TWI783089B - Active convection heat dissipation structure - Google Patents

Abstract

An active convection heat dissipation structure is provided for vertical network communication electronics device which has a housing and at least one PCB which has at least heat generating member and is disposed vertically in the housing. At least an upper through hole and a bottom through hole is respectively disposed on the top and the bottom of the housing. The active convection heat dissipation structure includes a hollow tube-like chamber which is disposed in the housing. The chamber has at least a lateral wall which its surface abuts the heat generating member. An air inlet and an air outlet is respectively disposed on the bottom and the top of the chamber and connects to the bottom through hole and the upper through hole. The air inlet and the air outlet connects to each other and forms a convection path which is perpendicular to a horizontal surface.

Description

Active convection cooling structure

The present invention relates to an active convection heat dissipation structure, especially a simple structure, good heat dissipation, suitable for vertical network communication electronic devices, and can avoid poor reliability (durability), accumulation of dust, and noise caused by the use of fans for heat dissipation Active convection heat dissipation structure for major problems.

As electronic devices tend to be miniaturized, heat dissipation becomes more and more important.

The traditional fan cooling structure not only has poor reliability (durability), easy to accumulate dust, and high noise, but also has a complex structure and takes up a lot of space, which is not conducive to the application of miniaturized electronic devices.

For the vertical network communication electronic device, since the printed circuit boards are usually stacked vertically, it is easy to cause heat energy to accumulate between two adjacent printed circuit boards, which is not conducive to heat dissipation.

Accordingly, how can there be an "active convection" that has a simple structure and good heat dissipation, is suitable for vertical network communication electronic devices, and can avoid the problems of poor reliability (durability), dust accumulation, and loud noise caused by the use of fans for heat dissipation? Heat dissipation structure” is an urgent problem to be solved by people in the related technical field.

In one embodiment, the present invention proposes an active convection heat dissipation structure, which is suitable for vertical network communication electronic devices. The vertical network communication electronic device has a housing and at least one circuit board. The top and bottom of the housing are respectively provided with at least one top Through holes and at least one bottom through hole, the circuit board is vertically erected in the casing, and at least one heating element is arranged on the surface of the circuit board. The active convection heat dissipation structure includes: A cavity is arranged in the casing. The cavity is formed into a hollow tube by at least one side wall. An air inlet is formed at the bottom of the cavity, and an air outlet is formed at the top of the cavity. The air inlet and the air outlet are connected to form convection The path, the convection path is roughly perpendicular to the horizontal plane, the air inlet is connected to the bottom through hole, the air outlet is connected to the top through hole, and the outer surface of at least one side wall is in contact with the heating element of the circuit board.

10: Active convection cooling structure

11: Cavity

12: Heat conduction sheet

111, 112: long side wall

113, 114: short side wall

115: air inlet

116: Air outlet

117: hole

20: Vertical Netcom electronic device

21: Shell

211: Top through hole

212: Bottom through hole

213: base

214: foot pad

22: Circuit board

23: heating element

L: Length

P: Convective path

S: Horizontal plane

W: width

FIG. 1 is a three-dimensional schematic diagram of the present invention implemented in a vertical network communication electronic device.

Fig. 2 is a schematic diagram of an exploded structure of the embodiment in Fig. 1 after removing the housing.

Fig. 3 is a schematic diagram of the size of the air inlet of the embodiment of Fig. 1 .

FIG. 4 is a schematic diagram of the cross-sectional structure along line A-A of FIG. 1 .

The detailed features and advantages of the embodiments of the present invention are described in detail below in the implementation modes, the content is enough for anyone with ordinary knowledge in the field to understand the technical content of the embodiments of the present invention and implement them accordingly, and according to the disclosure of this specification Anyone with ordinary knowledge in the art can easily understand the related objectives and advantages of the present invention. the following The examples further illustrate the viewpoints of the present invention in detail, but do not limit the scope of the present invention in any viewpoint. In the so-called schematic diagrams in this specification, the dimensions, proportions and angles may be exaggerated for illustration purposes, but are not intended to limit the present invention. Various changes are possible without departing from the gist of the present invention.

Referring to FIG. 1 to FIG. 3 , the present invention provides an active convection cooling structure 10 suitable for a vertical network communication electronic device 20 . The vertical network communication electronic device 20 has a housing 21 and two circuit boards 22. The circuit boards 22 are vertically erected in the housing 21 and are located on opposite sides of the active convection heat dissipation structure 10 respectively. Heating element 23.

The top and bottom of the casing 21 are respectively provided with a plurality of top through holes 211 and a plurality of bottom through holes 212 . In this embodiment, the casing 21 includes a detachable base 213 , and the bottom through hole 212 is disposed at a substantially central portion of the base 213 . The bottom of the base 213 is elevated with the foot pad 214 so that air can enter the bottom through hole 212 from the bottom of the base 213 .

The active convection cooling structure 10 includes a cavity 11 , and the cavity 11 is disposed in the casing 21 . The material of the cavity 11 is not limited, for example, it can be a plastic material composed of polycarbonate (PC) and acrylonitrile-butadiene-styrene copolymer (ABS), the heat-resistant temperature is 110 degrees Celsius, or it has thermal conductivity The metal material.

Please refer to Fig. 2 to Fig. 4 shown, in the present embodiment, cavity 11 forms a hollow flat rectangular tube shape by two opposite long side walls 111,112 and two opposite short side walls 113,114, and the long side wall of cavity 11 The outer surfaces of 111 and 112 are in close contact with the heating element 23 of the circuit board 22 . An air inlet 115 is formed at the bottom of the cavity 11, and an air outlet 116 is formed at the top of the cavity 11. The air inlet 115 and the air outlet 116 are corresponding narrow and long rectangles, and the air inlet 115 and the air outlet 116 are connected up and down to form a The convection path P, the convection path P is approximately perpendicular to the horizontal plane S, and the air inlet 115 and the bottom through hole 212 is connected, and the air outlet 116 is connected with the top through hole 211 , therefore, when the cavity 11 is disposed in the housing 21 , the convection path P can form an airflow passage with the outer space of the housing 21 .

In this embodiment, the cavity 11 is in the shape of a hollow flat rectangular tube, so the air inlet 115 and the air outlet 116 are corresponding narrow and long rectangles, the air inlet 115 has a length L and a width W perpendicular to each other, and the width W is smaller than the length L, for example, the width W may be in the range of 11-18 mm. The size and shape of the air outlet 116 correspond to the size and shape of the air inlet 115 .

However, it must be noted that the size and shape of the air inlet 115 and the air outlet 116 are designed according to actual needs, and there is no certain limitation. The size and shape of the air inlet 115 and the air outlet 116 can be corresponding or different, for example, it can be any combination of ellipse, circle, square, regular polygon, and irregular polygon, as long as the following design points are followed: air inlet 115 It communicates with the air outlet 116 to form a convection path P, and the convection path P is substantially perpendicular to the horizontal plane S.

Please refer to Fig. 1 to Fig. 3, on the outer surface of the long side walls 111, 112 there is a heat conduction sheet 12, the position of the heat conduction sheet 12 is corresponding to the position of the heating element 23 on the circuit board 22, the heat conduction sheet 12 has a heat conduction Composed of non-toxic materials to assist heat conduction. With the arrangement of the heat conduction sheet 12 , the heat generated by the heating element 23 during operation can be conducted to the heat conduction sheet 12 and then to the long sidewall 111 at a faster rate.

In addition, a plurality of holes 117 are provided on the long sidewall 111 , the plurality of holes 117 are located at the lower half of the long sidewall 111 , and the heating element 23 is attached to the upper half of the long sidewall 111 . The reason why the hole 117 is arranged in the lower half of the long side wall 111 is that when the external cold air enters the cavity 11 from the bottom through hole 212 through the air inlet 115, most of the cold air can rise to the air outlet 116 in the cavity 11. Then it flows out of the housing 21 through the top through hole 211 and enters the external atmosphere, while part of the cold air can flow out through the hole 117 to between the long sidewalls 111 , 112 and the circuit board 22 to cool the circuit board 22 . to The number, shape, and distribution position of the holes 117 depend on the actual situation, and are not limited to the arrangement as shown in the figure. In addition, the casing of the vertical network communication electronic device is not limited to a rectangular shape, for example, it may be in a circular cylindrical shape or other shapes.

It must be noted that the above-mentioned embodiment is an example in which an active convection heat dissipation structure is arranged in a housing and matched with two circuit boards. In addition, an active convection heat dissipation structure can also be arranged in a housing and matched with a circuit board, or a plurality of active convection heat dissipation structures are arranged in a casing, and each active convection heat dissipation structure can be matched with one circuit board or two circuit boards.

The cooling effect was simulated through experiments, and the results are shown in Table 1 below:

In Table 1, the component column represents different types of heating components, such as: double data rate synchronous dynamic random access memory, central processing unit, microprocessor and so on. The column of standard value represents the heating temperature of the element when the active convection heat dissipation structure provided by the present invention is not installed, and °C stands for Celsius. The improvement rate represents the ratio of the reduced temperature relative to the standard value.

Table 1 shows that when the width of the air inlet 115 of the cavity 11 is 11 mm, 15 mm, and 18 mm, a good cooling effect can be achieved, and the cooling effect is the best when the width is 15 mm, and the improvement rate The lowest is 2.04%, and the highest can reach 4.46%.

To sum up, the present invention utilizes a hollow tubular active convection heat dissipation structure to allow the internal flow field of the electronic device to cooperate with the structure to introduce external lower-temperature air to the area that needs to be cooled, and use the tubular structure to guide the air-cooled flow field and generate in the cavity Dean Vortex is used to facilitate heat exchange, not only can efficiently achieve heat exchange in the system, but also achieve quietness and high reliability. The invention is suitable for various electronic devices with circuit boards of heating elements, especially suitable for vertical network communication electronic devices.

Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field may make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention should be defined by the scope of the appended patent application.

10: Active convection cooling structure

11: Cavity

12: Heat conduction sheet

111, 112: long side wall

114: short side wall

115: air inlet

116: Air outlet

117: hole

20: Vertical Netcom electronic device

21: Shell

211: Top through hole

212: Bottom through hole

213: base

214: foot pad

22: Circuit board

23: heating element

P: Convective path

S: Horizontal plane

Claims (6)

An active convection heat dissipation structure suitable for vertical network communication electronic devices, the vertical network communication electronic device has a housing and at least one circuit board, the top and bottom of the housing are respectively provided with at least one top through hole and at least one bottom through hole hole, the at least one circuit board is vertically erected in the housing, at least one heating element is arranged on the surface of the at least one circuit board, and the active convection heat dissipation structure includes: a cavity, which is arranged in the housing, the cavity A flat rectangular hollow tube is formed by two opposite long side walls and two opposite short side walls, an air inlet is formed at the bottom of the cavity, and an air outlet is formed at the top of the cavity, the air inlet and the air outlet are in phase Corresponding to the long and narrow rectangle, the air inlet communicates with the air outlet to form a convection path, the convection path is approximately perpendicular to the horizontal plane, the air inlet communicates with the bottom through hole, and the air outlet communicates with the top through hole, at least An outer surface of the long side wall is in contact with the at least one heating element of the at least one circuit board, and the long side wall abutting against the heating element is provided with a plurality of holes, and the plurality of holes are located in the lower half of the long side wall , the heating element is attached to the upper half of the long side wall. The active convection heat dissipation structure described in item 1 of the scope of the patent application, wherein the air inlet has a length and a width perpendicular to each other, the width is smaller than the length, and the width is within the range of 11-18 mm. The active convection cooling structure described in item 1 of the scope of the patent application, wherein the size and shape of the air outlet correspond to the size and shape of the air inlet. The active convection heat dissipation structure described in item 1 of the scope of the patent application, wherein the outer surface of the side wall is provided with at least one heat conduction sheet, and the position of the at least one heat conduction sheet corresponds to the position of the heating element on the circuit board and is in contact with The heating element is attached to each other. The active convection heat dissipation structure described in item 1 of the scope of the patent application, wherein the cavity The material is a plastic material composed of polycarbonate (PC) and acrylonitrile-butadiene-styrene copolymer (ABS), and the heat-resistant temperature is 110 degrees Celsius. The active convection heat dissipation structure described in item 1 of the scope of the patent application, wherein the material of the cavity is a metal material with thermal conductivity.

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