43A are provided at three positions in the front-rear direction on the lower end edge 41a of the main body portion 41. The first substrate 1 is provided with a first slit 12 into which the first protruding portion 43A is inserted in order to define the position of the main body portion 41.

In the present embodiment, each guide plate 4 extends from the main body 41 onto the second portion 52 of the electrical insulating plate 5 so that the air from the intake port 31 can also be guided to the second heat sink 21. It has an extension 42 (see FIG. 2). Further, a second protruding portion 43B protruding downward is provided on the lower end edge 42a of the extending portion 42. In the present embodiment, the lower end edge 42a of the extending portion 42 is provided with the second protruding portions 43B at two positions in the front-rear direction. The second portion 52 of the electrical insulating plate 5 is provided with a second slit 53 into which the second protruding portion 43B is inserted in order to define the position of the extending portion 42.

In order to efficiently flow the air from the intake port 31 to the flow path Rf formed by the two guide plates 4, it is preferable to prevent the air from leaking from the flow path Rf. In the present embodiment, since the front end portion 501 of the electrical insulating plate 5 protrudes forward from the first heat sink 11, when the guide plate 4 is provided, the main body portion 41 of the guide plate 4 and the first heat sink 11 Gap is likely to occur between them. Therefore, the front end portion 501 (that is, the upstream end portion) of the electrical insulating plate 5 is inserted into the main body portion 41 of each guide plate 4 at the lower end position of the extending portion 42 of the downstream end edge 41b. It is preferable that the third slit 44 is provided (see FIG. 2). By inserting the front end portion 501 of the electrical insulating plate 5 into the third slit 44 at the time of installing each guide plate 4, the main body portion 41 of the guide plate 4 can be brought into contact with or close to the first heat sink 11. As a result, the occurrence of gaps can be prevented.

The position of each guide plate 4 can be defined only by inserting the first protrusion 43A and the second protrusion 43B described above into the first slit 12 and the second slit 53, respectively, but the first substrate 1 and electricity It is difficult to maintain the posture (standing posture) of each guide plate 4 standing perpendicular to the insulating plate 5. By inserting the electrical insulating plate 5 into the third slit 44 described above, the standing posture of each guide plate 4 can be maintained to some extent. However, with such holding alone, each guide plate 4 may fall down when some kind of impact is applied to the power supply device or when the power supply device is tilted.

FIG. 3 is a plan view showing the mounting state of the two guide plates 4 as viewed from the intake port 31 side. Therefore, as shown in FIG. 3 (see also the alternate long and short dash line showing the guide plate 4 in FIG. 1), two of the plurality of capacitors 22 mounted on the lower surface (main surface 2a) of the second substrate 2 described above. The capacitor 22 is arranged adjacent to the guide plate 4 so as to hold the standing posture of the guide plate 4 with the upper portion of the guide plate 4 sandwiched between the capacitors 22. Similarly, another two capacitors 22 out of the plurality of capacitors 22 are arranged adjacent to each other so as to hold the standing posture of the guide plate 4 with the upper portion of the other guide plate 4 interposed therebetween. That is, on the lower surface of the second substrate 2, two capacitors 22 arranged adjacent to each other are provided in a set corresponding to each of the two guide plates 4. In the present embodiment, the extension portion 42 is mainly sandwiched between the two capacitors 22 arranged adjacent to each other as the upper part of each guide plate 4.

According to the guide plate 4 described above, the first protruding portion 43A and the second protruding portion 43B provided on each guide plate 4 are inserted into the first slit 12 and the second slit 53, respectively, and are arranged adjacent to each other. A flow path for efficiently flowing air from the intake port 31 to a cooling target (in this embodiment, the first heat sink 11 and the second heat sink 21) with a simple configuration in which the standing posture is maintained by the two condensers 22. Rf can be formed. Therefore, in the power supply device, the cooling structure can be simplified without lowering the cooling efficiency.

Further, according to the guide plate 4 described above, the workability at the time of assembly can be improved as follows.

First, the first substrate 1 is fixed to the lower stage (first receiving portion 61) of the fixture 6A with the main surface 1a facing upward. After that, the two guide plates 4 are arranged on the first substrate 1 by inserting the first protrusion 43A and the second protrusion 43B provided on each guide plate 4 into the first slit 12 and the second slit 53, respectively. do. At this time, the insertion of the electrical insulating plate 5 into the third slit 44 may be hindered by the second protruding portion 43B provided on the lower end edge 42a of the extending portion 42. Therefore, it is preferable to use a guide plate 4 which is a plate material having a certain level of strength and which can be bent so that the electric insulating plate 5 can be inserted into the third slit 44. ..

Next, the second substrate 2 is fixed to the upper stage (second receiving portion 62) of the fixture 6A with the main surface 2a facing downward. At this time, the upper part of each guide plate 4 is inserted between the two capacitors 22 arranged adjacent to each other. As a result, the upper portion of each guide plate 4 is sandwiched between the two corresponding capacitors 22, and as a result, the standing posture of the guide plate 4 is maintained.

Here, the standing posture of the guide plate 4 when held by the capacitor 22 does not have to be the posture in which the guide plate 4 stands exactly perpendicular to the first substrate 1, and forms the flow path Rf. A posture that can be tilted to some extent is acceptable as long as it can be used and does not create a large gap. Therefore, the distance between the two capacitors 22 arranged adjacent to each other to hold the guide plate 4 is substantially the same as the thickness of the first protrusion 43A of the guide plate 4, such as the width of the first slit 12. Differently, it can be set larger than the thickness of the guide plate 4. Therefore, at the time of assembly, it is necessary to pick up from the second substrate 2 and insert the guide plate 4 between the two capacitors 22 in a situation where each guide plate 4 is not fixed. However, the guide plate 4 can be easily inserted between the two capacitors 22. Therefore, the assembly work when the first substrate 1 and the second substrate 2 are arranged in two upper and lower stages and the guide plate 4 is provided between them to form the flow path Rf becomes easy, and as a result, the assembly work at the time of assembly becomes easy. Workability is improved.

As described above, according to the power supply device, it is possible to achieve both simplification of the cooling structure and improvement of workability at the time of assembly without lowering the cooling efficiency.

If it is an electronic component that can hold the standing posture of the guide plate 4 with the upper part of each guide plate 4 sandwiched between them, not only the capacitor 22 but also various electronic components such as cement resistors and relays can be used. can. Further, as the electronic component holding the guide plate 4, peripheral components related to heat-generating components such as a switching element that releases heat through a heat sink can be used.

Further, the two electronic components arranged adjacent to each other are not limited to the same type, but may be different types. Further, the height of the electronic component holding the guide plate 4 may be low as long as the guide plate 4 can be sandwiched between the electronic component arranged adjacent to the guide plate 4 to the extent that the standing posture can be maintained.

In the power supply device described above, the number of guide plates 4 may be one as long as the flow path Rf can be formed between the power supply device and another member such as the fixture 6A. Further, by providing three or more guide plates 4, a plurality of flow paths Rf or one continuous flow path Rf may be formed. Further, for example, when there is no second heat sink 21 and it is not necessary to secure electrical insulation between the heat sinks, the electrical insulating plate 5 may be omitted.

Further, the configuration of each part of the power supply device is not limited to the power supply device, and can be applied to various electric devices.

The description of the embodiments described above should be considered exemplary in all respects and not restrictive. The scope of the invention is indicated by the claims, not by the embodiments described above. Furthermore, the scope of the present invention is intended to include all modifications within the meaning and scope of the claims.

1 1st substrate 2 2nd substrate 1a, 2a Main surface 3 Housing 4 Guide plate 5 Electrical insulation plate 6A Fixture 6B Strut 11 1st heat sink 12 1st slit 21 2nd heat sink 22 Capacitor 30A Bottom wall 30B Front wall 30C Rear Wall 31 Intake port 32 Exhaust port 33 Fan 41 Main body 42 Extensions 41a, 42a Lower edge 41b End edge 43A First protrusion 43B Second protrusion 44 Third slit 51 First part 52 Second part 53 Second slit 60 Flat plate portion 61 First receiving portion 62 Second receiving portion 71, 72, 73 Screw member 501 Front end portion 502 Rear end portion 501a, 501b Notch Rf flow path

Claims (6)

A first substrate having an upper surface on which a first heat sink is mounted,
A second substrate having a lower surface facing the upper surface of the first substrate and having a plurality of electronic components mounted on the lower surface.
A housing in which the first substrate and the second substrate are housed and an intake port for allowing air to flow between these substrates is provided.
A guide plate that is erected on the upper surface of the first substrate and forms a flow path for guiding air from the intake port to the first heat sink.
Equipped with
A first protruding portion protruding downward is provided on the lower end edge of the guide plate, and the first substrate is provided with a first slit into which the first protruding portion is inserted.
An electrical device in which at least two electronic components among the plurality of electronic components are arranged adjacent to each other at a position where the upper portion of the guide plate is sandwiched between them and the guide plate can hold an upright posture. The guide plates are provided on the left and right sides of the flow path, one on each side.
The electric device according to claim 1, wherein a set of two electronic components arranged adjacent to each other is provided on the lower surface of the second substrate so as to correspond to each of the guide plates. A second heat sink is further mounted on the lower surface of the second substrate.
The electric device according to claim 1 or 2, wherein in the flow path formed by the guide plate, the two electronic components arranged adjacent to each other are arranged at a position upstream of the second heat sink. Further provided with an electrical insulating plate covering the upper surface of the first heat sink,
The second heat sink faces the first heat sink via the first portion on the downstream side of the electrically insulating plate.
The guide plate extends from the main body portion onto the main body portion erected on the first substrate at a position upstream of the first heat sink and the second portion on the upstream side of the electrically insulating plate. It has a protruding part and
A second protruding portion protruding downward is provided on the lower end edge of the extending portion, and a second slit into which the second protruding portion is inserted is provided on the second portion of the electrically insulating plate. , The electrical device according to claim 3. The electrical device according to claim 4, wherein the two electronic components arranged adjacent to each other are provided at positions of the lower surface of the second substrate facing the second portion of the electrical insulating plate. The main body of the guide plate is provided with a third slit in which the upstream end of the electrical insulating plate is inserted at the lower end position of the extending portion of the downstream end edges. The electrical device according to claim 4 or 5.

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