JP2022060323A - Mold sterilizing agent composition - Google Patents
Mold sterilizing agent composition Download PDFInfo
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- JP2022060323A JP2022060323A JP2022018917A JP2022018917A JP2022060323A JP 2022060323 A JP2022060323 A JP 2022060323A JP 2022018917 A JP2022018917 A JP 2022018917A JP 2022018917 A JP2022018917 A JP 2022018917A JP 2022060323 A JP2022060323 A JP 2022060323A
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- 239000000203 mixture Substances 0.000 title claims abstract description 65
- 239000003206 sterilizing agent Substances 0.000 title abstract 3
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 65
- 150000001875 compounds Chemical class 0.000 claims abstract description 32
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 24
- 125000001183 hydrocarbyl group Chemical group 0.000 claims abstract description 7
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 4
- 230000000855 fungicidal effect Effects 0.000 claims description 31
- 239000000417 fungicide Substances 0.000 claims description 31
- -1 aliphatic alcohols Chemical class 0.000 claims description 23
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 14
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 claims description 12
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 claims description 12
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 claims description 10
- AQIXEPGDORPWBJ-UHFFFAOYSA-N pentan-3-ol Chemical compound CCC(O)CC AQIXEPGDORPWBJ-UHFFFAOYSA-N 0.000 claims description 10
- 241000233866 Fungi Species 0.000 claims description 9
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 9
- BBMCTIGTTCKYKF-UHFFFAOYSA-N 1-heptanol Chemical compound CCCCCCCO BBMCTIGTTCKYKF-UHFFFAOYSA-N 0.000 claims description 8
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 claims description 6
- 150000002191 fatty alcohols Chemical class 0.000 claims 1
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 abstract description 6
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 abstract description 4
- 125000001931 aliphatic group Chemical group 0.000 abstract description 4
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 abstract description 4
- 230000001954 sterilising effect Effects 0.000 abstract description 2
- 125000000217 alkyl group Chemical group 0.000 description 33
- 239000003139 biocide Substances 0.000 description 26
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- 230000000694 effects Effects 0.000 description 18
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- 239000000126 substance Substances 0.000 description 18
- 238000013329 compounding Methods 0.000 description 13
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- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 10
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- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 6
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- 230000000844 anti-bacterial effect Effects 0.000 description 6
- KWIUHFFTVRNATP-UHFFFAOYSA-N glycine betaine Chemical compound C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 description 6
- 239000012085 test solution Substances 0.000 description 6
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- 125000001453 quaternary ammonium group Chemical class 0.000 description 5
- 229940015975 1,2-hexanediol Drugs 0.000 description 4
- WRMNZCZEMHIOCP-UHFFFAOYSA-N 2-phenylethanol Chemical compound OCCC1=CC=CC=C1 WRMNZCZEMHIOCP-UHFFFAOYSA-N 0.000 description 4
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- 150000008045 alkali metal halides Chemical class 0.000 description 4
- FHKSXSQHXQEMOK-UHFFFAOYSA-N hexane-1,2-diol Chemical compound CCCCC(O)CO FHKSXSQHXQEMOK-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- WCVRQHFDJLLWFE-UHFFFAOYSA-N pentane-1,2-diol Chemical compound CCCC(O)CO WCVRQHFDJLLWFE-UHFFFAOYSA-N 0.000 description 4
- 229960005323 phenoxyethanol Drugs 0.000 description 4
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 3
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- 239000002253 acid Substances 0.000 description 3
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- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 description 3
- 229910052939 potassium sulfate Inorganic materials 0.000 description 3
- 235000011151 potassium sulphates Nutrition 0.000 description 3
- 229910052938 sodium sulfate Inorganic materials 0.000 description 3
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- 239000002904 solvent Substances 0.000 description 3
- 239000011550 stock solution Substances 0.000 description 3
- OOCCDEMITAIZTP-QPJJXVBHSA-N (E)-cinnamyl alcohol Chemical compound OC\C=C\C1=CC=CC=C1 OOCCDEMITAIZTP-QPJJXVBHSA-N 0.000 description 2
- LUBJCRLGQSPQNN-UHFFFAOYSA-N 1-Phenylurea Chemical compound NC(=O)NC1=CC=CC=C1 LUBJCRLGQSPQNN-UHFFFAOYSA-N 0.000 description 2
- VAJVDSVGBWFCLW-UHFFFAOYSA-N 3-Phenyl-1-propanol Chemical compound OCCCC1=CC=CC=C1 VAJVDSVGBWFCLW-UHFFFAOYSA-N 0.000 description 2
- MQVMITUCTLYRNV-UHFFFAOYSA-N 3-hexoxypropane-1,2-diol Chemical compound CCCCCCOCC(O)CO MQVMITUCTLYRNV-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 241000222290 Cladosporium Species 0.000 description 2
- 241000588724 Escherichia coli Species 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 2
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- XUMBMVFBXHLACL-UHFFFAOYSA-N Melanin Chemical compound O=C1C(=O)C(C2=CNC3=C(C(C(=O)C4=C32)=O)C)=C2C4=CNC2=C1C XUMBMVFBXHLACL-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 235000002595 Solanum tuberosum Nutrition 0.000 description 2
- 244000061456 Solanum tuberosum Species 0.000 description 2
- 229930006000 Sucrose Natural products 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 150000005215 alkyl ethers Chemical class 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 2
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 2
- 235000011130 ammonium sulphate Nutrition 0.000 description 2
- 239000003429 antifungal agent Substances 0.000 description 2
- 229940121375 antifungal agent Drugs 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- FLJPGEWQYJVDPF-UHFFFAOYSA-L caesium sulfate Chemical compound [Cs+].[Cs+].[O-]S([O-])(=O)=O FLJPGEWQYJVDPF-UHFFFAOYSA-L 0.000 description 2
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- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 239000008121 dextrose Substances 0.000 description 2
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 125000005313 fatty acid group Chemical group 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- 150000004676 glycans Chemical class 0.000 description 2
- 150000002338 glycosides Chemical class 0.000 description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- WQYVRQLZKVEZGA-UHFFFAOYSA-N hypochlorite Chemical compound Cl[O-] WQYVRQLZKVEZGA-UHFFFAOYSA-N 0.000 description 2
- 229910017053 inorganic salt Inorganic materials 0.000 description 2
- 230000000813 microbial effect Effects 0.000 description 2
- HLERILKGMXJNBU-UHFFFAOYSA-N norvaline betaine Chemical compound CCCC(C([O-])=O)[N+](C)(C)C HLERILKGMXJNBU-UHFFFAOYSA-N 0.000 description 2
- 125000005702 oxyalkylene group Chemical group 0.000 description 2
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- 235000010344 sodium nitrate Nutrition 0.000 description 2
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- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 2
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- OWTXHZITCDRRTI-UHFFFAOYSA-N 3-cyclohexyloxypropane-1,2-diol Chemical compound OCC(O)COC1CCCCC1 OWTXHZITCDRRTI-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
本発明は殺黴剤組成物に関する。 The present invention relates to an antifungal composition.
日本は高温多湿であるので浴室などの水周りの環境は湿度が高く、しかも石鹸かす汚れや皮脂汚れが存在するため菌などの微生物の繁殖が助長され、ピンク汚れ、黴汚れなどの菌に由来する汚れが発生しやすい。これらの汚れは次亜塩素酸塩などの強力な殺菌剤で死滅させることが一般的に行われているが、塩素などの発生が危惧され、独特の臭いが伴うため、手軽に用いることが難しい。このため、一般的には、これらの菌由来の汚れの発生をできるだけ回避するためには、日常からこまめな掃除を行うか、長時間の掃除を行うことで対応している。またイソチアゾリン系化合物、ニトロアルコール系化合物、ニトリル系化合物、ジチオール系化合物、フェノール系化合物、フェニルウレア系化合物、カーバメート系化合物、スルファミド系化合物、フタルイミド系化合物、ピリジン系化合物、グアニジン系化合物、トリアゾール系化合物、チアゾール系化合物、ベンゾイミダゾール系化合物等の防黴剤を用いることも行われているが、防黴剤の効果は一時的なものであり、黴の繁殖を恒久的に防止することは出来ない。 Since Japan is hot and humid, the environment around water such as bathrooms is humid, and the presence of soap scum stains and sebum stains promotes the growth of microorganisms such as fungi, which are derived from fungi such as pink stains and mold stains. It is easy to get dirty. These stains are generally killed with a strong disinfectant such as hypochlorite, but it is difficult to use easily because there is a concern that chlorine will be generated and a unique odor is involved. .. For this reason, in general, in order to avoid the generation of stains derived from these bacteria as much as possible, it is necessary to perform frequent cleaning on a daily basis or long-term cleaning. In addition, isothiazolin-based compounds, nitroalcohol-based compounds, nitrile-based compounds, dithiol-based compounds, phenol-based compounds, phenylurea-based compounds, carbamate-based compounds, sulfamide-based compounds, phthalimide-based compounds, pyridine-based compounds, guanidine-based compounds, and triazole-based compounds. , Thiazol-based compounds, benzoimidazole-based compounds, and other antifungal agents have also been used, but the effects of the antifungal agents are temporary, and the growth of the mold cannot be permanently prevented. ..
そのため繁殖が進む前の黴菌を殺菌する方法が研究されている。特許文献1、特許文献2には、カチオン系殺菌剤の殺菌力をグルコールエーテル化合物で増強させた殺黴に効果を有する技術が開示されている。 Therefore, a method for sterilizing molds before breeding has been studied. Patent Document 1 and Patent Document 2 disclose a technique having an effect on mold killing in which the bactericidal activity of a cationic fungicide is enhanced by a glucol ether compound.
特許文献3にはフェノール系殺菌剤とアルコールを含有する硬質表面用殺菌処理剤が黴菌に対しても有効に作用することが記載されている。 Patent Document 3 describes that a bactericidal treatment agent for a hard surface containing a phenolic bactericidal agent and an alcohol acts effectively against fungi.
特許文献4には殺微生物剤としてベンジルアルコールなどの芳香族アルコールとグリコールエーテル系溶剤を併用する殺微生物用組成物が開示されている。 Patent Document 4 discloses a composition for microbial killing in which an aromatic alcohol such as benzyl alcohol and a glycol ether solvent are used in combination as a microbial killing agent.
本発明は、浴室等の生活環境に存在する黴に対して優れた殺黴効果を発揮できる殺黴用組成物を提供する。 The present invention provides a mold-killing composition capable of exerting an excellent mold-killing effect on mold existing in a living environment such as a bathroom.
本発明は、(a)下記一般式(a-1)で表される化合物[以下、(a)成分という]、(b)下記の(b1)~(b3)の化合物から選ばれる1種以上[以下、(b)成分という]、及び水を含有する殺黴剤組成物に関する。
(b1):炭素数3以上10以下の脂肪族アルコール
(b2):炭素数3以上10以下の脂肪族ジオール(但し、(b3)成分は除く)
(b3):炭素数4以上10以下の脂肪族グリセリルエーテル
The present invention is one or more selected from (a) a compound represented by the following general formula (a-1) [hereinafter referred to as (a) component] and (b) the following compounds (b1) to (b3). [Hereinafter referred to as (b) component], and a fungicide composition containing water.
(B1): Aliphatic alcohol having 3 or more and 10 or less carbon atoms (b2): Aliphatic diol having 3 or more and 10 or less carbon atoms (however, the component (b3) is excluded)
(B3): Aliphatic glyceryl ether having 4 or more and 10 or less carbon atoms
(式中、R1aは炭素数1以上4以下の二価の炭化水素基であり、r、lは、0又は1の整数であるが、lが0の場合にはrは1の整数である。Aは炭素数2以上4以下のアルキレン基である。) (In the formula, R 1a is a divalent hydrocarbon group having 1 or more carbon atoms and 4 or less carbon atoms, and r and l are 0 or an integer of 1, but when l is 0, r is an integer of 1. A is an alkylene group having 2 or more and 4 or less carbon atoms.)
また本発明は、前記殺黴剤組成物を、黴菌が存在する対象表面に30秒以上接触させる殺黴方法に関する。 The present invention also relates to a mold-killing method in which the mold-killing agent composition is brought into contact with a surface of an object in which fungi are present for 30 seconds or longer.
本発明によれば、浴室等の生活環境に存在する黴に対して優れた殺黴効果を発揮できる殺黴剤組成物が提供される。 According to the present invention, there is provided a mold-killing agent composition capable of exerting an excellent mold-killing effect on mold existing in a living environment such as a bathroom.
〔殺黴剤組成物〕
本発明の殺黴剤組成物が、黴に対して優れた殺黴効果を発揮できる理由は必ずしも定かではないが、以下のように推定される。黴は細胞膜より外側に厚い細胞壁を有する。黴の細胞壁はグルカン・キチン等で構成される多糖層、メラニン層、ハイドロフォービン層等により構成される。この細胞壁の存在により、大腸菌等の一般細菌と比較して、黴は細胞内部への殺菌剤の浸透性が低く、短時間で十分な殺黴効果が得られないことが課題であると考えられる。しかしながら、本発明の殺黴剤組成物は、多糖層の構造変化を促す(b)成分との併用で、殺菌剤である(a)成分の浸透性を高めることにより短時間で殺黴効果を得ることを可能にしたと推定される。
[Moldicide composition]
The reason why the mold-killing agent composition of the present invention can exert an excellent mold-killing effect on mold is not always clear, but it is presumed as follows. The mold has a thick cell wall outside the cell membrane. The cell wall of mold is composed of a polysaccharide layer composed of glucan, chitin and the like, a melanin layer, a hydrophobin layer and the like. Due to the presence of this cell wall, it is considered that the problem is that mold has a lower permeability of the fungicide into the cell than general bacteria such as Escherichia coli, and a sufficient mold-killing effect cannot be obtained in a short time. .. However, the fungicide composition of the present invention, in combination with the component (b) that promotes structural changes in the polysaccharide layer, enhances the permeability of the component (a), which is a fungicide, to achieve a fungicide effect in a short time. It is presumed that it made it possible to obtain.
<(a)成分>
本発明の(a)成分は、下記一般式(a-1)で表される化合物である。
<(A) component>
The component (a) of the present invention is a compound represented by the following general formula (a-1).
(式中、R1aは炭素数1以上4以下の二価の炭化水素基であり、r、lは、0又は1の整数であるが、lが0の場合にはrは1の整数である。Aは炭素数2以上4以下のアルキレン基である。) (In the formula, R 1a is a divalent hydrocarbon group having 1 or more carbon atoms and 4 or less carbon atoms, and r and l are 0 or an integer of 1, but when l is 0, r is an integer of 1. A is an alkylene group having 2 or more and 4 or less carbon atoms.)
R1aの炭素数は、配合安定性の観点から、好ましくは4以下、より好ましくは2以下である。
r、lは、殺黴効果の観点から、rが1であり、且つlが0であることが好ましい。
The carbon number of R 1a is preferably 4 or less, more preferably 2 or less, from the viewpoint of compounding stability.
For r and l, it is preferable that r is 1 and l is 0 from the viewpoint of the fungicide effect.
(a)成分は、具体的には、ベンジルアルコール(分子量:108)、フェノキシエタノール(分子量:138)、2-フェニルエタノール(分子量:122)、3-フェニル-1-プロパノール(分子量:136)、及びシンナミルアルコール(分子量:134)から選ばれる1種以上が好ましく、ベンジルアルコール、フェノキシエタノール、及び2-フェニルエタノールから選ばれる1種以上がより好ましく、ベンジルアルコール、及びフェノキシエタノールから選ばれる1種以上が更に好ましい。 Specifically, the component (a) includes benzyl alcohol (molecular weight: 108), phenoxyethanol (molecular weight: 138), 2-phenylethanol (molecular weight: 122), 3-phenyl-1-propanol (molecular weight: 136), and One or more selected from cinnamyl alcohol (molecular weight: 134) is preferable, one or more selected from benzyl alcohol, phenoxyethanol, and 2-phenylethanol is more preferable, and one or more selected from benzyl alcohol and phenoxyethanol are further preferable. preferable.
<(b)成分>
本発明の(b)成分は、下記の(b1)~(b3)の化合物から選ばれる1種以上である。
(b1):炭素数3以上10以下の脂肪族アルコール
(b2):炭素数3以上10以下の脂肪族ジオール(但し、(b3)成分は除く)
(b3):炭素数4以上10以下の脂肪族グリセリルエーテル
<(B) component>
The component (b) of the present invention is one or more selected from the following compounds (b1) to (b3).
(B1): Aliphatic alcohol having 3 or more and 10 or less carbon atoms (b2): Aliphatic diol having 3 or more and 10 or less carbon atoms (however, the component (b3) is excluded)
(B3): Aliphatic glyceryl ether having 4 or more and 10 or less carbon atoms
(b)成分は、殺黴効果及び水相から菌体への分配という観点から、logP値が、好ましくは0以上、より好ましくは0.5以上、そして、配合安定性の観点から、好ましくは3以下、より好ましくは2以下である化合物が好適である。 The component (b) has a logP value of preferably 0 or more, more preferably 0.5 or more, and preferably from the viewpoint of compounding stability, from the viewpoint of antifungal effect and distribution from the aqueous phase to the cells. A compound having 3 or less, more preferably 2 or less is preferable.
本発明において、logP値とは、水と1-オクタノールに対する有機化合物の親和性を示す係数である。1-オクタノール/水分配係数Pは、1-オクタノールと水の2液相の溶媒に微量の化合物が溶質として溶け込んだときの分配平衡で、それぞれの溶媒中における化合物の平衡濃度の比であり、底10に対するそれらの対数logPの形で示すのが一般的である。多くの化合物のlogP値が報告されており、Daylight Chemical Information Systems, Inc. (Daylight CIS)等から入手しうるデータベースには多くの値が掲載されているので参照できる。実測のlogP値がない場合には、Daylight CISから入手できるプログラム「CLOGP」等で計算することができる。このプログラムは、実測のlogP値がある場合にはそれと共に、Hansch, Leoのフラグメントアプローチにより算出される「計算logP(ClogP)」の値を出力する。 In the present invention, the logP value is a coefficient indicating the affinity of the organic compound for water and 1-octanol. The 1-octanol / water partition coefficient P is the partition equilibrium when a trace amount of the compound is dissolved as a solute in the solvent of the two-component phase of 1-octanol and water, and is the ratio of the equilibrium concentration of the compound in each solvent. It is generally shown in the form of their loglogP for the base 10. The logP values of many compounds have been reported, and many values are listed in databases available from Daylight Chemical Information Systems, Inc. (Daylight CIS), etc., which can be referred to. If there is no actually measured logP value, it can be calculated by the program "CLOGP" etc. available from Daylight CIS. This program outputs the value of "calculated logP (ClogP)" calculated by Hansch, Leo's fragment approach together with the actually measured logP value, if any.
フラグメントアプローチは化合物の化学構造に基づいており、原子の数及び化学結合のタイプを考慮している(cf. A. Leo, Comprehensive Medicinal Chemistry, Vol.4, C. Hansch,P.G. Sammens, J.B. Taylor and C.A. Ramsden, Eds., p.295, Pergamon Press, 1990)。このClogP値を、化合物の選択に際して実測のlogP値の代わりに用いることができる。本発明では、logPの実測値があればそれを、無い場合はプログラムCLOGP v4.01により計算したClogP値を用いる。 The fragment approach is based on the chemical structure of the compound and takes into account the number of atoms and the type of chemical bond (cf. A. Leo, Comprehensive Medicinal Chemistry, Vol. 4, C. Hansch, P.G. Sammens, J.B. Taylor and C.A. Ramsden, Eds., P.295, Pergamon Press, 1990). This LogP value can be used in place of the measured logP value when selecting a compound. In the present invention, if there is an actually measured value of logP, it is used, and if not, the LogP value calculated by the program CLOGP v4.01 is used.
(b1)である、炭素数3以上10以下の脂肪族アルコールとしては、1-プロパノール(分子量:60、logP:0.55)、2-プロパノール(分子量:60、logP:0.38)、1-ヘキサノール(分子量:102、logP:1.80)、1-ペンタノール(分子量:88、logP:1.39)、3-ペンタノール(分子量:88、logP:1.36)、1-ブタノール(分子量:74、logP:0.97)、2-ブタノール(分子量:74、logP:0.87)、tert-ブタノール(分子量:74、logP:0.60)、1-ヘプタノール(分子量:116、logP:2.22)、及び1-オクタノール(分子量:130.23、logP:2.64)から選ばれる1種以上が挙げられ、殺黴効果と配合安定性の両立という観点から、1-プロパノール、2-プロパノール、1-ブタノール、2-ブタノール、tert-ブタノール、1-ペンタノール、3-ペンタノール、1-ヘキサノール、及び1-ヘプタノールから選ばれる1種以上が好ましく、1-ブタノール、2-ブタノール、1-ペンタノール、及び3-ペンタノールから選ばれる1種以上がより好ましい。 Examples of the aliphatic alcohol having 3 or more and 10 or less carbon atoms, which is (b1), include 1-propanol (molecular weight: 60, logP: 0.55), 2-propanol (molecular weight: 60, logP: 0.38), and 1 -Hexanol (molecular weight: 102, logP: 1.80), 1-pentanol (molecular weight: 88, logP: 1.39), 3-pentanol (molecular weight: 88, logP: 1.36), 1-butanol (molecular weight: 88, logP: 1.36) Molecular weight: 74, logP: 0.97), 2-butanol (molecular weight: 74, logP: 0.87), tert-butanol (molecular weight: 74, logP: 0.60), 1-heptanol (molecular weight: 116, logP) : 2.22), and 1 or more selected from 1-octanol (molecular weight: 130.23, logP: 2.64) can be mentioned. One or more selected from 2-propanol, 1-butanol, 2-butanol, tert-butanol, 1-pentanol, 3-pentanol, 1-hexanol, and 1-heptanol is preferable, and 1-butanol and 2-butanol are preferable. , 1-pentanol, and 3-pentanol are more preferred.
(b2)である炭素数3以上10以下の脂肪族ジオールは、殺黴効果の観点から、下記一般式(b-2)で表される化合物が好ましい。
R1c-CH(OH)-(CH2)m-CH2OH (b-2)
(式中、R1cは水素原子又は炭素数1以上8以下のアルキル基又はアルケニル基であり、mは0又は1以上6以下の整数である。但し、化合物中の総炭素数が3以上10以下である。)
The aliphatic diol having 3 or more carbon atoms and 10 or less carbon atoms according to (b2) is preferably a compound represented by the following general formula (b-2) from the viewpoint of an antifungal effect.
R 1c -CH (OH)-(CH 2 ) m -CH 2 OH (b-2)
(In the formula, R 1c is a hydrogen atom or an alkyl group or an alkenyl group having 1 or more and 8 or less carbon atoms, and m is 0 or an integer of 1 or more and 6 or less. However, the total number of carbon atoms in the compound is 3 or more and 10 or more. It is as follows.)
R1cは、殺黴効果の観点から、水素原子又は炭素数2以上8以下のアルキル基又はアルケニル基が好ましく、炭素数3以上8以下のアルキル基又はアルケニル基がより好ましく、炭素数4以上8以下のアルキル基又はアルケニル基が更に好ましい。
mは、殺黴効果の観点から、好ましくは1以下である。
From the viewpoint of the killing effect, R 1c is preferably a hydrogen atom or an alkyl group or alkenyl group having 2 or more and 8 or less carbon atoms, more preferably an alkyl group or alkenyl group having 3 or more and 8 or less carbon atoms, and 4 or more and 8 carbon atoms. The following alkyl or alkenyl groups are more preferred.
m is preferably 1 or less from the viewpoint of the mold-killing effect.
(b2)は、具体的には、1,2-ヘキサンジオール(分子量:118、logP:0.85)、1,2-ペンタンジオール(分子量:104、logP:0.43)、プロピレングリコール(分子量:76、logP:0.40)、1,6-ヘキサンジオール(分子量:118、logP:0.60)、1,2-ブタンジオール(分子量:90、logP:0.01)、1,4-ブタンジオール(分子量:90、logP:-0.23)、1,3-ブタンジオール(分子量:90、logP:0.-0.37)、1,5-ペンタンジオール(分子量:104、logP:0.19)、1,2-オクタンジオール(分子量:146、logP:1.68)、及び1,8-オクタンジオール(分子量:146、logP:1.44)から選ばれる1種以上が挙げられ、殺黴効果と配合安定性の両立という観点から、1,2-ヘキサンジオール、1,2-ペンタンジオール、プロピレングリコール、及び1,6-ヘキサンジオールから選ばれる1種以上が好ましく、1,2-ヘキサンジオール及び1,2-ペンタンジオールから選ばれる1種以上がより好ましい。 Specifically, (b2) is 1,2-hexanediol (molecular weight: 118, logP: 0.85), 1,2-pentanediol (molecular weight: 104, logP: 0.43), propylene glycol (molecular weight). : 76, logP: 0.40), 1,6-hexanediol (molecular weight: 118, logP: 0.60), 1,2-butanediol (molecular weight: 90, logP: 0.01), 1,4- Butanediol (molecular weight: 90, logP: -0.23), 1,3-butanediol (molecular weight: 90, logP: 0-0.37), 1,5-pentanediol (molecular weight: 104, logP: 0) .19), 1,2-octanediol (molecular weight: 146, logP: 1.68), and 1,8-octanediol (molecular weight: 146, logP: 1.44). From the viewpoint of achieving both a mold-killing effect and compounding stability, one or more selected from 1,2-hexanediol, 1,2-pentanediol, propylene glycol, and 1,6-hexanediol is preferable, and 1,2-hexanediol is preferable. More preferably, one or more selected from hexanediol and 1,2-pentanediol.
(b3)である炭素数4以上10以下の脂肪族グリセリルエーテルは、殺黴効果の観点から、下記一般式(b-3)で表される化合物が好ましい。
R2cO-CH2-CH(OH)-CH2OH (b-3)
(式中、R2cは炭素数1以上、好ましくは4以上、そして、7以下、好ましくは6以下の炭化水素基、好ましくはアルキル基又はアルケニル基である。)
The aliphatic glyceryl ether having 4 or more and 10 or less carbon atoms according to (b3) is preferably a compound represented by the following general formula (b-3) from the viewpoint of an antifungal effect.
R 2c O-CH 2 -CH (OH) -CH 2 OH (b-3)
(In the formula, R 2c is a hydrocarbon group having 1 or more carbon atoms, preferably 4 or more, and 7 or less, preferably 6 or less, preferably an alkyl group or an alkenyl group.)
(b3)は、具体的には、ヘキシルグリセリルエーテル(分子量:176、logP:1.11)、及びシクロヘキシルグリセリルエーテル(分子量:174、logP:0.58)から選ばれる1種以上が挙げられ、殺黴効果の観点から、ヘキシルグリセリルエーテルが好ましい。 Specific examples of (b3) include one or more selected from hexyl glyceryl ether (molecular weight: 176, logP: 1.11) and cyclohexyl glyceryl ether (molecular weight: 174, logP: 0.58). From the viewpoint of mold-killing effect, hexyl glyceryl ether is preferable.
(b)成分は、殺黴効果と配合安定性の両立という観点から、(b1)、及び(b2)の化合物から選ばれる1種以上が好ましく、(b1)がより好ましい。 The component (b) is preferably one or more selected from the compounds of (b1) and (b2), and more preferably (b1), from the viewpoint of achieving both an antifungal effect and compounding stability.
<組成等>
本発明の殺黴剤組成物は、(a)成分を、殺黴効果の観点から、好ましくは0.1質量%以上、より好ましくは1質量%以上、更に好ましくは1.4質量%以上、そして、配合安定性の観点から、好ましくは10質量%以下、より好ましくは3質量%以下、更に好ましくは2質量%以下含有する。
<Composition, etc.>
In the mold-killing agent composition of the present invention, the component (a) is preferably 0.1% by mass or more, more preferably 1% by mass or more, still more preferably 1.4% by mass or more, from the viewpoint of the mold-killing effect. From the viewpoint of compounding stability, the content is preferably 10% by mass or less, more preferably 3% by mass or less, and further preferably 2% by mass or less.
本発明の殺黴剤組成物は、(b)成分を、殺黴効果の観点から、好ましくは0.1質量%以上、より好ましくは1.0質量%以上、更に好ましくは3質量%以上、そして、配合安定性の観点から、好ましくは10質量%以下、より好ましくは8質量%以下、更に好ましくは6質量%以下含有する。 In the mold-killing agent composition of the present invention, the component (b) is preferably 0.1% by mass or more, more preferably 1.0% by mass or more, still more preferably 3% by mass or more, from the viewpoint of the killing effect. From the viewpoint of compounding stability, the content is preferably 10% by mass or less, more preferably 8% by mass or less, and further preferably 6% by mass or less.
本発明の殺黴剤組成物において、(a)成分の含有量と(b)成分の含有量との合計は、殺黴効果の観点から、好ましくは1.0質量%以上、より好ましくは3.0質量%以上、更に好ましくは5.0質量%以上、そして、配合安定性の観点から、好ましくは15質量%以下、より好ましくは10質量%以下、更に好ましくは8質量%以下である。 In the fungicide composition of the present invention, the total of the content of the component (a) and the content of the component (b) is preferably 1.0% by mass or more, more preferably 3 from the viewpoint of the fungicide effect. It is 0.0% by mass or more, more preferably 5.0% by mass or more, and from the viewpoint of compounding stability, it is preferably 15% by mass or less, more preferably 10% by mass or less, still more preferably 8% by mass or less.
本発明の殺黴剤組成物において、(a)成分の含有量と(b)成分の含有量との質量比(a)/(b)は、0.1以上、更に0.2以上、更に0.3以上、そして、50以下、更に10以下、更に5以下から選択できる。 In the fungicide composition of the present invention, the mass ratio (a) / (b) of the content of the component (a) to the content of the component (b) is 0.1 or more, further 0.2 or more, and further. You can select from 0.3 or more, 50 or less, 10 or less, and 5 or less.
本発明の殺黴剤組成物において、(a)成分の含有量と(b)成分の含有量とのモル比(a)/(b)は、0.05以上、更に0.1以上、更に0.2以上、そして、50以下、更に15以下、更に10以下から選択できる。 In the fungicide composition of the present invention, the molar ratio (a) / (b) of the content of the component (a) to the content of the component (b) is 0.05 or more, further 0.1 or more, and further. You can select from 0.2 or more, 50 or less, 15 or less, and 10 or less.
本発明の殺黴剤組成物は、殺黴効果の観点から、(c)成分として、水溶性無機塩〔以下、(c)成分という〕を含有することができる。
ここで、(c)成分の無機塩について、水溶性であるとは、25℃の脱イオン水100gに5g以上溶解するものを指す。
From the viewpoint of the fungicide effect, the fungicide composition of the present invention can contain a water-soluble inorganic salt [hereinafter referred to as (c) component] as the component (c).
Here, the inorganic salt of the component (c) that is water-soluble means that 5 g or more is dissolved in 100 g of deionized water at 25 ° C.
(c)成分は、アルカリ金属硫酸塩、アルカリ土類金属硫酸塩、硫酸アンモニウム塩、アルカリ金属亜硫酸塩、アルカリ土類金属亜硫酸塩、アルカリ金属ハロゲン化物、アルカリ土類金属ハロゲン化物、アルカリ金属硝酸塩、アルカリ土類金属硝酸塩、アルカリ金属炭酸塩、アルカリ土類金属炭酸塩、アルカリ金属リン酸塩、アルカリ土類金属リン酸塩、アルカリ金属チオシアン酸塩、及びアルカリ土類金属チオシアン酸塩から選ばれる1種以上の水溶性無機塩が挙げられ、殺黴効果及び配合安定性の観点から、アルカリ金属硫酸塩、アルカリ土類金属硫酸塩、アルカリ金属硝酸塩、アルカリ土類金属硝酸塩、アルカリ金属ハロゲン化物、及びアルカリ土類金属ハロゲン化物から選ばれる1種以上の水溶性無機塩が好ましく、アルカリ金属硫酸塩、アルカリ金属硝酸塩、及びアルカリ金属ハロゲン化物から選ばれる1種以上の水溶性無機塩がより好ましく、アルカリ金属硫酸塩、及びアルカリ金属ハロゲン化物から選ばれる1種以上の水溶性無機塩が更に好ましい。 The component (c) is alkali metal sulfate, alkaline earth metal sulfate, ammonium sulfate, alkali metal sulfite, alkaline earth metal sulfite, alkali metal halide, alkaline earth metal halide, alkali metal nitrate, alkali. One selected from earth metal nitrate, alkali metal carbonate, alkaline earth metal carbonate, alkali metal phosphate, alkaline earth metal phosphate, alkali metal thiocyanate, and alkaline earth metal thiocitanoate. The above-mentioned water-soluble inorganic salts are mentioned, and from the viewpoint of mold-killing effect and compounding stability, alkali metal sulfates, alkaline earth metal sulfates, alkali metal nitrates, alkaline earth metal nitrates, alkali metal halides, and alkalis. One or more water-soluble inorganic salts selected from earth metal halides are preferable, and one or more water-soluble inorganic salts selected from alkali metal sulfates, alkali metal nitrates, and alkali metal halides are more preferable, and alkali metals. One or more water-soluble inorganic salts selected from sulfates and alkali metal halides are more preferable.
(c)成分は、より具体的には、硫酸ナトリウム、硫酸リチウム、硫酸カリウム、硫酸セシウム、硫酸アンモニウム、亜硫酸ナトリウム、塩化ナトリウム、塩化カリウム、硝酸ナトリウム、炭酸ナトリウム、リン酸水素二ナトリウム、及びチオシアン酸ナトリウムから選ばれる1種以上が挙げられ、殺黴効果及び配合安定性の観点から、硫酸ナトリウム、硫酸カリウム、硝酸ナトリウム、塩化ナトリウム及び塩化カリウムから選ばれる1種以上が好ましく、硫酸ナトリウム、硫酸カリウム及び塩化カリウムから選ばれる1種以上がより好ましい。 The component (c) is more specifically sodium sulfate, lithium sulfate, potassium sulfate, cesium sulfate, ammonium sulfate, sodium sulfite, sodium chloride, potassium chloride, sodium nitrate, sodium carbonate, disodium hydrogen phosphate, and thiosian acid. One or more selected from sodium is mentioned, and one or more selected from sodium sulfate, potassium sulfate, sodium nitrate, sodium chloride and potassium chloride are preferable from the viewpoint of sizing effect and compounding stability, and sodium sulfate and potassium sulfate are preferable. And one or more selected from potassium chloride are more preferable.
本発明の殺黴剤組成物は、(c)成分を、殺黴効果の観点から、好ましくは0.1質量%以上、より好ましくは0.5質量%以上、更に好ましくは1.0質量%以上、そして、配合安定性の観点から、好ましくは10質量%以下、より好ましくは5質量%以下、更に好ましくは2質量%以下含有する。 In the mold-killing agent composition of the present invention, the component (c) is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, still more preferably 1.0% by mass, from the viewpoint of the killing effect. As described above, from the viewpoint of compounding stability, the content is preferably 10% by mass or less, more preferably 5% by mass or less, still more preferably 2% by mass or less.
本発明の殺黴剤組成物において、(a)成分の含有量と(c)成分の含有量との質量比(a)/(c)は、0.1以上、更に0.2以上、更に0.5以上、そして、10以下、更に7以下、更に5以下から選択できる。 In the fungicide composition of the present invention, the mass ratio (a) / (c) of the content of the component (a) to the content of the component (c) is 0.1 or more, further 0.2 or more, and further. You can select from 0.5 or more, 10 or less, 7 or less, and 5 or less.
本発明の殺黴剤組成物において、(a)成分の含有量と(c)成分の含有量とのモル比(a)/(c)は、0.1以上、更に0.3以上、更に0.5以上、そして、20以下、更に12以下、更に8以下から選択できる。 In the fungicide composition of the present invention, the molar ratio (a) / (c) of the content of the component (a) to the content of the component (c) is 0.1 or more, further 0.3 or more, and further. You can select from 0.5 or more, 20 or less, 12 or less, and 8 or less.
本発明の殺黴剤組成物において、(b)成分の含有量と(c)成分の含有量との質量比(b)/(c)は、0.1以上、更に0.3以上、更に0.5以上、そして、10以下、更に6以下、更に4以下から選択できる。 In the fungicide composition of the present invention, the mass ratio (b) / (c) of the content of the component (b) to the content of the component (c) is 0.1 or more, further 0.3 or more, and further. You can select from 0.5 or more, 10 or less, 6 or less, and 4 or less.
本発明の殺黴剤組成物において、(b)成分の含有量と(c)成分の含有量とのモル比(b)/(c)は、0.05以上、更に0.1以上、更に0.2以上、そして、8以下、更に5以下、更に3以下から選択できる。 In the fungicide composition of the present invention, the molar ratio (b) / (c) of the content of the component (b) to the content of the component (c) is 0.05 or more, further 0.1 or more, and further. You can select from 0.2 or more, 8 or less, 5 or less, and 3 or less.
本発明の殺黴剤組成物は、(d)成分として、界面活性剤〔(a)成分及び(b)成分を除く〕〔以下、(d)成分という〕を含有することができる。
(d)成分は、洗浄性能の付与の観点から用いられるが、殺黴効果の観点から、含有量は、好ましくは10質量%以下、より好ましくは8質量%以下、更に好ましくは6質量%以下が望ましい。
(d)成分としては、非イオン界面活性剤、陰イオン界面活性剤、陽イオン界面活性剤、及び両性界面活性剤から選ばれる界面活性剤が挙げられる。
The fungicide composition of the present invention can contain a surfactant [excluding the component (a) and the component (b)] [hereinafter referred to as the component (d)] as the component (d).
The component (d) is used from the viewpoint of imparting cleaning performance, but the content is preferably 10% by mass or less, more preferably 8% by mass or less, still more preferably 6% by mass or less, from the viewpoint of mold-killing effect. Is desirable.
Examples of the component (d) include a surfactant selected from nonionic surfactants, anionic surfactants, cationic surfactants, and amphoteric surfactants.
非イオン界面活性剤としては、炭素数10以上18以下のアルキル基を有するポリオキシアルキレンアルキルエーテル、炭素数10以上18以下のアルケニル基を有するポリオキシアルキレンアルケニルエーテル、炭素数10以上、18以下の脂肪酸基を有するポリオキシアルキレンソルビタン脂肪酸エステル、炭素数8以上18以下のアルキル基を有するアルキルグリコシド、炭素数8以上18以下のアルキル基を有するアルキルポリグリコシド、炭素数8以上18以下の脂肪酸基を有するショ糖脂肪酸エステル、炭素数8以上18以下のアルキル基を有するアルキルポリグリセリルエーテル等が挙げられる。中でも洗浄性の観点から、炭素数10以上16以下のアルキル基を有しエチレンオキサイド平均付加モル数が1以上15以下であるポリオキシエチレンアルキルエーテルが好ましい。 Examples of the nonionic surfactant include a polyoxyalkylene alkyl ether having an alkyl group having 10 or more and 18 or less carbon atoms, a polyoxyalkylene alkenyl ether having an alkenyl group having 10 or more and 18 or less carbon atoms, and 10 or more and 18 or less carbon atoms. Polyoxyalkylene sorbitan fatty acid ester having a fatty acid group, an alkyl glycoside having an alkyl group having 8 or more and 18 or less carbon atoms, an alkyl polyglycoside having an alkyl group having 8 or more and 18 or less carbon atoms, and a fatty acid group having 8 or more carbon atoms and 18 or less carbon atoms. Examples thereof include sucrose fatty acid esters having sucrose, alkyl polyglyceryl ethers having an alkyl group having 8 or more carbon atoms and 18 or less carbon atoms, and the like. Among them, from the viewpoint of detergency, a polyoxyethylene alkyl ether having an alkyl group having 10 or more and 16 or less carbon atoms and an average number of moles of ethylene oxide added of 1 or more and 15 or less is preferable.
陰イオン界面活性剤としては、炭化水素基を1つ以上と、スルホン酸基、硫酸エステル基及びカルボン酸基からなる群から選ばれる基の1つ以上とを有する陰イオン界面活性剤が挙げられる。陰イオン界面活性剤としては、アルキル又はアルケニルベンゼンスルホン酸又はその塩、ポリオキシアルキレンアルキル又はアルケニルエーテル硫酸エステル又はその塩、アルキル又はアルケニル硫酸エステル又はその塩、及び脂肪酸又はその塩等が挙げられる。洗浄力の観点から、陰イオン界面活性剤としては、ポリオキシアルキレンアルキル又はアルケニルエーテル硫酸エステル又はその塩及び脂肪酸又はその塩からなる群から選択される1以上が好ましい。ポリオキシアルキレンアルキル又はアルケニルエーテル硫酸エステル又はその塩のオキシアルキレン基は、オキシエチレン基が好ましい。また、ポリオキシアルキレンアルキル又はアルケニルエーテル硫酸エステル塩のオキシアルキレン基の平均付加モル数は、1以上10以下が好ましい。脂肪酸又はその塩としては、炭素数10以上18以下の脂肪酸又はその塩が挙げられる。陰イオン界面活性剤のアルキル基又はアルケニル基は、炭素数10以上18以下が好ましい。また、塩は、ナトリウム塩、カリウム塩などのアルカリ金属塩が好ましい。 Examples of the anionic surfactant include an anionic surfactant having one or more hydrocarbon groups and one or more groups selected from the group consisting of a sulfonic acid group, a sulfate ester group and a carboxylic acid group. .. Examples of the anionic surfactant include alkyl or alkenylbenzenesulfonic acid or a salt thereof, polyoxyalkylene alkyl or alkenyl ether sulfate ester or a salt thereof, alkyl or alkenylsulfate ester or a salt thereof, fatty acid or a salt thereof and the like. From the viewpoint of detergency, the anionic surfactant is preferably one or more selected from the group consisting of polyoxyalkylene alkyl or alkenyl ether sulfate ester or a salt thereof and a fatty acid or a salt thereof. The oxyalkylene group of the polyoxyalkylene alkyl or alkenyl ether sulfate ester or a salt thereof is preferably an oxyethylene group. The average number of moles of oxyalkylene groups added to the polyoxyalkylene alkyl or alkenyl ether sulfate ester salt is preferably 1 or more and 10 or less. Examples of the fatty acid or a salt thereof include a fatty acid having 10 or more carbon atoms and 18 or less carbon atoms or a salt thereof. The alkyl group or alkenyl group of the anionic surfactant preferably has 10 or more and 18 or less carbon atoms. The salt is preferably an alkali metal salt such as a sodium salt or a potassium salt.
陽イオン界面活性剤としては、第4級アンモニウム塩型陽イオン界面活性剤が挙げられる。第4級アンモニウム塩型陽イオン界面活性剤としては、窒素原子に結合する基のうち、1つ又は2つが炭素数8以上16以下の炭化水素基であり、残りが炭素数1以上3以下のアルキル基、炭素数1以上3以下のヒドロキシアルキル基及びアリールアルキル基(ベンジル基等)からなる群から選ばれる基である4級アンモニウム塩型陽イオン界面活性剤が挙げられる。なかでも、殺菌性能を有する4級アンモニウム塩型陽イオン界面活性剤が好ましく、殺菌性能の点から、ベンジル基を有する4級アンモニウム塩型陽イオン界面活性剤が好ましい。 Examples of the cationic surfactant include a quaternary ammonium salt-type cationic surfactant. As the quaternary ammonium salt-type cationic surfactant, one or two of the groups bonded to the nitrogen atom are hydrocarbon groups having 8 or more and 16 or less carbon atoms, and the rest have 1 or more and 3 or less carbon atoms. Examples thereof include a quaternary ammonium salt-type cationic surfactant which is a group selected from the group consisting of an alkyl group, a hydroxyalkyl group having 1 or more and 3 or less carbon atoms, and an arylalkyl group (benzyl group or the like). Of these, a quaternary ammonium salt-type cationic surfactant having bactericidal performance is preferable, and a quaternary ammonium salt-type cationic surfactant having a benzyl group is preferable from the viewpoint of bactericidal performance.
両性界面活性剤としては、泡立ちの観点から、炭素数8以上22以下のアルキル基を有する両性界面活性剤が好ましい。更に、この両性界面活性剤では、アルキル基の炭素数は、10以上、更に11以上が好ましく、そして、18以下、更に13以下が好ましい。両性界面活性剤としては、アルキルベタイン、アルキルアミドベタイン、アルキルスルホベタイン、アルキルヒドロキシスルホベタイン、アルキルアミドヒドロキシスルホベタイン、アルキルアミノ脂肪酸塩からなる群から選ばれる1以上の両性界面活性剤を用いることが洗浄力、泡立ちの点から好ましい。中でも、アルキル(炭素数8以上、22以下)アミドプロピルベタイン及びアルキル(炭素数8以上、22以下)ヒドロキシスルホベタインからなる群から選ばれる両性界面活性剤が好ましく、更には(3-ラウラミドプロピル)ジメチルベタイン及びラウリルジメチルヒドロキシスルホベタインからなる群から選ばれる両性界面活性剤がより好ましい。また、ここに列挙した両性界面活性剤の2種以上を混合して用いても良い。 As the amphoteric tenside agent, an amphoteric tenside agent having an alkyl group having 8 or more carbon atoms and 22 or less carbon atoms is preferable from the viewpoint of foaming. Further, in this amphoteric surfactant, the number of carbon atoms of the alkyl group is preferably 10 or more, more preferably 11 or more, and preferably 18 or less, further preferably 13 or less. As the amphoteric tenside, one or more amphoteric tensides selected from the group consisting of alkylbetaine, alkylamide betaine, alkylsulfobetaine, alkylhydroxysulfobetaine, alkylamide hydroxysulfobetaine, and alkylamino fatty acid salt can be used. It is preferable from the viewpoint of detergency and foaming. Among them, amphoteric tensides selected from the group consisting of alkyl (8 or more carbon atoms, 22 or less) amidopropyl betaine and alkyl (8 or more carbon atoms, 22 or less carbon atoms) hydroxysulfobetaine are preferable, and further (3-lauramidopropyl). ) An amphoteric tenside selected from the group consisting of dimethylbetaine and lauryldimethylhydroxysulfobetaine is more preferable. Further, two or more kinds of amphoteric surfactants listed here may be mixed and used.
(d)成分は、洗浄力と泡立ちの観点から、陰イオン界面活性剤、陽イオン界面活性剤、及び両性界面活性剤から選ばれる1種以上が好ましい。また(d)成分は、殺黴効果の観点から、陰イオン界面活性剤、非イオン界面活性剤、及び両性界面活性剤から選ばれる1種以上が好ましく、ポリオキシアルキレンアルキル(炭素数10以上18以下)若しくはアルケニル(炭素数10以上18以下)エーテル硫酸エステル又はその塩、脂肪酸(炭素数10以上18以下)又はその塩、アルキル(炭素数8以上18以下)グリコシド、ポリオキシアルキレンアルキル(炭素数10以上18以下)又はアルケニル(炭素数10以上18以下)エーテル、及びアルキル(炭素数8以上22以下)アミドプロピルベタインから選ばれる1種以上がより好ましく、ポリオキシアルキレンアルキル(炭素数10以上18以下)若しくはアルケニル(炭素数10以上18以下)エーテル硫酸エステル又はその塩、アルキル(炭素数8以上18以下)グリコシド、及びアルキル(炭素数8以上22以下)アミドプロピルベタインから選ばれる1種以上が更に好ましく、更に配合安定性の観点から、ポリオキシアルキレンアルキル(炭素数10以上18以下)若しくはアルケニル(炭素数10以上18以下)エーテル硫酸エステル又はその塩、及びアルキル(炭素数8以上22以下)アミドプロピルベタインから選ばれる1種以上がより更に好ましい。 The component (d) is preferably one or more selected from anionic surfactants, cationic surfactants, and amphoteric surfactants from the viewpoint of detergency and foaming. Further, the component (d) is preferably one or more selected from an anionic surfactant, a nonionic surfactant, and an amphoteric surfactant from the viewpoint of an ester-killing effect, and is preferably polyoxyalkylene alkyl (carbon number 10 or more 18). Or alkenyl (10 or more and 18 or less carbon atoms) ether sulfate ester or its salt, fatty acid (10 or more and 18 or less carbon atoms) or its salt, alkyl (8 or more and 18 or less carbon atoms) glycoside, polyoxyalkylene alkyl (10 or more carbon atoms) More preferably, one or more selected from 10 or more and 18 or less) or alkenyl (10 or more and 18 or less carbon atoms) ether and alkyl (8 or more and 22 or less carbon atoms) amide propyl betaine, and polyoxyalkylene alkyl (10 or more and 18 carbon atoms). One or more selected from alkenyl (10 or more and 18 or less carbon atoms) ether sulfate ester or a salt thereof, alkyl (8 or more and 18 or less carbon atoms) glycoside, and alkyl (8 or more and 22 or less carbon atoms) amide propyl betaine. More preferably, from the viewpoint of compounding stability, polyoxyalkylene alkyl (10 or more and 18 or less carbon atoms) or alkenyl (10 or more and 18 or less carbon atoms) ether sulfate ester or a salt thereof, and alkyl (8 or more and 22 or less carbon atoms). More preferably, one or more selected from amidpropyl betaine.
本発明の殺黴剤組成物は、(d)成分を含有する場合、(d)成分を、洗浄性能の観点から、好ましくは0.1質量%以上、より好ましくは0.5質量%以上、更に好ましくは1.0質量%以上、そして、好ましくは10質量%以下、より好ましくは8質量%以下、更に好ましくは6質量%以下含有する。 When the mold-killing agent composition of the present invention contains the component (d), the component (d) is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, from the viewpoint of cleaning performance. It is more preferably 1.0% by mass or more, preferably 10% by mass or less, more preferably 8% by mass or less, still more preferably 6% by mass or less.
本発明の殺黴剤組成物には、製品の付加価値を増大させるために、香料、色素、防腐剤、酸化防止剤等を任意に配合することができる(但し、前記(a)~(d)成分を除く)。 In order to increase the added value of the product, the mold-killing agent composition of the present invention may be optionally blended with a fragrance, a dye, a preservative, an antioxidant and the like (provided that the above (a) to (d) are added. ) Excluding ingredients).
本発明の殺黴剤組成物は、水を含有する。すなわち、前記(a)~(b)成分及び任意成分以外の残部が水である。本発明の殺黴剤組成物は、水を、好ましくは50質量%以上、より好ましくは60質量%以上、更に好ましくは70質量%以上、より更に好ましくは80質量%以上、そして、好ましくは99質量%以下、より好ましくは95質量%以下含有する。水は、イオン交換水、滅菌イオン交換水等を使用することが好ましい。 The fungicide composition of the present invention contains water. That is, the balance other than the components (a) to (b) and the optional components is water. The mold-killing agent composition of the present invention contains water, preferably 50% by mass or more, more preferably 60% by mass or more, still more preferably 70% by mass or more, still more preferably 80% by mass or more, and preferably 99. It is contained in an amount of% by mass or less, more preferably 95% by mass or less. As the water, it is preferable to use ion-exchanged water, sterile ion-exchanged water, or the like.
本発明の殺黴剤組成物は、強アルカリもしくは強酸を必要としない殺黴組成物である。すなわち、本発明の殺黴剤組成物は、中性近傍の液性であっても良好な殺黴効果が得られる。本発明の殺黴剤組成物は、25℃におけるpHが、取扱いの容易さ及び手肌への刺激性の観点から、好ましくは2以上、より好ましくは4以上、更に好ましくは6以上、そして、好ましくは12未満、より好ましくは10未満、更に好ましくは8未満である。 The fungicide composition of the present invention is a fungicide composition that does not require a strong alkali or strong acid. That is, the antifungal composition of the present invention can obtain a good antifungal effect even if it is a liquid near neutrality. The fungicide composition of the present invention has a pH at 25 ° C. of preferably 2 or more, more preferably 4 or more, still more preferably 6 or more, and from the viewpoint of ease of handling and irritation to the hand skin. It is preferably less than 12, more preferably less than 10, and even more preferably less than 8.
本発明の殺黴剤組成物は、浴室、浴槽、洗面器、タイル、化粧室、洗面台、鏡、台所まわりのシンク、カウンタートップ、水道まわり等の硬質表面の洗浄に好適に用いられる。浴室用として好適に用いられる。ここで、浴室用とは、浴室のみならず、浴槽、洗面器など、浴室内に存在する他の硬質表面を有する物品をも対象とするものである。 The antifungal composition of the present invention is suitably used for cleaning hard surfaces such as bathrooms, bathtubs, washbasins, tiles, dressing rooms, washbasins, mirrors, sinks around kitchens, countertops, and water taps. It is suitably used for bathrooms. Here, the term "for bathroom" refers not only to bathrooms but also to articles having other hard surfaces existing in the bathroom, such as bathtubs and washbasins.
本発明の殺黴剤組成物は、黴に対して優れた殺黴作用を有する。例えば、クラドスポリウム(Cladosporium)属、アスペルギルス(Aspergillus)属、キャンディダ(Candida)属、ペニシリウム(Penicillium)属、アルタナリア(Alternaria)属、フォーマ(Phoma)属、アウレオバシジウム(Aureobasidium)属真菌に代表される黴について高い殺黴効果を示す。
またサッカロマイセス(Saccharomyces)属、ロドトルラ(Rhodotorula)属、ピキア(Pichia)属真菌、緑膿菌(Pseudomonas aeruginosa)、Pseudomonas putida等のシュードモナス(Pseudomonas)属細菌、大腸菌(Escherichia coli)、アルカリジェネス(Alcaligenes faecalis)、クレブシエラ(Klebsiellapneumoniae)、プロテウス(Proteus vulgaris)、セラチア(Serratia marcescense)、メチロバクテリウム(Methylobacterium)等のグラム陰性菌;黄色ブドウ球菌(Staphylococcus aureus)に代表されるグラム陽性菌に対しても高い殺菌作用効果を示す。
The mold-killing agent composition of the present invention has an excellent mold-killing action on mold. For example, for fungi of the genera Cladosporium, Aspergillus, Candida, Penicillium, Alternaria, Phoma, and Aureobasidium. It shows a high genus killing effect for the representative genus.
Also, Saccharomyces, Rhodotorula, Pichia fungi, Pseudomonas aeruginosa, Pseudomonas putida and other Pseudomonas bacteria, Escherichia coli, Alcaligenes faec ), Klebsiellapneumoniae, Proteus vulgaris, Serratia marcescense, Methylobacterium and other gram-negative bacteria; also against gram-positive bacteria such as Staphylococcus aureus. Shows a high bactericidal effect.
〔殺黴方法〕
本発明の殺黴方法は、本発明の殺黴剤組成物を、黴菌が存在する対象表面に30秒以上接触させる殺黴方法である。
本発明では、本発明の殺黴剤組成物を対象表面に接触させた後、該表面を洗浄することができる。また本発明では、本発明の殺黴剤組成物を基体に担持させた清掃用物品により対象表面を洗浄することができる。
対象表面としては、浴室、浴槽、洗面器、タイル、化粧室、洗面台、鏡、台所まわりのシンク、カウンタートップ、水道まわり等の硬質表面が好適である。
[Mold killing method]
The mold-killing method of the present invention is a mold-killing method in which the mold-killing agent composition of the present invention is brought into contact with the surface of an object in which fungi are present for 30 seconds or longer.
In the present invention, after the antifungal composition of the present invention is brought into contact with the target surface, the surface can be washed. Further, in the present invention, the target surface can be cleaned with a cleaning article in which the mold-killing agent composition of the present invention is supported on a substrate.
As the target surface, a hard surface such as a bathroom, a bathtub, a washbasin, a tile, a dressing room, a washbasin, a mirror, a sink around the kitchen, a countertop, and a water supply is suitable.
本発明の殺黴方法は、具体的には、本発明の殺黴剤組成物を、原液で、対象表面に接触させる、又は前記殺黴剤組成物を、原液で、希釈せずに対象表面に接触させる、つまり、前記殺黴剤組成物を、希釈することなく、対象表面に接触させる洗浄方法が好ましく挙げられる。更に、前記殺黴剤組成物を、希釈することなく、黴菌が付着した対象表面に接触させる殺黴方法が挙げられる。尚、対象表面と接触させる方法としては、対象表面に塗布する方法が好ましい。
前記殺黴剤組成物を希釈せずに対象表面に接触させるとは、該殺黴剤組成物を、意図的に水などで希釈した後、対象表面と接触させないことである。例えば、前記殺黴剤組成物を水滴等が付着した対象表面と接触させたり、前記殺黴剤組成物を対象表面に接触させた後、対象表面に水滴が付着したりする場合は、前記殺黴剤組成物を希釈せずに、対象表面に接触させると理解できる。
本発明の殺黴方法は、前記殺黴剤組成物を、原液で、対象表面に接触させるには、ボトルから直接塗布又は噴霧してもよく、ボトルとしては、例えば、スクイズボトル、スプレーボトル等が挙げられる。
また本発明の殺黴剤組成物を含浸させた清掃用物品使用時に、別途本発明の殺黴剤組成物を、被清掃物又は前記清掃用物品に、噴霧しながら使用してもよい。当該使用方法によって、より広い面積を清掃する。
Specifically, the mold-killing method of the present invention is such that the mold-killing agent composition of the present invention is brought into contact with the target surface with a stock solution, or the mold-killing agent composition is brought into contact with a target surface without being diluted with a stock solution. That is, a cleaning method in which the fungicide composition is brought into contact with the surface of the object without being diluted is preferably mentioned. Further, there is a mold killing method in which the mold killing agent composition is brought into contact with the surface of the target to which the fungus adheres without diluting. As a method of contacting with the target surface, a method of applying to the target surface is preferable.
Contacting the target surface without diluting the mold-killing agent composition means that the mold-killing agent composition is intentionally diluted with water or the like and then not brought into contact with the target surface. For example, when the mold-killing agent composition is brought into contact with the target surface to which water droplets or the like are attached, or when the mold-killing agent composition is brought into contact with the target surface and then water droplets are attached to the target surface, the killing is performed. It can be understood that the mold composition is brought into contact with the target surface without being diluted.
In the mold-killing method of the present invention, the mold-killing agent composition may be directly applied or sprayed from a bottle in order to bring the mold-killing agent composition into contact with the target surface with a stock solution, and the bottle may be, for example, a squeeze bottle, a spray bottle or the like. Can be mentioned.
Further, when the cleaning article impregnated with the fungicide composition of the present invention is used, the fungicide composition of the present invention may be separately used while being sprayed on the object to be cleaned or the cleaning article. Clean a larger area according to the method of use.
但し、本発明の(a)成分、(b)成分、及び任意成分を含む濃厚組成物を調製しておき、該濃厚組成物を水で希釈して本発明の殺黴剤組成物を調製し、対象表面に接触させてもよい。すなわち、本発明の(a)成分、(b)成分、及び任意成分を含有する濃厚組成物を水で希釈して本発明の殺黴剤組成物に調製し、該殺黴剤組成物を希釈せずに対象表面に接触させる殺黴方法であってもよい。 However, a concentrated composition containing the component (a), the component (b), and the optional component of the present invention is prepared, and the concentrated composition is diluted with water to prepare the mold-killing agent composition of the present invention. , May be in contact with the target surface. That is, a concentrated composition containing the component (a), the component (b), and the optional component of the present invention is diluted with water to prepare the mold-killing agent composition of the present invention, and the mold-killing agent composition is diluted. It may be a dilution method in which the surface of the object is brought into contact with the surface of the object without using it.
黴菌が存在する対象表面に接触させた後、黴菌に接触させる放置時間は、殺黴効果の観点から、好ましくは30秒以上、好ましくは1分以上、より好ましくは2分以上、更に好ましくは3分以上、より更に好ましくは4分以上、より更に好ましくは5分以上であり、そして、効率的に洗浄する観点から、好ましくは30分以下、より好ましくは20分以下、更に好ましくは10分以下である。
放置した後は、通常、水ですすぐ。すすぐ際は、手などで機械力(物理的力)を掛けてもよく、単に水流ですすいでもよい。
なお、放置する際の温度は、室温でよく、例えば、10℃以上30℃以下が挙げられる。
From the viewpoint of the fungal killing effect, the leaving time for contacting the surface of the object in which the fungus is present is preferably 30 seconds or longer, preferably 1 minute or longer, more preferably 2 minutes or longer, still more preferably 3. Minutes or more, more preferably 4 minutes or more, still more preferably 5 minutes or more, and from the viewpoint of efficient cleaning, preferably 30 minutes or less, more preferably 20 minutes or less, still more preferably 10 minutes or less. Is.
After leaving it, it is usually rinsed with water. When rinsing, mechanical force (physical force) may be applied by hand or simply rinsing with a stream of water.
The temperature when left to stand may be room temperature, for example, 10 ° C. or higher and 30 ° C. or lower.
下記配合成分を用いて、表1~2に示す殺黴剤組成物を調製し、以下の項目について評価を行った。結果を表1~2に示す。表1~2の殺黴剤組成物は、リン酸水素ナトリウム、リン酸二水素ナトリウムをそれぞれイオン交換水に添加することで調製した10mMリン酸緩衝水溶液(pH7.8)に(a)成分、(b)成分、(b’)成分を表中の配合量で添加し、室温(25℃)で溶解させた。なお、表1~2中の配合成分の質量%は、全て有効分に基づく数値である。 The fungicide compositions shown in Tables 1 and 2 were prepared using the following compounding ingredients, and the following items were evaluated. The results are shown in Tables 1 and 2. The mold-killing agent compositions shown in Tables 1 and 2 are prepared by adding sodium hydrogen phosphate and sodium dihydrogen phosphate to ion-exchanged water, respectively, to prepare a 10 mM phosphate buffered aqueous solution (pH 7.8) containing the component (a). The component (b) and the component (b') were added in the blending amounts shown in the table and dissolved at room temperature (25 ° C.). The mass% of the compounding components in Tables 1 and 2 are all numerical values based on the effective amount.
<配合成分>
(a)成分
・ベンジルアルコール:東京化成工業(株)製、分子量108
・フェノキシエタノール:日本乳化剤(株)製、分子量138
<Ingredients>
(A) Ingredients-Benzyl alcohol: manufactured by Tokyo Chemical Industry Co., Ltd., molecular weight 108
-Phenoxyethanol: manufactured by Nippon Emulsorium Co., Ltd., molecular weight 138
(b)成分
・2-ブタノール:分子量74、logP0.87、和光純薬工業(株)製、1級、(b1)
・1-ブタノール:分子量74、logP0.97、東京化成工業(株)製、(b1)
・1,2-ヘキサンジオール:分子量118、logP0.85、東京化成工業(株)製、(b2)
・シクロヘキシルグリセリン:分子量174、logP0.58、(株)ADEKA製、(b3)
・1-プロパノール:分子量60、logP0.55、和光純薬工業(株)製、特級、(b1)
・2-プロパノール:分子量60、logP0.38、和光純薬工業(株)製、1級、(b1)
・tert-ブタノール:分子量74、logP0.60、東京化成工業(株)製、(b1)
・1-ペンタノール:分子量88、logP1.39、東京化成工業(株)製、(b1)
・3-ペンタノール:分子量88、logP1.36、東京化成工業(株)製、(b1)
・1-ヘキサノール:分子量102、logP1.80、東京化成工業(株)製、(b1)
・1-ヘプタノール:分子量116、logP2.22、和光純薬工業(株)製、特級、(b1)
・1,2-ペンタンジオール:分子量104、logP0.43、東京化成工業(株)製、(b2)
・ヘキシルグリセリン:分子量176、logP1.11、(株)ADEKA製、(b3)
(B) Ingredients-2-butanol: molecular weight 74, logP0.87, manufactured by Wako Pure Chemical Industries, Ltd., first grade, (b1)
1-Butanol: Molecular weight 74, logP0.97, manufactured by Tokyo Chemical Industry Co., Ltd., (b1)
1,2-Hexanediol: molecular weight 118, logP0.85, manufactured by Tokyo Chemical Industry Co., Ltd., (b2)
-Cyclohexylglycerin: molecular weight 174, logP0.58, manufactured by ADEKA Corporation, (b3)
1-Propanol: molecular weight 60, logP0.55, manufactured by Wako Pure Chemical Industries, Ltd., special grade, (b1)
2-propanol: molecular weight 60, logP0.38, manufactured by Wako Pure Chemical Industries, Ltd., first grade, (b1)
-Tert-Butyl: molecular weight 74, logP0.60, manufactured by Tokyo Chemical Industry Co., Ltd., (b1)
1-Pentanol: molecular weight 88, logP1.39, manufactured by Tokyo Chemical Industry Co., Ltd., (b1)
-3-Pentanol: Molecular weight 88, logP1.36, manufactured by Tokyo Chemical Industry Co., Ltd., (b1)
1-Hexanol: molecular weight 102, logP1.80, manufactured by Tokyo Chemical Industry Co., Ltd., (b1)
1-Heptanol: molecular weight 116, logP2.22, manufactured by Wako Pure Chemical Industries, Ltd., special grade, (b1)
1,2-pentanediol: molecular weight 104, logP0.43, manufactured by Tokyo Chemical Industry Co., Ltd., (b2)
-Hexyl glycerin: molecular weight 176, logP1.11, manufactured by ADEKA Corporation, (b3)
(b’)成分((b)成分の比較成分)
・エタノール:分子量46、和光純薬工業(株)製、特級
・メタノール:分子量32、和光純薬工業(株)製、高速液体クロマトク゛ラフ用
(B') component (comparative component of (b) component)
-Ethanol: molecular weight 46, manufactured by Wako Pure Chemical Industries, Ltd., special grade-methanol: molecular weight 32, manufactured by Wako Pure Chemical Industries, Ltd., for high performance liquid chromatography graph
<殺黴性評価方法>
住環境優先糸状菌Cladosporium属の環境分離株Cladsporium sp. PA-4を、ポテトデキストロース平板寒天培地(BectonDickinson社製のPotato Dextrose Agar試薬を能書どおりに調製)上で25℃/7日間培養後、同寒天プレート上に胞子回収液((株)大塚製薬工場製の生理食塩水で調製した和光純薬工業(株)製の0.05%Tween80溶液)を4mL滴下して、コンラージ棒(日水製薬(株)製)でなでるように軽くこすることで菌液を回収した。その後回収した菌液を、ミラクロス(CALBIOCHEM社製)を用いて濾過することで菌糸を除去し、得られた液を遠心処理(10,000rpm,25℃,5min)し、上澄みを除去した。これらの操作を2、3回繰り返し、菌濃度を3.0~7.0×107CFU/mLに調製して試験胞子液とした。
<Mold-killing evaluation method>
After culturing the environmental isolate Cladosporium sp. PA-4 of the genus Cladosporium, which is a living environment priority, on a potato dextrose plate agar plate (Potato Dextrose Agar reagent manufactured by Becton Dickinson was prepared according to the Noh book) at 25 ° C for 7 days. 4 mL of spore recovery solution (0.05% Tween80 solution manufactured by Wako Pure Chemical Industries, Ltd. prepared with physiological saline manufactured by Otsuka Pharmaceutical Factory Co., Ltd.) was dropped onto the agar plate, and a conlarge stick (Nissui) was added. The bacterial solution was recovered by gently rubbing it with a pharmaceutical company (manufactured by Pharmaceutical Co., Ltd.). After that, the collected hyphae were filtered using Miracross (manufactured by CALBIOCHEM) to remove hyphae, and the obtained liquid was centrifuged (10,000 rpm, 25 ° C., 5 min) to remove the supernatant. These operations were repeated two or three times, and the bacterial concentration was adjusted to 3.0 to 7.0 × 107 CFU / mL to prepare a test spore solution.
表1~2の殺黴剤組成物を試験液として用い、試験液1mLに対して調製した試験胞子液10μLを混合して、25℃で5分間接触させた後に、その100μLを分取して900μLのLP希釈液(日水製薬社製のものを能書通りに調製したもの)に懸濁することで試験液を不活化した。これをさらにLP希釈液で希釈した後に、ポテトデキストロース平板寒天培地(BectonDickinson社製のPotato Dextrose Agar試薬を能書どおりに調製)に塗布して4日間25℃で培養して得られたコロニー数から生残菌数を算出した。 Using the antifungal composition shown in Tables 1 and 2 as the test solution, 10 μL of the prepared test spore solution was mixed with 1 mL of the test solution, contacted at 25 ° C. for 5 minutes, and then 100 μL was separated. The test solution was inactivated by suspending it in 900 μL of LP diluted solution (prepared according to Noh book by Nissui Pharmaceutical Co., Ltd.). After further diluting this with LP diluted solution, it was applied to a potato dextrose plate agar medium (Potato Dextrose Agar reagent manufactured by Becton Dickinson was prepared according to the Noh book) and cultured at 25 ° C for 4 days from the number of colonies obtained. The number of surviving bacteria was calculated.
また、試験液の代わりに生理食塩水((株)大塚製薬工場製)を用いて同じ操作(試験液1mLに対して菌液10μLを混合し、5分間接触させた後に、LP希釈液と混合)を行ったものを対象操作として、対象操作後の生残菌数と試験液接触後の生残菌数との菌数の対数差を計算して殺菌性能の指標とした。結果を表1~2に示す。 In addition, use physiological saline (manufactured by Otsuka Pharmaceutical Factory, Inc.) instead of the test solution to mix 10 μL of the bacterial solution with 1 mL of the test solution, contact for 5 minutes, and then mix with the LP diluted solution. ) Was used as the target operation, and the logarithmic difference between the number of surviving bacteria after the target operation and the number of surviving bacteria after contact with the test solution was calculated and used as an index of bactericidal performance. The results are shown in Tables 1 and 2.
<外観評価>
調製直後の表1~2の各殺黴剤組成物について、20℃で12時間放置した後の外観を下記の基準で評価した。結果を表1~2に示す。
透明:組成物が、濁りがなく、透明な溶液である。
分離:組成物が、二層に分離した液体である。
白濁:組成物が、濁りのある白濁した液体である。
<Appearance evaluation>
The appearance of each moldicide composition shown in Tables 1 and 2 immediately after preparation after being left at 20 ° C. for 12 hours was evaluated according to the following criteria. The results are shown in Tables 1 and 2.
Transparent: The composition is a clear, clear solution.
Separation: The composition is a liquid separated into two layers.
White turbidity: The composition is a turbid, cloudy liquid.
表中、ΔLog減少菌数が4.5以上のものは、検出限界値を示し、殺黴剤組成物により殺黴されて、生残菌数が極わずかであることを意味する。
In the table, those having a ΔLog-reduced number of bacteria of 4.5 or more indicate a detection limit value, which means that the number of surviving bacteria is extremely small after being killed by the fungicide composition.
Claims (3)
(a)成分を、0.1質量%以上10質量%以下含有し、
(b)成分を、0.1質量%以上10質量%以下含有し、且つ、
(a)成分の含有量と(b)成分の含有量との質量比(a)/(b)が0.1以上50以下である、
殺黴剤組成物。
(b1):1-プロパノール、1-ヘキサノール、1-ペンタノール、3-ペンタノール、1-ブタノール、tert-ブタノール、1-ヘプタノール、及び1-オクタノールから選ばれる1種以上の脂肪族アルコール
(式中、R1aは炭素数1以上4以下の二価の炭化水素基であり、r、lは、0又は1の整数であるが、lが0の場合にはrは1の整数である。Aは炭素数2以上4以下のアルキレン基である。) (A) A compound represented by the following general formula (a-1) [hereinafter referred to as (a) component], (b) one or more selected from the following compounds (b1) [hereinafter referred to as (b) component ], And a fungicide composition containing water.
(A) Contains 0.1% by mass or more and 10% by mass or less of the component.
(B) Contains 0.1% by mass or more and 10% by mass or less of the component, and
The mass ratio (a) / (b) between the content of the component (a) and the content of the component (b) is 0.1 or more and 50 or less.
Moldicide composition.
(B1): One or more fatty alcohols selected from 1-propanol, 1-hexanol, 1-pentanol, 3-pentanol, 1-butanol, tert-butanol, 1-heptanol, and 1-octanol.
(In the formula, R 1a is a divalent hydrocarbon group having 1 or more carbon atoms and 4 or less carbon atoms, and r and l are 0 or an integer of 1, but when l is 0, r is an integer of 1. A is an alkylene group having 2 or more and 4 or less carbon atoms.)
(b)成分を、0.1質量%以上3質量%未満含有する、請求項1に記載の殺黴剤組成物。 (B) The component is one or more aliphatic alcohols selected from 1-hexanol, 1-pentanol, 3-pentanol, and 1-octanol, and
The fungicide composition according to claim 1, wherein the component (b) is contained in an amount of 0.1% by mass or more and less than 3% by mass.
A fungicide method in which the fungicide composition according to claim 1 or 2 is brought into contact with the surface of a target in which fungi are present for 30 seconds or longer.
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