TWI771324B - 平面研磨裝置 - Google Patents

平面研磨裝置 Download PDF

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Publication number
TWI771324B
TWI771324B TW106133306A TW106133306A TWI771324B TW I771324 B TWI771324 B TW I771324B TW 106133306 A TW106133306 A TW 106133306A TW 106133306 A TW106133306 A TW 106133306A TW I771324 B TWI771324 B TW I771324B
Authority
TW
Taiwan
Prior art keywords
workpiece
laser light
light
circularly polarized
optical path
Prior art date
Application number
TW106133306A
Other languages
English (en)
Chinese (zh)
Other versions
TW201813775A (zh
Inventor
井上裕介
吉原秀明
Original Assignee
日商創技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商創技股份有限公司 filed Critical 日商創技股份有限公司
Publication of TW201813775A publication Critical patent/TW201813775A/zh
Application granted granted Critical
Publication of TWI771324B publication Critical patent/TWI771324B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Crushing And Grinding (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW106133306A 2016-10-07 2017-09-28 平面研磨裝置 TWI771324B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016199085A JP6771216B2 (ja) 2016-10-07 2016-10-07 平面研磨装置
JP2016-199085 2016-10-07

Publications (2)

Publication Number Publication Date
TW201813775A TW201813775A (zh) 2018-04-16
TWI771324B true TWI771324B (zh) 2022-07-21

Family

ID=61894774

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106133306A TWI771324B (zh) 2016-10-07 2017-09-28 平面研磨裝置

Country Status (4)

Country Link
JP (1) JP6771216B2 (ko)
KR (1) KR102336201B1 (ko)
CN (1) CN107914212B (ko)
TW (1) TWI771324B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7046358B2 (ja) * 2018-04-17 2022-04-04 スピードファム株式会社 研磨装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08300256A (ja) * 1995-05-09 1996-11-19 Speedfam Co Ltd ワーク厚さ測定装置付き平面研磨装置
JPH10202514A (ja) * 1997-01-20 1998-08-04 Speedfam Co Ltd 自動定寸装置
JP2000283728A (ja) * 1999-03-31 2000-10-13 Matsushita Electric Ind Co Ltd 薄板材の厚み変動測定方法および装置
JP2015225184A (ja) * 2014-05-27 2015-12-14 株式会社オプトハブ ロータリージョイント

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0716871B2 (ja) * 1986-12-23 1995-03-01 スピ−ドフアム株式会社 定寸装置付きグラインダ−
JPH10260015A (ja) * 1997-03-21 1998-09-29 Olympus Optical Co Ltd 光学式研磨量測定装置
JP2000271854A (ja) * 1999-03-25 2000-10-03 Hitachi Ltd 加工方法及びその装置並びに半導体基板の加工方法
JP3506114B2 (ja) * 2000-01-25 2004-03-15 株式会社ニコン モニタ装置及びこのモニタ装置を具えた研磨装置及び研磨方法
JP2002178257A (ja) * 2000-12-12 2002-06-25 Nikon Corp 研磨面観測装置及び研磨装置
JP2002202108A (ja) * 2000-12-28 2002-07-19 Hitachi Electronics Eng Co Ltd 板厚測定装置
CN100488729C (zh) * 2002-10-17 2009-05-20 株式会社荏原制作所 抛光状态监测装置和抛光装置以及方法
KR20060009387A (ko) * 2003-06-13 2006-01-31 가부시키가이샤 에바라 세이사꾸쇼 측정장치
JP2005175177A (ja) * 2003-12-11 2005-06-30 Nikon Corp 光学装置及び露光装置
KR100819616B1 (ko) * 2006-03-13 2008-04-04 미쓰비시덴키 가부시키가이샤 레이저 가공 장치
JP2008227393A (ja) 2007-03-15 2008-09-25 Fujikoshi Mach Corp ウェーハの両面研磨装置
JP5813959B2 (ja) * 2011-02-07 2015-11-17 株式会社ディスコ レーザー光線照射機構およびレーザー加工装置
CN102221416B (zh) * 2011-03-10 2012-10-10 清华大学 抛光液物理参数测量装置、测量方法和化学机械抛光设备

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08300256A (ja) * 1995-05-09 1996-11-19 Speedfam Co Ltd ワーク厚さ測定装置付き平面研磨装置
JPH10202514A (ja) * 1997-01-20 1998-08-04 Speedfam Co Ltd 自動定寸装置
JP2000283728A (ja) * 1999-03-31 2000-10-13 Matsushita Electric Ind Co Ltd 薄板材の厚み変動測定方法および装置
JP2015225184A (ja) * 2014-05-27 2015-12-14 株式会社オプトハブ ロータリージョイント

Also Published As

Publication number Publication date
JP6771216B2 (ja) 2020-10-21
CN107914212A (zh) 2018-04-17
CN107914212B (zh) 2021-03-30
KR102336201B1 (ko) 2021-12-07
TW201813775A (zh) 2018-04-16
JP2018058186A (ja) 2018-04-12
KR20180038976A (ko) 2018-04-17

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