CN110337217B - Fanless communication device with inclined design - Google Patents
Fanless communication device with inclined design Download PDFInfo
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- CN110337217B CN110337217B CN201910353592.8A CN201910353592A CN110337217B CN 110337217 B CN110337217 B CN 110337217B CN 201910353592 A CN201910353592 A CN 201910353592A CN 110337217 B CN110337217 B CN 110337217B
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- circuit board
- fanless
- communication device
- inner bottom
- top surface
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20127—Natural convection
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- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a fanless communication device with an inclined design. The fanless communication device is suitable for being placed on a horizontal working surface and comprises a shell, a circuit board and a communication chip. The casing comprises a top casing and a bottom casing. The top shell has an inner top surface and an outer top surface, and the bottom shell has an inner bottom surface. The outer top surface is parallel to the horizontal working surface or the included angle between the outer top surface and the horizontal working surface is less than 3 degrees. The circuit board is arranged in the shell and positioned between the inner top surface and the inner bottom surface. The circuit board, the inner top surface and the inner bottom surface are inclined to the horizontal working surface, and the circuit board, the inner top surface and the inner bottom surface are parallel to each other or included angles between the circuit board, the inner top surface and the inner bottom surface are all smaller than 3 degrees. The included angle between the circuit board and the horizontal working surface is between 1 degree and 30 degrees. The communication chip is arranged on the circuit board.
Description
Technical Field
The present invention relates to a communication device, and more particularly, to a fanless communication device having an inclined design.
Background
Generally, an opening is usually formed in a housing of a communication device without a fan, so that waste heat generated by a communication chip or other electronic components is exhausted out of the housing through the opening. However, the heat dissipation effect of this method is quite limited, and therefore, how to improve the heat dissipation effect of the communication device without the fan is a problem to be solved.
Disclosure of Invention
In view of the above, the present invention provides a fanless communication device with an inclined design, which can improve the problem of poor heat dissipation effect.
The invention provides a fanless communication device with an inclined design, which is suitable for being placed on a horizontal working surface. The fanless communication device comprises a shell, a circuit board and a communication chip. The case includes a top case having an inner top surface and an outer top surface and a bottom case having an inner bottom surface. The outer top surface is parallel to the horizontal working surface or the included angle between the outer top surface and the horizontal working surface is less than 3 degrees. The circuit board is arranged in the shell and positioned between the inner bottom surfaces of the inner top surfaces, wherein the circuit board, the inner top surfaces and the inner bottom surfaces are inclined to the horizontal working surface, and the circuit board, the inner top surfaces and the inner bottom surfaces are parallel to each other or the included angles between the circuit board, the inner top surfaces and the inner bottom surfaces are all smaller than 3 degrees. The included angle between the circuit board and the horizontal working surface is between 1 degree and 30 degrees. The communication chip is arranged on the circuit board.
In an embodiment of the present invention, the chassis further includes a first side plate and a second side plate, the first side plate is located at a lower side of the inner top surface and the inner bottom surface, the second side plate is located at a higher side of the inner top surface and the inner bottom surface, the first side plate has a plurality of first openings located between the inner top surface and the inner bottom surface, the second side plate has a plurality of second openings located between the inner top surface and the inner bottom surface, and the first openings and the second openings are elongated and parallel to the horizontal working plane.
In an embodiment of the present invention, the second side plate has a plurality of baffles extending toward the interior of the enclosure, and the baffles are parallel to the circuit board or have an included angle of less than 3 degrees therebetween.
In an embodiment of the invention, the fanless communication device further includes a plurality of heat dissipation fins disposed between the circuit board and the inner bottom surface, wherein the heat dissipation fins extend along a direction from a low side of the inner bottom surface to a high side of the inner bottom surface.
In an embodiment of the invention, the fanless communication device further includes a heat sink disposed on the circuit board and thermally contacting the communication chip, wherein the heat sink has a plurality of channels extending along a direction from the low side of the circuit board to the high side of the circuit board.
In an embodiment of the invention, the top shell is a wedge-shaped hollow shell.
In an embodiment of the invention, the bottom shell further has an outer bottom surface that is parallel to the horizontal working plane or forms an angle of less than 3 degrees therebetween.
In an embodiment of the present invention, the bottom case includes an inner plate having an inner bottom surface and an outer plate having an outer bottom surface
In an embodiment of the present invention, a surface of the inner plate facing the outer plate has a plurality of radiator fins extending in a direction from a low side of the inner bottom surface to a high side of the inner bottom surface.
Based on the above, in the fanless communication device provided by the invention, the circuit board, the inner top surface and the inner bottom surface are inclined relative to the horizontal working plane to form a structural height difference, so that the high-temperature airflow between the inner top surface and the inner bottom surface is easy to flow from a low position to a high position, the speed of the airflow is increased, and the waste heat generated by the communication chip is more effectively taken out of the casing, thereby improving the heat dissipation effect.
In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.
Drawings
Fig. 1 is a cross-sectional view of a fanless communication device according to an embodiment of the invention;
FIG. 2 is a perspective view of the fanless communication device of FIG. 1;
FIG. 3 is a perspective view of FIG. 2 from a different perspective;
FIG. 4 is a perspective view of a portion of the components of the fanless communication device of FIG. 1; and
fig. 5 and 6 are perspective views of fig. 4 from different viewing angles.
Detailed Description
Fig. 1 is a schematic cross-sectional view of a fanless communication device according to an embodiment of the present invention. Fig. 2 is a perspective view of the fanless communication device of fig. 1. Fig. 3 is a perspective view of fig. 2 from a different perspective. Fig. 1 to 3 indicate coordinate axes to facilitate understanding of perspective conversion between the drawings. Referring to fig. 1 to fig. 3, the fanless communication device 100 of the present embodiment is suitable for being placed on a horizontal working surface 50. The fanless communication device 100 includes a housing 110, a circuit board 120, and a communication chip 130. The housing 110 includes a top case 111 and a bottom case 112. The top case 111 has an inner top surface S1, and the bottom case 112 has an inner bottom surface S3. The circuit board 120 is disposed in the chassis 110 between the inner top surface S1 and the inner bottom surface S3. The circuit board 120, the inner top surface S1 and the inner bottom surface S3 are all inclined to the horizontal working plane 50, and the included angle between the circuit board 120, the inner top surface S1 and the inner bottom surface S3 is less than 3 degrees. The communication chip 130 is disposed on the circuit board 120 for performing communication operations of the fanless communication apparatus 100. For ease of understanding of the drawings, footpads (for supporting the fanless communication device 100 above the horizontal work surface 50) are shown only in fig. 1.
Because the circuit board 120, the inner top surface S1 and the inner bottom surface S3 of the present embodiment are inclined with respect to the horizontal working plane 50 to cause a difference in height in the structure, the high-temperature airflow F between the top case 111 and the bottom case 112 can flow from the low side to the high side in a forward direction according to the physical characteristic that the hot air rises, and such a difference in height structure can increase the flow speed of the airflow F during natural convection, thereby more effectively carrying away the heat generated by the communication chip 130 during operation from the exterior of the fanless communication device 100. The horizontal work surface 50 is referred to herein as a substantially horizontal surface.
Various embodiments of the top case 111 and the bottom case 112 are illustrated below. In the embodiment of fig. 1, top shell 111 is, for example, a wedge-shaped hollow shell and also has an outer top surface S2. The bottom case 112 includes an inner plate 1121 and an outer plate 1122. The inner plate 1121 has an inner bottom surface S3, and the outer plate 1122 has an outer bottom surface S4. The outer top surface S2 is parallel to the horizontal working surface 50 with the outer bottom surface S4, or is inclined at an angle of no more than 3 degrees relative to the horizontal working surface 50. As such, the fanless communication device 100 appears to be a flat-laid device. In other embodiments, the outer plate 1122 of the bottom housing 112 may be omitted, and the inner plate 1121 may be supported by legs (not shown) with different lengths so as to maintain the circuit board 120, the inner top surface S1 and the inner bottom surface S3 in the tilted state.
In this embodiment, as shown in fig. 1 to 3, the casing 110 may further include a first side plate 113 and a second side plate 114. In detail, the height of the chassis 110 (the distance between the top case 111 and the bottom case 112) is less than one-half of either the length (the distance between the first side plate 113 and the second side plate 114) or the width of the chassis. That is, the fanless communication apparatus 100 is placed on the horizontal working surface 50 in a lying manner as a whole.
With the horizontal working surface 50 as a height reference, the first side panel 113 is located at a lower side of the inner top surface S1 and the inner bottom surface S3, and the second side panel 114 is located at a higher side of the inner top surface S1 and the inner bottom surface S3. The outer plate 1122 of the bottom case 112 of the present embodiment connects the top case 111 and the bottom case 112, but the present invention is not limited thereto. The first side panel 113 has a plurality of first apertures O1 between the inner top surface S1 and the inner bottom surface S3. The second side panel 114 has a plurality of second apertures O2 between the inner top surface S1 and the inner bottom surface S3. Further, in the present embodiment, the first opening O1 is used as an air inlet, and the low-temperature air flow F enters the casing 110 from the outside through the first opening O1. The second opening O2 serves as an air outlet, and the high-temperature air flow F carrying heat generated by the operation of the communication chip 130 is discharged out of the housing 110 through the second opening O2. In addition, the first opening O1 and the second opening O2 may be elongated and parallel to the horizontal working surface 50, which facilitates the entrance/exit of the external air into/from the casing 110, and can achieve the condition of a flat flow field, thereby reducing the flow resistance to increase the flow speed of the air flow F.
In the present embodiment, as shown in fig. 2 and 3, the bottom case 112 has a plurality of openings 115, and the openings 115 are formed in the outer plate 1122 of the bottom case 112 and are elongated and extend along a direction from the first side plate 113 to the second side plate 114. That is, the extending direction of the opening 115 corresponds to the flow direction of the air flow F, and thus resistance to the flow of the air flow F can be avoided. In detail, in the present embodiment, the airflow F passes through the upper and lower portions of the circuit board 120, and another airflow exists between the inner plate 1121 and the outer plate 1122, and the airflow enters from the opening 115 and flows out through the second opening O2 in the direction toward the second side plate 114. Fig. 4 is a perspective view of a portion of the components of the fanless communication device of fig. 1. Fig. 5 is a perspective view of fig. 4 from a different perspective. Fig. 4 and 5 indicate coordinate axes to facilitate understanding of the perspective conversion between the drawings. Referring to fig. 1, 4 and 5, a surface of the inner plate 1121 facing the outer plate 1122 has a plurality of heat dissipation fins 116. The radiator fins 116 extend in a direction from a low side of the inner bottom surface S3 to a high side of the inner bottom surface S3. In the present embodiment, the extending direction of the heat dissipation fins 116 is the same as the flowing direction of the airflow F, and the opening 115 of the outer plate 1122 is also the same as the flowing direction of the airflow F. By the structural cooperation of the heat dissipation fins 116 and the openings 115 (see fig. 3), the flowing direction of the airflow F can be properly regulated, and the reduction of the heat dissipation efficiency due to the generation of turbulence can be avoided. On the other hand, the inner plate 1121 is a heat dissipation plate disposed in the chassis 110 and located below the circuit board 120, and the upper surface of the inner plate 1121 is the inner bottom surface S3, and the lower surface of the inner plate 1121 is provided with a plurality of heat dissipation fins 116. The outer plate 1122 serves as an outer appearance of the bottom of the housing 110.
Referring to fig. 1 again, in the present embodiment, the second side plate 114 has a plurality of baffles 117. The baffle 117 extends toward the inside of the casing 110 and is parallel to the circuit board 120, or is inclined at an angle of not more than 3 degrees with respect to the circuit board 120, and is capable of guiding the airflow F in the casing 110 through the second opening O2, thereby facilitating the discharge of the airflow F.
In the present embodiment, the fanless communication device 100 further includes a plurality of heat dissipation fins 140 disposed between the circuit board 120 and the inner bottom surface S3. The radiator fins 140 extend in a direction from a low side of the inner bottom surface S3 to a high side of the inner bottom surface S3. Further, as shown in fig. 4, the heat dissipation fins 140 have a hollow structure, which facilitates the airflow F to pass through, so as to reduce the resistance when the airflow F flows and prevent the airflow F from accumulating in the housing 110. On the other hand, the radiator fins 140 also serve as a path for thermal conduction between the circuit board 120 and the inner bottom surface S3, helping to carry waste heat generated at the circuit board 120 toward the inner bottom surface S3.
Fig. 6 is a perspective view of fig. 4 from a different perspective. Fig. 6 indicates coordinate axes to facilitate understanding of perspective conversion between drawings. Referring to fig. 1, fig. 4 and fig. 6, in the present embodiment, the fanless communication device 100 further includes a heat sink 150 disposed on the circuit board 120 and in thermal contact with the communication chip 130. That is, the communication chip 130 dissipates heat through the heat sink 150. The communication chip 130 and the heat spreader 150 have a good thermal conduction path therebetween, for example, there may be a thermal pad (thermal pad) therebetween. Therefore, the heat generated by the communication chip 130 can be smoothly conducted to the heat sink 150 and dissipated to the outside. The heat sink 150 has a plurality of guide grooves 151. The channels 151 extend in a direction from the low side of the circuit board 120 to the high side of the circuit board 120, thereby preventing resistance to the flow of the air flow F. The arrangement of the guide grooves 151 helps to improve the heat dissipation efficiency of the heat sink 150. Therefore, the heat dissipation requirement of the communication chip 130 can be satisfied to improve the operation efficiency, so that the communication chip 130 has the advantages of high reliability, stability and long service life. It should be noted that the present invention is not limited to the type of heat sink, for example, different types of heat sinks can be seen in fig. 1, 4 and 6. The flow guide grooves of the radiators with different types can be aligned with each other and extend along the direction parallel to the flowing direction of the airflow F, so that the airflow F can flow favorably, the obstruction caused when the airflow F flows is avoided, the airflow F can smoothly pass through the radiators, and the integral heat dissipation efficiency of the radiators is improved.
Referring again to fig. 1, an angle a exists between the circuit board 120 and the horizontal working surface 50 (for clarity of the drawing, fig. 1 only schematically shows the angle between the circuit board 120 and an imaginary line parallel to the horizontal working surface 50). In the present embodiment, the included angle a is between 1 degree and 30 degrees, which is suitable for generating and flowing the air flow F.
Examples of the fanless communication apparatus 100 include a verimetrix Ultra-based high-security 4K set-top box, a smart convergence gateway of GPON and a 4K Ultra-high-definition set-top box, a 10G symmetric/asymmetric EPON home gateway, or a 2.5G GPON home gateway supporting ZWave/BlueTooth/802.11 ax.
In summary, in the communication device without fan provided by the present invention, the circuit board, the inner top surface and the inner bottom surface are inclined to the horizontal working surface to form a height difference in structure, which is beneficial for the air flow between the top case and the bottom case to generate natural convection to flow from the low side to the high side, so as to increase the flow speed of the air flow, and further effectively dissipate the heat generated by the communication chip during operation to the outside of the communication device without fan.
Optionally, the first and second elongated openings (inlet and outlet) are used to reduce the resistance of the flow by meeting the conditions of the flat flow field, and the design of the deflector can guide the airflow to exit the fanless communication device. In addition, the arrangement of the openings of the bottom shell and the radiating fins corresponds to the flowing direction of the airflow, so that the flowing speed of the airflow is increased.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (9)
1. A fanless communication device adapted to be placed on a horizontal work surface, the fanless communication device comprising:
a housing comprising a top shell and a bottom shell, the top shell having an inner top surface and an outer top surface, the bottom shell having an inner bottom surface, the outer top surface being parallel to the horizontal working surface or having an included angle therebetween of less than 3 degrees;
the circuit board is arranged in the shell and positioned between the inner top surface and the inner bottom surface, wherein the circuit board, the inner top surface and the inner bottom surface are inclined to the horizontal working surface, the circuit board, the inner top surface and the inner bottom surface are parallel to each other or have included angles smaller than 3 degrees, and the included angle between the circuit board and the horizontal working surface ranges from 1 degree to 30 degrees; and
a communication chip disposed on the circuit board,
wherein the chassis further comprises a first side plate and a second side plate, the first side plate is located at the low side of the inner top surface and the inner bottom surface, the second side plate is located at the high side of the inner top surface and the inner bottom surface, the first side plate has a plurality of first holes located between the inner top surface and the inner bottom surface, the second side plate has a plurality of second holes located between the inner top surface and the inner bottom surface, the first holes and the second holes are elongated and parallel to the horizontal working plane.
2. The fanless communication device of claim 1, wherein the second side plate has a plurality of baffles extending toward the interior of the housing, the baffles being parallel to the circuit board or forming an angle of less than 3 degrees therebetween.
3. The fanless communication device of claim 1, further comprising a plurality of heat fins disposed between the circuit board and the inner bottom surface, wherein the heat fins extend in a direction from a low side of the inner bottom surface to a high side of the inner bottom surface.
4. The fanless communication device of claim 1, further comprising a heat sink disposed on the circuit board and in thermal contact with the communication chip, wherein the heat sink has a plurality of channels extending in a direction from a low side of the circuit board to a high side of the circuit board.
5. The fanless communication device of claim 1, wherein the top housing is a wedge-shaped hollow housing.
6. The fanless communication device of claim 1, wherein the bottom housing further has an outer bottom surface that is parallel to the horizontal working surface or forms an angle of less than 3 degrees therebetween.
7. The fanless communication device of claim 6, wherein the bottom case comprises an inner panel having the inner bottom surface and an outer panel having the outer bottom surface.
8. The fanless communication device of claim 7, wherein a surface of the inner plate facing the outer plate has a plurality of heat fins extending in a direction from a low side of the inner bottom surface to a high side of the inner bottom surface.
9. The fanless communication device of claim 1, wherein the height of the housing is less than one-half of either the length or the width of the housing.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910353592.8A CN110337217B (en) | 2019-04-29 | 2019-04-29 | Fanless communication device with inclined design |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910353592.8A CN110337217B (en) | 2019-04-29 | 2019-04-29 | Fanless communication device with inclined design |
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| CN110337217A CN110337217A (en) | 2019-10-15 |
| CN110337217B true CN110337217B (en) | 2020-10-09 |
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Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2778580B2 (en) * | 1996-05-07 | 1998-07-23 | 日本電気株式会社 | Electronic equipment with natural convection cooling structure |
| KR101437497B1 (en) * | 2009-10-16 | 2014-09-03 | 후지쯔 가부시끼가이샤 | Electronic device and composite electronic apparatus |
| CN103931094A (en) * | 2011-12-13 | 2014-07-16 | 富士电机株式会社 | Power conversion device |
| CN105451517B (en) * | 2015-11-30 | 2017-09-12 | 中国电子科技集团公司第二十八研究所 | One kind forces air-exhaust type radiating electronic cabinet |
| CN208540240U (en) * | 2018-07-31 | 2019-02-22 | 深圳市创达华跃科技有限公司 | A kind of wiring board with heat sinking function |
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