TWI768187B - Mildewicidal cleaning compositions for hard surfaces - Google Patents

Abstract

The present invention provides a fungicidal cleaning composition for hard surfaces that exhibits excellent fungicidal effect on molds existing in living environments such as bathrooms, has sebum dirt cleaning properties, and is excellent in formulation stability, and a hard surface treatment method using the same . The fungicidal cleaning composition for hard surfaces of the present invention contains 0.1% by mass to 5% by mass of (a) water-soluble inorganic salt [hereinafter referred to as (a) component], 0.05% by mass to 7% by mass ( b) Nonionic bactericide [hereinafter, referred to as (b) component], 0.1 mass % or more and 5 mass % or less of (c1) at least one selected from betaine-type surfactants and amine oxide-type surfactants Surfactant [hereinafter referred to as (c1) component], any surfactant other than (P) (c1) component [hereinafter referred to as (P) component] and water, and the content of (c1) component, The mass ratio (c1)/[(c1)+(P)] to the total content of the component (c1) and the component (P) is 0.30 or more and 1.0 or less, and the fungicidal cleaning composition for hard surfaces is kept at 25°C. The pH value is 5 or more and 9 or less.

Description

Mildewicidal cleaning compositions for hard surfaces

The present invention relates to a fungicidal cleaning composition for hard surfaces and a method for treating hard surfaces.

Hydrophobic dirt such as sebum and soap scum tends to adhere to hard surfaces in places where water is used, such as in bathrooms, and is one of the hard-to-clean dirts because the hardness components in the water are foamed and adhere firmly. In addition, such firmly adhered dirt becomes the nutrients for microorganisms such as mold, and there is always a moderate amount of moisture, so mold is easily generated, and the temporarily generated mold becomes impossible to clean unless it is removed by a strong oxidizing agent such as hypochlorous acid, etc. greater burden. Therefore, a technique for effectively removing a nutrient source of microorganisms such as molds and sterilizing them by a simple method before the microorganisms such as molds multiply is strongly desired.

In Japanese Patent Publication No. 2015-537076, there is disclosed a liquid lotion composition for hand washing of tableware for cleaning and disinfection, which comprises an anionic, nonionic, cationic, bipolar, amphoteric surfactant and the At least one surfactant, at least one organic solvent and/or at least one dissolution aid, and a single antibacterial active substance and/or at least one metal ion blocking agent in the group consisting of a combination of the above.

Japanese Patent Laid-Open No. 2005-187491 discloses an antibacterial liquid detergent composition, which contains phenoxyethanol, an amphoteric surfactant and magnesium chloride, and improves the greasy feeling during cleaning or washing.

In Japanese Patent Laid-Open No. 2007-332304, there is disclosed a technology of a liquid detergent composition containing (A) a non-soap anionic surfactant and (B) a specific semi-polar surfactant , (C) at least one of linear and/or branched higher alcohols or fatty acids with a carbon number of 8 to 24, (D) dissolution aids and (E) antibacterial ingredients, excellent cleaning power, and antiseptic sex.

In Japanese Patent Laid-Open No. 2014-132063 and Japanese Patent Laid-Open No. 2014-132062, there is disclosed a liquid cleaning composition for hard surfaces, which contains benzyl alcohol and an amphoteric surfactant, and has a Excellent cleaning power for microbial pink dirt, excellent cleaning power for sebum dirt adhering to hard surfaces, and good preparation stability.

A cleaning composition is disclosed in Japanese Patent Laid-Open No. 11-61199, which contains a specific nonionic surfactant and/or an amphoteric surfactant, a specific monohydric or polyhydric alcohol, an acid and its salt, and Bactericide, excellent in cleaning effect, antibacterial property, and storage stability, especially effective for hard surfaces such as toilets and toilets.

In Japanese Patent Laid-Open No. 2015-105310, a liquid treatment agent composition for hard surfaces is disclosed, which contains inorganic salts such as a polymer compound containing a monomer unit having a sulfobetaine structure, an alkali metal halide, and the like. Surfactant, modifying the hydrophobic hard surface, can impart excellent antifouling property and excellent stability to temperature.

In Japanese Patent Laid-Open No. 2015-105310, a cleaning composition for hard surfaces is disclosed, which contains a nonionic surfactant, a terpene-based hydrocarbon solvent, a water-soluble solvent, an alkali agent and a cationic surfactant, and is suitable for oily soils. Needless to say, the cleaning power and the storage stability of the composition are excellent, and the cleaning property is also excellent.

In Japanese Patent Publication No. 2017-513985, there is disclosed a hard surface cleaning composition, which contains a specific amine compound, and contains salts of divalent cations, preservatives such as phenoxyethanol, and nonionic surfactants .

In Japanese Patent Laid-Open No. 2000-129298, a liquid lotion composition for hand washing tableware for cleaning and disinfection is disclosed, which comprises an anionic, nonionic, cationic, bipolar, amphoteric surfactant and the At least one surfactant, at least one organic solvent and/or at least one dissolution aid, and a single antibacterial active substance and/or at least one metal ion blocking agent in the group consisting of a combination of the above.

The present invention provides a fungicidal cleaning composition for hard surfaces that exhibits excellent fungicidal effect on molds existing in living environments such as bathrooms, and a method for treating hard surfaces using the same.

The present invention relates to a fungicidal cleaning composition for hard surfaces, which contains 0.1 mass % or more and 5 mass % or less (a) water-soluble inorganic salt [hereinafter referred to as (a) component], 0.05 mass % or more and 7 mass % % or less of (b) nonionic bactericide [hereinafter referred to as (b) component], 0.1% by mass or more and 5% by mass or less (c1) selected from betaine-type surfactants and amine oxide-type surfactants one or more surfactants [hereinafter referred to as (c1) components], any surfactants other than (P) (c1) components [hereinafter referred to as (P) components], and water, and (c1) The mass ratio (c1)/[(c1)+(P)] of the content of the components to the total content of the components (c1) and (P) is 0.30 or more and 1.0 or less, and the fungicidal cleaning composition for hard surfaces is 25 The pH value at ℃ is 5 or more and 9 or less. Hereinafter, it is set as the 1st aspect of this invention.

Moreover, this invention relates to the fungicidal cleaning composition for hard surfaces containing 0.1 mass % or more and 5 mass % or less of (a) water-soluble inorganic salt [hereinafter referred to as (a) component], 0.05 mass % or more 7 mass % or less of (b) nonionic bactericide [hereinafter, referred to as (b) component], 0.1 mass % or more and 5 mass % or less (c2) cationic surfactant [hereinafter referred to as (c2) component] , (d) a solvent (except for the component (b), hereinafter referred to as (d) minutes) and water, and the pH value at 25°C is 5 or more and 9 or less. Hereinafter, it is set as the 2nd aspect of this invention.

Moreover, this invention relates to the fungicidal cleaning composition for hard surfaces containing 0.1 mass % or more and 5 mass % or less of (a) water-soluble inorganic salt [hereinafter referred to as (a) component], 0.05 mass % or more 7 mass % or less of (b) nonionic bactericide [hereinafter, referred to as (b) component], (c4) nonionic surfactant [however, excluding (b) component, hereinafter referred to as (c4) component] and water, and the total content of (a) component and (b) component is 1.5 mass % or more and 10 mass % or less, and the total content of surfactant is 10 mass % or less. The pH at 25°C did not reach 12. Hereinafter, it is set as the 3rd aspect of this invention.

Moreover, this invention relates to the fungicidal cleaning composition for hard surfaces containing 0.1 mass % or more and 5 mass % or less of (a) water-soluble inorganic salt [hereinafter referred to as (a) component], 0.05 mass % or more 7 mass % or less of (b) nonionic bactericide [hereinafter, referred to as (b) component], 0.01 mass % or more and 7 mass % or less (e) metal blocking agent [hereinafter referred to as (e) component] , water and any (S) surfactant [hereinafter, referred to as (S) component], and the content of (S) component is 10% by mass or less, the hard surface fungicidal cleaning composition at 25 ℃ The pH value is 5 or more and 9 or less. Hereinafter, it is set as the 4th aspect of this invention.

Furthermore, the present invention relates to a method for treating a hard surface, wherein the above-mentioned fungicidal cleaning composition for a hard surface of the present invention is brought into contact with a hard surface in which mold is present, and the fungicidal and cleaning are performed simultaneously.

According to the first aspect of the present invention, there is provided a fungicidal cleaning composition for hard surfaces which exhibits an excellent fungicidal effect on molds existing in living environments such as bathrooms, has cleaning properties of sebum and dirt, and is excellent in formulation stability, and Use its hard surface treatment method.

According to the second aspect and the third aspect of the present invention, there is provided a fungicidal cleaning composition for hard surfaces which exhibits an excellent fungicidal effect against mold existing in a living environment such as a bathroom, and which is excellent in cleaning properties of sebum and dirt, and Use its hard surface treatment method.

According to the fourth aspect of the present invention, there is provided a fungicidal cleaning composition for hard surfaces which exhibits excellent fungicidal effect against mold existing in living environments such as bathrooms, and which is excellent in cleaning properties of soap scum, and a hard surface using the same Approach.

[Fungicide cleaning composition for hard surfaces] [the first aspect] The 1st aspect of this invention is the fungicidal cleaning composition for hard surfaces containing 0.1 mass % or more of 5 mass % or less of (a) component, 0.05 mass % or more of 7 mass % or less of (b) component, 0.1 Mass % to 5 mass % of (c1) component, optional (P) component, and water, and the mass ratio of the content of (c1) component to the total content of (c1) component and (P) component (c1)/[ (c1)+(P)] is 0.30 or more and 1.0 or less, and the pH value at 25 degreeC of this fungicidal cleaning composition for hard surfaces is 5 or more and 9 or less.

<(a) Component> The component (a) of the present invention is a water-soluble inorganic salt. Here, regarding the inorganic salt of the component (a), water solubility means that 5 g or more is dissolved in 100 g of deionized water at 25°C.

The component (a) is selected from the group consisting of alkali metal sulfates, alkaline earth metal sulfates, ammonium sulfates, alkali metal sulfites, alkaline earth metal sulfites, alkali metal halides, alkaline earth metal halides, alkali metal nitrates, One or more water-soluble inorganic salts selected from the group consisting of alkaline earth metal nitrates, alkali metal carbonates, alkaline earth metal carbonates, alkali metal phosphates, alkaline earth metal phosphates, alkali metal thiocyanates and alkaline earth metal thiocyanates. From the viewpoint of fungicidal performance and formulation stability, preferably one or more water-soluble inorganic salts selected from the group consisting of alkali metal sulfates, alkaline earth metal sulfates, alkali metal halides and alkaline earth metal halides, more preferably One or more water-soluble inorganic salts selected from alkali metal sulfates, alkaline earth metal sulfates, alkali metal chlorides and alkaline earth metal chlorides, and preferably one selected from alkali metal sulfates and alkali metal chlorides more than one water-soluble inorganic salt, more preferably an alkali metal sulfate.

More specifically, the (a) component may be selected from the group consisting of sodium sulfate, lithium sulfate, potassium sulfate, cesium sulfate, ammonium sulfate, sodium sulfite, sodium chloride, potassium chloride, sodium nitrate, sodium carbonate, disodium hydrogen phosphate and One or more kinds of sodium thiocyanate are preferably one or more kinds selected from sodium sulfate, potassium sulfate, sodium nitrate, sodium chloride and potassium chloride from the viewpoint of fungicidal effect and preparation stability, More preferably, it is at least one selected from the group consisting of sodium sulfate, potassium sulfate, and potassium chloride. Component (a) of the present invention is preferably sodium sulfate.

<(b) Component> The (b) component of this invention is a nonionic fungicide. From the viewpoint of fungicidal performance, the component (b) is preferably a nonionic fungicide having an optionally substituted aromatic group and a hydroxyl group and having a molecular weight of 106 or more and 300 or less. The aromatic group is an aromatic hydrocarbon group, and examples thereof include a phenyl group, a benzyl group, and a phenethyl group, and these aromatic groups may have a substituent. Examples of substituents include halogen groups such as fluorine groups and chlorine groups; alkyl groups such as methyl, ethyl, and isopropyl groups; carboxyl groups, amino groups, sulfo groups, alkoxy groups, and the like, and these substituents may have one type or two or more.

From the viewpoint of fungicidal performance and formulation stability, the component (b) is preferably a compound represented by the following general formula (b1). R ^1b O-(R ^2b O) _l -H (b1) (wherein R ^1b is a hydrocarbon group having an aromatic group and a total carbon number of 6 or more and 11 or less, l is an integer of 0 or 1, and R ^2b is a carbon number 2 or more and 4 or less alkylene; wherein, the molecular weight of the compound is 106 or more and 300 or less)

The total carbon number of R ^1b is the carbon number including the aromatic group, and from the viewpoint of fungicidal performance, the total carbon number of R ^1b is 6 or more, and from the viewpoint of compounding stability, it is 11 or less, Preferably it is 10 or less, More preferably, it is 9 or less. R ^1b is an aromatic hydrocarbon group, and examples thereof include a phenyl group, a benzyl group, and a phenethyl group. From the viewpoint of the fungicidal effect, R ^2b is preferably an ethylidene group. From the viewpoint of the fungicidal effect, l is preferably 0.

Specific examples of the component (b) include benzyl alcohol (molecular weight: 108), phenoxyethanol (molecular weight: 138), 2-phenylethanol (molecular weight: 122), and 3-phenyl-1 -Propanol (Molecular Weight: 136), Cinnamyl Alcohol (Molecular Weight: 134), Ethylene Glycol Benzyl Ether (Molecular Weight: 152), Diethylene Glycol Phenyl Ether (Molecular Weight: 182), Diethylene Glycol Benzyl Ether (Molecular Weight: 196 ), 4-phenyl-1-butanol (molecular weight: 150), triclosan (molecular weight: 290), diclosan (molecular weight: 255) and one of isopropylmethylphenol (molecular weight: 150) As mentioned above, from the viewpoint of the fungicidal effect and preparation stability, it is preferably selected from the group consisting of benzyl alcohol, phenoxyethanol, diethylene glycol phenyl ether, triclosan, dilosan, and isopropylmethylphenol One or more of them, more preferably one or more selected from the group consisting of benzyl alcohol and phenoxyethanol.

<(c1) Ingredient> The component (c1) of the present invention is one or more surfactants selected from betaine-type surfactants and amine oxide-type surfactants. Specifically, as the component (c1), one or more surfactants selected from the group consisting of sulfobetaine, carbonyl betaine, and amine oxide can be exemplified. From the viewpoint of formulation stability, the component (c1) is preferably one or more surfactants selected from carbonyl betaine and amine oxide.

Examples of sulfobetaines include N-alkyl-N,N-dimethyl-N-sulfopropane having an alkyl group of preferably 10 or more, preferably 18 or less, and more preferably 14 or less carbon atoms. Ammonium sulfobetaine; N-alkyl-N,N-dimethyl-N-(2-hydroxyl with preferably 10 or more, preferably 18 or less, more preferably 14 or less carbon atoms in the alkyl group Sulfopropyl) ammonium sulfobetaine; N-alkanoylaminopropyl-N,N-dicarbonate preferably 10 or more, more preferably 18 or less, more preferably 14 or less carbon number of the alkanoyl group Methyl-N-sulfopropylammonium sulfobetaine; N-alkanoylaminopropyl-N with the carbon number of the alkanoyl group preferably being 10 or more, preferably 18 or less, more preferably 14 or less , N-dimethyl-N-(2-hydroxysulfopropyl) ammonium sulfobetaine.

Examples of carbonyl betaine include N-alkyl-N,N-dimethyl-N-carboxymethylammonium having an alkyl group of preferably 10 or more, more preferably 18 or less, and more preferably 14 or less carbon atoms. Betaine; or a compound represented by the following general formula (c11), preferably a compound represented by the following general formula (c11) from the viewpoint of cleaning power.

[hua 1]

[In the formula, R ^1c represents an alkyl group or an alkenyl group having 7 to 21 carbon atoms, R ^2c represents a propylidene group, and R ^3c and R ^4c each independently represent an alkyl group having 1 to 3 carbon atoms.]

In the general formula (c11), the number of carbon atoms in R ^1c is preferably 9 or more, more preferably 11 or more, more preferably 15 or less, more preferably 13 or less alkyl or alkenyl, preferably nonyl, decyl base, undecyl, dodecyl, tridecyl. In the general formula (c11), R ^3c and R ^4c are each independently preferably a methyl group.

The amine oxide is preferably a compound of the following general formula (c12).

[hua 2]

[In the formula, R ^5c represents a hydrocarbon group with 7 to 22 carbon atoms, preferably an alkyl group or an alkenyl group, more preferably an alkyl group, and R ^6c and R ^7c are the same or different, and represent an alkyl group with 1 to 3 carbon atoms or less . D represents a -NHC(=O)- group or a -C(=O)NH- group, and E represents an alkylene group having 1 to 5 carbon atoms. m and p denote m=0 and p=0 or m=1 and p=1]

In the above general formula (c12), when m=1 and p=1, from the viewpoint of cleaning power, R ^5c is preferably an alkyl group having 9 to 18 carbon atoms, more preferably 11 carbon atoms. The alkyl group having 16 or more carbon atoms is more preferably an alkyl group having 11 or more carbon atoms and 14 or less, and more preferably an alkyl group having 11 carbon atoms or less. Moreover, in the case of m=0 and p=0, from the viewpoint of cleaning power, R ^5c is preferably an alkyl group having 10 to 18 carbon atoms, more preferably an alkyl group having 12 to 16 carbon atoms, More preferably, it is an alkyl group having 12 or more carbon atoms and not more than 14 carbon atoms, and still more preferably an alkyl group having 12 carbon atoms. In the present invention, m=0 and p=0 are preferred. From the viewpoint of cleaning power, R ^6c and R ^7c are preferably methyl groups having 1 carbon atoms.

＜(P)component＞ The component (P) of the present invention is a surfactant other than the component (c1). The fungicidal cleaning composition for hard surfaces of the first aspect of the present invention may contain (P) component as an optional component. As the (P) component, one or more interfaces selected from the group consisting of (c2) cationic surfactant, (c3) anionic surfactant, and (c4) nonionic surfactant (except for (b) component) can be mentioned. active agent. When the fungicidal cleaning composition for hard surfaces of the first aspect of the present invention contains the component (P), the component (P) preferably contains a cationic interface selected from the group consisting of (c2) from the viewpoint of cleaning power. One or more of the active agent and the (c3) anionic surfactant.

(c2) As a cationic surfactant, a quaternary ammonium salt type cationic surfactant can be mentioned. Examples of the quaternary ammonium salt type cationic surfactant include the following quaternary ammonium salt type cationic surfactants: among the groups bonded to the nitrogen atom, one or two are hydrocarbon groups having 8 to 16 carbon atoms, and the remainder is a group selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, a hydroxyalkyl group having 1 to 3 carbon atoms, and an arylalkyl group (benzyl group, etc.). Among them, quaternary ammonium salt type cationic surfactants having bactericidal properties are preferred, and in terms of bactericidal properties, quaternary ammonium salt type cationic surfactants having benzyl groups are preferred.

(c3) As an anionic surfactant, the anionic surfactant which has one or more hydrocarbon groups and one or more groups selected from the group which consists of a sulfonic acid group, a sulfate group, and a carboxylic acid group is mentioned. Examples of anionic surfactants include alkyl or alkenyl benzene sulfonic acid or salts thereof, polyoxyalkylene alkyl or alkenyl ether sulfates or salts thereof, alkyl or alkenyl sulfates or salts thereof, and Fatty acids or their salts, etc. From the viewpoint of cleaning power, the anionic surfactant is preferably one or more selected from the group consisting of polyoxyalkylene alkyl or alkenyl ether sulfates or salts thereof, and fatty acids or salts thereof. The oxyalkylene group of the polyoxyalkylene alkyl or alkenyl ether sulfate or its salt is preferably an oxyethylene group. Moreover, it is preferable that the average addition molar number of the oxyalkylene group of a polyoxyalkylene alkylene group or an alkenyl ether sulfate ester salt is 1 or more and 10 or less. As fatty acid or its salt, a C10-18 fatty acid or its salt is mentioned. The alkyl or alkenyl group of the anionic surfactant preferably has 10 or more carbon atoms and 18 or less carbon atoms. Further, the salt is preferably an alkali metal salt such as a sodium salt and a potassium salt.

(c4) Nonionic surfactants include polyoxyalkylene alkyl ethers having an alkyl group having 10 to 18 carbon atoms, and polyoxyalkylene olefins having an alkenyl group having 10 to 18 carbon atoms. Alkyl ethers, polyoxyalkylene sorbitan fatty acid esters having a fatty acid group having 10 to 18 carbon atoms, alkyl glycosides having an alkyl group having 8 to 18 carbon atoms, and alkanes having 8 to 18 carbon atoms Alkyl polyglycosides with carbon number, sucrose fatty acid esters with fatty acid groups with carbon number of 8 to 18, and alkyl polyglyceryl ethers with alkyl groups of carbon number of 8 to 18 or less. Among them, from the viewpoint of cleaning properties, a polyoxyethylene alkyl ether having an alkyl group having 10 to 16 carbon atoms and an average added molar number of ethylene oxide of 1 to 15 or less is preferable. However, (b) component is excluded from (c4) component.

＜Composition, etc.＞ Although the mechanism of action of the fungicidal cleaning composition for hard surfaces of the first aspect of the present invention is unknown, it is considered as follows. It is known that mold has a thicker cell wall outside the cell membrane, and the cell wall of mold includes a polysaccharide layer including glucan-chitin and the like, a melanin layer, a hydrophobin layer, and the like. Due to the existence of the cell wall, the penetration of fungicides into the cell interior of mold is lower than that of general bacteria such as Escherichia coli, and a sufficient fungicidal effect is not obtained in a short period of time, which is considered a problem. It is considered that when an aqueous solution containing the component (a) of the present invention at a specific concentration acts on a protein such as hydrophobin, structural changes of the protein are caused, and as a result, the nonionic bactericide as the component (b) of the present invention is considered to be sterilizing The increase in the penetration in the mold cells can give the fungicidal effect. However, in the case of applying this technology to a cleanser, the salt strength is increased by the formulation of the component (a), and as a result, in the case of formulation of a surfactant that is effective in cleaning sebum and dirt, formulation stability occurs The problem of sexual decline. In the fungicidal cleaning composition for hard surfaces of the first aspect of the present invention, it is considered that the (c1) component and the (P) component are contained in specific amounts as interfacial activity in the (a) component and the (b) component. It can provide a fungicidal cleaning composition for hard surfaces with excellent fungicidal performance and sebum cleaning power and good formulation stability.

The fungicidal cleaning composition for hard surfaces of the first aspect of the present invention contains 0.1% by mass or more, preferably 0.5% by mass or more, more preferably 1% by mass or more, from the viewpoint of improving the fungicidal performance. The (a) component also contains 5 mass % or less, preferably 4 mass % or less, and more preferably 3 mass % or less of the (a) component from the viewpoint of compounding stability.

The fungicidal cleaning composition for hard surfaces of the first aspect of the present invention contains 0.05 mass % or more, preferably 0.1 mass % or more, more preferably 0.5 mass % or more, from the viewpoint of improving the fungicidal performance. , and more preferably 1 mass % or more of (b) component, and, from the viewpoint of compounding stability, contains 7 mass % or less, preferably 5 mass % or less, more preferably 4 mass % or less, and more The (b) component of 3 mass % or less is preferable.

The fungicidal cleaning composition for hard surfaces according to the first aspect of the present invention contains 0.1 mass % or more, preferably 0.5 mass % or more, and more preferably 1 mass % from the viewpoints of formulation stability and cleaning properties. % or more of (c1) component, and from the viewpoint of fungicidal performance, 5 mass % or less, preferably 4 mass % or less, and more preferably 3 mass % or less of (c1) is contained.

In the fungicidal cleaning composition for hard surfaces of the first aspect of the present invention, the content of the component (P) is limited from the viewpoint of formulation stability. In the fungicidal cleaning composition for hard surfaces of the first aspect of the present invention, the mass of the content of the component (c1) and the total content of the component (c1) and the (P) component from the viewpoint of formulation stability The ratio (c1)/[(c1)+(P)] is 0.30 or more, preferably 0.40 or more, more preferably 0.50 or more, and from the viewpoint of cleaning power, 1.0 or less, preferably 0.90 or less, More preferably, it is 0.80 or less.

From the viewpoint of enhancing the fungicidal effect, the fungicidal cleaning composition for hard surfaces according to the first aspect of the present invention preferably contains a solvent (except for the component (b)) as the component (d).

The component (d) is preferably one or more solvents selected from the compounds of the following (d1) to (d3). (d1): aliphatic alcohol with a molecular weight of 60 or more and 500 or less (d2): Aliphatic glycol ether with molecular weight of 60 or more and 500 or less (d3): Aliphatic diol with molecular weight of 60 or more and 500 or less

The component (d) is preferably a logP value of 0 or more, more preferably 0.5 or more, from the viewpoints of further improving the fungicidal effect and distribution from the water phase to the bacterial cells, and furthermore, the fungicidal effect and formulation stability From a viewpoint, it is preferable that it is 3 or less, and it is more preferable that it is a compound of 2 or less.

In the present invention, the logP value is a coefficient representing the affinity of an organic compound for water and 1-octanol. The 1-octanol/water partition coefficient P is based on the distribution equilibrium when a trace amount of compound is dissolved as a solute into the solvent of the 2-phase liquid phase of 1-octanol and water. The ratio of the equilibrium concentration of the compound in each solvent is generally expressed as These are expressed in the form of log P with respect to base 10. The logP values of many compounds are reported, and more values are disclosed in the databases available from Daylight Chemical Information Systems, Inc. (Daylight CIS), etc., so they can be referred to. When there is no measured logP value, it can be calculated by a program such as "CLOGP" which can be obtained from Daylight CIS. In the presence of the measured logP value, the program outputs the value of "calculated logP(ClogP)" calculated by Hansch, Leo's fragmentation method together with it.

The fragmentation method is based on the chemical structure of the compound, considering the number of atoms and the type of chemical bonds (cf. A. Leo, Comprehensive Medicinal Chemistry, Vol.4, C. Hansch, P.G. Sammens, J.B.Taylor and C.A. Ramsden, Eds., p. 295, Pergamon Press, 1990). In selecting compounds, this ClogP value can be used in place of the measured logP value. In the present invention, if the measured value of logP exists, the measured value of logP is used, and when it does not exist, the ClogP value calculated by the program CLOGP v4.01 is used.

Examples of aliphatic alcohols having a molecular weight of 60 or more and 500 or less to be (d1) include 1-propanol (molecular weight: 60, logP: 0.55), 2-propanol (molecular weight: 60, logP: 0.38), 1-propanol (molecular weight: 60, logP: 0.38), 1-propanol (molecular weight: 60, logP: 0.55), -hexanol (molecular weight: 102, logP: 1.80), 1-pentanol (molecular weight: 88, logP: 1.39), 3-pentanol (molecular weight: 88, logP: 1.36), 1-butanol (molecular weight: 74, logP: 0.97), 2-butanol (molecular weight: 74, logP: 0.87), tertiary butanol (molecular weight: 74, logP: 0.60), cyclopentanol (molecular weight: 86, logP: 0.86), 1-heptanol (Molecular weight: 116, logP: 2.22) and one or more of 1-octanol (Molecular weight: 130, logP: 2.64), from the viewpoint of simultaneously achieving the fungicidal effect and formulation stability, it is preferably selected from 1 - 1 or more of propanol, 1-butanol, 2-butanol, 1-pentanol, 3-pentanol, cyclopentanol, 1-hexanol and 1-heptanol, more preferably selected from 1- One or more of butanol, 2-butanol, 1-pentanol, 3-pentanol and cyclopentanol, more preferably selected from 1-butanol, 1-pentanol, 3-pentanol and cyclopentanol One or more kinds of alcohols, more preferably one or more kinds selected from the group consisting of 1-butanol, 1-pentanol, and 3-pentanol.

The compound represented by the following general formula (d2) is preferable as the aliphatic glycol ether having a molecular weight of 60 or more and 500 or less to be (d2). R ^1d O-(R ^2d O) _n -H (d2) (wherein R ^1d is an aliphatic hydrocarbon group with 1 to 8 carbon atoms, R ^2d is an alkylene group with 2 or 3 carbon atoms, and n is 1 or more an integer below 4)

From the viewpoint of the fungicidal effect, R ^1d is preferably an alkyl group or an alkenyl group having 3 to 6 carbon atoms. From the viewpoint of the fungicidal effect, n is preferably 3 or less, more preferably 2 or less.

Specifically, (d2) may be selected from the group consisting of 2-ethylhexanediol (molecular weight: 174, logP: 2.46), hexanediol (molecular weight: 146, logP: 1.65), and diethylene glycol hexyl ether (molecular weight: 1.65). 190, logP: 1.49), dipropylene glycol butyl ether (molecular weight: 190, logP: 1.29), butyl propylene glycol (molecular weight: 132, logP: 1.13), dipropylene glycol propyl ether (molecular weight: 176, logP: 0.88), butanediol Alcohol (molecular weight: 118, logP: 0.81), propyl propylene glycol (molecular weight: 118, logP: 0.71), diethylene glycol butyl ether (molecular weight: 162, logP: 0.66), 2-tert-butoxyethanol (molecular weight: 162, logP: 0.66) : 118, logP: 0.45), diethylene glycol isobutyl ether (molecular weight: 118, logP: 0.07), propylene glycol methyl ether (molecular weight: 90, logP: -0.11) and methyl glycol (molecular weight: 76, logP : -0.43) at least one, from the viewpoint of the fungicidal effect, preferably selected from the group consisting of hexylene glycol, diethylene glycol hexyl ether, butyl propylene glycol, dipropylene glycol butyl ether, butylene glycol, and diethylene glycol At least one of alcohol butyl ether, dipropylene glycol propyl ether and propyl propylene glycol, more preferably selected from diethylene glycol hexyl ether, butyl propylene glycol, dipropylene glycol propyl ether, butylene glycol and diethylene glycol butyl ether One or more of them are further preferably one or more selected from the group consisting of diethylene glycol hexyl ether, butyl propylene glycol and butanediol, and still more preferably one or more selected from the group consisting of butyl propylene glycol and butanediol.

As the aliphatic diol having a molecular weight of 60 or more and 500 or less to be (d3), a compound represented by the following general formula (d3) is preferred. Furthermore, (d2) is not included in (d3). R ^3d -CH(OH)-(CH ₂ ) _q -CH ₂ OH (d3) (wherein R ^3d is a hydrogen atom, an aliphatic hydrocarbon group with 1 to 8 carbon atoms or R ^4d O, and R ^4d is a carbon number A hydrocarbon group of 1 or more and 8 or less, q is 0 or an integer of 1 or more and 6 or less. The total carbon number in the compound is 4 or more and 10 or less)

From the viewpoint of the fungicidal effect, R ^3d is preferably a hydrogen atom or an alkyl group or alkenyl group having 2 to 8 carbon atoms, more preferably an alkyl group or alkenyl group having 3 to 8 carbon atoms, and more preferably An alkyl or alkenyl group having 4 to 8 carbon atoms. R ^4d is preferably an alkyl group or alkenyl group having 2 to 8 carbon atoms, more preferably an alkyl group or alkenyl group having 3 to 8 carbon atoms, and further preferably an alkyl group or alkenyl group having 4 to 8 carbon atoms. . From the viewpoint of the fungicidal effect, q is preferably 1 or less.

Specifically, (d3) is selected from the group consisting of 1,2-hexanediol (molecular weight: 118, logP: 0.85), 1,2-pentanediol (molecular weight: 104, logP: 0.43), and propylene glycol (molecular weight: 76) , logP: 0.40), 1,6-hexanediol (molecular weight: 118, logP: 0.60), 1,2-butanediol (molecular weight: 90, logP: 0.01), 1,4-butanediol (molecular weight: 90, logP: -0.23), 1,3-butanediol (molecular weight: 90, logP: 0.-0.37), 1,5-pentanediol (molecular weight: 104, logP: 0.19), 1,2-octane One or more of diol (molecular weight: 146, logP: 1.68), amylglycerol ether (molecular weight: 162, logP: 0.69) and 1,8-octanediol (molecular weight: 146, logP: 1.44) at the same time From the viewpoint of achieving the fungicidal effect and formulation stability, it is preferably selected from 1,2-hexanediol, 1,2-pentanediol, propylene glycol, amylglycerol ether, and 1,6-hexanediol 1 or more, more preferably 1 or more selected from the group consisting of 1,2-hexanediol, pentyl glyceryl ether and 1,2-pentanediol, more preferably 1,2-hexanediol and pentanediol One or more of glycerol ethers.

From the viewpoint of enhancing the fungicidal effect, the component (d) is preferably one or more compounds selected from the group consisting of (d2) and (d3). Furthermore, it is more preferable that (d2) is a compound represented by general formula (d2), and (d3) is a compound represented by general formula (d3).

When the fungicidal cleaning composition for hard surfaces of the first aspect of the present invention contains the component (d), from the viewpoint of enhancing the fungicidal effect, the content is preferably 0.1% by mass or more, more preferably 0.5% by mass. Component (d) is more preferably at least 0.8 mass % by mass, more preferably at most 12 mass %, more preferably at most 10 mass %, and more preferably at most 12 mass % from the viewpoint of formulation stability (d) component of 8 mass % or less.

From the viewpoint of improving the cleaning power, the fungicidal cleaning composition for hard surfaces of the first aspect of the present invention preferably contains a metal blocking agent as the component (e). As the metal blocking agent, at least one compound selected from the group consisting of aminocarboxylic acid, hydroxycarboxylic acid, hydroxyphosphonic acid and salts thereof is preferred.

Examples of aminocarboxylic acids and salts thereof include those selected from the group consisting of ethylenediaminetetraacetic acid (EDTA), nitrotriacetic acid (NTA), iminodiacetic acid, diethylenetriaminepentaacetic acid (DPTA), N- 1 of hydroxyethyl-ethylenediaminetriacetic acid (HEDTA), methylglycine diacetic acid (MGDA), aspartic acid diacetic acid (ASDA), glutamic acid diacetic acid (GLDA) and their salts species or two or more. The amino carboxylic acid and its salts are preferably one or two selected from ethylenediaminetetraacetic acid and its salts, methylglycine diacetic acid and its salts, and L-glutamic acid diacetic acid and its salts above.

As a hydroxycarboxylic acid and its salt, the compound chosen from aliphatic hydroxycarboxylic acid and its salt is preferable. As a hydroxycarboxylic acid and its salt, the compound chosen from malic acid, a citric acid, and its salt is mentioned.

Examples of hydroxyphosphonic acid and salts thereof include compounds selected from 1-hydroxyethylidene-1,1-diphosphonic acid (HEDP) and salts thereof.

Examples of the salt of the metal blocking agent include alkali metal salts, ammonium salts, amine salts, and the like. Preferred are alkali metal salts, and more preferred are sodium or potassium salts.

(e) Component is preferably one or more selected from ethylenediaminetetraacetic acid (EDTA), methylglycine diacetic acid (MGDA), citric acid, malic acid and their salts, more preferably selected from One or more of ethylenediaminetetraacetic acid (EDTA), citric acid, and salts thereof, and more preferably one or more selected from ethylenediaminetetraacetic acid and salts thereof.

When the fungicidal cleaning composition for hard surfaces of the first aspect of the present invention contains the component (e), from the viewpoint of improving the cleaning power, the content is preferably 0.1 mass % or more, more preferably 0.5 mass % % or more, more preferably 1 mass % or more of the component (e), and from the viewpoint of compounding stability, the content is preferably 10 mass % or less, more preferably 8 mass % or less, and more preferably 7 mass % or less. (e) component below mass %.

In the fungicidal cleaning composition for hard surfaces of the first aspect of the present invention, in order to increase the added value of the product, fragrances, pigments, preservatives, antioxidants, etc. can be arbitrarily formulated (however, the above-mentioned component (a) , (b) component, (c1) component, (P) component, (d) component, (e) component are excluded).

The fungicidal cleaning composition for hard surfaces of the 1st aspect of this invention contains water. That is, the remainder other than the said (a) component, (b) component, (c1) component, and an arbitrary component is water. The content of the fungicidal cleaning composition for hard surfaces of the first aspect of the present invention is preferably 50% by mass or more, more preferably 60% by mass or more, more preferably 70% by mass or more, and still more preferably 80% by mass More than 99 mass % or less is preferable, and 95 mass % or less of water is more preferable. As water, ion-exchanged water, sterilizing ion-exchanged water, or the like is preferably used.

The fungicidal cleaning composition for hard surfaces of the first aspect of the present invention is a fungicidal cleaning composition for hard surfaces that does not require a strong base or a strong acid. That is, even if the fungicidal composition of the 1st aspect of this invention is liquid in the vicinity of neutrality, a favorable fungicidal effect can be obtained. From the viewpoint of ease of handling and irritation to the skin on hands, the pH of the fungicidal cleaning composition for hard surfaces of the first aspect of the present invention at 25°C is 5 or more, preferably 5.5 or more , more preferably 6 or more, and 9 or less, preferably 8.5 or less, more preferably 8 or less.

[the second aspect] The 2nd aspect of this invention is the fungicidal cleaning composition for hard surfaces containing 0.1 mass % or more and 5 mass % or less of (a) component, 0.05 mass % or more and 7 mass % or less of (b) component, 0.1 Component (c2), component (d), and water of not less than mass % and not more than 5% by mass, and pH at 25°C of not less than 5 and not more than 9.

<(a) Component> In the second aspect of the present invention, the water-soluble inorganic salt as the component (a) is the same as the component (a) described in the first aspect of the present invention, and its preferred aspects are also the same.

<(b) Component> In the second aspect of the present invention, the nonionic bactericide as the component (b) is the same as the component (b) described in the first aspect of the present invention, and its preferred aspects are also the same.

<(c2) Ingredient> In the 2nd aspect of this invention, a quaternary ammonium salt type cationic surfactant is mentioned as a cationic surfactant which becomes (c2) component. Examples of the quaternary ammonium salt type cationic surfactant include the following quaternary ammonium salt type cationic surfactants: Among the groups bonded to the nitrogen atom, one or two are hydrocarbon groups having 6 to 18 carbon atoms, and the remainder is a group selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, a hydroxyalkyl group having 1 to 3 carbon atoms, and an arylalkyl group (benzyl group, etc.). Among them, quaternary ammonium salt type cationic surfactants having fungicidal properties and cleaning power are preferred, and in terms of fungicidal properties, quaternary ammonium salt type cationic surfactants having benzyl groups are preferred.

The cationic surfactant is preferably a quaternary ammonium salt type cationic surfactant represented by the following general formula (c2).

[hua 3]

[In the formula, R ^11c represents a hydrocarbon group having 6 to 18 carbon atoms. R ^12c and R ^13c each independently represent an alkyl group having 1 or more carbon atoms and 3 or less carbon atoms. R ^14c represents an alkylene group having 1 or more carbons and 3 or less. Z ^- represents an anionic group]

In the general formula (c2), R ^11c is preferably 8 or more carbon atoms, and more preferably 14, from the viewpoint of the improvement of the fungicidal effect due to the distribution in the bacterial cell and the viewpoint of the preparation stability. Below, more preferably 10 or less hydrocarbon groups, preferably an alkyl group or an alkenyl group, more preferably an alkyl group. Moreover, in general formula (c2), R ^12c and R ^13c are each independently an alkyl group having 1 to 3 carbon atoms, preferably an alkyl group having 1 to 2 carbon atoms, more preferably a methyl group. In addition, in the general formula (c2), R ^14c is an alkylene group having 1 to 3 carbon atoms, preferably an alkylene group having 1 to 2 carbon atoms, more preferably a methylene group. Moreover, as Z ^- in general formula (c2), halogen ions, such as a chloride ion, are preferable. As Z ^- , chloride ion (Cl ^- ) is more preferred.

<(d) Component> In the second aspect of the present invention, the solvent used as the component (d) is the same as the component (d) described in the first aspect of the present invention, and the preferred aspects thereof are also the same.

＜Composition, etc.＞ Although the mechanism of action of the fungicidal cleaning composition for hard surfaces of the second aspect of the present invention is unknown, it is considered as follows. It is known that mold has a thicker cell wall outside the cell membrane, and the cell wall of mold includes a polysaccharide layer including glucan-chitin and the like, a melanin layer, a hydrophobin layer, and the like. Due to the existence of the cell wall, the penetration of fungicides into the cell interior of mold is lower than that of general bacteria such as Escherichia coli, and a sufficient fungicidal effect is not obtained in a short period of time, which is considered a problem. It is considered that when an aqueous solution containing the component (a) of the present invention at a specific concentration acts on proteins such as hydrophobin, the structure of the protein is changed. Increased penetration into cells can impart a fungicidal effect. However, in the case of applying this technology to a cleaning agent, the salt strength is increased by the formulation of the component (a), and as a result, in the case of a surfactant that is effective in cleaning sebum and dirt, fungicidal occurs. The problem of reduced effect. It is thought that in the fungicidal cleaning composition for hard surfaces of the second aspect of the present invention, the components (c2) and (d) are contained in specific amounts in the components (a) and (b). A fungicidal cleaning composition for hard surfaces with excellent fungicidal properties and sebum cleaning power.

The fungicidal cleaning composition for hard surfaces according to the second aspect of the present invention contains 0.1 mass % or more, preferably 0.5 mass % or more, more preferably 1.0 mass % or more from the viewpoint of the fungicidal effect. (a) Component and, from the viewpoint of compounding stability, contain (a) component of 5 mass % or less, preferably 4 mass % or less, and more preferably 3 mass % or less.

From the viewpoint of the fungicidal effect, the fungicidal cleaning composition for hard surfaces of the second aspect of the present invention contains 0.05 mass % or more, preferably 0.1 mass % or more, more preferably 0.5 mass % or more, Furthermore, it is more preferable to contain 1.0 mass % or more of (b) component, and from the viewpoint of compounding stability, it is preferable to contain 7 mass % or less, preferably 5 mass % or less, more preferably 4 mass % or less, and still more preferably (b) component which is 3 mass % or less.

From the viewpoint of the fungicidal effect and cleaning power, the fungicidal cleaning composition for hard surfaces of the second aspect of the present invention contains 0.1 mass % or more, preferably 0.3 mass % or more, more preferably 0.5 mass % or more and more preferably 0.75 mass % or more, and 5 mass % or less, preferably 4 mass % or less, more preferably 3 mass % or less of the component (c2).

The fungicidal cleaning composition for hard surfaces of the second aspect of the present invention contains preferably 0.1 mass % or more, more preferably 0.5 mass % or more, from the viewpoint of the fungicidal effect and cleaning power. The (d) component is preferably 1% by mass or more, and, from the viewpoint of compounding stability, preferably 10% by mass or less, more preferably 8% by mass or less, and more preferably 7% by mass or less ( d) Ingredients.

The total content of the fungicidal cleaning composition for hard surfaces of the second aspect of the present invention is preferably 0.2 mass % or more, more preferably 0.5 mass % or more, and further from the viewpoint of the fungicidal effect and cleaning power. 1.5 mass % or more of (c2) component and (d) component are preferable, and from the viewpoint of compounding stability, the total content is preferably 12 mass % or less, more preferably 10 mass % or less, and more preferably (c2) component and (d) component of 8 mass % or less.

The fungicidal cleaning composition for hard surfaces of the second aspect of the present invention may contain surfactants other than the component (c2) as the component (Q). As the (Q) component, (c1) one or more surfactants selected from the group consisting of betaine-type surfactants and amine oxide-type surfactants, (c3) anionic surfactants, and (c4) non-ionic surfactants can be mentioned. One or more of the ionic surfactants.

In the second aspect of the present invention, as the component (c1), one or more surfactants selected from the group consisting of betaine-type surfactants and amine oxide-type surfactants are the same as those in the first aspect of the present invention. The components (c1) described above are the same, and their preferred aspects are also the same.

In the second aspect of the present invention, the anionic surfactant as the component (c3) is the same as the component (c3) described in the first aspect of the present invention, and its preferred aspects are also the same.

In the second aspect of the present invention, the nonionic surfactant as the component (c4) is the same as the component (c4) described in the first aspect of the present invention, and its preferred aspects are also the same.

In the fungicidal cleaning composition for hard surfaces of the second aspect of the present invention, when the component (Q) is contained, from the viewpoints of improving the fungicidal effect and cleaning power, the composition of the component (Q) is appropriately prepared. content. In the fungicidal cleaning composition for hard surfaces of the second aspect of the present invention, from the viewpoint of the fungicidal effect, the mass of the content of the component (c2) and the total content of the component (c2) and (Q) The ratio (c2)/[(c2)+(Q)] is preferably 0.1 or more, more preferably 0.2 or more, still more preferably 0.3 or more, still more preferably 0.4 or more, and from the viewpoint of cleaning power, It is preferably 1 or less, more preferably 0.9 or less, and still more preferably 0.8 or less.

From the viewpoint of improving the cleaning power, the fungicidal cleaning composition for hard surfaces of the second aspect of the present invention preferably contains a metal blocking agent as the component (e). In the second aspect of the present invention, the metal blocking agent as the component (e) is the same as the component (e) described in the first aspect of the present invention, and its preferred aspects are also the same.

When the fungicidal cleaning composition for hard surfaces of the second aspect of the present invention contains the component (e), from the viewpoint of improving the cleaning power, the content is preferably 0.2 mass % or more, more preferably 0.5 mass % % or more, more preferably 1 mass % or more of the component (e), and from the viewpoint of compounding stability, the content is preferably 6 mass % or less, more preferably 5 mass % or less, and more preferably 4 mass % or less. (e) component below mass %.

In the fungicidal cleaning composition for hard surfaces of the second aspect of the present invention, in order to increase the added value of the product, fragrances, pigments, preservatives, antioxidants, etc. can be arbitrarily formulated (however, the above-mentioned component (a) , (b) component, (c2) component, (Q) component, (d) component, (e) component are excluded).

The fungicidal cleaning composition for hard surfaces of the 2nd aspect of this invention contains water. That is, the remainder other than the above-mentioned (a) component, (b) component, (c2) component, (d) component and optional components is water. The content of the fungicidal cleaning composition for hard surfaces of the second aspect of the present invention is preferably 50% by mass or more, more preferably 60% by mass or more, more preferably 70% by mass or more, and still more preferably 80% by mass More than 99 mass % or less is preferable, and 95 mass % or less of water is more preferable. As water, ion-exchanged water, sterilizing ion-exchanged water, or the like is preferably used.

The fungicidal cleaning composition for hard surfaces of the second aspect of the present invention is a fungicidal cleaning composition for hard surfaces that does not require a strong base or a strong acid. That is, even if the fungicidal composition of the 2nd aspect of this invention is liquid in the vicinity of neutrality, a favorable fungicidal effect can be obtained. From the viewpoint of ease of handling and irritation to the skin on hands, the pH of the fungicidal cleaning composition for hard surfaces of the second aspect of the present invention at 25°C is 5 or more, preferably 5.5 or more , more preferably 6 or more, and 9 or less, preferably 8.5 or less, more preferably 8 or less.

[the third aspect] The 3rd aspect of this invention is the fungicidal cleaning composition for hard surfaces containing 0.1 mass % or more and 5 mass % or less of (a) component, 0.05 mass % or more and 7 mass % or less of (b) component, ( c4) component and water, and the total content of component (a) and component (b) is 1.5 mass % or more and 10 mass % or less, and the total content of surfactant is 10 mass % or less, and the hard surface is fungicidal cleaning agent for The pH of the composition did not reach 12 at 25°C.

<(a) Component> In the third aspect of the present invention, the water-soluble inorganic salt as the component (a) is the same as the component (a) described in the first aspect of the present invention, and its preferred aspects are also the same.

<(b) Component> In the third aspect of the present invention, the nonionic bactericide as the component (b) is the same as the component (b) described in the first aspect of the present invention, and its preferred aspects are also the same.

In the third aspect of the present invention, as the nonionic surfactant to be the component (c4) (however, the component (b) is excluded), polyoxyalkylene having an alkyl group having 8 to 18 carbon atoms is exemplified. Alkyl ethers, polyoxyalkylene alkenyl ethers having alkenyl groups having 8 to 18 carbon atoms, polyoxyalkylene sorbitan fatty acid esters having fatty acid groups having 8 to 18 carbon atoms, and carbon Alkyl glycosides with alkyl groups of 8 or more and 18 or less, alkyl polyglycosides with alkyl groups of 8 to 18 or less carbon atoms, sucrose fatty acid esters with fatty acid groups of 8 to 18 carbon atoms, and 8 or more carbon atoms Alkyl polyglyceryl ethers with an alkyl group of 18 or less, etc., can be used singly or in two or more kinds. Among them, from the viewpoint of cleaning properties, preferred are polyoxyethylene alkyl ethers having an alkyl group having 8 to 18 carbon atoms and an average added molar number of ethylene oxide of 2 to 50.

From the viewpoint of cleaning power, the component (c4) of the present invention is preferably a nonionic surfactant represented by the following general formula (c4). R ^21c -O-[(C ₂ H ₄ O) _s (C ₃ H ₆ O) _t ]-H (c4) [wherein R ^21c has a carbon number of 8 or more, preferably 10 or more, and 18 or less , preferably an alkyl or alkenyl group of 16 or less. s and t are average added moles, and s is 2 or more, preferably 4 or more, more preferably 6 or more, further preferably 10 or more, and 50 or less, preferably 40 or less, more preferably 20 In the following numbers, t is 0 or more, preferably 1 or more, and 5 or less, preferably 3 or less, and t may be 0. (C ₂ H ₄ O) and (C ₃ H ₆ O) can be random polymers or block polymers]

＜Composition, etc.＞ Although the mechanism of action of the fungicidal cleaning composition for hard surfaces of the third aspect of the present invention is unknown, it is considered as follows. It is known that mold has a thicker cell wall outside the cell membrane, and the cell wall of mold includes a polysaccharide layer including glucan-chitin and the like, a melanin layer, a hydrophobin layer, and the like. Due to the existence of the cell wall, the penetration of fungicides into the cell interior of mold is lower than that of general bacteria such as Escherichia coli, and a sufficient fungicidal effect is not obtained in a short period of time, which is considered a problem. It is considered that when an aqueous solution containing the component (a) of the present invention at a specific concentration acts on proteins such as hydrophobin, the structure of the protein is changed. Increased penetration into cells can impart a fungicidal effect. However, when this technique is applied to a cleaning agent, if a surfactant is contained, there arises a problem that the fungicidal effect is impaired. The reason for this is considered to be that the component (b) was absorbed into the surfactant. It is considered that in the fungicidal cleaning composition for hard surfaces of the third aspect of the present invention, the fungicidal properties and the A fungicidal cleaning composition for hard surfaces with excellent sebum cleaning power.

The fungicidal cleaning composition for hard surfaces of the third aspect of the present invention contains 0.1% by mass or more, preferably 0.5% by mass or more, more preferably 1% by mass or more, from the viewpoint of enhancing the fungicidal effect. The (a) component, and from the viewpoint of compounding stability, contains 5 mass % or less, preferably 4 mass % or less, more preferably 3 mass % or less, and further preferably 1.5 mass % or less of (a) )Element.

The fungicidal cleaning composition for hard surfaces of the third aspect of the present invention contains 0.05 mass % or more, preferably 0.1 mass % or more, more preferably 0.5 mass % or more, from the viewpoint of enhancing the fungicidal effect. , and more preferably 1 mass % or more of (b) component, and, from the viewpoint of compounding stability, contains 7 mass % or less, preferably 5 mass % or less, more preferably 4 mass % or less, and more The (b) component of 3 mass % or less is preferable.

In the fungicidal cleaning composition for hard surfaces of the third aspect of the present invention, the total content of the component (a) and the component (b) is 1.5% by mass or more from the viewpoint of enhancing the fungicidal effect, It is preferably 1.8 mass % or more, more preferably 2 mass % or more, and from the viewpoint of compounding stability, 10 mass % or less, preferably 8 mass % or less, and more preferably 7 mass % or less.

The fungicidal cleaning composition for hard surfaces of the third aspect of the present invention contains preferably 0.1 mass % or more, more preferably 0.2 mass % or more, and further preferably 0.5 mass % from the viewpoint of cleaning power % or more (c4) component, and, from the viewpoint of the fungicidal effect, preferably contains 10 mass % or less, more preferably 8 mass % or less, and more preferably 6 mass % or less, and more preferably 3 (c4) component below mass %.

In the fungicidal cleaning composition for hard surfaces of the third aspect of the present invention, the mass ratio (b)/(c4) of the content of component (b) to the content of component (c4) is the difference in the fungicidal effect. From a viewpoint, it is preferably 0.2 or more, more preferably 0.5 or more, still more preferably 1 or more, and from the viewpoint of preparation stability, it is preferably 9 or less, more preferably 7 or less, and still more preferably 5 or less, more preferably 4 or less.

It is preferable that the fungicidal cleaning composition for hard surfaces of the 3rd aspect of this invention contains a solvent (however, (b) component is excluded) as (d) component. The solvent used as the component (d) is the same as the component (d) described in the first aspect of the present invention, and its preferred aspect is also the same.

When the fungicidal cleaning composition for hard surfaces of the third aspect of the present invention contains the component (d), from the viewpoint of the fungicidal effect, the content is preferably 0.1 mass % or more, more preferably 0.5 mass % % or more, more preferably 0.8 mass % or more of the component (d), and from the viewpoint of compounding stability, the content is preferably 12 mass % or less, more preferably 10 mass % or less, and more preferably 8 (d) component below mass %.

The fungicidal cleaning composition for hard surfaces of the 3rd aspect of this invention may contain surfactant other than (c4) component as (R) component. As the (R) component, (c1) one or more surfactants selected from the group consisting of betaine-type surfactants and amine oxide-type surfactants, (c2) cationic surfactants, and (c3) anionic surfactants can be exemplified One or more of the surfactants.

In the third aspect of the present invention, as the component (c1), one or more surfactants selected from the group consisting of betaine-type surfactants and amine oxide-type surfactants are the same as those in the first aspect of the present invention. The components (c1) described above are the same, and their preferred aspects are also the same.

In the third aspect of the present invention, the cationic surfactant as the component (c2) is the same as the component (c2) described in the first aspect of the present invention, and its preferred aspects are also the same.

In the third aspect of the present invention, the anionic surfactant as the component (c3) is the same as the component (c3) described in the first aspect of the present invention, and its preferred aspects are also the same.

The (R) component may be contained in the fungicidal cleaning composition for hard surfaces of the third aspect of the present invention, but from the viewpoint of the fungicidal effect, the amount of the composition in the fungicidal cleaning composition for hard surfaces is limited. The total content of surfactants. In the fungicidal cleaning composition for hard surfaces of the third aspect of the present invention, from the viewpoint of the fungicidal effect, the total content of the surfactant (the total content of the component (c4) and the component (R)) is: 10 mass % or less, preferably 9 mass % or less, more preferably 8 mass % or less, still more preferably 6 mass % or less, still more preferably 4 mass % or less.

From the viewpoint of cleaning power, the fungicidal cleaning composition for hard surfaces of the third aspect of the present invention preferably contains a metal blocking agent as the component (e). In the third aspect of the present invention, the metal blocking agent as the component (e) is the same as the component (e) described in the first aspect of the present invention, and its preferred aspects are also the same.

When the fungicidal cleaning composition for hard surfaces of the third aspect of the present invention contains the component (e), the content is preferably 0.1 mass % or more, more preferably 0.5 mass % from the viewpoint of cleaning power The (e) component is more than, more preferably 1 mass % or more, and from the viewpoint of compounding stability, the content is preferably 10 mass % or less, more preferably 8 mass % or less, and still more preferably 7 mass % % or less of (e) component.

In the fungicidal cleaning composition for hard surfaces of the third aspect of the present invention, in order to increase the added value of the product, fragrances, pigments, preservatives, antioxidants, etc. can be arbitrarily formulated (however, the above-mentioned component (a) , (b) component, (c4) component, (R) component, (d) component, (e) component are excluded).

The fungicidal cleaning composition for hard surfaces of the 3rd aspect of this invention contains water. That is, the remainder other than the said (a) component, (b) component, (c4) component, and an arbitrary component is water. The content of the fungicidal cleaning composition for hard surfaces of the third aspect of the present invention is preferably 50% by mass or more, more preferably 60% by mass or more, more preferably 70% by mass or more, and still more preferably 80% by mass More than 99 mass % or less is preferable, and 95 mass % or less of water is more preferable. As water, ion-exchanged water, sterilizing ion-exchanged water, or the like is preferably used.

The fungicidal cleaning composition for hard surfaces of the third aspect of the present invention is a fungicidal cleaning composition for hard surfaces that does not require strong alkali or strong acid. That is, even if the fungicidal composition of the 3rd aspect of this invention is liquid in the vicinity of neutrality, a favorable fungicidal effect can be obtained. From the viewpoint of ease of handling and irritation to the skin on hands, the pH of the fungicidal cleaning composition for hard surfaces of the third aspect of the present invention at 25°C is preferably 5 or more, more preferably 5.5 or more, more preferably 6 or more, and less than 12, preferably 9 or less, more preferably 8.5 or less, still more preferably 8 or less.

[the fourth aspect] The 4th aspect of this invention is the fungicidal cleaning composition for hard surfaces containing 0.1 mass % or more and 5 mass % or less of (a) component, 0.05 mass % or more and 7 mass % or less of (b) component, 0.01 Component (e), water, and any component (S) in mass % or more and 7 mass % or less, and the content of component (S) is 10 mass % or less. The pH value is 5 or more and 9 or less.

<(a) Component> In the fourth aspect of the present invention, the water-soluble inorganic salt as the component (a) is the same as the component (a) described in the first aspect of the present invention, and its preferred aspects are also the same.

<(b) Component> In the fourth aspect of the present invention, the nonionic bactericide as the component (b) is the same as the component (b) described in the first aspect of the present invention, and its preferred aspect is also the same.

<(e) Component> The component (e) of the present invention is a metal blocking agent. As the metal blocking agent, at least one compound selected from the group consisting of aminocarboxylic acid, hydroxycarboxylic acid, hydroxyphosphonic acid and salts thereof is preferred.

Examples of aminocarboxylic acids and salts thereof include those selected from the group consisting of ethylenediaminetetraacetic acid (EDTA), nitrotriacetic acid (NTA), iminodiacetic acid, diethylenetriaminepentaacetic acid (DPTA), N- 1 of hydroxyethyl-ethylenediaminetriacetic acid (HEDTA), methylglycine diacetic acid (MGDA), aspartic acid diacetic acid (ASDA), glutamic acid diacetic acid (GLDA) and their salts species or two or more. The amino carboxylic acid and its salts are preferably one or two selected from ethylenediaminetetraacetic acid and its salts, methylglycine diacetic acid and its salts, and L-glutamic acid diacetic acid and its salts above.

As a hydroxycarboxylic acid and its salt, the compound chosen from aliphatic hydroxycarboxylic acid and its salt is preferable. As a hydroxycarboxylic acid and its salt, the compound chosen from malic acid, a citric acid, and its salt is mentioned.

Examples of hydroxyphosphonic acid and salts thereof include compounds selected from 1-hydroxyethylidene-1,1-diphosphonic acid (HEDP) and salts thereof.

Examples of the salt of the metal blocking agent include alkali metal salts, ammonium salts, amine salts, and the like. Preferred are alkali metal salts, and more preferred are sodium or potassium salts.

(e) Component is preferably one or more selected from ethylenediaminetetraacetic acid (EDTA), methylglycine diacetic acid (MGDA), malic acid, citric acid and their salts, more preferably selected from One or more of ethylenediaminetetraacetic acid (EDTA), citric acid, and salts thereof, and more preferably ethylenediaminetetraacetic acid, citric acid, and salts thereof.

＜Composition, etc.＞ Although the mechanism of action of the fungicidal cleaning composition for hard surfaces of the fourth aspect of the present invention is unknown, it is considered as follows. It is known that mold has a thicker cell wall outside the cell membrane, and the cell wall of mold includes a polysaccharide layer including glucan-chitin, chitin, etc., a melanin layer, a hydrophobin layer, and the like. Due to the existence of the cell wall, it is considered that mold has a lower penetration of the fungicide into the cell interior than general bacteria such as Escherichia coli, and a sufficient fungicidal effect is not obtained in a short period of time, which is a problem. It is considered that when an aqueous solution containing the component (a) of the present invention at a specific concentration acts on proteins such as hydrophobin, the structure of the protein changes. Increased penetration into cells can impart a fungicidal effect. However, when this technique is applied to a cleaning agent, if a surfactant is contained, there is a problem that the fungicidal effect is impaired. The reason for this is considered to be that the component (b) was absorbed into the surfactant. It is considered that in the fungicidal cleaning composition for hard surfaces of the fourth aspect of the present invention, since the (a) component and the (b) component further contain a specific amount of a metal blocking agent as the (e) component, even if it is not It contains surfactant, or even contains a small amount of surfactant, it can provide the fungicidal cleaning composition for hard surfaces with excellent fungicidal performance and soap scum dirt cleaning power.

The fungicidal cleaning composition for hard surfaces of the fourth aspect of the present invention contains 0.1 mass % or more, preferably 0.3 mass % or more, more preferably 0.5 mass % or more, from the viewpoint of enhancing the fungicidal effect. The (a) component, and from the viewpoint of formulation stability, contains 5 mass % or less, preferably 4 mass % or less, more preferably 3 mass % or less, more preferably 2 mass % or less, and even more Preferably it is 1 mass % or less of (a) component.

The fungicidal cleaning composition for hard surfaces of the fourth aspect of the present invention contains 0.05 mass % or more, preferably 0.1 mass % or more, more preferably 0.5 mass % or more, from the viewpoint of enhancing the fungicidal effect. , and more preferably 1 mass % or more of (b) component, and, from the viewpoint of compounding stability, contains 7 mass % or less, preferably 5 mass % or less, more preferably 4 mass % or less, and more The (b) component of 3 mass % or less is preferable.

The fungicidal cleaning composition for hard surfaces according to the fourth aspect of the present invention contains 0.01 mass % or more, preferably 0.1 mass % or more, more preferably 0.5 mass % or more, from the viewpoint of improving the cleaning power. (e) Component and, from the viewpoint of compounding stability, contain (e) of 7 mass % or less, preferably 6 mass % or less, more preferably 5 mass % or less, and still more preferably 2 mass % or less Element.

The fungicidal cleaning composition for hard surfaces of the 4th aspect of this invention may contain a surfactant as an arbitrary (S) component. As the surfactant of the component (S), (c1) one or more surfactants selected from the group consisting of betaine-type surfactants and amine oxide-type surfactants, (c2) cationic surfactants, (c3) Anionic surfactant and (c4) Nonionic surfactant (however, excluding (b) component) 1 or more surfactants.

In the fourth aspect of the present invention, as the component (c1), one or more surfactants selected from the group consisting of betaine-type surfactants and amine oxide-type surfactants are the same as those in the first aspect of the present invention. The components (c1) described above are the same, and their preferred aspects are also the same.

In the fourth aspect of the present invention, the cationic surfactant as the component (c2) is the same as the component (c2) described in the first aspect of the present invention, and its preferred aspects are also the same.

In the fourth aspect of the present invention, the anionic surfactant as the component (c3) is the same as the component (c3) described in the first aspect of the present invention, and its preferred aspects are also the same.

In the fourth aspect of the present invention, the nonionic surfactant as the component (c4) is the same as the component (c4) described in the first aspect of the present invention, and its preferred aspects are also the same.

The (S) component may be contained in the fungicidal cleaning composition for hard surfaces of the fourth aspect of the present invention, but from the viewpoint of the fungicidal effect, (S) in the fungicidal cleaning composition for hard surfaces. S) The content of ingredients is limited. In the fungicidal cleaning composition for hard surfaces of the fourth aspect of the present invention, from the viewpoint of the fungicidal effect, the content of the component (S) is 10% by mass or less, preferably 7% by mass or less, and more Preferably it is 5 mass % or less, More preferably, it is 4 mass % or less, More preferably, it is 3 mass % or less.

In the fungicidal cleaning composition for hard surfaces of the fourth aspect of the present invention, the mass ratio (S)/(e) of the content of the (e) component to the content of the (S) component is from the viewpoint of cleaning power In terms of, preferably 0 or more, more preferably 0.2 or more, more preferably 0.4 or more, and, from the viewpoint of the fungicidal effect, preferably 10 or less, more preferably 7 or less, and more preferably 5 Below, more preferably, it is 2 or less.

From the viewpoint of the fungicidal effect and cleaning power, the fungicidal cleaning composition for hard surfaces of the fourth aspect of the present invention preferably contains a solvent (except for the component (b)) as the component (d). The solvent used as the component (d) is the same as the component (d) described in the first aspect of the present invention, and its preferred aspect is also the same.

When the fungicidal cleaning composition for hard surfaces of the fourth aspect of the present invention contains the component (d), from the viewpoint of improving the fungicidal effect and improving the cleaning power, the content is preferably 0.1% by mass or more, 0.5 mass % or more is more preferable, More preferably, it is 1 mass % or more of (d) component, and from the viewpoint of compounding stability, it is preferable to contain 10 mass % or less, more preferably 9 mass % or less, More preferably, it is 8 mass % or less of (d)component.

In the fungicidal cleaning composition for hard surfaces of the fourth aspect of the present invention, in order to increase the added value of the product, fragrances, pigments, preservatives, antioxidants, etc. can be arbitrarily formulated (however, the above-mentioned component (a) , (b) component, (e) component, (S) component, (d) component are excluded).

The fungicidal cleaning composition for hard surfaces of the 4th aspect of this invention contains water. That is, the remainder other than the said (a) component, (b) component, (e) component, and arbitrary components is water. The content of the fungicidal cleaning composition for hard surfaces of the fourth aspect of the present invention is preferably 50% by mass or more, more preferably 60% by mass or more, more preferably 70% by mass or more, and still more preferably 80% by mass More than 99 mass % or less is preferable, and 95 mass % or less of water is more preferable. As water, ion-exchanged water, sterilizing ion-exchanged water, or the like is preferably used.

The fungicidal cleaning composition for hard surfaces of the fourth aspect of the present invention is a fungicidal cleaning composition for hard surfaces that does not require strong alkali or strong acid. That is, even if the fungicidal composition of the 4th aspect of this invention is liquid in the vicinity of neutrality, a favorable fungicidal effect can be obtained. From the viewpoint of ease of handling and irritation to the skin on hands, the pH of the fungicidal cleaning composition for hard surfaces of the fourth aspect of the present invention at 25°C is 5 or more, preferably 5.5 or more , more preferably 6 or more, and 9 or less, preferably 8.5 or less, more preferably 8 or less.

Hereinafter, it describes in common with the 1st, 2nd, 3rd, and 4th aspects of this invention.

The fungicidal cleaning composition for hard surfaces of the present invention is preferably used for hard surfaces in bathrooms, bathtubs, washbasins, ceramic tiles, powder rooms, washbasins, mirrors, sinks around kitchens, countertops, around water pipes, etc. Clean, especially for bathroom use. Here, the bathroom uses not only the bathroom, but also other objects with a hard surface that exist in the bathroom, such as a bathtub and a washbasin.

The fungicidal cleaning composition for hard surfaces of the present invention has an excellent fungicidal effect on molds. For example, for Cladosporium, Aspergillus, Candida, Penicillium, Alternaria, Phoma, Molds represented by fungi of the genus Aureobasidium exhibit high fungicidal effects. Also, for Pseudomonas such as Saccharomyces, Rhodotorula, Pichia fungi, Pseudomonas aeruginosa, Pseudomonas putida, etc. (Pseudomonas) bacteria, Escherichia coli, Alcaligenes faecalis, Klebsiellapneumoniae, Proteus vulgaris, Serratia marcescense, Methyl Gram-negative bacteria such as Methylobacterium; Gram-positive bacteria represented by Staphylococcusaureus also showed higher bactericidal effect.

[Hard surface treatment method] The method for treating a hard surface of the present invention is a method for treating a hard surface in which the fungicidal cleaning agent composition for a hard surface of the present invention is brought into contact with a hard surface where mildew exists, and simultaneously, the fungicidal and cleaning are performed. In the present invention, after the fungicidal cleaning composition for a hard surface of the present invention is brought into contact with a hard surface, the surface can be cleaned. Moreover, in this invention, the hard surface can be cleaned by the cleaning article which carried the fungicide composition for hard surfaces of this invention on a base|substrate. As the hard surface, hard surfaces such as bathrooms, bathtubs, washbasins, tiles, powder rooms, washbasins, mirrors, sinks around kitchens, counter tops, and around water pipes are preferred.

Specifically, the hard surface treatment method of the present invention can preferably be exemplified by the following hard surface treatment methods: the fungicidal cleaning composition for hard surfaces of the present invention is brought into contact with the hard surface in the form of a stock solution, or the above-mentioned hard surface is treated with The fungicide composition comes into contact with the hard surface in the form of a stock solution without being diluted, that is, it comes into contact with the hard surface without diluting the above-mentioned fungicide composition for hard surfaces. Furthermore, without diluting the said fungicidal cleaning composition for hard surfaces, the hard surface treatment method of contacting the hard surface to which mold is attached can be mentioned. Furthermore, as a method of contacting with a hard surface, the method of coating on a hard surface is preferable. Contact with a hard surface without diluting the above-mentioned fungicidal cleaning composition for hard surfaces is to contact with a hard surface after diluting the fungicidal cleaning composition for hard surfaces with water or the like intentionally. For example, it can be understood that after the above-mentioned fungicidal cleaning composition for hard surfaces is brought into contact with a hard surface to which water droplets and the like are attached, or after the above-mentioned fungicidal cleaning composition for hard surfaces is brought into contact with a hard surface, water droplets adhere to the surface of the hard surface. In this case, the above-mentioned fungicidal cleaning composition for hard surfaces is not diluted and brought into contact with the hard surface.

The hard surface treatment method of the present invention can be directly applied or sprayed from a bottle in order to make the above-mentioned fungicidal cleaning agent composition for hard surface contact with the hard surface in the form of a stock solution. Examples of the bottle include: squeeze bottle, spray bottle Wait. Moreover, when using the article for cleaning impregnated with the fungicidal detergent composition for hard surfaces of the present invention, the fungicidal detergent composition for hard surfaces of the present invention may be sprayed on the object to be cleaned or the above-mentioned cleaning agent on the other hand. Items are used on one side. By using this method, a wider area can be cleaned.

In addition, a concentrated composition containing the essential components and optional components of the present invention may be prepared, and the thick composition may be diluted with water to prepare the fungicidal cleaning composition for hard surfaces of the present invention, and contacted with the hard surface. That is, it can also be the following hard surface treatment method: by diluting the concentrated composition containing the essential components and optional components of the present invention with water to prepare the fungicidal cleaning composition for hard surfaces of the present invention, without diluting the hard surface The fungicidal cleaning composition comes into contact with hard surfaces.

From the viewpoint of the fungicidal effect, the time for contacting the mildewcide cleaning composition for hard surfaces of the present invention after contacting the hard surface with mildew is preferably more than 30 seconds, preferably more than 1 minute, More preferably 2 minutes or more, more preferably 3 minutes or more, still more preferably 4 minutes or more, still more preferably 5 minutes or more, and from the viewpoint of efficient cleaning, preferably 30 minutes or less, More preferably, it is 20 minutes or less, and still more preferably 10 minutes or less. After standing, it is usually washed with water. During cleaning, mechanical force (physical force) may be applied by hand or the like, or cleaning may be performed only by water flow. In addition, the temperature at the time of leaving may be room temperature, for example, 10°C or more and 30°C or less.

Regarding the above-mentioned embodiment, the present invention further discloses the following fungicidal cleaning composition for hard surfaces and a method for treating hard surfaces.

<1A> A fungicidal cleaning composition for hard surfaces, which contains 0.1% by mass to 5% by mass (a) water-soluble inorganic salt [hereinafter referred to as (a) component], 0.05% by mass to 7% by mass ( b) Nonionic bactericide [hereinafter, referred to as (b) component], 0.1 mass % or more and 5 mass % or less of (c1) at least one selected from betaine-type surfactants and amine oxide-type surfactants Surfactant [hereinafter referred to as (c1) component], any surfactant other than (P) (c1) component [hereinafter referred to as (P) component] and water, and the content of (c1) component is the same as The mass ratio (c1)/[(c1)+(P)] of the total content of the component (c1) and the component (P) is 0.30 or more and 1.0 or less, and the pH of the fungicidal cleaning composition for hard surfaces at 25°C The value is 5 or more and 9 or less.

<2A> The fungicidal cleaning composition for hard surfaces as described in the above <1A>, wherein the component (a) is selected from the group consisting of alkali metal sulfates, alkaline earth metal sulfates, ammonium sulfates, alkali metal sulfites, and alkaline earth metal sulfites , alkali metal halides, alkaline earth metal halides, alkali metal nitrates, alkaline earth metal nitrates, alkali metal carbonates, alkaline earth metal carbonates, alkali metal phosphates, alkaline earth metal phosphates, alkali metal thiocyanates and alkaline earth metals One or more water-soluble inorganic salts in thiocyanate, preferably one or more water-soluble inorganic salts selected from alkali metal sulfates, alkaline earth metal sulfates, alkali metal halides and alkaline earth metal halides, More preferably one or more water-soluble inorganic salts selected from alkali metal sulfates, alkaline earth metal sulfates, alkali metal chlorides and alkaline earth metal chlorides, and more preferably selected from alkali metal sulfates and alkali metal chlorides One or more of the water-soluble inorganic salts are more preferably alkali metal sulfates.

<3A> The fungicidal cleaning composition for hard surfaces as described in the above <1A> or <2A>, wherein the component (a) is selected from the group consisting of sodium sulfate, lithium sulfate, potassium sulfate, cesium sulfate, ammonium sulfate, sodium sulfite, sodium chloride, One or more of potassium chloride, sodium nitrate, sodium carbonate, disodium hydrogen phosphate and sodium thiocyanate, preferably one selected from sodium sulfate, potassium sulfate, sodium nitrate, sodium chloride and potassium chloride Above, more preferably one or more selected from the group consisting of sodium sulfate, potassium sulfate and potassium chloride, and more preferably sodium sulfate.

<4A> The fungicidal cleaning composition for hard surfaces according to any one of the above <1A> to <3A>, wherein the component (b) has an aromatic group and a hydroxyl group which may have a substituent and has a molecular weight of 106 or more and 300 or less. Non-ionic fungicide.

<5A> The fungicidal cleaning composition for hard surfaces according to any one of the above <1A> to <4A>, wherein the component (b) is a compound represented by the following general formula (b1). R ^1b O-(R ^2b O) _l -H (b1) (wherein R ^1b is a hydrocarbon group having an aromatic group and a total carbon number of 6 or more and 11 or less, l is an integer of 0 or 1, and R ^2b is a carbon number 2 or more and 4 or less alkylene groups. Wherein, the molecular weight of the compound is 106 or more and 300 or less)

<6A> The fungicidal cleaning composition for hard surfaces according to any one of the above <1A> to <5A>, wherein the component (b) is selected from the group consisting of benzyl alcohol, phenoxyethanol, 2-phenylethanol, 3-benzene Ethyl-1-propanol, Cinnamyl Alcohol, Ethylene Glycol Benzyl Ether, Diethylene Glycol Phenyl Ether, Diethylene Glycol Benzyl Ether, 4-Phenyl-1-Butanol, Triclosan, Diclosan and Isopropyl One or more kinds of methylmethylphenols, preferably one or more kinds selected from benzyl alcohol, phenoxyethanol, diethylene glycol phenyl ether, triclosan, diclosan and isopropylmethylphenol, More preferably, it is at least one selected from the group consisting of benzyl alcohol and phenoxyethanol.

<7A> The fungicidal cleaning composition for hard surfaces according to any one of the above <1A> to <6A>, wherein the component (c1) is at least one selected from the group consisting of sulfobetaine, carbonyl betaine and amine oxide The surfactant is preferably one or more surfactants selected from carbonyl betaine and amine oxide.

<8A> The fungicidal cleaning composition for hard surfaces as described in the above <7A>, wherein the sulfobetaine is N selected from the alkyl group with a carbon number of preferably 10 or more, preferably 18 or less, more preferably 14 or less -Alkyl-N,N-dimethyl-N-sulfopropylammonium sulfobetaine; the carbon number of the alkyl group is preferably 10 or more, and preferably 18 or less, more preferably 14 or less N-alkane base-N,N-dimethyl-N-(2-hydroxysulfopropyl)ammonium sulfobetaine; the carbon number of the alkanoyl group is preferably 10 or more, more preferably 18 or less, more preferably 14 or less N-Alkylaminopropyl-N,N-dimethyl-N-sulfopropylammonium sulfobetaine; and the carbon number of the alkanoyl group is preferably 10 or more, and preferably 18 or less, More preferably, it is one or more of 14 or less N-alkylaminopropyl-N,N-dimethyl-N-(2-hydroxysulfopropyl)ammonium sulfobetaines.

<9A> The fungicidal cleaning composition for hard surfaces as described in the above <7A>, wherein the carbonyl betaine is selected from N- with an alkyl group having a carbon number of preferably 10 or more, preferably 18 or less, more preferably 14 or less. Alkyl-N,N-dimethyl-N-carboxymethylammonium betaine and at least one compound represented by the following general formula (c11), preferably the following general formula (c11) the compound.

[hua 4]

[In the formula, R ^1c represents an alkyl group or an alkenyl group having 7 to 21 carbon atoms, R ^2c represents a propylidene group, and R ^3c and R ^4c each independently represent an alkyl group having 1 to 3 carbon atoms.]

<10A> The fungicidal cleaning composition for hard surfaces as described in the above <7A>, wherein the amine oxide is a compound of the following general formula (c12).

[hua 5]

[In the formula, R ^5c represents a hydrocarbon group with 7 to 22 carbon atoms, preferably an alkyl group or an alkenyl group, more preferably an alkyl group, and R ^6c and R ^7c are the same or different, and represent an alkyl group with 1 to 3 carbon atoms or less . D represents a -NHC(=O)- group or a -C(=O)NH- group, and E represents an alkylene group having 1 to 5 carbon atoms. m and p denote m=0 and p=0 or m=1 and p=1]

<11A> The fungicidal cleaning composition for hard surfaces according to any one of the above <1A> to <10A>, wherein the component (P) is selected from the group consisting of (c2) cationic surfactants, (c3) anionic surfactants and ( c4) Surfactant of one or more kinds of nonionic surfactants (except for component (b)).

<12A> The fungicidal cleaning composition for hard surfaces according to any one of the above <1A> to <10A>, wherein the component (P) comprises a compound selected from the group consisting of (c2) cationic surfactants and (c3) anionic surfactants 1 or more.

<13A> The fungicidal cleaning composition for hard surfaces according to any one of the above <1A> to <12A>, which contains preferably 0.5% by mass or more, more preferably 1% by mass or more, and more preferably 4% by mass Below, it is more preferable that it is 3 mass % or less of (a) component.

<14A> The fungicidal cleaning composition for hard surfaces according to any one of the above <1A> to <13A>, which contains preferably 0.1 mass % or more, more preferably 0.5 mass % or more, and still more preferably 1 mass % It is more than 5 mass % or less, More preferably, it is 4 mass % or less, More preferably, it is 3 mass % or less of (b) component.

<15A> The fungicidal cleaning composition for hard surfaces according to any one of the above <1A> to <14A>, containing preferably 0.5% by mass or more, more preferably 1% by mass or more, and more preferably 4% by mass Below, more preferably, it is 3 mass % or less of (c1) component.

<16A> The fungicidal cleaning composition for hard surfaces according to any one of the above <1A> to <15A>, wherein the mass ratio (c1) of the content of the component (c1) to the total content of the component (c1) and (P) )/[(c1)+(P)] is preferably 0.40 or more, more preferably 0.50 or more, and more preferably 0.90 or less, more preferably 0.80 or less.

<17A> The fungicidal cleaning composition for hard surfaces as described in any one of said <1A> to <16A>, which further contains a solvent (however, (b) component is excluded) as (d) component.

<18A> The fungicidal cleaning composition for hard surfaces as described in the above <17A>, wherein the component (d) is one or more solvents selected from the following compounds (d1) to (d3). (d1): aliphatic alcohol with a molecular weight of 60 or more and 500 or less (d2): Aliphatic glycol ether with molecular weight of 60 or more and 500 or less (d3): Aliphatic diol with molecular weight of 60 or more and 500 or less

<19A> The fungicidal cleaning composition for hard surfaces as described in the above-mentioned <18A>, wherein (d2) is a compound represented by the following general formula (d2). R ^1d O-(R ^2d O) _n -H (d2) (wherein R ^1d is an aliphatic hydrocarbon group with 1 to 8 carbon atoms, R ^2d is an alkylene group with 2 or 3 carbon atoms, and n is 1 or more an integer below 4)

<20A> The fungicidal cleaning composition for hard surfaces as described in the above <18A>, wherein (d3) is a compound represented by the following general formula (d3) (except (d2). R ^3d -CH(OH) )-(CH ₂ ) _q -CH ₂ OH (d3) (wherein R ^3d is a hydrogen atom, an aliphatic hydrocarbon group with 1 to 8 carbon atoms or R ^4d O, and R ^4d is a hydrocarbon group with 1 to 8 carbon atoms or less , q is 0 or an integer of 1 or more and 6 or less. Wherein, the total carbon number in the compound is 4 or more and 10 or less)

<21A> The fungicidal cleaning composition for hard surfaces according to any one of the above <17A> to <20A>, which contains preferably 0.1 mass % or more, more preferably 0.5 mass % or more, and further preferably 0.8 mass % It is more than 12 mass % or less, More preferably, it is 10 mass % or less, More preferably, it is 8 mass % or less of (d) component.

<22A> The fungicidal cleaning composition for hard surfaces as described in any one of said <1A> to <21A>, which further contains a metal blocking agent as (e) component.

<23A> The fungicidal cleaning composition for hard surfaces as described in the above <22A>, wherein the component (e) is at least one selected from the group consisting of aminocarboxylic acids, hydroxycarboxylic acids, hydroxyphosphonic acids and salts thereof, preferably It is one or more selected from ethylenediaminetetraacetic acid (EDTA), methylglycine diacetic acid (MGDA), citric acid, malic acid and their salts, more preferably selected from ethylenediaminetetraacetic acid ( EDTA), citric acid, and one or more of these salts, and more preferably one or more selected from ethylenediaminetetraacetic acid and its salts.

<24A> The fungicidal cleaning composition for hard surfaces as described in the above <22A> or <23A>, which contains preferably 0.1% by mass or more, more preferably 0.5% by mass or more, still more preferably 1% by mass or more, and It is preferably 10 mass % or less, more preferably 8 mass % or less, and still more preferably 7 mass % or less of the (e) component.

<25A> The fungicidal cleaning composition for hard surfaces according to any one of the above <1A> to <24A>, the pH at 25°C is preferably 5.5 or more, more preferably 6 or more, and more preferably 8.5 or less, more preferably 8 or less.

<26A> A method for treating a hard surface, wherein the fungicidal cleaning composition for a hard surface as described in any one of the above <1A> to <25A> is brought into contact with a hard surface in which mold is present, and the fungicidal and cleaning are performed simultaneously.

<27A> The method for treating hard surfaces as described in the above <26A>, wherein the fungicidal cleaning composition for hard surfaces described in any one of the above <1A> to <25A> is brought into contact with a hard surface in the form of a stock solution, or The above-mentioned fungicidal composition for hard surfaces is brought into contact with the hard surfaces in the form of a stock solution without being diluted.

<28A> A use of the fungicidal cleaning composition for hard surfaces according to any one of the above <1A> to <25A>, which is used as a fungicidal cleaning agent for hard surfaces.

<1B> A fungicidal cleaning composition for hard surfaces, which contains 0.1% by mass to 5% by mass (a) water-soluble inorganic salt [hereinafter referred to as (a) component], 0.05% by mass to 7% by mass ( b) Nonionic bactericide [hereinafter referred to as (b) component], 0.1 mass % or more and 5 mass % or less (c2) cationic surfactant, (d) solvent (except (b) component), and water , and the pH value at 25°C is above 5 and below 9.

<2B> The fungicidal cleaning composition for hard surfaces as described in the above <1B>, wherein the component (a) is selected from the group consisting of alkali metal sulfates, alkaline earth metal sulfates, ammonium sulfates, alkali metal sulfites, and alkaline earth metal sulfites , alkali metal halides, alkaline earth metal halides, alkali metal nitrates, alkaline earth metal nitrates, alkali metal carbonates, alkaline earth metal carbonates, alkali metal phosphates, alkaline earth metal phosphates, alkali metal thiocyanates and alkaline earth metals One or more water-soluble inorganic salts in thiocyanate, preferably one or more water-soluble inorganic salts selected from alkali metal sulfates, alkaline earth metal sulfates, alkali metal halides and alkaline earth metal halides, More preferably one or more water-soluble inorganic salts selected from alkali metal sulfates, alkaline earth metal sulfates, alkali metal chlorides and alkaline earth metal chlorides, and more preferably selected from alkali metal sulfates and alkali metal chlorides One or more of the water-soluble inorganic salts are more preferably alkali metal sulfates.

<3B> The fungicidal cleaning composition for hard surfaces as described in the above <1B> or <2B>, wherein the component (a) is selected from the group consisting of sodium sulfate, lithium sulfate, potassium sulfate, cesium sulfate, ammonium sulfate, sodium sulfite, sodium chloride, One or more of potassium chloride, sodium nitrate, sodium carbonate, disodium hydrogen phosphate and sodium thiocyanate, preferably one selected from sodium sulfate, potassium sulfate, sodium nitrate, sodium chloride and potassium chloride Above, more preferably one or more selected from the group consisting of sodium sulfate, potassium sulfate and potassium chloride, and more preferably sodium sulfate.

<4B> The fungicidal cleaning composition for hard surfaces according to any one of the above <1B> to <3B>, wherein the component (b) has an optionally substituted aromatic group and a hydroxyl group, and has a molecular weight of 106 or more and 300 or less. Non-ionic fungicide.

<5B> The fungicidal cleaning composition for hard surfaces according to any one of the above <1B> to <4B>, wherein the component (b) is a compound represented by the following general formula (b1). R ^1b O-(R ^2b O) _l -H (b1) (wherein R ^1b is a hydrocarbon group having an aromatic group and a total carbon number of 6 or more and 11 or less, l is an integer of 0 or 1, and R ^2b is a carbon number 2 or more and 4 or less alkylene groups. Wherein, the molecular weight of the compound is 106 or more and 300 or less)

<6B> The fungicidal cleaning composition for hard surfaces according to any one of the above <1B> to <5B>, wherein the component (b) is selected from the group consisting of benzyl alcohol, phenoxyethanol, 2-phenylethanol, 3-benzene Ethyl-1-propanol, Cinnamyl Alcohol, Ethylene Glycol Benzyl Ether, Diethylene Glycol Phenyl Ether, Diethylene Glycol Benzyl Ether, 4-Phenyl-1-Butanol, Triclosan, Diclosan and Isopropyl One or more kinds of methylmethylphenols, preferably one or more kinds selected from benzyl alcohol, phenoxyethanol, diethylene glycol phenyl ether, triclosan, diclosan and isopropylmethylphenol, More preferably, it is at least one selected from the group consisting of benzyl alcohol and phenoxyethanol.

<7B> The fungicidal cleaning composition for hard surfaces according to any one of the above <1B> to <6B>, wherein the component (c2) is a quaternary ammonium salt type cationic surfactant, preferably a quaternary having a benzyl group Ammonium salt type cationic surfactant.

<8B> The fungicidal cleaning composition for hard surfaces as described in the above <7B>, wherein the component (c2) is a quaternary ammonium salt type cationic surfactant represented by the following general formula (c2).

[hua 6]

[In the formula, R ^11c represents a hydrocarbon group having 6 to 18 carbon atoms. R ^12c and R ^13c each independently represent an alkyl group having 1 or more carbon atoms and 3 or less carbon atoms. R ^14c represents an alkylene group having 1 or more carbons and 3 or less. Z ^- represents an anionic group]

<9B> The fungicidal cleaning composition for hard surfaces according to any one of the above <1B> to <8B>, wherein the component (d) is one or more selected from the following compounds (d1) to (d3). solvent. (d1): aliphatic alcohol with a molecular weight of 60 or more and 500 or less (d2): Aliphatic glycol ether with molecular weight of 60 or more and 500 or less (d3): Aliphatic diol with molecular weight of 60 or more and 500 or less

<10B> The fungicidal cleaning composition for hard surfaces as described in the above-mentioned <9B>, wherein (d2) is a compound represented by the following general formula (d2). R ^1d O-(R ^2d O) _n -H (d2) (wherein R ^1d is an aliphatic hydrocarbon group with 1 to 8 carbon atoms, R ^2d is an alkylene group with 2 or 3 carbon atoms, and n is 1 or more an integer below 4)

<11B> The fungicidal cleaning composition for hard surfaces as described in the above <9B>, wherein (d3) is a compound represented by the following general formula (d3) (except (d2). R ^3d -CH(OH) )-(CH ₂ ) _q -CH ₂ OH (d3) (wherein R ^3d is a hydrogen atom, an aliphatic hydrocarbon group with 1 to 8 carbon atoms or R ^4d O, and R ^4d is a hydrocarbon group with 1 to 8 carbon atoms or less , q is 0 or an integer of 1 or more and 6 or less. Wherein, the total carbon number in the compound is 4 or more and 10 or less)

<12B> The fungicidal cleaning composition for hard surfaces according to any one of the above <1B> to <11B>, which contains preferably 0.5% by mass or more, more preferably 1.0% by mass or more, and more preferably 4% by mass Below, it is more preferable that it is 3 mass % or less of (a) component.

<13B> The fungicidal cleaning composition for hard surfaces according to any one of the above <1B> to <12B>, which contains preferably 0.1 mass % or more, more preferably 0.5 mass % or more, and still more preferably 1.0 mass % It is more than 5 mass % or less, More preferably, it is 4 mass % or less, More preferably, it is 3 mass % or less of (b) component.

<14B> The fungicidal cleaning composition for hard surfaces according to any one of the above <1B> to <13B>, which contains preferably 0.3 mass % or more, more preferably 0.5 mass % or more, and further preferably 0.75 mass % More than 4 mass % or less is preferable, and (c2) component of 3 mass % or less is more preferable.

<15B> The fungicidal cleaning composition for hard surfaces according to any one of the above <1B> to <14B>, containing preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and still more preferably 1% by mass It is more than 10 mass % or less, More preferably, it is 8 mass % or less, More preferably, it is 7 mass % or less of (d) component.

<16B> The total content of the fungicidal cleaning composition for hard surfaces according to any one of the above <1B> to <15B> is preferably 0.2 mass % or more, more preferably 0.5 mass % or more, and still more preferably 1.5 mass % % or more, and preferably 12 mass % or less, more preferably 10 mass % or less, and still more preferably 8 mass % or less of (c2) component and (d) component.

<17B> The fungicidal cleaning composition for hard surfaces as described in any one of said <1B> to <16B> containing surfactant other than (c2) component as arbitrary (Q) component.

<18B> The fungicidal cleaning composition for hard surfaces as described in the above <17B>, wherein the component (Q) is an interface selected from (c1) at least one selected from the group consisting of betaine-type surfactants and amine oxide-type surfactants Surfactant of one or more of active agent, (c3) anionic surfactant, and (c4) nonionic surfactant.

<19B> The fungicidal cleaning composition for hard surfaces as described in the above <17B> or <18B>, wherein the mass ratio of the total content of the component (c2) and the component (Q) is (c2)/[(c2)+(Q)] Preferably it is 0.1 or more, more preferably 0.2 or more, still more preferably 0.3 or more, still more preferably 0.4 or more, and more preferably 1 or less, more preferably 0.9 or less, still more preferably 0.8 or less.

<20B> The fungicidal cleaning composition for hard surfaces according to any one of the above <1B> to <19B>, the pH at 25°C is preferably 5.5 or more, more preferably 6 or more, and more preferably 8.5 or less, more preferably 8 or less.

<21B> A method for treating a hard surface, wherein the fungicidal cleaning composition for a hard surface as described in any one of the above <1B> to <20B> is brought into contact with a hard surface in which mold is present, and the fungicidal and cleaning are performed simultaneously.

<22B> The method for treating hard surfaces as described in the above <21B>, wherein the fungicidal cleaning composition for hard surfaces described in any one of the above <1B> to <20B> is brought into contact with a hard surface in the form of a stock solution, or The above-mentioned fungicidal composition for hard surfaces is brought into contact with the hard surfaces in the form of a stock solution without being diluted.

<23B> A use of the fungicidal cleaning composition for hard surfaces according to any one of the above <1B> to <20B>, which is used as a fungicidal cleaning agent for hard surfaces.

<1C> A fungicidal cleaning composition for hard surfaces, which contains 0.1% by mass to 5% by mass (a) water-soluble inorganic salt [hereinafter referred to as (a) component], 0.05% by mass to 7% by mass ( b) nonionic bactericide [hereinafter referred to as (b) component], (c4) nonionic surfactant [except for (b) component, hereinafter referred to as (c4) component] and water, and (a) The total content of component ) and component (b) is 1.5 mass % or more and 10 mass % or less, and the total content of surfactant is 10 mass % or less, and the pH value of the fungicidal cleaning composition for hard surfaces at 25°C under 12.

<2C> The fungicidal cleaning composition for hard surfaces as described in the above <1C>, wherein the component (a) is selected from the group consisting of alkali metal sulfates, alkaline earth metal sulfates, ammonium sulfates, alkali metal sulfites, and alkaline earth metal sulfites , alkali metal halides, alkaline earth metal halides, alkali metal nitrates, alkaline earth metal nitrates, alkali metal carbonates, alkaline earth metal carbonates, alkali metal phosphates, alkaline earth metal phosphates, alkali metal thiocyanates and alkaline earth metals One or more water-soluble inorganic salts in thiocyanate, preferably one or more water-soluble inorganic salts selected from alkali metal sulfates, alkaline earth metal sulfates, alkali metal halides and alkaline earth metal halides, More preferably one or more water-soluble inorganic salts selected from alkali metal sulfates, alkaline earth metal sulfates, alkali metal chlorides and alkaline earth metal chlorides, and more preferably selected from alkali metal sulfates and alkali metal chlorides One or more of the water-soluble inorganic salts are more preferably alkali metal sulfates.

<3C> The fungicidal cleaning composition for hard surfaces as described in the above <1C> or <2C>, wherein the component (a) is selected from the group consisting of sodium sulfate, lithium sulfate, potassium sulfate, cesium sulfate, ammonium sulfate, sodium sulfite, sodium chloride, One or more of potassium chloride, sodium nitrate, sodium carbonate, disodium hydrogen phosphate and sodium thiocyanate, preferably one selected from sodium sulfate, potassium sulfate, sodium nitrate, sodium chloride and potassium chloride Above, more preferably one or more selected from the group consisting of sodium sulfate, potassium sulfate and potassium chloride, and more preferably sodium sulfate.

<4C> The fungicidal cleaning composition for hard surfaces according to any one of the above <1C> to <3C>, wherein the component (b) has an optionally substituted aromatic group and a hydroxyl group and has a molecular weight of 106 or more and 300 or less Non-ionic fungicide.

<5C> The fungicidal cleaning composition for hard surfaces according to any one of the above <1C> to <4C>, wherein the component (b) is a compound represented by the following general formula (b1). R ^1b O-(R ^2b O) _l -H (b1) (wherein R ^1b is a hydrocarbon group having an aromatic group and a total carbon number of 6 or more and 11 or less, l is an integer of 0 or 1, and R ^2b is a carbon number 2 or more and 4 or less alkylene groups. Wherein, the molecular weight of the compound is 106 or more and 300 or less)

<6C> The fungicidal cleaning composition for hard surfaces according to any one of the above <1C> to <5C>, wherein the component (b) is selected from benzyl alcohol, phenoxyethanol, 2-phenylethanol, 3-benzene Ethyl-1-propanol, Cinnamyl Alcohol, Ethylene Glycol Benzyl Ether, Diethylene Glycol Phenyl Ether, Diethylene Glycol Benzyl Ether, 4-Phenyl-1-Butanol, Triclosan, Diclosan and Isopropyl One or more kinds of methylmethylphenols, preferably one or more kinds selected from benzyl alcohol, phenoxyethanol, diethylene glycol phenyl ether, triclosan, diclosan and isopropylmethylphenol, More preferably, it is at least one selected from the group consisting of benzyl alcohol and phenoxyethanol.

<7C> The fungicidal cleaning composition for hard surfaces according to any one of the above <1C> to <6C>, wherein the component (c4) is selected from polyoxyalkylene having an alkyl group having 8 to 18 carbon atoms Alkyl ethers, polyoxyalkylene alkenyl ethers having alkenyl groups having 8 to 18 carbon atoms, polyoxyalkylene sorbitan fatty acid esters having fatty acid groups having 8 to 18 carbon atoms, and 8 carbon atoms Alkyl glycosides with an alkyl group of 18 or more or less, alkyl polyglycosides with an alkyl group of 8 to 18 carbon atoms, sucrose fatty acid esters with a fatty acid group of 8 to 18 carbon atoms, and 8 to 18 carbon atoms One or more of the alkyl polyglyceryl ethers of the following alkyl groups, preferably polyoxyethylene having an alkyl group with a carbon number of 8 to 18 and an average added molar number of ethylene oxide of 2 to 50 Alkyl ethers.

<8C> The fungicidal cleaning composition for hard surfaces according to any one of the above <1C> to <6C>, wherein the component (c4) is a nonionic surfactant represented by the following general formula (c4). R ^21c -O-[(C ₂ H ₄ O) _s (C ₃ H ₆ O) _t ]-H (c4) [wherein R ^21c has a carbon number of 8 or more, preferably 10 or more, and 18 or less , preferably an alkyl or alkenyl group of 16 or less. s and t are average added moles, and s is 2 or more, preferably 4 or more, more preferably 6 or more, further preferably 10 or more, and 50 or less, preferably 40 or less, more preferably 20 In the following numbers, t is 0 or more, preferably 1 or more, and 5 or less, preferably 3 or less, and t may be 0. (C ₂ H ₄ O) and (C ₃ H ₆ O) can be random polymers or block polymers]

<9C> The fungicidal cleaning composition for hard surfaces according to any one of the above <1C> to <8C>, containing preferably 0.5% by mass or more, more preferably 1% by mass or more, and more preferably 4% by mass Below, it is more preferable that it is 3 mass % or less, More preferably, it is 1.5 mass % or less of (a) component.

<10C> The fungicidal cleaning composition for hard surfaces according to any one of the above <1C> to <9C>, containing preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and still more preferably 1% by mass It is more than 5 mass % or less, More preferably, it is 4 mass % or less, More preferably, it is 3 mass % or less of (b) component.

<11C> The fungicidal cleaning composition for hard surfaces according to any one of the above <1C> to <10C>, wherein the total content of the component (a) and the component (b) is preferable from the viewpoint of enhancing the fungicidal effect. It is 1.8 mass % or more, more preferably 2 mass % or more, and more preferably 8 mass % or less, more preferably 7 mass % or less.

<12C> The fungicidal cleaning composition for hard surfaces according to any one of the above <1C> to <11C>, which contains preferably 0.1 mass % or more, more preferably 0.2 mass % or more, and further preferably 0.5 mass % It is more than 10 mass % or less, More preferably, it is 8 mass % or less, More preferably, it is 6 mass % or less, More preferably, it is 3 mass % or less of (c4).

<13C> The fungicidal cleaning composition for hard surfaces according to any one of the above <1C> to <12C>, wherein the mass ratio (b)/(c4) of the content of the component (b) to the content of the component (c4) is compared with that of (b)/(c4). It is preferably 0.2 or more, more preferably 0.5 or more, still more preferably 1 or more, and more preferably 9 or less, more preferably 7 or less, still more preferably 5 or less, still more preferably 4 or less.

<14C> The fungicidal cleaning composition for hard surfaces as described in any one of said <1C> to <13C> which further contains a solvent (however, (b) component is excluded) as (d) component.

<15C> The fungicidal cleaning composition for hard surfaces as described in the above <14C>, wherein the component (d) is one or more solvents selected from the following compounds (d1) to (d3). (d1): aliphatic alcohol with a molecular weight of 60 or more and 500 or less (d2): Aliphatic glycol ether with molecular weight of 60 or more and 500 or less (d3): Aliphatic diol with molecular weight of 60 or more and 500 or less

<16C> The fungicidal cleaning composition for hard surfaces as described in the above-mentioned <15C>, wherein (d2) is a compound represented by the following general formula (d2). R ^1d O-(R ^2d O) _n -H (d2) (wherein R ^1d is an aliphatic hydrocarbon group with 1 to 8 carbon atoms, R ^2d is an alkylene group with 2 or 3 carbon atoms, and n is 1 or more an integer below 4)

<17C> The fungicidal cleaning composition for hard surfaces as described in the above <15C>, wherein (d3) is a compound represented by the following general formula (d3) (except (d2). R ^3d -CH(OH) )-(CH ₂ ) _q -CH ₂ OH (d3) (wherein R ^3d is a hydrogen atom, an aliphatic hydrocarbon group with 1 to 8 carbon atoms or R ^4d O, and R ^4d is a hydrocarbon group with 1 to 8 carbon atoms or less , q is 0 or an integer of 1 or more and 6 or less. Wherein, the total carbon number in the compound is 4 or more and 10 or less)

<18C> The fungicidal cleaning composition for hard surfaces according to any one of the above <14C> to <17C>, which contains preferably 0.1 mass % or more, more preferably 0.5 mass % or more, and further preferably 0.8 mass % It is more than 12 mass % or less, More preferably, it is 10 mass % or less, More preferably, it is 8 mass % or less of (d) component.

<19C> The fungicidal cleaning composition for hard surfaces as described in any one of said <1C>-<18C> containing surfactant other than (c4) component as arbitrary (R) component.

<20C> The fungicidal cleaning composition for hard surfaces as described in the above <19C>, wherein the component (R) is an interface selected from (c1) at least one selected from the group consisting of betaine-type surfactants and amine oxide-type surfactants Surfactant of one or more of active agent, (c2) cationic surfactant, and (c3) anionic surfactant.

<21C> The fungicidal cleaning composition for hard surfaces according to any one of the above <1C> to <20C>, wherein the total content of the surfactant (the total content of the component (c4) and the component (R)) is preferably 9 The mass % or less is more preferably 8 mass % or less, more preferably 6 mass % or less, and still more preferably 4 mass % or less.

<22C> The pH value at 25°C of the fungicidal cleaning composition for hard surfaces according to any one of the above <1C> to <21C> is preferably 5 or more, more preferably 5.5 or more, still more preferably 6 More than that, 9 or less are preferable, 8.5 or less are more preferable, and 8 or less are still more preferable.

<23C> A method for treating a hard surface, wherein the fungicidal cleaning composition for a hard surface as described in any one of the above <1C> to <22C> is brought into contact with a hard surface in which mold is present, and the fungicidal and cleaning are performed simultaneously.

<24C> The method for treating hard surfaces as described in the above <23C>, wherein the fungicidal cleaning composition for hard surfaces described in any one of the above <1C> to <22C> is brought into contact with a hard surface in the form of a stock solution, or The above-mentioned fungicidal composition for hard surfaces is brought into contact with the hard surfaces in the form of a stock solution without being diluted.

<25C> A use of the fungicidal cleaning composition for hard surfaces according to any one of the above <1C> to <22C>, which is used as a fungicidal cleaning agent for hard surfaces.

<1D> A fungicidal cleaning composition for hard surfaces, which contains 0.1% by mass to 5% by mass (a) water-soluble inorganic salt [hereinafter referred to as (a) component], 0.05% by mass to 7% by mass ( b) Nonionic bactericide [hereinafter, referred to as (b) component], 0.01 mass % or more and 7 mass % or less (e) metal blocking agent [hereinafter referred to as (e) component], water and any ( S) Surfactant [hereinafter, referred to as (S) component], and the content of (S) component is 10 mass % or less, and the pH value of the fungicidal cleaning composition for hard surfaces at 25°C is 5 or more 9 the following.

<2D> The fungicidal cleaning composition for hard surfaces as described in the above <1D>, wherein the component (a) is selected from the group consisting of alkali metal sulfates, alkaline earth metal sulfates, ammonium sulfates, alkali metal sulfites, and alkaline earth metal sulfites , alkali metal halides, alkaline earth metal halides, alkali metal nitrates, alkaline earth metal nitrates, alkali metal carbonates, alkaline earth metal carbonates, alkali metal phosphates, alkaline earth metal phosphates, alkali metal thiocyanates and alkaline earth metals One or more water-soluble inorganic salts in thiocyanate, preferably one or more water-soluble inorganic salts selected from alkali metal sulfates, alkaline earth metal sulfates, alkali metal halides and alkaline earth metal halides, More preferably one or more water-soluble inorganic salts selected from alkali metal sulfates, alkaline earth metal sulfates, alkali metal chlorides and alkaline earth metal chlorides, and more preferably selected from alkali metal sulfates and alkali metal chlorides One or more of the water-soluble inorganic salts are more preferably alkali metal sulfates.

＜3D＞ The fungicidal cleaning composition for hard surfaces as described in the above <1D> or <2D>, wherein the component (a) is selected from the group consisting of sodium sulfate, lithium sulfate, potassium sulfate, cesium sulfate, ammonium sulfate, sodium sulfite, sodium chloride, One or more of potassium chloride, sodium nitrate, sodium carbonate, disodium hydrogen phosphate and sodium thiocyanate, preferably one selected from sodium sulfate, potassium sulfate, sodium nitrate, sodium chloride and potassium chloride Above, more preferably one or more selected from the group consisting of sodium sulfate, potassium sulfate and potassium chloride, and more preferably sodium sulfate.

<4D> The fungicidal cleaning composition for hard surfaces according to any one of the above <1D> to <3D>, wherein the component (b) has an aromatic group and a hydroxyl group which may have a substituent and has a molecular weight of 106 or more and 300 or less. Non-ionic fungicide.

<5D> The fungicidal cleaning composition for hard surfaces according to any one of the above <1D> to <4D>, wherein the component (b) is a compound represented by the following general formula (b1). R ^1b O-(R ^2b O) _l -H (b1) (wherein R ^1b is a hydrocarbon group having an aromatic group and a total carbon number of 6 or more and 11 or less, l is an integer of 0 or 1, and R ^2b is a carbon number 2 or more and 4 or less alkylene groups. Wherein, the molecular weight of the compound is 106 or more and 300 or less)

<6D> The fungicidal cleaning composition for hard surfaces according to any one of the above <1D> to <5D>, wherein the component (b) is selected from the group consisting of benzyl alcohol, phenoxyethanol, 2-phenylethanol, 3-benzene Ethyl-1-propanol, Cinnamyl Alcohol, Ethylene Glycol Benzyl Ether, Diethylene Glycol Phenyl Ether, Diethylene Glycol Benzyl Ether, 4-Phenyl-1-Butanol, Triclosan, Diclosan and Isopropyl One or more kinds of methylmethylphenols, preferably one or more kinds selected from benzyl alcohol, phenoxyethanol, diethylene glycol phenyl ether, triclosan, diclosan and isopropylmethylphenol, More preferably, it is at least one selected from the group consisting of benzyl alcohol and phenoxyethanol.

<7D> The fungicidal cleaning composition for hard surfaces according to any one of the above <1D> to <6D>, wherein the component (e) is selected from the group consisting of aminocarboxylic acid, hydroxycarboxylic acid, hydroxyphosphonic acid and salts thereof One or more of them, preferably one or more selected from ethylenediaminetetraacetic acid (EDTA), methylglycine diacetic acid (MGDA), citric acid, malic acid and their salts, more preferably One or more selected from ethylenediaminetetraacetic acid (EDTA), citric acid, and salts thereof, and more preferably one or more selected from ethylenediaminetetraacetic acid and salts thereof.

<8D> The fungicidal cleaning composition for hard surfaces according to any one of the above <1D> to <7D>, containing preferably 0.3 mass % or more, more preferably 0.5 mass % or more, and more preferably 4 mass % Below, it is more preferable that it is 3 mass % or less, More preferably, it is 2 mass % or less, More preferably, it is 1 mass % or less of (a) component.

<9D> The fungicidal cleaning composition for hard surfaces according to any one of the above <1D> to <8D>, containing preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and still more preferably 1% by mass It is more than 5 mass % or less, More preferably, it is 4 mass % or less, More preferably, it is 3 mass % or less of (b) component.

<10D> The fungicidal cleaning composition for hard surfaces according to any one of the above <1D> to <9D>, containing preferably 0.1 mass % or more, more preferably 0.5 mass % or more, and more preferably 6 mass % Below, it is more preferable that it is 5 mass % or less, More preferably, it is 2 mass % or less of (e) component.

<11D> The fungicidal cleaning composition for hard surfaces as described in any one of said <1D> to <10D>, which contains a surfactant as an arbitrary (S) component.

<12D> The fungicidal cleaning composition for hard surfaces as described in the above <11D>, wherein the component (S) is an interface selected from (c1) at least one selected from the group consisting of betaine-type surfactants and amine oxide-type surfactants Surfactant of one or more of active agent, (c2) cationic surfactant, (c3) anionic surfactant, and (c4) nonionic surfactant (except for (b) component).

＜13D＞ The fungicidal cleaning composition for hard surfaces as described in the above <11D> or <12D>, wherein the content of the component (S) is 10% by mass or less, preferably 7% by mass or less, more preferably 5% by mass or less, More preferably, it is 4 mass % or less, and still more preferably 3 mass % or less.

<14D> The fungicidal cleaning composition for hard surfaces according to any one of the above <11D> to <13D>, wherein the mass ratio (S)/(e) of the content of the component (e) to the content of the component (S) is compared with (S)/(e). It is preferably 0 or more, more preferably 0.2 or more, still more preferably 0.4 or more, and more preferably 10 or less, more preferably 7 or less, still more preferably 5 or less, and still more preferably 2 or less.

<15D> The fungicidal cleaning composition for hard surfaces as described in any one of said <1D> to <14D>, which further contains a solvent (however, (b) component is excluded) as (d) component.

<16D> The fungicidal cleaning composition for hard surfaces as described in the above <15D>, wherein the component (d) is one or more solvents selected from the following compounds (d1) to (d3). (d1): aliphatic alcohol with a molecular weight of 60 or more and 500 or less (d2): Aliphatic glycol ether with molecular weight of 60 or more and 500 or less (d3): Aliphatic diol with molecular weight of 60 or more and 500 or less

<17D> The fungicidal cleaning composition for hard surfaces as described in the above-mentioned <16D>, wherein (d2) is a compound represented by the following general formula (d2). R ^1d O-(R ^2d O) _n -H (d2) (wherein R ^1d is an aliphatic hydrocarbon group with 1 to 8 carbon atoms, R ^2d is an alkylene group with 2 or 3 carbon atoms, and n is 1 or more an integer below 4)

<18D> The fungicidal cleaning composition for hard surfaces as described in the above <16D>, wherein (d3) is a compound represented by the following general formula (d3) (except (d2). R ^3d -CH(OH) )-(CH ₂ ) _q -CH ₂ OH (d3) (wherein R ^3d is a hydrogen atom, an aliphatic hydrocarbon group with 1 to 8 carbon atoms or R ^4d O, and R ^4d is a hydrocarbon group with 1 to 8 carbon atoms or less , q is 0 or an integer of 1 or more and 6 or less. Wherein, the total carbon number in the compound is 4 or more and 10 or less)

<19D> The fungicidal cleaning composition for hard surfaces according to any one of the above <15D> to <18D>, wherein from the viewpoint of improving the fungicidal effect and improving the cleaning power, the composition preferably contains 0.1 mass % or more, more 0.5 mass % or more is preferable, More preferably, it is 1 mass % or more of (d) component, and from the viewpoint of compounding stability, it is preferable to contain 10 mass % or less, more preferably 9 mass % or less, and further 8 mass % or less of (d) component is preferable.

<20D> The fungicidal cleaning composition for hard surfaces according to any one of the above <1D> to <19D>, the pH at 25°C is preferably 5.5 or more, more preferably 6 or more, and preferably 8.5 or less, more preferably 8 or less.

<21D> A method for treating a hard surface, wherein the fungicidal cleaning composition for a hard surface as described in any one of the above <1D> to <20D> is brought into contact with a hard surface in which mold is present, and the fungicidal and cleaning are performed simultaneously.

<22D> The method for treating hard surfaces as described in the above <21D>, wherein the fungicidal cleaning composition for hard surfaces described in any one of the above <1D> to <20D> is brought into contact with a hard surface in the form of a stock solution, or The above-mentioned fungicidal composition for hard surfaces is brought into contact with the hard surfaces in the form of a stock solution without being diluted.

＜23D＞ A use of the fungicidal cleaning composition for hard surfaces according to any one of the above <1D> to <20D>, which is used as a fungicidal cleaning agent for hard surfaces.

Example [Test Example 1] Using the following formulation components, the fungicidal cleaning composition for hard surfaces shown in Tables 1 to 4 was prepared, and the following items were evaluated. The results are shown in Tables 1 to 4. The fungicidal detergent compositions for hard surfaces in Tables 1 to 4 were prepared by adding sodium hydrogen phosphate and sodium dihydrogen phosphate to ion-exchanged water, respectively, in a 10 mM phosphate buffered aqueous solution (pH value 7) as shown in the table. (a) component, (b) component, (c1) component, (P) component, (d) component, (e) component were added to the compounding amount, and these were dissolved at room temperature (25°C). When the pH value is other than 7 after preparation, the pH value is adjusted to 7 using sodium hydroxide and/or hydrochloric acid. In addition, pH value was measured by the glass electrode method. In addition, the mass % of the compounding components in Tables 1-4 is the numerical value based on an active ingredient.

<Ingredients> (a) Ingredient ・Na ₂ SO ₄ : Sodium sulfate, manufactured by Wako Pure Chemical Industries, Ltd. ・ K ₂ SO ₄ : Potassium sulfate, manufactured by Wako Pure Chemical Industries, Ltd. ・ NaCl: Sodium chloride, and Manufactured by Guangchun Pharmaceutical Industry Co., Ltd.

(b) Ingredients ・Benzyl alcohol: manufactured by Wako Pure Chemical Industries, Ltd., molecular weight 108 ・Phenoxyethanol: manufactured by Wako Pure Chemical Industries, Ltd., molecular weight 138 ・Diclosan: manufactured by BASF, molecular weight 255 ・IPMP: Isopropylmethylphenol, manufactured by Wako Pure Chemical Industries, Ltd., molecular weight 150 ・Diethylene glycol phenyl ether: manufactured by Nippon Emulsifier Co., Ltd., molecular weight 182

(c1) Ingredient ・Carbonyl betaine: Laurylaminopropyl betaine, Amphitol 20AB, manufactured by Kao Co., Ltd., in the general formula (c11), R ^1c is an alkyl group having 11 carbon atoms, R ^2c is a propyl group, and R ^3c and R ^4c is a methyl compound ・Sulfobetaine: Lauryl hydroxysulfobetaine (N-dodecyl-N,N-dimethyl-N-(2-hydroxysulfopropyl)ammoniumsulfobetaine) Betaine), Amphitol 20HD, manufactured by Kao Co., Ltd. ・Amine oxide: Amphitol 20N, manufactured by Kao Co., Ltd., in the general formula (c12), R ^5c is dodecyl (a straight-chain alkyl group having 12 carbon atoms), R Compounds in which ^6c and R ^7c are methyl, and m and p are 0

(P) Ingredient ・ES: Sodium polyoxyethylene lauryl ether sulfate, manufactured by Kao Co., Ltd. ・LAS: Sodium dodecylbenzenesulfonate, manufactured by Kao Co., Ltd. ・Sanisol 08: Octylbenzyldimethylammonium chloride, manufactured by Kao Co., Ltd.

(d) Ingredients ・BDG: Diethylene glycol butyl ether (Molecular weight: 162, logP: 0.66), manufactured by Nippon Emulsifier Co., Ltd., (d2) (e) Ingredients ・EDTA-4Na: Ethylenediaminetetraacetic acid sodium salt, manufactured by Dojin Chemical Research Institute Co., Ltd.

<Method for evaluating the fungicidal activity> The environmental isolate Cladsporium sp. PA-4 of the filamentous fungus Cladosporium genus with preference for living environment was placed on a potato dextrose plate agar medium (Potato dextrose agar (Potato dextrose agar manufactured by Becton Dickinson) was prepared according to the efficacy instructions. Potato Dextrose Agar) reagent) was cultured at 25°C for 7 days, and then a spore recovery solution (0.05 0.05 0.05 0.05 0.05 wt. %Tween80 solution) 4 mL, and rubbed gently by brushing with a coating rod (manufactured by Nisshui Pharmaceutical Co., Ltd.), thereby recovering the bacterial solution. Then, the collected bacterial liquid was filtered using Miracloth (manufactured by CALBIOCHEM) to remove mycelium, and the obtained liquid was centrifuged (10,000 rpm, 25° C., 5 min) to remove the supernatant. These operations were repeated two or three times, and the bacterial concentration was prepared to be 3.0×10 ⁷ to 7.0×10 ⁸ CFU/mL as a test spore solution.

Using the fungicidal detergent compositions for hard surfaces in Tables 1 to 4 as the test solution, mix 10 μL of the prepared test spore solution with 1 mL of the test solution, and after contacting at 25°C for 5 minutes, aliquot 100 μL of it and add it to the test solution. The test solution was suspended in 900 μL of LP diluent (prepared by the manufacturer of Nissui Pharmaceutical Co., Ltd. according to the efficacy instructions), thereby inactivating the test solution. After further diluting it with LP diluent, it was coated on potato dextrose agar medium (the potato dextrose agar reagent manufactured by Becton Dickinson company was prepared according to the efficacy specification), and the number of colonies was obtained by culturing at 25° C. for 4 days. The number of colonies was calculated as the number of residual bacteria.

In addition, using physiological saline (manufactured by Otsuka Pharmaceutical Co., Ltd.) in place of the test solution, and performing the same operation (10 μL of the mixed bacterial solution to 1 mL of the test solution, contacted for 5 minutes, and then mixed with the LP dilution solution), the obtained As the target operation, the logarithmic difference of the number of residual bacteria after the target operation and the number of residual bacteria after contact with the test solution was calculated and used as an index of bactericidal performance (ΔLog reduction of bacteria). In the present invention, the ΔLog reduced bacterial count was set to be 1.0 or more as acceptable. The results are shown in Tables 1 to 4.

<Evaluation of formulation stability (room temperature 25°C)> After preparing the fungicidal cleaning composition for hard surfaces, the composition was stored at room temperature (25° C.) for 1 day, and changes in appearance (separation of components, separation, turbidity, etc.) were observed by visual inspection, and the following criteria were used to evaluate. ○: Uniform and transparent with no separation, delamination and turbidity of components △: Although cloudy but not delaminated, it maintains a uniform state ×: Separation and stratification of visible components

＜Evaluation of sebum cleansing properties＞ The model sebum soil prepared based on the composition of the sebum soil adhering to the bathtub of the bathroom was dissolved in chloroform to prepare a 5 mass % model sebum soil solution. A polyvinyl chloride flat plate (size 7 cm×2 cm) was immersed in this solution for 10 seconds to form a film of model sebum dirt on the flat plate, and then it was naturally dried overnight. Furthermore, the composition of the model sebum stain was 40% by mass of linoleic acid, 20% by mass of oleic acid, 20% by mass of palmitic acid, 10% by mass of cholesterol, and 10% by mass of liquid paraffin. Drop 10 μl of the fungicidal cleaning composition for hard surfaces in Tables 1 to 4 on the soiled part of the plate, leave it at 25° C. for 5 minutes, wash with water, and evaluate the cleaning power by visual inspection and the following criteria. ⊚: All the dirt on the part where the above composition was dropped was dropped ○: Although not all the dirt on the part where the above composition was dropped, more than half of the dirt dropped off △: The soil on the site where the above composition was dropped dropped, but only less than half of the soil dropped ×: The dirt on the site where the above composition was dropped hardly dropped

[Table 1]

[Table 2]

[table 3]

[Table 4]

In Tables 1 to 4, those with a ΔLog reduced bacterial count of 4.5 or more showed a detection limit value, which means that the number of residual bacteria was extremely small by the fungicidal cleaning composition for hard surfaces.

[Test Example 2] Using the following formulation components, the fungicidal cleaning composition for hard surfaces shown in Table 5 was prepared, and the following items were evaluated. The results are shown in Table 5. The fungicidal detergent compositions for hard surfaces in Table 5 are prepared by adding sodium hydrogen phosphate and sodium dihydrogen phosphate to ion-exchanged water, respectively, in a 10 mM phosphate buffered aqueous solution (pH value 7) with the formulations in the table. (a) component, (b) component, (c2) component, (d) component, (Q) component were added in quantity, and these were melt|dissolved at room temperature (25 degreeC). When the pH value is other than 7 after preparation, the pH value is adjusted to 7 using sodium hydroxide and/or hydrochloric acid. In addition, pH value was measured by the glass electrode method. In addition, the mass % of the compounding components in Table 5 is the numerical value based on an active ingredient.

<Ingredients> (a) Ingredient ・Na ₂ SO ₄ : Sodium sulfate, manufactured by Wako Pure Chemical Industries, Ltd.

(b) Ingredients ・Benzyl alcohol: manufactured by Wako Pure Chemical Industries, Ltd., molecular weight 108 ・Phenoxyethanol: manufactured by Wako Pure Chemical Industries, Ltd., molecular weight 138

(c2) Component ・Sanisol 08: octylbenzyldimethylammonium chloride, in the general formula (c2), R ^11c is an octyl group, R ^12c and R ^13c are methyl groups, R ^14c is a methylene group, ^and Z- is a Compound of chloride ion, manufactured by Kao Co., Ltd. ・C10BAC: Benzyldimethyldecylammonium chloride, in the general formula (c2), R ^11c is an alkyl group having 10 carbon atoms, R ^12c and R ^13c are methyl groups, R ^14c is a methylene group, Z ^- is a compound of chloride ion, manufactured by Sigma-Aldrich Co., Ltd. ・Sanisol C: alkyl (8 to 18 carbon atoms) benzyl dimethyl ammonium chloride, R in the general formula (c2) Compounds in which ^11c is an alkyl group having 8 to 18 carbon atoms, R ^12c and R ^13c are methyl groups, R ^14c is a methylene group, and Z ^- is a chloride ion, manufactured by Kao Co., Ltd.

(d) Ingredients ・BDG: Diethylene glycol butyl ether (Molecular weight: 162, logP: 0.66), manufactured by Nippon Emulsifier Co., Ltd., (d2) (Q) Ingredients ・Emulgen 108: Polyoxyethylene (average number of moles added 6) lauryl ether, manufactured by Kao Co., Ltd.

＜Evaluation method of fungicidal property＞ For the fungicidal detergent compositions for hard surfaces shown in Table 5, by the same method as the fungicidal property evaluation method described in Test Example 1, the sterilization performance ( ΔLog reduces bacterial count). The results are shown in Table 5. In the present invention, the ΔLog reduced bacterial count was set to be 1.0 or more as acceptable. In addition, in the method for evaluating the fungicidal property described in Test Example 1, the test liquid and the test spore liquid were mixed and contacted for 1 minute (when the test liquid was physiological saline, the same was applied for 1 minute), except that Other than that, it evaluated by the method similar to the method described in Test Example 1, and evaluated the bactericidal performance. The results are shown in Table 5.

＜Evaluation of sebum cleansing properties＞ With respect to the fungicidal cleaning compositions for hard surfaces shown in Table 5, the sebum cleaning properties of each of the fungicidal cleaning compositions for hard surfaces were evaluated by the same method as the evaluation of sebum cleaning properties described in Test Example 1. The results are shown in Table 5.

[table 5]

In Table 5, those with a ΔLog reduction of 4.5 or more in the number of bacteria showed the detection limit value, which means that the number of residual bacteria was extremely small by the fungicidal cleaning composition for hard surfaces. In addition, the test example in which the evaluation result of the fungicidal property was described as "-" means that the evaluation of the fungicidal property was not performed.

[Test Example 3] Using the following formulation components, the fungicidal cleaning composition for hard surfaces shown in Table 6 was prepared, and the following items were evaluated. The results are shown in Table 6. The fungicidal detergent compositions for hard surfaces in Table 6 were prepared by adding sodium hydrogen phosphate and sodium dihydrogen phosphate to ion-exchanged water, respectively, in a 10 mM phosphate buffered aqueous solution (pH value of 7) with the formulations in the table. (a) component, (b) component, (c4) component, (d) component, (R) component were added in quantity, and these were melt|dissolved at room temperature (25 degreeC). When the pH value is other than 7 after preparation, the pH value is adjusted to 7 using sodium hydroxide and/or hydrochloric acid. In addition, pH value was measured by the glass electrode method. In addition, the mass % of the compounding components in Table 6 is the numerical value based on an active ingredient.

<Ingredients> (a) Ingredient ・Na ₂ SO ₄ : Sodium sulfate, manufactured by Wako Pure Chemical Industries, Ltd.

(b) Ingredients ・Phenoxyethanol: manufactured by Wako Pure Chemical Industries, Ltd., molecular weight 138 ・Benzyl alcohol: manufactured by Wako Pure Chemical Industries, Ltd., molecular weight 108

(c4) Component ・Emulgen 108: Polyoxyethylene lauryl ether, in the general formula (c4), R ^21c is an alkyl group having 12 carbon atoms, s is 6, and t is a compound of 0, manufactured by Kao Co., Ltd.

(d) Ingredients ・BDG: Diethylene glycol butyl ether (Molecular weight: 162, logP: 0.66), manufactured by Nippon Emulsifier Co., Ltd., (d2)

(R) Ingredients ・ES-4.0K: Polyoxyethylene (average number of moles added 4) alkyl ether sulfate sodium, manufactured by Kao Co., Ltd.

＜Evaluation method of fungicidal property＞ For the fungicidal cleaning compositions for hard surfaces shown in Table 6, by the same method as the method for evaluating the fungicidal properties described in Test Example 1, the sterilization performance ( ΔLog reduces bacterial count). The results are shown in Table 6. In the present invention, the ΔLog reduced bacterial count was set to be 1.0 or more as acceptable.

＜Evaluation of sebum cleansing properties＞ With respect to the fungicidal cleaning compositions for hard surfaces shown in Table 6, the sebum cleaning properties of each of the fungicidal cleaning compositions for hard surfaces were evaluated by the same method as the evaluation of the sebum cleaning properties described in Test Example 1. The results are shown in Table 6.

[Table 6]

In Table 6, those with a ΔLog reduction of 4.5 or more showed the detection limit value, which means that the number of residual bacteria was extremely small when the mold was killed by the fungicidal cleaning composition for hard surfaces.

[Test Example 4] Using the following formulation components, the fungicidal cleaning composition for hard surfaces shown in Table 7 was prepared, and the following items were evaluated. The results are shown in Table 7. The fungicidal detergent compositions for hard surfaces in Table 7 are prepared by adding sodium hydrogen phosphate and sodium dihydrogen phosphate to ion-exchanged water, respectively, in a 10 mM phosphate buffered aqueous solution (pH value 7) with the formulations in the table. (a) component, (b) component, (e) component, (S) component, (d) component were added in quantity, and these were melt|dissolved at room temperature (25 degreeC). When the pH value is other than 7 after preparation, the pH value is adjusted to 7 using sodium hydroxide and/or hydrochloric acid. In addition, pH value was measured by the glass electrode method. In addition, the mass % of the compounding components in Table 7 is the numerical value based on an active ingredient.

<Formulation ingredients> (a) Component ・Na ₂ SO ₄ : Sodium sulfate, manufactured by Wako Pure Chemical Industries, Ltd. (b) Component ・ Benzyl alcohol: manufactured by Wako Pure Chemical Industries, Ltd., molecular weight 108 (e) Component ・ EDTA -4Na: EDTA sodium salt, manufactured by Dojin Chemical Research Institute Co., Ltd.

(S) Ingredient ・ES-4.0K: Polyoxyethylene (average added moles of 4) sodium lauryl ether sulfate, manufactured by Kao Co., Ltd. ・Emulgen 108: The average added moles of ethoxylates is 6 Mol's polyoxyethylene lauryl ether, manufactured by Kao Co., Ltd. ・Amphitol 20N: amine oxide, manufactured by Kao Co., Ltd., R ^5c in the general formula (c12) is dodecyl (linear alkyl group with 12 carbon atoms) , R ^6c and R ^7c are methyl groups, and m and p are 0. Compound (d) Component ・BDG: Diethylene glycol butyl ether (molecular weight: 162, logP: 0.66), manufactured by Nippon Emulsifier Co., Ltd., (d2 )

＜Evaluation method of fungicidal property＞ For the fungicidal detergent compositions for hard surfaces shown in Table 7, in the fungicidal property evaluation method described in Test Example 1, the test liquid and the test spore liquid were mixed and contacted for 10 minutes (when the test liquid was physiological In the case of salt water, contact for 10 minutes was carried out in the same manner), except that it was evaluated by the same method as that described in Test Example 1, and the bactericidal performance (ΔLog) of each fungicidal cleaning composition for hard surfaces was evaluated. reduce the number of bacteria). The results are shown in Table 7. In the present invention, the ΔLog reduced bacterial count was set to be 1.0 or more as acceptable.

＜Evaluation of soap scum cleaning properties＞ The model soap scum dirt prepared with the composition of the soap scum dirt adhering to the bathroom as a reference was formed into a film on a polypropylene flat plate (size 8 cm×12 cm). The method for preparing the model soap scum stain and film forming method is to sequentially immerse the above-mentioned flat plate in an aqueous solution (2% by mass) in which a solid soap (manufactured by Kao Co., Ltd., "White") and an aqueous solution of calcium chloride (0.7 mass %) are dissolved. %), the subsequent drying step was repeated 10 times, whereby the preparation and film formation of model soap scum stains were performed. After the model soap scum dirt was made into a film on the above-mentioned flat plate, 10 μl of the fungicidal cleaning agent composition for hard surfaces in Table 7 was dropped on the dirt part of the flat plate, placed at 25 ° C for 10 minutes, washed with water, The cleaning power was evaluated according to the following criteria. ⊚: All the dirt on the part where the above composition was dropped was dropped ○: Although not all the dirt on the part where the above composition was dropped, more than half of the dirt dropped off △: The soil on the site where the above composition was dropped fell, but only less than half of the soil fell off ×: The dirt on the site where the above composition was dropped hardly dropped

[Table 7]

In Table 7, those with a ΔLog reduction in the number of bacteria of 4.5 or more showed the detection limit value, which means that the number of residual bacteria was extremely small by the fungicidal cleaning composition for hard surfaces.

Claims (13)

A fungicidal cleaning composition for hard surfaces, which contains 0.1% by mass to 5% by mass (a) water-soluble inorganic salt [hereinafter referred to as (a) component], 0.05% by mass to 7% by mass ( b) Nonionic bactericide [hereinafter, referred to as (b) component], 0.1 mass % or more and 5 mass % or less of (c1) at least one selected from betaine-type surfactants and amine oxide-type surfactants Surfactant [hereinafter referred to as (c1) component], any surfactant other than (P) (c1) component [hereinafter referred to as (P) component], and water, and the content of (c1) component The mass ratio (c1)/[(c1)+(P)] to the total content of component (c1) and component (P) is not less than 0.30 and not more than 1.0; The pH value is above 5 and below 9. As claimed in claim 1, the fungicidal cleaning composition for hard surfaces, wherein (a) component is one or more water-soluble selected from alkali metal sulfates, alkaline earth metal sulfates, alkali metal chlorides and alkaline earth metal chlorides Inorganic salts. The fungicidal cleaning composition for hard surfaces according to claim 1, wherein the component (P) comprises at least one selected from the group consisting of (c2) cationic surfactants and (c3) anionic surfactants. The fungicidal cleaning composition for hard surfaces according to claim 1, which further contains (d) a solvent (however, the (b) component is excluded). A fungicidal cleaning composition for hard surfaces, which contains 0.1% by mass to 5% by mass of (a) water-soluble inorganic salt [hereinafter referred to as (a) component], 0.05% by mass or more and 7% by mass or less (b) Nonionic bactericide [hereinafter referred to as (b) component], 0.1 mass % or more and 5 mass % or less (c2) cationic surfactant, (d) solvent (except (b) component) and water, and the pH value of the fungicidal cleaning composition for hard surfaces at 25°C is 5 or more and 9 or less. As claimed in claim 5, the fungicidal cleaning composition for hard surfaces, wherein (a) component is one or more water-soluble selected from alkali metal sulfates, alkaline earth metal sulfates, alkali metal chlorides and alkaline earth metal chlorides Inorganic salts. A fungicidal cleaning composition for hard surfaces, which contains 0.1% by mass to 5% by mass of (a) selected from the group consisting of alkali metal sulfates, alkaline earth metal sulfates, alkali metal chlorides and alkaline earth metal chlorides The above water-soluble inorganic salt [hereinafter referred to as (a) component], 0.05 mass % or more and 7 mass % or less (b) nonionic bactericide [hereinafter referred to as (b) component], (c4) nonionic Surfactant [except (b) component, hereinafter referred to as (c4) component] and water, and the total content of (a) component and (b) component is 1.5 mass % or more and 10 mass % or less, and the interface is active The total content of the agent is 10 mass % or less, and the pH value of the fungicidal cleaning composition for hard surfaces at 25° C. is less than 12. The fungicidal cleaning composition for hard surfaces according to claim 7, which further contains (d) a solvent (however, the (b) component is excluded). As claimed in claim 7, the fungicidal cleaning composition for hard surfaces has a pH value of 5 or more and 9 or less at 25°C. A fungicidal cleaning composition for hard surfaces, which contains 0.1% by mass to 5% by mass of (a) selected from the group consisting of alkali metal sulfates, alkaline earth metal sulfates, alkali metal chlorides and alkaline earth metal chlorides The above water-soluble inorganic salt [hereinafter referred to as (a) component], 0.05 mass % or more and 7 mass % or less (b) nonionic bactericide [hereinafter referred to as (b) component], 0.01 mass % or more 7 Mass % or less of (e) metal blocking agent [hereinafter referred to as (e) component], water and any (S) surfactant [hereinafter referred to as (S) component], and the content of (S) component It is 10 mass % or less, and the pH value at 25 degreeC of this fungicidal cleaning composition for hard surfaces is 5 or more and 9 or less. The fungicidal cleaning composition for hard surfaces according to any one of claims 1 to 10, wherein the component (b) is a non-ionic sterilization having an aromatic group and a hydroxyl group which may have substituents and a molecular weight of 106 or more and 300 or less. agent. The fungicidal cleaning composition for hard surfaces according to any one of claims 1 to 10, wherein the component (b) is selected from benzyl alcohol, phenoxyethanol, diethylene glycol phenyl ether, triclosan, dichloromethane One or more kinds of non-ionic fungicides among sand and isopropyl methyl phenol. A method for treating a hard surface, wherein the fungicidal cleaning composition for a hard surface according to any one of Claims 1 to 10 is brought into contact with a hard surface in which mold is present, and the fungicidal and cleaning are performed at the same time.