JP2008026475A - Exposure apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an exposure apparatus that can eliminate distortion in a mask while keeping the mask on a mask stage when stress acts on the mask to induce distortion upon sucking and holding the mask to the mask stage, that increases reproducibility of the shape of the mask kept on the stage and that can carry out exposure transfer with high accuracy. <P>SOLUTION: A mask stage 1 of a division sequential exposure apparatus PE has a pair of chucks 16 disposed corresponding to two sides opposing to each other of a mask M, each chuck having a plurality of box grooves 16b (16b1, 16b2, to 16b10). The plurality of box grooves 16b of each chuck 16 independently can impart sucking force to the mask M. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an exposure apparatus suitable for performing proximity exposure transfer of a mask pattern of a mask onto a substrate of a large flat panel display such as a liquid crystal display or a plasma display by a divided sequential exposure method.

  Conventionally, in an exposure apparatus for manufacturing a color filter of a flat panel display device such as a liquid crystal display device or a plasma display device, a mask smaller than the substrate as an exposed material is used, the mask is held on a mask stage, and the substrate is held on a work stage. And hold them close to each other so as to face each other. In this state, the work stage is moved stepwise with respect to the mask, and the substrate is irradiated with light for pattern exposure from the mask side at each step, whereby a plurality of mask patterns drawn on the mask are exposed and transferred onto the substrate. A plurality of displays and the like are created on a single substrate. Further, the mask is transported to the lower part of the mask stage by the transport device, and the periphery outside the effective exposure area is vacuum-sucked by the holding part formed on the mask stage, and is fixed to the mask stage in a flat state. .

Further, in an exposure apparatus for manufacturing a semiconductor, in order to reduce mask distortion, it has been proposed to control the suction force for holding the mask so as to change for each suction position (see, for example, Patent Document 1).
JP-A-8-55778

  By the way, when the mask is transferred from the transfer device to the mask stage to be sucked and held, stress may be applied to the mask and the mask may be held in a distorted state. When exposure is performed using such a distorted mask, the exposure result may be adversely affected. In addition, if there is distortion in the mask, it may be possible to remove the distortion by releasing the holding of the mask once and then adsorbing it again. It may not be resolved.

  In particular, with the recent increase in size of flat panel display devices, masks for producing color filters have also become larger (for example, 1400 mm × 1200 mm), and distortion during suction holding greatly affects exposure accuracy. The exposure apparatus for manufacturing a semiconductor described in Patent Document 1 reduces the distortion of the mask itself due to the manufacturing, and cannot eliminate the distortion at the time of adsorption as described above.

  The present invention has been made in view of the above circumstances, and its purpose is to hold the mask on the mask stage when the mask is attracted to the mask stage and stress is applied to the mask to cause distortion. An object of the present invention is to provide an exposure apparatus capable of eliminating distortion, improving the reproducibility of a held mask shape, and performing highly accurate exposure transfer.

The above object of the present invention is achieved by the following configurations.
(1) A work stage that holds a substrate as an exposure target, a mask stage that is disposed opposite to the substrate and holds a mask, and an irradiation unit that irradiates the substrate with light for pattern exposure through the mask; An exposure apparatus comprising:
The mask stage includes at least a pair of holding portions that are arranged corresponding to two opposite sides of the mask and each have a plurality of suction grooves,
An exposure apparatus characterized in that a plurality of suction grooves in each holding portion can apply an attractive force to a mask independently of each other.
(2) a work stage that holds a substrate as an exposed material, a mask stage that is arranged opposite to the substrate and holds a mask, and irradiation means that irradiates the substrate with light for pattern exposure through the mask; An exposure apparatus comprising:
The mask stage includes at least first and second holding portions that are arranged corresponding to two opposite sides of the mask and hold the mask,
An exposure apparatus, wherein at least one of the first and second holding portions arranged to face each other is movable in a direction facing each other.

  According to the present invention, the mask stage includes at least a pair of holding portions that are arranged corresponding to the two opposite sides of the mask and each have a plurality of suction grooves, and the plurality of suction grooves in each holding portion include: Since the suction force can be applied to the mask independently of each other, when the mask is attracted and held on the mask stage, when the stress is applied to the mask and the distortion occurs, the mask stage is held and the distortion is eliminated. It is possible to improve the reproducibility of the held mask shape and perform highly accurate exposure transfer.

  The mask stage is disposed corresponding to two opposite sides of the mask and includes at least first and second holding portions for holding the mask, and at least one of the first and second holding portions arranged to face each other. Can move in the opposite direction, so that when the mask is attracted and held on the mask stage, if the mask is stressed and distorted, the mask stage holds the mask and the distortion is eliminated. It is possible to increase the reproducibility of the held mask shape and perform highly accurate exposure transfer.

  Hereinafter, embodiments of the exposure apparatus of the present invention will be described in detail with reference to the accompanying drawings.

(First embodiment)
First, the divided sequential exposure apparatus PE will be described. As shown in FIG. 1, the division sequential exposure apparatus PE of this embodiment includes a mask stage 1 that holds a mask M, a work stage 2 that holds a glass substrate (exposed material) W, and light for pattern exposure. An exposure illumination optical system 3 as irradiation means for irradiating, and an apparatus base 4 for supporting the mask stage 1 and the work stage 2 are provided.

  A glass substrate W (hereinafter simply referred to as “substrate W”) is placed on the mask M so as to be exposed to the surface (opposite surface of the mask M) so that the mask pattern P drawn on the mask M is exposed and transferred. An agent is applied to make it translucent.

  For convenience of explanation, the exposure illumination optical system 3 will be described. The exposure illumination optical system 3 is switchable to, for example, a high-pressure mercury lamp 31 that is a light source for ultraviolet irradiation, a concave mirror 32 that condenses the light emitted from the high-pressure mercury lamp 31, and the vicinity of the focal point of the concave mirror 32. Two types of optical integrators 33 arranged, plane mirrors 35 and 36, and a spherical mirror 37, and an exposure control shutter 34 arranged between the plane mirror 36 and the optical integrator 33 to control opening and closing of the irradiation light path. I have.

  When the exposure control shutter 34 is controlled to be opened during exposure, the light irradiated from the high-pressure mercury lamp 31 passes through the optical path L shown in FIG. 1 and is held on the mask M held on the mask stage 1 and thus on the work stage 2. Irradiated as parallel light for pattern exposure substantially perpendicularly to the surface of the substrate W to be formed. Thereby, the mask pattern P of the mask M is exposed and transferred onto the substrate W.

  Next, the mask stage 1 and the work stage 2 will be described in this order. First, the mask stage 1 is provided with a mask stage base 10, and the mask stage base 10 is disposed above the work stage 2 while being supported by a mask stage column 11 protruding from the apparatus base 4.

  As shown in FIG. 2, the mask stage base 10 has a substantially rectangular shape and has an opening 10a at the center. A mask holding frame 12 is mounted on the opening 10a so as to be movable in the X and Y directions. ing.

  As shown in FIG. 3A, the mask holding frame 12 has a flange 12 a provided on the outer periphery of the upper end thereof placed on the upper surface in the vicinity of the opening 10 a of the mask stage base 10. It is inserted through a predetermined gap between the inner periphery. Thereby, the mask holding frame 12 can be moved in the X and Y directions by this gap.

  As shown in FIGS. 3 and 4, a pair of chuck portions 16 that hold two opposite sides of the mask M are fixed to the lower surface of the mask holding frame 12 via a spacer 20. 12 and the mask stage base 10 can be moved in the X and Y directions. On the lower surface of each chuck portion 16, a plurality (5 in this embodiment) of suction nozzles 16 a (16 a 1 and 16 a 2) for adsorbing two sides facing the X direction of the mask M on which the mask pattern P is drawn. ,... 16a10) are established, and the chuck portion 16 constitutes the holding portion of the present invention. A plurality of box grooves 16b (16b1, 16b2,... 16b10), which are suction grooves respectively surrounding the suction nozzles 16a (16a1, 16a2,... 16a10), are provided on the lower surface of each chuck portion 16 (this embodiment). 5 in each form) are provided. Thus, the suction area on one side where the mask M is sucked is divided into a plurality (five pieces for each chuck portion 16).

  Each suction nozzle 16a (16a1, 16a2,... 16a10) is connected to a vacuum pump 73 via a distributor 71 having a plurality of switching valves 72 (72a, 72b,... 72j) that can be independently operated. Has been. Each switching valve 72 (72a, 72b,... 72j) is switched by the control device 80 so that the flow path is connected to or disconnected from the vacuum pump 73 independently. That is, the control device 80 switches the switching valves 72 (72a, 72b,... 72j) individually or groups the switching valves 72 (72a, 72b,. The vacuum state of the grooves 16b (16b1, 16b2,... 16b10) is controlled. As a result, the mask M is detachably held on the chuck portion 16 on two sides by the vacuum pump 73 via the suction nozzles 16a (16a1, 16a2,... 16a10).

  On the upper surface of the mask stage base 10, in FIG. 2, the mask holding frame 12 is moved in the XY plane based on the detection result by the alignment camera 15 described later or the measurement result by the laser length measuring device 60 described later. Mask position adjusting means 13 for adjusting the position and posture of the mask M held on the mask holding frame 12 is provided.

  The mask position adjusting means 13 includes an X-axis direction driving device 13x attached to one side of the mask holding frame 12 along the Y-axis direction, and two Y-axes attached to one side of the mask holding frame 12 along the X-axis direction. And a direction driving device 13y.

  3A and 3B, the X-axis direction drive device 13x includes a drive actuator (for example, an electric actuator) 131 having a rod 131r that expands and contracts in the X-axis direction, and a mask holding frame 12. And a linear guide (linear motion bearing guide) 133 attached to a side portion along the Y-axis direction. The guide rail 133r of the linear guide 133 extends in the Y-axis direction and is fixed to the mask holding frame 12. A slider 133 s movably attached to the guide rail 133 r is connected to the tip of a rod 131 r fixed to the mask stage base 10 via a pin support mechanism 132.

  On the other hand, the Y-axis direction drive device 13y has the same configuration as the X-axis direction drive device 13x, and includes a drive actuator (for example, an electric actuator) 131 having a rod 131r that expands and contracts in the Y-axis direction, and the mask holding frame 12 And a linear guide (linear motion bearing guide) 133 attached to a side portion along the X-axis direction. The guide rail 133r of the linear guide 133 extends in the X-axis direction and is fixed to the mask holding frame 12. A slider 133s attached to the guide rail 133r so as to be movable is connected to the tip of the rod 131r via a pin support mechanism 132. The X-axis direction driving device 13x adjusts the mask holding frame 12 in the X-axis direction. The two Y-axis direction driving devices 13y adjust the mask holding frame 12 in the Y-axis direction and the θ-axis direction (oscillation around the Z-axis). ).

  Further, inside the two sides facing each other in the X-axis direction of the mask holding frame 12, as shown in FIG. 2, a gap sensor 14 as a means for measuring the gap between the opposing surfaces of the mask M and the substrate W, An alignment camera 15 is provided as means for detecting a plane deviation amount between the mask M and the alignment reference. Both the gap sensor 14 and the alignment camera 15 are movable in the X-axis direction via a moving mechanism 19.

  The moving mechanism 19 has a holding frame 191 for holding the gap sensor 14 and the alignment camera 15 extending in the Y-axis direction on the upper surfaces of the two sides facing each other in the X-axis direction of the mask holding frame 12. The end of the holding base 191 that is separated from the Y-axis direction drive device 13 y is supported by a linear guide 192. The linear guide 192 includes a guide rail 192r that is installed on the mask stage base 10 and extends along the X-axis direction, and a slider (not shown) that moves on the guide rail 192r. The end portion of 191 is fixed.

  Then, the gap sensor 14 and the alignment camera 15 are moved in the X-axis direction via the holding frame 191 by driving the slider by a driving actuator 193 including a motor and a ball screw.

  As shown in FIG. 5, the alignment camera 15 optically detects the mask side alignment mark 101 on the surface of the mask M (mask pattern surface Mm) held on the lower surface of the mask stage 1 from the mask back surface side. Yes, the focus adjustment mechanism 151 moves toward and away from the mask M to perform focus adjustment.

  The focus adjustment mechanism 151 includes a linear guide 152, a ball screw 153, and a motor 154. The linear guide 152 includes a guide rail 152r and a slider 152s. Of these, the guide rail 152r is attached to the holding frame 191 of the moving mechanism 19 of the mask stage 1 so as to extend in the vertical direction. The alignment camera 15 is fixed to the slider 152s via a table 152t. A nut screwed to the screw shaft of the ball screw 153 is connected to the table 152t, and the screw shaft is rotated by a motor 154.

  Further, in this embodiment, as shown in FIG. 6, a projection for projecting the workpiece side alignment mark 100 from below by having a light source 781 and a condenser lens 782 below the work chuck 8 provided on the work stage 2. An optical system 78 is disposed integrally with the Z-axis fine movement stage 24 in accordance with the optical axis of the alignment camera 15. A through hole corresponding to the optical path of the projection optical system 78 is formed in the work stage 2 and the Y-axis feed base 52.

  Furthermore, in this embodiment, as shown in FIG. 7, the best focus of the alignment image that detects the position of the mask M having the mask-side alignment mark 101 (mask pattern surface Mm) and prevents the alignment camera 15 from being out of focus. An adjustment mechanism 150 is provided. In addition to the alignment camera 15 and the focus adjustment mechanism 151, this best focus adjustment mechanism 150 uses the gap sensor 14 as a focus deviation detection means. That is, the measured value of the mask lower surface position measured by the gap sensor 14 is compared with the focus position preset by the control device 80 to obtain a difference, and the relative focus position change amount from the set focus position is calculated from the difference. The alignment camera 15 is moved by controlling the motor 154 of the focus adjustment mechanism 151 according to the calculated change amount, thereby adjusting the focus of the alignment camera 15.

  By using the best focus adjustment mechanism 150, it is possible to perform high-precision focus adjustment of the alignment image regardless of the plate thickness change of the mask M and the plate thickness variation. That is, when a plurality of types of masks M are exchanged and used, proper focus can always be obtained even if the thicknesses of the individual masks are different. Note that the focus adjustment mechanism 151, the projection optical system 78, the best focus adjustment mechanism 150, and the like not only correspond to the high accuracy of the alignment of the first layer divided pattern, but also the high accuracy of the alignment after the second layer. If the thickness of the mask M is known, the best focus adjustment mechanism 150 may be omitted and the focus adjustment mechanism 151 may be moved according to the thickness.

  Note that masking apertures (shielding plates) 17 that shield both ends of the mask M as necessary are disposed at both ends in the Y-axis direction of the opening 10a of the mask stage base 10 so as to be positioned above the mask M. The masking aperture 17 can be moved in the Y-axis direction by a masking aperture driving device 18 including a motor, a ball screw, and a linear guide so that the shielding areas at both ends of the mask M can be adjusted.

  Next, the work stage 2 is installed on the apparatus base 4, and a Z-axis feed base (gap adjusting means) 2A for adjusting the gap between the opposing surfaces of the mask M and the substrate W to a predetermined amount, and this Z A work stage feed mechanism 2B disposed on the axis feed base 2A and moving the work stage 2 in the XY-axis direction is provided.

  As shown in FIG. 8, the Z-axis feed base 2 </ b> A includes a Z-axis coarse movement stage 22 supported so as to be coarsely movable in the Z-axis direction by a vertical coarse movement device 21 erected on the apparatus base 4. A Z-axis fine movement stage 24 supported by a vertical fine movement device 23 is provided on the coarse axis movement stage 22. For example, an electric actuator composed of a motor and a ball screw or a pneumatic shilling is used for the vertical movement device 21, and the Z-axis coarse movement stage 22 is moved to a preset position by performing a simple vertical movement. Then, it is moved up and down without measuring the gap between the mask M and the substrate W.

  On the other hand, the vertical fine movement device 23 shown in FIG. 1 includes a movable wedge mechanism in which a motor, a ball screw, and a wedge are combined. In this embodiment, for example, the motor 231 installed on the upper surface of the Z-axis coarse movement stage 22. The screw shaft 232 of the ball screw is driven to rotate, the ball screw nut 233 is formed in a wedge shape, and the slope of the wedge nut 233 protrudes from the lower surface of the Z-axis fine movement stage 24. Thus, a movable wedge mechanism is configured.

  When the screw shaft 232 of the ball screw is driven to rotate, the wedge-shaped nut 233 is finely moved in the Y-axis direction. The

  The vertical fine movement device 23 composed of the movable wedge mechanism includes a total of three units, two on one end side (front side in FIG. 1) in the Y-axis direction and one on the other end side (not shown) of the Z-axis fine movement stage 24. It is installed and each is driven and controlled independently. Accordingly, the vertical fine movement device 23 also has a tilt function. Based on the measurement results of the gaps between the mask M and the substrate W by the three gap sensors 14, the mask M and the substrate W are parallel and predetermined. The height of the Z-axis fine movement stage 24 is finely adjusted so as to face each other through the gap. Note that the vertical coarse motion device 21 and the vertical fine motion device 23 may be provided in the Y-axis feed base 52.

  As shown in FIG. 8, the work stage feed mechanism 2 </ b> B is a kind of two sets of rolling guides that are spaced apart from each other in the Y-axis direction and extended along the X-axis direction on the upper surface of the Z-axis fine movement stage 24. A linear guide 41, an X-axis feed base 42 attached to a slider 41a of the linear guide 41, and an X-axis feed drive device 43 that moves the X-axis feed base 42 in the X-axis direction. An X-axis feed base 42 is connected to a ball screw nut 433 that is screwed to a ball screw shaft 432 that is rotationally driven by a motor 431 of the shaft feed driving device 43.

  Further, on the upper surface of the X-axis feed base 42, a linear guide 51 which is a kind of two sets of rolling guides that are spaced apart from each other in the X-axis direction and extend along the Y-axis direction, and the linear guide Y-axis feed base 52 attached to 51 slider 51a, and Y-axis feed drive device 53 that moves Y-axis feed base 52 in the Y-axis direction, and is rotated by motor 531 of Y-axis feed drive device 53. A Y-axis feed base 52 is connected to a ball screw nut (not shown) screwed to the ball screw shaft 532 to be driven. The work stage 2 is attached to the upper surface of the Y-axis feed base 52.

  A laser length measuring device 60 as a moving distance measuring unit that detects the X-axis and Y-axis positions of the work stage 2 is provided on the device base 4. In the work stage 2 configured as described above, due to errors such as the shape of the ball screw and the linear guide itself, and mounting errors thereof, when the work stage 2 is moved, positioning errors, yawing, straightness, etc. Occurrence is inevitable. The laser length measuring device 60 is intended to measure these errors.

  As shown in FIG. 1, the laser length measuring device 60 is provided with a pair of Y-axis interferometers 62 and 63 each provided with a laser so as to face the Y-axis direction end of the work stage 2, and One X-axis interferometer 64 provided at the end of the direction and provided with a laser, a Y-axis mirror 66 disposed at a position facing the Y-axis interferometers 62 and 63 of the work stage 2, and the X of the work stage 2 The X-axis mirror 68 is disposed at a position facing the axial interferometer 64.

  As described above, by providing two Y-axis interferometers 62 and 63 in the Y-axis direction, not only information on the position of the work stage 2 in the Y-axis direction but also a difference in position data between the Y-axis interferometers 62 and 63. You can also know yawing error. The position in the Y-axis direction can be calculated by appropriately correcting both the average value of the two in consideration of the position in the X-axis direction of the work stage 2 and the yawing error.

  Then, when the next divided pattern is connected and exposed following the exposure of the work stage 2 in the XY direction and the Y-axis feed base 52 and the previous divided pattern, each interference is performed at the stage of sending the substrate W to the next area. The detection signals output from the total 62 to 64 are input to the control device 80 as shown in FIG. The control device 80 controls the X-axis feed driving device 43 and the Y-axis feed driving device 53 in order to adjust the amount of movement in the XY direction for the divided exposure based on the detection signal, and also the X-axis interferometer 64. And the detection results of the Y-axis interferometers 62 and 63 are used to calculate a positioning correction amount for joint exposure, and the calculated result is used as the mask position adjustment means 13 (and the vertical fine movement device 23 as required). Output to. As a result, the mask position adjusting means 13 and the like are driven in accordance with the correction amount, and the influence of positioning error, straightness error, yawing and the like caused by the X-axis feed driving device 43 or the Y-axis feed driving device 53 is eliminated.

  In addition, the control device 80 controls the switching valve 72 (72a, 72b,... 72j) when it is detected that a predetermined strain or more is generated in the mask held by a strain amount measuring device (not shown) or the like. Then, the suction state of each suction nozzle 16a (16a1, 16a2,... 16a10) is switched so that the distortion correction operation is performed with the mask M held.

  The control device 80 of the present embodiment controls the opening of the exposure control shutter 34, the feed control of the work stage 2, the calculation of the correction amount based on the detection values of the laser interferometers 62 to 64, and the driving of the mask position adjusting means 13. In addition to the control, calculation of the correction amount at the time of alignment adjustment, drive control of the Z-axis feed base (gap adjustment means) 2A, drive control of the automatic workpiece feeder (not shown), etc. are incorporated in the divided sequential proximity exposure apparatus PE. Most of the actuator driving and predetermined calculation processing are executed based on sequence control using a microcomputer, a sequencer or the like.

  Next, the suction holding operation of the mask M to the mask stage 1 by the divided successive proximity exposure apparatus PE of the present embodiment will be described in detail. First, as shown in FIG. 4, the switching valve 72 (72a, 72b,... 72j) is operated to connect all the suction nozzles 16a (16a1, 16a2,... 16a10) to the vacuum pump 73. Thereby, all the box grooves 16b (16b1, 16b2,... 16b10) are in a vacuum state, and the two sides of the mask M are sucked and held by the pair of chuck portions 16 (initial suction).

  When the mask M is sucked and held, this holding state is confirmed by the strain amount detection device. When it is detected that the distortion of the mask M is equal to or greater than a predetermined value, the control device 80 controls the switching valve 72 (72a, 72b,... 72j), and five are provided for one side. Further, the vacuum state of each box groove 16b is sequentially controlled from one end side to the other end side of each chuck portion 16 to partially release the suction of the mask M and further re-suck it.

  Specifically, the switching valves 72b, 72c and 72g, 72h are closed, the remaining switching valves 72a, 72d, 72e and 72f, 72i, 72j are opened, and the mask M is adsorbed by the box grooves 16b2, 16b3 and 16b7, 16b8. Is partially released. Thereby, the distortion of the portion where the suction is released is released. Here, the switching valves 72b and 72g are opened and the mask M is adsorbed again by the box grooves 16b2 and 16b7, and the switching valves 72d and 72i are closed and the adsorption of the mask M by the box grooves 16b4 and 16b9 is partially released. Next, the switching valves 72c and 72h are opened to suck the mask M again by the box grooves 16b3 and 16b8, and the switching valves 72e and 72j are closed to partially release the suction of the mask M by the box grooves 16b5 and 16b10.

  Thereafter, similarly, by sequentially performing the suction release and re-suction of the mask M, the distortion of the mask M generated during the initial suction is sequentially released from one end side to the other end side of the chuck portion 16, and finally The entire surface of the mask M is sucked and held by the chuck portion 16 without any distortion.

  Therefore, according to the divided sequential exposure apparatus PE of the present embodiment, the mask stage 1 is arranged corresponding to the two opposite sides of the mask M, and each of the plurality of box grooves 16b (16b1, 16b2,... 16b10), and a plurality of box grooves 16b in each chuck portion 16 can apply the suction force to the mask M independently of each other, so that the mask M is sucked and held on the mask stage 1. When stress is applied to the mask M and distortion occurs, the distortion can be eliminated while the mask M is held on the mask stage 1. Therefore, the reproducibility of the held mask shape can be improved and high-precision exposure transfer can be performed without being affected by the delivery state of the mask M to the chuck portion 16.

In the above-described embodiment, the suction release and re-suction of the mask M are sequentially performed from one end side to the other end side of the chuck portion 16, but are performed from the center portion of the chuck portion 16 toward both end portions. It may be. Further, the number of box grooves 16 b of each chuck portion 16 is appropriately set according to the size of the mask M.
Furthermore, each chuck | zipper part 16 which is a pair of holding | maintenance part may be another body like this embodiment, and may be formed by the single member surrounding the mask M circumference | surroundings.

(Second Embodiment)
Next, a second embodiment of the exposure apparatus according to the present invention will be described with reference to FIG. Note that portions equivalent to those of the exposure apparatus of the first embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified.

  As shown in FIG. 10, in the divided sequential exposure apparatus of the second embodiment, two pairs of chuck portions facing each other in the X direction and the Y direction so as to hold the four sides of the mask M on the lower surface of the mask holding frame 12. 16 is fixed via a spacer 20, and the chuck portion 16 can move in the X and Y directions with respect to the mask stage base 10 together with the mask holding frame 12. On the lower surface of each chuck portion 16, a plurality (five in each embodiment) of suction nozzles 16 a (5 in this embodiment) for adsorbing the four sides facing the X and Y directions of the mask M on which the mask pattern P is drawn. 16a1, 16a2,... 16a20) are established, and the chuck portion 16 constitutes the holding portion of the present invention. A plurality of box grooves 16b (16b1, 16b2,... 16b20), which are suction grooves respectively surrounding the suction nozzles 16a (16a1, 16a2,... 16a20), are provided on the lower surface of each chuck portion 16 (this embodiment). 5 in the form) are provided independently of each other.

  Each suction nozzle 16a (16a1, 16a2,... 16a20) is connected to the vacuum pump 73 via a distributor 71 having a plurality of switching valves 72 (72a, 72b,... 72t) that can be independently operated. Has been. Each switching valve 72 (72a, 72b,... 72t) is switched by the control device 80 so that the flow path is connected to or disconnected from the vacuum pump 73 independently. That is, the control device 80 controls the switching valves 72 (72a, 72b,... 72t) individually or by switching the switching valves 72 (72a, 72b,... 72t) in groups. Thereby, the mask M is detachably held on the chuck part 16 by the vacuum pump 73 via the suction nozzles 16a (16a1, 16a2,... 16a20).

  In order to suck and hold the mask M on the mask stage 1 of the present embodiment, first, as shown in FIG. 10, the switching valves 72 (72a, 72b,... 72t) are operated, and all the suction nozzles 16a (16a1) are operated. , 16a2,... 16a20) are connected to the vacuum pump 73, and all the box grooves 16b (16b1, 16b2,... 16b20) are evacuated to initially adsorb the four sides of the mask M to the chuck portion 16.

  Next, when it is detected that the distortion of the sucked and held mask M is greater than or equal to a predetermined value, the selector valve 72 (72k, 72l,... 72t) is closed and each box arranged in the X direction is closed. The suction by the grooves 16b (16b11, 16b12,... 16b20) is released, and the switching valves 72 (72a, 72b,... 72j) are controlled, and the box grooves 16b (16b1, 16b2) arranged in the Y direction are controlled. ,..., 16b10) are sequentially controlled from one end side to the other end side of the chuck portion 16 in the same manner as in the first embodiment, so that the suction of the mask M is partially released and further re-sucked. Thus, distortion in the Y direction of the mask M is released.

  Next, from the state where the mask M is again adsorbed on the four sides, the switching valve 72 (72a, 72b,... 72j) is closed and the box grooves 16b (16b1, 16b2,...) Arranged in the Y direction are closed. 16b10) is released, the switching valve 72 (72k, 72l,... 72t) is controlled, and the vacuum state of each box groove 16b (16b11, 16b12,. Similarly to the embodiment, the chuck unit 16 is sequentially controlled from one end side to the other end side to partially cancel the suction of the mask M, and further re-suck to release the distortion of the mask M in the X direction.

  Thereby, the distortion of the mask M generated at the time of the initial suction is sucked and held on the chuck part 16 on four sides while the mask M is held on the chuck part 16 and the entire surface of the mask M is not distorted.

Therefore, according to the divided sequential exposure apparatus PE of this embodiment, the mask M can be held more safely by sucking the four sides of the mask M, and the mask M is sucked to the mask stage 1 by the four sides. When the mask M is subjected to stress when it is held and distorted, the distortion can be eliminated in a state where the mask M is held on the mask stage 1. Therefore, the reproducibility of the held mask shape can be improved and high-precision exposure transfer can be performed without being affected by the delivery state of the mask M to the chuck portion 16.
Other configurations and operations are the same as those in the first embodiment.

(Third embodiment)
Next, a third embodiment of the exposure apparatus according to the present invention will be described with reference to FIGS. Note that portions equivalent to those of the exposure apparatus of the first embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified. Moreover, since the structure between the suction nozzle 16a and the vacuum pump 73 is the same as that of the said embodiment, illustration is abbreviate | omitted.

  As shown in FIGS. 11 and 12, in the divided sequential exposure apparatus PE of the third embodiment, the lower surface of the mask holding frame 12 is a first and second holding unit that holds two opposite sides of the mask M. First and second chuck portions 16L and 16R are provided. The first chuck portion 16L is fixed to the mask holding frame 12 via the spacer 20, and the second chuck portion 16R is fitted to the guide rails 81a of the pair of guide members 81 fixed to the mask holding frame 12. And is slidably supported. Further, an actuator 82 is disposed between the second chuck portion 16R and the mask holding frame 12, and the second chuck portion 16R can be moved in a direction facing the first chuck portion 16L.

  On the lower surfaces of the first and second chuck portions 16L and 16R, a plurality of suction nozzles 16a for adsorbing two sides facing the X direction of the mask M on which the mask pattern P is drawn are opened. A plurality of box grooves 16b, which are suction grooves surrounding the suction nozzle 16a, are provided.

  In the mask stage 1 configured as described above, when the two sides of the mask M are attracted and held by the first and second chuck portions 16L and 16R, stress acts on the mask M as shown in FIG. In some cases, the mask M is fixed in a state where distortion is generated. In the present embodiment, when the distortion of the mask M is confirmed by a distortion amount detection device (not shown) or the like, the control device 80 drives the actuator 82 to separate the second chuck portion 16R from the first chuck portion 16L. , The stress acting on the mask M is eliminated, and the distortion of the mask M is removed (see FIG. 13B).

  Therefore, according to the divided sequential exposure apparatus PE of the present embodiment, the mask stage 1 is arranged corresponding to two opposite sides of the mask M, and the first and second chuck parts 16L that hold the mask M, 16R, and the second chuck portion 16R is movable in directions opposite to each other. Therefore, when the mask M is attracted and held on the mask stage 1, when the mask M is subjected to stress and distortion occurs, the mask stage 1 Thus, the distortion can be eliminated while the mask M is held on the mask, the reproducibility of the held mask shape can be improved, and high-precision exposure transfer can be performed.

  In the present embodiment, only the second chuck portion 16R is movable among the first and second chuck portions 16 arranged to face each other, but both the chuck portions 16L and 16R may be movable.

(Fourth embodiment)
Next, a fourth embodiment of the exposure apparatus according to the present invention will be described with reference to FIG. Note that portions equivalent to those of the exposure apparatus of the third embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified.

  In the divided sequential exposure apparatus PE of the present embodiment, the mask stage 1 holds and holds the four sides of the mask M. That is, as shown in FIG. 14, in addition to the first and second chuck portions 16L and 16R of the third embodiment, the mask stage 1 includes the first and second chuck portions 16L in a direction opposite to the Y direction in the drawing. , 16R are provided with third and fourth chuck portions 16D, 16U having the same configuration.

  As a result, when the suctioned mask M is distorted, first, the switching valve 72 connected to the suction nozzles 16a of the third and fourth chuck portions 16D and 16U is closed, and the third and fourth The chucking by the box grooves 16b of the chuck portions 16D and 16U is released, and the mask M is temporarily brought into a two-side support state. In this state, when the control device 80 drives the actuator 82 of the second chuck portion 16R, the second chuck portion 16R is moved away from the first chuck portion 16L so as to remove distortion.

  Next, the switching valve 72 connected to the suction nozzles 16a of the third and fourth chuck portions 16D and 16U is opened, and the switching valve connected to the suction nozzles 16a of the first and second chuck portions 16L and 16R. 72 is closed, and similarly, the mask M is in a state of supporting two sides. Then, by driving the actuator 82 connected to the fourth chuck portion, the fourth chuck portion 16U moves in a direction away from the third chuck portion 16D, and the distortion of the mask M is completely removed. Thereafter, by opening the switching valve 72 connected to the suction nozzles 16a of the first and second chuck portions 16L and 16R, the mask M is supported on four sides without any distortion.

Therefore, according to the divided sequential exposure apparatus PE of this embodiment, the mask M can be held more safely by sucking the four sides of the mask M, and the mask M is sucked to the mask stage 1 by the four sides. When the mask M is subjected to stress when it is held and distorted, the distortion can be eliminated in a state where the mask M is held on the mask stage 1. Therefore, the reproducibility of the held mask shape can be improved and high-precision exposure transfer can be performed without being affected by the delivery state of the mask M to the chuck portion 16.
Other configurations and operations are the same as those of the third embodiment.

  In addition, this invention is not limited to embodiment mentioned above at all, In the range which does not deviate from the summary, it can implement with a various form.

  The order of suction and release by the suction groove of the present invention is not limited to the above embodiment, and can be arbitrarily set by the control device 80 as long as the distortion is removed without dropping the mask M. .

1 is a partially exploded perspective view of a divided sequential proximity exposure apparatus according to a first embodiment of the present invention. It is an expansion perspective view of a mask stage part. (A) is the III-III sectional view taken on the line of FIG. 2, (b) is a top view of the mask position adjustment means of (a). FIG. 3 is a bottom view of the mask stage shown in FIG. 2. It is explanatory drawing for demonstrating the irradiation optical system of the workpiece | work side alignment mark. It is a block diagram which shows the focus adjustment mechanism of an alignment image. It is a side view which shows the basic structure of an alignment camera and the focus adjustment mechanism of this alignment camera. It is a front view of the division | segmentation successive proximity exposure apparatus shown in FIG. FIG. 2 is a block diagram showing an electrical configuration of the divided sequential proximity exposure apparatus shown in FIG. 1. It is a bottom view of the mask stage of the exposure apparatus of 2nd Embodiment. It is a bottom view of the mask stage of the exposure apparatus of 3rd Embodiment. It is the XII-XII sectional view taken on the line of FIG. 11 which shows a mask stage. FIG. 13 is a cross-sectional view taken along the line XIII-XIII of FIG. 11 showing a state in which the mask distortion is corrected. It is a bottom view of the mask stage of the exposure apparatus of 4th Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Mask stage 2 Work stage 3 Exposure illumination optical system (irradiation means)
16 Chuck part (holding part)
16b Box groove (suction groove)
16L first chuck part (first holding part)
16R Second chuck part (second holding part)
M Mask PE Exposure device W Substrate (material to be exposed)

Claims (2)

A work stage for holding a substrate as a material to be exposed, a mask stage that is arranged opposite to the substrate and holds a mask, and irradiation means for irradiating the substrate with light for pattern exposure through the mask; An exposure apparatus comprising:
The mask stage includes at least a pair of holding portions that are arranged corresponding to two opposite sides of the mask and each have a plurality of suction grooves,
The exposure apparatus according to claim 1, wherein the plurality of suction grooves in each of the holding portions can apply an attracting force to the mask independently of each other. A work stage for holding a substrate as a material to be exposed, a mask stage that is arranged opposite to the substrate and holds a mask, and irradiation means for irradiating the substrate with light for pattern exposure through the mask; An exposure apparatus comprising:
The mask stage includes at least first and second holding portions that are arranged corresponding to two opposite sides of the mask and hold the mask;
An exposure apparatus, wherein at least one of the first and second holding portions arranged to face each other is movable in a direction facing each other.

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