CN115380253A - 图案形成装置、及图案形成方法 - Google Patents
图案形成装置、及图案形成方法 Download PDFInfo
- Publication number
- CN115380253A CN115380253A CN202180025936.8A CN202180025936A CN115380253A CN 115380253 A CN115380253 A CN 115380253A CN 202180025936 A CN202180025936 A CN 202180025936A CN 115380253 A CN115380253 A CN 115380253A
- Authority
- CN
- China
- Prior art keywords
- substrate
- mark
- light
- pattern
- alignment system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/24—Curved surfaces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7019—Calibration
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Document Processing Apparatus (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020068034 | 2020-04-06 | ||
| JP2020-068034 | 2020-04-06 | ||
| PCT/JP2021/014467 WO2021206044A1 (ja) | 2020-04-06 | 2021-04-05 | パターン形成装置、並びにパターン形成方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115380253A true CN115380253A (zh) | 2022-11-22 |
Family
ID=78023054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180025936.8A Pending CN115380253A (zh) | 2020-04-06 | 2021-04-05 | 图案形成装置、及图案形成方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7435748B2 (https=) |
| KR (2) | KR102853866B1 (https=) |
| CN (1) | CN115380253A (https=) |
| TW (2) | TWI781572B (https=) |
| WO (1) | WO2021206044A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102515305B1 (ko) * | 2022-05-18 | 2023-03-29 | 에스케이엔펄스 주식회사 | 섀도우 마스크 및 이를 이용한 블랭크 마스크의 제조방법 |
| JP2024014031A (ja) | 2022-07-21 | 2024-02-01 | キヤノン株式会社 | 検出装置、リソグラフィー装置および物品製造方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0677116A (ja) * | 1992-08-27 | 1994-03-18 | Nikon Corp | 位置検出装置 |
| JP2014081452A (ja) * | 2012-10-16 | 2014-05-08 | Nikon Corp | 露光装置、およびデバイス製造方法 |
| US20150185623A1 (en) * | 2013-12-27 | 2015-07-02 | Canon Kabushiki Kaisha | Optical device, lithography apparatus and manufacturing method of article |
| CN106133610A (zh) * | 2014-04-01 | 2016-11-16 | 株式会社尼康 | 基板处理装置、器件制造方法及基板处理方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3445100B2 (ja) * | 1997-06-02 | 2003-09-08 | キヤノン株式会社 | 位置検出方法及び位置検出装置 |
| JP4046323B2 (ja) | 2002-08-08 | 2008-02-13 | フジノン株式会社 | 平行度測定方法 |
| JP2006098726A (ja) | 2004-09-29 | 2006-04-13 | Fuji Photo Film Co Ltd | アライメント部の校正方法と、アライメント校正可能な描画装置と、搬送装置 |
| NL2013745A (en) | 2013-12-05 | 2015-06-08 | Asml Netherlands Bv | Method and apparatus for measuring a structure on a substrate, models for error correction, computer program products for implementing such methods & apparatus. |
| CN110083018A (zh) * | 2014-04-01 | 2019-08-02 | 株式会社尼康 | 基板处理装置的调整方法 |
| JP6465591B2 (ja) * | 2014-08-27 | 2019-02-06 | 株式会社オーク製作所 | 描画装置 |
| CN107329379B (zh) * | 2016-04-29 | 2019-01-18 | 上海微电子装备(集团)股份有限公司 | 双层对准装置和双层对准方法 |
-
2021
- 2021-04-05 KR KR1020227034595A patent/KR102853866B1/ko active Active
- 2021-04-05 WO PCT/JP2021/014467 patent/WO2021206044A1/ja not_active Ceased
- 2021-04-05 JP JP2022514057A patent/JP7435748B2/ja active Active
- 2021-04-05 CN CN202180025936.8A patent/CN115380253A/zh active Pending
- 2021-04-05 KR KR1020257028795A patent/KR20250133998A/ko active Pending
- 2021-04-06 TW TW110112367A patent/TWI781572B/zh active
- 2021-04-06 TW TW111136244A patent/TWI869708B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0677116A (ja) * | 1992-08-27 | 1994-03-18 | Nikon Corp | 位置検出装置 |
| JP2014081452A (ja) * | 2012-10-16 | 2014-05-08 | Nikon Corp | 露光装置、およびデバイス製造方法 |
| US20150185623A1 (en) * | 2013-12-27 | 2015-07-02 | Canon Kabushiki Kaisha | Optical device, lithography apparatus and manufacturing method of article |
| CN106133610A (zh) * | 2014-04-01 | 2016-11-16 | 株式会社尼康 | 基板处理装置、器件制造方法及基板处理方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021206044A1 (ja) | 2021-10-14 |
| KR102853866B1 (ko) | 2025-09-02 |
| JPWO2021206044A1 (https=) | 2021-10-14 |
| TW202303300A (zh) | 2023-01-16 |
| JP7435748B2 (ja) | 2024-02-21 |
| TWI781572B (zh) | 2022-10-21 |
| TWI869708B (zh) | 2025-01-11 |
| KR20220150942A (ko) | 2022-11-11 |
| KR20250133998A (ko) | 2025-09-09 |
| TW202205031A (zh) | 2022-02-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |