TWI768072B - Transfer device, method of use and method of adjustment - Google Patents

Abstract

The present invention provides transfer devices, methods of use, and methods of adjustment. Enlargement, refinement, and shortening of tact time of the receiver substrate of the transfer device are achieved while maintaining high transfer position accuracy. Each stage group that moves in a state in which the donor substrate on which the transfer object is placed, the beam shaping optical system, and the reduced projection optical system, and the stage group that carries the acceptor substrate as the transfer object are constructed on separate stages In the above-described mechanism, the vibration caused by the relative scanning of each substrate with respect to the laser and the abnormality of the synchronization position accuracy of the stage responsible for the scanning are minimized.

Description

Transfer device, method of use and method of adjustment

The present invention relates to a device that uses laser irradiation to transfer an object located on a donor substrate to an acceptor substrate with high precision (LIFT: Laser Induced Forward Transfer).

There is a conventional technique in which an organic EL (electroluminescence) layer on a donor substrate is irradiated with laser light and transferred to an opposing circuit substrate. As this technique, Patent Document 1 discloses a technique of converting a single laser beam into a plurality of rectangular laser beams having a rectangular shape and uniform intensity distribution, and arranging them in series at equal intervals so as to be separated by a predetermined period of time or more and overlap a predetermined time A plurality of rectangular laser beams are irradiated to a predetermined area of the donor substrate in a number of times, the laser beams are absorbed by the metal foil located between the donor substrate and the organic EL layer, and elastic waves are generated, and the organic EL layer thus peeled off is transferred to the opposite. on the circuit board.

In this technique, a structure is used in which a spacer having an appropriate value of 80 to 100 [ μm ] is sandwiched between the donor substrate and the circuit substrate, and the distance between the donor substrate and the circuit substrate is kept constant. The integrated components are placed on a stage and scanned relative to the laser. However, in this case, in addition to a separate step of integrating the opposing donor substrate and the circuit substrate, a donor substrate of the same size as the circuit substrate is required, and the need for an increase in the size of the circuit substrate is increased. Manufacturing cost and increase in size of the device.

Similarly, as a technique for transferring an organic EL layer on a donor substrate to an opposing circuit substrate, Patent Document 2 discloses a technique in which a light absorbing layer is provided between the donor substrate and the organic EL layer, and the The light absorbing layer absorbs the irradiated laser light to generate shock waves, and transfers the organic EL layer on the donor substrate to the circuit substrate facing each other with an interval of 10 to 100 [ μm ]. However, Patent Document 2 does not disclose a laser scanning method and a stage structure for realizing the same, and also does not disclose a transfer device. Therefore, Patent Document 2 cannot be referred to as a technique for maintaining and improving the transfer position accuracy that can be adapted to the enlargement of the circuit board.

Furthermore, Patent Document 3 discloses a technique related to the step-and-scan method in an exposure apparatus for semiconductor device manufacturing. This is basically considered as follows: a row of shot regions along the scanning exposure direction of the wafer table is intermittently exposed while skipping several shot regions on the way, and the wafer table is not stopped in the middle. That is, Patent Document 3 discloses an exposure apparatus including: an intermediate mask stage that supports an intermediate mask; a wafer stage that supports a wafer; and a projection optical system that projects a pattern of the intermediate mask on the wafer, while causing the intermediate mask The stage and the wafer stage perform exposure while scanning with respect to the projection optical system, and sequentially project the pattern of the intermediate reticle onto a plurality of irradiated areas of the wafer, wherein the wafer stage is scanned edge-to-edge while the wafer stage is not kept stationary for scanning movement. Exposure is performed intermittently on a plurality of shot areas on a wafer aligned in a direction. This makes it possible to reduce vibrations and wobbles accompanying the scanning of the table, as compared with the step-and-repeat method in which acceleration and deceleration of the wafer table are repeated in response to the requirement of increasing the size of the wafer and increasing the processing speed. effect on exposure accuracy.

However, the technique disclosed in the above-mentioned Patent Document 3 is a technique of a semiconductor exposure apparatus based on reduction projection exposure, and its technical field is different from the transfer technique of the present invention. That is, the structure and scanning technique of the intermediate reticle stage and wafer stage of the exposure apparatus are completely different from the stage structure and scanning technique of the present invention, which are used to convert the reticle pattern of the present invention with high positional accuracy The object projected onto the donor substrate is reduced in such a way that the object is transferred to the acceptor substrate with the same high positional accuracy. Therefore, the technology disclosed in the above-mentioned Patent Document 3 cannot be referred to as a specific stage structure of the present invention and its scanning technology.

prior art literature

Patent Document 1: Japanese Patent Laid-Open Publication No. 2014-67671

Patent Document 2: Japanese Patent Laid-Open Publication No. 2010-40380

Patent Document 3: Japanese Patent Laid-Open Publication No. 2000-21702

By using the donor stage on which the donor substrate is placed, the optical stage on which the optical system is placed, and the acceptor stage on which the acceptor substrate is placed as independent mechanisms, and The optical table is not directly placed on the donor table, but is independently installed on a high rigidity table, which minimizes the influence of vibration and various errors accompanying the scanning of each table on the synchronization position accuracy between the tables. As a result, an object of the present invention is to provide a transfer apparatus that contributes to the enlargement, refinement, and shortening of the takt time of the acceptor substrate while maintaining the accuracy of the transfer position.

The first invention is a transfer apparatus which selectively peels off the object by irradiating the object located on the surface of the moving donor substrate with pulsed laser light from the back surface of the donor substrate, and removes the object The object is transferred to the acceptor substrate that moves relative to the donor substrate. The transfer device includes: a laser device for pulse oscillation; a telescope to make the pulsed laser emitted from the laser device into parallel light; a shaping optical system , the spatial intensity distribution of the pulsed laser that has passed through the telescope is shaped into a uniform distribution; a mask allows the pulsed laser shaped by the shaping optical system to pass through in a prescribed pattern; a field lens is located in the between the shaping optical system and the reticle; a projection lens for reducing and projecting the laser light passing through the pattern of the reticle on the surface of the donor substrate; a reticle stage for carrying the field lens and the reticle ; Optical stage, carrying the shaping optical system, the mask stage and the projection lens; the donor stage, so that the back of the donor substrate becomes the laser incident side and supports the donor substrate; The receptor stage carries the receptor substrate; and a programmable multi-axis control device has the trigger output function and stage control function for the pulsed laser oscillation, and the receptor stage has the function of taking the horizontal plane as the XY plane. The Y axis, the Z axis in the vertical direction, and the θ axis in the XY plane, the donor stage has an X axis, a Y axis, and a θ axis, and the projection lens and the Z axis stage for the projection lens are carried on the On the optical table, the telescope, the shaping optical system, the field lens, the photomask and the projection lens constitute a reduction projection optical system, and the reduction projection optical system reduces the projection of the pattern of the photomask On the surface of the donor substrate, the X-axis of the donor stage is set on stage 1 (first stage), and the Y-axis of the acceptor stage is set on stage 2 (second stage) different from the stage 1 platform), the Y-axis of the donor table is suspended on the X-axis of the donor table.

Here, the "moving" substrate includes a pulsed laser (indicated as "LS" in FIG. 1A . However, FIG. 1A shows the main components of the second invention, but since it includes the same components as those of the first invention, Refer to the case where it moves without stopping during irradiation, and the same applies hereinafter) and The case where the pulse laser irradiation is stopped and the movement and stop are repeated is selected according to the transfer process performed by the transfer apparatus of the present invention, the required takt time, and the like. In addition, a structure in which the donor substrate (D) is repeatedly moved and stopped, and the acceptor substrate (R) does not stop, and a structure in the opposite case are also included. When only one shot is used for peeling the object from the donor substrate and a high tact time is required, it is suitable to select a structure in which the donor substrate and the acceptor substrate move at the same or different speeds without stopping. On the other hand, when an object is to be laminated to a certain thickness, etc., a structure in which the donor substrate is moved without stopping and the acceptor substrate is stopped for a certain number of shots may be selected.

In addition, the "object" is not particularly limited, and is a transfer object provided on the donor substrate or on the donor substrate via a light absorbing layer (not shown in FIG. 1A ) in one piece. The thin film represented by the organic EL layer described in the literature and the objects in which a plurality of micro-units are regularly arranged are not limited to these objects. In addition, the mechanism of the transfer includes the following cases: the light absorbing layer irradiated with laser generates a shock wave, whereby the object is peeled off from the donor substrate and transferred toward the acceptor substrate; It is peeled off by irradiating laser light; however, it is not limited to these cases.

The material of the donor substrate only needs to have transmission characteristics for the wavelength of the laser, and it is desirable that the amount of curvature of the substrate is small due to the increase in size of the substrate. In addition, when the amount of curvature is so large that the uniformity of the gap between the donor substrate and the acceptor substrate is not satisfied, the method for supporting the donor substrate on the donor stage (Yd, θd) includes, for example, the following method: Mechanical correction is performed by providing a suction area or the like near the center of the donor substrate; otherwise, correction is performed using a gap sensor formed by a combination of height sensors described later.

In the present invention, in order to transfer the object located near the edge of the donor substrate to the acceptor substrate, the movable range of the donor stage includes the XY plane area in which the donor substrate should move, and refers to a size that depends on the acceptor substrate range. As an example, when the size of the donor substrate in the XY plane is 200 × 200 [mm] and the same acceptor substrate is 400 × 400 [mm], the rules for moving the donor stage (Xd, Yd) The range is roughly 800×800 [mm]. FIG. 4 shows this situation. In addition, in the case where further movement is required to remove the donor substrate, this area is also included.

」形或「□」形的形状。此外，在圖1A中，將平臺2圖示為一個的形狀，但是具體地說，也可以是下述構成：將平臺作為沿Y軸方向設置兩個的平臺，在其中間放置線性刻度和直線電機。另外，平臺1和平臺2可以是固定在同一基礎平臺(G)上的結構。此外，G1可以由平臺11(G11)和平臺12(G12)的組合構成。 In addition, the material of the "platform" is not particularly limited, but it must be a material with extremely high rigidity. In order to make the platform 1 (G1) rigid, it is desired to be "

" or "□" shape. In addition, in FIG. 1A, although the stage 2 is shown in the shape of one, specifically, the following configuration is also possible: two stages are provided along the Y-axis direction, and a linear scale and a straight line are placed in the middle. motor. In addition, platform 1 and platform 2 may be structures fixed to the same base platform (G). Furthermore, G1 may be constituted by a combination of platform 11 ( G11 ) and platform 12 ( G12 ).

In addition, the material of any platform requires the use of rigid components such as steel, stone or ceramic materials. For example, the stone material represented by granite can be used, but it is not limited to this. Also, all platforms need not be made of the same material.

In the embodiments to be described later, the movement of each stage will be described in detail, but the following operations are generally performed. First, the X-axis (Xd) of the donor table is set on G1 in a state where the Y-axis (Yd) of the donor table is suspended and moved in the X-axis direction. Furthermore, the movement changes the relative position along the X-axis between the donor substrate and the acceptor substrate. FIG. 1B shows the case of movement. In addition, the detailed structures of the movable table and the linear guide of the table are not shown in any of the drawings.

The installation method of the optical stage (Xo) is not limited, and various mechanisms can be selected, such as the state of being placed on the Xd, the state of being placed on the same stage as the stage on which the Xd is placed, or placed on a stage different from the Xd. status, etc. Xo and Xd travel simultaneously and move in the X-axis direction, and the relative positions of the shaping optical system (H), field lens (F), mask (M), and projection lens (P1) do not change, and they move integrally. On the other hand, the movement of Xo along the X-axis changes the relative positional relationship between the donor substrate and the projection lens. FIG. 1C shows the situation of this movement.

In addition, when the relative position of the donor substrate and the projection lens in the X-axis direction does not need to be changed, a structure that always moves with the X-axis of the donor stage can be used, that is, the optical stage, the homogenizer, and the field can be omitted. A structure in which the mirror, reticle and projection lens are all positioned on the X-axis of the donor table or fixed on another platform.

The reticle is carried on the reticle stage, and the reticle stage at least has a W axis that moves along the X-axis direction together with the field lens, and preferably also has: a U-axis in the Y-axis direction, a U-axis in the Y-axis direction, and a W-axis that moves along the Z-axis direction. A moving V axis, an R axis that is a rotation axis in the YZ plane, a TV axis that adjusts the inclination relative to the V axis, and a TU axis that adjusts the inclination relative to the U axis. In addition, in order to suppress the injection of heat generated by irradiating laser light to the mask, an aperture mask may be provided on the front side of the mask. The mask is matched to form a double mask structure.

The Y-axis (Yd) of the donor stage and the Y-axis (Yr) of the acceptor stage are in a state where the gap between the donor substrate and the acceptor substrate in the transfer process is kept constant and the parallelism is kept extremely high, and the same or move at different speeds. In addition, according to the above-described structure of the moving method of each stage group and the stage supporting them, by limiting the moving mechanism of the acceptor substrate to the Y-axis and separating it from the moving mechanism of the donor substrate, it is possible to suppress the moving area of the substrates due to each other. The mutual influence caused by the interference and vibration can cope with the enlargement and refinement of the size of the receptor substrate.

The second invention is based on the first invention, the X-axis of the donor table is placed on the platform 1, and the optical table is placed on the X-axis of the donor table.

FIG. 1A shows the main structural part (side view) of the transfer apparatus of the said 2nd invention. FIG. 1B shows a situation (side view) in which Xd is placed on Xo and moved from the state of FIG. 1A . FIG. 1C shows a state (side view) where Xo has moved on Xd from the state shown in FIG. 1B . FIG. 1D shows the top view of FIG. 1C .

The third invention is based on the first invention, the optical table is placed on the platform 1 , and the X-axis of the donor table is suspended on the platform 1 .

FIG. 2A shows a main structural part (side view) of the transfer apparatus of the third invention. FIG. 2B shows the case (side view) in which Xd and Xo are moved by the same distance on G1 (Xd is suspended from G1 ) from the state of FIG. 2A . FIG. 2C shows a case (side view) in which only Xo has moved on G1 from the state shown in FIG. 2B .

The fourth invention is based on the first invention, wherein the X-axis of the donor table is mounted on the platform 1, and the optical table is placed on a platform 3 (different from the platform 1 and the platform 2). third platform).

Here, "installed on the platform 1" includes the state of being placed on the platform 1 and the state of being suspended from the platform 1, but is not limited to these states.

The fifth invention is based on the first invention, and is provided between the X-axis of the donor table and the stage 1 with a rotation adjustment mechanism for finely adjusting the installation angle in the XY plane between the two, Between the X-axis of the donor table and the Y-axis of the donor table, a rotation adjustment mechanism for finely adjusting the installation angle in the XY plane between the two is provided.

Here, FIG. 3A shows an example of a rotation adjustment mechanism (RP) provided between the X-axis (Xd) of the donor table and the stage 1 (G1). In the said FIG. 3A, the left figure shows a top view, and the right figure shows the side view seen from the X-axis direction. In addition, in a plan view, the holes in the row located on the outer side are used for fixing to G1, and have "play" (a margin, a margin) in order to have a rotational adjustment function. In addition, in a plan view, the holes in the second row on the inner side are holes for passing screws for fixing the linear guides of the RP and Xd. In addition, the side with "play" may be used as the hole for the linear guide of the Xd, but when two linear guides are fixed independently and in parallel, there is a possibility that the difficulty of the installation process will increase. .

On the other hand, FIG. 3B shows an example of the RP provided between Xd and the Y axis (Yd) of the donor table suspended from Xd. In a plan view, the holes in the two rows on the outer side are used for fixing with Xd, and have "play" in order to have a rotational adjustment function. In addition, two rows of holes arranged in the Y-axis direction are used for fixing to Yd.

Furthermore, as the RP set between G1 and Xd, an RP different from the aforementioned RP can be used. For example, a fulcrum (rotation axis in the Z-axis direction) is provided on the contact surface between the RP and G1, and the fulcrum is used to adjust the rotation of the RP on which the Xd is placed in the XY plane with respect to the G1 (not shown). A force point with respect to the fulcrum is provided on the side (vertical plane) of the RP that is far from the fulcrum. A large screw that is pressed horizontally toward the force point is provided on G1 near the force point. Similarly, a large screw is provided on the side of the RP on the opposite side. As a result, the RP on which Xd is placed can be rotated in the XY plane with respect to the fulcrum in the order of microradians [μrad] with respect to the fulcrum.

The sixth invention is based on the second invention, and is provided between the X-axis of the donor table and the stage 1 with a rotation adjustment mechanism for finely adjusting the installation angle in the XY plane therebetween, Between the X-axis of the donor table and the optical table, there is a rotation adjustment mechanism for finely adjusting the installation angle in the XY plane therebetween, and the X-axis of the donor table and the A rotation adjustment mechanism for finely adjusting the installation angle in the XY plane therebetween is provided between the Y-axis of the donor table.

As the above RP, for example, the RP used between G1 and Xd shown in FIG. 3A described above, the RP used between Xd and Xo shown in FIG. 3C , and the RP used between Xd and Yd shown in FIG. 3B can be used, for example. RP between.

The seventh invention is based on the third invention, and is provided between the X-axis of the donor table and the stage 1 with a rotation adjustment mechanism for finely adjusting the installation angle in the XY plane therebetween, Between the optical stage and the stage 1, there is a rotation adjustment mechanism for finely adjusting the installation angle in the XY plane between the two, and the X-axis of the donor stage and the A rotation adjustment mechanism for finely adjusting the installation angle in the XY plane therebetween is provided between the Y-axis.

Here, for example, RP shown in FIG. 3A is used as the rotation adjustment mechanism between Xo and G1 and between Xd and G1, respectively, and, on the other hand, as the rotation adjustment mechanism between Xd and Yd, the rotation adjustment mechanism shown in FIG. 3B is used. RP. The former RP has a hole through which the Xo and Xd linear guide fixing screws pass, and the installation angle in the XY plane of the RP and G1 to which the linear guide for each table is fixed is adjusted using the "play" of the hole.

The eighth invention is based on the fourth invention, and is provided between the X-axis of the donor table and the stage 1 with a rotation adjustment mechanism for finely adjusting the installation angle in the XY plane therebetween, Between the optical stage and the stage 3, there is a rotation adjustment mechanism for finely adjusting the installation angle in the XY plane between the two, and the X-axis of the donor stage and the A rotation adjustment mechanism for finely adjusting the installation angle in the XY plane therebetween is provided between the Y-axis.

A ninth invention is based on any one of the first to eighth inventions, wherein the laser device is an excimer laser.

Here, the oscillation wavelength of the excimer laser is mainly 193 [nm], 248 [nm], 308 [nm], or 351 [nm], depending on the material of the light absorption layer and the light absorption characteristics of the object, from among them Choose appropriately.

A tenth invention is based on the ninth invention, wherein the transfer device includes a pulse shutter that cuts off an arbitrary pulse train of laser pulses emitted from the excimer laser.

It is known to the public that the pulse-oscillating laser device receives a trigger signal from the programmable multi-axis control device and starts to oscillate, but the energy of the pulses after the oscillation for a certain number of times or within a certain period of time is unstable to the point where The degree to which the application is different and cannot be used. Therefore, in order to eliminate this unstable pulse group, it is necessary to eliminate the above-mentioned pulse group by mechanical shutter operation. Specifically, for example, in the case of an excimer laser oscillating at 1 [kHz], the time window between adjacent laser pulses is about 1 [ms], and it is necessary to be able to move (traverse) within this time. High-speed shutter function for a certain distance. The certain distance depends on the space size of the laser in the place where the shutter operates. If the distance is 5 [mm], the required shutter operation speed is 5 [m/s], and a voice coil needs to be used. Such as ultra-high-speed shutters that allow optical elements to enter and exit the optical path. In addition, even if the size of the space is reduced by molding the optical system or the like, and the distance that the shutter member traverses can be shortened, it is easily damaged due to the energy density of the laser.

The eleventh invention is based on the tenth invention, wherein the programmable multi-axis control device has a function of at least simultaneously controlling the Y-axis of the acceptor table and the Y-axis of the donor table, and includes using A device for correcting the moving position error by pre-produced two-dimensional distribution correction value data for correcting the moving position error of the stage.

For example, the position correction of the acceptor substrate and the donor substrate during laser irradiation is performed using the two-dimensional distribution correction value data information in the XY plane analogous to any combination of Xd or Xo, Yr or Yd. The main causes of the corrected position error include pitching, yawing, and rolling that occur with the movement of each stage, but are not limited to these. In addition, the parameters for determining the correction value include the moving speeds of Yr and Yd and their ratios in addition to the position information of the respective stations.

The twelfth invention is based on the eleventh invention, wherein a high-magnification camera for monitoring the position of the donor substrate is disposed on the Z-axis of the acceptor stage, or a high-magnification camera for monitoring the position of the acceptor substrate A camera is provided on the X-axis of the donor table or a portion that moves with the X-axis of the donor table, or on the optical table or a portion that moves with the optical table.

Here, Yd suspended from Xd is also included in the "portion that moves together with the X axis of the donor table". In the present invention, the parallelism between the Y-axis and the X-axis of each stage and the perpendicularity between the Y-axis and X-axis of each stage are important parameters for the positional accuracy of the left-right transfer. In addition, in the inspection of parallelism and perpendicularity at the time of assembling each stage, a high-magnification, high-resolution camera is used to monitor the deviation in the vertical direction relative to the moving distance of each stage on which the alignment substrate is placed, and The verticality adjustment is performed using the rotational adjustment mechanism. In addition, in the adjustment of the parallelism between Yr and Yd, the two stages are moved synchronously (parallel) by the same distance, and the pattern matching is performed by observing the high-magnification camera mounted on one stage and attached to the opposite stage. Is the position of the alignment mark image (cross mark, etc.) still stationary without moving. In this case, the movement in the Y-axis direction indicates an abnormal synchronization between Yd and Yr, and the movement in the X-axis direction indicates an adjustment error in the parallelism of Yd and Yr.

In addition, a CCD camera is generally used as a high-magnification camera. The magnification and the like depend on the transfer position accuracy, but as an example, in the case of detecting the deviation amount of the order of [μrad], that is, the case of detecting the deviation amount of 1 [μm] with respect to the table moving distance of 1 [m] In this case, a camera with a resolution of 1 [μm] and a magnification of about 20 to 50 times can be used.

A thirteenth invention is based on the twelfth invention, wherein the donor stage and the acceptor stage include a gap sensor that measures the difference between the surface (lower surface) of the donor substrate and the the gap of the surface of the acceptor substrate.

Here, the gap sensor refers to a sensor that combines height sensors arranged on the donor and acceptor stages, respectively, and the height sensor arranged on the donor stage measures the distance to the acceptor substrate, A height sensor disposed on the acceptor stage measures the distance to the donor substrate, and calculates the gap between the donor substrate and the acceptor substrate according to the two measured values and the height information of the height sensor.

The fourteenth invention is based on the thirteenth invention, and includes a position measuring device using a laser interferometer for the Y-axis of the acceptor stage and the Y-axis of the donor stage, respectively.

As the structure of the laser interferometer for the Y axis (Yr) of the receiver stage, a structure including the following components can be used: a mirror (Ic), which is carried on the part that moves together with Yr; and a laser (IL) for the interferometer, which is fixed For example, on a platform such as platform 2 (G2) that is not easily affected by vibrations and the like caused by the movement; and a quarter-wave plate, etc. (not shown). In addition, as the mirror, a triaxial corner prism (retro-reflector) is suitably used, and it is preferable to be as close as possible to the position (height) of the receptor substrate. An overview is shown in FIG. 5A (the Z-axis and theta-axis of the donor stage group and the acceptor stage are omitted).

Based on the position information from the linear encoder, Yr is controlled by a programmable multi-axis control device, and the laser interferometer is used for the correction of the linear encoder and as the calibration of the Yr and Yd described later. Correction when the gear ratio is finely adjusted in gear mode action.

As the structure of the laser interferometer for the Y axis (Yd) of the donor stage, a structure including the following components can be used: Ic, which is carried on a surface that moves together with Yd suspended from Xd; IL, which is fixed to Xd in the same way and 1/4 wavelength plate, etc. (illustration omitted). Here, as the mirror, a triaxial pyramid (retro-reflector) is suitably used, and it is preferable to be as close to the position (height) of the donor substrate as possible. An overview is represented by Fig. 5B. (The receiver stage group is not shown in the figure.) In addition, for the selection of the detection method of the laser for any interferometer, the most suitable method may be selected according to the required transfer position accuracy.

The fifteenth invention is based on the fourteenth invention, wherein the transfer device includes a confocal beam profiler, and the confocal beam profiler performs reduced projection on the pattern of the reticle through the projection lens and combined with The position of the imaged position conjugate has a focal plane.

With the confocal beam profiler, the position and spatial intensity distribution of the laser reduced-projected on the surface of the donor substrate and the imaging state thereof can be monitored instantly and with the same precision as the imaging resolution of the reduced-imaging optical system.

The sixteenth invention is a method of using a transfer device, the transfer device is the transfer device of the thirteenth invention, and the gap sensor is used to detect in advance together with the XY position information of the donor substrate The amount of curvature of the donor substrate is measured, based on the two-dimensional distribution data of the amount of curvature obtained by the measurement, while using adjustment by the Z-axis (Zr) of the acceptor stage or the Z-axis stage of the projection lens, While correcting the gap between the donor substrate and the acceptor substrate.

A seventeenth invention is a method for adjusting a transfer device, which is the transfer device according to any one of the fifth to eighth inventions, and the method for adjusting the transfer device is a step of assembling the transfer device The adjustment method of the parallelism of the Y-axis of the acceptor stage and the Y-axis of the donor stage in the adjustment method of the transfer device is performed in a straight line with the Z-axis and the theta-axis of the acceptor stage The Y-axis of the acceptor table for the degree of adjustment is based on the following steps: through the rotation adjustment mechanism located between the platform 1 and the X-axis of the donor table, the adjustment of the acceptor table The verticality of the Y-axis and the X-axis of the donor table is adjusted; the Y-axis of the donor table and the Y-axis of the acceptor table are suspended from the X-axis of the donor table whose verticality is adjusted. Synchronized parallel travel, observing alignment marks on the Y-axis of the opposing donor table through a high-magnification camera mounted on a site that moves with the Y-axis of the acceptor table; and a result based on the observation The parallelism of the Y-axis of the acceptor table and the Y-axis of the donor table is adjusted by a rotation adjustment mechanism between the X-axis of the donor table and the Y-axis of the donor table.

In addition, in order to confirm and adjust the parallelism of Yd and Yr with high accuracy, it is preferable that the high-magnification camera is located at the highest position among the stages and plates placed on the Yr, and is mounted on a portion with high rigidity.

The present invention can realize the enlargement of the acceptor substrate of the transfer device and shorten the tact time while maintaining the high transfer position accuracy on the basis of the high synchronization position accuracy of the donor substrate and the acceptor substrate.

1: Platform

2: Platform

3: Platform

11: Platform

12: Platform

AD: Adjustment substrate for donor stage

AR: Adjustment substrate for receiver stage

BP: Confocal Beam Profiler

CCD: high magnification camera

D: Donor substrate

F: Field lens

G: Basic Platform

G1: Platform 1

G11: Platform 11

G12: Platform 12

G2: Platform 2

G3: Platform 3

H: shaping optical system

Ic: Corner prism for laser interferometer

IL: Laser for Laser Interferometer

LS: Laser

M: photomask

Pl: projection lens

R: receptor substrate

RP: Rotation Adjustment Mechanism

S: object

TE: Telescope

Xd: X-axis of the donor table

Xo: Optical stage (X-axis)

Yd: Y axis of the donor table

Yl: Switcher for projection lenses and cameras

Yr: Y-axis of the receptor stage

Zl: Z-axis stage of the projection lens

Zr: Z axis of the acceptor stage

θ d: the theta axis of the donor table

θ r: the theta axis of the acceptor stage

FIG. 1A shows the main structural part (side view) of the transfer apparatus of the present invention. (Second Invention)

FIG. 1B shows a case where the X-axis of the donor table is placed on the optical table and moved from the state of FIG. 1A (side view).

FIG. 1C shows a state in which the optical table is moved on the X-axis of the donor table from the state of FIG. 1B (side view).

1D is a top view of FIG. 1C.

FIG. 2A shows the main structural part (side view) of the transfer apparatus of the present invention. (third invention)

FIG. 2B shows the case where the X-axis of the donor table and the optical table are moved by the same distance on the stage 1 from the state of FIG. 2A (side view).

FIG. 2C shows a case (side view) in which only the X-axis of the optical table has moved on the stage 1 from the state shown in FIG. 2B .

FIG. 3A shows an example of a rotational adjustment mechanism used between G1 and Xd.

FIG. 3B shows an example of a mechanism for adjusting the rotation between Xd and Yd.

FIG. 3C shows an example of a rotational adjustment mechanism used between Xd and Xo.

Figure 4 shows the range that the donor stage should move according to the size of the acceptor substrate.

FIG. 5A shows a case where a laser interferometer for the Y-axis is provided with an acceptor stage.

FIG. 5B shows a case where a laser interferometer for the Y-axis is provided with a donor stage.

FIG. 6 shows an example of a pattern formed on a photomask.

FIG. 7 shows the case of a transfer process using a multi-row mask pattern.

FIG. 8 shows the monitoring of the confocal beam profiler.

FIG. 9A shows the first irradiation of the transfer process.

FIG. 9B shows the second irradiation of the transfer process.

FIG. 9C shows the third irradiation of the transfer process.

FIG. 10 shows the state of the receiver substrate after one scan with the gear ratio of 1:2.

FIG. 11 shows the case of the step scan of the X-axis of the donor table.

FIG. 12 shows a synchronization position error when the Y-axis of the acceptor table and the Y-axis of the donor table are brought into parallel.

FIG. 13A shows the first irradiation of the transfer process using the matrix-shaped donor substrate.

FIG. 13B shows the second irradiation of the transfer step using the matrix-shaped donor substrate.

FIG. 13C shows the third irradiation of the transfer process using the matrix-shaped donor substrate.

Hereinafter, the specific structure of the transfer apparatus of the present invention will be described in detail with reference to the accompanying drawings.

[Example 1]

In this Example 1, an example is shown in which a layered (solid-state film) object formed in one piece with a light absorbing layer on a donor substrate having a size of 200×200 [mm] is used for each shape A unit-shaped transfer object having a size of 10×10 [μm] was transferred to a receptor substrate having a size of 400×400 [mm] in a matrix of a total of 144 million of 12000×12000 in length. The above-mentioned 144 million transfer positions have a positional accuracy of ±1 [μm], and the vertical and horizontal pitches are 30 [μm].

First, FIG. 1A shows the main structural part of the transfer apparatus related to the implementation of the present invention. In addition, in FIG. 1A , the illustration of the laser device, the control device, and other monitors, etc. is omitted, and the directions of the X-axis, the Y-axis, and the Z-axis are shown in the drawing. Platform 1 (G1), platform 11 (G11), platform 12 (G12), and platform 2 (G2) are all stone platforms using granite. In addition, the base platform (G) uses iron with high rigidity. In addition, this Example is an Example based on the structure of the said 6th invention.

The configuration of the transfer apparatus according to Embodiment 1 of the present invention will be sequentially described in accordance with the transmission sequence of the laser light until the pulsed laser light is emitted from the laser apparatus and irradiated to the object on the donor substrate. First, the laser device used in this Example 1 is an excimer laser with an oscillation wavelength of 248 [nm]. The spatial distribution of the emitted laser beam is approximately 8×24 [mm], and the beam divergence angle is 1×3 milliradian [mrad]. The above are all descriptions of (vertical x horizontal), and the numerical value is FWHM.

In addition, there are various specifications of excimer lasers. Depending on the output, the repetition frequency, the beam size, and the beam divergence angle, there is a possibility that the emitted laser has a longitudinal length (reversing the vertical and horizontal directions). ), but there are many types of excimer lasers that can be used in Example 1 by addition, omission, or design change of an optical system. In addition, although the laser device depends on its size, it is generally installed on a base (laser stage) different from the base of the table group on which the transfer device is installed.

The outgoing light from the excimer laser enters the telescope optical system and is transmitted to the shaping optical system in front of it. Here, as shown in FIG. 1A , the shaping optical system is mounted on an optical table (Xo) provided on the X-axis (Xd) of the donor table that moves the donor substrate so that the optical axis is along the X-axis. superior. In addition, the laser beam just before entering the shaping optical system is adjusted by the telescope optical system so that it becomes substantially parallel light at any position within the moving range of the X-axis of the donor stage. Therefore, regardless of the movement in the X-axis direction of Xd and/or Xo, the laser light always enters the shaping optical system with substantially the same size and the same angle (vertical). In this Example 1, the size is about 25×25 [mm] (vertical×horizontal).

The shaping optical system (H) of the present embodiment 1 combines two sets of uniaxial cylindrical lens arrays into two sets of right angles in a plane perpendicular to the optical axis direction. The configuration is such that the lens array of the front stage in each group passes through the lens array of the rear stage and the condenser lens (not shown) located behind the lens array to form an image on the mask (M).

The laser beam that has passed through the shaping optical system is incident on the reticle via the field lens (F) that constitutes the image-side telecentric reduction projection optical system in combination with the projection lens (P1). The size of the laser on the mask is 1×50 [mm] (FWHM), and the size of the area whose spatial intensity distribution uniformity is within ±5% is maintained at 0.5×45 [mm] or more.

The reticle is fixed on the reticle stage. As described above, the reticle stage has a total of six-axis adjustment mechanisms, and the six axes are: the W-axis that moves in the X-axis direction together with the field lens, and the U-axis in the Y-axis direction. , the V axis that moves in the Z-axis direction, the R axis that is the rotation axis in the YZ plane, the TV axis that adjusts the inclination relative to the V axis, and the TU axis that adjusts the inclination relative to the U axis.

As the photomask of this Example 1, a photomask in which a pattern was drawn (formed) on a synthetic quartz plate by chrome plating was used. FIG. 6 shows its outline. In this photomask, a window portion (a) shown in white, which is not chrome-plated, transmits laser light, and a colored portion (b), which is chrome-plated, blocks laser light. The shape (a) of one window is 50×50 [μm], and a total of 300 windows are continuously arranged at intervals of 43.85 [mm] at intervals of 150 [μm] along the X-axis direction (one column). In addition, the surface on which the chrome plating is performed is the emission side of the laser beam, and on the other hand, an antireflection film for 248 [nm] is provided on the incidence side. Also, instead of chrome plating, aluminum evaporation can be used or dielectric multilayer films.

In addition, when switching the transfer process using a plurality of patterns on one reticle, if the size of the laser beam irradiated from the shaping optical system to the reticle is within the range of the movable range of the reticle stage , you can use a reticle with a different pattern.

In addition, in FIG. 7 , in the case where the transfer process of scanning the donor substrate (D) at the same speed a plurality of times or reciprocating is used while the acceptor substrate (R) is scanned once (including halfway stops), etc. , the reticle pattern shown in Figure 6 may not be one column, but a multi-column pattern (but the laser irradiation is intermittently and selectively irradiated in the reticle pattern. In Figure 7, it is represented as a matrix of 3 × 2 columns) . Thereby, the donor substrate having a smaller size than the acceptor substrate can be used.

The laser passing through the mask pattern changes its transmission direction to be vertically downward (-Z direction) through the epi mirror and enters the projection lens. The projection lens is provided with an antireflection film for 248 nm, and has a reduction magnification of 1/5. Details are shown in Table 1 below.

The laser beam emitted from the projection lens is incident from the back surface of the donor substrate, and is accurately projected at a predetermined position of the light absorbing layer formed on the surface (lower surface) of the mask pattern at a reduced size of 1/5 of the mask pattern. Here, the X-axis (Xd), Y-axis (Yd), and θ-axis (θd) of the donor stage are adjusted based on the alignment marks previously attached to the donor substrate, etc., to determine the rules in the XY plane. Location.

To adjust the image plane of the reticle pattern generated by the projection lens to focus on the donor substrate The surface of the plate and the edge interface of the light absorbing layer adjust the positions of the Z-axis stage (Z1) of the projection lens and the W-axis position of the mask stage on which the field lens (F) is placed. In addition, an adjustment function (Z-axis stage) in the Z-axis direction of the donor substrate can be added, but it is necessary to consider the decrease in the transfer position accuracy due to the addition of a heavy load to the X-axis (Xd) of the donor stage.

When adjusting the imaging position of the donor substrate surface and the edge interface of the light absorbing layer, instant monitoring using a confocal beam profiler (BP) having a plane in the focal plane that is conjugate to the image plane is effective. FIG. 8 shows the state of the adjustment screen. In this embodiment 1, the spatial intensity distribution of the laser imaged on the surface of the donor substrate and the edge interface of the light absorbing layer is monitored in real time and with high resolution.

The above are the functions realized by the device structure of the first embodiment related to the transmission of the pulsed laser light emitted from the laser device.

Next, how the parallelism of the Y-axis (Yr) of the acceptor table and the Y-axis (Yd) of the donor table can be mechanically achieved in the apparatus of the present invention using the structure of Example 1 is briefly described.

Each stage As shown in FIG. 1A, the X-axis (Xd) of the donor stage is placed on the stone stage 1 (G1), and the optical stage (Xo) is placed thereon. The acceptor table set (Yr, θr, Zr) was placed on stone table 2 (G2). Furthermore, the whole is built on the base platform (G). Further, a rotation adjustment mechanism (RP) is provided between G1 and Xd, between Xo and Xd, and between Xd and Yd (illustration omitted).

In addition, in order to adjust the perpendicularity and parallelism of the axes of each stage, the adjustment substrate AD carried on the donor stage is used instead of the donor substrate, and the adjustment substrate AR placed on the acceptor stage is used instead of the acceptor substrate. Lines representing the X-axis (alignment line X) and the Y-axis (alignment line Y) that form an accurate right angle are drawn as alignment lines on any of the adjustment substrates, and are also added at predetermined positions (intervals). mark.

1) The parallelism between Yr and AR(Y) (the perpendicularity between Yr and AR(X))

In order to adjust the parallelism of the Y-axis (Yr) of the acceptor stage and the alignment line Y on the adjustment substrate AR, the adjustment substrate AR placed on the Z-axis (Zr) of the acceptor stage is observed by a high-magnification CCD camera, the High magnification CCD camera fixed on the optical table (Xo) or set on the optical table (Xo) on the Z-axis stage for the projection lens. The Yr axis was moved by 400 [mm], and the θ axis (θr) of the receiver stage was adjusted so that the deviation amount in the X axis direction of the alignment line Y was within 1 [μm]. In addition, the moving distance of the stage at this time is within the range of the effective stroke of the stage, and the amount of deviation to be tolerated varies according to the required transfer accuracy. (same below)

2) The parallelism between AR(X) and Xd (the perpendicularity between Yr and Xd)

Next, using the alignment line X of the adjustment substrate AR adjusted as described above, the perpendicularity between the X-axis (Xd) of the donor stage and the Y-axis (Yr) of the acceptor stage is adjusted while observing with a high-magnification CCD camera, The high-magnification CCD camera is also fixed on the optical table (Xo) or on the Z-axis table for the projection lens provided on the optical table (Xo). Move the Xd axis by 400 [mm], and use the rotation adjustment mechanism between G1 and Xd to adjust the mounting angles of both so that the deviation in the Y axis direction of the alignment line X is within 1 [μm] , and adjust the installation angle of G1 and Xd, that is, Xd relative to Yr.

3) The parallelism between AR(X) and Xo (the perpendicularity between Yr and Xo, the parallelism between Xd and Xo)

Using the alignment line X of the adjustment substrate AR adjusted as described above, the parallelism between the optical table (Xo) and the X-axis (Xd) of the donor table is adjusted while observing by a high-magnification CCD camera. It is fixed on the optical table (Xo) or on the Z-axis stage for the projection lens provided on the optical table (Xo). The Xo-axis is moved by 200 [mm], and the optical stage (Xo) is adjusted relative to the donor by the rotation adjustment mechanism between the two so that the deviation in the Y-axis direction of the alignment line X is within 0.5 [μm]. The parallelism of the X-axis (Xd) of the stage.

4) Parallelism of Yd and AD(Y)

In order to adjust the parallelism of the Y-axis (Yd) of the donor stage and the alignment line Y on the adjustment substrate AD, the adjustment substrate AD carried on the θ-axis (θd) of the donor stage is observed by a high-magnification CCD camera, the said The high-magnification CCD camera is fixed on the optical table (Xo) or on the Z-axis table for the projection lens provided on the optical table (Xo). The Yd axis is moved by 200 [mm], and the θ axis (θd) of the donor stage is used for adjustment so that the deviation amount in the X axis direction of the alignment line Y is within 0.5 [μm]. all.

5) The parallelism of AD(X) and Xo (the parallelism of AD(X) and Xd, the perpendicularity of Xd and Yd)

In order to adjust the perpendicularity between the X-axis (Xd) of the donor table and the Y-axis (Yd) of the donor table, the alignment line X on the adjustment substrate AD is observed by a high-magnification CCD camera fixed on the On the optical table (Xo) whose parallelism with the X-axis (Xd) of the donor table is adjusted, or on the Z-axis table for the projection lens provided on the optical table (Xo). The optical stage (Xo) is moved by 200 [mm], and is adjusted and suspended on the donor by the rotation adjustment mechanism between the two so that the deviation amount in the Y-axis direction of the alignment line X is within 0.5 [μm]. The perpendicularity of the Y-axis (Yd) of the donor table on the X-axis (Xd) of the table.

6) Parallelism between AD(Y) and Yr (parallelism between Yd and Yr)

Finally, in order to confirm the parallelism of the Y-axis (Yd) of the donor table and the Y-axis (Yr) of the acceptor table, a high-magnification CCD camera is installed on the Y-axis (Yd) of the donor table, and the observation placed on the opposite Alignment line Y of the adjustment substrate AR on the acceptor stage. At this time, the adjustment board AD is removed in advance. The X-axis (Xd) of the donor table was moved to enable the high magnification CCD camera to view either end of the acceptor table. Next, the Y-axis (Yd) of the donor stage was moved by 400 [mm], and it was checked whether the deviation amount of the alignment line Y in the X-axis direction was within 1 [μm]. In addition, in order to perform the same confirmation on the other end of the receiving stage, after moving Xd to the other end, move Yd by 400 [mm], and confirm that the deviation amount of the alignment line Y in the X-axis direction is within 1 [ μm]. In addition, Yd and Yr may be moved in parallel to observe the positional change of the alignment mark.

In addition, in the case where the high-magnification CCD camera is mounted on the Y-axis (Yd) of the donor table, depending on the position of the X-axis of the donor table and the shape (opening) of the stone table 1, there are differences between the high-power CCD camera and the the possibility of their contact. In this case, the high-magnification CCD camera is not attached to Yd but is attached to the Z-axis (Zr) of the receiver stage, and can be observed by moving the Y-axis (Yr) of the receiver stage by 200 [mm] Adjust the alignment line Y of the substrate AD and check the amount of deviation in the X-axis direction.

Since the stone platform 1 (G1) and the stone platform 2 independently support each platform, and Yd is suspended from Xd provided on G1, the parallelism between Yr and Yd cannot be directly adjusted, but can be adjusted step by step as described above. The parallelism of Yr and Yd is adjusted in the order of [μrad]. In addition, since errors in parallelism (perpendicularity) are accumulated in the adjustment steps in the order of 1) to 6), it is desirable to perform the adjustment so as to suppress the allowable amount of deviation in the initial stage as small as possible. In addition, although the adjustment procedures 1) to 6) describe the adjustment of the parallelism and perpendicularity of each stage of the XY plane, adjustment of other axes (X axis and Y axis) is also required.

Next, with reference to FIGS. 9A to 9C , the scanning of the donor substrate and the acceptor substrate at the time of transfer in the first embodiment will be described. Here, the top views of FIGS. 9A to 9C are diagrams in which the operator is located on the left side of these figures, and the donor substrate (D) and the acceptor substrate (R) are scanned in front and back with respect to the operator.

First, the amount of curvature of the donor substrate adsorbed and set on the θ axis (θd) of the donor stage is measured over the entire surface of the donor substrate, and mapped together with position information as two-dimensional data. This information is used as a correction amount for the Z-axis (Zr) of the acceptor table corresponding to the X-axis (Xd) and the Y-axis (Yd) of the donor table that are moved in the transfer process.

In addition, in the following description, for convenience of description, the predetermined position on the left anterior side of the acceptor substrate (R) and the donor substrate (D) when viewed from the operator is defined as the origin of each substrate. In addition, the positions of the optical table (Xo) and the receiver table (Yr, θr) when the laser beam is irradiated to the origin of the receptor substrate are defined as the origin, respectively. In addition, in the donor substrate, the position of the donor stage (Xd, Yd, θd) at the time of the laser (LS) irradiation is also defined as the respective origin. However, the origin of each stage is not limited to one end of its stroke range, but is a position where a stroke portion of the movement is reserved for the subsequent transfer process and removal of the substrate.

FIG. 9A shows a case where the first pulse of laser light (LS) is irradiated to the donor substrate (D) and the acceptor substrate (R) at the origin. Here, both a side view (side view) and a plan view (top view) are illustrated. The dashed-dotted line indicates the case where the laser beam is irradiated to the object (S) through the reduced projection optical system, and the light absorbing layer (not shown) in the 10×10 [μm] region that has received the irradiation absorbs the laser beam and ablates the laser beam. A shock wave is generated, whereby the object in the same area is transferred to the opposing receptor substrate. object shown Although there are three objects, in the case of Example 1, a total of 300 objects are transferred to the acceptor substrate at one time.

In the present Example 1, the laser device oscillated at 200 [Hz], and since the transfer was performed by one shot, the receiver stage (Yr) did not stop the receiver substrate until the next shot position at a speed of 6 [Hz]. mm/s] to scan in the -Y direction.

On the other hand, the Y-axis (Yd) of the donor stage is synchronized with the position of the Y-axis (Yr) of the acceptor stage, and is directed at a speed of 3 [mm/s] without stopping the donor substrate. Scan in the same -Y direction. That is, the moving speed ratio (gear ratio) of Yd and Yr is 1:2. FIG. 9B shows the second irradiation after each substrate is moved.

With Yr as the reference (master) and Yd as the slave (slave), the positions of Yr and Yd are synchronized by synchronizing the two stages in the gear pattern using the gear command of the stage system. Use programmable multi-axis controls in the control system.

Furthermore, in order to determine the gear ratio of the gear command, the actual measurement of the stage position measured by the laser interferometer is used. Install the pyramid (Ic), set the helium-neon (He-Ne) laser (IL) with a wavelength of 632.8 [nm] and the light-receiving part (not shown in FIG. 5A ) on the stone platform 2 (or an equivalent stationary position) , the pyramid (Ic) moves together with the moving stage of Yr and forms a laser interferometer in the vicinity of the receptor substrate. Similarly, a pyramid is attached to the side surface of the moving stage of Yd, and a laser beam for an interferometer and a light-receiving part (not shown in FIG. 5B ) are installed on Xd. Thereby, accurate position synchronization of each station is achieved.

As described above, at the position of the origin, each stage starts to accelerate from the position on the immediate side of the origin so that the constant velocity motion has become stable. During the acceleration time and the time until the stage reaches the origin, it is necessary to cut off the laser pulse so that the donor substrate is not irradiated with the laser beam. Therefore, the programmable multi-axis control device transmits the external oscillation trigger signal or the action start trigger signal of the high-speed shutter and the stage drive signal to the laser device with high precision.

In addition, FIG. 9C shows the case of the third irradiation. From the figure, it can be seen that the moving distance of the acceptor substrate (R) is doubled relative to the moving distance of the donor substrate (D). Thereafter, similarly, the acceptor substrate and the donor substrate continue to move.

When the donor substrate scans 180 [mm] in the -Y direction and ends, and similarly, when the acceptor substrate scans 360 [mm] in the -Y direction and ends, the oscillation of the laser device is temporarily stopped, or it is cut off with a high-speed shutter Laser irradiation. By scanning this distance, 300 objects arranged in the X-axis direction are shifted along the Y-axis direction of the receptor substrate by 12,000 lines and a total of 3.6 million objects. FIG. 10 shows this situation.

During the stop time, both the Y-axis (Yr) of the acceptor table and the Y-axis (Yd) of the donor table return to the origin. (However, the acceleration distance for the next scan is taken into consideration. The following is the same.) On the other hand, the X-axis (Xd) of the donor table returns to the position of -9 [mm] from the previous origin. In addition, the transfer process is restarted from a new area. Hereinafter, the above-mentioned operations are repeated.

Fig. 11 shows the return to the position of 15 [μm] in the -X direction from the previous origin (indicated by the dotted line) this time after the -9[mm]×20 step movement of Xd (indicated by real line icon), before starting the same action as the new origin. After that, the Y-axis scanning (180 [mm] (Yd) and 360 [mm] (Yr)) of the two stages and the step operation of -9 [mm]×20 times of Xd were repeated. As a result, during the first Xd scan of 180 [mm] (movement of 20 steps of -9 [mm]), the area that is not irradiated with laser light (the next laser ( By irradiating the laser beam in the area to be irradiated in LS), it is possible to transfer more objects on the donor substrate to the acceptor substrate without waste.

In addition, the approximate processing time is 360[mm]/6[mm/s]×40[times]=2400[s]. In addition, the time required for the Y-axis (Yr) of the receiver stage to move the distance required for acceleration and deceleration and the time until the Y-axis is scanned to return to the origin each time are not included in this time. In addition, by increasing the repetition frequency of the excimer laser to 1 [kHz], the above processing time can be shortened by 1/5.

Fig. 12 shows the apparatus configuration of the first embodiment, in which the receiver table is moved by 400 [mm at a moving speed of 150 [mm/s] with the Y-axis (Yr) of the receiver table as a reference (main) in a synchronized manner. ], and the donor table is moved by a distance of 200 [mm] at a moving speed of 75 [mm/s] with the Y-axis (Yd) of the donor table as a slave, synchronization between the two tables position error. Specifically, the difference between the error amount (δYr) and the error amount (δYd) (ΔYdr=δYd−δYr), the error amount (δYr), is plotted on the horizontal axis as the elapsed time corresponding to the moving speed of the receiver table is on Yr as the reference (master) from the The amount of error between the position information obtained by the linear encoder and the position information measured by the laser interferometer, the error amount (δYd) is calculated from Yd, which is a slave (slave) moving synchronously at the speed of 1/2 above. The amount of error between the position information obtained by the linear encoder and the position information measured by the laser interferometer. As can be seen from the results, the position synchronization accuracy within ±1 [μm] was achieved within a moving distance of 400 mm.

As described above, the transfer pattern (pattern) of the object to the receiver substrate in the present Example 1 is a matrix of 10×10 [μm] at intervals of 30 [μm]. However, for example, if the interval is set to 60 [μm], the transfer of four acceptor substrates can be performed with one donor substrate.

[Example 2]

In this Example 2, the object on the surface of the donor substrate is different from the layer state in which the object on the surface of the donor substrate is one sheet, and is an example in which the same size of the donor substrate of 200×200 [mm] is formed as A matrix of 144 million objects with a shape of 10 × 10 [μm] and an interval of 15 [μm] in total, at 1/2 the density of the donor substrate, that is, at intervals of 30 [μm] and The same matrix was transferred to the acceptor substrate of size 400×400 [mm].

Finally, the arrangement of the objects to be transferred to the acceptor substrate is the same as that of Example 1, but the difference is that in the present Example 2, the objects are also similarly arranged on the donor substrate in advance at twice the density, and It was transferred onto the acceptor substrate with a positional accuracy of ±1 [μm]. In addition, in this case, compared with Example 1, the positional synchronization accuracy of the Y-axis (Yd) of the donor stage and the Y-axis (Yr) of the acceptor stage is more strictly required.

FIG. 13A to FIG. 13C show the case of irradiating the donor substrate (D) and the acceptor substrate (R) at the origin from the first pulse of the laser beam (LS) to the third time as in Example 1. irradiated condition.

[Example 3]

In this Example 3, the method of transferring the object on the surface of the donor substrate to the acceptor substrate is the same as that in Example 1 or Example 2. On the other hand, the method of adjusting the parallelism of the Y-axes and the X-axes of the stages, and the perpendicularity of the Y-axes to the X-axes is different from that of the above-described embodiment. That is, the adjustment method described in Example 1 is as follows: In order to adjust the Y-axis (Yr) of the acceptor stage and the donor stage For the parallelism of the Y-axis (Yd), the adjustment steps 1) to 6) are carried out. In contrast, in the third embodiment, the parallelism of Yr and Yd is adjusted in the early stage of the adjustment step.

1) Straightness of Yr, θr, Zr

This adjustment step is an adjustment step that is a premise common to the first and second embodiments described above. Use a laser interferometer or the like to adjust the Y axis (Yr) of the acceptor stage set on the stone stage 2 (G2), the θ axis (θr) set thereon, and the same Z axis (Zr) and the acceptor substrate. Straightness of the holder (straightness with respect to the Z-axis which is the vertical direction when the horizontal plane is the XY plane). In addition, basically, after this adjustment, no adjustment that may affect the verticality of the receiver table group is performed, and all other table adjustments are performed based on, for example, the uppermost surface of the receiver table group.

2) The parallelism between Yr and AR(Y) (the perpendicularity between Yr and AR(X))

Similar to the adjustment step 1) of Example 1, the parallelism of the Y-axis (Yr) of the acceptor stage and the alignment line Y on the adjustment substrate AR was adjusted. Thereby, the perpendicularity of Yr to the alignment line X is also adjusted. In addition, when using the alignment line or alignment mark obtained by direct drawing etc. on Yr without using the adjustment board|substrate AR, this adjustment process 1) can be abbreviate|omitted.

3) The parallelism of AR(X) and Xd (the perpendicularity of Yr and Xd)

Next, the alignment line X of the adjustment substrate AR is observed by a high-magnification CCD camera installed on the optical stage (Xo) placed on the X-axis (Xd) of the donor stage. The position in the Z-axis direction of the above-mentioned high-magnification CCD camera is determined by the design of the projection optical system, but in the third embodiment, the Z-axis stage (Z1) carrying the projection lens is used to be fixed near the position of the projection lens (P1). . Move Xd by 400 [mm], and use the rotation adjustment mechanism to adjust the installation angle of Xd relative to the stone platform 1, that is, the perpendicularity of Xd relative to Yr, so that the deviation in the Y-axis direction of the alignment line X is within 0.3 [μm]. Spend.

4) Parallelism in the YZ plane of Yr and Yd

In the description of Example 1, the description of the adjustment procedure of the other axis systems (X-axis and Y-axis) is omitted, and here, the X-axis system, that is, the adjustment procedure of the parallelism in the YZ plane is briefly described. The lower surface of the Y-axis (Yd) of the donor table is observed using a height sensor disposed on the Z-axis (Zr) of the acceptor table or elsewhere. Move Yr and Yd simultaneously (parallel movement) over the same distance of 200[mm] or more, see Observe the change in the measured value of the gap sensor (the distance between Zr and Yd). Insert the backing plate into the rotation adjustment mechanism provided between Xd and Yd and between Yd or Xd in such a way that the change is within 5 [μm] or within a range sufficiently small compared to the depth of focus of the image formed by the projection lens. During this time, adjust the parallelism in the YZ plane between Yr and Yd.

5) Parallelism of Yr and Yd

The alignment mark for pattern matching provided on the lower surface of Yd is observed using a high-magnification CCD camera provided at Zr or other locations. When Yr and Yd are moved synchronously (parallel movement) by the same distance and the position of the alignment mark image (cross mark, etc.) that matches the pattern is moved in the X-axis direction, the rotation adjustment mechanism provided between Xd and Yd is used. adjustment to correct it. In addition, instead of the alignment mark, the alignment line Y of the adjustment substrate AD mounted on the Y axis of the donor table may be used.

6) The perpendicularity of Yr and Xo

The alignment line X of the adjustment substrate AR whose perpendicularity to the Y-axis (Yr) of the receptor stage was adjusted in the adjustment step 1) was observed by a high-magnification CCD camera installed on the optical stage (Xo). By moving Xo by 400 [mm], the mounting angle of Xo with respect to Xd is adjusted using the rotation adjustment mechanism provided between the two so that the deviation in the Y-axis direction of the alignment line X is within 0.3 [μm].

[Example 4]

FIG. 2A shows the main components of the transfer apparatus of the fourth embodiment. This is an example in which the seventh invention of the present invention is used as the basic structure. In addition, in FIGS. 2A to 2C , the laser device, the control device, and other monitors are omitted from the drawings (these are all the same as those in Embodiment 1), and the X-axis, Y-axis, and Z-axis directions are shown in the drawings. In addition, the arrangement on the donor substrate, the acceptor substrate, and the donor substrate of the transfer object used in this Example 4 and the arrangement after transfer to the acceptor substrate are the same as those in Example 2.

The case of the optical system until the pulsed laser is emitted from the excimer laser device and irradiated to the transfer object on the donor substrate is as described below, except that the configuration of each stage group shown in FIG. 1A and FIG. 2A is performed, respectively It is the same as Example 1 except for the part that is caused by the difference. That is, in the case of the transfer apparatus of the sixth invention shown in FIGS. 1A to 1C , the donor stages are sequentially arranged on the stone stage 1 ( G1 ). In contrast to the X axis (Xd) on which the optical table (Xo) is arranged, in the case of the transfer device of the seventh invention shown in FIGS. 2A to 2C , the difference in the construction of these table groups is: Place Xo on G1 and hang Xd below G1.

The outgoing light from the excimer laser enters the telescope optical system and propagates to the shaping optical system in front of it. As shown in FIG. 2A , the above-mentioned shaping optical system is arranged on an optical table (Xo) moving in the X-axis direction so as to be parallel to its optical axis. In addition, Xo is placed on a stone platform 1 (G1) made of granite, and has a rotation adjustment mechanism (RP) therebetween. Here, Xo is at right angles to the Y-axis (Yr) of the acceptor table placed on a stone platform 2 (G2) different from G1, and parallel to the X-axis (Xd) of the donor table. In addition, the laser beam before entering the shaping optical system is adjusted by the telescope optical system to have substantially the same shape (approximately 25×25 [mm] (vertical×horizontal, FWHM)) irrespective of the movement of Xo.

The X-axis (Xd) of the donor table is suspended below G1, and the Y-axis (Yd) of the donor table is also suspended. In addition, there is a rotational adjustment mechanism between them. The case where Xo and Xd move the same distance relative to G1 is shown in a side view in FIG. 2B . Thereby, the position in the X-axis direction with respect to Yd can be changed without changing the relative position on the X-axis of Xo and Xd. In addition, in FIG. 2C, the case where only Xo moves with respect to G1 is shown by the side view. Thereby, the relative positions on the X axis of Xd and Xo can be changed.

The details of the field lens (F), the mask (M) and the projection lens (P1), which are other reduction projection optical systems, are the same as in Example 1. The laser light emitted from the projection lens is incident from the back of the donor substrate, and is The reduced size of 1/5 of the pattern drawn on the mask is accurately projected toward the transfer object formed on the surface (lower surface). In addition, the imaging on the surface of the donor substrate was performed by a confocal beam profiler as in Example 1.

When the transfer object is transferred to the opposite acceptor substrate based on the reticle pattern that is reduced in projection onto the transfer object disposed on the surface of the donor substrate as described above, the donor substrate and the acceptor The manner in which the substrate is scanned and the manner in which the transfer object is transferred to the receiver substrate are the same as those shown in FIGS. 6 , 10 , 11 , and 13A to 13C. The position synchronization accuracy of the movement of the Y-axis (Yd) of the body table is the same as that of FIG. 12 described in the first embodiment.

In addition, the method for adjusting the parallelism of the Y axes and the parallelism of the X axes of the respective stages, and the perpendicularity of the Y axes and the X axes of each stage is the same as that of the third embodiment. That is, using the Y-axis (Yr) of the receiver stage whose straightness has been adjusted as a reference for adjustment, a high-magnification CCD camera fixed on the Z-axis (Zr) of the receiver stage is used to observe the relationship between Yr and the slave stone stage 1 (G1 ). ) The verticality of the X-axis (Xd) of the suspended donor table is adjusted by the rotation adjustment mechanism (RP) between G1 and Xd. In addition, the parallelism of the Y-axis (Yd) and Yr of the donor stage suspended on the adjusted Xd was observed by the same high-magnification CCD camera, and adjusted by the RP between Xd and Yd. Finally, the perpendicularity of the optical stage (Xo) to Yr is observed by a high-magnification CCD moving with Xo, and adjusted by the RP between G1 and Xo.

[Industrial Applicability]

This invention can be utilized as a manufacturing apparatus of a display.

BP: Confocal Beam Profiler

CCD: high magnification camera

D: Donor substrate

F: Field lens

G: Basic Platform

G1: Platform 1

G11: Platform 11

G12: Platform 12

G2‧‧‧Platform 2

H‧‧‧Shaping Optical System

LS‧‧‧Laser

M‧‧‧mask

Pl‧‧‧Projection Lens

R‧‧‧Acceptor substrate

TE‧‧‧ telescope

Xd‧‧‧X axis of the donor table

Xo‧‧‧Optical Stage (X-axis)

Y-axis of Yd‧‧‧donor table

Yl‧‧‧Switchers for projection lenses and cameras

Y-axis of the Yr‧‧‧receptor stage

Zl‧‧‧Z-axis stage for projection lens

Z-axis of Zr‧‧‧acceptor stage

θ d‧‧‧Theta axis of the donor table

θ r‧‧‧Theta axis of the acceptor stage

Claims (17)

A transfer device, which selectively peels off the object by irradiating a pulsed laser from a back surface of a donor substrate to an object located on a surface of the moving donor substrate, and removes the object. The object is transferred to an acceptor substrate that moves relative to the donor substrate, and the transfer device is characterized in that the transfer device includes: a laser device oscillating in pulses; The pulsed laser emitted by the laser device becomes a parallel light; a shaping optical system reshapes a spatial intensity distribution of the pulsed laser passing through the telescope into a uniform distribution; a mask makes the shaping The pulsed laser after shaping by the optical system passes through a prescribed pattern; a field mirror is located between the shaping optical system and the mask; a projection lens passes through the mask of a pattern of the mask. a pulsed laser reduction projection on the surface of the donor substrate; a reticle stage, carrying the field lens and the reticle; an optical stage, carrying the shaping optical system, the reticle stage and the a projection lens; a donor stage for supporting the donor substrate so that a back surface of the donor substrate becomes an incident side of the pulsed laser; an acceptor stage for supporting the acceptor substrate; and A programmable multi-axis control device has a trigger output function and a control function for the pulse laser oscillation, and the receiving stage has a Y axis and a vertical axis when a horizontal plane is used as an XY plane. A Z-axis in the direction and a theta-axis in the XY plane, the donor stage has an X-axis, a Y-axis and a theta-axis, the projection lens is carried together with a Z-axis stage for the projection lens On the optical table, the telescope, the shaping optical system, the field lens, the light shield and the projection lens constitute a reduced projection optical system, and the reduced projection optical system converts the The pattern is reduced and projected on the surface of the donor substrate, the X-axis of the donor stage is set on a first stage, and the Y-axis of the acceptor stage is set on the same surface as the first stage. On a second platform with a different platform, the Y-axis of the donor table is suspended from the X-axis of the donor table. The transfer apparatus of claim 1, wherein the X-axis of the donor table is placed on the first table and the optical table is placed on the X-axis of the donor table . The transfer device according to claim 1, wherein the optical table is placed on the first platform, and the X-axis of the donor table is suspended from the first platform. The transfer apparatus of claim 1, wherein the X-axis of the donor table is mounted on the first table, and the optical table is placed on the first table and the second table The platforms are all different on a third platform. The transfer device according to claim 1, characterized in that between the X-axis of the donor table and the first stage there is a device for finely adjusting a setting angle in an XY plane therebetween. A rotation adjustment mechanism, there is a rotation between the X axis of the donor table and the Y axis of the donor table to finely adjust a setting angle in an XY plane between the two Adjust the organization. The transfer apparatus according to claim 2, wherein between the X-axis of the donor table and the first stage, there is a device for adjusting a setting angle in an XY plane therebetween. A rotation adjustment mechanism for fine adjustment, between the X axis of the donor table and the optical table, there is a rotation adjustment mechanism for fine adjustment of a setting angle in an XY plane between the two , between the X axis of the donor table and the Y axis of the donor table, there is a rotation adjustment mechanism for finely adjusting a setting angle in an XY plane between the two. The transfer apparatus according to claim 3, wherein between the X-axis of the donor table and the first stage, there is a device for adjusting a setting angle in an XY plane therebetween. A rotation adjustment mechanism for fine adjustment, there is a rotation adjustment mechanism between the optical stage and the first stage for fine adjustment of a setting angle in an XY plane between the two, in the supply stage Between the X axis of the donor table and the Y axis of the donor table, there is a rotation adjustment mechanism for finely adjusting a setting angle in an XY plane between the two. The transfer apparatus according to claim 4, wherein between the X-axis of the donor table and the first stage, there is a device for adjusting a setting angle in an XY plane therebetween. A rotation adjustment mechanism for fine adjustment, there is a rotation adjustment mechanism between the optical stage and the third stage for fine adjustment of a setting angle in an XY plane between the two, in the supply Between the X-axis of the body table and the Y-axis of the donor table, there is a rotation adjustment mechanism for finely adjusting a setting angle in an XY plane therebetween. The transfer device according to any one of claims 1 to 8, wherein the laser device is an excimer laser. The transfer device according to claim 9, characterized in that the transfer device includes a pulse shutter, and the pulse shutter cuts off an arbitrary pulse train of laser pulses emitted from the excimer laser. 11. The transfer apparatus of claim 10, wherein said programmable multi-axis control means has at least simultaneous control of said Y-axis of said acceptor table and said Y-axis of said donor table and includes a means for correcting a moving position error using a two-dimensional distribution correction value data pre-produced for correcting a moving position error of the stage. The transfer device of claim 11, wherein: A high-magnification camera monitoring a position of the donor substrate is disposed on the Z-axis of the acceptor stage, or the high-magnification camera monitoring the position of the acceptor substrate is disposed on the donor substrate. The X-axis of the body table or the part that moves with the X-axis of the donor table, or the optical table or the part that moves with the optical table. The transfer apparatus of claim 12, wherein the donor stage and the acceptor stage include a gap sensor, the gap sensor measuring the surface of the donor substrate and the a gap of a surface of the receptor substrate. The transfer apparatus according to claim 13, wherein the Y-axis of the acceptor table and the Y-axis of the donor table respectively include a position measuring device using a laser interferometer. The transfer device according to claim 14, wherein the transfer device comprises a confocal beam profiler, which reduces the pattern of the photomask by using the projection lens. The location where the projected and imaged location is conjugate has a focal plane. A method of using a transfer device, wherein the transfer device is the transfer device according to claim 13, and the gap sensor is used to measure the A curvature of the donor substrate, based on a two-dimensional profile of the curvature obtained by the measurement, using the Z-axis or the projection through the acceptor stage The adjustment of the Z-axis stage of the lens corrects the gap between the donor substrate and the acceptor substrate. A method for adjusting a transfer device, characterized in that the transfer device is the transfer device according to any one of claims 5 to 8, and the method for adjusting the transfer device is in the process of assembling the transfer device A method of adjusting the parallelism of the Y-axis of the acceptor table and the Y-axis of the donor table, and the adjustment method of the transfer device to the Z of the acceptor table The Y-axis of the acceptor stage whose axis and the θ-axis are adjusted together for a straightness is used as a reference, and the following steps are included in sequence: passing between the X-axis of the first stage and the donor stage. The rotation adjustment mechanism between the two adjusts the verticality of the Y-axis of the acceptor table and the X-axis of the donor table; The X-axis of the donor table and the Y-axis of the donor table and the Y-axis of the acceptor table travel synchronously and in parallel by being installed together with the Y-axis of the acceptor table a high-magnification camera on the moving site to observe an alignment mark on the Y-axis of the opposing donor table; and, based on the results of the observation, to pass through the X-axis of the donor table and the rotation adjustment mechanism between the Y-axis of the donor table and the Y-axis of the acceptor table adjusts the parallelism of the Y-axis of the acceptor table and the Y-axis of the donor table.

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