TWI781572B - 圖案形成裝置、及圖案形成方法 - Google Patents

圖案形成裝置、及圖案形成方法 Download PDF

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Publication number
TWI781572B
TWI781572B TW110112367A TW110112367A TWI781572B TW I781572 B TWI781572 B TW I781572B TW 110112367 A TW110112367 A TW 110112367A TW 110112367 A TW110112367 A TW 110112367A TW I781572 B TWI781572 B TW I781572B
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TW
Taiwan
Prior art keywords
substrate
mentioned
light
mark
pattern
Prior art date
Application number
TW110112367A
Other languages
English (en)
Chinese (zh)
Other versions
TW202205031A (zh
Inventor
加藤正紀
Original Assignee
日商尼康股份有限公司
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Publication date
Application filed by 日商尼康股份有限公司 filed Critical 日商尼康股份有限公司
Publication of TW202205031A publication Critical patent/TW202205031A/zh
Application granted granted Critical
Publication of TWI781572B publication Critical patent/TWI781572B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7019—Calibration
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Document Processing Apparatus (AREA)
TW110112367A 2020-04-06 2021-04-06 圖案形成裝置、及圖案形成方法 TWI781572B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020068034 2020-04-06
JPJP2020-068034 2020-04-06

Publications (2)

Publication Number Publication Date
TW202205031A TW202205031A (zh) 2022-02-01
TWI781572B true TWI781572B (zh) 2022-10-21

Family

ID=78023054

Family Applications (2)

Application Number Title Priority Date Filing Date
TW110112367A TWI781572B (zh) 2020-04-06 2021-04-06 圖案形成裝置、及圖案形成方法
TW111136244A TWI869708B (zh) 2020-04-06 2021-04-06 圖案形成裝置

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW111136244A TWI869708B (zh) 2020-04-06 2021-04-06 圖案形成裝置

Country Status (5)

Country Link
JP (1) JP7435748B2 (https=)
KR (2) KR102853866B1 (https=)
CN (1) CN115380253A (https=)
TW (2) TWI781572B (https=)
WO (1) WO2021206044A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102515305B1 (ko) * 2022-05-18 2023-03-29 에스케이엔펄스 주식회사 섀도우 마스크 및 이를 이용한 블랭크 마스크의 제조방법
JP2024014031A (ja) 2022-07-21 2024-02-01 キヤノン株式会社 検出装置、リソグラフィー装置および物品製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004069585A (ja) * 2002-08-08 2004-03-04 Fuji Photo Optical Co Ltd 平行度測定方法
TW201738986A (zh) * 2016-04-29 2017-11-01 上海微電子裝備（集團）股份有限公司 雙層對準裝置和雙層對準方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0677116A (ja) * 1992-08-27 1994-03-18 Nikon Corp 位置検出装置
JP3445100B2 (ja) * 1997-06-02 2003-09-08 キヤノン株式会社 位置検出方法及び位置検出装置
JP2006098726A (ja) 2004-09-29 2006-04-13 Fuji Photo Film Co Ltd アライメント部の校正方法と、アライメント校正可能な描画装置と、搬送装置
JP2014081452A (ja) * 2012-10-16 2014-05-08 Nikon Corp 露光装置、およびデバイス製造方法
NL2013745A (en) 2013-12-05 2015-06-08 Asml Netherlands Bv Method and apparatus for measuring a structure on a substrate, models for error correction, computer program products for implementing such methods & apparatus.
JP2015125424A (ja) * 2013-12-27 2015-07-06 キヤノン株式会社 光学装置、リソグラフィ装置、及び物品の製造方法
CN110083018A (zh) * 2014-04-01 2019-08-02 株式会社尼康 基板处理装置的调整方法
TWI709006B (zh) * 2014-04-01 2020-11-01 日商尼康股份有限公司 圖案描繪裝置及圖案描繪方法
JP6465591B2 (ja) * 2014-08-27 2019-02-06 株式会社オーク製作所 描画装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004069585A (ja) * 2002-08-08 2004-03-04 Fuji Photo Optical Co Ltd 平行度測定方法
TW201738986A (zh) * 2016-04-29 2017-11-01 上海微電子裝備（集團）股份有限公司 雙層對準裝置和雙層對準方法

Also Published As

Publication number Publication date
CN115380253A (zh) 2022-11-22
WO2021206044A1 (ja) 2021-10-14
KR102853866B1 (ko) 2025-09-02
JPWO2021206044A1 (https=) 2021-10-14
TW202303300A (zh) 2023-01-16
JP7435748B2 (ja) 2024-02-21
TWI869708B (zh) 2025-01-11
KR20220150942A (ko) 2022-11-11
KR20250133998A (ko) 2025-09-09
TW202205031A (zh) 2022-02-01

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