TWI763425B - 在由半導體材料製成的基板晶圓上沉積磊晶層的方法和設備 - Google Patents

在由半導體材料製成的基板晶圓上沉積磊晶層的方法和設備 Download PDF

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TWI763425B
TWI763425B TW110113361A TW110113361A TWI763425B TW I763425 B TWI763425 B TW I763425B TW 110113361 A TW110113361 A TW 110113361A TW 110113361 A TW110113361 A TW 110113361A TW I763425 B TWI763425 B TW I763425B
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湯瑪斯 史坦特納
沃特 愛德邁爾
寇賓南 林雀坦納爵
漢納斯 黑雀特
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德商世創電子材料公司
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Abstract

一種在由半導體材料製成的基板晶圓上沉積磊晶層的方法和設備。所述方法包含:將基板晶圓和基座佈置在沉積裝置中,使得基板晶圓放置在基座上,且該基座係由支撐軸的臂固持;監測基座位置相對於環繞該基座的預熱環之位置是否存在偏移;監測支撐軸位置相對於預熱環之位置是否存在偏移;如果存在所述偏移中的至少一種,則消除相應的偏移;以及,在基板晶圓上沉積磊晶層。

Description

在由半導體材料製成的基板晶圓上沉積磊晶層的方法和設備
本發明係關於在由半導體材料製成的基板晶圓上沉積磊晶層的方法以及用於實施該方法的設備。
具有磊晶層的半導體晶圓是這種方法的產物,且在電子產業中之特別苛刻的應用中需要具有磊晶層的半導體晶圓。因此,對於磊晶層厚度均勻性和磊晶層中摻雜劑分佈均勻性的要求是特別具有挑戰性的。因此,有強烈的動機來創造生產條件,以允許以高產率生產具有滿足嚴格要求之具有磊晶層的半導體晶圓。
在半導體晶圓基板上沉積磊晶層通常在可容納基板晶圓的沉積裝置中使用CVD(化學氣相沉積)來進行。在磊晶層的沉積期間,基板晶圓位於基座上,該基座係由支撐軸的支撐臂固持並藉由該支撐軸來旋轉,其中沉積氣體被引導到基板晶圓之自由的上表面上方,即正面上方。沉積裝置通常還具有預熱環,該預熱環係佈置在基座周圍並由間隙隔開。上部及下部圓頂界定一反應室,在該反應室內將磊晶層沉積在基板晶圓上。來自多組燈發出的輻射照射透過圓頂,以提供必要的沉積溫度。具有這些特性的沉積裝置可商購獲得。另外,可提供將基板晶圓裝載到沉積裝置中並放置在該處的基座上,或者將上方放置有基板晶圓的基座裝載到沉積裝置中,如同例如US2018 0 282 900 A1中所述。
長久以來已知,基板晶圓相對於基座位置的偏移(misalignment)可能對產率產生不利影響。通常,基板晶圓應放置在基座的中心,以使基板晶圓和基座的圓周線形成同心圓。
JP2017-69 414 A描述如何透過照相機系統監測基板晶圓在基座上的位置,且如果需要的話,水平移動基座支撐軸以使基板晶圓在基座上居中。
US2009 0 314 205 A1係關於觀察系統的細節,該觀察系統除其他功能之外尤其還可監控預熱環的位置。
US2016 0 125 589 A1描述一種可用於檢測偏移的方法。
本發明發明人已發現,由於顆粒的存在,由於磊晶層的厚度不均勻以及由於在磊晶層中摻雜劑分佈不均勻而導致的產率損失,這不能歸因於基板晶圓位置相對於基座位置的偏移。
本發明之目的是指出這種產率損失的原因,並說明如何補救它們。
本發明之目的係藉由一種在半導體材料的基板晶圓上沉積磊晶層的方法來實現,該方法包含:將基板和基座佈置在沉積裝置中,使得基板晶圓放置在基座上,且該基座係由支撐軸的臂固持;監測基座位置相對於環繞該基座的預熱環之位置是否存在偏移;監測支撐軸位置相對於預熱環之位置是否存在偏移;如果存在該等偏移的至少一種,則消除相應的偏移;以及在基板晶圓上沉積磊晶層。
本發明之目的還藉由一種用於在由半導體材料製成的基板晶圓上沉積磊晶層的設備來實現,該設備包含:基座;預熱環;具有基座支撐臂的支撐軸;照相機系統,該照相機系統用於監測基座與預熱環之間的間隙區段的寬度,以及監測照相機系統與基座之間的距離;影像處理裝置,該影像處理裝置用於確定基座位置相對於預熱環之位置是否存在偏移及/或支撐軸其位置相對於預熱環的位置是否存在偏移;用於移動和傾斜基座支撐軸的驅動裝置;以及在發生偏移時用於產生信號的控制裝置,其中該信號使該驅動裝置以校正存在的偏移之方式移動。
本發明人已發現,所提到的產率損失可歸因於基座的位置及/或其支撐軸的位置相對於預熱環的位置存在偏移。在預熱環與基座之間通常設置有間隙,該間隙沿著預熱環的內周具有相同的寬度。預熱環和基座係彼此同心地佈置,且基座係水平地佈置。支撐軸係沿著穿過預熱環中心的垂直軸而對準。
因此,如果基座相對於預熱環係偏離中心地放置於支撐軸的支撐臂上,或者基座傾斜偏離支撐軸支撐臂上的水平面,則存在基座偏移。如果支撐軸是垂直的,但未沿著穿過預熱環中心的垂直軸而對準,或者因為支撐軸傾斜偏離穿過預熱環中心的垂直軸,則表示支撐軸相對於預熱環的位置存在偏移。
如果基座接觸預熱環,則產生作為雜質的顆粒,使所得的具有磊晶層的半導體晶圓無法用於預期目的。如果由於上述偏移之一而使預熱環與基座之間的間隙之寬度沿著預熱環的內周發生變化,則也可能導致產率的損失。然後,製程氣體有可能因沿著基座下部引導的吹掃氣體(purge gas)而在間隙的不同點處稀釋到不同程度,從而導致磊晶層的厚度和摻雜劑在磊晶層中的分佈可能沿著基板晶圓的圓周方向發生變化。
上述偏移可能在沉積裝置的冷狀態下已經存在;或者可能僅在將沉積裝置加熱到操作溫度的過程中發生,且在冷卻到冷狀態的過程中(例如當冷卻到室溫時)可能再次消失。
因此,建議監測是否存在至少一種偏移,並在必要時校正偏移。為此目的,原則上,可將沉積裝置冷卻到環境溫度並且消除相應的偏移。
在可能的情況下,較佳在關閉沉積裝置的情況下移動支撐軸來進行此操作。在其他情況下,打開沉積裝置並修正偏移的起因。如果,例如,基座偏移是因為基座水平放置在支撐軸的支撐臂上,但相對於預熱環偏離中心;或者因為基座與預熱環同心地位於支撐軸的支撐臂上,但傾斜偏離水平位置,則打開沉積裝置,將基座升高並如預期放置在支撐軸的支撐臂上。
在可藉由移動支撐軸來校正偏移的情況下,沉積裝置保持關閉,且不需要將沉積裝置冷卻至環境溫度。如果沉積裝置的反應室已經處於熱狀態,這種情況是至少在450℃或更高的溫度下,則當發生支撐軸偏移時,該偏移較佳係在不將沉積裝置冷卻至低於特定之450℃溫度的情況下,特別佳在不降低沉積裝置中所達之溫度的情況下進行校正。如果偏移的原因是因支撐軸是垂直的,但沒有沿著穿過預熱環中心的垂直軸而對準;或者是因為支撐軸傾斜偏離穿過預熱環中心的垂直軸,則可藉由移動支撐軸來校正支撐軸的偏移。
基座和支撐軸的位置相對於預熱環的位置的佈置是透過照相機系統觀察的,該照相機系統捕獲徑向延伸的圖像片段,較佳在包圍基板晶圓的圓周之區段及預熱環的內圓周之區段的至少一個區域上徑向延伸的圖像片段。該圖像片段還包括基座與預熱環之間的間隙區段。照相機系統記錄的圖像片段具有較佳不小於12o 的方位角寬度。由影像處理裝置根據特徵的對比差異,以及照相機系統較佳與基座之上表面之間的距離或該距離的變化,來識別各區段的位置。在適當的情況下,例如,可提供包含一個或多個LED燈的照明系統,以在沉積裝置處於冷狀態時照亮反應室。在支撐軸旋轉期間,以固定的間隔記錄並評估圖像片段。根據所述位置相對於彼此隨時間的變化以及根據所述距離隨時間的波動,影像處理裝置確定是否存在上述基座及/或支撐軸的偏移。基於所確定的結果,控制裝置產生控制信號,以使用於移動和傾斜支撐軸的驅動裝置開始運轉,目的是藉由移動支撐軸來消除存在的偏移。
例如,影像處理裝置可使用US2016 0 125 589 A1中描述的演算法,或者較佳執行使用Sobel運算元進行邊緣檢測的影像處理。
照相機系統包含至少一個照相機,或較佳至少二個照相機,該二個照相機記錄彼此間具有90o 之方位角距離的二個圖像片段。有利的是,儲存藉由影像處理裝置評估的資料以用於比較目的,這些資料是在沉積裝置處於冷狀態且不存在上述偏移的情況下所獲得的。特別地,有利的是,當支撐軸和基座係如預期佈置時,針對基座與預熱環之間的間隙寬度而對相應的圖像片段進行評估,並存儲該間隙的寬度。
沉積裝置的下部圓頂與驅動裝置較佳係經由波紋管(bellows)連接,使得支撐軸相對於固定的下部圓頂的移動及/或傾斜運動可以在必要時開始,而環境大氣不會到達支撐軸。
為了消減(dampen)振動,較佳將支撐臂的上端連接到所謂「基環」的外部,並將該支撐臂的下端安裝在用於移動和傾斜支撐軸的驅動裝置上,其中該基環使上部與下部圓頂保持分開。
用於移動和傾斜基座之支撐軸的驅動裝置包含至少必要數量的致動器,以使得能夠在x方向和y方向上使支撐軸移動並使支撐軸圍繞著平行於x方向的旋轉軸和平行於y方向的旋轉軸傾斜。因此,提供例如四個致動器,各個致動器引起該等運動中的一個。致動器較佳是壓電致動元件。
如果在沉積裝置處於加熱狀態時發生偏移,則藉由移動支撐軸來校正上述偏移,較佳還在沉積裝置被加熱及關閉時進行。
如果支撐軸實際上如預期地垂直對準,但未沿著穿過預熱環中心的垂直軸對準;且如果基座如預期地放置在支撐臂上,則當基座圍繞支撐軸旋轉時將觀察到,照相機系統的圖像片段中的間隙寬度不同於所預期之儲存的寬度,或者,如果照相機系統包含以90o 之方位角距離排列的二個照相機,則觀察到的間隙寬度是不同的。在這種情況下,支撐軸位置相對於預熱環之位置存在偏移。該偏移係藉由將支撐軸水平移動到沿著穿過預熱環中心的垂直軸位置來進行校正。
如果支撐軸如預期地沿著穿過預熱環中心的垂直軸而對準,且基座確實相對於預熱環的位置同心放置,但傾斜偏離支撐臂上的水平面,則在基座圍繞支撐軸旋轉的期間,將觀察到,在照相機的圖像片段中,照相機系統與基座的距離在觀察過程中呈正弦變化。基座的這種偏移係藉由將基座恢復到預期位置來校正。
如果基座實際上如預期地放置在支撐臂上,但是支撐軸傾斜偏離沿著穿過預熱環中心的垂直軸的所預期之對準,則支撐軸位置相對於預熱環之位置也存在偏移。在這種情況下,發現觀察到的基座與預熱環之間的間隙寬度不同於在將支撐軸與基座如預期放置時所觀察到及儲存的間隙寬度。支撐軸的這種偏移係藉由使支撐軸傾斜到沿著穿過預熱環中心的垂直軸的預期位置來校正,使得觀察到的間隙寬度對應於所儲存的間隙寬度。
例如,有時可能是以下情況:在沉積裝置的冷狀態下不存在偏移,即,支撐軸如預期沿著穿過預熱環中心的垂直軸而對準,且基座相對於預熱環的位置水平地且同心地位於支撐臂上,僅在加熱沉積裝置期間,由於支撐軸傾斜偏離預期位置,才產生支撐軸的偏移。
無論基板晶圓是單獨還是與基座一起被裝載到沉積裝置中,都可以應用本發明。較佳地,在封閉的沉積裝置中且在至少450℃的操作溫度下應用根據本發明的方法。
基座在平面圖中具有圓形的外周,且較佳具有凹處(pocket)和放置表面,基板晶圓背面的邊緣區域位於該放置表面上。基板晶圓較佳以如下方式放置在該放置表面上:使得基板晶圓的背面與形成凹處之邊界的基底之間存在距離。凹處的底部可併入有孔,以利於摻雜劑從基板晶圓的背面向基座下方的反應室傳輸。基座可由纖維材料製成而代替孔,由於該材料的多孔性,可確保摻雜劑的傳輸。
基板晶圓較佳由單晶矽組成,如同沉積在基板晶圓正面上的磊晶層。基板晶圓的直徑較佳為至少200毫米,特別佳為至少300毫米。
本發明較佳還包括本領域技術人員已知的特徵,以便確定和校正基板晶圓位置相對於基座之位置的偏移。
下文參考例示性實施態樣的圖式來說明本發明。
圖1所示的沉積裝置20的反應室從上方係由上部圓頂17界定,從下方係由下部圓頂18界定。支撐軸9突出至反應室的中心,其中支撐臂10從該軸的上端分支。支撐臂10支撐基座2,在磊晶層的沉積期間,基板晶圓1放置在基座2上。在所示的實施態樣中,設置為在沉積裝置20的裝載期間將基板晶圓1放置在升降軸11上,並透過降低升降軸11而將其放置到基座上。沉積氣體係經由面向上部圓頂17的基板玻璃的正面而從進氣口引導到出氣口,所述進氣口和出氣口都位於沉積裝置的側壁上。在沉積裝置的側壁與基座2之間佈置有預熱環3。此外,可設置用於吹掃氣體的相應的進氣口和出氣口,該吹掃氣體係在基座下方平行於該基座朝下的面引導通過反應室。箭頭指示氣流的流動方向。反應室由燈組19從外部加熱,燈組19發射輻射能透過上部圓頂17和下部圓頂18。
在基座2位置相對於圍繞基座的預熱環3之位置的預期佈置中,在預熱環3與基座2之間設置有間隙5,間隙5的寬度沿著基座的外圓周及預熱環的內圓周是恆定的。穿過基座2中心的軸和穿過預熱環3中心的垂直軸22是重合的。在支撐軸9位置相對於預熱環3之位置的預期佈置中,沿著基座2的外圓周及預熱環的內圓周的間隙5具有恆定的寬度,且當支撐軸旋轉時,旋轉的旋轉軸與垂直軸22重合。
如果基座2水平地位於支撐臂10上但相對於預熱環偏離中心,或者如果基座2沒有水平地位於支撐臂10上,即位於沒有與垂直軸22正交對準的平面中,則基座2位置相對於圍繞基座的預熱環3之位置存在偏移。那麼,在第一種情況下,觀察到的基座2與預熱環3之間的間隙5的寬度發生變化,在第二種情況下,基座2與照相機系統7的距離發生變化(圖2),其中當基座2透過支撐軸9旋轉時,用該照相機系統觀察間隙5的寬度。
如果觀察到的基座2與預熱環3之間的間隙5的寬度改變,則支撐軸9位置相對於圍繞支撐軸的預熱環3之位置存在偏移,因為支撐軸9垂直定向,但不沿著穿過預熱環3中心的垂直軸22。如果觀察到的間隙5的寬度相較於所儲存之間隙5的寬度發生變化,則支撐軸9位置相對於圍繞支撐軸的預熱環3之位置也存在偏移,因為支撐軸9傾斜偏離預期位置,即當基座2旋轉時支撐軸9的旋轉軸和垂直軸22並沒有平行排列穿過預熱環3的中心。
圖2中所示的照相機系統7包含:用於在藉由支撐軸9旋轉基座2期間觀察圖像片段6的照相機。圖像片段6捕獲徑向延伸的區域,該區域較佳包圍基板晶圓1的外周的區段、基座2的外周的區段、預熱環3的內周的區段、以及因此還有基座2與預熱環3之間的間隙5的區段。基板晶圓1位於放置表面4上之基座2的凹處中,使得基板晶圓1的背面23與基座2的基底24相距一段距離。透過影像處理裝置8評估圖像片段6中所包含的資訊,尤其是關於間隙5的寬度以及照相機系統7到基座2的距離的資訊。控制裝置21用於檢查是否存在基座2及/或支撐軸9的偏移,且如果需要的話,如果出現支撐軸9的偏移,則控制裝置產生信號使驅動裝置12(圖1)開始運轉,而校正支撐軸存在的偏移。如果存在基座的偏移,則必要時使沉積裝置達到環境溫度並打開,並校正偏移。
驅動裝置12具有能夠使支撐軸9移動或傾斜,且當然二者能夠同時進行的特徵。驅動裝置12之可能的實施態樣係在圖1中示出。支撐軸9的移動係由致動器(例如壓電致動器)觸發。為了使支撐軸9在水平面內移動,設置致動器13(用於在x方向上移動)和致動器14(用於在y方向上移動),以及設置致動器16以用於使支撐軸9從圖1的視平面圍繞平行於x方向的旋轉軸以傾斜角φ傾斜,及設置致動器15以用於使支撐軸9在圖1的視平面中圍繞平行於y方向的旋轉軸以傾斜角θ傾斜。
沉積裝置20的下部圓頂18經由波紋管25連接至驅動裝置12,以使得支撐軸9能夠移動並密封由此形成的內部空間以抵抗周圍大氣的流入。
1:基板晶圓 2:基座 3:預熱環 4:放置表面 5:間隙 6:圖像片段 7:照相機系統 8:影像處理裝置 9:支撐軸 10:支撐臂 11:升降軸 12:驅動裝置 13:致動器(x方向) 14:致動器(y方向) 15:致動器(傾斜角φ) 16:致動器(傾斜角θ) 17:上部圓頂 18:下部圓頂 19:燈組 20:沉積裝置 21:控制裝置 22:垂直軸 23:背面 24:基底 25:波紋管
圖1示出具有根據本發明特徵的沉積裝置的例示性實施態樣。
圖2顯示基座與預熱環之間的間隙的觀察結果。
1:基板晶圓
2:基座
3:預熱環
5:間隙
9:支撐軸
10:支撐臂
11:升降軸
12:驅動裝置
13:致動器(x方向)
14:致動器(y方向)
15:致動器(傾斜角φ)
16:致動器(傾斜角θ)
17:上部圓頂
18:下部圓頂
19:燈組
20:沉積裝置
21:控制裝置
22:垂直軸
25:波紋管

Claims (2)

  1. 一種用於在半導體材料的基板晶圓上沉積磊晶層的方法,該方法包含:將該基板晶圓和基座佈置在沉積裝置中,使得該基板晶圓放置在該基座上,且該基座係由支撐軸的臂固持;監測該基座位置相對於環繞該基座的預熱環之位置是否存在偏移;監測支撐軸位置相對於該預熱環之位置是否存在偏移;如果存在該等偏移的至少一種,則在不低於450℃的溫度下藉由控制裝置設定驅動裝置以用於移動和傾斜該基座支撐軸來消除相應的偏移;以及在該基板晶圓上沉積磊晶層。
  2. 如請求項1所述的方法,其中,在該沉積裝置關閉的情況下移動該支撐軸。
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