TWI762638B - 雷射熔接體及其製造方法 - Google Patents
雷射熔接體及其製造方法 Download PDFInfo
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- 238000003466 welding Methods 0.000 title claims abstract description 154
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 69
- 229920005989 resin Polymers 0.000 claims abstract description 654
- 239000011347 resin Substances 0.000 claims abstract description 654
- 238000002835 absorbance Methods 0.000 claims abstract description 91
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 43
- 239000006096 absorbing agent Substances 0.000 claims abstract description 40
- -1 polyethylene terephthalate Polymers 0.000 claims description 70
- 238000000034 method Methods 0.000 claims description 32
- 239000001000 anthraquinone dye Substances 0.000 claims description 25
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 24
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 24
- 229920006122 polyamide resin Polymers 0.000 claims description 22
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 19
- 239000000155 melt Substances 0.000 claims description 13
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 12
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 12
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 12
- 210000001503 joint Anatomy 0.000 claims description 11
- 229920005668 polycarbonate resin Polymers 0.000 claims description 11
- 239000004431 polycarbonate resin Substances 0.000 claims description 11
- 239000004743 Polypropylene Substances 0.000 claims description 9
- 229920001155 polypropylene Polymers 0.000 claims description 9
- 230000001747 exhibiting effect Effects 0.000 claims description 3
- 230000001010 compromised effect Effects 0.000 abstract 1
- 239000003086 colorant Substances 0.000 description 52
- 239000000975 dye Substances 0.000 description 52
- 239000011342 resin composition Substances 0.000 description 51
- 229920002302 Nylon 6,6 Polymers 0.000 description 29
- 238000002360 preparation method Methods 0.000 description 21
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 19
- 229920002647 polyamide Polymers 0.000 description 19
- 238000002834 transmittance Methods 0.000 description 19
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 18
- 229920006065 Leona® Polymers 0.000 description 17
- 239000004952 Polyamide Substances 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 16
- 238000011156 evaluation Methods 0.000 description 16
- 238000000465 moulding Methods 0.000 description 16
- 229920000642 polymer Polymers 0.000 description 15
- 150000004056 anthraquinones Chemical class 0.000 description 14
- 229920001577 copolymer Polymers 0.000 description 14
- 229920001971 elastomer Polymers 0.000 description 14
- 239000000126 substance Substances 0.000 description 14
- 150000001412 amines Chemical class 0.000 description 13
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 13
- 150000001875 compounds Chemical class 0.000 description 13
- 239000000203 mixture Substances 0.000 description 13
- 239000011521 glass Substances 0.000 description 12
- 239000004014 plasticizer Substances 0.000 description 12
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 11
- 239000000806 elastomer Substances 0.000 description 11
- 239000000047 product Substances 0.000 description 11
- 239000000980 acid dye Substances 0.000 description 10
- 229920001225 polyester resin Polymers 0.000 description 10
- 239000004645 polyester resin Substances 0.000 description 10
- 239000010935 stainless steel Substances 0.000 description 10
- 229910001220 stainless steel Inorganic materials 0.000 description 10
- 229910045601 alloy Inorganic materials 0.000 description 9
- 239000000956 alloy Substances 0.000 description 9
- 239000000835 fiber Substances 0.000 description 9
- 239000002994 raw material Substances 0.000 description 9
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 8
- 239000002253 acid Substances 0.000 description 8
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- 229920000728 polyester Polymers 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 7
- 239000000654 additive Substances 0.000 description 7
- 229920006026 co-polymeric resin Polymers 0.000 description 7
- 239000000178 monomer Substances 0.000 description 7
- 239000000843 powder Substances 0.000 description 7
- 239000001044 red dye Substances 0.000 description 7
- SJEYSFABYSGQBG-UHFFFAOYSA-M Patent blue Chemical compound [Na+].C1=CC(N(CC)CC)=CC=C1C(C=1C(=CC(=CC=1)S([O-])(=O)=O)S([O-])(=O)=O)=C1C=CC(=[N+](CC)CC)C=C1 SJEYSFABYSGQBG-UHFFFAOYSA-M 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 6
- 238000002425 crystallisation Methods 0.000 description 6
- 230000008025 crystallization Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 230000004927 fusion Effects 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- UHOKSCJSTAHBSO-UHFFFAOYSA-N indanthrone blue Chemical compound C1=CC=C2C(=O)C3=CC=C4NC5=C6C(=O)C7=CC=CC=C7C(=O)C6=CC=C5NC4=C3C(=O)C2=C1 UHOKSCJSTAHBSO-UHFFFAOYSA-N 0.000 description 6
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- NIDFGXDXQKPZMA-UHFFFAOYSA-N 14h-benz[4,5]isoquino[2,1-a]perimidin-14-one Chemical compound C1=CC(N2C(=O)C=3C4=C(C2=N2)C=CC=C4C=CC=3)=C3C2=CC=CC3=C1 NIDFGXDXQKPZMA-UHFFFAOYSA-N 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 5
- 239000004594 Masterbatch (MB) Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 125000000217 alkyl group Chemical group 0.000 description 5
- 125000003118 aryl group Chemical group 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 150000002009 diols Chemical class 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 125000005843 halogen group Chemical group 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 5
- 238000005304 joining Methods 0.000 description 5
- 238000006068 polycondensation reaction Methods 0.000 description 5
- 229920000098 polyolefin Polymers 0.000 description 5
- 229920005672 polyolefin resin Polymers 0.000 description 5
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 5
- 125000001424 substituent group Chemical group 0.000 description 5
- 229920002725 thermoplastic elastomer Polymers 0.000 description 5
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 4
- FWLHAQYOFMQTHQ-UHFFFAOYSA-N 2-N-[8-[[8-(4-aminoanilino)-10-phenylphenazin-10-ium-2-yl]amino]-10-phenylphenazin-10-ium-2-yl]-8-N,10-diphenylphenazin-10-ium-2,8-diamine hydroxy-oxido-dioxochromium Chemical compound O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.Nc1ccc(Nc2ccc3nc4ccc(Nc5ccc6nc7ccc(Nc8ccc9nc%10ccc(Nc%11ccccc%11)cc%10[n+](-c%10ccccc%10)c9c8)cc7[n+](-c7ccccc7)c6c5)cc4[n+](-c4ccccc4)c3c2)cc1 FWLHAQYOFMQTHQ-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 229920002292 Nylon 6 Polymers 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 125000003277 amino group Chemical group 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000004040 coloring Methods 0.000 description 4
- UHXQPQCJDDSMCB-UHFFFAOYSA-L disodium;3-[[9,10-dioxo-4-(2,4,6-trimethyl-3-sulfonatoanilino)anthracen-1-yl]amino]-2,4,6-trimethylbenzenesulfonate Chemical compound [Na+].[Na+].CC1=CC(C)=C(S([O-])(=O)=O)C(C)=C1NC(C=1C(=O)C2=CC=CC=C2C(=O)C=11)=CC=C1NC1=C(C)C=C(C)C(S([O-])(=O)=O)=C1C UHXQPQCJDDSMCB-UHFFFAOYSA-L 0.000 description 4
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 4
- 230000005284 excitation Effects 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229920000767 polyaniline Polymers 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 229920001955 polyphenylene ether Polymers 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 4
- 239000001043 yellow dye Substances 0.000 description 4
- CNRPDCKHCGUKDK-UHFFFAOYSA-N 1,8-bis(phenylsulfanyl)anthracene-9,10-dione Chemical compound C=12C(=O)C3=C(SC=4C=CC=CC=4)C=CC=C3C(=O)C2=CC=CC=1SC1=CC=CC=C1 CNRPDCKHCGUKDK-UHFFFAOYSA-N 0.000 description 3
- GBPWTMZRCAESKB-UHFFFAOYSA-N 2-amino-n,n-dipropylacetamide;hydrochloride Chemical compound Cl.CCCN(CCC)C(=O)CN GBPWTMZRCAESKB-UHFFFAOYSA-N 0.000 description 3
- LTHNHFOGQMKPOV-UHFFFAOYSA-N 2-ethylhexan-1-amine Chemical compound CCCCC(CC)CN LTHNHFOGQMKPOV-UHFFFAOYSA-N 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 3
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 150000001408 amides Chemical class 0.000 description 3
- 125000002490 anilino group Chemical group [H]N(*)C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 3
- 150000004984 aromatic diamines Chemical class 0.000 description 3
- 239000011324 bead Substances 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 150000004985 diamines Chemical class 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- FPAYXBWMYIMERV-UHFFFAOYSA-L disodium;5-methyl-2-[[4-(4-methyl-2-sulfonatoanilino)-9,10-dioxoanthracen-1-yl]amino]benzenesulfonate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)C1=CC(C)=CC=C1NC(C=1C(=O)C2=CC=CC=C2C(=O)C=11)=CC=C1NC1=CC=C(C)C=C1S([O-])(=O)=O FPAYXBWMYIMERV-UHFFFAOYSA-L 0.000 description 3
- FBNCDTLHQPLASV-UHFFFAOYSA-L disodium;5-methyl-2-[[5-(4-methyl-2-sulfonatoanilino)-9,10-dioxoanthracen-1-yl]amino]benzenesulfonate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)C1=CC(C)=CC=C1NC1=CC=CC2=C1C(=O)C1=CC=CC(NC=3C(=CC(C)=CC=3)S([O-])(=O)=O)=C1C2=O FBNCDTLHQPLASV-UHFFFAOYSA-L 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000008187 granular material Substances 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- AJDUTMFFZHIJEM-UHFFFAOYSA-N n-(9,10-dioxoanthracen-1-yl)-4-[4-[[4-[4-[(9,10-dioxoanthracen-1-yl)carbamoyl]phenyl]phenyl]diazenyl]phenyl]benzamide Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2NC(=O)C(C=C1)=CC=C1C(C=C1)=CC=C1N=NC(C=C1)=CC=C1C(C=C1)=CC=C1C(=O)NC1=CC=CC2=C1C(=O)C1=CC=CC=C1C2=O AJDUTMFFZHIJEM-UHFFFAOYSA-N 0.000 description 3
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 3
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 3
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 229920013716 polyethylene resin Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000001062 red colorant Substances 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 125000000542 sulfonic acid group Chemical group 0.000 description 3
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000003981 vehicle Substances 0.000 description 3
- 239000001060 yellow colorant Substances 0.000 description 3
- 239000004711 α-olefin Substances 0.000 description 3
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- RUFPHBVGCFYCNW-UHFFFAOYSA-N 1-naphthylamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1 RUFPHBVGCFYCNW-UHFFFAOYSA-N 0.000 description 2
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 2
- PBLZLIFKVPJDCO-UHFFFAOYSA-N 12-aminododecanoic acid Chemical compound NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 2
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 2
- JZUHIOJYCPIVLQ-UHFFFAOYSA-N 2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCN JZUHIOJYCPIVLQ-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- WVDRSXGPQWNUBN-UHFFFAOYSA-N 4-(4-carboxyphenoxy)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C=C1 WVDRSXGPQWNUBN-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- IPRJXAGUEGOFGG-UHFFFAOYSA-N N-butylbenzenesulfonamide Chemical compound CCCCNS(=O)(=O)C1=CC=CC=C1 IPRJXAGUEGOFGG-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920000305 Nylon 6,10 Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 229920001893 acrylonitrile styrene Polymers 0.000 description 2
- 229920001898 acrylonitrile–EPDM–styrene Polymers 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 150000003863 ammonium salts Chemical class 0.000 description 2
- 229920006020 amorphous polyamide Polymers 0.000 description 2
- 150000001450 anions Chemical class 0.000 description 2
- 239000003242 anti bacterial agent Substances 0.000 description 2
- 230000000844 anti-bacterial effect Effects 0.000 description 2
- 239000003429 antifungal agent Substances 0.000 description 2
- 229940121375 antifungal agent Drugs 0.000 description 2
- 150000001463 antimony compounds Chemical class 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- QMKYBPDZANOJGF-UHFFFAOYSA-N benzene-1,3,5-tricarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=CC(C(O)=O)=C1 QMKYBPDZANOJGF-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 239000000038 blue colorant Substances 0.000 description 2
- 239000001045 blue dye Substances 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- XBZSBBLNHFMTEB-UHFFFAOYSA-N cyclohexane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCCC(C(O)=O)C1 XBZSBBLNHFMTEB-UHFFFAOYSA-N 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- JMLPVHXESHXUSV-UHFFFAOYSA-N dodecane-1,1-diamine Chemical compound CCCCCCCCCCCC(N)N JMLPVHXESHXUSV-UHFFFAOYSA-N 0.000 description 2
- 239000003623 enhancer Substances 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 235000013305 food Nutrition 0.000 description 2
- 239000001046 green dye Substances 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- QQHJDPROMQRDLA-UHFFFAOYSA-N hexadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCC(O)=O QQHJDPROMQRDLA-UHFFFAOYSA-N 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- JJOJFIHJIRWASH-UHFFFAOYSA-N icosanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCCCCC(O)=O JJOJFIHJIRWASH-UHFFFAOYSA-N 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000012784 inorganic fiber Substances 0.000 description 2
- 239000012796 inorganic flame retardant Substances 0.000 description 2
- SXQFCVDSOLSHOQ-UHFFFAOYSA-N lactamide Chemical compound CC(O)C(N)=O SXQFCVDSOLSHOQ-UHFFFAOYSA-N 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 239000004611 light stabiliser Substances 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- ZETYUTMSJWMKNQ-UHFFFAOYSA-N n,n',n'-trimethylhexane-1,6-diamine Chemical compound CNCCCCCCN(C)C ZETYUTMSJWMKNQ-UHFFFAOYSA-N 0.000 description 2
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 2
- LQNUZADURLCDLV-UHFFFAOYSA-N nitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1 LQNUZADURLCDLV-UHFFFAOYSA-N 0.000 description 2
- 229910017464 nitrogen compound Inorganic materials 0.000 description 2
- 150000002830 nitrogen compounds Chemical class 0.000 description 2
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 150000002896 organic halogen compounds Chemical class 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 150000003014 phosphoric acid esters Chemical class 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 229920005990 polystyrene resin Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 150000003141 primary amines Chemical class 0.000 description 2
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 125000001453 quaternary ammonium group Chemical group 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229920005604 random copolymer Polymers 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- LWBHHRRTOZQPDM-UHFFFAOYSA-N undecanedioic acid Chemical compound OC(=O)CCCCCCCCCC(O)=O LWBHHRRTOZQPDM-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000010456 wollastonite Substances 0.000 description 2
- 229910052882 wollastonite Inorganic materials 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 235000014692 zinc oxide Nutrition 0.000 description 2
- IWTMSCUHCJHPPR-ACCUITESSA-N (E)-hexadec-2-enedioic acid Chemical compound OC(=O)CCCCCCCCCCCC\C=C\C(O)=O IWTMSCUHCJHPPR-ACCUITESSA-N 0.000 description 1
- LJDGJCNHVGGOFW-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-(2-bromophenoxy)benzene Chemical compound BrC1=CC=CC=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br LJDGJCNHVGGOFW-UHFFFAOYSA-N 0.000 description 1
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- OWRCNXZUPFZXOS-UHFFFAOYSA-N 1,3-diphenylguanidine Chemical compound C=1C=CC=CC=1NC(=N)NC1=CC=CC=C1 OWRCNXZUPFZXOS-UHFFFAOYSA-N 0.000 description 1
- DMDRBXCDTZRMHZ-UHFFFAOYSA-N 1,4-bis(2,4,6-trimethylanilino)anthracene-9,10-dione Chemical compound CC1=CC(C)=CC(C)=C1NC(C=1C(=O)C2=CC=CC=C2C(=O)C=11)=CC=C1NC1=C(C)C=C(C)C=C1C DMDRBXCDTZRMHZ-UHFFFAOYSA-N 0.000 description 1
- QOSTVEDABRQTSU-UHFFFAOYSA-N 1,4-bis(methylamino)anthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C(NC)=CC=C2NC QOSTVEDABRQTSU-UHFFFAOYSA-N 0.000 description 1
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- OXLITIGRBOEDEZ-UHFFFAOYSA-N 1,5-diamino-4,8-dihydroxy-2-(4-hydroxyphenyl)anthracene-9,10-dione Chemical compound C=1C(O)=C2C(=O)C=3C(N)=CC=C(O)C=3C(=O)C2=C(N)C=1C1=CC=C(O)C=C1 OXLITIGRBOEDEZ-UHFFFAOYSA-N 0.000 description 1
- YFOOEYJGMMJJLS-UHFFFAOYSA-N 1,8-diaminonaphthalene Chemical compound C1=CC(N)=C2C(N)=CC=CC2=C1 YFOOEYJGMMJJLS-UHFFFAOYSA-N 0.000 description 1
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
- ITYXXSSJBOAGAR-UHFFFAOYSA-N 1-(methylamino)-4-(4-methylanilino)anthracene-9,10-dione Chemical compound C1=2C(=O)C3=CC=CC=C3C(=O)C=2C(NC)=CC=C1NC1=CC=C(C)C=C1 ITYXXSSJBOAGAR-UHFFFAOYSA-N 0.000 description 1
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- VCRZAKVGPJFABU-UHFFFAOYSA-N 10-phenoxarsinin-10-yloxyphenoxarsinine Chemical compound C12=CC=CC=C2OC2=CC=CC=C2[As]1O[As]1C2=CC=CC=C2OC2=CC=CC=C21 VCRZAKVGPJFABU-UHFFFAOYSA-N 0.000 description 1
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 1
- XFYQEBBUVNLYBR-UHFFFAOYSA-N 12-phthaloperinone Chemical compound C1=CC(N2C(=O)C=3C(=CC=CC=3)C2=N2)=C3C2=CC=CC3=C1 XFYQEBBUVNLYBR-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- DWFUTNJGNBYHNN-UHFFFAOYSA-N 2,2,4-trimethylhexanedioic acid Chemical compound OC(=O)CC(C)CC(C)(C)C(O)=O DWFUTNJGNBYHNN-UHFFFAOYSA-N 0.000 description 1
- VVFVRTNNLLZXAL-UHFFFAOYSA-N 2-(2-methylphenyl)guanidine Chemical compound CC1=CC=CC=C1N=C(N)N VVFVRTNNLLZXAL-UHFFFAOYSA-N 0.000 description 1
- MGUMZJAQENFQKN-UHFFFAOYSA-N 2-(cyclohexylamino)ethanol Chemical compound OCCNC1CCCCC1 MGUMZJAQENFQKN-UHFFFAOYSA-N 0.000 description 1
- HCYSJBICYOIBLS-UHFFFAOYSA-N 2-(dodecylamino)ethanol Chemical compound CCCCCCCCCCCCNCCO HCYSJBICYOIBLS-UHFFFAOYSA-N 0.000 description 1
- NKFNBVMJTSYZDV-UHFFFAOYSA-N 2-[dodecyl(2-hydroxyethyl)amino]ethanol Chemical compound CCCCCCCCCCCCN(CCO)CCO NKFNBVMJTSYZDV-UHFFFAOYSA-N 0.000 description 1
- ZPXGNBIFHQKREO-UHFFFAOYSA-N 2-chloroterephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(Cl)=C1 ZPXGNBIFHQKREO-UHFFFAOYSA-N 0.000 description 1
- GAGWMWLBYJPFDD-UHFFFAOYSA-N 2-methyloctane-1,8-diamine Chemical compound NCC(C)CCCCCCN GAGWMWLBYJPFDD-UHFFFAOYSA-N 0.000 description 1
- JMMZCWZIJXAGKW-UHFFFAOYSA-N 2-methylpent-2-ene Chemical compound CCC=C(C)C JMMZCWZIJXAGKW-UHFFFAOYSA-N 0.000 description 1
- QWGRWMMWNDWRQN-UHFFFAOYSA-N 2-methylpropane-1,3-diol Chemical compound OCC(C)CO QWGRWMMWNDWRQN-UHFFFAOYSA-N 0.000 description 1
- UFMBOFGKHIXOTA-UHFFFAOYSA-N 2-methylterephthalic acid Chemical compound CC1=CC(C(O)=O)=CC=C1C(O)=O UFMBOFGKHIXOTA-UHFFFAOYSA-N 0.000 description 1
- YZTJKOLMWJNVFH-UHFFFAOYSA-N 2-sulfobenzene-1,3-dicarboxylic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1S(O)(=O)=O YZTJKOLMWJNVFH-UHFFFAOYSA-N 0.000 description 1
- UBZVRROHBDDCQY-UHFFFAOYSA-N 20749-68-2 Chemical compound C1=CC(N2C(=O)C3=C(C(=C(Cl)C(Cl)=C3C2=N2)Cl)Cl)=C3C2=CC=CC3=C1 UBZVRROHBDDCQY-UHFFFAOYSA-N 0.000 description 1
- XBNVWXKPFORCRI-UHFFFAOYSA-N 2h-naphtho[2,3-f]quinolin-1-one Chemical compound C1=CC=CC2=CC3=C4C(=O)CC=NC4=CC=C3C=C21 XBNVWXKPFORCRI-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical class C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- AIBRSVLEQRWAEG-UHFFFAOYSA-N 3,9-bis(2,4-ditert-butylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP1OCC2(COP(OC=3C(=CC(=CC=3)C(C)(C)C)C(C)(C)C)OC2)CO1 AIBRSVLEQRWAEG-UHFFFAOYSA-N 0.000 description 1
- DVFGEIYOLIFSRX-UHFFFAOYSA-N 3-(2-ethylhexoxy)propan-1-amine Chemical compound CCCCC(CC)COCCCN DVFGEIYOLIFSRX-UHFFFAOYSA-N 0.000 description 1
- KHZYMPDILLAIQY-UHFFFAOYSA-N 3-(3-carboxyphenyl)benzoic acid Chemical compound OC(=O)C1=CC=CC(C=2C=C(C=CC=2)C(O)=O)=C1 KHZYMPDILLAIQY-UHFFFAOYSA-N 0.000 description 1
- XUSNPFGLKGCWGN-UHFFFAOYSA-N 3-[4-(3-aminopropyl)piperazin-1-yl]propan-1-amine Chemical compound NCCCN1CCN(CCCN)CC1 XUSNPFGLKGCWGN-UHFFFAOYSA-N 0.000 description 1
- COCWIIAFGQLMGS-UHFFFAOYSA-N 3-[n-ethyl-3-methyl-4-[(5-nitro-1,3-thiazol-2-yl)diazenyl]anilino]propane-1,2-diol Chemical compound CC1=CC(N(CC(O)CO)CC)=CC=C1N=NC1=NC=C([N+]([O-])=O)S1 COCWIIAFGQLMGS-UHFFFAOYSA-N 0.000 description 1
- BUZICZZQJDLXJN-UHFFFAOYSA-N 3-azaniumyl-4-hydroxybutanoate Chemical compound OCC(N)CC(O)=O BUZICZZQJDLXJN-UHFFFAOYSA-N 0.000 description 1
- LPUBRQWGZPPVBS-UHFFFAOYSA-N 3-butoxypropan-1-amine Chemical compound CCCCOCCCN LPUBRQWGZPPVBS-UHFFFAOYSA-N 0.000 description 1
- YHQXBTXEYZIYOV-UHFFFAOYSA-N 3-methylbut-1-ene Chemical compound CC(C)C=C YHQXBTXEYZIYOV-UHFFFAOYSA-N 0.000 description 1
- UTOXFQVLOTVLSD-UHFFFAOYSA-N 3-propoxypropan-1-amine Chemical compound CCCOCCCN UTOXFQVLOTVLSD-UHFFFAOYSA-N 0.000 description 1
- IHZXTIBMKNSJCJ-UHFFFAOYSA-N 3-{[(4-{[4-(dimethylamino)phenyl](4-{ethyl[(3-sulfophenyl)methyl]amino}phenyl)methylidene}cyclohexa-2,5-dien-1-ylidene)(ethyl)azaniumyl]methyl}benzene-1-sulfonate Chemical compound C=1C=C(C(=C2C=CC(C=C2)=[N+](C)C)C=2C=CC(=CC=2)N(CC)CC=2C=C(C=CC=2)S([O-])(=O)=O)C=CC=1N(CC)CC1=CC=CC(S(O)(=O)=O)=C1 IHZXTIBMKNSJCJ-UHFFFAOYSA-N 0.000 description 1
- NEQFBGHQPUXOFH-UHFFFAOYSA-N 4-(4-carboxyphenyl)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C=C1 NEQFBGHQPUXOFH-UHFFFAOYSA-N 0.000 description 1
- YMGUSOBWEUGITL-UHFFFAOYSA-N 4-(aminomethyl)-2-methylbenzoic acid Chemical compound CC1=CC(CN)=CC=C1C(O)=O YMGUSOBWEUGITL-UHFFFAOYSA-N 0.000 description 1
- KSMVBYPXNKCPAJ-UHFFFAOYSA-N 4-Methylcyclohexylamine Chemical compound CC1CCC(N)CC1 KSMVBYPXNKCPAJ-UHFFFAOYSA-N 0.000 description 1
- IGSBHTZEJMPDSZ-UHFFFAOYSA-N 4-[(4-amino-3-methylcyclohexyl)methyl]-2-methylcyclohexan-1-amine Chemical compound C1CC(N)C(C)CC1CC1CC(C)C(N)CC1 IGSBHTZEJMPDSZ-UHFFFAOYSA-N 0.000 description 1
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 1
- BDBZTOMUANOKRT-UHFFFAOYSA-N 4-[2-(4-aminocyclohexyl)propan-2-yl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1C(C)(C)C1CCC(N)CC1 BDBZTOMUANOKRT-UHFFFAOYSA-N 0.000 description 1
- GAHCNYHAKKGGHF-UHFFFAOYSA-N 5,5-dimethylhexan-1-amine Chemical compound CC(C)(C)CCCCN GAHCNYHAKKGGHF-UHFFFAOYSA-N 0.000 description 1
- PMZBHPUNQNKBOA-UHFFFAOYSA-N 5-methylbenzene-1,3-dicarboxylic acid Chemical compound CC1=CC(C(O)=O)=CC(C(O)=O)=C1 PMZBHPUNQNKBOA-UHFFFAOYSA-N 0.000 description 1
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- AAIUWVOMXTVLRG-UHFFFAOYSA-N 8,8-dimethylnonan-1-amine Chemical compound CC(C)(C)CCCCCCCN AAIUWVOMXTVLRG-UHFFFAOYSA-N 0.000 description 1
- VJUKWPOWHJITTP-UHFFFAOYSA-N 81-39-0 Chemical compound C1=CC(C)=CC=C1NC1=CC=C2C3=C1C(=O)C1=CC=CC=C1C3=CC(=O)N2C VJUKWPOWHJITTP-UHFFFAOYSA-N 0.000 description 1
- RZVHIXYEVGDQDX-UHFFFAOYSA-N 9,10-anthraquinone Chemical group C1=CC=C2C(=O)C3=CC=CC=C3C(=O)C2=C1 RZVHIXYEVGDQDX-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 239000004114 Ammonium polyphosphate Substances 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- SAIKULLUBZKPDA-UHFFFAOYSA-N Bis(2-ethylhexyl) amine Chemical compound CCCCC(CC)CNCC(CC)CCCC SAIKULLUBZKPDA-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- XBPCUCUWBYBCDP-UHFFFAOYSA-N Dicyclohexylamine Chemical compound C1CCCCC1NC1CCCCC1 XBPCUCUWBYBCDP-UHFFFAOYSA-N 0.000 description 1
- RUPBZQFQVRMKDG-UHFFFAOYSA-M Didecyldimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCC[N+](C)(C)CCCCCCCCCC RUPBZQFQVRMKDG-UHFFFAOYSA-M 0.000 description 1
- QEVGZEDELICMKH-UHFFFAOYSA-N Diglycolic acid Chemical compound OC(=O)COCC(O)=O QEVGZEDELICMKH-UHFFFAOYSA-N 0.000 description 1
- ZVFDTKUVRCTHQE-UHFFFAOYSA-N Diisodecyl phthalate Chemical compound CC(C)CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC(C)C ZVFDTKUVRCTHQE-UHFFFAOYSA-N 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 108700042658 GAP-43 Proteins 0.000 description 1
- WJYIASZWHGOTOU-UHFFFAOYSA-N Heptylamine Chemical compound CCCCCCCN WJYIASZWHGOTOU-UHFFFAOYSA-N 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- KEQFTVQCIQJIQW-UHFFFAOYSA-N N-Phenyl-2-naphthylamine Chemical compound C=1C=C2C=CC=CC2=CC=1NC1=CC=CC=C1 KEQFTVQCIQJIQW-UHFFFAOYSA-N 0.000 description 1
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 1
- IIHKGAZZIDXOAT-UHFFFAOYSA-N NCC12CCCCC2(CCCC1)CN Chemical compound NCC12CCCCC2(CCCC1)CN IIHKGAZZIDXOAT-UHFFFAOYSA-N 0.000 description 1
- DFPAKSUCGFBDDF-UHFFFAOYSA-N Nicotinamide Chemical group NC(=O)C1=CC=CN=C1 DFPAKSUCGFBDDF-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920001007 Nylon 4 Polymers 0.000 description 1
- 229920003189 Nylon 4,6 Polymers 0.000 description 1
- 229920000572 Nylon 6/12 Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 229920001283 Polyalkylene terephthalate Polymers 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 229920006121 Polyxylylene adipamide Polymers 0.000 description 1
- UOJYYXATTMQQNA-UHFFFAOYSA-N Proxan Chemical compound CC(C)OC(S)=S UOJYYXATTMQQNA-UHFFFAOYSA-N 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 1
- 239000004113 Sepiolite Substances 0.000 description 1
- MRQIXHXHHPWVIL-ISLYRVAYSA-N Sudan I Chemical compound OC1=CC=C2C=CC=CC2=C1\N=N\C1=CC=CC=C1 MRQIXHXHHPWVIL-ISLYRVAYSA-N 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- QHWKHLYUUZGSCW-UHFFFAOYSA-N Tetrabromophthalic anhydride Chemical compound BrC1=C(Br)C(Br)=C2C(=O)OC(=O)C2=C1Br QHWKHLYUUZGSCW-UHFFFAOYSA-N 0.000 description 1
- 244000269722 Thea sinensis Species 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- WPWNSTTVSOUHRP-UHFFFAOYSA-N [1-(aminomethyl)naphthalen-2-yl]methanamine Chemical compound C1=CC=CC2=C(CN)C(CN)=CC=C21 WPWNSTTVSOUHRP-UHFFFAOYSA-N 0.000 description 1
- OUDVZDBTAKSRJB-UHFFFAOYSA-N [3-(aminomethyl)-3,5,5-trimethylcyclohexyl]methanamine Chemical compound CC1(C)CC(CN)CC(C)(CN)C1 OUDVZDBTAKSRJB-UHFFFAOYSA-N 0.000 description 1
- QLBRROYTTDFLDX-UHFFFAOYSA-N [3-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCCC(CN)C1 QLBRROYTTDFLDX-UHFFFAOYSA-N 0.000 description 1
- OXIKYYJDTWKERT-UHFFFAOYSA-N [4-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCC(CN)CC1 OXIKYYJDTWKERT-UHFFFAOYSA-N 0.000 description 1
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- DGOBMKYRQHEFGQ-UHFFFAOYSA-L acid green 5 Chemical compound [Na+].[Na+].C=1C=C(C(=C2C=CC(C=C2)=[N+](CC)CC=2C=C(C=CC=2)S([O-])(=O)=O)C=2C=CC(=CC=2)S([O-])(=O)=O)C=CC=1N(CC)CC1=CC=CC(S([O-])(=O)=O)=C1 DGOBMKYRQHEFGQ-UHFFFAOYSA-L 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 229960002684 aminocaproic acid Drugs 0.000 description 1
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 1
- QCTBMLYLENLHLA-UHFFFAOYSA-N aminomethylbenzoic acid Chemical compound NCC1=CC=C(C(O)=O)C=C1 QCTBMLYLENLHLA-UHFFFAOYSA-N 0.000 description 1
- 229960003375 aminomethylbenzoic acid Drugs 0.000 description 1
- 235000019826 ammonium polyphosphate Nutrition 0.000 description 1
- 229920001276 ammonium polyphosphate Polymers 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- VQNRMLCRMNVBBP-UHFFFAOYSA-N aniline;oxalic acid Chemical compound OC(=O)C(O)=O.NC1=CC=CC=C1 VQNRMLCRMNVBBP-UHFFFAOYSA-N 0.000 description 1
- 150000001448 anilines Chemical class 0.000 description 1
- MMCPOSDMTGQNKG-UHFFFAOYSA-N anilinium chloride Chemical compound Cl.NC1=CC=CC=C1 MMCPOSDMTGQNKG-UHFFFAOYSA-N 0.000 description 1
- RGHILYZRVFRRNK-UHFFFAOYSA-N anthracene-1,2-dione Chemical compound C1=CC=C2C=C(C(C(=O)C=C3)=O)C3=CC2=C1 RGHILYZRVFRRNK-UHFFFAOYSA-N 0.000 description 1
- URRLLRVIUROMEQ-UHFFFAOYSA-N anthracene-1,6-dicarboxylic acid Chemical compound OC(=O)C1=CC=CC2=CC3=CC(C(=O)O)=CC=C3C=C21 URRLLRVIUROMEQ-UHFFFAOYSA-N 0.000 description 1
- XAAYMWLCUICVSL-UHFFFAOYSA-N anthracene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC3=CC(C(=O)O)=CC=C3C=C21 XAAYMWLCUICVSL-UHFFFAOYSA-N 0.000 description 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 1
- KIQKNTIOWITBBA-UHFFFAOYSA-K antimony(3+);phosphate Chemical compound [Sb+3].[O-]P([O-])([O-])=O KIQKNTIOWITBBA-UHFFFAOYSA-K 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 159000000032 aromatic acids Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 239000000987 azo dye Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 150000001555 benzenes Chemical class 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 235000013361 beverage Nutrition 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- JTNKWPDPEXRFOV-UHFFFAOYSA-N bis(8-methylnonyl) phenyl phosphate Chemical compound CC(C)CCCCCCCOP(=O)(OCCCCCCCC(C)C)OC1=CC=CC=C1 JTNKWPDPEXRFOV-UHFFFAOYSA-N 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 150000001639 boron compounds Chemical class 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- WOWHHFRSBJGXCM-UHFFFAOYSA-M cetyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[N+](C)(C)C WOWHHFRSBJGXCM-UHFFFAOYSA-M 0.000 description 1
- 239000012295 chemical reaction liquid Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229920006039 crystalline polyamide Polymers 0.000 description 1
- GEQHKFFSPGPGLN-UHFFFAOYSA-N cyclohexane-1,3-diamine Chemical compound NC1CCCC(N)C1 GEQHKFFSPGPGLN-UHFFFAOYSA-N 0.000 description 1
- VKIRRGRTJUUZHS-UHFFFAOYSA-N cyclohexane-1,4-diamine Chemical compound NC1CCC(N)CC1 VKIRRGRTJUUZHS-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- UZJUEEROTUVKNS-UHFFFAOYSA-N decyl diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)(OCCCCCCCCCC)OC1=CC=CC=C1 UZJUEEROTUVKNS-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 125000005265 dialkylamine group Chemical group 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- MCWXGJITAZMZEV-UHFFFAOYSA-N dimethoate Chemical compound CNC(=O)CSP(=S)(OC)OC MCWXGJITAZMZEV-UHFFFAOYSA-N 0.000 description 1
- FBSAITBEAPNWJG-UHFFFAOYSA-N dimethyl phthalate Natural products CC(=O)OC1=CC=CC=C1OC(C)=O FBSAITBEAPNWJG-UHFFFAOYSA-N 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- REZZEXDLIUJMMS-UHFFFAOYSA-M dimethyldioctadecylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+](C)(C)CCCCCCCCCCCCCCCCCC REZZEXDLIUJMMS-UHFFFAOYSA-M 0.000 description 1
- 229960001826 dimethylphthalate Drugs 0.000 description 1
- PPSZHCXTGRHULJ-UHFFFAOYSA-N dioxazine Chemical compound O1ON=CC=C1 PPSZHCXTGRHULJ-UHFFFAOYSA-N 0.000 description 1
- GWZCCUDJHOGOSO-UHFFFAOYSA-N diphenic acid Chemical compound OC(=O)C1=CC=CC=C1C1=CC=CC=C1C(O)=O GWZCCUDJHOGOSO-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- AOMZHDJXSYHPKS-UHFFFAOYSA-L disodium 4-amino-5-hydroxy-3-[(4-nitrophenyl)diazenyl]-6-phenyldiazenylnaphthalene-2,7-disulfonate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)C1=CC2=CC(S([O-])(=O)=O)=C(N=NC=3C=CC=CC=3)C(O)=C2C(N)=C1N=NC1=CC=C([N+]([O-])=O)C=C1 AOMZHDJXSYHPKS-UHFFFAOYSA-L 0.000 description 1
- SKKIWNWLPWAHTF-UHFFFAOYSA-L disodium;5-(4-acetamidoanilino)-8-amino-9,10-dioxoanthracene-1,2-disulfonate Chemical compound [Na+].[Na+].C1=CC(NC(=O)C)=CC=C1NC1=CC=C(N)C2=C1C(=O)C(C=CC(=C1S([O-])(=O)=O)S([O-])(=O)=O)=C1C2=O SKKIWNWLPWAHTF-UHFFFAOYSA-L 0.000 description 1
- 239000004664 distearyldimethylammonium chloride (DHTDMAC) Substances 0.000 description 1
- ILRSCQWREDREME-UHFFFAOYSA-N dodecanamide Chemical compound CCCCCCCCCCCC(N)=O ILRSCQWREDREME-UHFFFAOYSA-N 0.000 description 1
- DDXLVDQZPFLQMZ-UHFFFAOYSA-M dodecyl(trimethyl)azanium;chloride Chemical compound [Cl-].CCCCCCCCCCCC[N+](C)(C)C DDXLVDQZPFLQMZ-UHFFFAOYSA-M 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- QXRZNXPSKJPMHR-UHFFFAOYSA-N ethyl carbamate nickel Chemical compound [Ni].NC(=O)OCC QXRZNXPSKJPMHR-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229920006228 ethylene acrylate copolymer Polymers 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 239000004715 ethylene vinyl alcohol Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 238000010097 foam moulding Methods 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 239000000040 green colorant Substances 0.000 description 1
- 229940083094 guanine derivative acting on arteriolar smooth muscle Drugs 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229940051250 hexylene glycol Drugs 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 239000005457 ice water Substances 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- LVPMIMZXDYBCDF-UHFFFAOYSA-N isocinchomeronic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)N=C1 LVPMIMZXDYBCDF-UHFFFAOYSA-N 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- PXZQEOJJUGGUIB-UHFFFAOYSA-N isoindolin-1-one Chemical compound C1=CC=C2C(=O)NCC2=C1 PXZQEOJJUGGUIB-UHFFFAOYSA-N 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 229920001179 medium density polyethylene Polymers 0.000 description 1
- 239000004701 medium-density polyethylene Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- RTWNYYOXLSILQN-UHFFFAOYSA-N methanediamine Chemical compound NCN RTWNYYOXLSILQN-UHFFFAOYSA-N 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- OJURWUUOVGOHJZ-UHFFFAOYSA-N methyl 2-[(2-acetyloxyphenyl)methyl-[2-[(2-acetyloxyphenyl)methyl-(2-methoxy-2-oxoethyl)amino]ethyl]amino]acetate Chemical compound C=1C=CC=C(OC(C)=O)C=1CN(CC(=O)OC)CCN(CC(=O)OC)CC1=CC=CC=C1OC(C)=O OJURWUUOVGOHJZ-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011490 mineral wool Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- VOVMEXKSLWYRFV-UHFFFAOYSA-N n'-undecylethane-1,2-diamine Chemical compound CCCCCCCCCCCNCCN VOVMEXKSLWYRFV-UHFFFAOYSA-N 0.000 description 1
- PZNXLZZWWBSQQK-UHFFFAOYSA-N n-(5-benzamido-9,10-dioxoanthracen-1-yl)benzamide Chemical compound C=1C=CC=CC=1C(=O)NC(C=1C(=O)C2=CC=C3)=CC=CC=1C(=O)C2=C3NC(=O)C1=CC=CC=C1 PZNXLZZWWBSQQK-UHFFFAOYSA-N 0.000 description 1
- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical class CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 description 1
- 125000006606 n-butoxy group Chemical group 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003506 n-propoxy group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- NVSYANRBXPURRQ-UHFFFAOYSA-N naphthalen-1-ylmethanamine Chemical compound C1=CC=C2C(CN)=CC=CC2=C1 NVSYANRBXPURRQ-UHFFFAOYSA-N 0.000 description 1
- NTNWKDHZTDQSST-UHFFFAOYSA-N naphthalene-1,2-diamine Chemical compound C1=CC=CC2=C(N)C(N)=CC=C21 NTNWKDHZTDQSST-UHFFFAOYSA-N 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 description 1
- DFFZOPXDTCDZDP-UHFFFAOYSA-N naphthalene-1,5-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=CC2=C1C(O)=O DFFZOPXDTCDZDP-UHFFFAOYSA-N 0.000 description 1
- VAWFFNJAPKXVPH-UHFFFAOYSA-N naphthalene-1,6-dicarboxylic acid Chemical compound OC(=O)C1=CC=CC2=CC(C(=O)O)=CC=C21 VAWFFNJAPKXVPH-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- ZSJFLDUTBDIFLJ-UHFFFAOYSA-N nickel zirconium Chemical class [Ni].[Zr] ZSJFLDUTBDIFLJ-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 235000015097 nutrients Nutrition 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- XKIVKIIBCJIWNU-UHFFFAOYSA-N o-[3-pentadecanethioyloxy-2,2-bis(pentadecanethioyloxymethyl)propyl] pentadecanethioate Chemical compound CCCCCCCCCCCCCCC(=S)OCC(COC(=S)CCCCCCCCCCCCCC)(COC(=S)CCCCCCCCCCCCCC)COC(=S)CCCCCCCCCCCCCC XKIVKIIBCJIWNU-UHFFFAOYSA-N 0.000 description 1
- ZWLPBLYKEWSWPD-UHFFFAOYSA-N o-toluic acid Chemical compound CC1=CC=CC=C1C(O)=O ZWLPBLYKEWSWPD-UHFFFAOYSA-N 0.000 description 1
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 150000001282 organosilanes Chemical class 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 125000003538 pentan-3-yl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 125000005498 phthalate group Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- XUWHAWMETYGRKB-UHFFFAOYSA-N piperidin-2-one Chemical compound O=C1CCCCN1 XUWHAWMETYGRKB-UHFFFAOYSA-N 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 description 1
- 229920006128 poly(nonamethylene terephthalamide) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920000137 polyphosphoric acid Polymers 0.000 description 1
- 229920005673 polypropylene based resin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 150000004032 porphyrins Chemical class 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- 229920001384 propylene homopolymer Polymers 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- GGVMPKQSTZIOIU-UHFFFAOYSA-N quaterrylene Chemical group C12=C3C4=CC=C2C(C2=C56)=CC=C5C(C=57)=CC=CC7=CC=CC=5C6=CC=C2C1=CC=C3C1=CC=CC2=CC=CC4=C21 GGVMPKQSTZIOIU-UHFFFAOYSA-N 0.000 description 1
- TVRGPOFMYCMNRB-UHFFFAOYSA-N quinizarine green ss Chemical compound C1=CC(C)=CC=C1NC(C=1C(=O)C2=CC=CC=C2C(=O)C=11)=CC=C1NC1=CC=C(C)C=C1 TVRGPOFMYCMNRB-UHFFFAOYSA-N 0.000 description 1
- IZMJMCDDWKSTTK-UHFFFAOYSA-N quinoline yellow Chemical compound C1=CC=CC2=NC(C3C(C4=CC=CC=C4C3=O)=O)=CC=C21 IZMJMCDDWKSTTK-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000001175 rotational moulding Methods 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
- 229960001860 salicylate Drugs 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052624 sepiolite Inorganic materials 0.000 description 1
- 235000019355 sepiolite Nutrition 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- RAMNYUMITLZMIC-UHFFFAOYSA-N sodium;3-[[4-[(4-diethylazaniumylidenecyclohexa-2,5-dien-1-ylidene)-[4-[ethyl-[(3-sulfophenyl)methyl]amino]-2-methylphenyl]methyl]-n-ethyl-3-methylanilino]methyl]benzenesulfonate Chemical compound [Na+].C=1C=C(C(=C2C=CC(C=C2)=[N+](CC)CC)C=2C(=CC(=CC=2)N(CC)CC=2C=C(C=CC=2)S([O-])(=O)=O)C)C(C)=CC=1N(CC)CC1=CC=CC(S(O)(=O)=O)=C1 RAMNYUMITLZMIC-UHFFFAOYSA-N 0.000 description 1
- 238000000807 solvent casting Methods 0.000 description 1
- LJFWQNJLLOFIJK-UHFFFAOYSA-N solvent violet 13 Chemical compound C1=CC(C)=CC=C1NC1=CC=C(O)C2=C1C(=O)C1=CC=CC=C1C2=O LJFWQNJLLOFIJK-UHFFFAOYSA-N 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000006277 sulfonation reaction Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- WJCNZQLZVWNLKY-UHFFFAOYSA-N thiabendazole Chemical compound S1C=NC(C=2NC3=CC=CC=C3N=2)=C1 WJCNZQLZVWNLKY-UHFFFAOYSA-N 0.000 description 1
- KUAZQDVKQLNFPE-UHFFFAOYSA-N thiram Chemical compound CN(C)C(=S)SSC(=S)N(C)C KUAZQDVKQLNFPE-UHFFFAOYSA-N 0.000 description 1
- 229960002447 thiram Drugs 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- LMYRWZFENFIFIT-UHFFFAOYSA-N toluene-4-sulfonamide Chemical compound CC1=CC=C(S(N)(=O)=O)C=C1 LMYRWZFENFIFIT-UHFFFAOYSA-N 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- 229920006352 transparent thermoplastic Polymers 0.000 description 1
- 150000003626 triacylglycerols Chemical class 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- OOZBTDPWFHJVEK-UHFFFAOYSA-N tris(2-nonylphenyl) phosphate Chemical compound CCCCCCCCCC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC OOZBTDPWFHJVEK-UHFFFAOYSA-N 0.000 description 1
- NSBGJRFJIJFMGW-UHFFFAOYSA-N trisodium;stiborate Chemical compound [Na+].[Na+].[Na+].[O-][Sb]([O-])([O-])=O NSBGJRFJIJFMGW-UHFFFAOYSA-N 0.000 description 1
- KJPJZBYFYBYKPK-UHFFFAOYSA-N vat yellow 1 Chemical compound C12=CC=CC=C2C(=O)C2=CC=C3N=C4C5=CC=CC=C5C(=O)C5=C4C4=C3C2=C1N=C4C=C5 KJPJZBYFYBYKPK-UHFFFAOYSA-N 0.000 description 1
- GFFQNEGBFFGLQG-UHFFFAOYSA-N vat yellow 2 Chemical compound S1C2=C3C(=O)C4=CC=C5N=C(C=6C=CC=CC=6)SC5=C4C(=O)C3=CC=C2N=C1C1=CC=CC=C1 GFFQNEGBFFGLQG-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
- 229960001763 zinc sulfate Drugs 0.000 description 1
- 229910000368 zinc sulfate Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
- B29C65/1612—Infrared [IR] radiation, e.g. by infrared lasers
- B29C65/1616—Near infrared radiation [NIR], e.g. by YAG lasers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1654—Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1664—Laser beams characterised by the way of heating the interface making use of several radiators
- B29C65/1667—Laser beams characterised by the way of heating the interface making use of several radiators at the same time, i.e. simultaneous laser welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1677—Laser beams making use of an absorber or impact modifier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
- B29C65/5042—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like covering both elements to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/82—Testing the joint
- B29C65/8253—Testing the joint by the use of waves or particle radiation, e.g. visual examination, scanning electron microscopy, or X-rays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/114—Single butt joints
- B29C66/1142—Single butt to butt joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/43—Joining a relatively small portion of the surface of said articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/43—Joining a relatively small portion of the surface of said articles
- B29C66/432—Joining a relatively small portion of the surface of said articles for making tubular articles or closed loops, e.g. by joining several sheets ; for making hollow articles or hollow preforms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/49—Internally supporting the, e.g. tubular, article during joining
- B29C66/496—Internally supporting the, e.g. tubular, article during joining using a support which remains in the joined object
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
- B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/286—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysulphones; polysulfides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B3/18—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by an internal layer formed of separate pieces of material which are juxtaposed side-by-side
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/41—Compounds containing sulfur bound to oxygen
- C08K5/42—Sulfonic acids; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
- B29C66/712—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined the composition of one of the parts to be joined being different from the composition of the other part
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/0005—Condition, form or state of moulded material or of the material to be shaped containing compounding ingredients
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/0079—Liquid crystals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/03—3 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/24—All layers being polymeric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/44—Number of layers variable across the laminate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0261—Polyamide fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0261—Polyamide fibres
- B32B2262/0269—Aromatic polyamide fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0276—Polyester fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/105—Ceramic fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/106—Carbon fibres, e.g. graphite fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/108—Rockwool fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/101—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/102—Oxide or hydroxide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/104—Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/107—Ceramic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/402—Coloured
- B32B2307/4026—Coloured within the layer by addition of a colorant, e.g. pigments, dyes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2419/00—Buildings or parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2439/00—Containers; Receptacles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2439/00—Containers; Receptacles
- B32B2439/40—Closed containers
- B32B2439/60—Bottles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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Abstract
本發明提供一種雷射熔接體及其製造方法,其不需經過複雜步驟,而可使簡便調製之複數樹脂構件藉由一次雷射熔接步驟接合並一體化,而且樹脂構件彼此之接合強度優異,同時不損及樹脂特性。 本發明之雷射熔接體藉由使具有未達0.13之吸光度a1
且為雷射光被照射構件之第1樹脂構件(1)、具有0.1~0.9之吸光度a2
且包含單個或複數個樹脂構件之端部接觸所成之對接部位(B)之第2樹脂構件(2)、及具有0.2~3.8之吸光度a3
之第3樹脂構件(3)之含有熱塑性樹脂的三種樹脂構件中之第2樹脂構件(2)及第3樹脂構件(3)含有雷射光吸收劑,而顯示吸光度a2
、a3
,藉由使各樹脂構件(1)、(2)、(3)重疊而具有接觸部位(C1-2
、C2-3
),且對接部位(B)及/或接觸部位(C1-2
、C2-3
)經雷射熔接。
Description
本發明係關於於端部彼此具有對接部位之樹脂構件與隔個該對接部位使樹脂構件重疊之複數個別樹脂構件同時藉由雷射熔接而一體化之雷射熔接體及其製造方法。
於汽車或如火車般之車輛及電子・電氣機器領域之構造零件,進幾年大多使用輕量之熱塑性樹脂製品替代金屬。作為該等構造零件所使用之熱塑性樹脂,舉例為例如聚酯樹脂、聚醯胺樹脂、聚碳酸酯樹脂等,該等中,以聚對苯二甲酸丁二酯或聚對苯二甲酸乙二酯樹脂為代表之聚酯樹脂或聚醯胺樹脂,由於機械物性、電氣特性、耐熱性、尺寸安定性、其他物理・化學特性優異,故已廣泛使用於車輛零件、電氣・電子機器零件、精密機器零件等。
該各種用途中,尤其於以聚對苯二甲酸丁二酯密封汽車電裝零件(控制單元等)、各種感測器零件、連接器零件等的電路之製品中,聚醯胺樹脂已開展於例如如進氣歧管之具有中空部的製品中。密閉該等電路之製品或具有中空部之製品中,有必須將複數構件接合並密封內部之情況。因此採用各種熔接・密封技術例如使用接著劑之熔接技術,或使用如振動熔接、超音波熔接、熱板熔接、射出熔接及雷射熔接之熔接的接合技術等。
利用接著劑之接合,除了接著劑硬化需要長時間之時間損失以外,亦因接著劑中含有之有機溶劑而污染周圍。且,利用超音波熔接或熱板熔接之接合,由於因振動或熱而使製品損傷或因發生磨耗粉或毛刺而需要後處理,故熔接步驟複雜化。且利用射出熔接之接合,由於需要特殊模具或成形機故為高成本,且不適於使用流動性低的材料之熔接。
雷射熔接係藉由對雷射光吸收性樹脂構件重疊雷射光透過性樹脂構件,使自雷射光透過性樹脂構件側照射之雷射光透過其,到達至雷射光吸收性樹脂構件並吸收而發熱,使兩者樹脂構件熱熔融並熔接而接合者。
作為雷射熔接之優點,舉例為可僅對應接合之部位局部照射雷射光而使樹脂構件熔接,由於係局部發熱故對熔接部位以外之周邊部稍微造成熱影響,而能不產生振動地使具有微細部分或立體上複雜之構造之樹脂構件彼此熔接,再現性高,可維持高的氣密性,接合強度高,於熔接部分之接縫不明顯,及不發生粉塵等。
依據雷射熔接,可使樹脂構件確實熔接並將該等接合。進而,可獲得與藉由緊固用零件(螺栓、螺釘、彈夾等)之緊固,或藉由接著劑、振動熔接及超音波熔接等方法之接合同等以上之接合強度。而且雷射熔接由於不產生振動而可將熱的影響抑制為最小限度,故可實現省力化、生產性之改良及製造成本之降低等。因此雷射熔接於例如汽車產業或電氣・電子產業等中,適於應避免振動或熱的影響之工能零件或電子零件等之接合,並且可對應於複雜形狀之樹脂零件的接合。
作為有關雷射熔接之技術,於專利文獻1中,記載有將雷射光透過性樹脂構件與添加有吸收雷射光之碳黑的雷射光吸收性樹脂構件重疊後,自雷射光透過性零件側照射雷射光而使兩樹脂構件熔接並接合之方法。
專利文獻2中,記載將熱塑性樹脂構件A及B與具有紅外線透過部之散熱材C以C/A/B之位置關係之方式予以接觸,自散熱材C側照射紅外線之雷射熔接方法。依據該方法,熱塑性樹脂構件A及B可以同種熱塑性樹脂成形。然而該雷射熔接方法於調整雷射熔接時之發熱時,必須特殊的散熱材C。此將使雷射熔接步驟複雜化。
專利文獻3中,記載將透過雷射光之樹脂構件與吸收雷射光之樹脂構件個別中作為替代熔接而預先形成之接合凸緣部彼此對接,自透過雷射光之樹脂構件之接合凸緣部側照射雷射光而使兩樹脂構件彼此暫時熔接後,對接合凸緣部再次實施照射雷射光之正式熔接使兩樹脂構件一體化之雷射熔接方法。依據該雷射熔接方法,由於複數次雷射照射步驟使步驟數增加,故拉長利用熔接之樹脂構件的接合步驟,而增高樹脂構件之製造成本。 [先前技術文獻] [專利文獻]
[專利文獻1] 日本特公昭62-049850號公報 [專利文獻2] 國際公開2003/039843號 [專利文獻3] 日本特開2004-351730號公報
[發明欲解決之課題]
本發明係為解決前述課題而完成者,目的在於提供不需經過複雜步驟,而可使簡便調製之複數樹脂構件藉由一次雷射熔接步驟接合並一體化,而且樹脂構件彼此之接合強度優異,同時不損及樹脂特性之雷射熔接體及其製造方法。 [用以解決課題之手段]
本發明之發明人等發現到如下事實:藉由對於以隔著吸收並透過雷射光且調整為特定吸光度之雷射光弱吸收性樹脂構件之方式使複數樹脂構件重疊之多層樹脂構件照射雷射光,而可於包含雷射光弱吸收性樹脂構件之熔接部位引起大且深的熔融現象。藉此本發明人等完成了本發明,其與將雷射光透過性樹脂構件與雷射光吸收性樹脂構件熔接之以往雷射熔接相比,可獲得樹脂構件彼此更遠遠強固地接合之雷射熔接體。
為了達成前述目的之本發明之雷射熔接體係藉由使具有未達0.13之吸光度a1
且為雷射光被照射構件之第1樹脂構件、具有0.1~0.9之吸光度a2
且包含單個或複數個樹脂構件之端部接觸所成之對接部位之第2樹脂構件、及具有0.2~3.8之吸光度a3
之第3樹脂構件之含有熱塑性樹脂的至少三種樹脂構件中之前述第2樹脂構件及前述第3樹脂構件含有雷射光吸收劑,而顯示前述吸光度a2
及a3
,藉由依此順序使前述樹脂構件重疊而於該等之界面具有接觸部位,且前述對接部位及/或前述接觸部位之至少一部分經雷射熔接。
雷射熔接體舉例為例如前述第2樹脂構件具備各具有吸光度a2f
及吸光度a2s
之2種前述樹脂構件,前述吸光度a2f
與前述吸光度a2s
之吸光度比a2f
/a2s
為0.3~1.2者。
雷射熔接體亦可前述吸光度a1
為0.01~0.09者。
雷射熔接體亦可前述第1樹脂構件含有與前述雷射光吸收劑相同或不同之雷射光吸收劑者。
雷射熔接體舉例為例如前述熱塑性樹脂係選自聚醯胺樹脂、聚碳酸酯樹脂、聚苯硫醚樹脂、聚對苯二甲酸乙二酯樹脂、聚對苯二甲酸丁二酯樹脂及聚丙烯樹脂中之至少一者。
雷射熔接體較好前述第1樹脂構件包含蒽醌染料。
雷射熔接體亦可前述雷射光吸收劑為苯胺黑(nigrosine)。
雷射熔接體較好前述苯胺黑之體積電阻率為0.5×109
~5.0×1011
Ω・cm。
雷射熔接體亦可前述苯胺黑為苯胺黑硫酸鹽。
本發明之雷射熔接體之製造方法係使吸光度a2
為0.1~0.9之單個或複數個樹脂構件的端部接觸,形成對接部位,使吸光度a1
為0.01~0.12之第1樹脂構件、具有前述樹脂構件之第2樹脂構件、與吸光度a3
為0.2~3.8之第3樹脂構件之至少三者重疊,於前述第1~第3樹脂構件之界面形成接觸部位,自前述第1樹脂構件側對前述對接部位及/或前述接觸部位照射雷射光,而使前述對接部位及/或前述接觸部位之至少一部分熔接。 [發明效果]
本發明之雷射熔接體由於藉由使第1樹脂構件之雷射光透過性樹脂構件、第2樹脂構件之包含對接部位之雷射光弱吸收性樹脂構件及第3樹脂構件之雷射光吸收性樹脂構件重疊並雷射熔接者,故藉由苯胺黑使於接受雷射光照射時熱熔融而顯示高流動性之第2樹脂構件之對接部位為起點,適度擴大熔接部位,而於對接部位及/或各樹脂構件間強固接合。
於雷射熔接體中,由於第1~第3樹脂構件係依此順序重疊,故應接合之部位的對接部位及接觸部位不存在於表層,於表現未顯現熔接痕,故獲得優異設計性。如此之雷射熔接體由於第1及第3樹脂構件隔著具有對接部位之第2樹脂構件,故具有高的接合強度。再者該情況下,由於接觸部位與對接部位可同時熔接,故該等部位確實熔接,結果雷射熔接體具有高的密封性。
以下,針對用以實施本發明之形態詳細說明,但本發明之範圍並非限定於該等形態。又本說明書中,所謂「~」係包含其前後所記載之數值作為下限值及上限值之意義而使用。
顯示製造本發明之雷射熔接體之一例的中途之示意剖面圖示於圖1。雷射熔接體10係複數樹脂構件彼此藉由雷射熔接而接合使該等樹脂構件一體化者。該雷射熔接體10係將第1樹脂構件之雷射光透過性樹脂構件1、第2樹脂構件之具有樹脂構件片2f及樹脂構件片2s的雷射光弱吸收性樹脂構件2及第3樹脂構件的雷射光吸收性樹脂構件3依此順序重疊而成者。各樹脂構件1、2、3成為具有均一厚度之平坦板狀。各樹脂構件1、2、3包含熱塑性樹脂,雷射光弱吸收性樹脂構件2及雷射光吸收性樹脂構件3含有苯胺黑作為雷射光吸收劑。
雷射光弱吸收性樹脂構件2中,同種或不同種樹脂構件的兩樹脂構件片2f、2s形成該等端部彼此接觸之對接部位B並排列。雷射光透過性樹脂構件1與雷射光弱吸收性樹脂構件2之界面係與對接部位B一起經雷射熔接之接觸部位C1-2
。且,雷射光弱吸收性樹脂構件2與雷射光吸收性樹脂構件3之界面係與對接部位B一起經雷射熔接之接觸部位C2-3
。
雷射光透過性樹脂構件1係配置於雷射光L照射側的雷射光被照射構件。雷射光透過性樹脂構件1之吸光度a1
對於例如自半導體雷射出射之具有940nm波長區域之雷射光,最大亦未達0.13,而為0.01~0.12,較好為0.01~0.1,更好為0.01~0.098,又更好為0.01~0.09。因雷射光吸收劑而更提高發熱量時,吸光度a1
較好為0.05~0.12,更好為0.05~0.1,又更好為0.07~0.098,再更好為0.07~0.09。雷射光弱吸收性樹脂構件2中,兩樹脂構件片2f、2s之各自吸光度a2f
及吸光度a2s
較好為0.1~0.9,更好為0.1~0.8。吸光度a2f
與吸光度a2s
之吸光度比a2f
/a2s
較好為0.3~1.2,更好為0.7~1.2。雷射光吸收性構件3之吸光度a3
較好為0.2~3.8,更好為0.2~3.5。較好藉由使雷射光弱吸收性樹脂構件2含有比雷射光吸收性樹脂構件3更少量的苯胺黑,而具有比雷射光吸收性樹脂構件3更低之吸光度。且雷射光L的波長較好為800~1600nm,更好為800~1100nm。
如此,藉由使各樹脂構件1、2、3之各吸光度a1
、a2
、a3
階段性轉變,可將起因於自雷射光透過性樹脂構件1入射之雷射光L而產生之各樹脂構件1、2、3之發熱量階段性增大。具體而言,藉由使a1
與a2
在上述範圍內,可於雷射光吸收性樹脂構件1與雷射光弱吸收性樹脂構件2之界面(接觸部位C1-2
)增大發熱量,可促進該等樹脂構件間之熔接。又,藉由使a2
與a3
在上述範圍內,即使於到達至雷射光吸收性樹脂構件3之前雷射光L被雷射光弱吸收性樹脂構件2吸收,於雷射光弱吸收性樹脂構件2與雷射光吸收性樹脂構件3之界面(接觸部位C2-3
)亦可充分發熱,並確實熔接,可使該等樹脂構件間接合。
尤其,藉由使雷射光弱吸收性樹脂構件2具有上述範圍之吸光度a2及含有苯胺黑,而可充分發熱,並且該熱可於雷射光弱吸收性樹脂構件2之面方向及厚度方向迅速擴散。其結果,雷射光弱吸收性樹脂構件2於廣範圍熔融而於接觸部位C1-2
、C2-3
熔接於雷射光吸收性樹脂構件1及雷射光吸收性樹脂構件3。因此,並雷射光L無必要沿著對接部位B僅以一直線(圖1中深入方向)照射,可擴大雷射光照射範圍之選擇性,而且不會發生因雷射光L之能量集中引起之燒焦或孔洞。如此之雷射熔接體10之各樹脂構件1、2、3由於藉由高接合力接合,故例如雷射熔接體10之拉伸強度(依據JIS K7161:2014)顯示至少700N。
由於雷射光透過性樹脂構件1的作為原料而含有之熱塑性樹脂的吸光度低,故雷射光透過性樹脂構件1之雷射光透過率過高,而難以藉雷射光L之入射產生使雷射光透過性樹脂構件1熔接而必要之發熱時,亦可於用以形成其之雷射光透過性樹脂組成物中,添加如苯胺黑之雷射光吸收劑。藉此可獲得上述吸光度a1
。又,a1
為0.07~0.09時,使用聚醯胺樹脂之雷射光透過性樹脂構件1時,波長940nm之雷射光L的透過率為70%以上。
雷射光弱吸收性樹脂構件2邊使透過雷射光透過性樹脂構件1並入射之雷射光L的一部分透過,邊吸收其他一部分並發熱。藉此雷射光弱吸收性樹脂構件2熔融並且該熱輻射及傳導並擴及各接觸部位C1-2
、C2-3
而使該等熔融。於雷射光弱吸收性樹脂構件2產生之熱輻射及熱傳導時,雷射光吸收性樹脂構件3藉由吸收透過雷射光透過性樹脂構件1及雷射光弱吸收性樹脂構件2並入射之雷射光L而發熱,尤其於接觸部位C2-3
熔融。結果各接觸部位C1-2
、C2-3
強固熔接。
各樹脂構件1、2、3及雷射光弱吸收性樹脂構件2中之兩樹脂構件片2f、2s之吸光度,可基於源自該等原料樹脂之吸光度,藉由適當增減例如如苯胺黑之雷射光吸收劑添加於原料樹脂中之量,而可侷限於上述範圍內之值。
雷射熔接體10係如圖2所示,將第2樹脂構件的雷射光弱吸收性樹脂構件2於4個部位均往下折或往上折而直角彎折或成形,而具有該等端部彼此對接並接觸之對接部位B。
且雷射光L不僅朝向對接部位B照射,亦可例如如圖2所示,於雷射光透過性樹脂構件1之照射面上,雷射光L除了沿著對接部位B之X方向(圖2中,深入方向)以外,亦於與其正交之Y方向(圖2中,左右方向)邊掃描邊於廣範圍照射。且,亦可藉由於雷射光透過性樹脂構件1之全面照射雷射光L,使雷射光吸收性樹脂構件1與雷射光弱吸收性樹脂構件2之界面的接觸部位C1-2
及雷射光弱吸收性樹脂構件2與雷射光吸收性樹脂構件3之界面的接觸部位C2-3
全面熔接。
且雷射熔接體10亦可如圖3(a)所示,作成圓筒形。兩樹脂構件片2f、2s係以拱形彎曲或成形,於該等之端部彼此對接。藉此雷射光弱吸收性樹脂構件2成為具有兩個對接部位B1
、B2
(參考圖2(b))之圓筒形。雷射光弱吸收性樹脂構件2插入至具有內徑稍大於其外徑之雷射光吸收性樹脂構件1內。且於雷射光弱吸收性樹脂構件2中插入具有外徑稍小於其內徑之雷射光吸收性樹脂構件3。
圖3(b)顯示圖3(a)之前視圖。雷射光L以夾住各樹脂構件1、2、3而對向之方式照射。藉此於各對接部位B1
、B2
、位於該雷射光吸收性樹脂構件1側之接觸部位C1-2
、及位於該雷射光吸收性樹脂構件3側之接觸部位C2-3
,各樹脂構件1、2、3熔接並接合。又,雷射光L邊自一部位照射,邊使圓筒形之各樹脂構件1、2、3繞該等之中心軸旋轉,亦可使各對接部位B1
、B2
及接觸部位C1-2
、C2-3
熔接。
雷射熔接體10不限定於圖1~3所示之形狀,亦可成為彎曲或彎折之捲筒狀、圓筒狀、角柱狀或箱狀。再者,亦可例如雷射光弱吸收性樹脂構件2及雷射光吸收性樹脂構件3以雷射光吸收性樹脂構件1覆蓋,形成雷射光吸收性樹脂構件1與雷射光吸收性樹脂構件3之接觸部位C1-3
後,對雷射光吸收性樹脂構件1全面照射雷射光L,除了使對接部位B或接觸部位C1-2
、C2-3
熔接以外,亦可使接觸部位C1-3
熔接。
作為此等雷射熔接體10之具體製造方法,可舉例為第1~第3製造方法。第1製造方法係使各樹脂構件1、2、3重疊後藉一次雷射熔接步驟使該等熔接・接合者。第2製造方法係使構成雷射光弱吸收性樹脂構件2之兩樹脂構件片2f、2s雷射熔接並接合,以雷射光吸收性樹脂構件1與雷射光吸收性樹脂構件3將其夾住後進行雷射熔接,使各樹脂構件1、2、3接合者。第3製造方法係使不具有樹脂構件片之單一雷射光弱吸收性樹脂構件2彎折成圓,將該等端部彼此對接形成對接部位B,以夾住對接部位B之方式使雷射光吸收性樹脂構件1與雷射光吸收性樹脂構件3重疊進行雷射熔接,而使各樹脂構件1、2、3接合者。首先針對第1及第2製造方法,參照圖1加以說明。
(第1製造方法) 第1製造方法具有以下步驟1A~1E。 步驟1A:調製至少包含熱塑性樹脂及根據需要包含雷射光吸收劑或如著色劑之添加劑之雷射光透過性樹脂組成物。其次使用成形機,將配置於雷射光入射側之雷射光透過性樹脂構件1成形為例如矩形之板狀。雷射光透過性樹脂構件1於例如940nm之半導體雷射之波長區域之吸光度a1
最大亦未達0.13,而為0.01~0.12,較好為0.01~0.1,更好為0.01~0.098,又更好為0.01~0.09。因雷射光吸收劑而更提高發熱量時,吸光度a1
為0.05~0.12,更好為0.05~0.1,又更好為0.07~0.098,再更好為0.07~0.09。
步驟1B:調製至少包含熱塑性樹脂及雷射光吸收劑,且根據需要包含如著色劑之添加劑之雷射光弱吸收性樹脂組成物。雷射光吸收劑之含量,係調整為基於該熱塑性樹脂本來具有之吸光度,將例如940nm之半導體雷射之波長區域之兩樹脂構件片2f、2s的吸光度a2f
、a2s
均侷限於0.1~0.9之範圍內。其次使用成形機,將成為雷射光弱吸收性樹脂構件2之兩樹脂構件片2f、2s成形為例如矩形之板狀。兩樹脂構件片2f、2s可分別由同種或不同的雷射光弱吸收性樹脂組成物成形。
步驟1C:調製至少包含熱塑性樹脂及雷射光吸收劑,且根據需要包含如著色劑之添加劑之雷射光吸收性樹脂組成物。雷射光吸收劑及雷射光吸收劑之含量,係調整為基於該熱塑性樹脂本來具有之吸光度,將例如940nm之半導體雷射之波長區域之雷射光吸收性樹脂構件3的吸光度a3
侷限於0.2~3.8之範圍內。其次使用成形機,將雷射光吸收性樹脂構件3成形為例如矩形之板狀。
步驟1D:將兩樹脂構件片2f、2s之端部彼此對接接觸形成對接部位B,作成雷射光弱吸收性樹脂構件2。將雷射光透過性樹脂構件1、雷射光弱吸收性樹脂構件2及雷射光吸收性樹脂構件3依此順序重疊。藉此以雷射光透過性樹脂構件1及雷射光吸收性樹脂構件3夾住雷射光弱吸收性樹脂構件2,使該等抵接。此時,亦可以治具夾住各樹脂構件1、2、3並加壓及固定。亦可進而於雷射光透過性樹脂構件1之雷射光L之入射側之面,配置如玻璃板或抗反射膜之具有抗反射功能之構件,或不會遮避雷射光或使其衰減之如玻璃板之透過性構件。且亦可對雷射光之入射側之面施以吹附低溫或室溫的空氣或惰性氣體之冷卻處理。又,雷射熔接時,各樹脂構件1、2、3及兩樹脂構件片2f、2s產生氣體時,亦可使用氣體處理裝置對其進行處理。
步驟1E:自雷射光透過性樹脂構件1側,將調整為適當條件之雷射光L朝向對接部位B照射。雷射光L之一部分透過雷射光透過性樹脂構件1。又另一部分被雷射光透過性樹脂構件1稍微吸收,而使接觸部位C1-2
發熱。所透過之一部分雷射光L到達至對接部位B附近,被兩樹脂構件片2f、2s吸收,於對接部位B附近引起發熱。藉此,兩樹脂構件片2f、2s於對接部位B附近熔融。該熔融部位擴展至位於對接部位B正上方之接觸部位C1-2
與位於對接部位B正下方之接觸部位C2-3
,並自其擴展至接觸部位C1-2
及接觸部位C2-3
全體。所透過之一部分雷射光L邊熱傳導或熱輻射邊被雷射光吸收性樹脂構件3吸收,於雷射光吸收性樹脂構件3之接觸部位C2-3
引起發熱並熔融。使發熱・熔融之對接部位B及接觸部位C1-2
、C2-3
冷卻,使該等固化並熔接。其結果,雷射光透過性樹脂構件1、雷射光弱吸收性樹脂構件2及雷射光吸收性樹脂構件3於對接部位B及接觸部位C1-2
、C2-3
強固地接合並一體化。
又,各樹脂構件1、2、3及兩樹脂構件片2f、2s之形狀除如圖1所示之複數且具有均一厚度之平坦板以外,亦可為單一膜,亦可為彎曲或彎折之捲筒狀、圓筒狀、角柱狀、箱狀之單一種或複數種之以雷射光弱吸收性樹脂組成物形成,可成為實用之任意形狀。該等可使用模具成形。且,各樹脂構件1、2、3及兩樹脂構件片2f、2s中,如對接部位B及接觸部位C1-2
、C2-3
之相互對接、重疊、對向、抵接、接觸之部位的形狀可採取任意形狀。例如,可於重疊之部位設有接頭之階差。
(第2製造方法) 第2製造方法具有下述步驟2A~2E。 步驟2A~2C與第1製造方法之步驟1A~1C相同。 步驟2D:將兩樹脂構件片2f、2s之端部彼此對階接觸形成對階部位B。此時,亦可藉由將兩樹脂構件片2f、2s收納於治具中而夾住固定。且兩樹脂構件片2f、2s中,於重疊雷射光透過性樹脂構件1之面亦可配置如玻璃板或抗反射膜之具有抗反射功能之構件或不會遮蔽雷射光或使其衰減之如玻璃板之透過性構件。且於雷射光L之入射側之面亦可施以吹附低溫或室溫的空氣或惰性氣體之冷卻處理。朝向對接部位B照射雷射光L。雷射光L於對接部位B被兩樹脂構件片2f、2s吸收。藉此兩樹脂構件片2f、2s於對接部位B附近熔融。使該熔融部位冷卻,使對接部位B固化並熔接,將兩樹脂構件片2f、2s接合。藉此獲得雷射光弱吸收性樹脂構件2。又,雷射熔接時,各樹脂構件1、2、3及兩樹脂構件片2f、2s產生氣體時,亦可使用氣體處理裝置對其進行處理。
步驟2E:將雷射光透過性樹脂構件1、雷射光弱吸收性樹脂構件2及雷射光吸收性樹脂構件3依此順序重疊並使該等彼此抵接。自雷射光透過性樹脂構件1側,將調整為適當條件之雷射光L朝向對接部位B照射。藉此與步驟1E同樣,使各樹脂構件1、2、3於對接部位B及接觸部位C1-2
、C2-3
強固地接合並一體化。
(第3製造方法) 參照圖2說明第3製造方法。圖2係顯示製造雷射熔接體10之另一例的中途之示意剖面圖。第3製造方法具有下述步驟3A~3E。 步驟3A及3C分別與第1製造方法中之步驟1A及1C相同。 步驟3B:作為雷射光弱吸收性樹脂構件2用,調製至少包含熱塑性樹脂及雷射光吸收劑,且根據需要可含有如著色劑之添加劑之雷射光弱吸收性樹脂組成物。雷射光吸收劑之含量,係調整為基於該熱塑性樹脂本來具有之吸光度,將例如940nm之半導體雷射之波長區域之雷射光弱吸收性樹脂構件2的吸光度a2
侷限於0.1~0.9之範圍內。其次使用成形機,將雷射光弱吸收性樹脂構件2成形為例如矩形之板狀。雷射光弱吸收性樹脂構件2於4個部位均往下折或往上折而直角彎折使該等端部彼此對接並接觸而形成對接部位B。藉此將雷射光弱吸收性樹脂構件2成形為筒狀之四角柱形。
步驟3D:將雷射光透過性樹脂構件1與雷射光吸收性樹脂構件3以抵接於對接部位B之方式,分別於雷射光弱吸收性樹脂構件2之外側面抵接雷射光透過性樹脂構件1,於其內側面抵接雷射光吸收性樹脂構件3。藉此,於成為筒狀四角柱形之雷射光弱吸收性樹脂構件2之一部分,使雷射光透過性樹脂構件1、雷射光弱吸收性樹脂構件2與雷射光吸收性樹脂構件3依此順序重疊。
步驟3E:自雷射光透過性樹脂構件1側,將調整為適當條件之雷射光L朝向對接部位B照射。亦可根據需要掃描雷射光L。藉此與步驟1E同樣,使各樹脂構件1、2、3於對接部位B及接觸部位C1-2
、C2-3
強固地接合並一體化。
圖2中雖舉將雷射光弱吸收性樹脂構件2作成筒狀四角柱形之例,但不限於此,亦可為各樹脂構件1、2、3之形狀係彎曲或彎折之捲筒狀、圓筒狀、角柱狀、箱狀之單一種或複數種之以雷射光弱吸收性樹脂組成物形成,可成為實用之任意形狀。該等可使用模具成形。且,各樹脂構件1、2、3及兩樹脂構件片2f、2s中,如對接部位B及接觸部位C1-2
、C2-3
之相互對接、重疊、對向、抵接、接觸之部位的形狀可採取任意形狀,例如,可於重疊之部位設有接頭之階差。
第1~第3製造方法中,藉由雷射光L之一次照射,除了進行於對接部位B之對接熔接與接觸部位C1-2
、C2-3
之聚合熔接以外,亦可藉由對不同位置照射複數次雷射光L,邊掃描邊照射,而對各樹脂構件1、2、3彼此之界面全體施以聚合熔接。若如此,則可依各段提高雷射熔接體10之接合強度。
此等雷射熔接體10係第1樹脂構件的雷射光透過性樹脂構件1、第2樹脂構件的具有至少一個對接部位B之雷射光弱吸收性樹脂構件2及第3樹脂構件的雷射光吸收性樹脂構件3依此順序重疊之三層雷射熔接體。各樹脂構件1、2、3為相同色調或相同色系時,可獲得該等之界面或熔接痕不明顯而富含設計性之雷射熔接體10。色調較好為深色,尤其較好為黑色色調。該情況下,較好至少於形成第1樹脂構件的雷射光透過性樹脂構件1的熱塑性樹脂中添加含有蒽醌之著色劑,更好添加含有蒽醌藍色染料與紅色染料與黃色染料之著色劑。
作為雷射光,可使用比可見光更長波長區域的800~1600nm的紅外光線,較佳使用於800~1100nm具有激振波長之雷射光。例如可較好地使用固體雷射(Nd:YAG激發、半導體雷射激發等)、半導體雷射、可調變雷射二極體、鈦藍寶石(Nd:YAG激發)。又此外,亦可使用產生700nm以上波長之紅外線的鹵素燈或氙氣燈。且雷射光之照射角度對於雷射光弱吸收性樹脂構件2之面,可為自垂直方向亦可為自傾斜方向照射,亦可自一方向或複數方向照射。雷射光之輸出係根據各樹脂構件1、2、3之吸光度而適當調整。
使用產生700nm以上波長之紅外線的鹵素燈時,例如作為燈形狀,可舉例以帶狀配置燈者。作為照射態樣,舉例為例如藉由移動燈照射部而可於廣範圍照射雷射光之掃描類型、同樣使應熔接之構件移動之遮蔽類型、自多方面對應融接之構件同時照射燈之類型等。且照射可適當調整紅外線之照射寬度、照射時間、照射能量等而進行。鹵素燈由於具有以紅外線區域為中心之能量分佈,故於其能量分佈之短波長側亦即可見光區域存在有能量。此等情況下,由於有對入射之構件表面產生熔接痕之情況,故亦可使用截止膜等遮斷可見光區域之能量。
各樹脂構件1、2、3之厚度較好落於200~5000μm之範圍。厚度未達200μm時雷射光能量難以控制,雷射熔接時,產生熱熔融之過與不足,因過熱而斷裂或因熱不足而難以獲得充分接著強度。另一方面,厚度超過5000μm時,由於距離應熔接部位之距離長,故入射至雷射光弱吸收性樹脂構件2之雷射光無法透過至其內部即衰減,而無法獲得充分接合強度。
作為各樹脂構件1、2、3中含有之雷射光吸收劑舉例為苯胺黑(nigrosine)及其衍生物、苯胺黑(aniline black)、酞青素、茶酞青、卟啉、氰系化合物、苝、二異喹啉(quaterrylene)、偶氮系金屬錯合物、近紅外線吸收性之蒽醌、芳酸衍生物及亞銨染料等。其中,較好為苯胺黑及其衍生物。雷射光吸收劑之吸收係數εd
(ml/g・cm)為1000~8000(ml/g・cm),較好為1000~6000(ml/g・cm),更好為3000~6000(ml/g・cm)。
吸收係數(吸光係數)εd
之測定方法係精秤雷射光吸收劑0.05g,使用50ml量瓶,溶於例如溶劑N,N-二甲基甲醯胺(DMF)後,使用50ml量瓶將其1ml以DMF稀釋作成測定樣品,使用分光光度計(島津製作所股份有限公司製,商品名:UV1600PC),進行吸光度測定。
熱塑性樹脂之著色係基於裝飾效果、分色效果、成形品之耐光性提高、內容物之保護或隱蔽等之目的而進行。產業界中最重要者係黑色著色。且基於對樹脂之分散性或與樹脂之相溶性良好,宜為利用油溶性染料之著色。其中,較好為可使用作為黑色著色劑亦可作為雷射光吸收劑使用且可獲得更高接合強度之苯胺黑。
作為苯胺黑舉例為如作為C.I.溶劑黑5及C.I.溶劑黑7而記載於色彩指數之黑色嗪系縮合混合物。此等苯胺黑,可藉由將例如苯胺、苯胺鹽酸鹽及硝基苯在氯化鐵存在下,於反應溫度160~180℃下氧化及脫水縮合而合成。基於提高熱塑性樹脂之流動性之觀點,更好為C.I.溶劑黑5。
苯胺黑之體積電阻率較好為0.5×109
~5.0×1011
Ω・cm,更好為3.0×109
~1.0×1011
Ω・cm。經過去除無機鹽等雜質之純化步驟後之苯胺黑由於不會使各樹脂構件1、2、3之原料的樹脂組成物物性降低,故可較好地使用。含有顯示高體積電阻率之苯胺黑的材料可較好地廣泛使用於如電氣・電子機器零件或精密機器零件之需要高絕緣性之零件。又,苯胺黑之體積電阻率係如下求得。對量取一定量苯胺黑之試料施加200kgf荷重使緊固,求出該試料體積。其次以數位超高電阻/微少電流計(ADC股份有限公司製,商品名:8340A)測定該試料。
苯胺黑較好為硫酸鹽。苯胺黑硫酸鹽由於具有作微流動性提升劑、表面光澤提升劑及結晶化溫度降低劑之作用,故提高雷射熔接時之樹脂組成物流動性。
依據使用氯化鐵作為觸媒之苯胺黑的生成反應系,由於在氯化鐵或過量鹽酸存在下進行反應,故生成苯胺黑鹽酸鹽。由苯胺黑鹽酸鹽獲得苯胺黑硫酸鹽時,若為將苯胺黑中構成鹽之氯化物離子之全部或相當部分取代為硫酸離子,則未特別限制,而可使用習知方法。又,苯胺黑硫酸鹽為屬於C.I.溶劑黑5之油溶性黑色染料,而非屬於C.I.酸性黑2之水溶性黑色染料。
製造苯胺黑硫酸鹽時,具體而言舉例為例如將苯胺黑分散於稀硫酸中,並適度加熱(例如50~90℃)之方法。又例如藉由將製造苯胺黑所得之縮合反應液分散於稀硫酸中,並適度加熱(例如50~90℃)而製造。例如以不引起磺化之方式,邊將反應液溫度調節於低溫邊將苯胺黑溶解於濃硫酸者添加於大量冰水中析出結晶而製造。
苯胺黑硫酸鹽藉由將硫酸(離子)濃度為0.3~5質量%,較好0.3~3.5質量%,而使熱塑性樹脂之結晶溫度降低效果變大,故而可以簡便且穩定地進行雷射熔接。
作為此等苯胺黑,市售有東方化學工業股份有限公司製之商品名NUBIAN BLACK系列。
又,調整吸光度之如苯胺黑之雷射光吸收劑之含量,於雷射光弱吸收性樹脂構件2中,相對於熱塑性樹脂,為0.01~0.5質量%。具體而言,雷射光弱吸收性樹脂構件2(樹脂構件片2f、2s)中含有之熱塑性樹脂為聚醯胺樹脂、聚碳酸酯樹脂或聚丙烯樹脂時,雷射光吸收劑之含量為0.001~0.5質量%,更好為0.002~0.2質量%。且該熱塑性樹脂為聚對苯二甲酸丁二酯樹脂或聚苯硫醚樹脂時,雷射光吸收劑之含量較好為0.001~0.2質量%。該含量未達下限時,吸收雷射光能量之各樹脂構件1、2、3之發熱量過少,故由此未充份升溫,而使對接部位B或接觸部位 C1-2
、C2-3
之接合強度不足。又,含量超過0.3質量%時,雷射光透過率過度降低,而發生各樹脂構件1、2、3彼此之熔接強度降低、因能量過量而發生熔接痕・燒焦之發生般之熔接不良。
且,苯胺黑具有對樹脂構件表面賦予高光澤、對熱塑性樹脂作為結晶化溫度降低劑、流動性提升劑、及表面光澤提升劑之作用。雷射光弱吸收性樹脂構件2之熔融流動速率較好為10~50g/10分鐘,更好為11~30g/10分鐘。進而雷射光弱吸收性樹脂構件2由於含有苯胺黑硫酸鹽,故與含有苯胺黑鹽酸鹽之樹脂構件相比,具有較低結晶化溫度。因此接受雷射光L之入射而熱熔融之雷射光弱吸收性樹脂構件2由於富含流動性,故例如即使對接部位B或接觸部位C具有起因於各樹脂構件1、2、3之表面粗糙度之空隙而形成時,該等空隙亦因熱熔融之雷射光弱吸收性樹脂構件2流入而將其確實塞住之結果,使各樹脂構件1、2、3強固熔接。如此之雷射光弱吸收性樹脂構件1之熔融流動速率較好為11~30g/10分鐘,更好為12~20g/10分鐘,又更好為13~18g/10分鐘。
雷射光吸收性樹脂構件3之0.2~3.8的吸光度a3
(例如940nm的半導體雷射之波長區域),與習知雷射光吸收性樹脂構件相比係較低。藉由使吸光度a3
為該範圍,雷射光吸收性樹脂構件3不會因透過雷射光弱吸收性樹脂構件2(樹脂構件片2f、2s)之雷射光,而產生急遽且過度發熱。該吸光度a3
係基於原料樹脂所含之熱塑性樹脂本來具有之吸光度,調節雷射光吸收劑或如苯胺黑之雷射光吸收劑之含量而調節。含量具體而言較好為0.03~2質量%,更好為0.04~0.8質量%。雷射光吸收性樹脂構件3亦可根據需要,含有少量之碳黑作為雷射光吸收劑。
雷射光弱吸收性樹脂構件2之吸光度a2
與雷射光吸收性樹脂構件3之吸光度a3
之值,可根據用途、目的及雷射工法之環境適當選擇。又本說明書中,雷射光弱吸收性樹脂構件2之吸光度a2
與雷射光吸收性樹脂構件3之吸光度a3
由於重疊,故基於區別兩樹脂構件2、3之目的,而表示為雷射光弱吸收性樹脂構件2及雷射光吸收性樹脂構件3。吸光度之理論定義中,顯示雷射光不透過之吸光度為2.0。另一方面具有0.2以上且未達2.0之吸光度的樹脂構件顯示雷射光透過性。
於雷射光弱吸收性樹脂構件2之吸光度a2
(0.1~0.9)之範圍內,數值越高(0.5~0.9),雷射光弱吸收性樹脂構件2越顯示高的發熱力,而提高該等之熱傳導力。該情況,產生雷射光透過性降低之現象。因此,藉由適當調整雷射光吸收性樹脂構件3之吸光度a3
,可調節兩樹脂構件2、3之發熱量。另一方面,吸光度a2
之數值越低(0.1~0.5),雷射光弱吸收性樹脂構件2的發熱力越低,其熱傳導力降低。該情況下,產生雷射光之透過性提高之現象。因此,藉由適當調整雷射光吸收性樹脂構件3之吸光度a3
,可調節發熱量或掃描時間或照射能量,而可穩定地進行雷射熔接。
該各樹脂構件1、2、3中所含之熱塑性樹脂若為可含有雷射光吸收劑者,則未特別限定。
作為此等熱塑性樹脂舉例為例如具有雷射光透過性且作為顏料之分散劑使用之樹脂、作為母批次或著色顆粒之載體樹脂使用之樹脂。更具體而言,舉例為聚苯硫醚樹脂(PPS)、聚醯胺樹脂(尼龍(註冊商標),PA)、如聚乙烯樹脂或聚丙烯樹脂之聚烯烴系樹脂、聚苯乙烯樹脂、聚甲基戊烯樹脂、甲基丙烯酸樹脂、丙烯基聚醯胺樹脂、乙烯乙烯醇(EVOH)樹脂、聚碳酸酯樹脂、如聚對苯二甲酸乙二酯(PET)樹脂或聚對苯二甲酸丁二酯(PBT)樹脂之聚酯樹脂、聚縮醛樹脂、聚氯乙烯樹脂、聚偏氯乙烯樹脂、聚苯醚樹脂、聚丙烯酸酯樹脂、聚烯丙基碸樹脂、氟樹脂及液晶聚合物等。
該熱塑性樹脂較好為聚醯胺樹脂、聚碳酸酯樹脂、聚丙烯樹脂、聚對苯二甲酸丁二酯樹脂、聚苯硫醚樹脂。其中,基於顯示與如苯胺黑之雷射光吸收劑之良好相溶性之觀點,更好為聚醯胺樹脂及聚碳酸酯樹脂。
本發明中之聚醯胺樹脂係其分子中具有酸醯胺基(-CONH-)且可加熱熔融之聚醯胺聚合物。較好係含有自由脂肪族二胺與芳香族二羧酸所成之鹽及由芳香族二胺與脂肪族二羧酸所成之鹽選出之至少一種作為構成單位(a)之聚醯胺樹脂。聚醯胺樹脂全部構成單位中之前述構成單位(a)的比例較好為30莫耳%以上,更好為40莫耳%以上。更具體而言,舉例為內醯胺聚縮合物、二胺與二羧酸之聚縮合物、ω-胺基羧酸之聚縮合物等之各種聚醯胺樹脂,或該等之共聚合聚醯胺樹脂或摻合物。作為聚醯胺樹脂之聚縮合的原料內醯胺舉例為例如ε-己內醯胺、氮雜環辛酮、己內醯胺、月桂內醯胺、α-吡咯啶酮、α-哌啶酮及ω-月桂內醯胺等。
作為二胺舉例為例如四亞甲基二胺、五亞甲基二胺、六亞甲基二胺、八亞甲基二胺、十一亞甲基二胺、十二亞甲基二胺、2-甲基五亞甲基二胺、(2,2,4-或2,4,4-)三甲基六亞甲基二胺、九亞甲基二胺及5-甲基九亞甲基二胺等之脂肪族二胺;1,3-雙(胺基甲基)環己烷、1,4-雙(胺基甲基)環己烷、1,3-二胺基環己烷、1,4-二胺基環己烷、1,3-二胺基甲基-3,5,5-三甲基環己烷、雙(4-胺基環己基)甲烷、雙(3-甲基-4-胺基環己基)甲烷、2,2-雙(4-胺基環己基)丙烷、雙(胺基甲基)十氫萘、雙(胺基甲基)三環癸烷、雙(胺基丙基)哌嗪及胺基乙基哌嗪等之脂環族二胺;間二甲苯二胺(MXDA)、對二甲苯二胺、對苯二胺、雙(4-胺基苯基)醚,及雙(胺基甲基)萘等之芳香族二胺等。
作為二羧酸舉例為例如己二酸、辛二酸、壬二酸、癸二酸、十二烷二酸、戊二酸、庚二酸、十一烷二酸、十二烷二酸、十六烷二酸、十六碳烯二酸、二十烷二酸、二乙醇酸及2,2,4-三甲基己二酸等之脂肪族二羧酸;1,4-環己烷二羧酸等之脂環族二羧酸;對苯二甲酸、間苯二甲酸、2-氯對苯二甲酸、2-甲基對苯二甲酸、5-甲基間苯二甲酸、5-鈉磺基間苯二甲酸、六氫對苯二甲酸、六氫間苯二甲酸及二甲苯二羧酸等之芳香族二羧酸等。
作為ω-胺基羧酸舉例為例如6-胺基己酸、11-胺基十一烷酸、12-胺基十二烷酸、對胺基甲基苯甲酸、2-氯-對胺基甲基苯甲酸及2-甲基-對胺基甲基苯甲酸等。
作為聚醯胺樹脂舉例為聚醯胺6、聚醯胺66、聚醯胺46、聚醯胺11、聚醯胺12、聚醯胺69、聚醯胺610、聚醯胺612、聚醯胺96、非晶質性聚醯胺、高熔點聚醯胺、聚醯胺RIM、聚醯胺4、聚醯胺6I、聚醯胺56、聚醯胺6T、聚醯胺9T、聚醯胺MXD6、聚醯胺MP6、聚醯胺MP10及該等之2種以上之共聚物。作為該共聚物具體舉例為聚醯胺6/66共聚物、聚醯胺6/66/610共聚物、聚醯胺6/66/11/12共聚物、結晶性聚醯胺/非結晶性聚醯胺共聚物等。且聚醯胺樹脂可為聚醯胺樹脂與其他合成樹脂之混合聚合物。作為此等混合聚合物之例舉例為聚醯胺/聚酯混合聚合物、聚醯胺/聚苯醚混合聚合物、聚醯胺/聚碳酸酯混合聚合物、聚醯胺/聚烯烴混合聚合物、聚醯胺/苯乙烯/丙烯腈混合聚合物、聚醯胺/丙烯酸酯混合聚合物及聚醯胺/聚矽氧混合聚合物等。該等聚醯胺樹脂可單獨或混合2種以上使用。
聚苯硫醚(PPS)樹脂係以(-φ-S-)[φ為取代或未取代之伸苯基]表示之由硫伸苯基所成之重複單位為主之聚合物。PPS樹脂係將對二氯苯與硫化鹼於高溫、高壓下反應而合成之單體經聚合者。PPS樹脂大致分類為僅使用聚合助劑之聚合步驟即可獲得目的聚合物之直鏈型者,與在氧存在下使低分子聚合物熱交聯之交聯型者的兩種類型。尤其,直鏈型的PPS樹脂基於透過率優異之方面而較佳。又,PPS樹脂之熔融黏度只要可熔融混練則未限制,但通常較好為5~2000Pa.s之範圍,更好為100 ~600Pa.s之範圍。
且,PPS樹脂可為聚合物合金。舉例為例如PPS/聚烯烴系合金、PPS/聚醯胺系合金、PPS/聚酯系合金、PPS/聚碳酸酯系合金、PPS/聚苯醚系合金、PPS/液晶聚合物系合金、PPS/聚醯亞胺系合金及PPS/聚碸系合金。PPS樹脂由於具有耐藥品性、耐熱性及高強度,故適於電子零件或汽車零件等之用途。
作為聚酯樹脂舉例為例如對苯二甲酸與乙二醇之聚縮合反應所得之聚對苯二甲酸乙二酯樹脂,及對苯二甲酸與丁二醇之聚縮合反應所得之聚對苯二甲酸丁二酯樹脂。作為其他聚酯樹脂之例舉例為對苯二甲酸成分中,以15莫耳%以下(例如0.5~15莫耳%),較好5莫耳%以下(例如0.5~5莫耳%)及/或如乙二醇及丁二醇之二醇成分中,以15莫耳%以下(例如0.5~15莫耳%),較好5莫耳%以下(例如0.5~5莫耳%)之方式,將對苯二甲酸成分或二醇成分中之一部分經例如碳數1~4之烷基之取代基取代之共聚物。且聚酯樹脂可單獨或混合複數種者。
作為構成聚酯樹脂之二羧酸化合物具體可較好地使用芳香族二羧酸或其酯形成性衍生物。作為芳香族二羧酸舉例為對苯二甲酸、間苯二甲酸、鄰苯二甲酸、1,5-萘二羧酸、2,5-萘二羧酸、2,6-萘二羧酸、聯苯-2,2’-二羧酸、聯苯-3,3’-二羧酸、聯苯-4,4’-二羧酸、二苯醚-4,4’-二羧酸、二苯基甲烷-4,4’-二羧酸、二苯基碸-4,4’-二羧酸、二苯基亞異丙基-4,4’-二羧酸、1,2-雙(苯氧基)乙烷-4,4’-二羧酸、蒽-2,5-二羧酸、蒽-2,6-二羧酸、對-聯三苯基-4,4’-二羧酸及吡啶-2,5-二羧酸等,可較好地使用對苯二甲酸。該等芳香族二羧酸亦可混合2種以上使用。該等如週知除游離酸以外可將二甲酯等作為酯形成性衍生物用於聚縮合反應。又,若為少量則可與該等芳香族二羧酸一起混合如己二酸、辛二酸、十二烷二酸及癸二酸等之脂肪族二羧酸、或1,2-環己烷二羧酸、1,3-環己烷二羧酸及1,4-環己烷二羧酸等之脂環式二羧酸之一種以上使用。
作為構成聚酯樹脂之二羥基化合物舉例為如乙二醇、丙二醇、丁二醇、己二醇、新戊二醇、2-甲基丙烷-1,3-二醇、二乙二醇及三乙二醇等之脂肪族二醇,環己烷-1,4-二甲醇等之脂環式二醇等,及該等之混合物等。又,若為少量,則亦可共聚合分子量400~6000之長鏈二醇亦即聚乙二醇、聚-1,3-丙二醇及聚四亞甲基二醇等之1種以上。且,亦可使用如氫醌、間苯二酚、萘二酚、二羥基二苯醚及2,2-雙(4-羥基苯基)丙烷等之芳香族二醇。又,如上述之二官能性單體以外,亦可少量併用用以導入分支構造之苯偏三酸、均苯三酸、均苯四酸、季戊四醇及三羥甲基丙烷等之三官能性單體或用以調節分子量之脂肪酸等之單官能性化合物。
作為聚酯樹脂係使用主要包含二羧酸與二醇之聚縮合物者,即樹脂全體之50質量%,較好70質量%以上為該聚縮合物者。作為二羧酸較好為芳香族羧酸,作為二醇較好為脂肪族二醇。更好酸成分之95莫耳%以上為對苯二甲酸,醇成分之95質量%以上為脂肪族二醇的聚對苯二甲酸烷二酯。作為其例舉例為聚對苯二甲酸丁二酯及聚對苯二甲酸乙二酯。該等較好為接近均聚酯者,即樹脂全體之95質量%以上為對苯二甲酸成分及1,4-丁二醇或乙二醇成分。作為聚酯樹脂,較好主成分為聚對苯二甲酸丁二酯。聚對苯二甲酸丁二酯可為如間苯二甲酸、二聚酸及聚四亞甲基二醇(PTMG)等之聚烷二醇等之共聚物。
作為聚烯烴系樹脂舉例為例如乙烯、丙烯、丁烯-1、3-甲基丁烯-1、4-甲基戊烯-1、辛烯-1之α-烯烴之均聚物及該等之共聚物,以及該等與其他可共聚合不飽和單體之共聚物(作為共聚物,舉例為嵌段共聚物、無規共聚物、接枝共聚物)等。更具體例舉例為高密度聚乙烯、中密度聚乙烯、低密度聚乙烯、直鏈狀低密度聚乙烯、乙烯-乙酸乙烯酯共聚物,及乙烯-丙烯酸酯共聚物等之聚乙烯系樹脂;丙烯均聚物、丙烯-乙烯嵌段共聚物或無規共聚物,及丙烯-乙烯-丁烯-1共聚物等之聚丙烯系樹脂;聚丁烯-1及聚4-甲基戊烯-1等。該等之聚烯烴系樹脂可單獨使用,亦可組合2種以上。該等中,較好使用聚乙烯樹脂及/或聚丙烯樹脂。更好為聚丙烯系樹脂。該聚丙烯系樹脂之分子量並未特別限制,可使用廣範圍分子量者。
又,作為聚烯烴系樹脂亦可使用如以不飽和羧酸或其衍生物改質之酸改質聚烯烴或發泡聚丙烯之樹脂本身含有發泡劑者。又,聚烯烴系樹脂亦可含有乙烯-α-烯烴系共聚物橡膠、乙烯-α-烯烴系-非共軛二烯系共聚物(例如EPDM等)、乙烯-芳香族單乙烯化合物-共軛二烯系化合物共聚合橡膠,或該等之氫化物等之橡膠類。
聚碳酸酯樹脂係於主鏈具有碳酸酯鍵之熱塑性樹脂,係具備優亦機械性質、耐熱性、耐寒性、電性質、透明性等之工程塑膠。目前工業上量產之聚碳酸酯樹脂係由雙酚A所得之芳香族聚碳酸酯。作為該等之製法,舉例為光氣法及酯交換法。聚碳酸酯樹脂之化學構造式係於將芳香族烴之碳酸酯多數連結之直鏈狀分子中,於分子主鏈具有體積增大的苯核與撓性碳酸酯。前者賦予高的熱變形溫度或優異物理及機械性質,後者有助於成形性與柔軟性,易藉由鹼水解。
熱塑性樹脂除上述以外,可為由2種以上單體所成之共聚物樹脂。舉例為例如AS(丙烯腈-苯乙烯)共聚物樹脂、ABS(丙烯腈-丁二烯-苯乙烯)共聚物樹脂、AES(丙烯腈-EPDM-苯乙烯)共聚物樹脂、PA-PBT共聚物、PET-PBT共聚物樹脂、PC-PBT共聚物樹脂及PC-PA共聚物樹脂等。又舉例為如聚苯乙烯系熱塑性彈性體、聚烯烴系熱塑性彈性體、聚胺基甲酸酯熱塑性彈性體及聚酯系熱塑性彈性體之熱塑性彈性體,以及以上述樹脂類為主成分之合成蠟及天然蠟等。又,該等熱塑性樹脂之分子量並未特別限制。且,作為熱塑性樹脂可使用上述之一種或複數種。
本發明之雷射熔接體10之一部分的雷射光弱吸收性樹脂構件2所用之雷射光弱吸收樹脂組成物及形成雷射光吸收性樹脂構件3所用之雷射光吸收性樹脂組成物較好含有苯胺黑作為黑色著色劑。基於調整為特定吸光度之目的比著色為黑色之目的更優先之觀點,於該等樹脂組成物中較好含比較少量之苯胺黑。因此,具有低吸光度之雷射光弱吸收性樹脂構件2不具有充分之漆黑度。形成雷射光透過性樹脂構件1所用之雷射光透過性樹脂組成物可為無色透明或藉由含有微量苯胺黑而呈現淡灰色。
基於使雷射熔接體10中之各樹脂構件1、2、3之界面或溶接痕不顯眼之目的,用以形成各樹脂構件1、2、3之各樹脂組成物中,可添加著色劑。藉此例如可將各樹脂構件1、2、3設為黑色的單一色調。可對應於各樹脂組成物中所含之熱塑性樹脂之色相及色濃度,而添加適當著色劑,藉此可獲得呈現均質黑色之各樹脂構件1、2、3。此等黑色著色劑可藉由例如組合藍色著色劑、紅色著色劑及黃色著色劑,組合紫色著色劑及黃色著色劑、組合綠色著色劑與紅色著色劑而獲得。
添加於作為各樹脂構件1、2、3之原料的各樹脂組成物中之著色劑舉例為組合可吸收可見光區域,與熱塑性樹脂富含相溶性且對於雷射光具有低散射特性之染料者。又,較好為即使暴露於雷射光透過性樹脂構件1之成形時或雷射照射所致之熔融時之高溫時,亦難以褪色而具有優異耐熱性,進而於雷射光之紅外線區域不具有吸收之著色劑。具體上較好為至少含有對於雷射熔接所用之雷射光具有透過性之蒽醌染料之著色劑。
此等蒽醌染料較好為蒽醌系油溶性染料,具體之例舉例為以C.I.溶劑藍11、12、13、14、26、35、36、44、45、48、49、58、59、63、68、69、70、78、79、83、87、90、94、97、98、101、102、104、105、122、129及132;C.I.分散藍14、35、102及197;C.I.溶劑綠3、19、20、23、24、25、26、28、33及65;C.I.溶劑紫13、14、15、26、30、31、33、34、36、37、38、40、41、42、45、47、48、51、59及60之色彩指數所銷售之染料。
作為蒽醌染料,舉例為於590~635nm之範圍具有最大吸收波長者。此等蒽醌染料大多呈現藍色,例如比綠色蒽醌染料具有更高視覺辨識性。組合黑色混合染料時,藉由減法混色,於藍色蒽醌染料中,組合紅色染料或黃色染料,而可獲得具有高著色力之黑色著色劑。
又,蒽醌染料之940nm雷射光透過率較好為60~95%。作為市售之蒽醌染料舉例為例如「NUBIAN(註冊商標)藍色系列」及「OPLAS(註冊商標)藍色系列」(均為商品名,東方化學工業股份有限公司製)等。
蒽醌染料之電傳導度較好為50~500μS/cm。若如此,則可提高各樹脂構件1、2、3之絕緣性,故可對於如電氣・電子機械零件或精密機械零件之需要高絕緣性之零件較好地使用雷射熔接體10。
此電傳導度可如以下般測定。將試料的蒽醌染料5g分散於500mL之離子交換水中,記錄其重量。將其煮沸萃取出離子成分,隨後過濾。添加離子交換水直至濾液重量與先前測定之重量相同,使用電傳導率計(東亞DKK股份有限公司製,製品名:AOL-10)測定該溶液之電傳導度。
作為藍色著色劑、紅色著色劑及黃色著色劑之組合,綠色染料與紅色染料之組合,藍色染料、綠色染料、紅色染料及黃色染料之組合等之混合著色劑中所用之紅色染料或黃色染料,舉例為偶氮染料、喹吖啶酮染料、二噁嗪染料、喹酞酮染料、苝染料、紫環酮、異吲哚酮染料、偶氮甲撐染料、三苯基甲烷染料及蒽醌染料等。該等可使用一種或組合複數種使用。作為對樹脂組成物賦予良好顯色性之染料,舉例為紫環酮染料及蒽醌染料。
較好組合使用於590~635nm之範圍具有最大吸收波長之如上述蒽醌染料與紅色染料。作為較佳例,舉例為具有良好耐熱性且大多顯示紅色之如上述紫環酮染料。作為此等紅色染料之市售品舉例為例如「NUBIAN(註冊商標)紅色系列」及「OPLAS(註冊商標)紅色系列」(均為商品名,東方化學工業股份有限公司製)等。
作為紫環酮染料具體舉例為例如C.I.溶劑橙60;C.I.溶劑紅135、162、178及179。
作為蒽醌染料(包含蒽并吡啶酮染料)舉例為例如C.I.溶劑紅52、111、149、150、151、168、191、207及227;C.I.分散紅60。此等紫環酮染料及蒽醌染料係以上述色彩指數市售。
作為與此等蒽醌染料組合使用之染料,較好為黃色之蒽醌染料。著色劑中,(i)黃色之蒽醌染料之質量/(ii)藍色、綠色及/或紫色之蒽醌染料的質量比(i)/(ii)之範圍較好為0.15~1.0。作為黃色的蒽醌染料之市售品舉例為例如「NUBIAN(註冊商標)黃色系列」及「OPLAS(註冊商標)黃色系列」(均為商品名,東方化學工業股份有限公司製)等。
作為黃色染料具體舉例為以例如C.I.溶劑黃14、16、32、33、43、44、93、94、98、104、114、116、133、145、157、163、164、167、181、182、183、184、185及187;C.I.還原黃1、2及3之色彩指數市售之染料。
於雷射熔接體10中,於要求耐候性、耐熱性及如耐滲出性之堅牢性之情形時,作為上述舉例之油溶性染料,可較好地使用組合酸性染料與有機胺之造鹽染料。此等造鹽染料可表示為[酸性染料之陰離子・有機銨鹽]。著色劑中,藉由使用蒽醌染料替代造鹽染料而以[蒽醌之酸性染料之陰離子・有機銨鹽]表示之蒽醌系造鹽染料,可提高著色劑之堅牢性。
作為造鹽染料所用之蒽醌酸性染料具體舉例為例如以C.I.酸性藍25、27、40、41、43、45、47、51、53、55、56、62、78、111、124、129、215、230及277;C.I.酸性綠37;C.I.酸性紫36、41、43、51及63之色彩指數市售之一分子中具有一個磺酸基之蒽醌染料。
作為蒽醌酸性染料,除上述以外,具體舉例為例如以C.I.酸性藍23、35、49、68、69、80、96、129:1、138、145、175、221及344;C.I.酸性綠25、27、36、38、41、42及44;C.I.酸性紫34及42之色彩指數市售之蒽醌之一分子中具有兩個磺酸基之蒽醌染料。
其中,較好為如C.I.酸性藍49、80、96、129:1、138、145及221、C.I.酸性綠25、27、36、38、41、42及44以及C.I.酸性紫34之蒽醌骨架中具有於苯胺基中鍵結有具有磺酸基作為至少一個取代基之構造者。
作為適當之蒽醌造鹽染料,舉例為具有苯胺基衍生物作為取代基之蒽醌造鹽染料。此等蒽醌造鹽染料對於芳香族熱塑性樹脂顯示高的相溶性,可賦予高的耐熱性。
此等較佳之蒽醌染料係以下述化學式(1)表示:(化學式(1)中,X及Y相互獨立為氫原子、羥基、鹵原子或胺基,R1
~R5
相互獨立為氫原子、羥基、胺基、硝基、碳數1~18之直鏈或分支鏈之烷基、碳數1~18之直鏈或分支鏈之烷氧基、鹵原子、苯氧基、羧基,(P)b+
係有機銨離子,a及b為1~2之正數,m及n為1~2之正數,A為氫原子、羥基、胺基、鹵原子或以下述化學式(2)表示:(化學式(2)中,R6
~R10
相互獨立為氫原子、羥基、胺基、硝基、碳數1~18之直鏈或分支鏈之烷基、碳數1~18之直鏈或分支鏈之烷氧基或鹵原子))。
化學式(1)及(2)中,作為碳數1~18之直鏈或分支鏈之烷基具體舉例為例如甲基、乙基、正丙基、異丙基、正丁基、第二丁基、異丁基、第三丁基、正戊基、新戊基、異戊基、第二戊基、3-戊基、第三戊基、己基、庚基及辛基。且作為碳數1~18之直鏈或分支鏈之烷氧基具體舉例為例如甲氧基、乙氧基、正丙氧基、異丙氧基、正丁氧基、第二丁氧基、異丁氧基、第三丁氧基、正戊氧基、新戊氧基、異戊氧基、第二戊氧基、3-戊氧基、第三戊氧基、己氧基。進而作為鹵原子具體舉例為例如氟、氯、溴及碘。
化學式(1)表示之造鹽染料較好為一分子中具有兩個苯胺基衍生物作為取代基之蒽醌造鹽染料。若如此,則各樹脂構件1、2、3之成形時或雷射熔接時,可抑制因熱熔融所致之該等熱劣化。作為如造鹽染料中較好地使用之一分子中具有兩個苯胺基衍生物作為取代基之蒽醌酸性染料,具體舉例為例如C.I.酸性綠25、27、36、38、41、42及44;C.I.酸性藍80及221;C.I.酸性紫34。
作為化學式(1)表示之造鹽染料中較好使用之胺類具體舉例為例如如己胺、庚胺、辛胺、2-乙基己胺、二-(2-乙基己基)胺及十二烷胺之脂肪族單胺;環己胺、二-環己胺及二氫二乙胺之脂環族胺;如四亞甲基二胺、六亞甲基二胺、八亞甲基二胺、九亞甲基二胺、十二亞甲基二胺、2-甲基五亞甲基二胺、2-甲基八亞甲基二胺、三甲基六亞甲基二胺、雙(對-胺基環己基)甲烷、間-二甲苯二胺及對-二甲苯二胺之脂肪族、脂環族、芳香族之二胺;3-丙氧基丙胺、二-(3-乙氧基丙基)胺、3-丁氧基丙胺、辛氧基丙胺及3-(2-乙基己氧基)丙胺之烷氧基烷基胺;如α-萘基胺、β-萘基胺、1,2-萘二胺、1,5-萘二胺及1,8-萘二胺之芳香族胺;如1-萘基甲胺之芳香族烷基胺;如N-環己基乙醇胺、N-十二烷基乙醇胺及N-十二烷基亞胺基-二乙醇之含烷醇基之胺;如1,3-二苯基胍、1-鄰-甲苯基胍及二-鄰-甲苯基胍之胍衍生物。
作為胺類可使用市售之四級銨。作為此等四級銨具體舉例為例如QUARTAMIN 24P、QUARTAMIN 86P conc.、QUARTAMIN 60W、QUARTAMIN 86W、QUARTAMIN D86P(氯化二硬脂基二甲基銨)、SANISOL C及SANISOL B-50(以上為花王股份有限公司製,QUARTAMIN及SANISOL為註冊商標);ARQUAD 210-80E、2C-75、2HT-75(氯化二烷基(烷基為C14
~C18
)二甲基銨)、2HT FLAKE、2O-75I、2HP-75及2HP FLAKE(以上為獅王特用化學品股份有限公司製,ARQUAD為商品名);PRIMENE MD胺(甲烷二胺)、PRIMENE 81-R(高分支鏈tert-烷基(C12
~C14
)一級胺異構物混合物)、PRIMENE TOA胺(第三辛胺)、PRIMENE RB-3(第三烷基一級胺混合物)及PRIMENE JM-T胺(高分支鏈第三烷基(C16
~C22
)一級胺異構物混合物)(以上,陶氏化學公司製,PRIMENE為註冊商標)。
著色劑之含量,相對於熱塑性樹脂100質量份,為0.01~3質量份,較好為0.05~1質量份,更好為0.1~0.8質量份。藉由將著色劑含量調整為此範圍,可獲得高顯色性之樹脂組成物。
調製此等樹脂組成物時,較好調製含有著色劑之母批料,將該母批料添加於熱塑性樹脂原料中。若如此,則由於著色劑均一分散,故該等樹脂組成物不會產生色不均。母批料中之著色劑含量較好為5~90質量%,更好為20~60質量%。
又,雷射光透過性樹脂構件1之原料組成物藉由不含雷射光吸收劑或藉由將其含量設為少量,而不僅可使雷射光透過性樹脂構件1無色彩,亦可作成有彩色之著色構件。例如使用前述例示之著色劑,可將雷射光透過性樹脂構件1著色為黃色、紅色、藍色、綠色及紫色。
形成各樹脂構件1、2、3之原料的樹脂組成物時,可根據需要除著色劑以外,可於熱塑性樹脂原料中調配各種添加劑。作為此等添加劑舉例為例如補強材、填充材、紫外線吸收劑或光安定劑、抗氧化劑、抗菌・防霉劑、難燃劑、助色劑、分散劑、安定劑、可塑劑、改質劑、抗靜電劑、潤滑劑、脫模劑、結晶促進劑及結晶核劑。進而舉例為如氧化鈦、硫酸鋅、鋅白(氧化鋅)、碳酸鈣及氧化鋁白之白色顏料或有機白色顏料。若藉此,可將無色彩之熱塑性樹脂原料與有機染顏料組合而調整為有色彩。
補強材只要可用於合成樹脂之補強即可,並無特別限制。舉例為例如如玻璃纖維、碳纖維、金屬纖維、鈦酸鉀纖維、矽酸鈣纖維、海泡石、矽灰石及岩棉之無機纖維,以及如芳醯胺、聚苯硫醚樹脂、聚醯胺、聚酯及亦經聚酯之有機纖維。例如對樹脂構件賦予透明性時,其補強可較好地使用玻璃纖維。此等玻璃纖維之纖維長為2~15 mm,其纖維徑為1~20μm。關於剝離纖維之形態並未特別限定,舉例為例如粗紗或磨碎纖維。該等玻璃纖維可單獨使用一種,亦可組合使用2種以上。其含量相對於例如雷射光透過性樹脂構件1之100質量份,較好為5~120質量份。未達5質量份時,無法獲得充分之剝離纖維補強效果,超過120質量份時成形性降低。較好為10~60質量份,特佳為20~50質量份。
作為填充材舉例為粒子狀填充材,例如如滑石、高嶺土、黏土、矽灰石、膨潤土、石棉及鋁酸矽酸鹽之矽酸鹽;如氧化鋁、氧化矽、氧化鎂、氧化鋯及氧化鈦之金屬氧化物;如碳酸鈣、碳酸鎂及白雲石之碳酸鹽;如硫酸鈣及硫酸鋇之硫酸鹽;如玻璃珠、陶瓷珠、氮化硼及碳化矽之陶瓷。且填充劑可為如雲母、絹雲母及玻璃片之板狀填充材。
作為紫外線吸收劑及光安定劑之例舉例為苯并三唑系化合物、二苯甲酮系化合物、水楊酸酯系化合物、氰基丙烯酸酯系化合物、苯甲酸酯系化合物、草醯替苯胺系化合物、受阻胺系化合物及鎳錯鹽等。
作為抗氧化劑舉例為具有酚性羥基之酚系化合物;磷酸三苯酯、磷酸二苯酯癸酯、磷酸苯酯二異癸酯、磷酸三(壬基苯基)酯、雙(2,4-二-第三丁基苯基)季戊四醇二磷酸酯及雙(2,6-二-第三丁基-4-甲基苯基)季戊四醇二磷酸酯等之具有磷原子之磷系化合物、二丙酸二-十二烷硫酯、二丙酸二-十四烷硫酯、二丙酸二-十八烷硫酯、季戊四醇四(3-十二烷硫基丙酸酯)、硫基雙(N-苯基-β-萘基胺)、2-巰基苯并噻唑、2-巰基苯并咪唑、單硫化四甲基秋蘭姆、二硫化四甲基秋蘭姆、二丁基二硫代胺基甲酸鎳、異丙基黃原酸鎳及三月桂基三硫代磷酸酯等具有硫原子之硫系化合物及硫醚系化合物。
作為抗菌・防霉劑,舉例為2-(4’-噻唑基)苯并咪唑、10,10’-氧基雙苯氧基砷化氫、N-(氟二氯甲硫基)酞二醯亞胺及雙(2-吡啶硫基-1-氧化)鋅等。
難燃劑並未特別限制,舉例為例如有機鹵素化合物、銻化合物、含矽化合物、磷化合物、氮化合物等之有機難燃劑及無機難燃劑。作為有機鹵素化合物舉例為例如溴化聚碳酸酯、溴化環氧樹脂、溴化苯氧基樹脂、溴化聚苯醚樹脂、溴化聚苯乙烯樹脂、溴化雙酚A、五溴苄基聚丙烯酸酯、四溴雙酚A衍生物、六溴二苯醚及四溴鄰苯二甲酸酐等。作為銻化合物舉例為例如三氧化銻、五氧化銻、銻酸鈉及磷酸銻等。作為含矽化合物舉例為例如矽氧油、有機矽烷及矽酸鋁。作為磷化合物舉例為例如亞磷酸三苯酯、磷酸三苯酯、磷酸酯、聚磷酸、聚磷酸銨、紅磷以及於主鏈具有磷原子與氮原子之鍵結之苯氧基磷腈、及胺基磷腈等之磷腈化合物。作為氮化合物舉例為例如三聚氰胺、氰脲酸、氰尿酸三聚氰胺、尿素及胍等。作為無機難燃劑舉例為例如氫氧化鋁、氫氧化鎂、矽化合物及硼化合物等。
可塑劑並未特別限定,舉例為例如鄰苯二甲酸酯(例如鄰苯二甲酸二甲酯、鄰苯二甲酸丁酯苄酯及鄰苯二甲酸二異癸酯等)、磷酸酯(例如磷酸三甲苯酯及磷酸2-乙基己酯二苯酯)、磷醯胺系可塑劑(例如正丁基苯磺醯胺及對-甲苯磺醯胺等)。再者,可使用聚酯系可塑劑、多元醇酯系可塑劑、多元羧酸酯系可塑劑、雙酚系可塑劑、醯胺系可塑劑、酯系可塑劑、醯胺酯系可塑劑、甘油系可塑劑及環氧系可塑劑(例如環氧硬脂酸烷酯與大豆油所成之環氧三甘油酯)等。
作為耐衝擊改良劑,若為發揮樹脂之耐衝擊性改良效果,則未特別限制。舉例為例如聚醯胺系彈性體、聚酯系彈性體、苯乙烯系彈性體、聚烯烴系彈性體、丙烯酸系彈性體、聚胺基甲酸酯系彈性體、氟系彈性體、聚矽氧系彈性體及丙烯酸系之核/殼型彈性體等之習知者。其中,較好為聚酯系彈性體及苯乙烯系彈性體。
各樹脂構件1、2、3亦可使用期望之著色熱塑性樹脂組成物之母批料製造。此等母批料可藉由任意方法獲得。例如將母批料之成為珠粒之樹脂粉末及/或顆粒與著色劑以如滾筒或超混合機之混合機混合後,藉由擠出機、批式混練機或輥式混練機加熱熔融而顆粒化或粗粒子化而獲得。
各樹脂構件1、2、3之成形可藉由通常進行之各種順序進行。例如使用著色顆粒,藉由擠出機、射出成形機及輥混合機之加工機成形。且,亦可於適當混合機中混合透明熱塑性樹脂之顆粒及/或粉末、經粉碎之著色劑及根據需要之各種添加劑,使用加工機使藉此獲得之樹脂組成物成形。且例如亦可於含有適當聚合觸媒之單體中添加著色劑,使該混合物藉由聚合而合成期望之樹脂,以適當方法使其成形。作為成形方法可採用例如射出成形、擠出成形、壓縮成形、發泡成形、吹塑成形、真空成形、吹脹成形、旋轉成形、壓延成形及溶劑澆鑄等之成形方法。藉由此等成形,可獲得各種形狀之各樹脂構件1、2、3。 [實施例]
以下列舉實施例更具體說明本發明,但本發明不限定於該等實施例。
(雷射透過性之黑色著色劑之調製) [著色劑A]蒽醌藍色酸性染料(C.I.酸性藍80)與六亞甲基二胺之藍色造鹽染料:紫環酮紅色油溶性染料(C.I.溶劑紅179)=1:2(質量比)進行粉體混合,獲得著色劑A。 [著色劑B]蒽醌藍色酸性染料(C.I.酸性藍80)與2-乙基己胺之藍色造鹽染料:紫環酮紅色油溶性染料(C.I.溶劑紅179):C.I.溶劑黃163=7:2:1(質量比)進行粉體混合,獲得著色劑B。 [著色劑C]蒽醌藍色酸性染料(C.I.溶劑藍236)與2-乙基己胺之藍色造鹽染料:紫環酮紅色油溶性染料(C.I.溶劑紅179):C.I.溶劑黃163=6:3:1(質量比)進行粉體混合,獲得著色劑C。 [著色劑D]蒽醌藍色油溶性染料(C.I.酸性藍104):紫環酮紅色油溶性染料(C.I.溶劑紅179):蒽醌黃色油溶性染料(C.I.溶劑黃163)=5:3:2(質量比)進行粉體混合,獲得著色劑D。
(實施例1) (1)雷射光透過性樹脂構件1(第1樹脂構件)之製作 將聚醯胺66樹脂(旭化成股份有限公司製,商品名:LEONA(註冊商標)1300S)500g,使用射出成形機(東洋機械金屬股份有限公司製,商品名:Si-50),藉由汽缸溫度290℃、模具溫度80℃之通常方法予以成形,製作1片長80mm×寬50mm×厚1mm之雷射光透過性樹脂構件1。
(2)雷射光弱吸收性樹脂構件2(第2樹脂構件)之製作 將聚醯胺66樹脂(旭化成股份有限公司製,商品名:LEONA (註冊商標)1300S) 499.8g與苯胺黑A(依據日本專利第3757081號公報之記載變更硫酸濃度而合成之苯胺黑的硫酸鹽;硫酸離子1.96質量%;體積阻抗率2.0×1010
Ω・cm;C.I.溶劑黑5)0.2g饋入不鏽鋼製滾筒中攪拌混合1小時,調製雷射光弱吸收性樹脂構件2用之樹脂組成物。該樹脂組成物使用射出成形機(東洋機械金屬股份有限公司製,商品名:Si-50),藉由汽缸溫度290℃、模具溫度80℃之通常方法予以成形,各製作1片長80mm×寬50mm×厚1mm之成為雷射光弱吸收性樹脂構件2之樹脂構件片2f及樹脂構件片2s。
(3)雷射光吸收性樹脂構件3(第3樹脂構件)之製作 將聚醯胺66樹脂(旭化成股份有限公司製,商品名:LEONA (註冊商標)1300S) 499.7g與苯胺黑A(苯胺黑的硫酸鹽;硫酸離子1.96質量%;體積阻抗率2.0×1010
Ω・cm)0.3g饋入不鏽鋼製滾筒中攪拌混合1小時,調製雷射光吸收性樹脂構件3用之樹脂組成物。該樹脂組成物使用射出成形機(東洋機械金屬股份有限公司製,商品名:Si-50),藉由汽缸溫度290℃、模具溫度80℃之通常方法予以成形,製作1片長80mm×寬50mm×厚1mm之雷射光吸收性樹脂構件3。
使用分光光度計(日本分光股份有限公司製,商品名:V-570)測定雷射光吸收性樹脂構件及雷射光弱吸收性樹脂構件成形板之透過率、反射率。將使試料溶解而測定之一般吸光度(Absorbance)係根據透過率之對數設為正數者。如本發明測定所形成之樹脂構件之吸光度時,由於雷射光於成形板表面反射,故必須求出真的透過率。真的透過率T係以T=IT
/(IO
-IR
)表示。表示940nm之吸光度的Lambert-Beer定律係以下述數式(1)表示:(數式(1)中,T為真的透過率,(IO
)為入射光強度,(IT
)為透過光強度,(IR
)為反射光強度)。此處,IO
入射光強度設為100%,進而作為IT
(透過光強度)及IR
(反射光強度),藉由將測定值之百分率的透過率及反射率代入,而算出吸光度。又,構成本發明之雷射熔接體之雷射光吸收性樹脂構件及雷射光弱吸收性樹脂構件由於有含大量雷射光吸收劑之情況,故有難以藉由測定吸光度及吸光係數而求出之情況。又依據Lambert-Beer定律,吸光度a係以雷射光吸收劑含有率C(質量%)與L樹脂構件厚度(mm)之關係式的下述數式(2)表示,(數式(2)中,ε為吸光係數(l/mm),C為雷射光吸收劑含有率(質量%),L為樹脂構件之厚度(mm))。此處,基於表1作成校正線,該等樹脂構件之吸光度及吸光係數係如下算出。
將所得吸光度a為縱軸,其雷射光吸收劑含有率C(質量%)為橫軸作成圖表後,獲得吸光度a=4.538C +0.058表示之校正線。實施例及比較例中,使用該校正線之式,將由雷射光吸收劑含有率(質量%)算出之吸光度除以樹脂構件厚度,求出含有雷射光吸收劑之樹脂構件每1mm厚之吸光度a。針對各樹脂組成物亦同樣進行測定。
(4)雷射熔接體10之製作 如圖1所示,將兩樹脂構件片2f、2s之端部彼此對接接觸形成對接部位B,作成雷射光弱吸收性樹脂構件2。將雷射光透過性樹脂構件1、雷射光弱吸收性樹脂構件2及雷射光吸收性樹脂構件3依此順序重疊,形成3層樹脂構件。於該3層樹脂構件之厚度方向,施加每單位面積0.4Pa之壓力。進而於雷射光透過性樹脂構件1表面載置5mm厚之玻璃板(雷射光透過率90%)固定3層樹脂構件。藉此製作具有接觸部位C1-2
、C2-3
之各樹脂構件1、2、3層合體。自雷射光透過性樹脂構件1上方,將來自輸出10W的雷射二極體[波長:940nm連續](浜松Photonic股份有限公司製)之雷射光L沿著對接部位B及接觸部位C1-2
、C2-3
以掃描速度0.6mm/秒,掃描距離20mm邊掃描邊照射。藉此於對接部位B及接觸部位C1-2
、C2-3
熔接,獲得各樹脂構件1、2、3一體化之實施例1之雷射熔接體10。針對該樹脂溶接體10進行以下評價。
(拉伸強度) 依據JIS K7161:2014塑膠-拉伸特性之試驗方法,使用拉伸試驗機(島津製作所股份有限公司製,商品名:AG-50kNE),將雷射熔接體10以使雷射光弱吸收性樹脂構件2之兩樹脂構件片2f、2s以反向分離之方式於水平方向以試驗速度10mm/分鐘拉伸,測定拉伸強度。結果示於表2。
(外觀觀察) 以目視觀查雷射熔接體10之熔接部位的對接部位B及接觸部位C1-2
、C2-3
之外觀。於雷射熔接體10表面未見到燒焦及雷射熔接痕者記為「良好」,於其表面見到燒焦及雷射熔接痕者記為「不良」。結果示於表2。
(熔融流動速率) 將雷射光弱吸收性樹脂構件2切斷為特定尺寸,於80℃乾燥15小時,製作測定試料。依據JIS K7210:2014(求得塑膠-熱塑性塑膠之熔融流動速率(MFR)及熔融體積流動速率(MVR)之方法),使用熔融分度計F-F01型(東洋精機製作所股份有限公司製,商品名),以試驗溫度280℃、試驗荷重2.16kgf之條件進行測定。測定進行3次,算出該等值之平均,求出熔融流動速率。第2樹脂構件之雷射光弱吸收性樹脂構件2的熔融流動速率為14.8g/10分鐘。
(實施例2) (1)雷射光透過性樹脂構件1之製作 與實施例1同樣操作,製作雷射光透過性樹脂構件1。 (2)雷射光弱吸收性樹脂構件2之製作 除將聚醯胺66樹脂設為499.7g及替代苯胺黑A而將苯胺黑B(苯胺黑的硫酸鹽;硫酸離子1.52質量%;體積阻抗率2.7×1010
Ω・cm;依據日本專利第3757081號公報之記載變更硫酸濃度而合成之苯胺黑的硫酸鹽)設為0.3g以外,與實施例1同樣操作,各製作1片成為雷射光弱吸收性樹脂構件2之樹脂構件片2f及樹脂構件片2s。與實施例1同樣操作測定樹脂構件片2f、2s之熔融流動速率後,為14.5g/10分鐘。 (3)雷射光吸收性樹脂構件3之製作 除將聚醯胺66樹脂設為499.5g及替代苯胺黑A而將苯胺黑B(苯胺黑的硫酸鹽;硫酸離子1.52質量%;體積阻抗率2.7×1010
Ω・cm)設為0.5g以外,與實施例1同樣操作,製作雷射光吸收性樹脂構件3。
(4)雷射熔接體10之製作 將兩樹脂構件片2f、2s之端部彼此對接接觸形成對接部位B,作成雷射光弱吸收性樹脂構件2。於兩樹脂構件片2f、2s之對接方向,施加400N之荷重並且於雷射光弱吸收性樹脂構件2表面載置5mm厚之玻璃板(雷射光透過率90%)之玻璃板予以固定。將輸出10W之雷射二極體[波長:940nm連續]沿著對接部位B以掃描速度0.9mm/秒,掃描距離20mm邊掃描邊照射。藉此於對接部位B熔接,接合兩樹脂構件片2f、2s。將雷射光透過性樹脂構件1、雷射光弱吸收性樹脂構件2及雷射光吸收性樹脂構件3依此順序重疊,形成3層樹脂構件。於該3層樹脂構件之厚度方向,施加每單位面積0.4Pa之壓力。進而於雷射光透過性樹脂構件1表面載置5mm厚之玻璃板(雷射光透過率90%)固定3層樹脂構件。將來自輸出10W的雷射二極體[波長:940nm連續](浜松Photonic股份有限公司製)之雷射光L沿著接觸部位C1-2
、C2-3
以掃描速度0.9mm/秒,掃描距離20mm邊掃描邊照射。藉此於接觸部位C1-2
、C2-3
熔接,獲得各樹脂構件1、2、3一體化之實施例2之雷射熔接體10。針對該樹脂溶接體10與實施例1同樣進行評價。結果示於表2。
(實施例3) (1)雷射光透過性樹脂構件1之製作 將聚醯胺66樹脂(旭化成股份有限公司製,商品名:LEONA (註冊商標)1300S) 498.5g與著色劑A 1.5g饋入不鏽鋼製滾筒攪拌混合1小時,調製雷射光透過性樹脂構件1用之樹脂組成物。該樹脂組成物藉由與實施例1同樣操作予以成形,製作1片長80mm×寬50mm×厚1mm之雷射光透過性樹脂構件1。
(2)雷射光弱吸收性樹脂構件2之製作 將聚醯胺66樹脂(旭化成股份有限公司製,商品名:LEONA (註冊商標)1300S) 498.0g、苯胺黑A 0.5g與著色劑A 1.5g饋入不鏽鋼製滾筒攪拌混合1小時,調製雷射光弱吸收性樹脂構件2用之樹脂組成物。該樹脂組成物藉由與實施例1同樣操作予以成形,各製作1片長80mm×寬50mm×厚1mm之成為雷射光弱吸收性樹脂構件2之樹脂構件片2f及樹脂構件片2s。與實施例1同樣操作測定樹脂構件片2f、2s之熔融流動速率後,為15.8g/10分鐘。
(3)雷射光吸收性樹脂構件3之製作 將聚醯胺66樹脂(旭化成股份有限公司製,商品名:LEONA(註冊商標)1300S) 494.5g、苯胺黑A 4.0g與著色劑A 1.5g饋入不鏽鋼製滾筒攪拌混合1小時,調製雷射光吸收性樹脂構件3用之樹脂組成物。該樹脂組成物藉由與實施例1同樣操作予以成形,製作1片長80mm×寬50mm×厚1mm之雷射光吸收性樹脂構件3。
(4)雷射熔接體10之製作 除將雷射光L之掃描速度設為2.0mm/秒以外,與實施例1同樣操作,獲得實施例3之雷射熔接體10。針對該雷射熔接體10,進行與實施例1同樣之評價。結果示於表2。
圖4中顯示實施例3之雷射熔接體10之熔接部位的剖面放大照片。又該圖中。白框箭頭表示雷射光照射方向。藉由雷射光之照射,使雷射光弱吸收性樹脂構件2於對接部位熔接。進而使雷射光弱吸收性樹脂構件2於與於雷射光入射側層合之雷射光透過性樹脂構件1、及雷射光吸收性樹脂構件3之接觸部位熔接,藉此使雷射光透過性樹脂構件1、雷射光弱吸收性樹脂構件2及雷射光吸收性樹脂構件3接合。雷射光弱吸收性樹脂構件2與雷射光吸收性樹脂構件3之接觸部位,與雷射光透過性樹脂構件1與雷射光弱吸收性樹脂構件2之接觸部位相比較,可知以更廣且更深的範圍熔融。且,針對已透過雷射光之雷射光透過性樹脂構件1,除與雷射光弱吸收性樹脂構件2之接觸部位以外,並未見到變色、燒焦或熔接痕。
(實施例4) (1)雷射光透過性樹脂構件1之製作 與實施例1同樣操作,製作雷射光透過性樹脂構件1。 (2)雷射光弱吸收性樹脂構件2之製作 除使用聚醯胺66樹脂(旭化成股份有限公司製,商品名:LEONA (註冊商標)1300S) 497.75g與苯胺黑A 0.75g及著色劑A 1.5g以外,與實施例3同樣操作,各製作1片長80mm×寬50mm×厚1mm之成為雷射光弱吸收性樹脂構件2之樹脂構件片2f及樹脂構件片2s。與實施例1同樣操作測定樹脂構件片2f、2s之熔融流動速率後,為16.2g/10分鐘。 (3)雷射光吸收性樹脂構件3之製作 與實施例3同樣操作,製作雷射光吸收性樹脂構件3。 (4)雷射熔接體10之製作 與實施例3同樣操作,獲得實施例4之雷射熔接體10。針對該雷射熔接體10,進行與實施例1同樣之評價。結果示於表2。
(實施例5) (1)雷射光透過性樹脂構件1之製作 將聚醯胺66樹脂(旭化成股份有限公司製,商品名:LEONA (註冊商標)1300S) 499.975g與苯胺黑A 0.025g饋入不鏽鋼製滾筒攪拌混合1小時,調製雷射光透過性樹脂構件1用之樹脂組成物。該樹脂組成物藉由與實施例1同樣操作予以成形,製作1片長80mm×寬50mm×厚1mm之雷射光透過性樹脂構件1。
(2)雷射光弱吸收性樹脂構件2之製作 將聚醯胺66樹脂(旭化成股份有限公司製,商品名:LEONA (註冊商標)1300S) 499.85g與苯胺黑A 0.15g饋入不鏽鋼製滾筒攪拌混合1小時,調製雷射光弱吸收性樹脂構件2用之樹脂組成物。該樹脂組成物藉由與實施例1同樣操作予以成形,各製作1片長80mm×寬50mm×厚1mm之成為雷射光弱吸收性樹脂構件2之樹脂構件片2f及樹脂構件片2s。與實施例1同樣操作測定樹脂構件片2f、2s之熔融流動速率後,為13.8g/10分鐘。
(3)雷射光吸收性樹脂構件3之製作 將聚醯胺66樹脂(旭化成股份有限公司製,商品名:LEONA (註冊商標)1300S) 499.8g與苯胺黑A 0.2g饋入不鏽鋼製滾筒攪拌混合1小時,調製雷射光吸收性樹脂構件3用之樹脂組成物。該樹脂組成物藉由與實施例1同樣操作予以成形,製作1片長80mm×寬50mm×厚1mm之雷射光吸收性樹脂構件3。
(4)雷射熔接體10之製作 除將雷射光L之掃描速度設為0.4mm/秒以外,與實施例1同樣操作,獲得實施例5之雷射熔接體10。針對該雷射熔接體10,進行與實施例1同樣之評價。結果示於表2。
(實施例6) (1)雷射光透過性樹脂構件1之製作 與實施例3同樣操作,製作雷射光透過性樹脂構件1。 (2)雷射光弱吸收性樹脂構件2之製作 與實施例1同樣操作,製作成為雷射光弱吸收性樹脂構件2之兩樹脂構件片2f、2s。 (3)雷射光吸收性樹脂構件3之製作 與實施例1同樣操作,製作雷射光吸收性樹脂構件3。 (4)雷射熔接體10之製作 與實施例1同樣操作,獲得實施例6之雷射熔接體10。針對該雷射熔接體10,進行與實施例1同樣之評價。結果示於表2。
(實施例7) (1)雷射光透過性樹脂構件1之製作 除替代著色劑A而設為著色劑B 1.5g以外,與實施例3同樣操作,製作雷射光透過性樹脂構件1。 (2)雷射光弱吸收性樹脂構件2之製作 與實施例1同樣操作,製作成為雷射光弱吸收性樹脂構件2之兩樹脂構件片2f、2s。 (3)雷射光吸收性樹脂構件3之製作 與實施例1同樣操作,製作雷射光吸收性樹脂構件3。 (4)雷射熔接體10之製作 與實施例1同樣操作,獲得實施例7之雷射熔接體10。針對該雷射熔接體10,進行與實施例1同樣之評價。結果示於表2。
(實施例8) (1)雷射光透過性樹脂構件1之製作 除替代著色劑A而設為著色劑C 1.5g以外,與實施例3同樣操作,製作雷射光透過性樹脂構件1。 (2)雷射光弱吸收性樹脂構件2之製作 與實施例1同樣操作,製作成為雷射光弱吸收性樹脂構件2之兩樹脂構件片2f、2s。 (3)雷射光吸收性樹脂構件3之製作 與實施例1同樣操作,製作雷射光吸收性樹脂構件3。 (4)雷射熔接體10之製作 與實施例1同樣操作,獲得實施例8之雷射熔接體10。針對該雷射熔接體10,進行與實施例1同樣之評價。結果示於表2。
(實施例9) (1)雷射光透過性樹脂構件1之製作 除替代著色劑A而設為著色劑D 1.5g以外,與實施例3同樣操作,製作雷射光透過性樹脂構件1。 (2)雷射光弱吸收性樹脂構件2之製作 與實施例1同樣操作,製作成為雷射光弱吸收性樹脂構件2之兩樹脂構件片2f、2s。 (3)雷射光吸收性樹脂構件3之製作 與實施例1同樣操作,製作雷射光吸收性樹脂構件3。 (4)雷射熔接體10之製作 與實施例1同樣操作,獲得實施例9之雷射熔接體10。針對該雷射熔接體10,進行與實施例1同樣之評價。結果示於表2。
(實施例10) (1)雷射光透過性樹脂構件1之製作 除替代著色劑A而設為蒽醌藍色酸性染料(C.I.酸性藍80)與六亞甲基二胺之藍色造鹽染料1.5g以外,與實施例3同樣操作,製作雷射光透過性樹脂構件1。 (2)雷射光弱吸收性樹脂構件2之製作 與實施例3同樣操作,製作成為雷射光弱吸收性樹脂構件2之兩樹脂構件片2f、2s。 (3)雷射光吸收性樹脂構件3之製作 與實施例3同樣操作,製作雷射光吸收性樹脂構件3。 (4)雷射熔接體10之製作 與實施例3同樣操作,獲得實施例10之雷射熔接體10。針對該雷射熔接體10,進行與實施例1同樣之評價。結果示於表2。
(實施例11) (1)雷射光透過性樹脂構件1之製作 除替代著色劑A而設為蒽醌藍色油溶性染料(C.I.溶劑藍104)1.5g以外,與實施例3同樣操作,製作雷射光透過性樹脂構件1。 (2)雷射光弱吸收性樹脂構件2之製作 與實施例3同樣操作,製作成為雷射光弱吸收性樹脂構件2之兩樹脂構件片2f、2s。 (3)雷射光吸收性樹脂構件3之製作 與實施例3同樣操作,製作雷射光吸收性樹脂構件3。 (4)雷射熔接體10之製作 與實施例3同樣操作,獲得實施例11之雷射熔接體10。針對該雷射熔接體10,進行與實施例1同樣之評價。結果示於表2。
(實施例12) (1)雷射光透過性樹脂構件1之製作 除替代著色劑A而設為紫環酮紅色油溶性染料(C.I.溶劑紅179)1.5g以外,與實施例3同樣操作,製作雷射光透過性樹脂構件1。 (2)雷射光弱吸收性樹脂構件2之製作 與實施例3同樣操作,製作成為雷射光弱吸收性樹脂構件2之兩樹脂構件片2f、2s。 (3)雷射光吸收性樹脂構件3之製作 與實施例3同樣操作,製作雷射光吸收性樹脂構件3。 (4)雷射熔接體10之製作 與實施例3同樣操作,獲得實施例12之雷射熔接體10。針對該雷射熔接體10,進行與實施例1同樣之評價。結果示於表2。
(實施例13) (1)雷射光透過性樹脂構件1之製作 將聚醯胺66樹脂(旭化成股份有限公司製,商品名:LEONA(註冊商標)1300S) 499.9g與苯胺黑A 0.1g饋入不鏽鋼製滾筒攪拌混合1小時,調製雷射光透過性樹脂構件1用之樹脂組成物。該樹脂組成物藉由與實施例1同樣操作予以成形,製作1片長80mm×寬50mm×厚1mm之雷射光透過性樹脂構件1。 (2)雷射光弱吸收性樹脂構件2之製作 除使用聚醯胺66樹脂(旭化成股份有限公司製,商品名:LEONA (註冊商標)1300S) 499.6g與苯胺黑A 0.4g以外,與實施例1同樣,各製作1片成為雷射光弱吸收性樹脂構件2之樹脂構件片2f及樹脂構件片2s。 (3)雷射光吸收性樹脂構件3之製作 除使用聚醯胺66樹脂(旭化成股份有限公司製,商品名:LEONA (註冊商標)1300S) 499.25g與苯胺黑A 0.75g以外,與實施例1同樣製作1片雷射光吸收性樹脂構件3。 (4)雷射熔接體10之製作 除將雷射光L之掃描速度設為1.0mm/秒以外,與實施例1同樣操作,獲得實施例13之雷射熔接體10。針對該雷射熔接體10,進行與實施例1同樣之評價。結果示於表2。
(實施例14) (1)雷射光透過性樹脂構件1之製作 與實施例1同樣操作,製作雷射光透過性樹脂構件1。 (2)雷射光弱吸收性樹脂構件2之製作 除使用聚醯胺66樹脂(旭化成股份有限公司製,商品名:LEONA (註冊商標)1300S) 499.5g與苯胺黑A 0.5g以外,與實施例1同樣,各製作1片成為雷射光弱吸收性樹脂構件2之樹脂構件片2f及樹脂構件片2s。 (3)雷射光吸收性樹脂構件3之製作 除使用聚醯胺66樹脂(旭化成股份有限公司製,商品名:LEONA (註冊商標)1300S) 499g與苯胺黑A 1.0g以外,與實施例1同樣製作1片雷射光吸收性樹脂構件3。 (4)雷射熔接體10之製作 除將雷射光L之掃描速度設為1.4mm/秒以外,與實施例1同樣操作,獲得實施例14之雷射熔接體10。針對該雷射熔接體10,進行與實施例1同樣之評價。結果示於表2。
(實施例15) (1)雷射光透過性樹脂構件1之製作 與實施例1同樣操作,製作雷射光透過性樹脂構件1。 (2)雷射光弱吸收性樹脂構件2之製作 除使用聚醯胺66樹脂(旭化成股份有限公司製,商品名:LEONA (註冊商標)1300S) 499.25g與苯胺黑A 0.75g以外,與實施例1同樣,各製作1片成為雷射光弱吸收性樹脂構件2之樹脂構件片2f及樹脂構件片2s。與實施例1同樣測定兩樹脂構件片2f、2s之熔融流動速率後,為15.8g/10分鐘。 (3)雷射光吸收性樹脂構件3之製作 除使用聚醯胺66樹脂(旭化成股份有限公司製,商品名:LEONA (註冊商標)1300S) 498g與苯胺黑A 2.0g以外,與實施例1同樣製作1片雷射光吸收性樹脂構件3。 (4)雷射熔接體10之製作 除將雷射光L之掃描速度設為1.4mm/秒以外,與實施例1同樣操作,獲得實施例15之雷射熔接體10。針對該雷射熔接體10,進行與實施例1同樣之評價。結果示於表2。
(比較例1) 將聚醯胺66樹脂499.5g與苯胺黑A(苯胺黑的硫酸鹽;硫酸離子1.96質量%;體積阻抗率2.0×1010
Ω・cm)0.5g饋入不鏽鋼製滾筒中攪拌混合1小時,調製樹脂組成物。該樹脂組成物使用射出成形機,藉由汽缸溫度290℃、模具溫度80℃之通常方法予以成形,製作2片長80mm×寬50mm×厚1mm之樹脂構件片。將該樹脂構件片之端部彼此對接接觸,於兩樹脂構件片之對接方向,施加400N之荷重並且以跨及兩樹脂構件之方式於該等之表面載置5mm厚之玻璃板(雷射光透過率90%)之玻璃板予以固定。沿著對接部位以掃描速度1mm/秒,掃描距離20mm邊掃描邊照射雷射光。藉此使該對接部位熔接,接合樹脂構件片,獲得比較例1之比較雷射熔接體。針對該比較雷射熔接體,進行與實施例1同樣之評價。於比較雷射熔接體見到熔接痕。其結果示於表2。
(比較例2) 除了使用雷射光透過性樹脂構件用樹脂組成物中含有之聚醯胺66樹脂499.8g與苯胺黑A 0.2g,雷射光弱吸收性樹脂構件用樹脂組成物中含有之聚醯胺66樹脂499.5g與苯胺黑A 0.5g,及雷射光吸收性樹脂構件用樹脂組成物中含有之聚醯胺66樹脂498.0g與苯胺黑A 2.0g以外,與實施例5同樣成形各樹脂構件及樹脂構件片。將該等以與實施例5同樣對接並重疊而製作之層合體,將掃描速度設為3.0mm/秒以外,與實施例5同樣照射雷射光,但樹脂構件彼此未熔接,無法獲得雷射熔接體。比較例2之各樹脂構件之吸光度示於表2。
(比較例3) 除了使用雷射光透過性樹脂構件用樹脂組成物中含有之聚醯胺66樹脂499.7g與苯胺黑A 0.3g,雷射光弱吸收性樹脂構件用樹脂組成物中含有之聚醯胺66樹脂499.25g與苯胺黑A 0.75g,及雷射光吸收性樹脂構件用樹脂組成物中含有之聚醯胺66樹脂498.0g與苯胺黑A 2.0g以外,與實施例5同樣成形各樹脂構件及樹脂構件片。將該等以與實施例5同樣對接並重疊而製作之層合體,將掃描速度設為2.0mm/秒以外,與實施例5同樣照射雷射光,但樹脂構件彼此未熔接,無法獲得雷射熔接體。比較例3之各樹脂構件之吸光度示於表2。
(比較例4) 與實施例1同樣操作,分別製作1片雷射光透過性樹脂構件1以及成為雷射光弱吸收性樹脂構件2之樹脂構件片2f及樹脂構件片2s。除聚醯胺66樹脂(旭化成股份有限公司製,商品名:LEONA(註冊商標) 1300S) 494.2g與苯胺黑A 5.8g以外,與實施例1同樣製作1片雷射光吸收性樹脂構件3。除將雷射光L之掃描速度設為1.4mm/秒以外,與實施例1同樣操作,獲得比較例4之雷射熔接體。針對該比較雷射熔接體,進行與實施例1同樣之評價。結果示於表2。
如由表2所了解,實施例1~15之雷射熔接體10於對接部位B及接觸部位C1-2
、C2-3
確實熔接,均具有高的拉伸強度。另一方面比較例1,僅於對接部位具有熔接,由於不具有樹脂構件之重疊,故與實施例之雷射熔接體10比較,顯示低的拉伸強度。又,比較例2及3中,由於各具有0.24及0.36之較高吸光度a1
,故雷射光無法透過,3層樹脂構件彼此無法熔接。比較例4中,雷射光弱吸收性樹脂構件與雷射光吸收性樹脂構件之間產生燒焦。 [產業上之可利用性]
本發明之雷射熔接體由於可較好地廣泛適用於例如內裝之儀錶板、引擎室內之共振器(消音器)、引擎蓋、驅動裝置、剎車裝置、車輛用燈體、如電裝品之輸送用機器(尤其是汽車)用之零件、電氣電子機器零件、產業機械用零件、輸液或營養劑點滴時使用之醫療用管、如封入流動食品或飲料組成物之吸口鋁箔包之食品包材、塑膠瓶之標籤、及如外裝之加電製品零件等,故產業上利用性非常高。
1‧‧‧雷射光透過性樹脂構件2‧‧‧雷射光弱吸收性樹脂構件2f、2s‧‧‧樹脂構件片3‧‧‧雷射光吸收性樹脂構件10‧‧‧雷射熔接體B、B1
、B2
‧‧‧對接部位C1-2
、C2-3
‧‧‧接觸部位L‧‧‧雷射光
圖1係顯示隔著具備2種樹脂構件之第2樹脂構件的對接部位使第1及第3樹脂構件重疊,藉由雷射熔接,而製造適用本發明之雷射熔接體之中途的示意剖面圖。 圖2係顯示隔著藉由彎曲而使端部彼此對接之一個第2樹脂構件的對接部位使第1及第3樹脂構件重疊,藉由雷射熔接,而製造適用本發明之雷射熔接體之中途的示意剖面圖。 圖3係顯示將藉由2種樹脂構件之端部對接而形成為圓筒狀之第2樹脂構件插入於第1樹脂構件中,將圓筒狀之第3樹脂構件插入於第2樹脂構件中,而使第1~第3樹脂構件重疊,藉由雷射熔接,而製造適用本發明之雷射熔接體之中途的立體圖及該等之前視圖。 圖4係適用本發明之實施例3的雷射熔接體之熔接部位的對接部位及接觸部位之剖面放大照片。
1‧‧‧雷射光透過性樹脂構件
2‧‧‧雷射光弱吸收性樹脂構件
2f、2s‧‧‧樹脂構件片
3‧‧‧雷射光吸收性樹脂構件
10‧‧‧雷射熔接體
B‧‧‧對接部位
C1-2、C2-3‧‧‧接觸部位
L‧‧‧雷射光
Claims (8)
- 一種雷射熔接體,其特徵係藉由使具有0.01~0.12之吸光度a1且為雷射光被照射構件之第1樹脂構件、具有0.1~0.9之吸光度a2且包含單個或複數個樹脂構件之端部接觸所成之對接部位之第2樹脂構件、及具有0.2~3.8之吸光度a3之第3樹脂構件之含有熱塑性樹脂的至少三種樹脂構件中之前述第2樹脂構件及前述第3樹脂構件含有苯胺黑(nigrosine)作為雷射光吸收劑,而顯示前述吸光度a2及a3,藉由依此順序使前述樹脂構件重疊而於該等之界面具有接觸部位,且前述對接部位及前述接觸部位之至少一部分一同經雷射熔接,前述熱塑性樹脂係選自聚醯胺樹脂、聚碳酸酯樹脂、聚苯硫醚樹脂、聚對苯二甲酸乙二酯樹脂、聚對苯二甲酸丁二酯樹脂及聚丙烯樹脂中之至少一者,該雷射熔接體具有至少700N之拉伸強度。
- 如請求項1之雷射熔接體,其中前述苯胺黑之體積電阻率為3.0×109~1.0×1011Ω‧cm。
- 如請求項1或2之雷射熔接體,其中前述苯胺黑為苯胺黑硫酸鹽,前述苯胺黑硫酸鹽中硫酸離子濃度為0.3~5質量%。
- 如請求項1或2之雷射熔接體,其中前述第2樹脂構件之熔融流動速率為11~30g/10分鐘。
- 如請求項1或2之雷射熔接體,其中前述第2樹脂構件具備各具有吸光度a2f及吸光度a2s之2種前述樹脂構件,前述吸光度a2f與前述吸光度a2s之吸光度比a2f/a2s為0.3~1.2。
- 如請求項1或2之雷射熔接體,其中前述吸光度a1為0.01~0.09。
- 如請求項1或2之雷射熔接體,其中前述第1樹脂構件包含蒽醌染料。
- 一種雷射熔接體之製造方法,其特徵係吸光度a1為0.01~0.12之第1樹脂構件、使吸光度a2為0.1~0.9之單個或複數個樹脂構件的端部接觸而形成對接部位之第2樹脂構件、與吸光度a3為0.2~3.8之第3樹脂構件含有選自聚醯胺樹脂、聚碳酸酯樹脂、聚苯硫醚樹脂、聚對苯二甲酸乙二酯樹脂、聚對苯二甲酸丁二酯樹脂及聚丙烯樹脂中之至少一者,前述第2樹脂構件及第3樹脂構件藉由含有苯胺黑作為雷射光吸收劑而顯示前述吸光度a2及a3,前述第1~第3樹脂構件之至少三者重疊,於該等之界面形成接觸部位,自前述第1樹脂構件側對前述對接部位及前述接觸部 位照射雷射光,而使前述對接部位及前述接觸部位之至少一部分一同熔接,該雷射熔接體具有至少700N之拉伸強度。
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