TWI759630B - Cooling system and cooling method - Google Patents

Abstract

A cooling system is disclosed herein. The system includes a tank, a tube, a cooler, and a concentration meter. The tank is configured to contain first liquid. The tube is coupled to the tank and configured to convey the first liquid from the tank. The cooler covers the tube to cool the first liquid conveyed by the tube. The concentration meter is configured to measure a concentration of the first liquid cooled by the cooler.

Description

Cooling system and cooling method

The present disclosure relates to a cooling technique and further to a residue treatment technique.

Due to manufacturing requirements, residues of semiconductors in each manufacturing process should be removed. However, there is no adequate way to remove semiconductor residues. Thus, sufficient and precise removal of semiconductor residues has become a key issue in the field of semiconductor technology.

The present disclosure provides a cooling system including a storage tank, a conduit, a cooler and a concentration meter. The storage tank is used for containing a first liquid. A conduit is coupled to the sump and serves to deliver the first liquid from the sump. A cooler covers the conduit to cool the first liquid delivered by the conduit. The concentration meter is used to measure a concentration of the first liquid cooled by the cooler.

The present disclosure also provides a cooling system including a cleaning device and a concentration measuring device. The cleaning device includes a storage tank and a pipeline. The storage tank is used for containing a first liquid. A pipe is coupled to the sump, and the first liquid is in the pipe Circulating flow inside the channel and the storage tank. The concentration measuring device includes a duct, a cooler, a concentration meter and a fan. A conduit is coupled to the conduit and serves to deliver the first liquid from the conduit. A cooler covers the conduit to cool the first liquid delivered by the conduit. The concentration meter is used to measure a concentration of the first liquid cooled by the cooler. A fan is arranged on one side of the concentration meter to cool the concentration measuring device.

The present disclosure also provides a cooling method, comprising: leading a first liquid at a first temperature from a storage tank through a conduit, cooling the first liquid delivered by the conduit to a second temperature by means of a cooler covering the conduit, and measuring the temperature at the second temperature The temperature of the concentration of the first liquid, the first liquid system is delivered by the catheter. A second liquid is provided into the sump according to the concentration of the first liquid, and the first liquid is heated to a first temperature to remove residues of the semiconductor device resulting from the manufacturing process.

100: Cleaning device

110: Storage tank

112: Inner storage tank

114, 116: External storage tank

120, 170: Pipes

121, 123, 125, 127, 129: Valves

130: Pump

140: Heater

150: Filter

160: Oscillator

200: Concentration measuring device

210: Tube

220: Cooler

221: Fan

222, 223: Spiral hose

224, 250: Pump

226: Condenser

228: Shell

230: Densitometer

240: Fan

260: Processor

310~380: Operation

500: liquid

600: Semiconductor Devices

602: Semiconductor substrate

604: Patterned Mask

702: Groove

704: Fins

706: Dielectric layer

N1, N2: Nodes

Aspects of the present disclosure are best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that in accordance with standard practice in the industry, the various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or decreased for clarity of discussion.

FIG. 1 is a schematic diagram of a system according to various embodiments of the present disclosure; FIG. 2 is a flowchart illustrating a method for operating the system in FIG. 1 according to various embodiments of the present disclosure; and FIG. 3 is a schematic diagram of various embodiments of the present disclosure. The schematic diagram of the cooler of the system as shown in Figure 1; Fig. 4 is a schematic diagram of a cooler of the system shown in Fig. 1 according to various embodiments of the present disclosure; Fig. 5 is a schematic diagram of a cooler of the system shown in Fig. 1 according to various embodiments of the present disclosure; Fig. 6 Fig. 7 is a schematic diagram of a system according to various embodiments of the present disclosure; Fig. 7 is a schematic diagram of a system according to various embodiments of the present disclosure; Fig. 8 is a schematic diagram of a system according to various embodiments of the present disclosure; Fig. 9 is a schematic diagram of a system according to various embodiments of the present disclosure 8 is a schematic diagram of a cooler of the system shown in FIG. 8; FIG. 10 is a cross-sectional view of a semiconductor device shown in FIG. 1 according to various embodiments of the present disclosure; and FIG. 11 is according to various embodiments of the present disclosure. FIG. 1 is a cross-sectional view of the semiconductor device shown in FIG. 1; FIG. 12 is a cross-sectional view of the semiconductor device shown in FIG. 1 according to various embodiments of the present disclosure.

The following disclosure provides many different embodiments or examples for implementing different features of the provided subject matter. Specific examples of elements and arrangements are described below to simplify the present disclosure. Of course, these are only examples and are not intended to be limiting. For example, in the following description forming a first feature over or on a second feature may include embodiments in which the first feature and the second feature are formed in direct contact; and may also include between the first feature and the second feature Embodiments in which additional features are formed such that the first and second features may not be in direct contact. also, The present disclosure may repeat reference numerals and/or letters in various instances. This repetition is for brevity and clarity and does not in itself indicate a relationship between the various embodiments and/or configurations discussed.

Terms used in this specification generally have their ordinary meanings in the art and in the specific context in which each term is used. The use of examples in this specification (including examples of any terms discussed herein) is illustrative only and does not in any way limit the scope and meaning of the disclosure or any exemplified terms. Likewise, the present disclosure is not limited to the various embodiments presented in this specification.

Although the terms "first," "second," etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish between elements. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the embodiments. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Terms used in this specification "comprise", "comprising", "include", "including", "has", "having", etc. Equivalent is open ended and means "including but not limited to".

Referring now to Figure 1. FIG. 1 is a schematic diagram of a system according to various embodiments of the present disclosure.

As illustratively shown in FIG. 1 , the system includes a cleaning device 100 and a concentration measuring device 200 . The cleaning device 100 includes a sump 110 , a pipe 120 , a pump 130 , a heater 140 , a filter 150 , and an oscillator 160 . Other In one aspect, the concentration measurement device 200 includes a conduit 210 , a cooler 220 , a concentration meter 230 , a fan 240 , a pump 250 , and a processor 260 .

In some embodiments, reference is now made to cleaning device 100 . Conduit 120 is coupled to sump 110 . Two terminals of the pump 130 are coupled to the pipeline 120, respectively. Explained in another way, the conduit 120 extends through the pump 130 . Two terminals of the heater 140 are coupled to the pipe 120, respectively. Explained another way, the conduit 120 extends through the heater 140 . Two terminals of the filter 150 are coupled to the pipe 120, respectively. Explained another way, the conduit 120 extends through the filter 150 .

In various embodiments, reference is now made to concentration measurement device 200 . The conduit 210 is coupled to the conduit 120 of the cleaning device 100 . The cooler 220 covers the conduit 210 . Concentrator 230 is coupled to conduit 210 . Processor 260 is coupled to densitometer 230 , fan 240 , and pump 250 . Pump 250 is coupled to conduit 210 .

The above discussion describes only exemplary connections that may be made in accordance with various alternative embodiments. It will be appreciated that such various alternative embodiments are not limited to the specific connections described above or those shown in FIG. 1 .

Referring now to Figure 2. FIG. 2 is a flowchart of a method 300 for operating the system of FIG. 1 in accordance with various embodiments of the present disclosure.

As illustratively shown in FIG. 2 , in operation 310 , the sump 110 is used to contain the liquid 500 . The liquid 500 is used to remove residues of the semiconductor device 600 resulting from the manufacturing process. In some embodiments, for example, liquid 500 is an etch residue remover, a positive photoresist stripper, or any suitable liquid for removing residues generated during a manufacturing process. In various embodiments, for example, the fabrication process is a deposition process, a photoresist coating process, an etching process, a patterning process, a removal process, or other process for fabricating a semiconductor device.

In operation 320 , the liquid 500 is moved to circulate inside the pipe 120 and the sump 110 . In some embodiments, the sump 110 includes an inner sump 112 and an outer sump 114 . The inner tank 112 is used to contain the liquid 500 inside. If the semiconductor device 600 is immersed in the liquid 500 and the inner tank 112 overflows, the overflowed liquid 500 is further contained by the outer tank 114 . In various embodiments, the circulation of liquid 500 begins in outer tank 114, valve 121 is opened to allow liquid 500 in outer tank 114 to flow through this valve into conduit 120, and then valve 123 is opened to allow liquid in inner tank 112 500 flows through this valve into conduit 120. The liquid 500 then flows through the valves 121 , 123 into the pump 130 and the pump 130 moves the liquid 500 in the pipe 120 . In some embodiments, for example, pump 130 is a lift pump, displacement pump, gravity pump, or any suitable device for moving liquid 500 in conduit 120 by mechanical action.

If the liquid 500 in the sump 112 is insufficient and the temperature is not higher than the predetermined temperature, the valve 125 is closed and the valve 127 is opened to allow the liquid 500 to flow through the valve into the pipeline 120 . Next, the liquid 500 flows through the heater 140 and is heated by this heater. If the liquid 500 in the sump 112 is insufficient and the temperature is not higher than the predetermined temperature, the liquid 500 passes through the valve 129 into the inner sump 112 from the side. In some embodiments, under the condition that the liquid 500 in the storage tank 112 is insufficient and the temperature is not higher than the predetermined temperature, the pressure of the pipeline 120 and the thickness of the liquid 500 are both too high. Under such conditions, the liquid 500 cannot flow through the filter 150, or the filter 150 will be damaged by the high pressure in the pipe 120 or the high thickness of the liquid 500. In various embodiments, for example, the valves 121, 123, 125, 127, 129 are hydraulic valves, pneumatic valves, or any suitable valve used to control the flow of liquid 500 through such valves. In some embodiments, for example, heater 140 is an electric heater, heating lamp, heating jacket, or any suitable device for heating the liquid 500.

When the liquid 500 in the sump 112 is sufficient and the temperature is higher than the predetermined temperature, the residue of the semiconductor device 600 may be removed by the cleaning device 100 . After removing the residue of the semiconductor device 600 , particles are present in the liquid 500 . The filter 150 is used to filter particles in the liquid 500 . Under such conditions, the circulation of liquid 500 starts from outer tank 114, valve 121 is opened to allow liquid 500 in outer tank 114 to flow through this valve into line 120, and then valve 123 is opened to allow liquid in inner tank 112 500 flows through this valve into conduit 120. The liquid 500 then flows through the valves 121 , 123 into the pump 130 and the pump 130 moves the liquid 500 in the pipe 120 . Next, valve 125 is opened and valve 127 is closed to allow liquid 500 to flow through valve 125 into filter 150 . The filter 150 filters particles in the liquid 500 and provides the liquid 500 without particles to the inner sump 112 . In some embodiments, the capacity of the sump 110 is in the range of 70 liters to 120 liters. If the capacity of the storage tank 110 is too high, it will be difficult to cool the liquid 500 in the storage tank 110 . On the other hand, if the capacity of the sump 110 is too low, it is difficult to use enough liquid 500 to remove the residue of the semiconductor device 600 so that the capacity of the sump 110 is within a predetermined range.

In operation 330 , catheter 210 is used to retrieve and deliver liquid 500 from conduit 120 . As illustratively shown in FIG. 1 , conduit 210 retrieves liquid 500 from node N1 of conduit 120 . However, in various embodiments, conduit 210 may retrieve liquid 500 from node N2 of conduit 120 or any suitable portion of conduit 120, depending on actual needs. In some embodiments, the diameter of the conduit 120 Tie in the range of 3 cm to 10 cm. In various embodiments, for example, the diameter of the conduit 120 is 10 centimeters. If the diameter of the pipe 120 is too high, it is difficult for the pump 250 to move the liquid 500 inside the pipe 120 . On the other hand, if the diameter of the pipe 120 is too low, it is difficult to circulate the liquid 500 inside the pipe 120 and the storage tank, so that the diameter of the pipe 120 is within a predetermined range. In some embodiments, the diameter of the catheter is in the range of 5 millimeters to 1 centimeter. In various embodiments, for example, the diameter of the catheter 210 is 5 millimeters. The conduit 210 is used for sampling, and the diameter of the conduit 210 may be smaller than the diameter of the conduit 120 . The flow rate of the liquid 500 in the conduit 210 is inversely proportional to the cross-section of the conduit 210 . Thus, if the diameter of the conduit 210 is less than 5 mm, the flow rate of the liquid 500 in the conduit 210 will be too fast. When the flow rate of the liquid 500 in the conduit 210 is too fast, the medicament does not have enough time to mix with the liquid 500, so that the concentration of the liquid 500 will be lower than the actual concentration, and the measurement results of the densitometer 230 are inaccurate. Conversely, if the diameter of the conduit 210 is greater than 1 cm, the flow rate of the liquid 500 in the conduit 210 will be too low. When the flow rate of the liquid 500 in the conduit 210 is too low, the concentration meter 230 cannot measure the concentration of the liquid 500.

In operation 340 , cooler 220 is used to cool liquid 500 delivered by conduit 210 . As illustratively shown in FIG. 1 , the cooler 220 covers the conduit 210 to effectively cool the liquid 500 delivered by the conduit 210 . In some embodiments, for example, the cooler 220 is a water cooling device. To facilitate understanding of the structure of the cooler 220, reference is now made to FIG. 3 . FIG. 3 is a schematic diagram of a cooler 220 of the system shown in FIG. 1 in accordance with various embodiments of the present disclosure.

As illustratively shown in FIG. 3 , the cooler 220 includes a coiled hose 222 , and the coiled hose 222 is disposed around the conduit 210 . In some embodiments, coiled hose 222 is disposed around and in contact with conduit 210 for facilitating cooler 220 to cool liquid 500 delivered by conduit 210 . In various embodiments, for example, the spiral hose 222 is a Polyurethane (PU) pipe, a PolyVinyl Chloride (PVC) pipe, or any suitable type of pipe. In some embodiments, for example, the liquid system in spiral hose 222 is used to circulate deionized water, condensate, or any suitable liquid that moves in spiral hose 222 to cool liquid 500 delivered by conduit 210 .

As illustratively shown in FIG. 3 , the cooler 220 includes a pump 224 coupled to the coiled hose 222 and used to move the liquid in the coiled hose 222 . In various embodiments, the pump 224 is positioned adjacent to node N1 as shown in FIG. 1 . In some embodiments, for example, the pump 224 is a submersible pump, an onshore pump, or any suitable pump for moving the liquid in the spiral hose 222 . As illustratively shown in Figure 3, the pump 224 moves the liquid in a counter-clockwise direction. However, the pump 224 may move the liquid in a clockwise direction, depending on actual needs.

The above discussion describes only exemplary connections and operations that may be made in accordance with various alternative embodiments. It will be appreciated that such various alternative embodiments are not limited to the specific connections and operations described above or those illustrated in FIG. 3 .

In order to understand the structure of the cooler 220, reference is now made to FIG. 4 . FIG. 4 is a schematic diagram of a cooler 220 of the system shown in FIG. 1 in accordance with various embodiments of the present disclosure.

As illustratively shown in FIG. 4 , for example, cooler 220 includes condenser 226 . Conduit 210 may be provided inside condenser 226 . Explained another way, the condenser 226 completely covers the conduit 210 . In various embodiments, for example, the liquid system in condenser 226 is used to circulate deionized water, condensate, or any suitable liquid that moves in condenser 226 to cool liquid 500 delivered by conduit 210 .

As illustratively shown in FIG. 4 , the cooler 220 includes a pump 224 coupled to the condenser 226 and used to move the liquid in the condenser 226 . In various embodiments, the pump 224 is positioned adjacent to node N1 as shown in FIG. 1 . As illustratively shown in Figure 4, the pump 224 moves the liquid in a clockwise direction. However, depending on actual needs, the pump 224 may move the liquid in a counterclockwise direction.

The above discussion describes only exemplary connections and operations that may be made in accordance with various alternative embodiments. It will be appreciated that such various alternative embodiments are not limited to the specific connections and operations described above or those illustrated in FIG. 4 .

In some embodiments, for example, cooler 220 is an air cooling device. Air cooling equipment is provided on the side of the duct 210 . To facilitate understanding of the structure of cooler 220, reference is now made to FIG. 5 . FIG. 5 is a schematic diagram of a cooler 220 of the system shown in FIG. 1 in accordance with various embodiments of the present disclosure.

As illustratively shown in FIG. 5 , the cooler 220 includes a housing 228 and a fan 221 . Housing 228 covers conduit 210 . The fan 221 is used to blow the air inside the housing 228 so that the liquid 500 delivered by the duct 210 can be cooled.

As illustratively shown in FIG. 5, in some embodiments, a fan 221 is provided to the side of the densitometer 230 in FIG. 1 . This arrangement can help the fan 221 stay away from the heater 140 in Figure 1, or the fan 221 blows the heat generated by the heater 140 to the duct 210 and the densitometer 230 in Figure 1.

The above discussion describes only exemplary connections and operations that may be made in accordance with various alternative embodiments. It will be appreciated that such various alternative embodiments are not limited to the specific connections and operations described above or to those shown in FIG. 5 .

In operation 350 , the concentration meter 230 is used to measure the concentration of the liquid 500 cooled by the cooler 220 . In various embodiments, the temperature of the liquid 500 in the sump 110 is in the range of 65 degrees Celsius to 80 degrees Celsius. In some embodiments, the temperature of the liquid 500 in the sump 110 is about 70 degrees Celsius. The properties of the medicament mixed in the liquid 500 will be exhibited by increasing its temperature and adding water to the liquid 500 to maintain its flow rate. When the temperature of the liquid 500 is lower than 65 degrees Celsius, the concentration of the liquid 500 will be too high to remove the residues of the semiconductor device 600 . Conversely, when the temperature of the liquid 500 is higher than 80 degrees Celsius, the removal rate of the liquid 500 is too high, so that the semiconductor device 600 may be damaged by the liquid 500 .

In some embodiments, the temperature of the liquid 500 in the sump 110 is in the range of 65 degrees Celsius to 80 degrees Celsius. In various embodiments, The temperature of the liquid 500 in the sump 110 is in the range of 110 degrees Celsius to 120 degrees Celsius. If the conduit 210 were to deliver the liquid 500 with this high temperature to the densitometer 230, the measurement of the liquid 500 from the densitometer 230 would be inaccurate. Thus, the cooler 220 serves to cool the liquid 500 delivered by the conduit 210 to a predetermined temperature in about two minutes. Compared to the prior art that cools the liquid in the conduit to a temperature in thirty minutes or more, the present disclosure provides a system with cooler 220 covering conduit 210 that can The liquid 500 delivered by the conduit 210 is cooled to a temperature. Thus, the liquid 500 is cooled more efficiently by the system of the present disclosure in FIG. 1 .

On the other hand, in various embodiments, the cooler 220 cools the liquid 500 in the conduit 210 to a temperature in the range of 26 degrees Celsius to 29 degrees Celsius. In some embodiments, cooler 220 cools liquid 500 in conduit 210 to a temperature of less than 29 degrees Celsius. Thus, the system provided in Figure 1 can cool the liquid 500 delivered by the conduit 210 to the point where the densitometer 230 can accurately measure the temperature of the liquid 500.

In operation 360 , the fan 240 is used to cool the concentration measuring device 200 . In various embodiments, the fan 240 in the concentration measurement device 200 is used to cool the processor 260 . However, due to the fact that the fan 240 is positioned inside the concentration measurement device 200 , the fan 240 helps to cool the liquid 500 delivered by the conduit 210 . In some embodiments, the fan 240 is positioned on the side of the densitometer 230 . Such an arrangement can help the fan 240 stay away from the heater 140 , and the fan 240 blows the heat generated by the heater 140 to the concentration measuring device 200 .

In operation 370 , the pump 250 is used to provide the liquid into the sump 110 according to the concentration of the liquid 500 . In operation 380, the heater 140 is used to The liquid is heated to a high temperature to remove residues of the semiconductor device 600 resulting from the manufacturing process.

In some embodiments, the oscillator 160 along with the liquid 500 in the tank 110 is used to remove residues of the semiconductor device 600 resulting from the manufacturing process. In some embodiments, for example, oscillator 160 is an ultrasonic oscillator. The ultrasonic oscillator is used to provide ultrasonic waves to help the semiconductor device 600 remove residues generated by the manufacturing process. In various embodiments, the processor 260 is coupled between the densitometer 230 and the pump 250, and the processor 260 is used to control the pump 250 according to the concentration of the liquid 500 to provide the liquid into the conduit 120. In some embodiments, the sump 110 further includes an outer sump 116 . If the semiconductor device 600 is immersed in the liquid 500 and the inner tank 112 overflows, the overflowed liquid 500 is further contained by the outer tank 114 . However, if the outer sump 114 also overflows, the overflowed liquid 500 may be further contained by the outer sump 116 .

Referring now to Figure 6. 6 is a schematic diagram of a system according to various embodiments of the present disclosure.

As illustratively shown in Figure 6, the pump 224 used to move the coiled hose 222 and the liquid in the condenser 226 in Figures 3 to 4 may be replaced by the pump 250 in Figure 6. The pump 250 in Figure 6 is coupled to both the cooler 220 and the densitometer 230. The pump 250 is used to move the liquid in the cooler 220 for cooling the liquid 500 delivered by the conduit 210 and to provide the liquid into the sump 110 according to the concentration of the liquid 500 . Thus, since the pump 250 in FIG. 6 is used as the pump of the cooler 220 , the number of pumps 224 in FIGS. 3 to 4 inside the cooler 220 can be reduced. In various embodiments, for example, pump 250 is a deionization spike pump.

The above discussion describes only exemplary connections and operations that may be made in accordance with various alternative embodiments. It will be appreciated that the various alternative embodiments are not limited to the specific connections and operations described above or those shown in FIG. 6 .

Reference is now made to Figure 7. FIG. 7 is a schematic diagram of a system according to various embodiments of the present disclosure.

As illustratively shown in Figure 7, the pump 224 used to move the coiled hose 222 and the liquid in the condenser 226 in Figures 3 to 4 may be replaced by the pump 260 in Figure 7. Pump 250 is coupled to concentration meter 230 and processor 260 . The pump 250 is used to provide the liquid 500 into the sump 110 by the processor 260 according to the concentration of the liquid 500 . On the other hand, the pump 260 is coupled to the cooler 220 and is disposed adjacent to the densitometer 230 . In some embodiments, pump 260 and pump 250 are arranged in parallel. Pump 260 is used to move the liquid in cooler 220 for cooling liquid 500 delivered by conduit 210 . In various embodiments, for example, pump 250 and pump 260 are deionization spike pumps.

The above discussion describes only exemplary connections and operations that may be made in accordance with various alternative embodiments. It will be appreciated that such various alternative embodiments are not limited to the specific connections and operations described above or those illustrated in FIG. 7 .

Referring now to Figure 8. FIG. 8 is a schematic diagram of a system according to various embodiments of the present disclosure.

As illustratively shown in Figure 8, the cleaning device 100 further includes at least one air valve 129 for controlling the flow path of the liquid 500 in the conduit 120, and which will be used to control the at least one air valve Air from door 129 is delivered to cooler 220 to cool liquid 500 delivered by conduit 210 . In some embodiments, for example, valve 129 is a pneumatic valve. The valve 129 is thus controlled by air, and the air is delivered to the cooler 220 through the conduit 170 for cooling the liquid 500 delivered by the conduit 210 .

To understand the structure of the cooler 220, reference is now made to FIG. 9 . FIG. 9 is a schematic diagram of a cooler 220 of the system shown in FIG. 8 in accordance with various embodiments of the present disclosure.

As illustratively shown in FIG. 8 , the cooler 220 includes a coiled hose 223 , and the coiled hose 222 is provided around the conduit 210 . In some embodiments, helical hose 223 is disposed around and in contact with conduit 210 for facilitating cooler 220 to cool liquid 500 delivered by conduit 210 . In various embodiments, the coiled hose 223 is used to deliver air for controlling the valve 129 for cooling the liquid 500 delivered by the conduit 210 . However, in some embodiments, for example, the valves 121, 123, 125, 127 are pneumatic valves. Thus, the spiral hose 223 is used to deliver air for controlling the valves 121, 123, 125, 127, depending on the actual needs. In various embodiments, for example, the spiral hose 223 is a polyurethane (PU) pipe, a polyvinyl chloride (PVC) pipe, or any suitable type of pipe.

The above discussion describes only exemplary connections and operations that may be made in accordance with various alternative embodiments. It will be appreciated that the various alternative embodiments are not limited to the specific connections and operations described above or those shown in FIG. 9 .

Referring now to Figure 10. FIG. 10 is an illustration of a cross-sectional view of a semiconductor device 600 as shown in FIG. 1 in accordance with various embodiments of the present disclosure. intention. As shown, a patterned mask 604 is formed on the semiconductor substrate 602 . Reference is now made to Figure 11. FIG. 11 is a schematic illustration of a cross-sectional view of a semiconductor device 600 as shown in FIG. 1 in accordance with various embodiments of the present disclosure. As shown, exposed portions of semiconductor substrate 602 may be etched to form trenches 702 in semiconductor substrate 602 . The semiconductor substrate 602 forms fins 704 in regions between adjacent trenches 702 . The trenches 702 may be filled by forming a dielectric layer 706 over the patterned mask 604 and substantially filling the trenches 702 . Reference is now made to Figure 12. FIG. 12 is a cross-sectional view of a semiconductor device 600 as shown in FIG. 1 in accordance with various embodiments of the present disclosure. As shown, the patterned mask 604 is removed. Some residue remains on the semiconductor device 600 after removing the patterned mask 604 . At this time, the semiconductor device 600 is put into the sump 110 filled with the liquid 500 , and the liquid 500 is used to remove the residue of the semiconductor device 600 .

The present disclosure also provides a system. The system includes a sump, conduit, cooler, and a concentration meter. The sump is used to hold the first liquid. A conduit is coupled to the sump and serves to deliver the first liquid from the sump. A cooler covers the conduit to cool the first liquid delivered by the conduit. The concentration meter is used to measure the concentration of the first liquid cooled by the cooler.

In some embodiments, the cooler includes a water cooling device covering the conduit, and the water cooling device includes a helical hose disposed around the conduit.

In various embodiments, the water cooling device includes a condenser, and the tubes are disposed inside the condenser.

In some embodiments, the system further includes a pump. The pump is coupled to the cooler and the concentration meter. The pump is used to move the second liquid in the cooler for The first liquid delivered by the conduit is cooled and a second liquid is provided into the sump according to the concentration of the first liquid.

In various embodiments, the system further includes a first pump and a second pump. The first pump is coupled to the densitometer. The first pump is used to provide the second liquid into the sump according to the concentration of the first liquid. A second pump is coupled to the cooler and positioned adjacent to the densitometer. The second pump and the first pump are arranged in parallel. The second pump is used to move the second liquid in the cooler for cooling the first liquid delivered by the conduit.

In some embodiments, the system further includes a processor. The processor is coupled between the densitometer and the first pump. The processor is used for controlling the first pump according to the concentration of the first liquid.

In various embodiments, the cooler includes an air cooling device disposed on the side of the conduit.

In some embodiments, the air cooling device includes a housing and a fan. The casing covers the conduit. A fan is provided on the side of the densitometer and is used to blow the air inside the housing.

The present disclosure also provides a system including a cleaning device and a concentration measuring device. The cleaning device includes storage tanks and pipes. The sump is used to hold the first liquid. A pipe is coupled to the sump. The first liquid circulates in the pipeline and the storage tank. The concentration measuring device includes a duct, a cooler, a concentration meter, and a fan. A conduit is coupled to the conduit and serves to deliver the first liquid from the conduit. A cooler covers the conduit to cool the first liquid delivered by the conduit. The concentration meter is used to measure the concentration of the first liquid cooled by the cooler. A fan is placed on the side of the densitometer to cool the densitometer.

In some embodiments, the cleaning device further includes at least one air valve for controlling the flow path of the first liquid in the conduit, and the air for controlling the at least one air valve is delivered to the cooler for cooling delivered by the conduit the first liquid.

In various embodiments, the cooler includes a coiled hose. A coiled hose is disposed around the conduit, and the coiled hose is used to deliver air for controlling at least one air valve for cooling the first liquid delivered by the conduit.

In some embodiments, the cooler includes a housing. The casing covers the conduit. The air used to control the air valve is delivered to the housing for blowing air inside the housing.

In various embodiments, the cooler includes a housing and a fan. The casing covers the conduit. A fan is provided on the side of the densitometer and is used to blow the air inside the housing.

In some embodiments, the cooler includes a water cooling device. Water cooling equipment covers the conduits. Water cooling equipment consists of spiral hoses. A coiled hose is arranged around the conduit.

In various embodiments, the concentration measurement device further includes a pump. The pump is coupled to the cooler and the concentration meter. A pump is used to move the second liquid in the cooler for cooling the first liquid delivered by the conduit and to provide the second liquid into the conduit according to the concentration of the first liquid.

In some embodiments, the concentration measurement device includes a first pump and a second pump. The first pump is coupled to the densitometer. The second pump is used to supply the second liquid into the pipeline according to the concentration of the first liquid. A second pump is coupled to the cooler and positioned adjacent to the densitometer. The second pump and the first pump are arranged in parallel. For the second pump The second liquid in the mobile cooler is used to cool the first liquid delivered by the conduit.

In various embodiments, the concentration measurement device includes a processor. A processor is coupled between the densitometer and the first pump. The processor is used to control the first pump according to the concentration of the first liquid, and the fan is used to cool the processor.

The present disclosure also provides a method comprising the following operations. A first liquid at a first temperature is drawn from the sump via a conduit. The first liquid delivered by the conduit is cooled to the second temperature by a cooler covering the conduit. The concentration of the first liquid delivered by the catheter at the second temperature is measured. The second liquid is provided into the sump according to the concentration of the first liquid. The first liquid is heated to a first temperature to remove residues of the semiconductor device resulting from the manufacturing process.

In some embodiments, cooling the first liquid delivered by the conduit to the second temperature with a cooler covering the conduit includes cooling the first liquid delivered by the conduit to a temperature with a water cooling device comprising a helical hose disposed around the conduit second temperature.

In some embodiments, cooling the first liquid delivered by the conduit to the second temperature by a cooler covering the conduit comprises: cooling the first liquid delivered by the conduit with an air cooling device comprising an enclosure covering the conduit and a fan blowing air inside the enclosure The first liquid is cooled to the second temperature.

The foregoing outlines features of several embodiments so that those skilled in the art may better understand aspects of the present disclosure. Those skilled in the art should appreciate that the present disclosure may be readily utilized as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments described herein. Those skilled in the art will also recognize that such equivalent constructions do not Various changes, substitutions and alterations herein can be made without departing from the spirit and scope of the present disclosure.

N1, N2: Nodes

100: Cleaning device

110: Storage tank

112: Inner storage tank

114, 116: External storage tank

120: Pipes

130: Pump

140: Heater

150: Filter

160: Oscillator

121, 123, 125, 127, 129: Valves

200: Concentration measuring device

210: Catheter

220: Cooler

230: Densitometer

240: Fan

250: Pump

260: Processor

500: liquid

600: Semiconductor Devices

Claims (10)

A cooling system, comprising: a sump to contain a first liquid; a conduit coupled to the sump and to deliver the first liquid from the sump; a cooler covering the conduit for cooling delivered by the conduit the first liquid; a concentration meter for measuring a concentration of the first liquid cooled by the cooler; and a first pump coupled to the concentration meter for according to the concentration of the first liquid The concentration provides a second liquid in the cooler to the sump. The cooling system of claim 1, wherein the cooler includes: a water cooling device covering the conduit, and the water cooling device includes a coiled hose and a condenser disposed around the conduit, wherein the conduit is in the conduit The condenser is arranged inside; and an air cooling device arranged on one side of the duct, including: a casing, covering the duct; and a fan, arranged on one side of the concentration meter, and used to blow the air inside the casing . The cooling system of claim 1, wherein the first pump is coupled to the cooler and the densitometer, wherein the first pump is further adapted to move The second liquid in the cooler serves to cool the first liquid delivered by the conduit. The cooling system of claim 1, further comprising: a second pump coupled to the cooler and disposed adjacent to the concentration meter, wherein the second pump is disposed in parallel with the first pump, wherein the second pump is used for to move the second liquid in the cooler to cool the first liquid delivered by the conduit; and a processor coupled between the densitometer and the first pump, wherein the processor is used according to the This concentration of the first liquid controls the first pump. A cooling system, comprising: a cleaning device, comprising: a sump for containing a first liquid; and a pipe coupled to the sump, wherein the first liquid circulates within the duct and the sump; and a A concentration measuring device, comprising: a conduit coupled to the conduit and used to deliver the first liquid from the conduit; a cooler covering the conduit to cool the first liquid delivered by the conduit; a concentration meter with to measure a concentration of the first liquid cooled by the cooler; and a fan arranged on one side of the concentration meter to cool the concentration measuring device. The cooling system of claim 5, wherein the cleaning device further comprises at least one air valve for controlling a flow path of the first liquid in the conduit, and delivering air for controlling the at least one air valve to the cooler for controlling the first liquid delivered by the conduit; and the cooler comprising: a water cooling device covering the conduit, and the water cooling device comprising a helical hose disposed around the conduit, the a coiled hose for delivering the air for controlling the at least one air valve to cool the first liquid delivered by the conduit; a housing covering the conduit in which the air for controlling the air valve is to be delivered to the housing for blowing air inside the housing; and a fan provided on a side of the densitometer and used to blow air inside the housing. The cooling system of claim 5, wherein the concentration measuring device further comprises: a pump coupled to the cooler and the concentration meter, wherein the pump is used to move a second liquid in the cooler to The first liquid delivered by the conduit is cooled and the second liquid is provided into the conduit according to the concentration of the first liquid. The cooling system of claim 5, wherein the concentration measuring device further comprises: a first pump coupled to the concentration meter, wherein the first pump is used to convert a second liquid according to the concentration of the first liquid liquid is provided into the conduit; and a second pump coupled to the cooler and disposed adjacent to the densitometer, wherein the second pump is disposed in parallel with the first pump, wherein the second pump is used to move the cooler the second liquid in to cool the first liquid delivered by the conduit; and a processor coupled between the densitometer and the first pump, wherein the processor is used to measure the concentration of the first liquid The first pump is controlled and the fan is used to cool the processor. A method of cooling comprising: deriving the first liquid at a first temperature from a sump for containing a first liquid through a conduit; distributing the first liquid delivered by the conduit with a cooler covering the conduit liquid is cooled to a second temperature; a concentration of the first liquid at the second temperature is measured by a concentration meter, the first liquid system is delivered by the conduit; by a pump coupled to the concentration meter , providing a second liquid in the cooler into the sump according to the concentration of the first liquid; and heating the first liquid to the first temperature to remove a plurality of semiconductor devices produced by the manufacturing process The residue. The cooling method of claim 9, wherein cooling the first liquid delivered by the conduit to the second temperature, by the cooler covering the conduit, comprises: by including a helical hose disposed around the conduit a water-cooled device that cools the first liquid delivered by the conduit to the second temperature; or an air-cooled device that cools the first liquid delivered by the conduit to the second temperature It includes a casing covering the duct and a fan blowing air inside the casing.

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