TWI767481B - 光敏樹脂組成物以及使用其的乾膜式光阻、光敏元件、電路板與顯示裝置 - Google Patents
光敏樹脂組成物以及使用其的乾膜式光阻、光敏元件、電路板與顯示裝置 Download PDFInfo
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- TWI767481B TWI767481B TW109146583A TW109146583A TWI767481B TW I767481 B TWI767481 B TW I767481B TW 109146583 A TW109146583 A TW 109146583A TW 109146583 A TW109146583 A TW 109146583A TW I767481 B TWI767481 B TW I767481B
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- photosensitive resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F212/06—Hydrocarbons
- C08F212/08—Styrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/04—Acids; Metal salts or ammonium salts thereof
- C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/34—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate
- C08F220/36—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate containing oxygen in addition to the carboxy oxygen, e.g. 2-N-morpholinoethyl (meth)acrylate or 2-isocyanatoethyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
- C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
- C08F265/06—Polymerisation of acrylate or methacrylate esters on to polymers thereof
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20190179685 | 2019-12-31 | ||
KR10-2019-0179686 | 2019-12-31 | ||
KR10-2019-0179685 | 2019-12-31 | ||
KR20190179686 | 2019-12-31 | ||
KR10-2020-0098836 | 2020-08-06 | ||
KR10-2020-0098835 | 2020-08-06 | ||
KR1020200098836A KR102242552B1 (ko) | 2019-12-31 | 2020-08-06 | 감광성 수지 조성물 및 이를 이용한 드라이 필름 포토레지스트, 감광성 엘리먼트, 회로기판, 및 디스플레이 장치 |
KR1020200098835A KR102242551B1 (ko) | 2019-12-31 | 2020-08-06 | 감광성 수지 조성물 및 이를 이용한 드라이 필름 포토레지스트, 감광성 엘리먼트, 회로기판, 및 디스플레이 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202132360A TW202132360A (zh) | 2021-09-01 |
TWI767481B true TWI767481B (zh) | 2022-06-11 |
Family
ID=76686969
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109146583A TWI767481B (zh) | 2019-12-31 | 2020-12-29 | 光敏樹脂組成物以及使用其的乾膜式光阻、光敏元件、電路板與顯示裝置 |
Country Status (4)
Country | Link |
---|---|
JP (2) | JP7376723B2 (ja) |
CN (1) | CN114787711A (ja) |
TW (1) | TWI767481B (ja) |
WO (1) | WO2021137545A1 (ja) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11316456A (ja) * | 1998-02-17 | 1999-11-16 | Toppan Printing Co Ltd | 無溶剤型感光性焼成ペ―スト組成物及び溶剤型感光性焼成ペ―スト組成物および構造体 |
JP2017167394A (ja) * | 2016-03-17 | 2017-09-21 | 日立化成株式会社 | 感光性樹脂組成物、感光性エレメント、レジストパターン付き基板の製造方法、及びプリント配線板の製造方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4428399B2 (ja) * | 2001-03-29 | 2010-03-10 | 日立化成工業株式会社 | プリント配線板の製造に用いる感光性樹脂組成物 |
JP2004004546A (ja) * | 2003-02-03 | 2004-01-08 | Hitachi Chem Co Ltd | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法 |
KR20050106645A (ko) * | 2004-05-06 | 2005-11-11 | 주식회사 코오롱 | 감광성 수지조성물 |
JP2006227206A (ja) * | 2005-02-16 | 2006-08-31 | Hitachi Chem Co Ltd | 感光性エレメント、これを用いたレジストパターンの形成方法及びプリント配線板の製造方法 |
JP2007286477A (ja) * | 2006-04-19 | 2007-11-01 | Hitachi Chem Co Ltd | 感光性樹脂組成物、これを用いた感光性エレメント及びプリント配線板の製造方法 |
JP2008164886A (ja) * | 2006-12-28 | 2008-07-17 | Sumitomo Chemical Co Ltd | 着色感光性樹脂組成物 |
JP5151446B2 (ja) * | 2007-07-18 | 2013-02-27 | 日立化成工業株式会社 | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
JP2009198685A (ja) * | 2008-02-20 | 2009-09-03 | Fujifilm Corp | 感光性組成物、及び感光性フィルム |
JP2013037272A (ja) * | 2011-08-10 | 2013-02-21 | Mitsubishi Paper Mills Ltd | 感光性樹脂組成物及び感光性フィルム |
CN105393171B (zh) * | 2013-07-23 | 2019-11-26 | 日立化成株式会社 | 投影曝光用感光性树脂组合物、感光性元件、抗蚀图案的形成方法、印刷配线板的制造方法和引线框的制造方法 |
TWI633388B (zh) * | 2013-11-29 | 2018-08-21 | 旭化成電子材料股份有限公司 | Photosensitive resin element |
KR20160131084A (ko) * | 2014-05-21 | 2016-11-15 | 아사히 가세이 가부시키가이샤 | 감광성 수지 조성물 및 회로 패턴의 형성 방법 |
-
2020
- 2020-12-28 JP JP2022538429A patent/JP7376723B2/ja active Active
- 2020-12-28 CN CN202080082461.1A patent/CN114787711A/zh active Pending
- 2020-12-28 WO PCT/KR2020/019181 patent/WO2021137545A1/ko active Application Filing
- 2020-12-29 TW TW109146583A patent/TWI767481B/zh active
-
2023
- 2023-08-10 JP JP2023131457A patent/JP2023159231A/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11316456A (ja) * | 1998-02-17 | 1999-11-16 | Toppan Printing Co Ltd | 無溶剤型感光性焼成ペ―スト組成物及び溶剤型感光性焼成ペ―スト組成物および構造体 |
JP2017167394A (ja) * | 2016-03-17 | 2017-09-21 | 日立化成株式会社 | 感光性樹脂組成物、感光性エレメント、レジストパターン付き基板の製造方法、及びプリント配線板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW202132360A (zh) | 2021-09-01 |
WO2021137545A1 (ko) | 2021-07-08 |
JP2023159231A (ja) | 2023-10-31 |
CN114787711A (zh) | 2022-07-22 |
JP7376723B2 (ja) | 2023-11-08 |
JP2023509860A (ja) | 2023-03-10 |
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