TW201938776A - Fungicidal detergent composition for rigid surface - Google Patents

Abstract

Provided are: a fungicidal detergent composition for rigid surfaces which exhibits the excellent effect of killing molds existing in living environments, e.g., bathrooms, and which has the property of removing sebaceous soils and has excellent stability; and a method for treating a rigid surface using the fungicidal detergent composition. The fungicidal detergent composition for rigid surfaces comprises (a) 0.1-5 mass% water-soluble inorganic salt [hereinafter referred to as (a) component], (b) 0.05-7 mass% nonionic bactericide [hereinafter referred to as (b) component], (c1) 0.1-5 mass% at least one surfactant [hereinafter referred to as (c1) component] selected from among betaine type surfactants and amine oxide type surfactants, and water and optionally contains (P) a surfactant [hereinafter referred to as (P) component] which is not (c1) component, the mass ratio of the content of (c1) component to the total content of (c1) component and (P) component, (c1)/[(c1)+(P)], being 0.30-1.0. The composition has a pH at 25 DEG C of 5-9.

Description

Mildew cleaning agent composition for hard surface

The present invention relates to a mildew-resistant cleaner composition for hard surfaces and a hard surface treatment method.

Hydrophobic dirt such as sebum or soap residue is easy to adhere to the hard surface of water places such as bathrooms. It is also one of the dirt that is difficult to clean because it hardly adheres due to the floating of the hardness components in the water. In addition, such firmly adhered dirt becomes a nutrient component of microorganisms such as mold, and there is always a moderate amount of water, so mold is easily generated. The mold that is temporarily generated becomes impossible to be cleaned without being removed by a strong oxidant such as hypochlorous acid. Big burden. Therefore, a technique for effectively removing a nutrient source of microorganisms such as molds and sterilizing them by a simple method before the microorganisms such as molds multiply is strongly sought.

Japanese Patent Publication No. 2015-537076 discloses a liquid detergent composition for hand washing of tableware for cleaning and disinfection, which comprises a liquid detergent composition selected from anionic, nonionic, cationic, bipolar, amphoteric surfactants, and the And a combination of at least one surfactant, at least one organic solvent, and / or at least one dissolution aid, and a single antibacterial active substance and / or at least one metal ion blocking agent.

Japanese Patent Application Laid-Open No. 2005-187491 discloses an antibacterial liquid cleaner composition containing phenoxyethanol, amphoteric surfactant, and magnesium chloride, and the slippery feeling during cleaning or cleaning is improved.

Japanese Patent Application Laid-Open No. 2007-332304 discloses a technology of a liquid detergent composition containing (A) a non-soap anionic surfactant, and (B) a specific semi-polar surfactant. (C) At least one of (C) a linear and / or branched higher alcohol or fatty acid having 8 to 24 carbon atoms, (D) a dissolution aid and (E) an antibacterial component, which has excellent cleaning power and also has anticorrosion Sex.

Japanese Patent Laid-Open No. 2014-132063 and Japanese Patent Laid-Open No. 2014-132062 disclose a liquid cleaner composition for a hard surface, which contains benzyl alcohol and an amphoteric surfactant, and is derived from a hard surface. The pink dirt of microorganisms has excellent cleaning power, and the sebum dirt attached to hard surfaces has excellent cleaning power and good formulation stability.

Japanese Patent Laid-Open No. 11-61199 discloses a detergent composition containing a specific nonionic surfactant and / or amphoteric surfactant, a specific monohydric or polyhydric alcohol, an acid and a salt thereof, and Bactericide, excellent cleaning effect, antibacterial property, storage stability, especially effective on hard surfaces of toilets and other toilets.

Japanese Patent Laid-Open No. 2015-105310 discloses a liquid treating agent composition for a hard surface, which contains a polymer compound containing a monomer unit having a sulfobetaine structure, an inorganic salt such as a halide of an alkali metal, and Surfactants, modified hydrophobic hard surface, can provide excellent antifouling properties, and excellent stability to temperature.

Japanese Patent Laid-Open No. 2015-105310 discloses a hard surface cleaner composition containing a non-ionic surfactant, a terpene-based hydrocarbon solvent, a water-soluble solvent, an alkali agent, and a cationic surfactant, and an oil stain. Needless to say, the cleaning power and the storage stability of the composition are excellent, and the cleaning property is also excellent.

Japanese Patent Publication No. 2017-513985 discloses a hard surface cleaning composition, which contains a specific amine compound, and contains a salt of a divalent cation, a preservative such as phenoxyethanol, and a nonionic surfactant. .

Japanese Patent Laid-Open No. 2000-129298 discloses a liquid lotion composition for hand washing of tableware for cleaning and disinfection, which comprises a liquid detergent composition selected from the group consisting of anionic, nonionic, cationic, bipolar, amphoteric surfactants, and the And a combination of at least one surfactant, at least one organic solvent, and / or at least one dissolution aid, and a single antibacterial active substance and / or at least one metal ion blocking agent.

The present invention provides a mold killing detergent composition for hard surfaces that exhibits excellent mold killing effects on molds present in living environments such as bathrooms, and a hard surface treatment method using the same.

The present invention relates to a mildew-resistant cleaner composition for hard surfaces, which contains (a) a water-soluble inorganic salt [hereinafter, referred to as (a) component] at 0.1 mass% to 5 mass% and 7 mass at 0.05 mass%. % (B) non-ionic fungicide [hereinafter, referred to as (b) component], and (c1) from 0.1% by mass to 5% by mass selected from betaine-type surfactants and amine oxide-type surfactants One or more of the surfactants [hereinafter, referred to as (c1) component], any of the surfactants (hereinafter, referred to as (P) component) other than (P) (c1) component, and water, and (c1) The mass ratio (c1) / [(c1) + (P)] of the content of the component to the total content of the (c1) component and the (P) component is 0.30 or more and 1.0 or less. The pH at ℃ is 5 or more and 9 or less. Hereinafter, the first aspect of the present invention will be described.

The present invention also relates to a mildew-resistant cleaner composition for a hard surface, which contains (a) a water-soluble inorganic salt [hereinafter, referred to as (a) component] and 0.05% by mass or more, in an amount of 0.1% by mass or more and 5% by mass or less. (B) nonionic fungicide [hereinafter, referred to as (b) component] of 7 mass% or less, (c2) cationic surfactant [hereinafter, referred to as (c2) component] of 0.1 mass% or more and 5 mass% or less (D) solvent (except component (b), hereinafter referred to as (d) minutes) and water, and the pH value at 25 ° C is 5 or more and 9 or less. Hereinafter, the second aspect of the present invention will be described.

The present invention also relates to a mildew-resistant cleaner composition for a hard surface, which contains (a) a water-soluble inorganic salt [hereinafter, referred to as (a) component] and 0.05% by mass or more, in an amount of 0.1% by mass or more and 5% by mass or less. (B) non-ionic fungicides [hereinafter, referred to as (b) component], (c4) non-ionic surfactants [except for (b) component, hereinafter referred to as (c4) component] And water, and the total content of (a) component and (b) component is 1.5 mass% or more and 10 mass% or less, and the total content of the surfactant is 10 mass% or less. The pH value did not reach 12 at 25 ° C. Hereinafter, the third aspect of the present invention will be described.

The present invention also relates to a mildew-resistant cleaner composition for a hard surface, which contains (a) a water-soluble inorganic salt [hereinafter, referred to as (a) component] and 0.05% by mass or more, in an amount of 0.1% by mass or more and 5% by mass or less. (B) non-ionic fungicide [hereinafter, referred to as (b) component] of 7 mass% or less, (e) metal blocking agent [hereinafter, referred to as (e) component] of 0.01 mass% or more and 7 mass% or less , Water, and any (S) surfactant [hereinafter, referred to as (S) component], and the content of (S) component is 10% by mass or less, the mildew-resistant cleaner composition for hard surfaces at 25 ° C The pH value is 5 or more and 9 or less. Hereinafter, the fourth aspect of the present invention will be described.

The present invention also relates to a hard surface treatment method in which the mold killing detergent composition for a hard surface of the present invention is brought into contact with a hard surface on which mold is present, and mold killing and cleaning are performed simultaneously.

According to the first aspect of the present invention, there is provided a mildew-resistant cleaner composition for hard surfaces that exhibits excellent fungicidal effects on molds existing in living environments such as bathrooms, has cleansing properties of sebum dirt, and has excellent formulation stability, and Use its hard surface treatment method.

According to the second aspect and the third aspect of the present invention, there are provided a mildew-resistant cleaner composition for hard surfaces which exhibits an excellent fungicidal effect on molds present in a living environment such as a bathroom and has excellent cleanability of sebum dirt, and Use its hard surface treatment method.

According to a fourth aspect of the present invention, there is provided a mildew-resistant cleaner composition for a hard surface which exhibits an excellent fungicidal effect against molds present in a living environment such as a bathroom and has excellent cleanliness of soap residue, and a hard surface using the same Approach.

[Fungicide Cleanser Composition for Hard Surface]
[1st aspect]
A first aspect of the present invention is a mildew-resistant cleaner composition for a hard surface, which contains (a) component in an amount of 0.1% by mass or more and 5% by mass, (b) component in an amount of 0.05% by mass or more and 7% by mass or less, 0.1 Mass ratio (c1) component, optional (P) component, and water from 5 mass% to 5 mass%, and the mass ratio of the content of (c1) component to the total content of (c1) component and (P) component (c1) / [ (c1) + (P)] is 0.30 or more and 1.0 or less, and the pH value of the mold killing detergent composition for a hard surface at 25 ° C is 5 or more and 9 or less.

＜ (a) component ＞
The component (a) of the present invention is a water-soluble inorganic salt.
Here, as for the inorganic salt of the component (a), water-soluble means that 5 g or more is dissolved in 100 g of deionized water at 25 ° C.

(a) The component is selected from the group consisting of an alkali metal sulfate, an alkaline earth metal sulfate, an ammonium sulfate, an alkali metal sulfite, an alkaline earth metal sulfite, an alkali metal halide, an alkaline earth metal halide, an alkali metal nitrate, One or more water-soluble inorganic salts of alkaline earth metal nitrates, alkali metal carbonates, alkaline earth metal carbonates, alkali metal phosphates, alkaline earth metal phosphates, alkali metal thiocyanates, and alkaline earth metal thiocyanates. From the viewpoint of fungicidal performance and formulation stability, one or more water-soluble inorganic salts selected from the group consisting of alkali metal sulfates, alkaline earth metal sulfates, alkali metal halides, and alkaline earth metal halides are more preferred. One or more water-soluble inorganic salts selected from the group consisting of alkali metal sulfates, alkaline earth metal sulfates, alkali metal chlorides, and alkaline earth metal chlorides, and more preferably one selected from alkali metal sulfates and alkali metal chlorides More than one of the water-soluble inorganic salts, and more preferably an alkali metal sulfate.

More specifically, the component (a) may be selected from the group consisting of sodium sulfate, lithium sulfate, potassium sulfate, cesium sulfate, ammonium sulfate, sodium sulfite, sodium chloride, potassium chloride, sodium nitrate, sodium carbonate, disodium hydrogen phosphate, and One or more kinds of sodium thiocyanate are preferably one or more kinds selected from sodium sulfate, potassium sulfate, sodium nitrate, sodium chloride, and potassium chloride from the viewpoint of a fungicidal effect and formulation stability, More preferably, it is 1 or more types chosen from sodium sulfate, potassium sulfate, and potassium chloride. The (a) component of the present invention is preferably sodium sulfate.

＜ (b) component ＞
The component (b) of the present invention is a non-ionic fungicide. From the viewpoint of fungicidal performance, the component (b) is preferably a nonionic fungicide having an aromatic group and a hydroxyl group which may have a substituent, and having a molecular weight of 106 to 300. The aromatic group is an aromatic hydrocarbon group, and examples thereof include a phenyl group, a benzyl group, and a phenethyl group. These aromatic groups may have a substituent. Examples of the substituent include a halogen group such as a fluoro group and a chloro group; an alkyl group such as a methyl group, an ethyl group, and an isopropyl group; a carboxyl group, an amino group, a sulfo group, and an alkoxy group; Or 2 or more.

From the viewpoint of fungicidal performance and formulation stability, the component (b) is preferably a compound represented by the following general formula (b1).
R ^1b O- (R ^2b O) _l -H (b1)
(Wherein R ^1b is a hydrocarbon group having an aromatic group and having a total carbon number of 6 to 11; l is an integer of 0 or 1; R ^2b is an alkylene group having a carbon number of 2 to 4; wherein the molecular weight of the compound (From 106 to 300)

The total carbon number of R ^1b is the carbon number including the aromatic group. From the viewpoint of fungicidal performance, the total carbon number of R ^1b is 6 or more, and from the viewpoint of formulation stability, it is 11 or less. It is preferably 10 or less, and more preferably 9 or less. R ^1b is an aromatic hydrocarbon group, and examples thereof include a phenyl group, a benzyl group, and a phenethyl group. From the viewpoint of a fungicidal effect, R ^{2b is} preferably an ethyl group. From the viewpoint of a fungicidal effect, l is preferably 0.

Specific examples of the component (b) include benzyl alcohol (molecular weight: 108), phenoxyethanol (molecular weight: 138), 2-phenylethanol (molecular weight: 122), and 3-phenyl-1. -Propanol (molecular weight: 136), cinnamon alcohol (molecular weight: 134), ethylene glycol benzyl ether (molecular weight: 152), diethylene glycol phenyl ether (molecular weight: 182), diethylene glycol benzyl ether (molecular weight: 196) ), 4-phenyl-1-butanol (molecular weight: 150), triclosan (molecular weight: 290), dicloxacin (molecular weight: 255), and isopropylmethylphenol (molecular weight: 150) Above, from the viewpoints of fungicidal effect and formulation stability, it is preferably selected from benzyl alcohol, phenoxyethanol, diethylene glycol phenyl ether, trichloro sand, dichloro sand, and isopropyl methylphenol. One or more kinds are more preferably one or more kinds selected from benzyl alcohol and phenoxyethanol.

＜ (c1) component ＞
The component (c1) of the present invention is one or more surfactants selected from betaine-type surfactants and amine oxide-type surfactants. Specifically, the (c1) component includes one or more surfactants selected from the group consisting of sulfobetaine, carbonylbetaine, and amine oxide. From the viewpoint of formulation stability, the (c1) component is preferably one or more surfactants selected from carbonyl betaine and amine oxide.

Examples of the sulfobetaine include an N-alkyl-N, N-dimethyl-N-sulfopropane having a carbon number of an alkyl group of preferably 10 or more, more preferably 18 or less, and more preferably 14 or less. Ammonium sulfobetaine; N-alkyl-N, N-dimethyl-N- (2-hydroxyl group having a carbon number of an alkyl group of preferably 10 or more, more preferably 18 or less, more preferably 14 or less Sulfopropyl) ammonium sulfobetaine; N-alkylfluorenylaminopropyl-N, N-dicarbonate having an alkyl group having a carbon number of preferably 10 or more, more preferably 18 or less, more preferably 14 or less Methyl-N-sulfopropylammonium sulfobetaine; N-alkylfluorenylaminopropyl-N having a carbon number of alkyl group of preferably 10 or more, more preferably 18 or less, more preferably 14 or less , N-dimethyl-N- (2-hydroxysulfopropyl) ammonium sulfobetaine.

Examples of the carbonyl betaine include N-alkyl-N, N-dimethyl-N-carboxymethylammonium having a carbon number of an alkyl group of preferably 10 or more, more preferably 18 or less, and more preferably 14 or less. Betaine; or a compound represented by the following general formula (c11), and a compound represented by the following general formula (c11) is preferred from the viewpoint of cleaning power.

[Chemical 1]

[ ^Wherein R ^1c represents an alkyl or alkenyl group having 7 to 21 carbon atoms, R ^2c represents propylene, and R ^3c and R ^4c each independently represent an alkyl group having 1 to 3 carbon atoms]

In the general formula (c11), R ^1c is preferably an alkyl or alkenyl group having a carbon number of 9 or more, more preferably 11 or more, and preferably 15 or less, more preferably 13 or less, and preferably nonyl or decyl. Radical, undecyl, dodecyl, tridecyl. In the general formula (c11), R ^3c and R ^4c are each independently preferably a methyl group.

The amine oxide is preferably a compound of the following general formula (c12).

[Chemical 2]

[ ^Wherein R ^5c represents a hydrocarbon group having 7 to 22 carbon atoms, preferably an alkyl or alkenyl group, more preferably an alkyl group, and R ^6c and R ^{7c are the} same or different and represent an alkyl group having 1 to 3 carbon atoms . D represents an -NHC (= O)-group or -C (= O) NH- group, and E represents an alkylene group having 1 to 5 carbon atoms. m and p represent m = 0 and p = 0 or m = 1 and p = 1]

In the general formula (c12), when m = 1 and p = 1, from the viewpoint of cleaning power, R ^{5c is} preferably an alkyl group having 9 to 18 carbon atoms, and more preferably 11 to 11 carbon atoms. The alkyl group of 16 or more is more preferably an alkyl group of 11 or more and 14 or less, and still more preferably an alkyl group of 11 carbons. When m = 0 and p = 0, from the viewpoint of cleaning power, R ^{5c is} preferably an alkyl group having a carbon number of 10 to 18 and more preferably an alkyl group having a carbon number of 12 to 16. An alkyl group having 12 to 14 carbon atoms is more preferred, and an alkyl group having 12 carbon atoms is more preferred. In the present invention, m = 0 and p = 0 are preferable. From the viewpoint of cleaning power, R ^6c and R ^{7c are} preferably a methyl group having 1 carbon number.

＜ (P) component ＞
The (P) component of the present invention is a surfactant other than the (c1) component. The mold killing detergent composition for hard surfaces of the 1st aspect of this invention may contain (P) component as an arbitrary component. Examples of the component (P) include one or more types of interfaces selected from the group consisting of (c2) cationic surfactants, (c3) anionic surfactants, and (c4) non-ionic surfactants (except for component (b)). Active agent. When the (P) component is included in the mold killing detergent composition for hard surfaces of the first aspect of the present invention, the (P) component preferably contains a cation interface selected from (c2) from the viewpoint of cleaning power. One or more of an active agent and (c3) anionic surfactant.

Examples of the (c2) cationic surfactant include a quaternary ammonium salt type cationic surfactant. Examples of the quaternary ammonium salt type cationic surfactant include the following quaternary ammonium salt type cationic surfactants: Among the groups bonded to a nitrogen atom, one or two are hydrocarbon groups having a carbon number of 8 to 16 and the remainder It is a group selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, a hydroxyalkyl group having 1 to 3 carbon atoms, and an arylalkyl group (such as benzyl group). Among them, a quaternary ammonium salt type cationic surfactant having a bactericidal property is preferable, and a quaternary ammonium salt type cationic surfactant having a benzyl group is preferable in terms of sterilizing performance.

Examples of the (c3) anionic surfactant include an anionic surfactant having one or more hydrocarbon groups and one or more groups selected from the group consisting of a sulfonic acid group, a sulfate group, and a carboxylic acid group. Examples of the anionic surfactant include alkyl or alkenylbenzenesulfonic acid or a salt thereof, polyoxyalkylene alkyl or alkenyl ether sulfate or a salt thereof, alkyl or alkenyl sulfate or a salt thereof, and Fatty acids or salts thereof. From the viewpoint of cleaning power, the anionic surfactant is preferably one or more selected from the group consisting of polyoxyalkylene alkyl or alkenyl ether sulfate or a salt thereof, and fatty acid or a salt thereof. The oxyalkylene group of the polyoxyalkylene alkyl or alkenyl ether sulfate or a salt thereof is preferably an oxyethyl group. The average addition mole number of the oxyalkylene group of the polyoxyalkylene alkyl or alkenyl ether sulfate salt is preferably 1 or more and 10 or less. Examples of the fatty acid or a salt thereof include a fatty acid or a salt thereof having a carbon number of 10 to 18. The alkyl or alkenyl group of the anionic surfactant is preferably from 10 to 18 carbons. The salt is preferably an alkali metal salt such as a sodium salt or a potassium salt.

Examples of the (c4) nonionic surfactant include a polyoxyalkylene alkyl ether having an alkyl group having 10 to 18 carbon atoms, and a polyoxyalkylene alkylene having an alkenyl group having 10 to 18 carbon atoms. Ethers, polyoxyalkylene sorbitan fatty acid esters having fatty acid groups of 10 to 18 carbons, alkyl glycosides having alkyl groups of 8 to 18 carbons, and alkyls having 8 to 18 carbons Alkyl polysaccharide glycosides, sucrose fatty acid esters having fatty acid groups of 8 to 18 carbons, alkyl polyglyceryl ethers having alkyl groups of 8 to 18 carbons, and the like. Among these, from the viewpoint of cleanness, a polyoxyethylene alkyl ether having an alkyl group having 10 to 16 carbon atoms and an average ethylene oxide addition mole number of 1 to 15 is preferred. However, the component (b) is excluded from the component (c4).

＜ Composition etc. ＞
Although the action mechanism of the mold killing detergent composition for hard surfaces of the 1st aspect of this invention is unknown, it is considered as follows. It is known that the mold has a thicker cell wall on the outer side than the cell membrane. The cell wall of the mold includes a polysaccharide layer containing dextran-chitin and the like, a melanin layer, and a hydrophobin layer. It is considered that due to the existence of the cell wall, compared with general bacteria such as Escherichia coli, the fungicide has a lower permeability to the inside of the cell, and a sufficient fungicidal effect is not obtained in a short time. This is a problem. It is considered that when an aqueous solution containing the component (a) of the present invention at a specific concentration is applied to proteins such as hydrophobin, the structure of the protein is changed. As a result, the non-ionic fungicide, which is the component (b) of the present invention, kills Increased penetration in mold cells can impart a fungicidal effect. However, when this technique is applied to a detergent, the salt strength is increased by the formulation of the component (a). As a result, when a surfactant having an effect on the cleanliness of sebum dirt is prepared, the formulation is stable. Sexual problems. It is considered that in the first aspect of the present invention, the mold-killing cleaner composition for hard surfaces contains a specific amount of (c1) component and (P) component as interfacial activity due to (a) component and (b) component Agent, which can provide a mildew-resistant cleaner composition for hard surfaces having excellent fungicidal performance and sebum cleaning power and good formulation stability.

The mold killing detergent composition for hard surfaces of the first aspect of the present invention contains 0.1% by mass or more, preferably 0.5% by mass or more, and more preferably 1% by mass or more from the viewpoint of improving the fungicidal performance. (A) component, and from the viewpoint of formulation stability, the component (a) is contained in an amount of 5 mass% or less, preferably 4 mass% or less, and more preferably 3 mass% or less.

The mold killing detergent composition for hard surfaces of the first aspect of the present invention contains 0.05% by mass or more, preferably 0.1% by mass or more, and more preferably 0.5% by mass or more from the viewpoint of improving the fungicidal performance. The component (b) is more preferably 1% by mass or more, and from the viewpoint of formulation stability, it contains 7% by mass or less, preferably 5% by mass or less, more preferably 4% by mass or less, and more preferably The component (b) is preferably 3% by mass or less.

The mold killing detergent composition for hard surfaces of the first aspect of the present invention contains 0.1% by mass or more, preferably 0.5% by mass or more, and more preferably 1% by mass from the viewpoint of formulation stability and cleanability. (C1) component of not less than%, and from the viewpoint of fungicidal performance, the content of (c1) is not more than 5% by mass, preferably not more than 4% by mass, and more preferably not more than 3% by mass.

In the mold killing detergent composition for hard surfaces of the 1st aspect of this invention, content of (P) component is limited from a viewpoint of formulation stability. The mass of the content of (c1) component and the total content of (c1) component and (P) component in the viewpoint of formulation stability in the 1st aspect of the mildew-proof mold cleaning composition for hard surfaces of this invention. The ratio (c1) / [(c1) + (P)] is 0.30 or more, preferably 0.40 or more, more preferably 0.50 or more, and from the viewpoint of cleaning power, 1.0 or less, preferably 0.90 or less, It is more preferably 0.80 or less.

From the viewpoint of improving the fungicidal effect, it is preferable that the fungicidal cleaner composition for hard surface of the first aspect of the present invention contains a solvent (except component (b)) as component (d).

(d) The component is preferably one or more solvents selected from the following compounds (d1) to (d3).
(d1): aliphatic alcohol having a molecular weight of 60 to 500
(d2): aliphatic glycol ethers having a molecular weight of 60 to 500
(d3): aliphatic diol having a molecular weight of 60 to 500

(d) The component is preferably from the viewpoint of further improving the fungicidal effect and the distribution from the water phase to the bacteria, the logP value is preferably 0 or more, more preferably 0.5 or more, and the fungicidal effect and the stability of formulation From a viewpoint, a compound of 3 or less is preferable, and a compound of 2 or less is more preferable.

In the present invention, the logP value is a coefficient representing the affinity of an organic compound for water and 1-octanol. The 1-octanol / water partition coefficient P is a distribution balance when a small amount of a compound is used as a solute to dissolve in a 2-phase solvent of 1-octanol and water. The ratio of the equilibrium concentration of the compound in each solvent is generally These are expressed in the form of logP relative to the base 10. The logP values of more compounds are reported, and more values are revealed in the database that can be obtained from Daylight Chemical Information Systems, Inc. (Daylight CIS), etc., so it can be referred to. In the case where there is no measured logP value, it can be calculated by the program "CLOGP" etc. which can be obtained from Daylight CIS. When there is a measured logP value, the program outputs the value of "calculated logP (ClogP)" calculated by Hansch, Leo's fragmentation method together with it.

The fragment method is based on the chemical structure of a compound, considering the number of atoms and the type of chemical bond (cf. A. Leo, Comprehensive Medicinal Chemistry, Vol. 4, C. Hansch, PG Sammens, JBTaylor and CA Ramsden, Eds., P. 295, Pergamon Press, 1990). When selecting a compound, the ClogP value can be used instead of the measured logP value. In the present invention, if the measured value of logP exists, the measured value of logP is used, and when it does not exist, the ClogP value calculated by the program CLOGP v4.01 is used.

(D1) The aliphatic alcohol having a molecular weight of 60 to 500 may be selected from 1-propanol (molecular weight: 60, logP: 0.55), 2-propanol (molecular weight: 60, logP: 0.38), 1 -Hexanol (molecular weight: 102, logP: 1.80), 1-pentanol (molecular weight: 88, logP: 1.39), 3-pentanol (molecular weight: 88, logP: 1.36), 1-butanol (molecular weight: 74, logP: 0.97), 2-butanol (molecular weight: 74, logP: 0.87), third butanol (molecular weight: 74, logP: 0.60), cyclopentanol (molecular weight: 86, logP: 0.86), 1-heptanol (Molecular weight: 116, logP: 2.22) and 1-octanol (Molecular weight: 130, logP: 2.64), from the viewpoint of simultaneously achieving a fungicidal effect and formulation stability, it is preferably selected from 1 -One or more of propanol, 1-butanol, 2-butanol, 1-pentanol, 3-pentanol, cyclopentanol, 1-hexanol, and 1-heptanol, more preferably selected from 1- One or more of butanol, 2-butanol, 1-pentanol, 3-pentanol, and cyclopentanol, and more preferably selected from 1-butanol, 1-pentanol, 3-pentanol, and cyclopentanol One or more kinds of alcohols, and more preferably one or more kinds selected from 1-butanol, 1-pentanol, and 3-pentanol.

As the aliphatic diol ether having a molecular weight of 60 or more and 500 or less as (d2), a compound represented by the following general formula (d2) is preferable.
R ^1d O- (R ^2d O) _n -H (d2)
(In the formula, R ^1d is an aliphatic hydrocarbon group having 1 to 8 carbon atoms, R ^2d is an alkylene group having 2 or 3 carbon atoms, and n is an integer of 1 to 4)

From the viewpoint of a fungicidal effect, R ^{1d is} preferably an alkyl or alkenyl group having 3 to 6 carbon atoms. From the viewpoint of the fungicidal effect, n is preferably 3 or less, and more preferably 2 or less.

Specifically, (d2) may be selected from the group consisting of 2-ethylhexanediol (molecular weight: 174, logP: 2.46), hexanediol (molecular weight: 146, logP: 1.65), diethylene glycol hexyl ether (molecular weight: 190, logP: 1.49), dipropylene glycol butyl ether (molecular weight: 190, logP: 1.29), butyl propylene glycol (molecular weight: 132, logP: 1.13), dipropylene glycol propyl ether (molecular weight: 176, logP: 0.88), succinic acid Alcohol (molecular weight: 118, logP: 0.81), propyl propylene glycol (molecular weight: 118, logP: 0.71), diethylene glycol butyl ether (molecular weight: 162, logP: 0.66), 2-third butoxyethanol (molecular weight : 118, logP: 0.45), diethylene glycol isobutyl ether (molecular weight: 118, logP: 0.07), propylene glycol methyl ether (molecular weight: 90, logP: -0.11), and methyl glycol (molecular weight: 76, logP :: 0.43) or more, from the viewpoint of a fungicidal effect, it is preferable to select self-diol, diethylene glycol hexyl ether, butyl propylene glycol, dipropylene glycol butyl ether, butylene glycol, diethylene glycol One or more of butyl ether, dipropylene glycol propyl ether, and propyl propylene glycol, more preferably selected from diethylene glycol hexyl ether, butyl propylene glycol, dipropylene glycol propyl ether, butylene glycol, and One or more kinds of ethylene glycol butyl ether, more preferably one or more kinds selected from diethylene glycol hexyl ether, butyl propylene glycol, and butane diol, and more preferably one selected from butyl propylene glycol and butane diol More than one of them.

The aliphatic diol having a molecular weight of 60 or more and 500 or less as (d3) is preferably a compound represented by the following general formula (d3). It should be noted that (d2) is not included in (d3).
R ^3d -CH (OH)-(CH ₂ ) _q -CH ₂ OH (d3)
(In the formula, R ^3d is a hydrogen atom, an aliphatic hydrocarbon group having 1 to 8 carbons or R ^4d O, R ^4d is a hydrocarbon group having 1 to 8 carbons, and q is an integer of 0 or 1 to 6. Here, (Total carbon number in the compound is 4 or more and 10 or less)

From the viewpoint of a fungicidal effect, R ^{3d is} preferably a hydrogen atom or an alkyl or alkenyl group having 2 to 8 carbon atoms, more preferably an alkyl or alkenyl group having 3 to 8 carbon atoms, and further preferably Alkyl or alkenyl having 4 to 8 carbon atoms. R ^{4d is} preferably an alkyl or alkenyl group having 2 to 8 carbon atoms, more preferably an alkyl or alkenyl group having 3 to 8 carbon atoms, and even more preferably an alkyl or alkenyl group having 4 to 8 carbon atoms. . From the viewpoint of a fungicidal effect, q is preferably 1 or less.

Specifically, (d3) may be selected from 1,2-hexanediol (molecular weight: 118, logP: 0.85), 1,2-pentanediol (molecular weight: 104, logP: 0.43), and propylene glycol (molecular weight: 76) , LogP: 0.40), 1,6-hexanediol (molecular weight: 118, logP: 0.60), 1,2-butanediol (molecular weight: 90, logP: 0.01), 1,4-butanediol (molecular weight: 90, logP: -0.23), 1,3-butanediol (molecular weight: 90, logP: 0.-0.37), 1,5-pentanediol (molecular weight: 104, logP: 0.19), 1,2-octyl Diol (molecular weight: 146, logP: 1.68), pentyl glyceryl ether (molecular weight: 162, logP: 0.69) and 1,8-octanediol (molecular weight: 146, logP: 1.44) From the viewpoint of achieving a fungicidal effect and formulation stability, it is preferably selected from the group consisting of 1,2-hexanediol, 1,2-pentanediol, propylene glycol, pentyl glyceryl ether, and 1,6-hexanediol. One or more, more preferably one or more selected from 1,2-hexanediol, pentyl glyceryl ether, and 1,2-pentanediol, and further preferably one or more selected from 1,2-hexanediol and pentane One or more of the glycerol ethers.

From the viewpoint of enhancing the fungicidal effect, the component (d) is preferably one or more selected from the compounds of (d2) and (d3). Furthermore, it is more preferable that (d2) is a compound represented by general formula (d2), and (d3) is a compound represented by general formula (d3).

In the case where the mold killing detergent composition for a hard surface of the first aspect of the present invention contains the component (d), from the viewpoint of improving the fungicidal effect, the content is preferably 0.1% by mass or more, and more preferably 0.5. The component (d) is at least mass%, more preferably at least 0.8 mass%, and from the viewpoint of formulation stability, the content is preferably at most 12 mass%, more preferably at most 10 mass%, and even more preferably (D) component of 8 mass% or less.

From the viewpoint of improving the cleaning power, it is preferable that the mold killing detergent composition for a hard surface of the first aspect of the present invention contains a metal blocking agent as the (e) component. The metal blocking agent is preferably one or more compounds selected from the group consisting of aminocarboxylic acids, hydroxycarboxylic acids, hydroxyphosphonic acids, and salts thereof.

Examples of the aminocarboxylic acid and its salt include ethylene diamine tetraacetic acid (EDTA), nitrogen triacetic acid (NTA), iminodiacetic acid, diethylene triamine pentaacetic acid (DPTA), and N- 1 of hydroxyethyl-ethylene diamine triacetic acid (HEDTA), methyl glycine diacetic acid (MGDA), aspartic acid diacetic acid (ASDA), glutamic acid diacetic acid (GLDA), and salts thereof One or two or more. The aminocarboxylic acid and its salt are preferably one or two selected from ethylenediaminetetraacetic acid and its salt, methylglycine diacetic acid and its salt, and L-glutamic acid diacetic acid and its salt. the above.

As the hydroxycarboxylic acid and its salt, a compound selected from an aliphatic hydroxycarboxylic acid and its salt is preferable. Examples of the hydroxycarboxylic acid and a salt thereof include compounds selected from malic acid, citric acid, and a salt thereof.

Examples of the hydroxyphosphonic acid and its salt include compounds selected from 1-hydroxyethylene-1,1-diphosphonic acid (HEDP) and its salt.

Examples of the salt of the metal blocking agent include alkali metal salts, ammonium salts, and amine salts. Alkali metal salts are preferred, and sodium or potassium salts are more preferred.

(e) The component is preferably one or more selected from ethylenediaminetetraacetic acid (EDTA), methylglycine diacetic acid (MGDA), citric acid, malic acid, and salts thereof, and more preferably selected from One or more kinds of ethylenediaminetetraacetic acid (EDTA), citric acid, and salts thereof, and more preferably one or more kinds selected from ethylenediaminetetraacetic acid and salts thereof.

When the (e) component is contained in the mold killing detergent composition for hard surfaces of the first aspect of the present invention, from the viewpoint of improving the cleaning power, the content is preferably 0.1% by mass or more, and more preferably 0.5% by mass. (E) component of 1% by mass or more, more preferably 1% by mass or more, and from the viewpoint of formulation stability, the content is preferably 10% by mass or less, more preferably 8% by mass or less, and even more preferably 7%. (E) component by mass% or less.

In the first aspect of the present invention, the mildew-resistant cleaner composition for hard surfaces, in order to increase the added value of the product, fragrances, pigments, preservatives, antioxidants, etc. can be arbitrarily blended (however, the component (a) above) , (B) component, (c1) component, (P) component, (d) component, (e) component).

In the first aspect of the present invention, the mildew-resistant cleaner composition for a hard surface contains water. That is, the remainder other than (a) component, (b) component, (c1) component, and an arbitrary component is water. In the first aspect of the present invention, the mildew-resistant cleaner composition for a hard surface contains preferably 50% by mass or more, more preferably 60% by mass or more, still more preferably 70% by mass or more, and even more preferably 80% by mass. The water is preferably 99% by mass or less, and more preferably 95% by mass or less. Water is preferably ion-exchanged water or sterilized ion-exchanged water.

In the first aspect of the present invention, the mildew-resistant cleaner composition for hard surfaces is a mildew-resistant cleaner composition for hard surfaces that does not require strong alkali or strong acid. That is, even if the fungicide composition according to the first aspect of the present invention is liquid near neutral, a good fungicidal effect can be obtained. From the viewpoints of ease of handling and irritation of the skin on the hands, the first embodiment of the present invention has a pH of 5 or more, preferably 5.5 or more, at a temperature of 25 ° C. Is more preferably 6 or more, and is 9 or less, preferably 8.5 or less, and even more preferably 8 or less.

[2nd aspect]
A second aspect of the present invention is a mildew-resistant cleaner composition for a hard surface, which contains (a) component in an amount of 0.1% by mass or more and 5% by mass, (b) component in an amount of 0.05% by mass or more and 7% by mass, or 0.1 The component (c2), the component (d), and water at a mass of 5 mass% or less and a pH of 5 to 9 at 25 ° C.

＜ (a) component ＞
In the second aspect of the present invention, the water-soluble inorganic salt that is the component (a) is the same as the (a) component described in the first aspect of the present invention, and the preferable aspect is also the same.

＜ (b) component ＞
In the second aspect of the present invention, the nonionic fungicide as the component (b) is the same as the component (b) described in the first aspect of the present invention, and the preferred aspect is also the same.

＜ (c2) component ＞
In the 2nd aspect of this invention, as a cationic surfactant which becomes (c2) component, a quaternary ammonium salt type cationic surfactant is mentioned. Examples of the quaternary ammonium salt type cationic surfactant include the following quaternary ammonium salt type cationic surfactants: Among the groups bonded to a nitrogen atom, one or two are hydrocarbon groups having 6 to 18 carbon atoms, and the remainder It is a group selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, a hydroxyalkyl group having 1 to 3 carbon atoms, and an arylalkyl group (such as benzyl group). Among them, a quaternary ammonium salt type cationic surfactant having fungicidal properties and cleaning power is preferred, and a quaternary ammonium salt type cationic surfactant having a benzyl group is preferred in terms of fungicidal properties.

The cationic surfactant is preferably a quaternary ammonium salt type cationic surfactant represented by the following general formula (c2).

[Chemical 3]

[In the formula, R ^11c represents a hydrocarbon group having 6 to 18 carbon atoms. R ^12c and R ^13c each independently represent an alkyl group having 1 to 3 carbon atoms. R ^14c represents an alkylene group having 1 to 3 carbon atoms. Z ^- represents an anionic group]

In the general formula (c2), from the viewpoint of improving the fungicidal effect due to the distribution in the bacterial cells and the viewpoint of formulation stability, R ^11c is preferably a carbon number of 8 or more, and more preferably 14 The hydrocarbon group is preferably 10 or less, preferably an alkyl or alkenyl group, and more preferably an alkyl group. In the general formula (c2), R ^12c and R ^13c are each independently an alkyl group having 1 to 3 carbon atoms, preferably an alkyl group having 1 to 2 carbon atoms, and more preferably a methyl group. In the general formula (c2), R ^14c is an alkylene group having 1 to 3 carbon atoms, preferably an alkylene group having 1 to 2 carbon atoms, and more preferably a methylene group. Moreover, as Z <^-> in General formula (c2), a halogen ion, such as a chloride ion, is preferable. As Z ^-, more preferably a chloride ion (Cl ^-).

＜ (d) component ＞
In the second aspect of the present invention, the solvent used as the component (d) is the same as the (d) component described in the first aspect of the present invention, and the preferable aspect is also the same.

＜ Composition etc. ＞
Although the mechanism of action of the fungicidal cleaner composition for hard surfaces of the 2nd aspect of this invention is unknown, it is considered as follows. It is known that the mold has a thicker cell wall on the outer side than the cell membrane. The cell wall of the mold includes a polysaccharide layer containing dextran-chitin and the like, a melanin layer, and a hydrophobin layer. It is considered that due to the existence of the cell wall, compared with general bacteria such as Escherichia coli, the fungicide has a lower permeability to the inside of the cell, and a sufficient fungicidal effect is not obtained in a short time. This is a problem. It is considered that when an aqueous solution containing the component (a) of the present invention at a specific concentration is applied to proteins such as hydrophobin, the structure of the protein is changed. As a result, the mold is a nonionic fungicide that is the component (b) of the present invention. Increased penetration into cells can impart a fungicidal effect. However, in the case of applying this technology to a detergent, the salt strength is increased by the blending of the component (a). As a result, when a surfactant having an effect on the cleanliness of sebum dirt is prepared, fungicidal is generated. The problem of reduced effectiveness. It is considered that in the second aspect of the present invention, the mildew-resistant cleaner composition for hard surfaces can provide the components (c) and (d) in a specific amount because of the components (a) and (b), thereby providing Mildew cleaning composition for hard surfaces excellent in fungicidal performance and sebum cleaning power.

In the second aspect of the present invention, the mold killing detergent composition for hard surfaces contains 0.1% by mass or more, preferably 0.5% by mass or more, and more preferably 1.0% by mass or more from the viewpoint of the fungicidal effect. (a) component, and from the viewpoint of formulation stability, the component (a) is contained in an amount of 5 mass% or less, preferably 4 mass% or less, and more preferably 3 mass% or less.

From the viewpoint of the fungicidal effect, the fungicidal cleaner composition for hard surface of the second aspect of the present invention contains 0.05% by mass or more, preferably 0.1% by mass or more, more preferably 0.5% by mass or more, The component (b) is more preferably 1.0% by mass or more, and from the viewpoint of formulation stability, it contains 7% by mass or less, preferably 5% by mass or less, more preferably 4% by mass or less, and still more preferably It is (b) component of 3 mass% or less.

From the viewpoint of a fungicidal effect and a cleaning power, the second aspect of the present invention contains a fungicidal cleaner composition for hard surfaces of 0.1% by mass or more, preferably 0.3% by mass or more, and more preferably 0.5% by mass or more. The component (c2) is more preferably 0.75% by mass or more, 5% by mass or less, preferably 4% by mass or less, and more preferably 3% by mass or less.

In the second aspect of the present invention, the mold killing detergent composition for a hard surface contains 0.1% by mass or more, more preferably 0.5% by mass or more from the viewpoint of the fungicidal effect and the cleaning power, and furthermore The component (d) is preferably 1 mass% or more, and from the viewpoint of formulation stability, the content is preferably 10 mass% or less, more preferably 8 mass% or less, and further preferably 7 mass% or less ( d) ingredients.

In the second aspect of the present invention, the mold killing detergent composition for hard surfaces, from the viewpoint of the mold killing effect and the cleaning power, the total content is preferably 0.2% by mass or more, more preferably 0.5% by mass or more, and further The (c2) component and (d) component are preferably 1.5 mass% or more, and from the viewpoint of formulation stability, the total content is preferably 12 mass% or less, more preferably 10 mass% or less, and further preferably The component (c2) and the component (d) are 8 mass% or less.

In the second aspect of the present invention, the fungicidal cleaner composition for a hard surface may contain a surfactant other than the component (c2) as the component (Q). Examples of the component (Q) include one or more surfactants selected from the group consisting of (c1) betaine-type surfactants and amine oxide-type surfactants, (c3) anionic surfactants, and (c4) non-ionic surfactants. One or more surfactants among ionic surfactants.

In the second aspect of the present invention, as the component (c1), one or more surfactants selected from betaine-type surfactants and amine oxide-type surfactants are the same as in the first aspect of the present invention. The components (c1) are the same, and their preferred aspects are also the same.

In the second aspect of the present invention, the anionic surfactant as the component (c3) is the same as the (c3) component described in the first aspect of the present invention, and the preferable aspect is also the same.

In the second aspect of the present invention, the nonionic surfactant as the component (c4) is the same as the (c4) component described in the first aspect of the present invention, and the preferred aspect is also the same.

In the second aspect of the present invention, in the case of containing the (Q) component, the mold killing detergent composition for hard surfaces, the content of the (Q) component is appropriately adjusted from the viewpoint of improving the fungicidal effect and cleaning power. content. The mass of the content of (c2) component and the total content of (c2) component and (Q) component in the mold-killing cleaner composition for hard surfaces of the 2nd aspect of this invention from a viewpoint of a fungicidal effect The ratio (c2) / [(c2) + (Q)] is preferably 0.1 or more, more preferably 0.2 or more, even more preferably 0.3 or more, and still more preferably 0.4 or more. From the viewpoint of cleaning power, It is preferably 1 or less, more preferably 0.9 or less, and even more preferably 0.8 or less.

From the viewpoint of improving the cleaning power, it is preferable that the mold killing detergent composition for hard surface of the second aspect of the present invention contains a metal blocking agent as the (e) component. In the second aspect of the present invention, the metal blocking agent as the (e) component is the same as the (e) component described in the first aspect of the present invention, and the preferable aspect is also the same.

When the (e) component is contained in the mold killing detergent composition for hard surfaces of the 2nd aspect of this invention, from a viewpoint of improving a cleaning power, it is preferable that it is 0.2 mass% or more, and 0.5 mass is more preferable (E) component of 1% by mass or more, more preferably 1% by mass or more, and from the viewpoint of formulation stability, the content is preferably 6% by mass or less, more preferably 5% by mass or less, and further preferably 4% by mass. (E) component by mass% or less.

In the second aspect of the present invention, the mildew-resistant cleaner composition for hard surfaces, in order to increase the added value of the product, fragrances, pigments, preservatives, antioxidants, etc. can be arbitrarily blended (however, the component (a) above) , (B) component, (c2) component, (Q) component, (d) component, (e) component).

In the second aspect of the present invention, the mold killing detergent composition for hard surfaces contains water. That is, the remainder other than (a) component, (b) component, (c2) component, (d) component and arbitrary components is water. In the second aspect of the present invention, the mildew-resistant cleaner composition for a hard surface contains preferably 50% by mass or more, more preferably 60% by mass or more, still more preferably 70% by mass or more, and even more preferably 80% by mass. The water is preferably 99% by mass or less, and more preferably 95% by mass or less. Water is preferably ion-exchanged water or sterilized ion-exchanged water.

In the second aspect of the present invention, the mildew-resistant cleaner composition for hard surfaces is a mildew-resistant cleaner composition for hard surfaces that does not require strong alkali or strong acid. That is, even if the fungicide composition according to the second aspect of the present invention is liquid near neutrality, a good fungicidal effect can be obtained. From the viewpoints of ease of operation and irritation of the skin on the hands, the second aspect of the present invention has a pH of 5 or more at 25 ° C, preferably 5.5 or more Is more preferably 6 or more, and is 9 or less, preferably 8.5 or less, and even more preferably 8 or less.

[Third aspect]
A third aspect of the present invention is a mildew-resistant cleaner composition for a hard surface, which contains (a) component in an amount of 0.1% by mass to 5% by mass, (b) component in an amount of 0.05% by mass to 7% by mass, ( c4) Ingredients and water, and the total content of (a) component and (b) component is 1.5% by mass or more and 10% by mass or less, and the total content of the surfactant is 10% by mass or less. The hard surface is a mildew-proof cleaner The pH of the composition did not reach 12 at 25 ° C.

＜ (a) component ＞
In the third aspect of the present invention, the water-soluble inorganic salt that is the component (a) is the same as the (a) component described in the first aspect of the present invention, and the preferable aspect is also the same.

＜ (b) component ＞
In the third aspect of the present invention, the non-ionic fungicide as the component (b) is the same as the component (b) described in the first aspect of the present invention, and the preferable aspect is also the same.

In the third aspect of the present invention, as the non-ionic surfactant (other than the component (b)) serving as the component (c4), polyoxyalkylenes having an alkyl group having 8 to 18 carbon atoms can be cited. Alkyl alkyl ethers, polyoxyalkylene alkenyl ethers having alkenyl groups of 8 to 18 carbons, polyoxyalkylene sorbitan fatty acid esters having fatty acid groups of 8 to 18 carbons, having carbon Alkyl glycosides having an alkyl group having a number of 8 or more and 18 or less, alkyl polyglycosides having an alkyl group having a carbon number of 8 or more and 18 or less, sucrose fatty acid esters having a fatty acid group having a carbon number of 8 or more and 18 or less, and 8 or more carbon atoms Alkyl polyglyceryl ethers having an alkyl group of 18 or less may be used alone or in combination of two or more. Among these, from the viewpoint of cleanness, a polyoxyethylene alkyl ether having an alkyl group having 8 to 18 carbons and an average addition mole number of ethylene oxide to 2 to 50 is preferred.

From the viewpoint of cleaning power, the component (c4) of the present invention is preferably a nonionic surfactant represented by the following general formula (c4).
R ^21c -O-[(C ₂ H ₄ O) _s (C ₃ H ₆ O) _t ] -H (c4)
[In the formula, R ^21c is an alkyl or alkenyl group having 8 or more carbon atoms, preferably 10 or more carbon atoms, and 18 or less carbon atoms, and preferably 16 or less carbon atoms. s and t are average addition mole numbers, and s is 2 or more, preferably 4 or more, more preferably 6 or more, further preferably 10 or more, and 50 or less, preferably 40 or less, and more preferably 20 In the following numbers, t is a number of 0 or more, preferably 1 or more, and 5 or less, preferably 3 or less, and t may also be 0. (C ₂ H ₄ O) and (C ₃ H ₆ O) can be random polymers or block polymers]

＜ Composition etc. ＞
Although the mechanism of action of the fungicidal cleaner composition for hard surfaces of the 3rd aspect of this invention is unknown, it is considered as follows. It is known that the mold has a thicker cell wall on the outer side than the cell membrane. The cell wall of the mold includes a polysaccharide layer containing dextran-chitin and the like, a melanin layer, and a hydrophobin layer. It is considered that due to the existence of the cell wall, compared with general bacteria such as Escherichia coli, the fungicide has a lower permeability to the inside of the cell, and a sufficient fungicidal effect is not obtained in a short time. This is a problem. It is considered that when an aqueous solution containing the component (a) of the present invention at a specific concentration is applied to proteins such as hydrophobin, the structure of the protein is changed. As a result, the mold is a nonionic fungicide that is the component (b) of the present invention. Increased penetration into cells can impart a fungicidal effect. However, when the technology is applied to a cleaning agent, if a surfactant is contained, there is a problem that the fungicidal effect is impaired. The reason is considered to be that the component (b) was absorbed into the surfactant. It is considered that in the third aspect of the present invention, the mildew-resistant cleaner composition for hard surfaces, by containing a specific amount of a specific surfactant in the components (a) and (b), can provide fungicidal properties and Mildew cleaning composition for hard surfaces excellent in sebum cleaning power.

The mold killing detergent composition for hard surfaces of the third aspect of the present invention contains 0.1% by mass or more, preferably 0.5% by mass or more, and more preferably 1% by mass or more from the viewpoint of enhancing the fungicidal effect. (A) component, and from the viewpoint of formulation stability, it contains 5 mass% or less, preferably 4 mass% or less, more preferably 3 mass% or less, and further preferably 1.5 mass% or less (a )ingredient.

From the viewpoint of enhancing the fungicidal effect, the fungicidal cleaner composition for hard surface of the third aspect of the present invention contains 0.05% by mass or more, preferably 0.1% by mass or more, and more preferably 0.5% by mass or more The component (b) is more preferably 1% by mass or more, and from the viewpoint of formulation stability, it contains 7% by mass or less, preferably 5% by mass or less, more preferably 4% by mass or less, and more preferably The component (b) is preferably 3% by mass or less.

The total content of (a) component and (b) component in the 3rd aspect mold-hardening | cleaning agent cleaning composition for hard surfaces of this invention is 1.5 mass% or more from a viewpoint of improving a fungicidal effect, It is preferably 1.8% by mass or more, more preferably 2% by mass or more, and 10% by mass or less, more preferably 8% by mass or less, and even more preferably 7% by mass or less from the viewpoint of formulation stability.

The mold killing detergent composition for hard surfaces of the third aspect of the present invention contains 0.1 mass% or more, more preferably 0.2 mass% or more, and further preferably 0.5 mass from the viewpoint of cleaning power. The component (c4) is not less than 10%, and from the viewpoint of a fungicidal effect, the content is preferably 10% by mass or less, more preferably 8% by mass or less, further preferably 6% by mass or less, and even more preferably 3%. (C4) component by mass% or less.

In the third aspect of the present invention, the mold-killing cleaner composition for hard surfaces, the mass ratio (b) / (c4) of the content of the component (b) to the content of the component (c4) has the fungicidal effect. From a viewpoint, it is preferably 0.2 or more, more preferably 0.5 or more, and even more preferably 1 or more. From the viewpoint of formulation stability, it is preferably 9 or less, more preferably 7 or less, and even more preferably 5 or less, more preferably 4 or less.

In the third aspect of the present invention, it is preferred that the mildew-resistant cleaner composition for a hard surface contains a solvent (except the component (b)) as the component (d). The solvent as the component (d) is the same as the component (d) described in the first aspect of the present invention, and the preferable aspect is also the same.

In the case where the (3) component is contained in the mold killing detergent composition for hard surfaces of the third aspect of the present invention, from the viewpoint of the fungicidal effect, the content is preferably 0.1% by mass or more, and more preferably 0.5% by mass. The component (d) is not less than 0.8% by mass, and more preferably not less than 0.8% by mass. From the viewpoint of formulation stability, the content is preferably not more than 12% by mass, more preferably not more than 10% by mass, and even more preferably 8%. (D) component in mass% or less.

In the third aspect of the present invention, the fungicidal cleaner composition for a hard surface may contain a surfactant other than the component (c4) as the component (R). Examples of the (R) component include one or more surfactants selected from the group consisting of (c1) betaine-type surfactants and amine oxide-type surfactants, (c2) cationic surfactants, and (c3) anions. One or more surfactants among the surfactants.

In the third aspect of the present invention, as the component (c1), one or more surfactants selected from betaine-type surfactants and amine oxide-type surfactants are the same as in the first aspect of the present invention. The components (c1) are the same, and their preferred aspects are also the same.

In the third aspect of the present invention, the cationic surfactant as the component (c2) is the same as the (c2) component described in the first aspect of the present invention, and the preferable aspect is also the same.

In the third aspect of the present invention, the anionic surfactant as the component (c3) is the same as the (c3) component described in the first aspect of the present invention, and the preferable aspect is also the same.

The mold killing detergent composition for hard surfaces in the third aspect of the present invention may also contain the (R) component. However, the mold killing detergent composition for hard surfaces is restricted from the viewpoint of the fungicidal effect. Total content of surfactant. In the third aspect of the present invention, in the mold killing detergent composition for hard surfaces, the total content of the surfactant (the total content of the (c4) component and the (R) component) from the viewpoint of the fungicidal effect is 10 mass% or less, preferably 9 mass% or less, more preferably 8 mass% or less, still more preferably 6 mass% or less, and even more preferably 4 mass% or less.

From the viewpoint of cleansing power, the mold killing detergent composition for a hard surface of the third aspect of the present invention preferably contains a metal blocking agent as the (e) component. In the third aspect of the present invention, the metal blocking agent as the (e) component is the same as the (e) component described in the first aspect of the present invention, and the preferable aspect is also the same.

In the case where the mold killing detergent composition for a hard surface of the third aspect of the present invention contains the component (e), from the viewpoint of cleaning power, the content is preferably 0.1% by mass or more, more preferably 0.5% by mass The above (e) component is more preferably 1% by mass or more, and from the viewpoint of formulation stability, the content is preferably 10% by mass or less, more preferably 8% by mass or less, and further preferably 7% by mass. (E) component below%.

In the third aspect of the present invention, the mildew-resistant cleaner composition for hard surfaces, in order to increase the added value of the product, fragrances, pigments, preservatives, antioxidants, etc. can be arbitrarily blended (however, the component (a) above) , (B) component, (c4) component, (R) component, (d) component, (e) component).

In a third aspect of the present invention, the mildew-resistant cleaning composition for hard surfaces contains water. That is, the remainder other than (a) component, (b) component, (c4) component, and arbitrary components is water. In the third aspect of the present invention, the mold killing detergent composition for a hard surface preferably contains 50% by mass or more, more preferably 60% by mass or more, more preferably 70% by mass or more, and even more preferably 80% by mass. The water is preferably 99% by mass or less, and more preferably 95% by mass or less. Water is preferably ion-exchanged water or sterilized ion-exchanged water.

In the third aspect of the present invention, the mildew-resistant cleaner composition for hard surfaces is a mildew-resistant cleaner composition for hard surfaces that does not require strong alkali or strong acid. That is, even if the fungicide composition according to the third aspect of the present invention is liquid near neutral, a good fungicidal effect can be obtained. From the viewpoints of ease of handling and irritation of the skin on the hands, the third aspect of the present invention has a pH of 5 or more at 25 ° C, and more preferably 5.5 or more, further preferably 6 or more, and less than 12, preferably 9 or less, more preferably 8.5 or less, and still more preferably 8 or less.

[4th aspect]
A fourth aspect of the present invention is a mildew-resistant cleaner composition for a hard surface, which contains (a) component in an amount of 0.1 mass% to 5 mass%, (b) component in an amount of 0.05 mass% to 7 mass%, 0.01 (E) component, water, and optional (S) component in an amount of not less than 7% by mass, and the content of the (S) component is not more than 10% by mass. The pH value is 5 or more and 9 or less.

＜ (a) component ＞
In the fourth aspect of the present invention, the water-soluble inorganic salt that is the component (a) is the same as the (a) component described in the first aspect of the present invention, and the preferable aspects are also the same.

＜ (b) component ＞
In the fourth aspect of the present invention, the non-ionic fungicide as the component (b) is the same as the component (b) described in the first aspect of the present invention, and preferred aspects thereof are also the same.

＜ (e) component ＞
The component (e) of the present invention is a metal blocking agent. The metal blocking agent is preferably one or more compounds selected from the group consisting of aminocarboxylic acids, hydroxycarboxylic acids, hydroxyphosphonic acids, and salts thereof.

Examples of the aminocarboxylic acid and its salt include ethylene diamine tetraacetic acid (EDTA), nitrogen triacetic acid (NTA), iminodiacetic acid, diethylene triamine pentaacetic acid (DPTA), and N- 1 of hydroxyethyl-ethylene diamine triacetic acid (HEDTA), methyl glycine diacetic acid (MGDA), aspartic acid diacetic acid (ASDA), glutamic acid diacetic acid (GLDA), and salts thereof One or two or more. The aminocarboxylic acid and its salt are preferably one or two selected from ethylenediaminetetraacetic acid and its salt, methylglycine diacetic acid and its salt, and L-glutamic acid diacetic acid and its salt. the above.

As the hydroxycarboxylic acid and its salt, a compound selected from an aliphatic hydroxycarboxylic acid and its salt is preferable. Examples of the hydroxycarboxylic acid and a salt thereof include compounds selected from malic acid, citric acid, and a salt thereof.

Examples of the hydroxyphosphonic acid and its salt include compounds selected from 1-hydroxyethylene-1,1-diphosphonic acid (HEDP) and its salt.

Examples of the salt of the metal blocking agent include alkali metal salts, ammonium salts, and amine salts. Alkali metal salts are preferred, and sodium or potassium salts are more preferred.

(e) The component is preferably one or more selected from ethylenediaminetetraacetic acid (EDTA), methylglycine diacetic acid (MGDA), malic acid, citric acid, and salts thereof, and more preferably selected from One or more of ethylenediaminetetraacetic acid (EDTA), citric acid, and salts thereof, and more preferably ethylenediaminetetraacetic acid, citric acid, and salts thereof.

＜ Composition etc. ＞
Although the mechanism of action of the fungicidal cleaner composition for hard surfaces of the 4th aspect of this invention is unknown, it is considered as follows. It is known that the mold has a thicker cell wall on the outer side than the cell membrane. The cell wall of the mold includes a polysaccharide layer containing dextran-chitin chitin and the like, a melanin layer, a hydrophobin layer, and the like. It is considered that due to the existence of the cell wall, compared with general bacteria such as Escherichia coli, the fungicide has a lower permeability to the inside of the cell, and a sufficient fungicidal effect is not obtained in a short time. This is a problem. It is considered that when an aqueous solution containing the component (a) of the present invention at a specific concentration is applied to proteins such as hydrophobin, the structure of the protein is changed. As a result, the mold is a nonionic fungicide that is the component (b) of the present invention. Increased penetration into cells can impart a fungicidal effect. However, when the technology is applied to a cleaning agent, if a surfactant is contained, there is a problem that the fungicidal effect is impaired. The reason is considered to be that the component (b) was absorbed into the surfactant. It is considered that in the fourth aspect of the present invention, the mildew-killing cleaner composition for hard surfaces contains a specific amount of a metal blocking agent as the (e) component because the component (a) and the component (b) further contain Containing a surfactant, or even containing a small amount of a surfactant, can provide a mold killing detergent composition for hard surfaces which is excellent in mold killing performance and soap residue dirt cleaning power.

From the viewpoint of enhancing the fungicidal effect, the fungicidal cleaner composition for hard surface of the fourth aspect of the present invention contains 0.1% by mass or more, preferably 0.3% by mass or more, and more preferably 0.5% by mass or more. (A) component, and from the viewpoint of formulation stability, it contains 5% by mass or less, preferably 4% by mass or less, more preferably 3% by mass or less, further preferably 2% by mass or less, further more The component (a) is preferably 1% by mass or less.

In the fourth aspect of the present invention, the mold killing detergent composition for hard surfaces contains 0.05% by mass or more, preferably 0.1% by mass or more, and more preferably 0.5% by mass or more from the viewpoint of enhancing the fungicidal effect. The component (b) is more preferably 1% by mass or more, and from the viewpoint of formulation stability, it contains 7% by mass or less, preferably 5% by mass or less, more preferably 4% by mass or less, and more preferably The component (b) is preferably 3% by mass or less.

In the fourth aspect of the present invention, the mold killing detergent composition for hard surfaces contains 0.01% by mass or more, preferably 0.1% by mass or more, and more preferably 0.5% by mass or more from the viewpoint of improving the cleaning power. (e) component, and from the viewpoint of formulation stability, (e) contains 7 mass% or less, preferably 6 mass% or less, more preferably 5 mass% or less, and further preferably 2 mass% or less ingredient.

The fourth aspect of the present invention, the mildew-resistant cleaner composition for a hard surface may contain a surfactant as an optional (S) component. Examples of the surfactant of the (S) component include (c1) one or more surfactants selected from betaine-type surfactants and amine oxide-type surfactants, (c2) cationic surfactants, (c3) one or more kinds of anionic surfactants and (c4) nonionic surfactants (except component (b)).

In the fourth aspect of the present invention, as the component (c1), one or more surfactants selected from the group consisting of betaine-type surfactants and amine oxide-type surfactants are the same as in the first aspect of the present invention. The components (c1) are the same, and their preferred aspects are also the same.

In the fourth aspect of the present invention, the cationic surfactant as the component (c2) is the same as the (c2) component described in the first aspect of the present invention, and the preferable aspect is also the same.

In the fourth aspect of the present invention, the anionic surfactant as the component (c3) is the same as the (c3) component described in the first aspect of the present invention, and the preferable aspect is also the same.

In the fourth aspect of the present invention, the nonionic surfactant as the component (c4) is the same as the (c4) component described in the first aspect of the present invention, and the preferred aspect is also the same.

In the fourth aspect of the present invention, the mold killing detergent composition for hard surfaces may contain the (S) component. However, from the viewpoint of the fungicidal effect, the mold killing detergent composition for hard surfaces ( S) The content of ingredients is limited. In the fourth aspect of the present invention, in the mold killing detergent composition for hard surfaces, the content of the (S) component is 10% by mass or less, more preferably 7% by mass or less, from the viewpoint of the fungicidal effect. It is preferably 5 mass% or less, more preferably 4 mass% or less, and even more preferably 3 mass% or less.

In the 4th aspect of the present invention, a mold killing detergent composition for hard surfaces, regarding the mass ratio (S) / (e) of the content of the (e) component to the content of the (S) component, from the viewpoint of cleaning power It is preferably 0 or more, more preferably 0.2 or more, and further preferably 0.4 or more, and from the viewpoint of a fungicidal effect, it is preferably 10 or less, more preferably 7 or less, and even more preferably 5 Hereinafter, it is more preferably 2 or less.

From the viewpoints of a fungicidal effect and a cleansing power, it is preferable that the fungicidal cleaner composition for a hard surface of the fourth aspect of the present invention contains a solvent (except (b) component) as the (d) component. The solvent as the component (d) is the same as the component (d) described in the first aspect of the present invention, and the preferable aspect is also the same.

In the case where the mold killing detergent composition for a hard surface of the fourth aspect of the present invention contains the component (d), from the viewpoint of improving the fungicidal effect and improving the cleaning power, the content is preferably 0.1% by mass or more, The component (d) is more preferably 0.5% by mass or more, and still more preferably 1% by mass or more, and from the viewpoint of formulation stability, the content is preferably 10% by mass or less, more preferably 9% by mass or less, The component (d) is more preferably 8% by mass or less.

In the fourth aspect of the present invention, in the mold killing detergent composition for hard surfaces, in order to increase the added value of the product, fragrances, pigments, preservatives, antioxidants, etc. can be arbitrarily blended (however, the component (a) , (B) component, (e) component, (S) component, (d) component).

In a fourth aspect of the present invention, the mildew-resistant cleaner composition for a hard surface contains water. That is, the remainder other than the components (a), (b), (e), and optional components is water. In the fourth aspect of the present invention, the mildew-resistant cleaner composition for a hard surface contains preferably 50% by mass or more, more preferably 60% by mass or more, still more preferably 70% by mass or more, and even more preferably 80% by mass. The water is preferably 99% by mass or less, and more preferably 95% by mass or less. Water is preferably ion-exchanged water or sterilized ion-exchanged water.

The 4th aspect of the present invention is a mold killing detergent composition for hard surfaces, which is a mold killing detergent composition for hard surfaces that does not require strong alkali or strong acid. That is, even if the fungicide composition according to the fourth aspect of the present invention is liquid near neutrality, a good fungicidal effect can be obtained. From the viewpoints of ease of handling and irritation of the skin on the hands, the fourth aspect of the present invention has a pH of 5 or more at 25 ° C, preferably 5.5 or more, at the mildew-resistant cleaner composition for hard surfaces. , More preferably 6 or more, and 9 or less, more preferably 8.5 or less, and even more preferably 8 or less.

Hereinafter, the first aspect, the second aspect, the third aspect, and the fourth aspect of the present invention will be described in common.

The mildew-resistant cleaner composition for hard surfaces of the present invention is preferably used for hard surfaces in bathrooms, bathtubs, washbasins, tiles, dressing rooms, washbasins, mirrors, sinks around kitchens, countertops, around tap water pipes, and the like. Clean, ideal for bathroom use. Here, the bathroom is used not only for the bathroom, but also for objects with a hard surface existing in the bathroom, such as a bathtub and a washbasin.

The mold-killing cleaner composition for hard surfaces of the present invention has excellent mold-killing effects on molds. For example, the genus Cladosporium, Aspergillus, Candida, Penicillium, Alternaria, Phoma, Gold Bacillus spp. (Aureobasidium) is a representative fungus that exhibits a high fungicidal effect. In addition, Pseudomonas such as Saccharomyces, Rhodotorula, Pichia, Pseudomonas aeruginosa, Pseudomonas putida, etc. (Pseudomonas) bacteria, Escherichia coli, Alcaligenes faecalis, Klebsiellapneumoniae, Proteus vulgaris, Serratia marcescense, methyl Gram-negative bacteria such as Methylobacterium; Gram-positive bacteria represented by Staphylococcusaureus also exhibit high bactericidal effects.

[Hard surface treatment method]
The hard surface treatment method of the present invention is a hard surface treatment method in which the mold-killing cleaner composition for hard surfaces of the present invention is brought into contact with a hard surface where mold is present, and at the same time, mildew and cleaning are performed. In the present invention, the surface of the hard surface of the present invention can be cleaned after being brought into contact with the hard surface cleansing composition. Further, in the present invention, the hard surface can be cleaned by a cleaning article having the fungicide composition for hard surfaces of the present invention carried on a substrate. As the hard surface, a hard surface such as a bathroom, a bathtub, a washbasin, a tile, a dressing room, a washbasin, a mirror, a sink around a kitchen, a counter top, and a periphery of a water pipe is preferred.

Specifically, the hard surface treatment method of the present invention may be preferably exemplified by contacting the mold killing detergent composition for hard surface of the present invention with a hard surface in the form of a dope, or by using the hard surface as described above. The fungicide composition is in the form of a stock solution, and is in contact with the hard surface without being diluted, that is, the fungicide composition for the hard surface is not contacted with the hard surface without being diluted. Furthermore, the hard surface treatment method which does not dilute the said mold-molding cleaner composition for hard surfaces, and contacts the hard surface to which mold | mold adhered is mentioned. Moreover, as a method of contacting a hard surface, a method of coating on a hard surface is preferable. The contact with the hard surface without diluting the mold killer cleaning composition for a hard surface is not intentionally diluting the mold killer cleaning composition for a hard surface with water or the like, and then contacting the hard surface. For example, it can be understood that when the mold killing detergent composition for a hard surface is brought into contact with a hard surface to which water droplets are attached, or after the mold killing cleaner composition for a hard surface is brought into contact with a hard surface, water droplets are adhered to the hard surface. In this case, the above-mentioned mold killing detergent composition for a hard surface is not diluted and brought into contact with the hard surface.

The hard surface treatment method of the present invention can be directly coated or sprayed from a bottle in order to make the above-mentioned mold killing detergent composition for hard surface contact with the hard surface in the form of a stock solution. As a bottle, for example, squeeze bottles and spray bottles Wait. In addition, when using a cleaning article impregnated with the mold killing detergent composition for a hard surface of the present invention, the mold killing detergent composition for a hard surface of the present invention may be sprayed on the object to be cleaned or the above cleaning Use the item on one side. By using this method, a wider area can be cleaned.

In addition, a thick composition containing the essential ingredients and optional ingredients of the present invention can also be prepared, and the thick composition of the present invention can be prepared by diluting the thick composition with water, and contacted with the hard surface. That is, it can also be a hard surface treatment method in which a thick composition containing the essential ingredients and optional ingredients of the present invention is diluted with water to prepare a mildew-resistant cleaner composition for hard surfaces of the present invention, without diluting the hard surface. The fungicidal cleaner composition comes into contact with a hard surface.

From the standpoint of the fungicidal effect, the contact time of the fungicidal cleaner composition for hard surfaces of the present invention in contact with the hard surfaces on which mold is present is preferably 30 seconds or more, more preferably 1 minute or more, It is more preferably 2 minutes or more, further preferably 3 minutes or more, even more preferably 4 minutes or more, and even more preferably 5 minutes or more. From the viewpoint of efficient cleaning, it is preferably 30 minutes or less. It is more preferably 20 minutes or less, and even more preferably 10 minutes or less. After standing, it is usually washed with water. At the time of washing, mechanical force (physical force) can be applied by hand or the like, and washing can be performed only by water flow. The temperature at the time of standing may be room temperature, and examples thereof include 10 ° C to 30 ° C.

Regarding the embodiment described above, the present invention further discloses the following mildew-resistant cleaner composition for a hard surface and a hard surface treatment method.

＜ 1A ＞
A fungicidal cleaner composition for a hard surface, which contains (a) a water-soluble inorganic salt [hereinafter, referred to as (a) component] of 0.1% by mass or more and 5% by mass or less, and 0.05% by mass or more and 7% by mass or less ( b) Non-ionic fungicide [hereinafter, referred to as (b) component], (c1) at least 0.1% by mass and 5% by mass or less (c1) one or more selected from betaine-type surfactants and amine oxide-type surfactants Surface active agent [hereinafter, referred to as (c1) component], any surface active agent other than (P) (c1) component [hereinafter, referred to as (P) component], and water, and the content of (c1) component and (c1) The mass ratio of the total content of the components and (P) components (c1) / [(c1) + (P)] is 0.30 or more and 1.0 or less, and the pH of the mold killing detergent composition for hard surfaces at 25 ° C The value is 5 or more and 9 or less.

＜ 2A ＞
The fungicidal cleaner composition for hard surfaces according to the above <1A>, wherein the component (a) is selected from the group consisting of alkali metal sulfate, alkaline earth metal sulfate, ammonium sulfate, alkali metal sulfite, and alkaline earth metal sulfite , Alkali metal halides, alkaline earth metal halides, alkali metal nitrates, alkaline earth metal nitrates, alkali metal carbonates, alkaline earth metal carbonates, alkali metal phosphates, alkaline earth metal phosphates, alkali metal thiocyanates, and alkaline earth metals One or more water-soluble inorganic salts of thiocyanate are preferably one or more water-soluble inorganic salts selected from alkali metal sulfate, alkaline earth metal sulfate, alkali metal halide and alkaline earth metal halide. One or more water-soluble inorganic salts selected from the group consisting of alkali metal sulfates, alkaline earth metal sulfates, alkali metal chlorides, and alkaline earth metal chlorides, more preferably selected from alkali metal sulfates and alkali metal chlorides One or more of these are water-soluble inorganic salts, and more preferably alkali metal sulfates.

＜ 3A ＞
The fungicidal cleaner composition for hard surfaces according to the above <1A> or <2A>, wherein the component (a) is selected from sodium sulfate, lithium sulfate, potassium sulfate, cesium sulfate, ammonium sulfate, sodium sulfite, sodium chloride, One or more of potassium chloride, sodium nitrate, sodium carbonate, disodium hydrogen phosphate, and sodium thiocyanate, preferably one selected from sodium sulfate, potassium sulfate, sodium nitrate, sodium chloride, and potassium chloride The above is more preferably one or more selected from the group consisting of sodium sulfate, potassium sulfate, and potassium chloride, and still more preferably sodium sulfate.

＜ 4A ＞
The mold killing detergent composition for hard surfaces according to any one of the above <1A> to <3A>, wherein the component (b) is an aromatic group and a hydroxyl group which may have a substituent, and has a molecular weight of 106 to 300. Non-ionic fungicide.

＜ 5A ＞
The mold killing detergent composition for hard surfaces according to any one of the above <1A> to <4A>, wherein the component (b) is a compound represented by the following general formula (b1).
R ^1b O- (R ^2b O) _l -H (b1)
(Wherein R ^1b is a hydrocarbon group having an aromatic group and having a total carbon number of 6 to 11; l is an integer of 0 or 1; R ^2b is an alkylene group having a carbon number of 2 to 4; wherein the molecular weight of the compound (From 106 to 300)

＜ 6A ＞
The fungicidal cleaner composition for hard surfaces according to any one of the above <1A> to <5A>, wherein the component (b) is selected from benzyl alcohol, phenoxyethanol, 2-phenylethanol, and 3-benzene 1-propanol, cinnamon alcohol, benzyl glycol benzyl ether, diethylene glycol phenyl ether, diethylene glycol benzyl ether, 4-phenyl-1-butanol, trichloro sand, dichloro sand, and isopropyl One or more of methylmethylphenols, preferably one or more of benzyl alcohol, phenoxyethanol, diethylene glycol phenyl ether, triclosan, dichlorosand, and isopropylmethylphenol, More preferably, it is 1 or more types chosen from benzyl alcohol and a phenoxyethanol.

＜ 7A ＞
The fungicidal cleaner composition for hard surfaces according to any one of the above <1A> to <6A>, wherein the component (c1) is at least one selected from the group consisting of sulfobetaine, carbonylbetaine, and amine oxide. The surfactant is preferably one or more surfactants selected from carbonyl betaine and amine oxide.

＜ 8A ＞
The mold killing detergent composition for hard surfaces according to the above <7A>, in which the sulfobetaine is selected from the group consisting of an alkyl group having a carbon number of preferably 10 or more, more preferably 18 or less, and more preferably 14 or less N -Alkyl-N, N-dimethyl-N-sulfopropylammonium sulfobetaine; the number of carbon atoms of the alkyl group is preferably 10 or more, more preferably 18 or less, more preferably 14 or less -N, N-dimethyl-N- (2-hydroxysulfopropyl) ammonium sulfobetaine; the number of carbon atoms of the alkyl group is preferably 10 or more, more preferably 18 or less, more preferably 14 or less N-alkylamidoaminopropyl-N, N-dimethyl-N-sulfopropylammonium sulfobetaine; and the number of carbon atoms of the alkylamido group is preferably 10 or more, and more preferably 18 or less, More preferably, it is one or more kinds of N-alkylamidoaminopropyl-N, N-dimethyl-N- (2-hydroxysulfopropyl) ammonium sulfobetaine of 14 or less.

＜ 9A ＞
As described in the aforementioned <7A>, the mold-killing cleaner composition for hard surfaces, wherein the carbonyl betaine is an N-number of carbons selected from alkyl groups, preferably 10 or more, more preferably 18 or less, more preferably 14 or less Alkyl-N, N-dimethyl-N-carboxymethylammonium betaine and one or more of the compounds represented by the following general formula (c11), preferably represented by the following general formula (c11) Of compounds.

[Chemical 4]

[ ^Wherein R ^1c represents an alkyl or alkenyl group having 7 to 21 carbon atoms, R ^2c represents propylene, and R ^3c and R ^4c each independently represent an alkyl group having 1 to 3 carbon atoms]

＜ 10A ＞
The mold killing detergent composition for hard surfaces according to the above <7A>, wherein the amine oxide is a compound of the following general formula (c12).

[Chemical 5]

[ ^Wherein R ^5c represents a hydrocarbon group having 7 to 22 carbon atoms, preferably an alkyl or alkenyl group, more preferably an alkyl group, and R ^6c and R ^{7c are the} same or different and represent an alkyl group having 1 to 3 carbon atoms . D represents an -NHC (= O)-group or -C (= O) NH- group, and E represents an alkylene group having 1 to 5 carbon atoms. m and p represent m = 0 and p = 0 or m = 1 and p = 1]

＜ 11A ＞
The fungicidal cleaner composition for hard surfaces according to any one of the above <1A> to <10A>, wherein the (P) component is selected from (c2) a cationic surfactant, (c3) an anionic surfactant, and ( c4) One or more kinds of non-ionic surfactants (except component (b)).

＜ 12A ＞
The fungicidal cleaner composition for hard surfaces according to any one of the above <1A> to <10A>, wherein the (P) component contains one selected from (c2) a cationic surfactant and (c3) an anionic surfactant 1 or more.

＜ 13A ＞
As described in any one of the above <1A> to <12A>, the mildew-resistant cleaner composition for hard surface contains 0.5 mass% or more, more preferably 1 mass% or more, and more preferably 4 mass%. The component (a) is preferably 3% by mass or less.

＜ 14A ＞
The mold killing detergent composition for hard surfaces according to any one of the above <1A> to <13A>, containing 0.1% by mass or more, more preferably 0.5% by mass or more, and further preferably 1% by mass The component (b) is preferably 5 mass% or less, more preferably 4 mass% or less, and still more preferably 3 mass% or less.

＜ 15A ＞
As described in any one of the above <1A> to <14A>, the mildew-resistant cleaner composition for a hard surface contains 0.5 mass% or more, more preferably 1 mass% or more, and more preferably 4 mass%. The component (c1) is preferably 3 mass% or less.

＜ 16A ＞
The mold killing detergent composition for hard surfaces according to any one of the above <1A> to <15A>, wherein the mass ratio of the content of the (c1) component to the total content of the (c1) component and (P) component (c1) ) / [(c1) + (P)] is preferably 0.40 or more, more preferably 0.50 or more, and more preferably 0.90 or less, more preferably 0.80 or less.

＜ 17A ＞
The mold killing detergent composition for hard surfaces as described in any one of the above <1A> to <16A>, further containing a solvent (except component (b)) as component (d).

＜ 18A ＞
The mold killing detergent composition for hard surfaces according to the above <17A>, wherein the component (d) is one or more solvents selected from the following compounds (d1) to (d3).
(d1): aliphatic alcohol having a molecular weight of 60 to 500
(d2): aliphatic glycol ethers having a molecular weight of 60 to 500
(d3): aliphatic diol having a molecular weight of 60 to 500

＜ 19A ＞
The mold killing detergent composition for hard surfaces according to the above <18A>, wherein (d2) is a compound represented by the following general formula (d2).
R ^1d O- (R ^2d O) _n -H (d2)
(In the formula, R ^1d is an aliphatic hydrocarbon group having 1 to 8 carbon atoms, R ^2d is an alkylene group having 2 or 3 carbon atoms, and n is an integer of 1 to 4)

＜ 20A ＞
The mold killing detergent composition for hard surfaces according to the above <18A>, wherein (d3) is a compound represented by the following general formula (d3) (except (d2)).
R ^3d -CH (OH)-(CH ₂ ) _q -CH ₂ OH (d3)
(In the formula, R ^3d is a hydrogen atom, an aliphatic hydrocarbon group having 1 to 8 carbons or R ^4d O, R ^4d is a hydrocarbon group having 1 to 8 carbons, and q is an integer of 0 or 1 to 6. Here, (Total carbon number in the compound is 4 or more and 10 or less)

＜ 21A ＞
As described in any one of the above <17A> to <20A>, the mildew-resistant cleaner composition for a hard surface contains 0.1 mass% or more, more preferably 0.5 mass% or more, and still more preferably 0.8 mass%. The component (d) is more than 12% by mass, more preferably 10% by mass or less, and still more preferably 8% by mass or less.

＜ 22A ＞
The mold killing detergent composition for hard surfaces according to any one of the above <1A> to <21A>, further containing a metal blocking agent as the (e) component.

＜ 23A ＞
The mold killing detergent composition for hard surfaces according to the above <22A>, in which the component (e) is at least one selected from the group consisting of aminocarboxylic acid, hydroxycarboxylic acid, hydroxyphosphonic acid, and salts thereof, and is preferably It is one or more selected from ethylenediaminetetraacetic acid (EDTA), methylglycine diacetic acid (MGDA), citric acid, malic acid, and salts thereof, and more preferably selected from ethylenediaminetetraacetic acid ( EDTA), citric acid and one or more of these salts, and more preferably one or more selected from ethylenediaminetetraacetic acid and its salts.

＜ 24A ＞
The mold killing detergent composition for hard surfaces according to the above <22A> or <23A>, the content of which is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and further preferably 1% by mass or more. The (e) component is preferably 10% by mass or less, more preferably 8% by mass or less, and even more preferably 7% by mass or less.

＜ 25A ＞
As described in any one of the above <1A> to <24A>, the pH value at 25 ° C of the fungicidal cleaner composition for a hard surface is preferably 5.5 or more, more preferably 6 or more, and more preferably 8.5 or less, more preferably 8 or less.

＜ 26A ＞
A hard surface treatment method in which a mold killing detergent composition for a hard surface as described in any one of the above <1A> to <25A> is brought into contact with a hard surface on which mold is present, and mold killing and cleaning are performed simultaneously.

＜ 27A ＞
The hard surface treatment method according to the above <26A>, which is to contact the hardened mold cleaning agent composition for a hard surface according to any one of the above <1A> to <25A> with a hard surface in the form of a stock solution, or The said fungicide composition for hard surfaces is in the form of a stock solution, and is in contact with a hard surface without dilution.

＜ 28A ＞
The use of the mold-killing cleaner composition for hard surfaces as described in any one of said <1A> to <25A> which is used as a mold-killing cleaner for hard surfaces.

＜ 1B ＞
A fungicidal cleaner composition for a hard surface, which contains (a) a water-soluble inorganic salt [hereinafter, referred to as (a) component] of 0.1% by mass or more and 5% by mass or less, and 0.05% by mass or more and 7% by mass or less ( b) Non-ionic fungicides [hereinafter, referred to as (b) component], (c2) cationic surfactants from 0.1% by mass to 5% by mass, (d) solvents (but excluding component (b)), and water And the pH value at 25 ° C is 5 or more and 9 or less.

＜ 2B ＞
The fungicidal cleaner composition for hard surfaces according to the above <1B>, wherein (a) component is selected from the group consisting of alkali metal sulfate, alkaline earth metal sulfate, ammonium sulfate, alkali metal sulfite, and alkaline earth metal sulfite , Alkali metal halides, alkaline earth metal halides, alkali metal nitrates, alkaline earth metal nitrates, alkali metal carbonates, alkaline earth metal carbonates, alkali metal phosphates, alkaline earth metal phosphates, alkali metal thiocyanates, and alkaline earth metals One or more water-soluble inorganic salts of thiocyanate are preferably one or more water-soluble inorganic salts selected from alkali metal sulfate, alkaline earth metal sulfate, alkali metal halide and alkaline earth metal halide. One or more water-soluble inorganic salts selected from the group consisting of alkali metal sulfates, alkaline earth metal sulfates, alkali metal chlorides, and alkaline earth metal chlorides, more preferably selected from alkali metal sulfates and alkali metal chlorides One or more of these are water-soluble inorganic salts, and more preferably alkali metal sulfates.

＜ 3B ＞
The fungicidal cleaner composition for hard surfaces according to the above <1B> or <2B>, wherein the component (a) is selected from sodium sulfate, lithium sulfate, potassium sulfate, cesium sulfate, ammonium sulfate, sodium sulfite, sodium chloride, One or more of potassium chloride, sodium nitrate, sodium carbonate, disodium hydrogen phosphate, and sodium thiocyanate, preferably one selected from sodium sulfate, potassium sulfate, sodium nitrate, sodium chloride, and potassium chloride The above is more preferably one or more selected from the group consisting of sodium sulfate, potassium sulfate, and potassium chloride, and still more preferably sodium sulfate.

＜ 4B ＞
The mold killing detergent composition for hard surfaces according to any one of the above <1B> to <3B>, wherein the component (b) is an aromatic group and a hydroxyl group which may have a substituent, and has a molecular weight of 106 to 300. Non-ionic fungicide.

＜ 5B ＞
The mold killing detergent composition for hard surfaces according to any one of the above <1B> to <4B>, wherein the component (b) is a compound represented by the following general formula (b1).
R ^1b O- (R ^2b O) _l -H (b1)
(Wherein R ^1b is a hydrocarbon group having an aromatic group and having a total carbon number of 6 to 11; l is an integer of 0 or 1; R ^2b is an alkylene group having a carbon number of 2 to 4; wherein the molecular weight of the compound (From 106 to 300)

＜ 6B ＞
The fungicidal cleaner composition for hard surfaces according to any one of the above <1B> to <5B>, wherein the component (b) is selected from benzyl alcohol, phenoxyethanol, 2-phenylethanol, and 3-benzene 1-propanol, cinnamon alcohol, benzyl glycol benzyl ether, diethylene glycol phenyl ether, diethylene glycol benzyl ether, 4-phenyl-1-butanol, trichloro sand, dichloro sand, and isopropyl One or more of methylmethylphenols, preferably one or more of benzyl alcohol, phenoxyethanol, diethylene glycol phenyl ether, triclosan, dichlorosand, and isopropylmethylphenol, More preferably, it is 1 or more types chosen from benzyl alcohol and a phenoxyethanol.

＜ 7B ＞
The fungicidal cleaner composition for hard surfaces according to any one of the above <1B> to <6B>, wherein the component (c2) is a quaternary ammonium salt type cationic surfactant, preferably a quaternary grade having a benzyl group Ammonium salt type cationic surfactant.

＜ 8B ＞
The mold killing detergent composition for hard surfaces according to the above <7B>, wherein the component (c2) is a quaternary ammonium salt type cationic surfactant represented by the following general formula (c2).

[Chemical 6]

[In the formula, R ^11c represents a hydrocarbon group having 6 to 18 carbon atoms. R ^12c and R ^13c each independently represent an alkyl group having 1 to 3 carbon atoms. R ^14c represents an alkylene group having 1 to 3 carbon atoms. Z ^- represents an anionic group]

＜ 9B ＞
The fungicidal cleaner composition for hard surfaces according to any one of the above <1B> to <8B>, wherein the component (d) is one or more selected from the following compounds (d1) to (d3) Solvent.
(d1): aliphatic alcohol having a molecular weight of 60 to 500
(d2): aliphatic glycol ethers having a molecular weight of 60 to 500
(d3): aliphatic diol having a molecular weight of 60 to 500

＜ 10B ＞
The mold killing detergent composition for hard surfaces according to the above <9B>, wherein (d2) is a compound represented by the following general formula (d2).
R ^1d O- (R ^2d O) _n -H (d2)
(In the formula, R ^1d is an aliphatic hydrocarbon group having 1 to 8 carbon atoms, R ^2d is an alkylene group having 2 or 3 carbon atoms, and n is an integer of 1 to 4)

＜ 11B ＞
The mold killing detergent composition for hard surfaces according to the above <9B>, wherein (d3) is a compound represented by the following general formula (d3) (except (d2)).
R ^3d -CH (OH)-(CH ₂ ) _q -CH ₂ OH (d3)
(In the formula, R ^3d is a hydrogen atom, an aliphatic hydrocarbon group having 1 to 8 carbons or R ^4d O, R ^4d is a hydrocarbon group having 1 to 8 carbons, and q is an integer of 0 or 1 to 6. Here, (Total carbon number in the compound is 4 or more and 10 or less)

＜ 12B ＞
As described in any one of the above <1B> to <11B>, the mold killing detergent composition for hard surfaces contains 0.5 mass% or more, more preferably 1.0 mass% or more, and more preferably 4 mass%. The component (a) is preferably 3% by mass or less.

＜ 13B ＞
The mold killing detergent composition for hard surfaces as described in any one of the above <1B> to <12B>, containing 0.1% by mass or more, more preferably 0.5% by mass or more, and further preferably 1.0% by mass The component (b) is preferably 5 mass% or less, more preferably 4 mass% or less, and still more preferably 3 mass% or less.

＜ 14B ＞
As described in any of the above <1B> to <13B>, the mildew-resistant cleaner composition for hard surfaces contains 0.3 mass% or more, more preferably 0.5 mass% or more, and still more preferably 0.75% by mass. The component (c2) is more than 4% by mass and more preferably 3% by mass or less.

＜ 15B ＞
As described in any one of the above <1B> to <14B>, the mildew-resistant cleaner composition for hard surface contains 0.1 mass% or more, more preferably 0.5 mass% or more, and further preferably 1 mass%. The component (d) is more than 10% by mass, more preferably 8% by mass or less, and still more preferably 7% by mass or less.

＜ 16B ＞
The mold-killing cleaner composition for hard surfaces as described in any one of the above <1B> to <15B>, the total content of which is preferably 0.2% by mass or more, more preferably 0.5% by mass or more, and further preferably 1.5% by mass The components (c2) and (d) are not less than 12% by mass, more preferably not more than 12% by mass, more preferably not more than 10% by mass, and even more preferably not more than 8% by mass.

＜ 17B ＞
The fungicidal cleaner composition for hard surfaces according to any one of the above <1B> to <16B>, which contains a surfactant other than the component (c2) as an optional (Q) component.

＜ 18B ＞
The mold killing detergent composition for hard surfaces according to the above <17B>, wherein the (Q) component is selected from (c1) one or more types of interfaces selected from betaine type surfactants and amine oxide type surfactants. One or more of surfactants, (c3) anionic surfactants, and (c4) nonionic surfactants.

＜ 19B ＞
As described in the above <17B> or <18B>, the mold killing detergent composition for hard surfaces, wherein the mass ratio of the total content of (c2) component and (Q) component (c2) / [(c2) + (Q)] It is preferably 0.1 or more, more preferably 0.2 or more, still more preferably 0.3 or more, even more preferably 0.4 or more, and further preferably 1 or less, more preferably 0.9 or less, and still more preferably 0.8 or less.

＜ 20B ＞
As described in any one of the above <1B> to <19B>, the pH value at 25 ° C of the fungicidal cleaner composition for a hard surface is preferably 5.5 or more, more preferably 6 or more, and more preferably 8.5 or less, more preferably 8 or less.

＜ 21B ＞
A hard surface treatment method in which a mold killing cleaner composition for a hard surface as described in any one of the above <1B> to <20B> is brought into contact with a hard surface on which mold is present, and the mold is killed and cleaned at the same time.

＜ 22B ＞
The hard surface treatment method according to the above <21B>, in which the mildew-resistant mold cleaner composition for a hard surface according to any one of the above <1B> to <20B> is brought into contact with the hard surface in the form of a stock solution, or The said fungicide composition for hard surfaces is in the form of a stock solution, and is in contact with a hard surface without dilution.

＜ 23B ＞
The use of the mold-killing cleaner composition for hard surfaces as described in any one of said <1B> to <20B> as a mold-killing cleaner for hard surfaces.

＜ 1C ＞
A fungicidal cleaner composition for a hard surface, which contains (a) a water-soluble inorganic salt [hereinafter, referred to as (a) component] of 0.1% by mass or more and 5% by mass or less, and 0.05% by mass or more and 7% by mass or less ( b) a non-ionic fungicide [hereinafter, referred to as (b) component], (c4) a non-ionic surfactant [except for (b) component, hereinafter, referred to as (c4) component], and water, and (a ) And the total content of the component (b) is 1.5% by mass or more and 10% by mass or less, and the total content of the surfactant is 10% by mass or less. The pH of the mildew-resistant cleaner composition for hard surfaces at 25 ° C Less than 12.

＜ 2C ＞
The fungicidal cleaner composition for hard surfaces according to the above <1C>, wherein the component (a) is selected from the group consisting of alkali metal sulfate, alkaline earth metal sulfate, ammonium sulfate, alkali metal sulfite, and alkaline earth metal sulfite , Alkali metal halides, alkaline earth metal halides, alkali metal nitrates, alkaline earth metal nitrates, alkali metal carbonates, alkaline earth metal carbonates, alkali metal phosphates, alkaline earth metal phosphates, alkali metal thiocyanates, and alkaline earth metals One or more water-soluble inorganic salts of thiocyanate are preferably one or more water-soluble inorganic salts selected from alkali metal sulfate, alkaline earth metal sulfate, alkali metal halide and alkaline earth metal halide. One or more water-soluble inorganic salts selected from the group consisting of alkali metal sulfates, alkaline earth metal sulfates, alkali metal chlorides, and alkaline earth metal chlorides, more preferably selected from alkali metal sulfates and alkali metal chlorides One or more of these are water-soluble inorganic salts, and more preferably alkali metal sulfates.

＜ 3C ＞
The fungicidal cleaner composition for hard surfaces according to the above <1C> or <2C>, wherein the component (a) is selected from sodium sulfate, lithium sulfate, potassium sulfate, cesium sulfate, ammonium sulfate, sodium sulfite, sodium chloride, One or more of potassium chloride, sodium nitrate, sodium carbonate, disodium hydrogen phosphate, and sodium thiocyanate, preferably one selected from sodium sulfate, potassium sulfate, sodium nitrate, sodium chloride, and potassium chloride The above is more preferably one or more selected from the group consisting of sodium sulfate, potassium sulfate, and potassium chloride, and still more preferably sodium sulfate.

＜ 4C ＞
The fungicidal cleaner composition for hard surfaces according to any one of the above <1C> to <3C>, wherein the component (b) is an aromatic group and a hydroxyl group which may have a substituent, and has a molecular weight of 106 to 300. Non-ionic fungicide.

＜ 5C ＞
The mold killing detergent composition for hard surfaces according to any one of the above <1C> to <4C>, wherein the component (b) is a compound represented by the following general formula (b1).
R ^1b O- (R ^2b O) _l -H (b1)
(Wherein R ^1b is a hydrocarbon group having an aromatic group and having a total carbon number of 6 to 11; l is an integer of 0 or 1; R ^2b is an alkylene group having a carbon number of 2 to 4; wherein the molecular weight of the compound (From 106 to 300)

＜ 6C ＞
The fungicidal cleaner composition for hard surfaces according to any one of the above <1C> to <5C>, wherein the component (b) is selected from benzyl alcohol, phenoxyethanol, 2-phenylethanol, and 3-benzene 1-propanol, cinnamon alcohol, benzyl glycol benzyl ether, diethylene glycol phenyl ether, diethylene glycol benzyl ether, 4-phenyl-1-butanol, trichloro sand, dichloro sand, and isopropyl One or more of methylmethylphenols, preferably one or more of benzyl alcohol, phenoxyethanol, diethylene glycol phenyl ether, triclosan, dichlorosand, and isopropylmethylphenol, More preferably, it is 1 or more types chosen from benzyl alcohol and a phenoxyethanol.

＜ 7C ＞
The fungicidal cleaner composition for hard surfaces according to any one of the above <1C> to <6C>, wherein the component (c4) is a polyoxyalkylene alkyl group having an alkyl group having 8 to 18 carbon atoms Ethers, polyoxyalkylene alkenyl ethers having alkenyl groups of 8 to 18 carbon atoms, polyoxyalkylene sorbitan fatty acid esters having fatty acid groups of 8 to 18 carbon atoms, having 8 carbon atoms Alkyl glycosides of alkyl groups of 18 to 18, alkyl polyglycosides of alkyl groups of 8 to 18 carbons, sucrose fatty acid esters of fatty acid groups of 8 to 18 carbons, and 8 to 18 carbons One or more of the following alkyl polyglyceryl ethers, preferably polyoxyethylene having an alkyl group having a carbon number of 8 to 18 and an average addition mole number of ethylene oxide of 2 to 50 Alkyl ether.

＜ 8C ＞
The fungicidal cleaner composition for hard surfaces according to any one of the above <1C> to <6C>, wherein the component (c4) is a nonionic surfactant represented by the following general formula (c4).
R ^21c -O-[(C ₂ H ₄ O) _s (C ₃ H ₆ O) _t ] -H (c4)
[In the formula, R ^21c is an alkyl or alkenyl group having 8 or more carbon atoms, preferably 10 or more carbon atoms, and 18 or less carbon atoms, and preferably 16 or less carbon atoms. s and t are average addition mole numbers, and s is 2 or more, preferably 4 or more, more preferably 6 or more, further preferably 10 or more, and 50 or less, preferably 40 or less, and more preferably 20 In the following numbers, t is a number of 0 or more, preferably 1 or more, and 5 or less, preferably 3 or less, and t may also be 0. (C ₂ H ₄ O) and (C ₃ H ₆ O) can be random polymers or block polymers]

＜ 9C ＞
As described in any one of the above <1C> to <8C>, the mildew-resistant cleaner composition for hard surface contains 0.5 mass% or more, more preferably 1 mass% or more, and more preferably 4 mass%. The component (a) is 3 mass% or less, more preferably 1.5 mass% or less.

＜ 10C ＞
As described in any one of the above <1C> to <9C>, the mildew-resistant cleaner composition for hard surface contains 0.1 mass% or more, more preferably 0.5 mass% or more, and further preferably 1 mass%. The component (b) is preferably 5 mass% or less, more preferably 4 mass% or less, and still more preferably 3 mass% or less.

＜ 11C ＞
As described in any one of the above <1C> to <10C>, the total content of the (a) component and the (b) component is preferably from the viewpoint of improving the fungicidal effect, in terms of the mold killing effect for a hard surface. It is 1.8% by mass or more, more preferably 2% by mass or more, more preferably 8% by mass or less, and even more preferably 7% by mass or less.

＜ 12C ＞
As described in any one of the above <1C> to <11C>, the mildew-resistant cleaner composition for hard surface contains 0.1 mass% or more, more preferably 0.2 mass% or more, and further preferably 0.5 mass%. The component (c4) is more than 10 mass%, more preferably 8 mass% or less, still more preferably 6 mass% or less, and still more preferably 3 mass% or less.

＜ 13C ＞
As described in any one of the above <1C> to <12C>, the mass ratio of the content of the component (b) to the content of the component (c4) is (b) / (c4). It is preferably 0.2 or more, more preferably 0.5 or more, even more preferably 1 or more, and more preferably 9 or less, more preferably 7 or less, still more preferably 5 or less, and even more preferably 4 or less.

＜ 14C ＞
The fungicidal cleaner composition for hard surfaces according to any one of the above <1C> to <13C>, further containing a solvent (except component (b)) as component (d).

＜ 15C ＞
The mold killing detergent composition for hard surfaces according to the above <14C>, wherein the component (d) is one or more solvents selected from the following compounds (d1) to (d3).
(d1): aliphatic alcohol having a molecular weight of 60 to 500
(d2): aliphatic glycol ethers having a molecular weight of 60 to 500
(d3): aliphatic diol having a molecular weight of 60 to 500

＜ 16C ＞
The mold killing detergent composition for hard surfaces according to the above <15C>, wherein (d2) is a compound represented by the following general formula (d2).
R ^1d O- (R ^2d O) _n -H (d2)
(In the formula, R ^1d is an aliphatic hydrocarbon group having 1 to 8 carbon atoms, R ^2d is an alkylene group having 2 or 3 carbon atoms, and n is an integer of 1 to 4)

＜ 17C ＞
The mold killing detergent composition for hard surfaces according to the above <15C>, wherein (d3) is a compound represented by the following general formula (d3) (except (d2)).
R ^3d -CH (OH)-(CH ₂ ) _q -CH ₂ OH (d3)
(In the formula, R ^3d is a hydrogen atom, an aliphatic hydrocarbon group having 1 to 8 carbons or R ^4d O, R ^4d is a hydrocarbon group having 1 to 8 carbons, and q is an integer of 0 or 1 to 6. Here, (Total carbon number in the compound is 4 or more and 10 or less)

＜ 18C ＞
The mold killing detergent composition for hard surfaces as described in any one of the above <14C> to <17C>, preferably containing 0.1% by mass or more, more preferably 0.5% by mass or more, and still more preferably 0.8% by mass The component (d) is more than 12% by mass, more preferably 10% by mass or less, and still more preferably 8% by mass or less.

＜ 19C ＞
The fungicidal cleaner composition for hard surfaces according to any one of the above <1C> to <18C>, which contains a surfactant other than the component (c4) as an optional (R) component.

＜ 20C ＞
The mold killing detergent composition for hard surfaces according to the above <19C>, wherein the (R) component is selected from (c1) one or more types of interfaces selected from betaine-type surfactants and amine oxide-type surfactants. One or more of surfactants, (c2) cationic surfactants, and (c3) anionic surfactants.

＜ 21C ＞
The mold killing detergent composition for hard surfaces according to any one of the above <1C> to <20C>, wherein the total content of the surfactant (the total content of the (c4) component and the (R) component) is preferably 9 Mass% or less, more preferably 8 mass% or less, still more preferably 6 mass% or less, and even more preferably 4 mass% or less.

＜ 22C ＞
As described in any one of the above <1C> to <21C>, the pH value at 25 ° C of the fungicidal cleaner composition for hard surfaces is preferably 5 or more, more preferably 5.5 or more, and even more preferably 6 The above is more preferably 9 or less, more preferably 8.5 or less, and even more preferably 8 or less.

＜ 23C ＞
A hard surface treatment method in which a mold killing cleaner composition for a hard surface as described in any one of the above <1C> to <22C> is brought into contact with a hard surface on which mold is present, and mold killing and cleaning are performed simultaneously.

＜ 24C ＞
The hard surface treatment method according to the above <23C>, which is to contact the hard mold cleaning agent composition for a hard surface according to any one of the above <1C> to <22C> with a hard surface in the form of a dope, or The said fungicide composition for hard surfaces is in the form of a stock solution, and is in contact with a hard surface without dilution.

＜ 25C ＞
The use of the mold-killing cleaner composition for hard surfaces as described in any one of said <1C> to <22C> as a mold-killing cleaner for hard surfaces.

＜ 1D ＞
A fungicidal cleaner composition for a hard surface, which contains (a) a water-soluble inorganic salt [hereinafter, referred to as (a) component] of 0.1% by mass or more and 5% by mass or less, and 0.05% by mass or more and 7% by mass or less ( b) Nonionic fungicide [hereinafter, referred to as (b) component], (e) metal blocking agent [hereinafter, referred to as (e) component] from 0.01% by mass to 7% by mass, water, and optionally ( S) Surfactant [hereinafter, referred to as (S) component], and the content of (S) component is 10% by mass or less, and the pH value of the mold killing detergent composition for hard surface at 25 ° C is 5 or more 9 the following.

＜ 2D ＞
The fungicidal cleaner composition for hard surfaces according to the above <1D>, wherein (a) component is selected from alkali metal sulfate, alkaline earth metal sulfate, ammonium sulfate, alkali metal sulfite, and alkaline earth metal sulfite , Alkali metal halides, alkaline earth metal halides, alkali metal nitrates, alkaline earth metal nitrates, alkali metal carbonates, alkaline earth metal carbonates, alkali metal phosphates, alkaline earth metal phosphates, alkali metal thiocyanates, and alkaline earth metals One or more water-soluble inorganic salts of thiocyanate are preferably one or more water-soluble inorganic salts selected from alkali metal sulfate, alkaline earth metal sulfate, alkali metal halide and alkaline earth metal halide. One or more water-soluble inorganic salts selected from the group consisting of alkali metal sulfates, alkaline earth metal sulfates, alkali metal chlorides, and alkaline earth metal chlorides, more preferably selected from alkali metal sulfates and alkali metal chlorides One or more of these are water-soluble inorganic salts, and more preferably alkali metal sulfates.

＜ 3D ＞
The fungicidal cleaner composition for hard surfaces according to the above <1D> or <2D>, wherein the component (a) is selected from sodium sulfate, lithium sulfate, potassium sulfate, cesium sulfate, ammonium sulfate, sodium sulfite, sodium chloride, One or more of potassium chloride, sodium nitrate, sodium carbonate, disodium hydrogen phosphate, and sodium thiocyanate, preferably one selected from sodium sulfate, potassium sulfate, sodium nitrate, sodium chloride, and potassium chloride The above is more preferably one or more selected from the group consisting of sodium sulfate, potassium sulfate, and potassium chloride, and still more preferably sodium sulfate.

＜ 4D ＞
The fungicidal cleaner composition for hard surfaces according to any one of the above <1D> to <3D>, wherein the component (b) is an aromatic group and a hydroxyl group which may have a substituent and has a molecular weight of 106 or more and 300 or less Non-ionic fungicide.

＜ 5D ＞
The mold killing detergent composition for hard surfaces according to any one of the above <1D> to <4D>, wherein the component (b) is a compound represented by the following general formula (b1).
R ^1b O- (R ^2b O) _l -H (b1)
(Wherein R ^1b is a hydrocarbon group having an aromatic group and having a total carbon number of 6 to 11; l is an integer of 0 or 1; R ^2b is an alkylene group having a carbon number of 2 to 4; wherein the molecular weight of the compound (From 106 to 300)

＜ 6D ＞
The fungicidal cleaner composition for hard surfaces according to any one of the above <1D> to <5D>, wherein the component (b) is selected from benzyl alcohol, phenoxyethanol, 2-phenylethanol, and 3-benzene 1-propanol, cinnamon alcohol, benzyl glycol benzyl ether, diethylene glycol phenyl ether, diethylene glycol benzyl ether, 4-phenyl-1-butanol, trichloro sand, dichloro sand, and isopropyl One or more of methylmethylphenols, preferably one or more of benzyl alcohol, phenoxyethanol, diethylene glycol phenyl ether, triclosan, dichlorosand, and isopropylmethylphenol, More preferably, it is 1 or more types chosen from benzyl alcohol and a phenoxyethanol.

＜ 7D ＞
The fungicidal cleaner composition for hard surfaces according to any one of the above <1D> to <6D>, wherein the component (e) is selected from the group consisting of aminocarboxylic acid, hydroxycarboxylic acid, hydroxyphosphonic acid, and salts thereof One or more of these are preferably one or more selected from ethylenediaminetetraacetic acid (EDTA), methylglycine diacetic acid (MGDA), citric acid, malic acid, and salts thereof, more preferably One or more selected from ethylenediaminetetraacetic acid (EDTA), citric acid, and salts thereof, and more preferably one or more selected from ethylenediaminetetraacetic acid and salts thereof.

＜ 8D ＞
As described in any one of the above <1D> to <7D>, the mildew-resistant cleaner composition for hard surface contains 0.3 mass% or more, more preferably 0.5 mass% or more, and more preferably 4 mass%. The component (a) is 3 mass% or less, more preferably 2 mass% or less, and even more preferably 1 mass% or less.

＜ 9D ＞
The mold killing detergent composition for hard surfaces as described in any one of the above <1D> to <8D>, containing 0.1% by mass or more, more preferably 0.5% by mass or more, and further preferably 1% by mass The component (b) is preferably 5 mass% or less, more preferably 4 mass% or less, and still more preferably 3 mass% or less.

＜ 10D ＞
The mold-killing cleaner composition for hard surfaces as described in any one of the above <1D> to <9D>, which contains 0.1 mass% or more, more preferably 0.5 mass% or more, and more preferably 6 mass%. The component (e) is 5% by mass or less, more preferably 2% by mass or less.

＜ 11D ＞
The mold killing detergent composition for hard surfaces according to any one of the above <1D> to <10D>, which contains a surfactant as an optional (S) component.

＜ 12D ＞
The fungicidal cleaner composition for hard surfaces according to the above <11D>, wherein the (S) component is selected from (c1) one or more types of interfaces selected from betaine type surfactants and amine oxide type surfactants. One or more of surfactants, (c2) cationic surfactants, (c3) anionic surfactants, and (c4) nonionic surfactants (except component (b)).

＜ 13D ＞
As described in the above <11D> or <12D>, the content of the (S) component is 10% by mass or less, preferably 7% by mass or less, and more preferably 5% by mass or less, It is more preferably 4% by mass or less, and still more preferably 3% by mass or less.

＜ 14D ＞
As described in any of the above <11D> to <13D>, the mold killing detergent composition for a hard surface has a mass ratio (S) / (e) of the content of the (e) component to the content of the (S) component. It is preferably 0 or more, more preferably 0.2 or more, still more preferably 0.4 or more, and further preferably 10 or less, more preferably 7 or less, still more preferably 5 or less, and even more preferably 2 or less.

＜ 15D ＞
The fungicidal cleaner composition for hard surfaces as described in any one of the above <1D> to <14D>, further containing a solvent (except component (b)) as component (d).

＜ 16D ＞
The mold killing detergent composition for hard surfaces according to the above <15D>, wherein the component (d) is one or more solvents selected from the following compounds (d1) to (d3).
(d1): aliphatic alcohol having a molecular weight of 60 to 500
(d2): aliphatic glycol ethers having a molecular weight of 60 to 500
(d3): aliphatic diol having a molecular weight of 60 to 500

＜ 17D ＞
The mold killing detergent composition for hard surfaces according to the above <16D>, wherein (d2) is a compound represented by the following general formula (d2).
R ^1d O- (R ^2d O) _n -H (d2)
(In the formula, R ^1d is an aliphatic hydrocarbon group having 1 to 8 carbon atoms, R ^2d is an alkylene group having 2 or 3 carbon atoms, and n is an integer of 1 to 4)

＜ 18D ＞
The mold killing detergent composition for hard surfaces according to the above <16D>, wherein (d3) is a compound represented by the following general formula (d3) (except (d2)).
R ^3d -CH (OH)-(CH ₂ ) _q -CH ₂ OH (d3)
(In the formula, R ^3d is a hydrogen atom, an aliphatic hydrocarbon group having 1 to 8 carbons or R ^4d O, R ^4d is a hydrocarbon group having 1 to 8 carbons, and q is an integer of 0 or 1 to 6. Here, (Total carbon number in the compound is 4 or more and 10 or less)

＜ 19D ＞
As described in any one of the above <15D> to <18D>, the mold killing cleaner composition for hard surfaces contains 0.1% by mass or more from the viewpoint of improving the fungicidal effect and improving the cleaning power. The component (d) is preferably 0.5% by mass or more, and further preferably 1% by mass or more. In terms of formulation stability, the content is preferably 10% by mass or less, more preferably 9% by mass or less, and furthermore The component (d) is preferably 8% by mass or less.

＜ 20D ＞
As described in any one of the above <1D> to <19D>, the fungicidal cleaner composition for a hard surface has a pH at 25 ° C of preferably 5.5 or more, more preferably 6 or more, and more preferably 8.5 or less, more preferably 8 or less.

＜ 21D ＞
A hard surface treatment method in which a mold killing detergent composition for a hard surface as described in any one of the above <1D> to <20D> is brought into contact with a hard surface on which mold is present, and mold killing and cleaning are performed simultaneously.

＜ 22D ＞
The hard surface treatment method according to the above <21D>, in which the mildew-resistant cleaning composition for hard surfaces according to any one of the above <1D> to <20D> is brought into contact with the hard surface in the form of a dope, or The said fungicide composition for hard surfaces is in the form of a stock solution, and is in contact with a hard surface without dilution.

＜ 23D ＞
The use of the mold-killing cleaner composition for hard surfaces as described in any one of said <1D> to <20D> which is used as a mold-killing cleaner for hard surfaces.

Examples
[Test Example 1]
The following formulation ingredients were used to prepare the mildew-resistant cleaner compositions for hard surfaces shown in Tables 1 to 4, and the following items were evaluated. The results are shown in Tables 1 to 4. The mold killing detergent compositions for hard surfaces in Tables 1 to 4 are shown in the table in a 10 mM phosphate buffer solution (pH 7) prepared by adding sodium hydrogen phosphate and sodium dihydrogen phosphate to ion-exchanged water, respectively. (A) component, (b) component, (c1) component, (P) component, (d) component, (e) component were added to the compounding quantity, and these were dissolved at room temperature (25 degreeC). When the pH after the preparation becomes other than 7, adjust to pH 7 using sodium hydroxide and / or hydrochloric acid. The pH value was measured by a glass electrode method. In addition, the mass% of the formulated ingredients in Tables 1 to 4 are all values based on the effective ingredients.

＜ Mixed ingredients ＞
(a) Ingredients · Na ₂ SO ₄ : sodium sulfate, manufactured by Wako Pure Chemical Industries, Ltd. · K ₂ SO ₄ : potassium sulfate, manufactured by Wako Pure Chemical Industries, Ltd. · NaCl: sodium chloride, Wako Pure Chemical Industries, Ltd. Manufacturing

(b) Ingredients: benzyl alcohol: manufactured by Wako Pure Chemical Industries, Ltd., molecular weight 108
・ Phenoxyethanol: manufactured by Wako Pure Chemical Industries, Ltd., molecular weight 138
・ Dichloro sand: manufactured by BASF, molecular weight 255
・ IPMP: Isopropylmethylphenol, manufactured by Wako Pure Chemical Industries, Ltd., molecular weight 150
・ Diethylene glycol phenyl ether: made by Japan Emulsifier Co., Ltd., molecular weight 182

(c1) Ingredients · Carbonyl betaine: Laurylamine propyl betaine, Amphitol 20AB, manufactured by Kao Corporation. In formula (c11), R ^1c is an alkyl group having 11 carbon atoms, R ^2c is propyl, and R ^3c Compounds in which R ^4c is a methyl group · Sulfobetaine: Laurylhydroxysulfobetaine (N-dodecyl-N, N-dimethyl-N- (2-hydroxysulfopropyl) ammonium sulfo Betaine), Amphitol 20HD, manufactured by Kao Corporation. Amine oxide: Amphitol 20N, manufactured by Kao Corporation. R ^5c in formula (c12) is dodecyl (a linear alkyl group having 12 carbon atoms), R ^6c and R ^7c are methyl, m and p are 0

(P) Ingredients ES: Sodium polyoxyethylene lauryl ether sulfate, manufactured by Kao Corporation. LAS: Sodium dodecylbenzenesulfonate, manufactured by Kao Corporation. Sanisol 08: Octyl benzyl dimethyl chloride. Ammonium chloride, manufactured by Kao Corporation

(d) Ingredients / BDG: Diethylene glycol butyl ether (Molecular weight: 162, logP: 0.66), manufactured by Japan Emulsifier Co., Ltd., (d2)
(e) Ingredients · EDTA-4Na: Ethylenediamine tetraacetic acid sodium salt, manufactured by Tongren Chemical Research Institute Co., Ltd.

＜ Evaluation method of fungicidal properties ＞
Cladsporiumsp. PA-4, an environmental isolate belonging to the genus Cladosporium, was used on a potato glucose plate agar medium (Potato Dextrose Agar reagent manufactured by Becton Dickinson Company according to the instruction manual). After 7 days of incubation at 25 ° C, 4 mL of spore recovery solution (0.05% Tween80 solution manufactured by Wako Pure Chemical Industries, Ltd., prepared by physiological saline manufactured by Otsuka Pharmaceutical Factory Co., Ltd.) was dropped on the same agar plate, The bacteria solution was recovered by gently rubbing with a coating bar (manufactured by Nissui Pharmaceutical Co., Ltd.). Thereafter, the recovered bacterial liquid was filtered using Miracloth (manufactured by Calbiochem) to remove mycelia, the obtained liquid was centrifuged (10,000 rpm, 25 ° C, 5 min), and the supernatant was removed. These operations were repeated two or three times, and the bacteria concentration was prepared as 3.0 × 10 ⁷ to 7.0 × 10 ⁸ CFU / mL to be used as a test spore fluid.

Use the mold-killing detergent composition for hard surfaces in Tables 1 to 4 as the test solution. Mix 10 mL of the test spore solution prepared with 1 mL of the test solution, and contact it at 25 ° C for 5 minutes. The suspension was suspended in 900 μL of a LP diluent (manufactured by a manufacturer of Nissui Pharmaceutical Co., Ltd. in accordance with the instruction manual), thereby deactivating the test solution. This was further diluted with LP diluent, and then spread on a potato glucose flat agar medium (preparing a potato glucose agar reagent manufactured by Becton Dickinson Company according to the instruction manual), and cultured at 25 ° C for 4 days to obtain the number of colonies. The number of colonies counts the number of residual bacteria at birth.

Also, a physiological saline solution (manufactured by Otsuka Pharmaceutical Works Co., Ltd.) was used in place of the test solution and the same operation was performed (10 μL of the test solution 1 mL of the mixed bacterial solution, which was contacted for 5 minutes, and then mixed with the LP diluent solution). As a target operation, the logarithmic difference between the number of bacterial residues after the target operation and the number of bacterial residues after contact with the test solution was calculated and used as an indicator of bactericidal performance (ΔLog reduced bacterial number). In the present invention, a ΔLog reduction bacteria count of 1.0 or more is considered acceptable. The results are shown in Tables 1 to 4.

＜ Evaluation of formulation stability (room temperature 25 ℃) ＞
After preparing a mildew-resistant cleaner composition for a hard surface, it was stored at room temperature (25 ° C) for one day, and the appearance change (separation, delamination, turbidity, etc.) of the appearance was observed by visual inspection, and evaluation was performed based on the following criteria.
○: Uniform and transparent, no separation, delamination and turbidity of components △: Although it is white and turbid but not delaminated, maintaining a uniform state ×: Separation and delamination of visible components

＜ Evaluation of sebum cleanability ＞
The model sebum dirt prepared based on the composition of the sebum dirt attached to the bathtub of the bathroom was dissolved in chloroform to prepare a 5% by mass model sebum dirt solution. A polyvinyl chloride flat plate (size 7 cm × 2 cm) was immersed in the solution for 10 seconds, and the model sebum dirt was formed on the flat plate to form a film, and then dried naturally for 1 night. Furthermore, the composition of the model sebum dirt was 40% by mass of linoleic acid, 20% by mass of oleic acid, 20% by mass of palmitic acid, 10% by mass of cholesterol, and 10% by mass of liquid paraffin. 10 μl of the mold killing detergent composition for hard surfaces of Tables 1 to 4 below was dripped onto the dirt portion of the plate, and it was left to stand at 25 ° C. for 5 minutes, and then washed with water. The cleaning power was evaluated visually and based on the following criteria.
：: All the dirt on the part where the composition was dropped ○: Although not all the dirt on the part where the composition was dropped, more than half of the dirt was dropped △: The dirt on the part where the composition was dropped, but Only less than half of the dirt is dropped ×: The dirt on the part where the above composition is dropped is hardly dropped

[Table 1]

[Table 2]

[table 3]

[Table 4]

In Tables 1 to 4, those with a ΔLog reduction of 4.5 or more exhibited a detection limit value, which means that the mold was killed by using a mold killing detergent composition on a hard surface, and the number of bacterial residues was extremely low.

[Test Example 2]
The following formulation ingredients were used to prepare the mold-resistant cleaner composition for hard surfaces shown in Table 5 and the following items were evaluated. The results are shown in Table 5. The fungicidal cleaner composition for hard surfaces in Table 5 was prepared by adding sodium hydrogen phosphate and sodium dihydrogen phosphate to 10 mM phosphate buffered aqueous solution (pH 7) prepared in ion-exchange water. (A) component, (b) component, (c2) component, (d) component, (Q) component are added in quantity, and these are melt | dissolved at room temperature (25 degreeC). When the pH after the preparation becomes other than 7, adjust to pH 7 using sodium hydroxide and / or hydrochloric acid. The pH value was measured by a glass electrode method. In addition, the mass% of the blending ingredients in Table 5 are all values based on the effective ingredients.

＜ Mixed ingredients ＞
(a) Ingredients: Na ₂ SO ₄ : sodium sulfate, manufactured by Wako Pure Chemical Industries, Ltd.

(b) Ingredients: benzyl alcohol: manufactured by Wako Pure Chemical Industries, Ltd., molecular weight 108
・ Phenoxyethanol: manufactured by Wako Pure Chemical Industries, Ltd., molecular weight 138

(c2) Ingredients · Sanisol 08: Octyl benzyl dimethyl ammonium chloride, in the general formula (c2), R ^11c is octyl, R ^12c and R ^13c are methyl, R ^14c is methylene, and Z ^- is Compounds of chloride ions, manufactured by Kao Corporation. C10BAC: benzyldimethyldecylammonium chloride. In formula (c2), R ^11c is an alkyl group having 10 carbon atoms, R ^12c and R ^13c are methyl groups, R ^14c is a compound of methylene group and Z ^- is a chloride ion, manufactured by Sigma-Aldrich Company · Sanisol C: alkyl (carbon number 8-18) benzyldimethylammonium chloride, R in the general formula (c2) ^11c is a compound having an alkyl group having 8 to 18 carbon atoms, R ^12c and R ^13c are methyl groups, R ^14c is a methylene group, and Z ^- is a chloride ion compound, manufactured by Kao Corporation

(d) Ingredients / BDG: Diethylene glycol butyl ether (Molecular weight: 162, logP: 0.66), manufactured by Japan Emulsifier Co., Ltd., (d2)
(Q) Emulgen 108: Polyoxyethylene (average addition mole number 6) Laurel ether, manufactured by Kao Corporation

＜ Evaluation method of fungicidal properties ＞
The fungicidal cleaner composition for hard surfaces shown in Table 5 was evaluated by the same method as the fungicidal evaluation method described in Test Example 1. ΔLog reduces the number of bacteria). The results are shown in Table 5. In the present invention, a ΔLog reduction bacteria count of 1.0 or more is considered acceptable. In the method for evaluating fungicidal properties described in Test Example 1, the test solution and the test spore solution were mixed and contacted for 1 minute (in the case where the test solution was physiological saline, the same contact was also performed for 1 minute). Other than that, evaluation was performed by the same method as that described in Test Example 1 to evaluate the bactericidal performance. The results are shown in Table 5.

＜ Evaluation of sebum cleanability ＞
The mold-cleaning detergent composition for hard surfaces shown in Table 5 evaluated the sebum-cleaning properties of the mold-cleaning detergent composition for each hard surface by the same method as the evaluation of the sebum-cleaning performance described in Test Example 1. The results are shown in Table 5.

[table 5]

In Table 5, the ΔLog reduction bacteria number of 4.5 or more shows a detection limit value, which means that the mold is killed by a mold killing detergent composition on a hard surface, and the number of bacterial residues is extremely small. In addition, the test example in which the evaluation result of the fungicidal property was described as "-" means that the evaluation of the fungicidal property was not performed.

[Test Example 3]
The following formulation ingredients were used to prepare the mold-resistant cleaner composition for hard surfaces shown in Table 6, and the following items were evaluated. The results are shown in Table 6. The mildew-resistant cleaner composition for hard surfaces in Table 6 was prepared by adding sodium hydrogen phosphate and sodium dihydrogen phosphate to 10 mM phosphate buffered aqueous solution (pH 7) prepared in ion-exchanged water, respectively. (A) component, (b) component, (c4) component, (d) component, and (R) component are added in quantity, and these are dissolved at room temperature (25 degreeC). When the pH after the preparation becomes other than 7, adjust to pH 7 using sodium hydroxide and / or hydrochloric acid. The pH value was measured by a glass electrode method. In addition, the mass% of the blending ingredients in Table 6 are all values based on the active ingredients.

＜ Mixed ingredients ＞
(a) Ingredients: Na ₂ SO ₄ : sodium sulfate, manufactured by Wako Pure Chemical Industries, Ltd.

(b) Ingredients and phenoxyethanol: manufactured by Wako Pure Chemical Industries, Ltd., molecular weight 138
・ Benzyl alcohol: manufactured by Wako Pure Chemical Industries, Ltd., molecular weight 108

(c4) Emulgen 108: Polyoxyethylene lauryl ether. In formula (c4), R ^21c is an alkyl group having 12 carbon atoms, s is 6, and t is 0. Manufactured by Kao Corporation.

(d) Ingredients / BDG: Diethylene glycol butyl ether (Molecular weight: 162, logP: 0.66), manufactured by Japan Emulsifier Co., Ltd., (d2)

(R) Ingredients ES-4.0K: Polyoxyethylene (average addition mole number 4) sodium alkyl ether sulfate, manufactured by Kao Corporation

＜ Evaluation method of fungicidal properties ＞
The fungicidal cleaner composition for hard surfaces shown in Table 6 was evaluated by the same method as the fungicidal evaluation method described in Test Example 1. ΔLog reduces the number of bacteria). The results are shown in Table 6. In the present invention, a ΔLog reduction bacteria count of 1.0 or more is considered acceptable.

＜ Evaluation of sebum cleanability ＞
About the mold killing detergent composition for hard surfaces shown in Table 6, the sebum cleaning property of the mold killing detergent composition for each hard surface was evaluated by the same method as the evaluation of the sebum cleaning property described in Test Example 1. The results are shown in Table 6.

[TABLE 6]

In Table 6, the ΔLog reduction bacteria number of 4.5 or more shows the detection limit value, which means that the mold is killed by a mold killing detergent composition on a hard surface, and the number of bacterial residues is extremely small.

[Test Example 4]
The following formulation ingredients were used to prepare the mold-resistant cleaner composition for hard surfaces shown in Table 7, and the following items were evaluated. The results are shown in Table 7. The fungicidal cleaner composition for hard surfaces in Table 7 was prepared by adding sodium hydrogen phosphate and sodium dihydrogen phosphate to 10 mM phosphate buffered aqueous solution (pH 7) prepared in ion-exchange water. (A) component, (b) component, (e) component, (S) component, and (d) component are added in quantity, and these are melt | dissolved at room temperature (25 degreeC). When the pH after the preparation becomes other than 7, adjust to pH 7 using sodium hydroxide and / or hydrochloric acid. The pH value was measured by a glass electrode method. In addition, the mass% of the blending ingredients in Table 7 are all values based on the active ingredients.

＜ Mixed ingredients ＞
(a) Ingredients: Na ₂ SO ₄ : sodium sulfate, manufactured by Wako Pure Chemical Industries, Ltd.
(b) Ingredients: benzyl alcohol: manufactured by Wako Pure Chemical Industries, Ltd., molecular weight 108
(e) Ingredients · EDTA-4Na: Ethylenediamine tetraacetic acid sodium salt, manufactured by Tongren Chemical Research Institute Co., Ltd.

(S) Ingredients ES-4.0K: Polyoxyethylene (average addition mole number 4) Sodium lauryl ether sulfate, manufactured by Kao Corporation ・ Emulgen 108: Average addition mole number of ethoxylate is 6 Moore's polyoxyethylene lauryl ether, manufactured by Kao Corporation. Amphitol 20N: Amine oxide, manufactured by Kao Corporation. R ^5c in formula (c12) is dodecyl (a linear alkyl group with 12 carbon atoms). Compounds in which R ^6c and R ^7c are methyl, m and p are 0
(d) Ingredients / BDG: Diethylene glycol butyl ether (Molecular weight: 162, logP: 0.66), manufactured by Japan Emulsifier Co., Ltd., (d2)

＜ Evaluation method of fungicidal properties ＞
For the mold killing detergent composition for hard surfaces shown in Table 7, in the mold killing evaluation method described in Test Example 1, the test solution and the test spore solution were mixed and contacted for 10 minutes (the test solution was physiological In the case of salt water, it was also exposed for 10 minutes in the same manner), except that the evaluation was performed by the same method as described in Test Example 1, and the bactericidal performance (ΔLog Reduce bacteria count). The results are shown in Table 7. In the present invention, a ΔLog reduction bacteria count of 1.0 or more is considered acceptable.

＜ Evaluation of soap residue cleanability ＞
The model soap scum stain prepared with reference to the composition of soap scum stain attached to the bathroom was used as a film on a polypropylene flat plate (size 8 cm × 12 cm). The method for preparing and filming the model soap residue is to immerse the above-mentioned plate in an aqueous solution (2% by mass) and an aqueous solution of calcium chloride (0.7% by mass) in which solid soap (made by Kao Corporation) is dissolved. %), And then the drying step was repeated 10 times, thereby preparing and forming the mold soap residue dirt. After the model soap residue was formed on the above-mentioned plate, 10 μl of the mold killing detergent composition on the hard surface of Table 7 was dripped onto the dirt portion of the plate, and it was left at 25 ° C for 10 minutes, and then washed with water. The cleaning power was evaluated on the following criteria.
：: All the dirt on the part where the composition was dropped ○: Although not all the dirt on the part where the composition was dropped, more than half of the dirt was dropped △: The dirt on the part where the composition was dropped, but Less than half of the amount of dirt dropped ×: The dirt on the part where the above composition was dropped hardly dropped

[TABLE 7]

In Table 7, a ΔLog reduction bacteria number of 4.5 or more shows a detection limit value, which means that the mold is killed by a mold killing detergent composition on a hard surface, and the number of bacterial residues is extremely small.

Claims (12)

A fungicidal cleaner composition for a hard surface, which contains (a) a water-soluble inorganic salt [hereinafter, referred to as (a) component] of 0.1% by mass or more and 5% by mass or less, and 0.05% by mass or more and 7% by mass or less ( b) Non-ionic fungicide [hereinafter, referred to as (b) component], (c1) at least 0.1% by mass and 5% by mass or less (c1) one or more selected from betaine-type surfactants and amine oxide-type surfactants Surface active agent [hereinafter, referred to as (c1) component], any surface active agent other than (P) (c1) component [hereinafter, referred to as (P) component], and water, and the content of (c1) component The mass ratio (c1) / [(c1) + (P)] to the total content of the (c1) component and (P) component is 0.30 or more and 1.0 or less, and the mold killing detergent composition for hard surfaces is at 25 ° C. The pH value is 5 or more and 9 or less. The mildew-resistant cleaner composition for a hard surface according to claim 1, wherein the (P) component contains at least one selected from the group consisting of (c2) a cationic surfactant and (c3) an anionic surfactant. The mildew-resistant cleaner composition for a hard surface as claimed in claim 1 or 2, further comprising (d) a solvent (except for the component (b)). A fungicidal cleaner composition for a hard surface, which contains (a) a water-soluble inorganic salt [hereinafter, referred to as (a) component] of 0.1% by mass or more and 5% by mass or less, and 0.05% by mass or more and 7% by mass or less ( b) Non-ionic fungicides [hereinafter, referred to as (b) component], (c2) cationic surfactants from 0.1% by mass to 5% by mass, (d) solvents (but excluding component (b)), and water And the pH value of the mold killing detergent composition for hard surfaces at 25 ° C. is 5 or more and 9 or less. A fungicidal cleaner composition for a hard surface, which contains (a) a water-soluble inorganic salt [hereinafter, referred to as (a) component] of 0.1% by mass to 5% by mass, and 0.05% by mass of 7% by mass ( b) a non-ionic fungicide [hereinafter, referred to as (b) component], (c4) a non-ionic surfactant [except for (b) component, hereinafter, referred to as (c4) component], and water, and (a ) And the total content of the component (b) is 1.5% by mass or more and 10% by mass or less, and the total content of the surfactant is 10% by mass or less. The pH of the mildew-resistant cleaner composition for hard surfaces at 25 ° C Less than 12. The mildew-resistant cleaner composition for a hard surface as claimed in claim 5, further comprising (d) a solvent (except for the component (b)). For example, the mildew-resistant cleaner composition for hard surface of claim 5 or 6, which has a pH value of 5 to 9 at 25 ° C. A fungicidal cleaner composition for a hard surface, which contains (a) a water-soluble inorganic salt [hereinafter, referred to as (a) component] of 0.1% by mass to 5% by mass, and 0.05% by mass of 7% by mass ( b) Nonionic fungicide [hereinafter, referred to as (b) component], (e) metal blocking agent [hereinafter, referred to as (e) component] from 0.01% by mass to 7% by mass, water, and optionally ( S) Surfactant [hereinafter, referred to as (S) component], and the content of (S) component is 10% by mass or less, and the pH value of the mold killing detergent composition for hard surface at 25 ° C is 5 or more 9 the following. The fungicidal cleaner composition for hard surfaces according to any one of claims 1 to 8, wherein (a) the component is selected from the group consisting of alkali metal sulfates, alkaline earth metal sulfates, alkali metal chlorides and alkaline earth metal chlorides. 1 or more water-soluble inorganic salts. The mold killing detergent composition for hard surfaces according to any one of claims 1 to 9, wherein the component (b) is a nonionic sterilization having an aromatic group and a hydroxyl group which may have a substituent and a molecular weight of 106 to 300. Agent. The mildew-resistant cleaner composition for a hard surface according to any one of claims 1 to 10, wherein the component (b) is selected from the group consisting of benzyl alcohol, phenoxyethanol, diethylene glycol phenyl ether, triclosan, and dichloride One or more non-ionic fungicides in sand and isopropyl methylphenol. A hard surface treatment method in which a mold killing detergent composition for a hard surface according to any one of claims 1 to 11 is brought into contact with a hard surface on which mold is present, and mold killing and cleaning are performed simultaneously.