TWI778144B - 雷射加工裝置 - Google Patents

雷射加工裝置 Download PDF

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Publication number
TWI778144B
TWI778144B TW107135087A TW107135087A TWI778144B TW I778144 B TWI778144 B TW I778144B TW 107135087 A TW107135087 A TW 107135087A TW 107135087 A TW107135087 A TW 107135087A TW I778144 B TWI778144 B TW I778144B
Authority
TW
Taiwan
Prior art keywords
liquid
laser
laser beam
workpiece
axis direction
Prior art date
Application number
TW107135087A
Other languages
English (en)
Chinese (zh)
Other versions
TW201918313A (zh
Inventor
能丸圭司
波多野雄二
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201918313A publication Critical patent/TW201918313A/zh
Application granted granted Critical
Publication of TWI778144B publication Critical patent/TWI778144B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Laser Surgery Devices (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
TW107135087A 2017-11-07 2018-10-04 雷射加工裝置 TWI778144B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017214473A JP6998178B2 (ja) 2017-11-07 2017-11-07 レーザー加工装置
JP2017-214473 2017-11-07

Publications (2)

Publication Number Publication Date
TW201918313A TW201918313A (zh) 2019-05-16
TWI778144B true TWI778144B (zh) 2022-09-21

Family

ID=66401900

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107135087A TWI778144B (zh) 2017-11-07 2018-10-04 雷射加工裝置

Country Status (4)

Country Link
JP (1) JP6998178B2 (ja)
KR (1) KR102616529B1 (ja)
CN (1) CN109746572B (ja)
TW (1) TWI778144B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102466684B1 (ko) * 2020-12-01 2022-11-15 서울대학교 산학협력단 레이저를 이용한 세라믹 재료의 가공시스템 및 이를 이용한 가공방법
CN115458468B (zh) * 2022-11-11 2023-03-24 扬州韩思半导体科技有限公司 一种半导体晶圆激光切割装置及方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201313373A (zh) * 2011-07-20 2013-04-01 Rena Gmbh 刀具頭
JP2016036818A (ja) * 2014-08-06 2016-03-22 株式会社ディスコ レーザー加工装置
JP2016047547A (ja) * 2014-08-28 2016-04-07 株式会社ディスコ レーザー加工装置
TW201639652A (zh) * 2015-01-29 2016-11-16 Ｉｍｒａ美國公司 雷射式修改透明材料的系統及其方法
TW201700206A (zh) * 2015-06-18 2017-01-01 Gongin Precision Industries Co Ltd 液體雷射耦合系統及液體雷射加工裝置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57190795A (en) * 1981-05-20 1982-11-24 Matsushita Electric Ind Co Ltd Laser working device
JPS59178189A (ja) * 1983-03-29 1984-10-09 Inoue Japax Res Inc レ−ザ加工装置
JPH10305420A (ja) 1997-03-04 1998-11-17 Ngk Insulators Ltd 酸化物単結晶からなる母材の加工方法、機能性デバイスの製造方法
JP3408805B2 (ja) 2000-09-13 2003-05-19 浜松ホトニクス株式会社 切断起点領域形成方法及び加工対象物切断方法
US20030062126A1 (en) * 2001-10-03 2003-04-03 Scaggs Michael J. Method and apparatus for assisting laser material processing
TWI236944B (en) 2001-12-17 2005-08-01 Tokyo Electron Ltd Film removal method and apparatus, and substrate processing system
JP2004188475A (ja) 2002-12-13 2004-07-08 Disco Abrasive Syst Ltd レーザー加工方法
JP4843212B2 (ja) 2004-10-29 2011-12-21 東京エレクトロン株式会社 レーザー処理装置及びレーザー処理方法
JP2007144494A (ja) 2005-11-30 2007-06-14 Tokyo Electron Ltd レーザー処理装置及びレーザー処理方法
KR101124347B1 (ko) 2011-01-25 2012-03-23 주식회사아톤 사각 방향으로 조사되는 스캔된 레이저 빔을 이용한 대상물의 가공 방법 및 그 장치
JP6151557B2 (ja) 2013-05-13 2017-06-21 株式会社ディスコ レーザー加工方法
JP6189178B2 (ja) * 2013-10-29 2017-08-30 株式会社ディスコ レーザー加工装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201313373A (zh) * 2011-07-20 2013-04-01 Rena Gmbh 刀具頭
JP2016036818A (ja) * 2014-08-06 2016-03-22 株式会社ディスコ レーザー加工装置
JP2016047547A (ja) * 2014-08-28 2016-04-07 株式会社ディスコ レーザー加工装置
TW201639652A (zh) * 2015-01-29 2016-11-16 Ｉｍｒａ美國公司 雷射式修改透明材料的系統及其方法
TW201700206A (zh) * 2015-06-18 2017-01-01 Gongin Precision Industries Co Ltd 液體雷射耦合系統及液體雷射加工裝置

Also Published As

Publication number Publication date
JP2019084562A (ja) 2019-06-06
CN109746572B (zh) 2022-04-01
JP6998178B2 (ja) 2022-01-18
KR102616529B1 (ko) 2023-12-20
CN109746572A (zh) 2019-05-14
TW201918313A (zh) 2019-05-16
KR20190051822A (ko) 2019-05-15

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