JP2007184328A - Exposure apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an aligner in which productivity can be enhanced and the manufacturing cost of a display, or the like, can be reduced by preventing sublimate of photoresist applied to the surface of a substrate from contaminating a mask or an optical component, and high precision exposure can be achieved by sustaining the mask in flat shape during exposure. <P>SOLUTION: A suction opening 16b for sucking/discharging gas between a mask M and a substrate W is provided wherein the mask M is held by the chuck portion 16 of a mask holding frame 12 by being bent in the direction receding from the substrate W such that it is deformed in substantially flat shape by the pressure difference generated between the substrate W side and the light source side of the mask M when the gas is sucked/discharged. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an exposure apparatus suitable for, for example, proximity exposure transfer of a mask pattern of a mask onto a substrate of a large flat panel display such as a liquid crystal display or a plasma display.

  Conventionally, various exposure apparatuses for producing color filters for flat panel display devices such as liquid crystal display devices and plasma display devices have been devised (see, for example, Patent Document 1 and Patent Document 2). The exposure apparatuses described in Patent Document 1 and Patent Document 2 hold a mask on a mask stage, hold a substrate as a non-exposure material on a work stage, and place both of them facing each other. Then, in this state, the substrate is irradiated with light for pattern exposure from the mask side by irradiation means, and the mask pattern drawn on the mask is exposed and transferred onto the substrate to create a display on one substrate. Yes.

JP-A-1-155354 JP 2000-35676 A

  By the way, in the exposure apparatus, the contamination of each component caused by sublimation generated from the photoresist applied on the surface of the substrate is a problem. For example, if the mask is soiled by sublimation, it becomes necessary to replace it with a new mask for cleaning. Further, when the amount of light of the optical parts of the irradiating means decreases due to contamination by the sublimated material, it becomes necessary to perform wiping and cleaning and to periodically replace the parts. For this reason, productivity is reduced, which hinders the cost of manufacturing a display or the like.

  To solve such a problem, a method of sucking and discharging the sublimate of the photoresist applied to the substrate surface from between the mask and the substrate can be considered. When the sublimate is sucked and discharged and the sublimate is removed, the pressure between the substrate and the mask becomes relatively negative, and the mask is bent toward the substrate due to the pressure difference between the substrate side of the mask and the light source side. In addition, bending due to the weight of the mask is added, and the mask is curved and deformed to the substrate side. For this reason, the gap between the mask and the substrate becomes non-uniform, resulting in a new problem of deteriorating exposure accuracy.

  The present invention has been made in view of the above circumstances, and its object is to prevent the mask and optical components from being stained by the sublimate of the photoresist applied to the surface of the substrate, thereby improving the productivity. An object of the present invention is to provide an exposure apparatus that can reduce the manufacturing cost of a display and the like, and that can maintain a mask at the time of exposure in a flat shape and realize high-precision exposure.

The above object of the present invention is achieved by the following configurations.
(1) A work stage that holds a substrate as an exposure target, a mask stage that is disposed opposite to the substrate and holds a mask, and an irradiation unit that irradiates the substrate with light for pattern exposure through the mask; An exposure apparatus comprising:
An exhaust means for sucking and discharging the gas between the mask and the substrate;
An exposure apparatus characterized in that the mask is held in a mask stage curved in a direction away from the substrate so as to be deformed into a substantially flat shape due to a pressure difference between the front side and the back side of the mask generated when gas is sucked and discharged. .
(2) The exposure apparatus according to (1), wherein the curved shape of the mask held on the mask stage is formed by the shape of the mask itself.
(3) The exposure apparatus according to (1), wherein the curved shape of the mask held on the mask stage is formed by forced deformation of the mask.

  According to the present invention, the exhaust means for sucking and discharging the gas between the mask and the substrate is provided, and the mask is deformed into a substantially flat shape by the pressure difference between the front side and the back side of the mask that is generated when the gas is sucked and discharged. In this way, the substrate is curved in the direction away from the substrate and held on the mask stage, so that the mask and optical components can be prevented from being soiled by the sublimate of the photoresist applied to the surface of the substrate, thereby improving productivity. In addition, the manufacturing cost of the display or the like can be reduced, and the mask at the time of exposure can be maintained in a flat shape to realize high-precision exposure.

  Hereinafter, embodiments of an exposure apparatus according to the present invention will be described in detail with reference to the drawings.

(First embodiment)
First, a first embodiment of a divided sequential exposure apparatus that is an exposure apparatus according to the present invention will be described with reference to FIGS.
FIG. 1 is a partially exploded perspective view for explaining a first embodiment of the division sequential exposure apparatus according to the present invention, FIG. 2 is an enlarged perspective view of the mask stage shown in FIG. 1, and FIG. A sectional view taken along line AA, (b) is a top view of the mask position adjusting means of (a), FIG. 4 is a sectional view for explaining a state in which the mask is held by the chuck portion, and FIG. FIG. 6 is a side view showing the basic structure of the alignment camera and the focus adjustment mechanism of the alignment camera, and FIG. 7 is the irradiation optics of the workpiece side alignment mark. FIG. 8 is a block diagram showing a focus adjustment mechanism for an alignment image, FIG. 9 is a front view of the divided sequential proximity exposure apparatus shown in FIG. 1, and FIG. 10 is a divided sequential proximity exposure shown in FIG. Block showing the electrical configuration of the device FIG, 11 is an explanatory diagram for explaining the matching of the work-side alignment marks and mask side alignment marks.

  As shown in FIG. 1, the division sequential exposure apparatus PE of this embodiment includes a mask stage 1 that holds a mask M, a work stage 2 that holds a glass substrate (material to be exposed) W, and an irradiation means for pattern exposure. And an apparatus base 4 that supports the mask stage 1 and the work stage 2.

  A glass substrate W (hereinafter simply referred to as “substrate W”) is disposed to face the mask M, and a surface (opposite surface of the mask M) for exposing and transferring the mask pattern P drawn on the mask M. A photoresist (photosensitive agent) is applied on the surface to make it translucent.

  For convenience of explanation, the illumination optical system 3 will be described. The illumination optical system 3 is, for example, a high-pressure mercury lamp 31 that is a light source for ultraviolet irradiation, and a concave mirror 32 that collects light emitted from the high-pressure mercury lamp 31. Two types of optical integrators 33 that are switchably arranged in the vicinity of the focal point of the concave mirror 32, plane mirrors 35 and 36, and a spherical mirror 37, and are arranged between the plane mirror 36 and the optical integrator 33 to change the irradiation light path. And an exposure control shutter 34 that controls opening and closing.

  When the exposure control shutter 34 is controlled to be opened at the time of exposure, the light emitted from the high-pressure mercury lamp 31 is held on the mask M held on the mask stage 1 and then on the work stage 2 via the optical path L shown in FIG. Irradiated as parallel light for pattern exposure perpendicular to the surface of the substrate W. As a result, the mask pad P of the mask M is exposed and transferred onto the substrate W.

  Next, the mask stage 1 and the work stage 2 will be described in this order. First, the mask stage 1 includes a mask stage base 10, and the mask stage base 10 is supported on a mask stage column 11 protruding from the apparatus base 4 and is disposed above the work stage 2.

  As shown in FIG. 2, the mask stage base 10 has a substantially rectangular shape and has an opening 10a at the center. A mask holding frame 12 is mounted on the opening 10a so as to be movable in the X and Y directions. ing.

  As shown in FIG. 3A, the mask holding frame 12 has a flange 12 a provided on the outer periphery of the upper end thereof placed on the upper surface in the vicinity of the opening 10 a of the mask stage base 10. It is inserted through a predetermined gap between the inner periphery. Thereby, the mask holding frame 12 can be moved in the X and Y directions by this gap.

  A chuck portion 16 is fixed to the lower surface of the mask holding frame 12 via a spacer 20 and can move in the X and Y directions with respect to the mask stage base 10 together with the mask holding frame 12. The chuck portion 16 is provided with a plurality of suction nozzles 16a for sucking the peripheral portion of the mask M on which the mask pattern P is drawn. As a result, the mask M is detachably held on the chuck portion 16 by a vacuum suction device (not shown) through the suction nozzle 16a.

  Further, as shown in FIGS. 3A and 4, the gas between the mask M and the substrate W is sucked and discharged to the chuck portion 16 at a position outside the mask M held by the chuck portion 16. A suction port (exhaust means) 16b is provided. The suction port 16b sucks the gas between the mask M and the substrate W by operating a suction pump (not shown) during exposure. And the gas attracted | sucked from the suction opening 16b is discharged | emitted outside via piping, such as a tube.

  When the gas is not sucked from the suction port 16b, the mask M is bent in the direction away from the substrate W and held by the chuck portion 16 as shown in FIGS. The curved shape of the mask M is formed by the shape of the mask M itself. Then, as shown in FIG. 5, when the gas between the mask M and the substrate W is sucked from the suction port 16b, a relatively negative pressure is generated between the substrate W and the mask M. Due to the pressure difference from the light source side, the mask M bends toward the substrate W and deforms into a substantially flat shape.

  Thereby, the sublimate of the photoresist applied to the surface of the substrate W can be removed by sucking from the suction port 16b, and the mask M at the time of exposure is maintained in a flat shape. Can be made substantially uniform. The curved shape of the mask M is such that the amount of deflection due to the weight of the mask M when the mask M is held by the chuck portion 16 and the pressure difference between the substrate W side of the mask M and the light source side described above. It is determined in consideration of the amount of deflection to the side.

  Further, in FIG. 2, the mask holding frame 12 is moved on the upper surface of the mask stage base 10 in the XY plane based on a detection result by an alignment camera 15 described later or a measurement result by a laser length measuring device 60 described later. A mask position adjusting means 13 for adjusting the position and posture of the mask M held by the mask holding frame 12 is provided.

  The mask position adjusting means 13 includes an X-axis direction driving device 13x attached to one side of the mask holding frame 12 along the Y-axis direction, and two Y-axes attached to one side of the mask holding frame 12 along the X-axis direction. Direction drive device 13y.

  The X-axis direction drive device 13x includes a drive actuator (for example, an electric actuator) 131 having a rod 131r extending and contracting in the X-axis direction, and a linear guide (linear motion) attached to a side portion of the mask holding frame 12 along the Y-axis direction. Bearing guide) 133. The guide rail 133r of the linear guide 133 extends in the Y-axis direction and is fixed to the mask holding frame 12. The slider 133 s movably attached to the guide rail 133 r is connected to the tip of a rod 131 r fixed to the mask stage base 10 via a pin support mechanism 132.

  On the other hand, the Y-axis direction drive device 13y has the same configuration as the X-axis direction drive device 13x, and includes a drive actuator (for example, an electric actuator) 131 having a rod 131r that expands and contracts in the Y-axis direction, and the mask holding frame 12 A linear guide (linear motion bearing guide) 133 attached to a side portion along the X-axis direction. The guide rail 133r of the linear guide 133 extends in the X-axis direction and is fixed to the mask holding frame 12. A slider 133s attached to the guide rail 133r so as to be movable is connected to the tip of the rod 131r via a pin support mechanism 132. The X-axis direction driving device 13x adjusts the mask holding frame 12 in the X-axis direction. The two Y-axis direction driving devices 13y adjust the mask holding frame 12 in the Y-axis direction and the θ-axis direction (oscillation around the Z-axis). ).

  Further, inside the two sides facing each other in the X-axis direction of the mask holding frame 12, as shown in FIG. 2, a gap sensor 14 as a means for measuring the gap between the opposing surfaces of the mask M and the substrate W; An alignment camera 15 is provided as means for detecting a plane deviation amount between the mask M and the alignment reference. Both the gap sensor 14 and the alignment camera 15 are movable in the X-axis direction via a moving mechanism 19.

  The moving mechanism 19 has a holding frame 191 for holding the gap sensor 14 and the alignment camera 15 extending in the Y-axis direction on the upper surfaces of the two sides facing each other in the X-axis direction of the mask holding frame 12. The end of the holding base 191 that is separated from the Y-axis direction drive device 13 y is supported by a linear guide 192. The linear guide 192 includes a guide rail 192r installed on the mask stage base 10 and extending along the X-axis direction, and a slider (not shown) that moves on the guide rail 192r. The end of the holding frame 191 is fixed.

  Then, the gap sensor 14 and the alignment camera 15 are moved in the X-axis direction via the holding frame 191 by driving the slider by a driving actuator 193 including a motor and a ball screw.

  As shown in FIG. 6, the alignment camera 15 optically detects the mask side alignment mark 101 on the surface of the mask M held on the lower surface of the mask stage 1 from the back side of the mask, and the focus adjustment mechanism 151. As a result, the focus is adjusted by moving toward and away from the mask M.

  The focus adjustment mechanism 151 includes a linear guide 152, a ball screw 153, and a motor 154. The linear guide 152 includes a guide rail 152r and a slider 152s. Of these, the guide rail 152r is attached to the holding frame 191 of the moving mechanism 19 of the mask stage 1 so as to extend in the vertical direction. The alignment camera 15 is fixed to the slider 152s via a table 152t. A nut screwed to the screw shaft of the ball screw 153 is connected to the table 152t, and the screw shaft is rotated by a motor 154.

  In the present embodiment, as shown in FIG. 7, the work side alignment mark 100 is projected from below with a light source 781 and a condenser lens 782 below the work chuck 8 provided on the work stage 2. An optical system 78 is disposed integrally with the Z-axis fine movement stage 24 in accordance with the optical axis of the alignment camera 15. A through hole corresponding to the optical path of the projection optical system 78 is formed in the work stage 2 and the Y-axis feed base 52.

  Furthermore, in this embodiment, as shown in FIG. 8, the best focus of the alignment image that detects the position of the mask M having the mask side alignment mark 101 (mask mark surface Mm) and prevents the alignment camera 15 from being out of focus. An adjustment mechanism 150 is provided. In addition to the alignment camera 15 and the focus adjustment mechanism 151, this best focus adjustment mechanism 150 uses the gap sensor 14 as a focus deviation detection means. That is, the measured value of the mask lower surface position measured by the gap sensor 14 is compared with the focus position preset by the control device 80 to obtain a difference, and the relative focus position change amount from the set focus position is calculated from the difference. The alignment camera 15 is moved by controlling the motor 154 of the focus adjustment mechanism 151 according to the calculated change amount, thereby adjusting the focus of the alignment camera 15.

  By using the best focus adjustment mechanism 150, it is possible to perform high-precision focus adjustment of the alignment image regardless of the plate thickness change of the mask M and the plate thickness variation. That is, when a plurality of types of masks M are exchanged and used, proper focus can always be obtained even if the thicknesses of the individual masks are different. Note that the focus adjustment mechanism 151, the projection optical system 78, the best focus adjustment mechanism 150, and the like not only correspond to the high accuracy of the alignment of the first layer divided pattern, but also the high accuracy of the alignment after the second layer. If the thickness of the mask M is known, the best focus adjustment mechanism 150 may be omitted and the focus adjustment mechanism may be moved according to the thickness.

  Note that masking apertures (shielding plates) 17 that shield both ends of the mask M as necessary are disposed at both ends in the Y-axis direction of the opening 10a of the mask stage base 10 so as to be positioned above the mask M. The masking aperture 17 can be moved in the Y-axis direction by a masking aperture driving device 18 including a motor, a ball screw, and a linear guide so that the shielding areas at both ends of the mask M can be adjusted.

  Next, the work stage 2 is installed on the apparatus base 4, and a Z-axis feed base (gap adjusting means) 2A for adjusting the gap between the opposing surfaces of the mask M and the substrate W to a predetermined amount, and this Z A work stage feed mechanism 2B disposed on the axis feed base 2A and moving the work stage 2 in the XY-axis direction.

  As shown in FIG. 9, the Z-axis feed base 2A includes a Z-axis coarse movement stage 22 supported so as to be coarsely movable in the Z-axis direction by an up-and-down coarse movement device 21 erected on the apparatus base 4. A Z-axis fine movement stage 24 supported on a coarse shaft movement stage 22 via a vertical fine movement device 23 (see FIG. 1). For example, an electric actuator composed of a motor and a ball screw or a pneumatic shilling is used for the vertical movement device 21, and the Z-axis coarse movement stage 22 is moved to a preset position by performing a simple vertical movement. Then, it is moved up and down without measuring the gap between the mask M and the substrate W.

  On the other hand, the vertical fine movement device 23 shown in FIG. 1 includes a movable wedge mechanism formed by combining a motor, a ball screw, and a wedge. In this embodiment, for example, a motor 231 installed on the upper surface of the Z-axis coarse movement stage 22. The screw shaft 232 of the ball screw is driven to rotate, the ball screw nut 233 is formed in a wedge shape, and the inclined surface of the wedge nut 233 projects from the inclined surface of the wedge 241 protruding from the lower surface of the Z-axis fine movement stage 24. Thus, a movable wedge mechanism is configured.

  When the screw shaft 232 of the ball screw is driven to rotate, the wedge-shaped nut 233 is finely moved in the Y-axis direction, and this horizontal fine movement is converted into a highly accurate vertical fine movement by the action of the slopes of both wedges 233 and 241. The

  The vertical fine movement device 23 composed of the movable wedge mechanism includes a total of three units, two on one end side (front side in FIG. 1) in the Y-axis direction and one on the other end side (not shown) of the Z-axis fine movement stage 24. It is installed and each is driven and controlled independently. Accordingly, the vertical fine movement device 23 also has a tilt function. Based on the measurement results of the gaps between the mask M and the substrate W by the three gap sensors 14, the mask M and the substrate W are parallel and predetermined. The height of the Z-axis fine movement stage 24 is finely adjusted so as to face each other through the gap. Note that the vertical coarse motion device 21 and the vertical fine motion device 23 may be provided in the Y-axis feed base 52.

  As shown in FIG. 9, the work stage feed mechanism 2B is a kind of two sets of rolling guides that are spaced apart from each other in the Y-axis direction and extended along the X-axis direction on the upper surface of the Z-axis fine movement stage 24. A linear guide 41, an X-axis feed base 42 attached to a slider 41a of the linear guide 41, and an X-axis feed drive device 43 that moves the X-axis feed base 42 in the X-axis direction. An X-axis feed base 42 is connected to a ball screw nut 433 that is screwed to a ball screw shaft 432 that is rotationally driven by a motor 431 of the shaft feed driving device 43.

  Further, on the upper surface of the X-axis feed base 42, a linear guide 51 which is a kind of two sets of rolling guides that are spaced apart from each other in the X-axis direction and extend along the Y-axis direction, and the linear guide 51, a Y-axis feed base 52 attached to a slider 51a, and a Y-axis feed drive device 53 that moves the Y-axis feed base 52 in the Y-axis direction. A Y-axis feed base 52 is connected to a ball screw nut (not shown) screwed to a ball screw shaft 532 that is rotationally driven. The work stage 2 is attached to the upper surface of the Y-axis feed base 52.

  A laser length measuring device 60 as a moving distance measuring unit that detects the X-axis and Y-axis positions of the work stage 2 is provided on the device base 4. In the work stage 2 configured as described above, due to errors such as the shape of the ball screw and the linear guide itself, and mounting errors thereof, when the work stage 2 is moved, positioning errors, yawing, straightness, etc. Occurrence is inevitable. The laser length measuring device 60 is intended to measure these errors. As shown in FIG. 1, the laser length measuring device 60 includes a pair of Y-axis interferometers 62 and 63 provided at the Y-axis direction end of the work stage 2 so as to face the X-axis direction, and the work stage 2. One X-axis interferometer 64 provided at an end in the X-axis direction, a Y-axis mirror 66 disposed at a position facing the Y-axis interferometers 62 and 63 of the work stage 2, and the X of the work stage 2 And an X-axis mirror 68 disposed at a position facing the axial interferometer 64.

  Thus, by providing two Y-axis interferometers in the Y-axis direction, not only the information on the Y-axis direction position of the work stage 2 but also the yawing error due to the difference between the position data of the Y-axis interferometers 62 and 63. You can also know. The position in the Y-axis direction can be calculated by appropriately correcting both the average value of the two in consideration of the position in the X-axis direction of the work stage 2 and the yawing error.

  Then, when the next divided pattern is connected and exposed following the exposure of the work stage 2 in the XY direction and the Y-axis feed base 52 and the previous divided pattern, each interference is performed at the stage of sending the substrate W to the next area. The detection signals output from the total 62 to 64 are input to the control device 80 as shown in FIG. The control device 80 controls the X-axis feed driving device 43 and the Y-axis feed driving device 53 in order to adjust the amount of movement in the XY direction for the divided exposure based on the detection signal, and also the X-axis interferometer 64. And the detection results of the Y-axis interferometers 62 and 63 are used to calculate a positioning correction amount for joint exposure, and the calculated result is used as the mask position adjustment means 13 (and the vertical fine movement device 23 as required). Output to. As a result, the mask position adjusting means 13 and the like are driven in accordance with the correction amount, and the influence of positioning error, straightness error, yawing and the like caused by the X-axis feed driving device 43 or the Y-axis feed driving device 53 is eliminated.

  Even when there is no error in feeding the work stage 2, if the orientation of the mask pattern P of the mask M is deviated from the feed direction of the work stage 2 in the initial state, the divided sequential exposure is performed on the substrate W. Each pattern to be formed is formed in an inclined state, or the joints of the patterns formed separately on the substrate W by connection exposure are shifted and not aligned.

  Further, as described above, the mask M is sucked and held on the lower surface of the chuck portion 16 via a vacuum suction device. When sucking and holding the mask M, the orientation of the mask pattern P of the mask M and the work stage feed mechanism 2B are used. It is difficult to match the moving direction of the work stage 2 with high accuracy.

  For example, as shown in FIG. 11 (a), when exposure is performed at an angle of θ at the first position, the exposure pattern at the next position is indicated by a two-dot chain line even when there is no feed error. Similarly, it is formed in a tilted state.

  Therefore, in the present embodiment, as shown in FIG. 11, for example, a cross shape (reticle) is formed in at least two places on the upper surface of the work stage 2 (actually, the work chuck 8 installed on the work stage 2). The workpiece-side alignment marks 100 are formed apart from each other in the X-axis direction. On the other hand, on the mask M, a mask measurement alignment mark 101 corresponding to the workpiece side alignment mark 100 is formed. The line connecting the centers of the two alignment marks 100 on the reference side is adjusted in advance so as to coincide with the X-axis direction in the initial state (reference position) and to be orthogonal to the Y-axis direction.

  Then, as shown in FIG. 11B, in the initial state (reference position), the alignment camera 15 detects the amount of misalignment between the alignment marks 100 and 101, and the X-axis direction drive device 13x and the Y-axis direction are detected. By adjusting the position of the mask holding frame 12 by the driving device 13y, the centers of the workpiece side alignment mark 100 and the mask side alignment mark 101 are substantially aligned and aligned in the XY plane.

  Further, the alignment between the workpiece side alignment mark 100 and the mask side alignment mark 101 is configured so as to be easily and accurately performed by the alignment camera 15 which is an alignment mark detection means.

  The control device 80 of the present embodiment controls the opening control of the exposure control shutter 34, the feed control of the work stage 2, the calculation of the correction amount based on the detection values of the laser interferometers 62 to 64, and the drive control of the mask position adjusting means 13. In addition to this, it is incorporated into the divided sequential proximity exposure apparatus, such as calculation of the correction amount at the time of alignment adjustment, drive control of the Z-axis feed base (gap adjustment means) 2A, drive control of the automatic workpiece feeder (not shown), and the like. Most actuators are driven and predetermined arithmetic processing is executed based on sequence control using a microcomputer, a sequencer, or the like.

  In particular, the control device 80 of the present embodiment is configured so that the amount of deflection due to the weight of the mask M when the mask M is held by the chuck portion 16 and the pressure difference between the substrate W side and the light source side of the mask M when the gas is sucked and discharged. The amount of deflection of the mask M toward the substrate W is calculated, and the driving of the suction pump for sucking gas from the suction port 16b is controlled so that the mask M is deformed into a substantially flat shape during exposure.

  Therefore, according to the divided sequential exposure apparatus PE of the present embodiment, the suction port 16b that sucks and discharges the gas between the mask M and the substrate W is provided, and the mask M is the mask M that is generated when the gas is sucked and discharged. Since it is bent in a direction away from the substrate W and held by the chuck portion 16 of the mask holding frame 12 so as to be deformed into a substantially flat shape due to a pressure difference between the substrate W side and the light source side, it is applied to the surface of the substrate W. Since the sublimated material of the photoresist can be removed by suction from the suction port 16b, the mask M and the optical parts of the irradiation means 3 are prevented from being contaminated by the sublimated material of the photoresist coated on the surface of the substrate W. Can do. Thereby, the frequency of maintenance can be reduced, the productivity can be improved, and the manufacturing cost of a display or the like can be reduced. Moreover, since the mask M at the time of exposure can be maintained in a flat shape, the gap between the mask M and the substrate W can be made substantially uniform. Thereby, since the mask M at the time of exposure can be maintained in a flat shape, highly accurate exposure can be realized.

(Second Embodiment)
Next, with reference to FIGS. 12 and 13, a second embodiment of the divided sequential exposure apparatus which is an exposure apparatus according to the present invention will be described. In addition, about the same or equivalent part as 1st Embodiment, the same code | symbol is attached | subjected to drawing, and the description is abbreviate | omitted or simplified.
FIG. 12 is a partially cutaway sectional view of a mask stage of a second embodiment of the division sequential exposure apparatus according to the present invention, and FIG. 13 is a view of a chuck portion showing a modification of the second embodiment of the division sequential exposure apparatus according to the present invention. It is an expanded sectional view.

  In this embodiment, as in the conventional mask, a mask M0 that has a flat shape when it is horizontally arranged in a state where gravity does not act (or in a vertically placed state) is used. Further, as shown in FIG. 12, the chuck 16 of the present embodiment is fixed to two spacers 20A and 20B having a tapered surface on the lower surface. Thereby, the chuck | zipper part 16 has the attachment surface 16c which inclined upward toward inner side from the outer edge part. In other words, in the present embodiment, the chuck portion 16 that has the mounting surface 16c inclined upward from the outer edge to the inside and holds the mask M0 is a flat that maintains the mask M0 during exposure in a flat shape. The state forming means is configured. The inclination angle of the mounting surface 16c with respect to the horizontal direction is determined by the amount of bending due to the weight of the mask M0 when the mask M0 is held by the chuck portion 16, and the substrate W side and the light source side of the mask M0 when the gas is sucked and discharged. It is determined in consideration of the amount of deflection of the mask M0 toward the substrate W due to the pressure difference.

Then, when the mask M0 is held by the chuck portion 16 of the present embodiment, the mask M0 is forcibly curved and deformed in the direction away from the substrate W by the attachment surface 16c (one-dot chain line in FIG. 12). The mask M0 is maintained in a flat shape by the bending and the bending due to the pressure difference between the substrate W side and the light source side of the mask M0 when the gas is sucked and discharged (solid line in FIG. 12).
About another structure and an effect, it is the same as that of 1st Embodiment mentioned above.

  As a modification of the present embodiment, instead of the two spacers 20A and 20B having tapered surfaces, two spacers 20C and 20D as shown in FIG. 13 are provided, and the mounting surface is inclined upward. 16c may be configured. In this case, the spacer 20 </ b> D is composed of a fixed member 81 having an inclined surface and a movable member 82 having an inclined surface that is movable by a feed screw 83, and by moving the movable member 82 relative to the fixed member 81. The mounting surface 16c of the chuck portion 16 is inclined upward from the outer end edge portion toward the inside.

In addition, this invention is not limited to each embodiment mentioned above, A deformation | transformation, improvement, etc. are possible suitably.
For example, in the present embodiment, the mask stage 1 is fixed and attached to the mask stage column 11 of the apparatus base 4 and only the work stage 2 is lifted and lowered by the Z-axis feed base 2A of the gap adjusting means. Without being limited thereto, the mask stage column 11 may be configured by a cylinder so that the mask stage 1 is moved up and down. In this case, the Z-axis coarse movement stage 22 having the vertical coarse movement device can be omitted.

1 is a partially exploded perspective view for explaining a first embodiment of a divided sequential exposure apparatus according to the present invention. FIG. It is an expansion perspective view of the mask stage shown in FIG. (A) is the sectional view on the AA line of FIG. 2, (b) is a top view of the mask position adjustment means of (a). It is sectional drawing for demonstrating the state with which the mask was hold | maintained at the chuck | zipper part. It is sectional drawing which shows the flat shape of a mask when the gas between a mask and a board | substrate is suction-discharged. It is a side view which shows the basic structure of an alignment camera and the focus adjustment mechanism of this alignment camera. It is explanatory drawing for demonstrating the irradiation optical system of the workpiece | work side alignment mark. It is a block diagram which shows the focus adjustment mechanism of an alignment image. It is a front view of the division | segmentation successive proximity exposure apparatus shown in FIG. FIG. 2 is a block diagram showing an electrical configuration of the divided sequential proximity exposure apparatus shown in FIG. 1. It is explanatory drawing for demonstrating the alignment of a workpiece | work side alignment mark and a mask side alignment mark. It is a partially cutaway sectional view of the mask stage of the second embodiment of the divided sequential exposure apparatus according to the present invention. It is an expanded sectional view of the chuck | zipper part which shows the modification of 2nd Embodiment of the division | segmentation sequential exposure apparatus which concerns on this invention.

Explanation of symbols

PE division sequential exposure equipment (exposure equipment)
W Glass substrate (material to be exposed, substrate)
M mask P mask pattern 1 mask stage 2 work stage 2A Z-axis feed base (gap adjusting means)
2B Work stage feed mechanism 3 Illumination optical system (irradiation means)
4 Device base 8 Work chuck 10 Mask stage base 12 Mask holding frame 13 Mask position adjusting means 13x X-axis direction drive device 13y Y-axis direction drive device 14 Gap sensor (focus shift detection means)
15 Alignment camera 16 Chuck part 16a Suction nozzle 16b Suction port (exhaust means)
DESCRIPTION OF SYMBOLS 19 Movement mechanism 21 Vertical coarse movement apparatus 22 Z-axis coarse movement stage 23 Vertical fine movement apparatus 24 Z-axis fine movement stage 60 Laser length measuring apparatus 62, 63 Y-axis interferometer (laser interferometer)
64 X-axis interferometer (laser interferometer)
66 Y-axis mirror 68 X-axis mirror 78 Projection optical system 80 Control device 100 Work side alignment mark 101 Mask side alignment mark 150 Best focus adjustment mechanism 151 Focus adjustment mechanism

Claims (3)

A work stage for holding a substrate as a material to be exposed, a mask stage that is arranged opposite to the substrate and holds a mask, and irradiation means for irradiating the substrate with light for pattern exposure through the mask; An exposure apparatus comprising:
An exhaust means for sucking and discharging the gas between the mask and the substrate;
The mask is held in the mask stage while being curved in a direction away from the substrate so as to be deformed into a substantially flat shape due to a pressure difference between the front side and the back side of the mask generated when the gas is sucked and discharged. A featured exposure apparatus.   2. The exposure apparatus according to claim 1, wherein the curved shape of the mask held on the mask stage is formed by the shape of the mask itself.   2. The exposure apparatus according to claim 1, wherein the curved shape of the mask held on the mask stage is formed by forced deformation of the mask.

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