TWI774198B - 基板處理方法 - Google Patents

基板處理方法 Download PDF

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Publication number
TWI774198B
TWI774198B TW110101874A TW110101874A TWI774198B TW I774198 B TWI774198 B TW I774198B TW 110101874 A TW110101874 A TW 110101874A TW 110101874 A TW110101874 A TW 110101874A TW I774198 B TWI774198 B TW I774198B
Authority
TW
Taiwan
Prior art keywords
substrate
nozzle
liquid
processing
gas
Prior art date
Application number
TW110101874A
Other languages
English (en)
Chinese (zh)
Other versions
TW202137315A (zh
Inventor
村元僚
佐藤雅伸
小林健司
Original Assignee
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW202137315A publication Critical patent/TW202137315A/zh
Application granted granted Critical
Publication of TWI774198B publication Critical patent/TWI774198B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Plasma & Fusion (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Cleaning In General (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW110101874A 2020-02-28 2021-01-19 基板處理方法 TWI774198B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-032706 2020-02-28
JP2020032706A JP7427475B2 (ja) 2020-02-28 2020-02-28 基板処理方法

Publications (2)

Publication Number Publication Date
TW202137315A TW202137315A (zh) 2021-10-01
TWI774198B true TWI774198B (zh) 2022-08-11

Family

ID=77490432

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110101874A TWI774198B (zh) 2020-02-28 2021-01-19 基板處理方法

Country Status (3)

Country Link
JP (1) JP7427475B2 (ja)
TW (1) TWI774198B (ja)
WO (1) WO2021171805A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7459849B2 (ja) 2021-08-24 2024-04-02 株式会社デンソー レーダ装置及び方位推定方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201707059A (zh) * 2015-03-27 2017-02-16 思可林集團股份有限公司 基板處理裝置及基板處理方法
US20170297164A1 (en) * 2016-04-15 2017-10-19 Samsung Electronics Co., Ltd. Cleaning apparatus and substrate processing system including the same
TW201738004A (zh) * 2016-03-25 2017-11-01 Screen Holdings Co Ltd 基板處理方法及基板處理裝置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100625315B1 (ko) * 2004-08-24 2006-09-20 세메스 주식회사 세정액 공급 장치 및 방법
WO2006104043A1 (ja) 2005-03-25 2006-10-05 Mitsubishi Rayon Co., Ltd. 表面処理方法および表面処理された物品
JP2008027657A (ja) 2006-07-19 2008-02-07 Tokyo Institute Of Technology プラズマ源、処理装置及び処理方法
JP5181085B2 (ja) 2006-06-22 2013-04-10 リバーベル株式会社 処理装置及び処理方法
JP2009016433A (ja) 2007-07-02 2009-01-22 Noritsu Koki Co Ltd レジスト除去装置
KR102461911B1 (ko) 2018-07-13 2022-10-31 삼성전자주식회사 플라즈마 제네레이터, 이를 포함하는 세정수 처리 장치, 반도체 세정 장치 및 세정수 처리 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201707059A (zh) * 2015-03-27 2017-02-16 思可林集團股份有限公司 基板處理裝置及基板處理方法
TW201738004A (zh) * 2016-03-25 2017-11-01 Screen Holdings Co Ltd 基板處理方法及基板處理裝置
US20170297164A1 (en) * 2016-04-15 2017-10-19 Samsung Electronics Co., Ltd. Cleaning apparatus and substrate processing system including the same

Also Published As

Publication number Publication date
JP2021136369A (ja) 2021-09-13
WO2021171805A1 (ja) 2021-09-02
TW202137315A (zh) 2021-10-01
JP7427475B2 (ja) 2024-02-05

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