TW200947171A - Improved reclaim function for semiconductor processing systems - Google Patents

Abstract

In one embodiment, a method of controlling fluids in a semiconductor processing system includes mixing two or more chemical compounds in a blender to produce a solution and supplying the solution to a reclaim tank, where the solution is dispense to a process station. The solution can be monitored at a location between the tank and the process station to determine whether at least one of the chemical compounds is at a predetermined concentration. Upon determining that the at least one chemical compound in the solution is at the predetermined concentration the solution is flowed to the process station. The method further includes removing at least a portion of the solution from the process station and returning the removed portion of the solution to the reclaim tank. The removed portion of the solution is monitored at a location between the process station and the reclaim tank to determine whether at least one of the chemical compounds in the removed portion of the solution is at a predetermined concentration. Upon determining that the at least one chemical compound in the removed portion of the solution is at the predetermined concentration, the removed portion of solution is flowed to the process station.

Description

200947171 IX. Invention Description: [Reciprocal Reference Related Application] This application is based on 35 USC §109(e) Proposal for Temporary Application No. 60/990,527 of November 27, 2007, December 3, 2007 The application for temporary application No. 6〇/992,012 and the application for temporary application No. 6〇/992, 〇14, filed on December 3, 2007, the entire contents of which are hereby incorporated by reference. BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to methods and systems for managing chemicals in a processing environment, such as a semiconductor manufacturing environment. [Prior Art] 化学品 In many industries, chemical delivery systems are used to supply chemicals to processing tools. The illustrated industries include the semiconductor industry, the pharmaceutical industry, the biomedical industry, the food processing industry, the household products industry, and the personal care petroleum industry. The chemicals delivered by a particular chemical delivery system depend on the process. Therefore 'special chemistry for supplying semiconductor processing tools. Depending on the process to be performed on the wafer within the tool. Example ^ Semi-conducting includes etching, cleaning, chemical mechanical polishing (CMp) and wet electroplating of copper, electroplating, etc.). For example, ", electricity, usually two or more fluids are combined for use in special fluids. The solution mixture can be prepared off-site, followed by the point of use of the custom process. This method is ρ ρ 1, , point position or special batch processing or batching. Or 7 200947171, more desirably, the cleaning fluid mixture is prepared at the point of use prior to delivery to the cleaning process using a suitable mixer or blender system. The latter method is sometimes referred to as continuous blending. In either case, the precise mixing of the desired proportions of the reagents is particularly important' due to changes in chemical concentration, the process performance can be adversely affected. For example, the inability to maintain a particular concentration for etching process chemicals will cause uncertainty in the etch rate and, therefore, the source of process variation. Therefore, there is a need in the processing environment for methods and systems for managing chemical conditioning and supply. SUMMARY OF THE INVENTION In a specific implementation, a method of controlling the fluid of a processing system includes mixing two or more chemical compounds in a blender to produce a solution and supplying the solution to a recovery tank where the solution is distributed to a processing station. The solution can be monitored at a location between the tank and the processing station to determine if at least one chemical compound has reached a predetermined concentration. Once the at least one chemical compound in the solution is determined to reach a predetermined concentration, the solution is passed to the processing station. The method further includes treating at least a portion of the solution and returning the removed portion of the solution to the recovery tank. Monitoring the solution removal portion at a position between the treatment station and the recovery tank to determine whether at least one chemical compound in the solution removal portion reaches a predetermined concentration... Dan:: at least one chemical compound in the solution removal portion reaches a predetermined concentration : J removes the solution removal section to the processing station. The method of controlling the fluid of the treatment system in the port example includes liquid = tank: a solution from the supply line and a mixed mixture solution from the recovery line to the treatment station. Position measurement between the tank and the treatment station 200947171 Mix the solution characteristics to determine the concentration of the chemical compound in the mixed solution. This concentration is then compared to the predetermined target concentration. Once the chemical compound in the mixed solution is determined to reach a predetermined concentration, the mixed solution is flowed to the processing station. The method also includes measuring at least a portion of the mixed solution from the processing station via the recovery line and measuring the characteristics of the mixed portion of the mixed solution at the recovery line position to determine the concentration of the chemical compound in the removed portion of the mixed solution. The chemical compound concentration is compared to a predetermined target concentration. Once the chemical composition of the solution removed portion is determined to have a predetermined concentration, the solution removal portion is flowed to the recovery tank. In yet another embodiment, the system includes a chemical blender for mixing. The chemical compound forms a solution; the recovery tank is used to mix the solution from the chemical blender with the recovered solution from the processing station; and the distribution system uses the combined solution to the processing station. The system also includes first chemical monitoring = configured to monitor the mixed solution downstream of the dispensing system and to determine whether: the compound reaches a predetermined concentration; the controller, the at least one chemical compound of the configured solution _ is achieved by the first ❹ station: when the predetermined concentration is determined, the mixed solution is flowed to the processing coupling, and the card line is in fluid communication with the outlet of the processing station and recovered and returned with the recovery tank: at least a part of the mixed solution removed from the processing chamber after use The heart is placed in the recycling tank. The system may further include two of the second chemical monitoring: the mixed solution recovery portion to determine the recovery degree: whether the chemical compound reaches a predetermined concentration before the reflux recovery tank. In the specific example, the system includes the first chemical The product is mixed with a chemical compound to form a first solution and a second chemical is used for a machine. 9 200947171 is used to mix a chemical compound to form a second solution. The system also includes a receiving tank for receiving the first solution and dispensing a first solution port, a recovery tank for receiving the second solution and dispensing the second solution. The system further includes: a first processing station having a first process in fluid communication with the first recovery tank to receive the first solution and in fluid communication with the second recovery tank to receive the second solution; and a half 1 The second-year-old station of the 菔 菔 理 , , , , , , , , 第 第 第 第 第 第 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二The second? The system further includes a first recovery line in fluid communication with the first and second arrogant first processing chambers to pick up the used portion of the first liquid from the first processing chamber, wherein the flute _ ^ The first recovery line and the first return line; and the second recovery line in fluid communication with the first and second processing stations of the first and second processing stations to receive the second processing The portion of the bath used, wherein the second recovery line is connected to the second chemical monitoring and control system. System in-step system, configured to monitor the portion of the first solution used in the first recovery line and to determine the portion of the compound in the blanket to return to the first - recovery concentration: chemical monitoring and control “It is configured to monitor the wave. Whether the material reaches the pre-initial body before reflowing to the second recovery tank, the fluid is distributed to the semiconductor processing tool for use in the manufacturing process. After the process, Panyu regains At least a portion of the fluid and at least one of the measured corpuscles are measured and measured. The fluid can then be sent to the recovery system 200947171 where it can be recycled or combined with more fluids. The fluid can be pumped back to the system and sent To the dispensing system, which will dispense fluid to the semiconductor processing tool. At least one metrology parameter of the fluid can be measured between the recovery system and the dispensing system. At least a portion of the fluid can be diverted to excretion' Or adjusting the parameters of the supplied fluid to compensate for the change of the fluid indicated by the measured weighting parameter. [Embodiment] The specific invention is difficult to use. And (4) a method of transporting and/or recovering a sample and a chemical management system. A total example of the processing system 100. In general, the system 100 includes a processing chamber 102 and a chemical management system. According to a specific example, the chemical management system 103 includes an input subsystem 104 and an output system 106. It is conceivable that any number of secondary systems 1〇4, 1〇6 components are comparable to 102, onboard Or an external load setting. In this context, the airborne means that the secondary system (or its components) is integrated with the chamber 102 in a clean room (clean room environment), or more broadly, to 102. Part of the processing tool is integrated; ", externally loaded" means that the subsystem (or its components) is separated from the chamber 1〇2 (or generic tool) and is located some distance away. In the example of the system shown in Fig. i, the secondary systems 1〇4, 1〇6 are all onboard, and the system 100 constitutes an integrated system that is completely placed in the clean room. The chamber 102 and the secondary systems 1〇4, 1〇6 can be located in a common frame. To aid in cleaning, repairing, and adjusting the system, the secondary system can be placed, for example, in a detachable sub-frame of the cast-iron support, so that the secondary system can be easily detached and removed from the chamber 1〇2. 200947171 For example, the input sub-system 包括4 includes a reversing enthalpy (10) and a carburetor 110, which is connected to the input flow control system 112β large (four) words 'combiner 108, configured to mix two or more chemical compounds (fluid And forming the desired chemical solution' which is then supplied to the input flow control system ιΐ2. The carburetor no is configured to vaporize the fluid and provide a vaporization stream to the input flow control system 112. For example, vaporizer 110 can vaporize isopropanol followed by a vaporization fluid and a carrier gas such as nitrogen. The input flow control system 112 is configured to dispense a chemical solution and/or a vaporization stream to the chamber 1〇2 at a desired flow rate. For this purpose, the input flow control system 112 is coupled to the chamber 102A by a plurality of input lines 114. In one embodiment, chamber 1A2A is configured with a single processing station a, where one or more processes are performed to process wafers located on station 124. Thus, a plurality of input tubes g U4 are supplied for specific The appropriate chemicals required for the process (provided by the blender 1 () 8 via the input flow control system ι 2). In a specific example, station 124 can be a tub, i.e., a container containing a chemical solution, wherein the wafer is removed after a period of immersion. More broadly, station m can be any environment in which one or more surfaces of the wafer contact one or more fluids supplied by a plurality of input lines 114. Additionally, it should be understood that while Figure 1 shows a single processing station, chamber 102A may include any number of processing stations, as will be detailed later with reference to Figure 2. For example, the wheeling subsystem 102 includes an output flow control system 116, a vacuum tank subsystem 118, and a vacuum pump subsystem 12A. A plurality of output lines 122 fluidly couple the chambers 1 to 2 to the output flow control system 116. As such, fluid is removed from chamber 1A through a plurality of output lines 122. The removed raft is then sent to the drain, or via the fluid line 1 to the vacuum tank system 12 200947171 118 ^ In a specific example, some of the rafts are removed from the vacuum tank system ι 8 and flow to the vacuum The Purdue system is conditioned (eg, neutralized and diluted) as part of the waste management process. In the case of Zhao, the input subsystem 1〇4 and the output subsystem 1〇6 independently or cooperatively achieve a plurality of process control purposes. For example, the concentration of solution from blender 1〇8 to chamber 102A can be monitored and controlled at various stages. In another embodiment, the output flow control system 丨16, vacuum tank system 118, and/or vacuum pump subsystem 120 cooperate to control the desired fluid flow on the cylindrical surface disposed within the chamber. In yet another embodiment, the output flow control system 116 and the vacuum pump sub-system 12 cooperate to condition the fluid removed from the chamber 1〇2A by the output flow control system 116, and then return the conditioned fluid to the blender 108. . These and other specific examples will be described in detail later. In one embodiment, a transfer device (e.g., a robot) is disposed within and/or adjacent to chamber 102A to move wafers into, through, and out of the chamber. Room 102A can also be a part of a large tool, as will be described later. In one embodiment, the various controllable elements of system 1 are controlled by controller 126. Controller 126 can be any suitable device capable of issuing control signal 128 to one or more controllable elements of system 1 . The controller 126 can also receive a plurality of input signals 13'' including solution concentration measurements at different locations of the system, level sensor outputs, temperature sensor outputs, flow meter outputs, and the like. For example, controller 126 can be a microprocessor-based controller for a programmable logic controller (PLC) program to perform various process controls in a single instance, including proportional integral derivative (PID) feedback control. An exemplary controller suitable for a process control blender system is the PLC simatic S7-300 Series 13 200947171, which is commercially available from the Xiqiao subsidiary (the controller m is shown as a separate component in George but the controller should be understood) 126 may actually be a plurality of control units that together form a control system for processing the system. As described above, one or more components of system 100 may be integral to the chamber or chamber 102A as part of its overall tool. External settings. Figure 2 shows a processing system 200' of this configuration having components disposed externally with respect to the chamber ι2β. The same component symbols represent the components of the aforementioned figures. For example, the machine 108, the vacuum error-and-slot-person system 118, and the vacuum pump subsystem 120 are externally mounted. In contrast, the cold crying tf Λ _ _ _ _ _ _ 110, the input flow control system 12 and the output flow control system 116 are shown in Fig. i as the onboard components. 2 Components can be placed in a clean room or sub-clean room with a processing fixture (ie, an integrated assembly of processing chambers and any other construction tool). It should be understood that the configuration of the first 200 is only an example, and other configurations are possible. For example, the system 2 can be configured to allow the vacuum tank system to be ΐ8 and the vacuum pump system 12 is externally loaded. According to the present invention: an example of 'blending machine 108, vaporizer' 〇, input flow control system 112: system 2 = control system 116, vacuum tank system 118 and vacuum pump sub-system 2 System 103. It should be noted that the chemical management system described in Figure i and described above is for illustrative purposes only. Other examples of vessels within the enclosure may include more or fewer components and components arranged in different lengths. Way, for example, in a specific example of a chemical management system,

The second ISI example 0 shows that the system 200 also illustrates the multi-station room 102B and does not have five stations 204l_5 (respectively referred to as stations 2〇4) 200947171 Room 102B. More generally, 'room i〇2B can have any number of stations (i.e., one or more stations). In one embodiment, the stations may be separated from each other by a sealing device such as a start gate placed between processing stations. In a special case, the isolation facility is vacuum sealed so that each processing station can be maintained at different pressure levels. Each station 204 is configured to perform a special process wafer on a wafer. The processes performed by each station may vary, and therefore the blending machine 8 is required to provide different chemicals through the input flow control system 112. Therefore, system 200 includes a plurality of input pipeline groups 206^, each group corresponding to a different station. In the illustrative specific example of Figure 2, five sets of input pipelines 206^ for each of the five processing stations are shown. Each input line set is configured to provide a suitable chemical composition to a particular station. For example, in one embodiment, chamber 1〇2B is a cleaning module to clean the wafer before or during, for example, a surname process. In this example, the input line set 220i for the first processing station 204 can provide a SCN1 type solution (which includes a mixture of ammonium hydroxide and hydrogen peroxide in deionized water) and deionized water enthalpy (DIW). combination. Input line set 2062 for second processing station 2042 provides one or more deionized water (DIW) and isopropyl alcohol (IPA). Input line group μ for the third processing station 2043. One or more deionized waters are provided by diluting hydrogen fluoride and isopropanol. The input line set 2〇64 for the fourth processing station 2〇44 provides one or more deionized water, a known mixed chemical solution, a dedicated chemical solution of a specific nature, and isopropyl alcohol. The input line set 206s for the fifth processing station 2〇45 provides one or more deionized water, an SC 2 type solution (which includes a mixed aqueous solution of hydrogen peroxide and hydrochloric acid), and isopropyl alcohol. As with the example of system 100 described in the figures, station 204 can be any environment in which one or more surfaces of the wafer are exposed to one or more fluids supplied by 15 200947171 plurality of input lines 114. It is conceivable that the fluid flow through the particular set 206 input line (and the i-th line 丨 14) can be individually controlled. Therefore, the timing and flow rate of the flow through a particular group of individual pipelines can be independently controlled. In addition, although some input lines are supplied to the wafer surface, 'other liquids may be supplied to the inner surface of the process #2〇4, for example, to clean the surface before or after the processing cycle. Furthermore, the input pipeline shown in Figure 2 is for illustrative purposes only and other inputs may be supplied from other sources. 〃 Each processing station 204, .5 has a corresponding output pipeline or output pipeline group from which the rogue is removed from the respective processing station. For example, the first processing station 2〇4丨 is coupled to the drain 208′ while the second to fourth processing stations 2〇42 are shown to output the flow control system 116 via the respective output line groups 21〇1·4. . Each plant represents one or more output lines. Thus, the flow is removed from chamber 102A via a plurality of output lines 122. The fluid removed from the processing station via the line group 21〇1_4 coupled to the output flow control system ι 6 can be circulated to the vacuum tank subsystem 118 via a plurality of fluid ports 7 . In the example of Zhao, a transport device (e.g., a robot) is placed in and/or near the chamber to move the wafer into, through, and out of the 胄i〇2b. room! It can also be part of a large tool, which will now be described below with reference to Figure 3. Referring now to Figure 3, there is shown a plan view of a system 300 in accordance with an embodiment of the present invention. The processing system 3 includes a front end segment % receiving wafer II. The front end section 3〇2 is engaged with the placement transfer robots 3〇6 to 304. The cleaning module fan, 31 〇 is placed in the transfer chamber, and the cleaning modules 3 〇 8, 310 each include a processing chamber (single station or multiple stations), such as the cleaning chamber 102a b described in FIG. The cleaning kit moves, 3^, and/or lightly connects the different components of the chemical management system 103 described above. (The Chemical Management System 103 is indicated by a dashed line, indicating that certain components of the chemical management system may be placed on the processing system on-board and other components may be externally placed; or, all components are onboard.) The opposite transfer chamber 304 of the front end section 302 is coupled to the processing tool 312. In one embodiment, the front end section 302 includes a load lock chamber that can be at a suitably low transfer pressure and then opened to the transfer chamber 304. The transport robot 306 then picks up the individual wafers from the wafers disposed within the load lock chamber and transfers the wafers to one of the processing tool 312 or the cleaning module 3〇8. During operation of system 300, chemical management system 1〇3 controls the supply and removal of fluid to/from cleaning modules 308, 310. It is to be understood that system 300 is only one specific example of a processing system of the present invention having a chemical management system. The specific example of the chemical management system is not limited to the configuration as shown in Fig. 3, and is not even limited to the semiconductor manufacturing environment. System and Process Control Referring to Figure 4, the processing system 4 is described below in conjunction with additional examples of chemical management systems. For convenience, additional examples will be described with reference to a multi-station system (as shown in Figure 2 and above). However, it should be understood that the following specific examples can also be applied to the system shown in Fig. 1. Further, it is noted that the order of the processing stations 204 of Fig. 4 does not necessarily reflect the order of processing performed on a particular wafer, but is arranged for convenience of explanation. For convenience, the same component symbols correspond to the similar components of the above FIG. 1 and/or FIG. 2, 17 200947171 and will not be described in detail. The systemic blender 108 is configured with a plurality of inputs 4G2l.N (commonly for the input 4G2)' each of which receives a respective chemical. The input 402 fluid is lightly connected to the main supply line 4〇4, in which the respective chemicals are mixed into a solution. In one embodiment, various chemical concentrations are monitored along one or more stages of the supply line 404. Figure 4 shows a plurality of chemical monitors.

4〇6丨.3 (three are shown by way of example) are placed along the supply line 4〇4. The specific financial instrument monitor is located at the supply line 4〇4 at two points where two or more chemicals are combined and mixed. For example, the first chemical monitor 406 is disposed at the mixing of the first and second chemicals (input 4〇2ι 2) and the third chemical (input 4023) into the supply line 4〇4 (ie upstream here) between. In one embodiment, the concentration monitor 4〇6 for the system is an electrodeless conductive probe and/or a refractive index (RI) detector, including an AC toroidal coil sensor, as commercially known from GLI International. (Colorado) Model 3 7〇〇 series type, RI detectors, such as the type of CR-288 commercially available from Swagel〇k (Ohio), and voiceprint identification sensors, such as commercially

Available from Mesa Experimental Research Corporation (Colorado), but not limited to 0, the machine 108 is selectively fluidly coupled to a plurality of usage destinations (i.e., processing stations 2〇4) via a primary supply line 404. (Of course, it is conceivable that in another example, the blender 1 〇 8 serves only one destination.) In a 鳢 instance, the selection of which processing station is controlled by the flow control unit 408. Flow control unit 408 represents any number of devices suitable for controlling the flow of fluid between the blender and the downstream destination. For example, flow control 18 200947171 unit 408 includes a multi-way valve to control the flow path of solution from the pinch 丨〇 8 to the downstream destination. For example, the flow control unit 408 can selectively (eg, under the control of the controller 126) circulate the solution from the blender ι 8 to the first supply line use point 410, the second supply line use point 412, or The third supply line uses point 414 where each supply line uses points to connect different processing stations. Flow control unit 408 may also include a flow meter or flow controller. In a specific example, the container is placed along the supply line point of use. For example, Figure 4 shows that the first container 416, which is fluidly coupled to the first supply line using point 41, is placed between the flow control unit 4〇8 and the first processing station plus seven. Similarly, a second container 418 fluidly coupled to the second supply line using point 4丨2 is placed between flow control unit 408 and second processing station 2042. The container is sized to provide sufficient capacity for the various processing stations when the blender 1 服务 8 serves different processing stations (or when the blender 108 is unusable, such as during maintenance). In a particular embodiment, the container has a capacity of 6 to 1 liter, or a special capacity for a particular treatment. The fluid level 0 of each container is determined by supplying respective level sensors 421, 423 (e.g., high and low sensors). In one embodiment, the vessels 416, 418 are pressure vessels, each comprising a respective inlet 420, 422 for receiving pressurized gas. In a specific example, the contents of the containers 416, 418 are monitored for concentration. Thus, the containers 416, 418 shown in Figure 4 include active concentration monitoring systems 424, 426. These and other aspects of system 4 将 will be detailed later with reference to Figure 5-6. In operation, the containers 416, 418 dispense their contents by manipulating the respective flow control devices 428, 430. The flow control devices 428, 43 are, for example, pneumatic valves controlled by the text controller 126. The solutions dispensed by the vessels 416, 418 are connected to the steam, for example, to the processing station 2〇4 via respective input lines 206. Alternatively, the vaporized fluid of the catalyst no may flow into one or more processing stations 2 〇 4 ' in this case ' the vaporized fluid is input to the second processing station 204. Each individual input line 206 can have - or more than 432 ι (3) (for convenience, each set of input lines only has a display rim 1 that does not have an associated fluid management device). The fluid management device 432 includes, for example, a filter, a method, a flow meter, a valve, and the like. A plurality of flow management devices 432 at a particular specific oxygen include heaters for heating to flow through respective lines

The flow is then removed from the respective processing chambers by the operation of the output flow control subsystem 116. As shown in FIG. 4, each of the plurality of output lines 21 of the output flow control subsystem 116 includes one or more of the associated flow management devices 434i3 (for convenience, each group of output lines only The display has an associated fluid management device). The fluid management device 434 includes, for example, a filter, a flow controller, a flow meter valve, and the like. In a specific example, the fluid management device includes an active pressure control unit. For example, the pressure control unit can be comprised of a pressure transducer coupled to a flow controller. The active pressure control unit is operable to cause desired process control associated with the wafer and the respective processing station, such as controlling the interface between the fluid and the wafer surface. For example, 'pressure control and processing station related output line pressures are required to ensure that the desired fluid/wafer interface is produced. In one embodiment, the fluid removed by the take-off flow control subsystem 116 flows into one or more vacuum slots of the vacuum tank system 118. Thus, for example, system 400 includes two vacuum slots. The first slot 436 is coupled to the output line 2 l of the second processing chamber 2 〇 42 20 200947171 (h. The second slot 438 is coupled to the output line 21 〇 3 of the third processing chamber 2 〇 43. In a specific example, The tank is available for each different chemical input to the respective processing station. This arrangement facilitates fluid reuse (recycling will be further detailed later) and fluid handling. The fluid level of each tank 436, 438 is Or a plurality of level sensors 437, 439 (such as high and low level sensors) are monitored. In one embodiment, the slots 436, 438 are selectively pressurized by the input of pressurized gas enthalpy 440, 442, and The tank may also be vented to depressurize the tank. Additionally, the tanks 436, 438 are connected to the vacuum pump sub-system 120 via respective vacuum lines 444, 446. Thus, the vapor may be removed from the respective tanks and vacuumed. The system 120 process, which will be described in detail later. In general, the contents of the tank can be sent to the drain or recovered and returned to the machine for reuse. Thus the second tank 438 shows the flow to the drain line 452. The first tank 436 is shown coupled to the recovery line 448. The recovery line 448 is fluidly coupled to the blender 108. Fluid can be returned from the treatment station to the blender ι 8 and reused. Fluid recovery will be detailed later with reference to Figure 8. In one embodiment, fluid delivery to system 400 is achieved by establishing a pressure gradient. For the system 400 shown in Figure 4, a declining pressure gradient can be established from the starter 108 to the processing station 204. In one embodiment, the blender 108 and the vaporizer crucible 10 are at about 2 atmospheres. Operating under pressure, the input flow control subsystem 112 is operated at a pressure of about 1 atmosphere. The processing station 204 is operated at about 400 Torr. This pressure gradient is established to drive the blender 1 to 8 to the processing station. The fluid flow of 4. In operation, the containers 416, 418 will be exhausted and must be replenished periodically. Root 21 200947171 According to a specific example, the management of individual containers (such as filling, dispensing, repairing, and/or maintenance) does not occur simultaneously. When a particular container is in operation (e.g., filled), the other containers can continue to dispense the solution. The fill cycle for a particular container begins by responding to signals from the low fluid level sensors (sensors 421, 423). It is assumed that the sensor 421 of the first container 416 indicates a low fluid level of the controller 126. In response, the controller 126 causes the first container 416 to depressurize (e.g., by opening the vent) and the flow control unit 408 will first The container 416 is placed in fluid communication with the blender 108 while separating the blender and other containers. The controller 126 then signals the blender 108 to mix and dispense the appropriate solution to the first container 416. Once the first container 416 is fully filled Full (as indicated by the high fluid level sensor), the controller 126 signals the blender 1〇8 to stop dispensing the solution and causes the flow control unit 408 to separate the blender 1〇8 and the first container 416. Alternatively, the first container 416 can be pressurized by injecting a pressurized gas to the gas inlet 42A. The first container 416 is now ready to begin dispensing the solution to the first processing station. During the filling cycle, each of the other containers can continue to dispense the solution to their respective processing stations. In one embodiment, the respective containers are desirably served in accordance with a prioritization algorithm employed by controller 126. For example, the prioritization algorithm can be based on usage. That is, the highest priority container is assigned (e.g., within a certain time) to the highest priority, and the lowest number of containers is assigned the lowest priority. Accordingly, the priority of the containers can be arranged from the maximum allocation amount to the minimum allocation amount. Machine 200947171 System I Γ Example + 'The present invention proposes the use of a point process control blender system comprising at least one blender to receive and blend at least two chemical compounds for a round robin $, 丨 & More than 3 containers or slots, including assistance with handling

Lit body wafer or the rest of the chemical bath. Tank (iv) chemical solution 'settling volume and temperature, blender configured to continuously deliver chemical solution to multiple tanks' or only when necessary to deliver chemical solution to one or more tanks as described above and who - half #,—#^^, Progress is described later) to maintain the concentration of the compound ❹ in the tank to a predetermined range. - A part of the processing tool, which is a processing aid chemical solution that can directly supply a predetermined chemical bath capacity. The processing tool can be any conventional or other tool suitable for processing semiconductor wafers or other components (e.g., using an etch process, a cleaning process, etc.), such as tool 312 of Figure 3 above. 5 The doping machine provides a chemical solution to one or more containment tanks or storage tanks in which the chemical solution is then supplied to one or more processing tools.

In one embodiment, a point process control blender system is provided, wherein the helium configuration is configured to increase the flow rate of the chemical solution to the one or more tanks when the concentration of one or more compounds of the solution falls within a predetermined target range, thereby rapidly An improper chemical solution is removed from the tank while a fresh chemical solution having the desired concentration of the compound is supplied to the tank. Referring now to Figure 5, there is shown a blending machine 108 (4) assembly system 5 〇〇 β according to an embodiment of the present invention. According to a specific example, the gripper 108 shows the coupling groove 5 〇 2, and both The ability to monitor and recycle. In a specific example, the tank 502 is the pressure vessel 416 or 418 shown in FIG. Or, the tank 502 is a cleaning tank (such as one of the cleaning modules 3〇8, 31〇 23 200947171 of the processing system 400). The semiconductor wafer or other components are immersed therein and cleaned. The inlet flow line 512 of the cleaning tank 502 is connected to the blender 1〇8. According to a specific example, the flow line 5 12 corresponds to one of the use point lines 410, 412, 414 shown in FIG. 4. In this specific example, the blender unit 1 8 generates and supplies the cleaning liquid of the cleaning tank 502. Sc-1 cleaning solution containing ammonium hydroxide (NH4〇H) supplied to the blender unit via supply line 506, hydrogen peroxide (h2〇2) supplied to the blender unit via supply line 508, and via supply line 510 supplies deionized water (DIW) to the blender unit. However, the blender system 500 can be configured to provide any selected chemical compound quantity (eg, two or more zeros) and a selected concentration of the mixture to any type of tool. In this mixture, chemical compounds such as hydrofluoric acid (HF) 'ammonium fluoride (NH4f), hydrochloric acid (HC1), sulfuric acid (H2S04), acetic acid (CH3COOH), ammonium hydroxide (NH4〇H), potassium hydroxide (KOH), ethylenediamine (EDA), hydrogen peroxide (h2〇2), and nitric acid (HN〇3). For example, blender 108 can be used to dispense diluted hf, sc>1 and/or SC-2 solutions. In a particular embodiment, the heated dilution HF is input so that the blender 1〇8 can be configured with an inlet for heating mw. In a particular embodiment, the heated DIW is maintained at about 25. 〇 to about 7 (Γ.: 〇 In addition, any suitable surfactant and/or other chemical additives (such as ammonium peroxosulfate or APS) can be incorporated into the cleaning solution to enhance the cleaning of specific applications. Flow Line 514 A flow line 512 between the blender unit 1〇8 and the inlet of the tank 5〇2 is selectively connected to facilitate the addition of the additive to the cleaning fluid used in the cleaning bath. '' The tank 502 is sized and configured A cleaning solution is maintained in the tank to maintain a quantity of cleaning fluid (e.g., sufficient capacity to form a cleaning bath). As described in 24 200947171, the cleaning fluid can be continuously supplied from the blender unit 108 to the tank 502 at one or more selected flow rates. Alternatively, the cleaning liquid is supplied from the blender unit to the tank only for a predetermined time (eg, when the filling tank is started, and one or more compounds of the cleaning liquid in the tank fall outside the selected or target concentration range). The overflow section and the outlet are configured to allow the cleaning liquid to exit the tank via the overflow line 516, and the cleaning tank contains a certain amount of cleaning liquid when the cleaning liquid is continuously fed and/or recycled to the tank as follows. Slot still has a connection The discharge outlet of discharge line 518 is connected, where discharge line 518 includes valve 520' that is selectively controlled to facilitate discharge and removal of cleaning fluid from the tank at a faster rate for a predetermined time, as will be described later. 520 is preferably an electronic valve that is automatically controlled by controller 126 (described in the aforementioned Figure 4). Overflow line 516 and discharge line 518 are coupled to flow line 522 of pump 524 to assist in the passage of tank 502. The cleaning fluid is delivered to the recirculation line 526 and/or the collection location or other processing location 'this will be described later. The concentration monitoring unit 528 is located downstream of the pump 524 of the flow line 522. The concentration monitoring unit 528 includes at least one sensing The concentration of one or more chemical compounds of the cleaning liquid (eg, H2〇2 and/or ΝΗβΗ) is measured when the cleaning liquid flows through the line 522. The sensor of the concentration monitoring unit 528 can be any one that facilitates accurate measurement. A suitable type of one or more chemical compound intensities to be tested in the cleaning fluid. In some embodiments, the concentration sensor for the system is an electrodeless conductive probe and/or a refractive index (RI) detector, including Ac ring line Sensors such as the type of Model 3700 series commercially available from GLI International (Colorado), RI detectors, such as the type of model CR-288 commercially available from Swagel〇k (Ohio), and Voiceprint recognition sensor, 25 200947171 is commercially available from Mesa Experimental Research Corporation (Colorado), but is not limited thereto. Flow line 530 is connected to the outlet of concentration monitoring unit 528, which is provided with a two-way valve 532. The three-way valve can be an electronic valve that is automatically controlled by controller 126 in accordance with the concentration measurements provided by unit 528 in the following manner. Recirculation line 526 connects the outlet of valve 532 and extends to the inlet of tank 502 for normal operation. During operation of the system, the assist solution is recirculated from the overflow line 5丨6 back to the tank (this will be described later). Discharge line 534 extends from the other outlet of wide 532' to assist in removing solution (via line 516 and/or line 522) in tank 502 when one or more constituent concentrations of the solution fall outside of the target range. Recirculation line 526 can include any suitable number and type of temperature, pressure, and/or flow rate sensors, and can also include one or more suitable heat exchangers to assist in recirculating the solution back to tank 5〇2 Heating, temperature and flow rate control of the solution. The recirculation line is useful for controlling the temperature of the bath in the tank during operation of the system. In addition, any suitable number of filters and/or pumps (e.g., in addition to pump 524) may be placed along flow line 526 to aid in filtering and controlling the flow rate of solution recycled back to tank 5〇2. In one embodiment, the recirculation loop defined by discharge line 518, valve 520, pump "circuit 522, concentration monitoring unit 528, two-way valve 532, and recirculation line 526" defines concentration monitoring in Figure 4 above. System 424 or 426. The blender system 5A includes a controller 126 that automatically controls the components of the blender unit 〇8 and the bleed valve 520 based on the concentration measurements obtained by the concentration monitoring unit 528. As described above, the control The flow rate of the cleaning fluid flow from the blender unit 108 and the cleaning liquid discharge or take-out tank 502 is controlled according to the concentration of one or more compounds in the cleaning liquid of the outflow tank 502 measured by the concentration monitoring unit 528. Providing certain components that communicate through the venting valve 520, the concentration monitoring unit 528 and the valve 532 (shown as dashed line 536 in Figure 5), and the blender unit 〇8 through any suitable wired or wireless communication link, depending on the concentration The measurement data obtained by the monitoring unit controls the blender unit and the drain valve. The controller includes a processor that is programmed to perform any one or more of the appropriate types of process control 'eg, proportional product Differential (PID) feedback control. An exemplary controller suitable for a process control blender system is the PLC Simatic S7-300 system 'which is commercially available from Siemens (Georgia). As described above, the blender unit 108 receives hydrogen individually. A feed stream of ammonium oxide, hydrogen peroxide, and deionized water (DIW), which is mixed with each other at an appropriate concentration and flow rate to obtain a sc-1 cleaning solution having a desired compound concentration. The controller 126 controls the blender unit 108. The flow rate of each compound to achieve the desired final concentration, and further control of the flow rate of the SC-1 cleaning solution to form a cleaning bath in the tank 502. One example of a blender unit is illustrated in Figure 6. In particular, Figure 6 is shown. The supply lines 506, 508, 510 for supplying NH4〇H, H2〇2 and DIW to the blender unit 1〇8 include check valves 6〇2, 6〇4, 6〇6 and are provided in the non-return Electronic valves 608, 610, 612 downstream of the valve. The electronic valves of each supply line are connected to the controller 126 (such as by wired or wireless connection) to assist the controller in automatically controlling the electronic valve during system operation. NH4〇H and H2〇2 Supply line 506 '508 connected to electricity Three-way valves 614, 616 that communicate with controller 126 (eg, using wired or wireless connections) and are placed under first electronic valves 008, 610 27 200947171. ❹ DIW supply line 510 includes pressure regulation disposed downstream of electronic valve 612 The 618 is used to control the flow of pressure and DIW into the system 100. The line 510 branches further downstream from the regulator 618 into three flow lines. The first branch line 620 extending from the main line 510 includes a flow control valve 621 along which The branch line is set and selectively controlled by controller 126, which is further coupled to first static mixer 630. The second branch line 622 extends from the main line 510 to the inlet of the three-way valve 614, which is also connected to the nh4〇H flow line 506. Further, the 'third branch line 624 extends from the main line 51〇 to the inlet of the three-way valve 616, which is also connected to the H2〇2 flow line 5〇8. Therefore, the three-way valve of the Nh4〇h and H2〇2 flow lines facilitates the addition of DIW to each flow to selectively adjust the ammonium hydroxide in the distilled water before the system is operated and the static mixer of the blender unit mixes it. And hydrogen peroxide concentration. The NH4〇H flow line 626 is connected to the inlet of the three-way valve 614 of the ammonium argon supply line and the first branch line 620 of the deionized water supply line between the valve 621 and the static mixer 63. Optionally, the flow line includes a flow control valve 628' that is automatically controlled by controller 126 to enhance flow control of the ammonium hydroxide feed to the first static mixer. The first static mixer 630 & the hydroxide and deionized water are combined in a mixer to form a substantially homogeneous solution of the mixture I. A flow line 634 connects the outlet of the first static mixer and extends and connects the second static mixer 64G. Set along the flow line (4) as any - or a plurality of suitable concentration sensors 632 (such as - or a plurality of the above-mentioned type-type electrodeless sensors or R detectors), which determine the gas oxidation of the solution concentration. The cadence sensor 632 is coupled to the controller 126 to provide a measured concentration of the hydroxide of the solution from the first static mixer of 28 200947171. This will help control the ammonium hydroxide concentration of the solution by selectively and automatically manipulating any of the valves on the NH4〇H and/or DIW supply lines before delivery to the second static mixer 640. ❹

The H2〇2 flow official line 636 connects the outlet of the three-way valve 616, which is connected to the h2〇2 supply line. Flow line 636 extends from three-way valve 616 to connect flow line 634 between concentration sensor 632 and second static mixer 64. > As appropriate, flow line 636 includes flow control valve 638 that is controlled The 126 is automatically controlled to enhance the flow control of the hydrogen peroxide fed to the second static mixer. The second static mixer 640 mixes the ΝΗ4〇η solution diluted from the first static mixer 63〇2 DHV with the H2〇2 cold liquid flowing from the Ah feed line to form a mixed and substantially uniform ammonium hydroxide. SC-1 cleaning solution for hydrogen peroxide and deionized water. Flow line 642 receives the mixed cleaning fluid from the second static mixer and is coupled to the inlet of electronic three-way valve 648: is disposed upstream of valve 648 along flow line 642 for at least one human concentration sensing 3 644 (eg, or A plurality of the above-described any type of electrodeless: detector or RU detector) 'determines at least one of the concentration of hydrogen peroxide and hydroxide in the cleaning liquid. The concentration sensor 644 is also coupled to the controller 126 to provide the concentration information measured by the controller' to assist the controller in selectively and automatically manipulating one or more of the NH4〇H, H2〇2, and DIW supply lines. To control the concentration of ammonium hydroxide and/or hydrogen peroxide in the cleaning solution. Depending on the situation, pressure regulator 646 is placed between sense $(4) and valve 648 along flow tube, line 642 to control the flow of pressure and cleaning fluid. The discharge line 650 is connected to the outlet of the three-way valve 648, and the flow line 652 29 200947171 extends from the other outlet of the one-way valve 648. The three-way valve is controlled by the controller I: selectively and automatically to assist in controlling the amount of cleaning fluid flowing out of the mixer unit for delivery to the tank 502 and the flow to the discharge line 65〇. In addition, electrons 654 are disposed along flow line 652 and are automatically manipulated by controller 126 to further control the flow of cleaning fluid from the machine unit to tank 5〇2. The flow line kiss becomes the flow 512 for conveying the heart cleaning solution to the tank 5〇2 as shown in Fig. 5. During operation of the system, a series of electronic valves and concentration sensors placed in the blender unit 〇8 are combined with the controller 126 to assist in accurately controlling the flow rate of the cleaning fluid to the tank, and the chlorine and chlorine oxidation of the cleaning fluid. Concentration at different cleaning fluid flow rates. In addition, when the hydrogen peroxide and/or hydroxide of the cleaning liquid falls outside the acceptable range, the humidity monitoring unit 528 disposed along the discharge line (2) of the tank 5〇2 provides a controller indication. Based on the concentration measurement provided by the concentration monitoring unit 528 to the controller 126, the controller can be programmed to change the flow rate of the cleaning fluid to the tank and open the discharge valve 520' to quickly discharge the SC1 cleaning fluid in the bath while supplying fresh SC- 1 Clean the bath to the tank to get a bath of cleansing solution within the desired or target concentration range as soon as possible. Once the cleaning fluid has completely drained out of the tank so that the concentration of peroxygen gas and/or ammonium hydroxide falls within an acceptable range (measured by concentration monitoring unit 528), then the controller is programmed to close the discharge valve 52 and control the blending The unit is closed to reduce the flow rate (or stop) while maintaining the concentration of the compound to be delivered to the tank 5〇2. An exemplary embodiment of a method of operating the systems shown in Figures 5 and 6 above will be described below. In this embodiment, the cleaning liquid can be continuously supplied to the tank, 200947171 or only at a selected interval of supply tank (such as the cleaning liquid of the drain tank). The cleaning liquid is prepared in the machine unit 108 and supplied to the tank 502, which contains A concentration of about 0.001 to 29% by weight of ammonium hydroxide (preferably about 1.0% by weight) and a concentration of about 0.01 to 31% by weight of hydrogen peroxide (preferably about 5% by weight of the cleaning tank are configured to maintain the tank) There is about 30 liters of cleaning bath and the temperature is about 25. 〇 to about 125 ° C. In operation, once the cleaning fluid is filled into the tank 502, the controller 126 controls the blender single π 108 via the flow line 512 per minute. A first flow rate of about 〇1 liters (LpM) provides a cleaning fluid to tank 502 during which the blender can supply the solution continuously or at a predetermined time. When the solution is continuously supplied, the first flow rate exemplified It is from about 1 LpM to about L25 LpM, preferably about LP2 LPM. The ammonium hydroxide supply line 506 feeds about 29-30% by volume of nH4〇h to the blender unit, and the ruthenium peroxide supply line 5〇8 Feed H2〇2 of about 5% by volume to the blender unit. When the flow rate is about L2LpM The supply line flow rate of the blender unit can be configured as follows to ensure that the cleaning liquid provided has a predetermined concentration of ammonium hydroxide and hydrogen peroxide: DIW about 〇i63LpM, NH4〇H about 〇.〇06LPM, and h2〇2 About 31 LpM. Additives (such as APS) can be selectively added to the cleaning solution through the supply line 514. During this operation phase, the fresh SCM cleaning liquid continuous flow can be supplied from the handler unit (10) from the first flow rate from the cleaning bath. The cleaning fluid can also exit the tank 502 via the overflow line 516 at substantially the same flow rate (i.e., about 02 LPM). Since the cleaning liquid enters and exits the tank at the same or similar flow rate, the Zhao product of the cleaning bath remains almost unchanged. The cleaning liquid flows into the discharge line (2) and flows through the concentration monitoring unit 528, where the concentration of one or more compounds (eg, h2〇2 and/or NH4〇H) in the cleaning solution is measured continuously or at selected intervals. The concentration measurement is given to the controller 12. The cleaning liquid is selectively circulated by the adjustment valve 532, and the cleaning liquid is returned to the tank from the tank 502 through the recirculation line 526 at an optional flow rate (e.g., about 20 LPM). Blending The machine unit 8 is controlled such that no cleaning liquid is delivered from the blender unit to the tank unless the concentration of one or more compounds in the cleaning liquid falls outside of the selected target range. Alternatively, the blender unit can be selected at a flow rate (eg, about 0.20). The LPM) provides a cleaning fluid and recycles the cleaning fluid in conjunction with line 526. In this operational embodiment, the three-way valve 532 is adjusted (as automatically adjusted by controller 126 126) to assist in cleaning the fluid to substantially approximate the blender unit. The flow rate of the supply tank cleaning fluid is transferred to line 534 at the same rate, while the cleaning fluid still flows through the recirculation line 526. Alternatively, valve 532 can be closed to prevent flow through the line 526, while the blender unit 1〇8 continuously supplies the tank 5〇2 cleaning fluid (eg, about 0.20 LPM). In this application, the solution is mixed with the fluid. The flow rate of the same or similar flow rate of the inflow unit into the tank exits the tank via line 516. For the application of the continuous supply tank of the cleaning liquid, the flow rate of the controller 12, the cyan, and the floc flowing from the blender unit 108 to the tank 502 is maintained at the first flow rate ^ 〇 hydrogen peroxide and ammonium hydroxide concentration Within the predetermined concentration range, as long as the measured concentration provided by the Hando monitoring unit 528 falls within an acceptable range. In the application of the cleaning fluid from the discontinuous supply tank of the blender unit, the controller 12 maintains this operating state (ie, no cleaning fluid flows from the blender unit to the tank) until the concentration of nitrogen peroxide and/or ammonium hydroxide Fall outside the predetermined concentration range. When at least one of the concentrations of hydrogen peroxide and ammonium hydroxide (e.g., the concentration measured by concentration monitoring unit 528) deviates from an acceptable range (eg, NH4〇H measures a concentration of 32 200947171 $about. Deviation from the target indifference by 1%' and / Or the coffee measuring wave is about to deviate from the target rich-controller according to the above operation of any one or more valves of the blender unit 1〇8, thereby starting or increasing the flow of the cleaning liquid from the machine unit to the tank 5〇2. The flow rate (while maintaining the νη4〇η and Η concentration of the cleaning solution within the pre-ratio range) ▲ The speed range can be from about Q.GG1LPM to about 2 GLPM. For continuous flocculation operations, the exemplified second flow rate is Approximately 2.5 LPM. The controller 126 Ο ❹ 槽 〇 〇 的 的 阀 520 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助 协助Make sure that the cleaning solution provided has a predetermined concentration of oxidized cerium oxide. Diw is about 2.04 LPM, NH4 〇 H is about 7 〇 LpM, and H2 〇 2 is about 387 LP] V1. : ' By adjusting the three-way valve 532 The cleaning fluid is diverted to line 534 and 丨" into line 526 such that it is to be at a selected flow rate (e.g., about 2 0LPM) Recirculating the 2-tank cleaning liquid removal system, the holding unit will adjust the second flow rate j (such as 2GLPM) to compensate for the flow rate of the cleaning liquid in and out of the tank at the same or similar flow rate. The cleaning solution inside remains almost unchanged. In addition, a certain amount of solution period in the replacement tank can maintain the processing temperature and circulation flow parameters in the tank. Monitoring = the controller keeps feeding the cleaning liquid to the tank 502 at the second flow rate, Until the Hanshao A 528 provides a concentration measurement within the concentration measurement within the acceptable range of the controller, the concentration measurement provided by the ΓNongdu Monitoring List & 528 ^ acceptable Fan cleaning bath again meets the predetermined cleaning compound inversion. Control The controller then controls the blender unit 1〇8 to supply the cleaning 33 200947171 502 at a first flow rate (or does not provide a cleaning fluid supply tank from the blender unit), and the controller further operates the drain valve 520 to the closed position to assist the cleaning fluid The tank flows out only through the overflow line 516. In applications where a recirculation line is employed, the controller operates the three-way valve 532 to cause cleaning fluid to flow from line 522 into line 526 and back to tank 502 ° at the application or location During the treatment, the above-mentioned point-by-point control blender system can effectively and accurately control the concentration of at least two compounds in the cleaning liquid delivered to the chemical tank (such as a tool or a solution tank), regardless of the possibility of changing the chemical solution in the tank. Decomposition of concentration and/or other reactions. The system can continuously supply fresh chemical solution to the tank at a first flow rate, and use a fresh chemical solution to quickly replace the chemical solution in the tank at a second flow rate' when the chemical solution in the tank is determined The second flow rate is faster than the first flow rate when there is one or more compound concentrations that are inappropriate or unsatisfactory. The use of the dot process control blender system is not limited to the illustrated specific examples shown in Figures 5 and 6 above. The system can be used to provide a chemical solution with a mixture of two or more compounds, such as the type of any semiconductor processing tank or other selected tool described above, while maintaining the concentration of the compound in the chemical solution during cleaning operations. Acceptable range. In addition, the process control switcher system can be used with any selected quantity = liquid or semiconductor processing tool, and the above controller and blending chemistry: liquid 5 j can be supplied with a mixing element with two or more precise compound indifferences: More than two processing tools. Alternatively, the controller and the blender are used to supply the chemical solution to one or more of the storage tanks to supply the chemical solution to - or a plurality of processing tools (eg, Γ in the outer casing (as shown in Figure 4, the system of 34 200947171) 400). The process control blender system precisely controls the concentration of the compound in the chemical solution by monitoring the concentration of the solution in the tank and when the concentration of the solution falls outside the target range, replacing or replenishing the solution to the tank. The design and construction of the system facilitates the placement of the system substantially adjacent to one or more chemical solution tanks and/or processing tools that are to provide chemical solutions from the system. In particular, the process control blending system can be located in manufacturing or not. a bath tank and/or tool placement in or near the dust chamber, or near the clean room. For example, a process control blender system including a blender unit and controller can be placed at approximately 3 A solution tank or treatment tool within a radius of preferably less than 15 A feet, preferably less than about 3 meters. Alternatively, the process control blender system can be integrated with one or more tools to form Single unit of blender system and tool. External load blender As described above, according to a specific example, the blender 1 8 can be externally disposed. That is, the blender 108 can be self-contained. 8 service processing stations are dedicated to the consumption, in this case 'the blending machine (10) can then be set remotely, for example in a sub-clean room.", 罟η: a special case of the machine, the blending of the center The machine is configured to assist a plurality of tools. The centered blender system 700% is shown in Figure 7. In general, the jointer system 700 includes a blender 108 and/or a plurality of fill stations 702m. In the real w, 1 shows 702m (collectively filled #7〇2) β blended 胄1〇8彳 according to any previous configuration (as shown in Figure 6 above). The blender (10) passes through the main supply line 4〇4 35 200947171 and a pair The flow lines 7〇4i 2 respectively coupled to the filling station 702i2 are fluidly coupled to the filling station 702. The flow control unit is disposed at the junction of the main supply line and the flow line 704m. The flow control unit 7〇6 represents any number and Suitable for controlling the flow of fluid between the blender 1〇8 and the filling station 7〇2. For example, flow Control unit 706 includes a multi-way valve for controlling the solution from the blender ι 8

Follow the path to downstream destinations. Therefore, the flow control unit 7〇6 can selectively (as under the control of the controller 126) cause the solution to flow from the blender 1〇8 via the first flow line 7〇4丨 to the first filling station 7〇2, and Flowing through the second flow line 7〇42 to the second filling station 702 The wide flow control unit 7〇6 may also include a flow meter or flow controller.

Each filling station 702 is coupled to one or more processing tools. In this exemplary embodiment, the filling stations are each connected with four tools (tool i_sentence, and more broadly, the filling station can be coupled to any number of uses) The solution path (and/or metering, flow rate, etc.) from the filling station 7〇2 can be controlled by a flow control unit 71〇1 2 placed between each filling station and a plurality of tools 708. In one embodiment, the filter 712m is disposed between each of the filling stations and the plurality of tools 7〇 8. The filter 712 is selected to remove the residue of the solution prior to transporting the solution to each tool. In one embodiment, the filling stations 702 are supplied separately. The chemical to each tool 708. For example, in one embodiment, the first filling station supplies dilute hydrofluoric acid, and the second filling station 7022 supplies sc> type 1 solution. The flow control device of each tool is operable to arrange the fed solution. Processing station/chamber flowing to the appropriate tool. In one embodiment, the filling station and blender 1〇8 operate asynchronously. That is, each filling station 702 can be filled while dispensing solution to one or more 36 200947171 tools 708. For this purpose Each filling station is configured with a filling circuit with at least two containers. In this exemplary embodiment, the first filling station 7〇2i has a first filling circuit 714a D with two containers 716i 2 built therein. Defined by a plurality of flow line segments. The first flow line segment 714a fluidly coupled to the flow line 704 and the first container 716 and the second flow line segment 714b are fluidly coupled to the first container 71 to the processing tool 7〇8^the third flow line The line segment 714c is fluidly coupled to the flow line 7〇4 and the second container π. The fourth flow tube line segment 714d is fluidly coupled to the second container 7162 to the processing tool 708. The plurality of valves 720^4 are disposed in the filling circuit for The control fluid is in communication between the blender 1 8 and the vessel 716, and between the vessel 716 and the plurality of tools 708. Each vessel 716 has an appropriate number of level sensors 717 (e.g., high level sensors and low a liquid level sensor for sensing the level of the drooling in the individual containers. Each container is also provided with a pressurized gas input 719i2, thereby accommodating the container, and the venting opening 721^, thereby decompressing the container. Not shown, the filling of the first processing station 702! Circuit 714A_D can be configured with any number of flow management devices such as pressure regulators, flow controllers, flow meters, etc. The second filling station 702 is also configured accordingly. Thus, the first filling station 702 shown in FIG. The two containers 722 are disposed in a filling circuit 7 1 4a_d having a plurality of valves 726i 4 for controlling fluid communication. In operation, the controller 126 operates the flow control unit 7〇6 to establish the pusher 108 and the filling station 702. The communication 126 is still operating a first fill circuit valve 72 (h to establish fluid communication between the first flow line 7〇4ι and the first flow line segment 714a of the fill circuit 714A_D to establish fluid communication with the blender 108 is interposed between the first container 716l. In this configuration, the sowing 37 200947171 machine (10) flows into the solution to the first volume _ 716 ι until the appropriate sensor 717] (ie, the high level sensor) indicates that the container is full, at which time the first filling circuit valve is closed. 72〇1' and pressurize the vessel to pressurize the gas input 7ΐ9 to pressurize the vessel 716!. The vent hole 72ΐ can be opened to depressurize the container before and during filling of the first container. While the first container 716 is being filled, the filling station 7〇2ι can be configured to dispense the second container HQ to one or more tools 7〇8. Therefore, the second valve 72〇2 is closed, the third valve 72〇3 is open, and the fourth valve 72〇4 is allowed to be in fluid communication with the second container 7162 and the ❹ processing tool 708 via the fourth flow line segment 714β. position. When dispensing the solution, the second container can be at a pressure by applying pressurized gas to the respective gas input 72l2. Once it is determined that the fluid level of the second container 7162 has reached a predetermined low level, as indicated by the appropriate low level sensor 7172, the filling station 7〇2 can configure the valve of the first fill circuit to the appropriate position, The configuration is to stop the dispensing from the second container 7162 and start dispensing the β from the first container 7 16 and then open the vent 7212 to depressurize the second container 7162, and then the second container 7162 can be filled with the solution from the blender 108. . The operation of the second filling station 7022 is the same as that of the first filling station 702i' is not described in detail. After filling the container filling station 702^, the filling station will be able to dispense the solution to one or more tools 708 for a period of time. During this time, the flow control unit 7〇6 is operable to place the blender 108 in fluid communication with other filling stations. It is conceivable that the capacity of the filling station can be adjusted to match the specific flow rate into and out of the filling station. The blending machine 1〇8 can be refilled before the spare container of the other filling station is exhausted. 38 200947171 Full filling station container. Thus, the solution can be dispensed from the filling station without interruption or substantially without interruption. Recycling System First Specific Example As described above, in a specific embodiment of the present invention, a fluid removed from a processing station (or a general use point) is recycled and reused. Referring now to Section 8A, a specific example of a helium recovery system 800A is shown. The recycling system 8A includes some of the components of the aforementioned FIG. 4, and like components are denoted by the same reference numerals and will not be described again. In addition, some of the aforementioned items have been removed for clarity. In general, the recovery system 800A includes a blender 1〇8 and a plurality of slots 8〇2in (collectively slots 802). The slot 8G2 corresponds to the slot 436 shown in Fig. 4, so that each ___ slot fluid handle is coupled to a respective processing station (not shown) or fluidly coupled to the vacuum pump subsystem 120 (not shown). In one embodiment, 8〇2 is configured to separate the ©liquid and gas fed into the liquid stream. For this purpose, the slots 8〇2 each include a jet plate 828. The slot inlet encounters the jet plate 828'. The liquid helium will condense from the incoming fluid stream due to blunt force. The slot 802 also includes a defogger 83〇1·Ν. The mist eliminator 830 generally includes an array of $ faces that are placed obliquely (e.g., about degrees) relative to the flow through the demister 83. The surface of the ejector plate and the demister advances to promote the liquid enthalpy from the gas, and the liquid from the inflowing liquid remains in the liquid storage area of the lower part of the tank. 任何 'Any residual vapor is moved to the vacuum pump sub-system (4) The first] map). In a specific example, the degassing baffle 834i is placed under the demister, such as directly below the plate 828. The degassing baffle extends past the liquid helium storage area 832 39 200947171 and forms an opening 836 i-N at the end. In this configuration, the degassing baffle allows liquid to enter the liquid storage area 832 via the opening 836, but avoids the moisture of the liquid being reintroduced with the incoming liquid/air flow. Each tank 802 is fluidly coupled to the blender 108 through a respective recovery line 804-N (collectively, recovery line 804). The respective pumps 806, -n (collectively referred to as pumps 806) are arranged to drive fluid from the tanks through their respective recovery lines 804. The fluid communication between the slots 802 and their respective pumps 806 is controlled by the pneumatic valves 808, which are located in the recovery line 8〇4, collectively referred to as valves 808). In one embodiment, the pump 860 is a centrifugal pump or a suitable substitute' such as a pneumatic diaphragm or bellows pump. In one embodiment, a filter 81 (hereinafter collectively referred to as filter 810) is provided in each recovery line. Filter 810 is selected to remove the recovered fluid residue before the recovery fluid is introduced into blender 108. Although not shown The filters are respectively coupled to the flushing system, which is configured to flow a flushing fluid (such as DIW) through the filter to remove and remove the residue obtained by the filter. The fluid flowing into the filter and blender 1〇8 can be One or more flow management devices are managed (eg, controlled and/or monitored). For example, flow management devices 812i-n, 814in are provided in the individual recovery lines upstream and downstream of the filter. For example, in the illustrated example, the upstream devices 812] is a pneumatic valve (collectively referred to as valve 812) placed upstream of the filter 81. Therefore, the flow rate of the recovered fluid is controlled by the operation of the pneumatic valve 812. In addition, the downstream devices 814i-N include a pressure regulator and a flow control valve to The predetermined pressure and fluid flow rate introduced into the blender 108 are ensured. Each flow management device can be controlled by the controller 126 (Fig. 4). Each-recovery line 804 terminates at the main supply line 200947171 404 of the blender. The fluid from each (four) may flow into and mix with the solution flowing through the main supply line 404. In one embodiment, the recovery fluid is from a mixing station disposed coaxially with the main supply line 404 (such as the mixer of Figure 6 above) 640) upstream introduction. Additionally, one or more concentration monitors 818 are disposed along the main supply line 404 downstream of the mixer 640. Although for convenience, only the concentration monitor is shown, it is conceivable that the concentration monitor can be used differently. Recycling chemicals, in this case, the recovery stream is introduced into a main supply line 404 for a particular stream located at an appropriate location upstream of the individual concentration monitor. Thus, individual concentration monitors can monitor individual chemical concentrations. Within the target range, the blender 108 is operable to inject an appropriate amount of the appropriate chemical σ from the different inputs 4 。 2. The resulting solution is then mixed in the mixer 640 and the tear monitor 818 monitors the tears again. The process continues while the solution is diverted to discharge until a predetermined concentration is reached. The solution then flows to the appropriate point of use. In some configurations, 'for each The chemicals of each station are always the same. Thus, in one embodiment, different recovery lines 804 are input to appropriate supply line usage points 410, 412, 414, as shown in Figure 8 of the recovery system 800A. The 'concentration monitor is shown along the recovery line to monitor the individual recovery stream concentrations in the point of use of the supply line to be input. Although not shown, the mixing zone is set along the supply line use points 410, 412, 414 for mixing into the recycle stream The liquid flow from the blender 1 〇 8. Further, the liquid flow can be appropriately mixed by conveying the liquid flow from the blender 108 and the individual recovery streams of 18 degrees to each other. The coupling is mixed, whereby the resulting mixture flows to an individual 200947171 point of use or a 'recovery flow that can flow to the upstream of the appropriate concentration monitor of the blender 108, as opposed to the flow path of the feed stream, as in the first The recycling system 800C of Fig. 8C is shown. For example, a dilute hydrofluoric acid recovery solution from a first recovery line 804i can be input downstream of the hydrofluoric acid input 4021 and upstream of the first concentration monitor 4〇6ι, which is configured to monitor the hydrofluoric acid concentration. The SC-1 type chemical recovery solution from the second recovery line 8042 can be input to the ammonium hydroxide input 4〇22, downstream of the hydrogen peroxide input 4023, and the second and third concentration monitors 4〇62, 4〇 Upstream, it is configured to monitor the SCq type solution composition concentration. And so on. In the case of a steroid, the process model equation derived from the metrology signal and the titration analysis results can be used to distinguish different components of a mixture of components such as ammonium hydroxide and hydrogen peroxide. Before decomposing, NH3 molecules are spilled or any salts are formed or by-products are produced by chemical treatment, the concentration of the chemical fed into the process, more specifically, the flow concentration. Thereby, the change in the observability and the composition change characteristic of the prediction process are observed. In the foregoing specific examples, an appropriate concentration of recovered fluid can be filtered and monitored. After a period of time and/or several treatment cycles, the recovered fluid will no longer be suitable for its use. Thus, in one embodiment, the solution from tank 8〇2 is only recycled and reused for a limited period of time and/or a limited number of treatment cycles. In one embodiment, the number of processing cycles is measured by the number of wafers processed. Thus, in a particular embodiment, a particular chemical solution for a particular processing station is recycled and reused to process a wafer for a predetermined integer. After processing one wafer, the solution is diverted to excretion. It should be understood that the recovery system 8A_c shown in Figures 8A-8C is only a specific example of the example of 42 200947171. Other specific examples within the scope of the invention will be apparent to those skilled in the art. For example, in another embodiment of the recovery system 800A-C, fluid may flow from the tank 802 to an external recovery facility, such as a sub-clean chamber. For this purpose, a suitable flow control device, such as a pneumatic valve, can be provided in the recovery line 804. Second Specific Example FIG. 9 illustrates a specific example of a recovery system for combining a fresh chemical solution from a blender with a recovery chemical solution from a point of use (eg, treatment station u〇4), and dispensing a mixed chemical solution. To the point of use. The recovery system 丨1〇〇 is used to measure at least one chemical characteristic of a chemical solution located upstream of the point of use and downstream of the point of use. The characteristic measurements of the two locations are compared to a particular predetermined value or range. Measurements that fall outside of the predetermined range will trigger the system to make one or more adjustments' to bring the values into range, as will be explained in detail later. The recovery system 1100 includes a recovery tank 耦 U02 6 coupled to the blender unit 丨〇8. In one embodiment, the tank 1102 is located upstream of the flow control unit 408 shown in FIG. The inlet of the recovery tank 11 〇 2 is connected to the blender unit 108 via a flow line 丨丨i 2 . According to a specific example, the flow line 1112 corresponds to the supply line 404 shown in FIG. The recovery tank 11 〇 2 is configured to supply cleaning fluid to the point of use. The recovery system 11 further includes a recovery line 1 1 70 for returning the cleaning liquid recovered from the point of use to the recovery tank 1102. In a specific example, the recovery line 1170 is the recovery line 448 exiting the vacuum tank 43 6 in FIG. The recovered cleaning liquid is mixed with the fresh cleaning liquid supplied from the blender unit 1〇8 of the recovery tank 1102. 43 200947171 The blender unit 108 can control the mixing concentration of the cleaning liquid in the flow line 丨丨12. For example, the blender unit 1〇8 is controlled to provide the constituent chemicals required to maintain the cleaning fluid concentration and/or capacity of the recovery tank 1102. As described above, the cleaning fluid can be continuously supplied from the blender unit 1〇8 to the tank 1102 at one or more selected flow rates. Alternatively, the cleaning fluid is only supplied from the blender single τ supply tank at selected intervals (e.g., when the fill tank is initially filled, and one or more compounds of the cleaning fluid in the tank fall outside of the selected or target concentration range). In this exemplary embodiment, the cleaning fluid formed in the blender unit 108 and supplied to the recovery tank 1102 is a binary solution of hydrofluoric acid (HF) and deionized water (DIW). The HF is supplied to the blender unit via supply line 1106, and the deionized water (DIW) is supplied to the supply blender unit via supply line 11〇8. The DIW and HF are mixed using a mixer 1141 of a blender. In a particular embodiment, the heated dilute HFE is input, so that the blender unit 1〇8 can be configured for use with a DIW input for heating. The DIW heated in a particular article instance is maintained at a temperature of from about 25 ° C to about 7 (rc. Note that the blender unit 1 8 can be configured to provide any selected chemical compound amount (eg, two or more) and at a selected concentration Mixture to any type of tool, where the mixture includes chemical compounds such as hydrofluoric acid (HF), ammonium fluoride (ΝΗβ), hydrochloric acid (HC1), sulfuric acid (ΗβΟ4), acetic acid (CH/OOH), ammonium hydroxide (氢氧化4ΟΗ), hydrazine hydroxide, ethylenediamine (EDA), hydrogen peroxide (η2〇2), and nitric acid (ην〇3). For this purpose, the blender unit 108 may include one or more mixers. To combine different stages of chemical compounds. For example, the blender unit 8 can be configured to dispense diluted HF, SC_1 and/or sc-2 solutions. The SC-1 cleaning solution contains hydrogen peroxide (ΝΗβΗ). 200947171 ternary solution of hydrogen peroxide (Η2〇2) and deionized water (DIW). [p40] In addition, any suitable surfactant and/or other chemical additives (such as ammonium peroxysulfate or APS) can be incorporated into the cleaning. Liquid to enhance the cleaning effect of special applications. Flow line 1110 selective A flow line 1112 between the first mixer 1141 and the second mixer 1142 facilitates the addition of additives to the cleaning fluid used in the cleaning bath. In one embodiment, each chemical compound Q of the supply blender unit 108 is stored. In addition, the supply of chemical compounds can be controlled under pressure to provide a stable feed pressure to the blender unit 1 。 8. Exemplary chemical container components that achieve these goals 丨 1 〇 5 Illustrated in Figure 9 "Container member 11"5 comprises a dual container member in which each container is filled and dispensed with a chemical compound. In this aspect, the container can be filled while another container can be dispensed with chemical compounds. The blender unit 108 is supplied. The capacity per container may range from 2 liters to 6 liters, preferably 3 liters. In one embodiment, the container members are sized to continuously flow into the compound for 3 minutes to 10 minutes. Minutes or sufficient time to run at least one treatment cycle. Chemical compounds can be supplied to the blender at an inlet chemical pressure of 5/sq. to 75 psi. 108, preferably about 15 psig to 35 psi. Further, the chemical compound entering the container member (10) can be controlled to refill at least one of the members of the member 11〇5 for a suitable period of time, for example about 1 Leap seconds to i minutes, preferably about Μ seconds. In a Zhao example, the container member 11() 5 is filled in a range of 0... squared to a pressure of square inches, preferably 〇时/平方英Up to 35 pieces per square inch. Although a double container member is described herein, it is noted that a 45 200947171 or multiple containers may be used to store and dispense chemical compounds to the blender unit 1〇8. The recovery tank 1102 is used for receiving And mixing the cleaning solution from one or more sources' then dispensing the mixed cleaning solution to the point of use. As described above, the cleaning fluid from the blender unit 108 is supplied to the recovery tank 1102 via the line m2. The recovery tank can also receive used cleaning liquid from the recovery line 1170 and/or recycled cleaning liquid from the recirculation line 1160. . The recovery tank n〇2 is suitably sized and maintained to maintain a quantity of cleaning fluid (e.g., sufficient capacity to form a cleaning bath for cleaning operations). In one embodiment, the recovery tank 1102 is sized to maintain sufficient cleaning fluid to operate for at least one process cycle. For example, the volume of the tank 1102 can range from about 15 liters to 100 liters', preferably from about 30 liters to 50 liters. The tank 1102 can be configured with an overflow section and an outlet to allow the cleaning liquid to exit the tank via an overflow line (not shown) and maintain a certain amount of cleaning liquid in the tank as the cleaning liquid is continuously fed to the point of use as follows. The recovery tank 1102 includes an outlet line 1118' that connects the distribution system ι15〇, which supplies cleaning liquid to the processing station u 〇4. The cleaning liquid flows into the distribution system n50 due to a pressure gradient between the recovery tank 11〇2 and the distribution system 1150. The pump 1117 is selectively used to assist in the delivery of cleaning fluid to the dispensing system n5 and/or the processing station 1104. In one embodiment, the dispensing system 1150 includes two or more holding tanks 1151, 1152 (only two are shown for illustration) to store the cleaning liquid from the recovery tank 11〇2. As shown, the receiving grooves 1151, 1152 are placed in the outlet line ms of the parallel recovery tank 1102. The filling valve 112 is disposed upstream of the grooves 1151 and 1152 to selectively control the filling of the grooves 1151 and 1152, and the distribution valve 1121 is set to 200947171.

Downstream of the tanks 1151, 1152, the respective tanks 1151, 1152 are selectively controlled to discharge. In this aspect, the accommodating grooves 1151, 1152 can be individually operated to fill or dispense the cleaning liquid. Valves 1120, 1121 are preferably electronic valves that are automatically controlled by controller 126 (pictures 1-4 above). In one embodiment, the holding tanks 1 1 5 1 , 1 1 52 are alternately filled and dispensed with cleaning liquid. In this aspect, at least one of the holding tanks will dispense cleaning liquid to the processing station 11〇4 for continuous processing operations. The cleaning liquid from the holding tank 115 1152 is distributed to the flow line 1122, which is supplied to the processing station 1104. The capacity of the receiving tanks may be the same or different. For example, the capacity of the holding tank is 15 liters. The selective filter U55 is provided in the flow line "22 downstream of the accommodating grooves 1151, 1152. Filter ι 55 is selected to remove particulates from the solution prior to delivery of the solution to treatment station 1104. In addition, flow line U22 optionally includes any suitable number and type of temperature history and/or flow rate sensors, and may include - or a plurality of suitable heat exchangers to assist in recycling the solution back to tank 1102 The heating temperature and flow rate of the solution are controlled. Flow line 1122 is useful for controlling the temperature of the bath in the tank during operation of the system. The fluid monitoring unit 1181 is connected to the flow line 1122 downstream of the receiving tanks U51, 1152. As shown, the monitoring unit 1181 is located at the filter u: downstream. The fluid monitoring unit 1181 includes at least one sensor that: when the cleaning liquid flows through the line 1122, measures one of the cleaning liquids (such as HF): Chemical characteristics (such as conductivity or concentration of one or more chemical compounds) The sensor of the measuring unit 1181 can be an electrochemical sensor, spectral sensing: a suitable sensor to facilitate accurate measurement of the cleaning liquid. One or more chemistries H specific examples 1 in the system of sensors 47 200947171 electrodeless conductive probes and / or refractive index (RI) detectors, including gossip loop coil sensors, such as commercially available Types of Model 3700 series from GLI International (Colorado), RI detectors, such as the type of CR-288 commercially available from Swagei〇k (Ohio), and voiceprint identification sensors, such as commercial The type available from Mesa Experimental Research (Colorado) is not limited to this. Suitable sensors include sensors that measure redox potential, infrared, ultraviolet, pH or other characteristics to be tested. In a specific example, the flow The line 1122 is connected to the process inlet line 1165 of the treatment station 11〇4 and the recirculation line ❹ 1160 of the transfer tank u〇2. To assist the distribution of the cleaning liquid between the two lines 116〇, 1165, the selective three-way valve 1132 is provided Downstream of the fluid monitoring unit 1181. As shown, the flow line 1122 connects to the inlet of the three-way valve i 132. The three-way valve can be an electronic valve that is automatically controlled by the controller 126 in accordance with the concentration measurement provided by the unit 1181 in the following manner The process inlet line 1165 connects the outlet of the valve 1132 and extends to the processing station 1104 to supply cleaning fluid for processing operations. The recirculation line 1160 connects the other outlet of the valve 1132 to assist a portion of the solution from the flow line 1122 during normal system operation. The cycle returns to the tank 1102 (which will be described later). In another embodiment, the selective discharge valve 1161 is connected to the recirculation line 1160, and will be recirculated if it is determined that the cleaning liquid of the return tank 11〇2 is not desired. Line 1160 is discharged. In yet another embodiment, the cleaning fluid in flow line 1122 can be distributed between treatment inlet line 1165 and recirculation line 1160 in any suitable manner. Some or all of the cleaning fluid is dispensed to recirculation line 1160. Additional valves or regulators may be used to assist in the dispensing of the cleaning fluid. 48 200947171 Recirculation line 1160 may include any suitable number and type of temperature, pressure, and/or flow rate. The sensor may also include one or more suitable heat exchangers to assist in the heating, temperature and flow rate control of the solution as it is recycled back to the tank 1 。 2. The recirculation line is beneficial during control system operation The bath temperature in the tank. In addition, 'any suitable number of filters and/or pumps (eg, in addition to the pump 1117) may be selectively placed along the flow line 1160 to aid in filtration and control of recirculation back to the tank. The solution flow rate of 1102. In a specific example, the recycle line 1160 aids in the cleaning fluid in the mixing system. For example, after the fresh cleaning liquid is added to the recovery tank 1102, the cleaning liquid is circulated through the recirculation line 1160 one or more times to enhance mixing and to promote uniform cleaning of the cleaning liquid in the recovery tank 1102. In another embodiment, the circulating cleaning fluid is monitored to determine if the target concentration or characteristics have been reached prior to supplying the cleaning fluid to the processing station 1104. In one embodiment, while the cleaning fluid is circulating, the processing station is in a standby state. The recovery system 1100 also includes a recovery line 1170 that connects the outlet of the point of use and a recovery tank 1102. In one embodiment, the recovery line 1170 is a recovery line 448 as shown in FIG. The recovery line 1170 directs the recovered cleaning liquid from the processing station to the recovery tank 1102. The second fluid monitoring unit 1182 is provided in the recovery line 11 70. The second fluid monitoring unit 1182 can be configured with the first fluid monitoring unit 1181 to measure the same or different chemical characteristics. The selective discharge valve 1171 is connected to the recovery line 1170 for discharging the recovery line 1170. If the return line 1102 is not appropriate, "note that the recovery line 117" may also include any suitable number and type of temperature, pressure and/or flow rate. The detector 'and one or more suitable heat exchangers are used to assist in the heating, temperature and flow rate control of the solution as it is recycled back to 49 200947171 to tank 1102. The recovery system 1100 includes a controller 126 that automatically controls the components of the blender unit 108 and the discharge valves 1161, 1171 based on the chemical characteristic measurements obtained by the fluid monitoring units 1181, 1182. As described above, the controller adjusts one or more components of system 11A based on the characteristics of the cleaning fluid in lines 117, 116, as measured by fluid monitoring units 1181, 1182. Controller 126 is configured to connect certain components of fluid monitoring unit 1181, 1182, bleed valve 1161, 1171 and valve 1132, and blender unit 108 via any suitable wired or wireless communication link to obtain measurements from the fluid monitoring unit. Information to control the blender unit and valve. Exemplary communication protocols include Ethernet or dry contacts. The controller includes a processor that is programmed to perform any one or more of the appropriate types of process control, such as proportional integral derivative (PID) feedback control. An exemplary controller suitable for a process control blender system is the PLC Simatic S7-300 system, which is commercially available from Siemens (Georgia). Based on the measurements provided by the fluid monitoring units 1181, 1182, the controller 126 is configured to cause the system to generate one or more changes. In a specific example, the fluid monitoring unit 181, 1182 is configured to measure the conductivity of the cleaning fluid. The measured conductivity value is compared to the stored response or target value range. If the measured value falls within the allowable range, the controller 126 allows the operation to continue without any change. However, if the measured value falls outside the range of acceptable values, the controller 126 will cause the system 11 to produce one or more changes. Controller! 26 Recyclable line 1160 or recovery line i丨7〇, chemicals that change fresh cleaning fluids, or combinations thereof, such as partial emission recovery lines 丨丨7〇 50 200947171 and changing chemicals. Chemical changes in fresh cleaning fluids involve changing the concentration and/or flow rate of the cleaning fluid. In one embodiment, the fresh cleaning solution is a high concentration, low flow rate solution, also referred to as "snap," in an example, if the concentration of the recovery line 1170 is measured to decrease, the controller will increase The concentration of fresh cleaning fluid in the supply tank compensates for the drop, thereby causing the cleaning fluid in the tank to fall within the acceptable or target concentration range. Once the cleaning fluid concentration falls within an acceptable range (measured by fluid monitoring unit 1182) then the controller The blender unit is programmed to reduce (or decrease) the concentration while maintaining the mixed cleaning liquid in the tank u〇2 at a predetermined compound concentration. In another example, if the measured value of the fluid monitoring unit 1181 falls within Outside the range, the concentration is below the target value. The controller can respond to 'drain the cleaning fluid and replenish the chemical before dispensing the cleaning fluid to the point of use. In another example, 'If the flow monitoring unit 1182 measures If it falls outside the range, the controller can use the discharge valve 1171 to discharge the recovery line 1170' without returning the used cleaning liquid to the recovery tank 1102. Conceivably even if measuring Within the predetermined range, the controller can still cause the system to change. In another embodiment, the measured values of the fluid monitoring units 丨 181, u 82 are used to determine the target characteristics. Next, the target characteristic values and the allowable values of the characteristics are compared. Range to determine if any changes need to be made to the recovery system. In one embodiment, the fluid monitoring unit 丨丨8丨, u 82 is configured to measure the conductivity of the 'cyan' broth. The controller 126 is configured to The conductivity value is converted to a concentration value. For example, the data or mathematical formula can be used to program the controller 126 for conversion. The conductivity values measured by the fluid monitoring unit 181, 1182 are used to determine the concentration value. Correlation and Concentration Values 51 200947171 Range 'and system as needed. For solutions with multiple chemical compounds, such as ternary or quaternary compound addition sensors are used to assist in determining target characteristics. For this purpose, the controller 126' can be programmed using any suitable data or model to determine other characteristics from the measured characteristics (eg, from the measured refractive index to a rich And let controller 126 determine if the system needs to be changed. In a specific example, a recovery system such as SC-ii ternary cleaning solution 11 is used in conjunction with two sensors to measure the solution of flow line U22. Two different characteristics, and two sensors are installed to measure the same two characteristics of the solution of the recovery line 1170. One sensor is used to measure conductivity, and the other sensor is used to measure the refractive index. Hydrogen in the cleaning solution The ammonium oxide and hydrogen peroxide concentrations can be inferred from the two measurement characteristics. The estimated compound concentration and the allowable value are then compared to determine whether the system needs to be changed. An example of a method for operating the system shown in Figure 9 above will be described. In the example of the example, the cleaning liquid can be continuously supplied to the tank, or can be supplied to the tank only at selected intervals (such as the cleaning liquid of the drain tank), the binary cleaning liquid containing HF and DIW in the blending machine. The unit 1〇8 is prepared and supplied to the tank 11〇2, wherein the HF concentration is about 〇1·15% by weight, preferably about 5% by weight. In operation, the supply of HF and DIW can be pressure controlled to provide a stable feed pressure to the blender unit 108. In one embodiment, HF is stored in a double barn unit 1105 wherein each container has a capacity of 3 liters. First, the container member U05 was filled with a pressure of 0 傍 7 square inches. Subsequently, Bp is supplied to the bar member 1105 at a minimum pressure of 5 pieces/square inch and a flow rate of 5 liters per minute (LpM). The container member 11〇5 was made to an appropriate size to continue to flow into the HF for 3 minutes to ι〇 minutes. The DIW was supplied to the blender ι 8 at a minimum pressure of 35 psig and a flow rate of 30 LPM. Both chemical compounds are supplied at 20 ° C to 25 ° C. The controller 126 controls the blender unit 1 to provide cleaning liquid to the tank 11〇2 via a flow line in a flow rate of about 0-35 liters per minute (LPM). The blender can supply the solution continuously or at selected times during system operation. The recovery tank 1102 has a capacity of 40 liters. The tank may be supplied with a cleaning liquid containing HF of 5% by weight of the solution. The cleaning liquid may be supplied from a flow rate of 0.5 LPM to 30 LPM to the tank 1102. The temperature of the cleaning liquid in the recovery tank 11〇2 is 2 〇〇 c to 25 C, or about room temperature. Additives such as Aps can be selectively added to the cleaning solution through supply line 111〇. The cleaning fluid is supplied from the tank 11〇2 to the outlet line at a flow rate of about 25 LPM. The 1118 / month cleaning liquid is directed to the holding tanks 1151, 11 52 of the dispensing system 1150. The receiving tank is configured to alternately fill and dispense the cleaning liquid to the processing station 11〇4. As shown, each holding tank has a capacity of 15 liters. In order to fill the 容纳 accommodating groove, the filling valve 112 第一 of the first accommodating groove 1151 is opened. The cleaning liquid flows into the first accommodating groove 1151 due to a pressure gradient between the recovery tank 1102 and the first accommodating groove 1151. After filling a certain capacity, close the filling valve 1120 of the first receiving tank and open the second receiving tank! The filling valve of 152 is 〇12〇. Note that the two holding slots can be opened when the filling is started or when the processing is performed at the selected interval. While filling the first accommodating groove 1152, the dispensing valve 1121 opening the first accommodating tank distributes the cleaning liquid to the flow line 1122 at a flow rate of 22 LPM for use by the processing station 1104. After filling a certain capacity, the filling valve 1120 of the second accommodating groove 1152 is closed and the dispensing valve 112 is opened. At the same time, the dispensing valve 1121 of the first accommodating groove 53 200947171 1151 is closed and the filling valve 1120 is opened. The two holding tanks 115, 115 and 2 alternately fill and dispense the cleaning liquid to ensure that the cleaning liquid continuously flows into the processing station 1104. In another embodiment, after the second tank is filled, the dispensing valve of the second receiving tank 1152 remains closed until the first receiving tank is ready to stop dispensing the cleaning liquid. The cleaning liquid dispensed from the holding tanks 115 1 , 11 5 2 passes through the transition unit 1155 to remove any excess debris. In one example, the filter 1155 is a 0.1 micron, 10 inch sputum PTFE filter. Controller 126 monitors the concentration of cleaning fluid in flow line 1122 based on input from rogue monitoring unit 1181. In this example, the rogue monitoring unit 1181 is equipped with a sensor to measure the conductivity of the cleaning fluid. Controller ι26 is configured to calculate the concentration as a function of conductivity. If the corresponding concentration determination has deviated from the target concentration value range', the controller may control the three-way valve u32 to divert all of the solution to the discharge valve 1161 of the recirculation line 1160 to discharge the cleaning liquid. Alternatively, the controller may discharge a portion of the cleaning fluid and instruct the blender unit 108 to provide a more concentrated cleaning fluid to replenish the lost hf. In a specific example, controller 126 is configured with a model or data to derive the concentration from the conductivity value. Figure 11 shows an exemplary relationship between concentration and conductivity. In one example, the concentration of the Hf solution can be inferred by locating the measured conductivity on the graph. The controller compares the estimated value with the target concentration value range. If it falls within the range, then the controller 126 allows processing to continue without any changes. In some instances, the relationship between conductivity and concentration varies with temperature. The thermometer is used to measure the temperature of the cleaning fluid to properly determine the relationship between conductivity and concentration. The flow line can be made by adjusting the three-way valve 1132! The cleaning fluid 54 in 122 is distributed between the treatment population line 1165 and the recirculation line u6Q. In this example, the process inlet line (10) has a 12 lpm cleaning fluid recycle line with 10 LPM of cleaning fluid. The line 1165, ιΐ6〇 is the cleaning liquid supply processing station 1104 in the 7-squared treatment population line, and the cleaning liquid return recovery tank 11〇2 in the recirculation line 1160. The cleaning fluid is circulated to one or more chambers of the processing station 1104 for processing. A processing loop involves the control room being in the ίτ_Ν period and the closing (〇ff) 〇 period. In this example, the chamber is open for 48 seconds for processing and is closed for 12 seconds. During the opening period, the cleaning solution capacity is reduced by 25% and the concentration is reduced by 2%. During the shutdown period, the cleaning fluid capacity was not reduced, but the concentration was reduced by 2% or less. Therefore, the flow rate of the cleaning liquid leaving the recovery line 117 打开 during the opening period was 9 LpM, and the concentration was 4% by weight. The cleaning fluid of the recovery line 117 has a pressure of 3 psi. The concentration and flow rate reduction can be monitored by the flow monitoring unit 1丨82. In this example, the conductivity value measured by the flow monitoring unit 1182 produces a concentration value that falls outside the range of the target concentration value as determined by the graph of Fig. 11. The decrease in concentration will trigger the controller 126 to respond to increase the concentration of the fresh cleaning solution. The controller 126 can increase the concentration of the fresh cleaning liquid supplied to the recovery tank 11〇2 to 5.05 wt% to compensate for the reduced concentration of the recovered cleaning liquid. Further, the recovery of the cleaning liquid minus 3LPM can also be detected by the flow rate meter of the flow monitoring unit 1182. The controller 126 responds to supply 5,05% of the cleaning liquid to the recovery tank 1102 at a flow rate of 3 LPM. Thus, the recovery system 11 provides the ability to effectively recover and blend, thereby maintaining the intended circulation and concentration of the cleaning liquid. Figure 10 is a schematic illustration of a processing system 1200 for supplying two different 55 200947171 chemicals to two processing stations. The virtual landlord is sticky. The processing system 120A includes a first MU-coupling wire 121 for supplying a first chemical, and a second switching system 1212 for supplying a second chemical. For example, the first Mr. Kangxi, the divisional chemistry σσ is the HF cleaning solution, and the second chemical is the S C 1 cleaning solution. The blending system 1211, 1212 supplies its individual chemical deduction to the first processing station lm and the second processing station} (10). Although here is the point of convergence S 4 • It is to be noted that the various holding systems can also supply chemical solutions to any suitable number of processing stations. It should be noted that the number of blending systems corresponds to the number of different chemicals required for a particular process.

The mother-blending system 1211, 1212 includes a chemical inlet 12〇6, a blending machine 1208, a recovery tank 1202, and a dispensing system 1250. The components are substantially similar to the inlets 11〇6, 11〇8, the blender unit ι8, the recovery tank 1102, and the dispensing system 115A of the above-described Fig. 9. For the sake of clarity, it will not be repeated here. Each system can operate in a manner similar to the system shown in Figure 9. For example, the chemical inlet 12〇6 of the first blending system 1211 includes a chemical inlet line, such as an HF inlet line 11〇6 and an mw inlet line 11〇8. The chemical inlet 12〇6 of the second blending system 1212 includes an inlet line for supplying ammonium hydroxide, hydrogen peroxide, and DIW. The inlet line is used to supply chemical compounds to the blender unit 1208. The blender unit 1208 mixes the chemical compound and supplies the just mixed chemical solution to the recovery tank 1202. The recovery tank 1202 mixes the fresh chemical solution with the solution already in the recovery tank 1202 and the chemistry returned from the recovery line 127 and the recycle line 1260. Solution. Next, the recovery tank 12〇2 supplies the mixed chemical solution to the distribution system 1250 where the chemical solution is distributed to the processing station, 1205 〇56 200947171 as shown in Fig. ο, with the first chemical from the first blending system 1211 The chemical solution is distributed to at least two processing stations 12〇4, 12〇5. The chemical solution can be distributed to the first chemical chamber 1231a of the first processing station 1204 and the first chemical chamber 1231 Ββ of the second processing station 1205. Additionally, a portion of the chemical solution can be recycled back to the recovery tank 12〇2 via the recirculation line 1260. The used chemical solution can be recovered and returned to the recovery tank 12〇2 via recovery line 1270. In a particular example, at least a portion of the chemical solution exits the processing station 1204 via a discharge line 1238.

Similarly, the chemical solution having the second chemical from the second blending system 1212 is distributed to at least two processing stations 12〇4, 12〇5. The chemical solution can be dispensed to the second chemical chamber 1231 of the first processing station 1204 and the second chemical chamber 1231 Ββ of the second processing station 1205. Additionally, a portion of the chemical solution can be recycled back to the recovery tank 12〇2 via the recirculation line 1260. The used chemical solution can be recovered and returned to the recovery tank 12〇2 via recovery line 1270. In one embodiment, at least a portion of the chemical solution exits the processing station 1204 via a discharge line 1238. Each blending system 1211 '1212 includes a fluid monitoring unit for monitoring chemical solution characteristics in each system. The fluid monitoring unit is used to maintain the chemical concentration of the recovery tank and maintain the tank capacity within the control range. In a specific embodiment, the first blending system 1211 includes a first monitoring unit 1281 disposed upstream of the processing station to monitor the chemical solution prior to processing. The measurements taken by the first monitoring unit ΐ28ι are used to verify that the chemical solution chemicals fall within the target range for processing. The first blending system further includes a second monitoring unit 1282 disposed downstream of the processing station to determine the degree of chemical degradation after the treatment and before the reflux recovery tank 12〇2 monitors the measured value of the county. . If the measurement is outside the range, the controller can send the chemical solution to the cable and/or provide supplemental chemicals from the 2-unit unit to shout the chemistry in the tank. = within the specification range. In a specific example, the first blending system ΐ2;: == liquid is a binary solution, such as hf "iw. The first and second monitoring early 1281, 1282 are used to measure binary, cross, for acknowledgment The sputum in the rain Η... Heavy "the conductivity of the liquid" to determine the HF concentration in the solution. Depending on the measured concentration, the controller 126 concentration is returned to the target I week while maintaining ❹. Similarly, the second blending system 1212 includes being placed upstream of the processing station: monitoring unit 1291 to monitor the chemical solution prior to processing. The first-monitoring measurement obtained by the single coffee is used to confirm that the chemical solution chemical is within the target range of the treatment. The second blending system 1212 further includes a first: monitoring unit 1292 placed downstream of the processing station to monitor the measured values obtained by the chemical solution 1 and the monitoring unit 1292 before the service and the return recovery tank 1202. The degree of chemical degradation is determined by comparison with the measured values obtained in 1291. If the right measurement falls outside the range, the controller can send the chemical solution to the drain and/or provide supplemental chemicals from the blender unit 12〇8 to maintain the chemicals in the recovery tank within specifications. ° In one embodiment, the chemical solution of the second blending system 1212 is a triterpene solution, such as SCM, which contains a mixture of ammonium hydroxide, hydrogen peroxide, and DIW. To determine the specific characteristics (such as concentration) of a ternary chemical solution, the fluid monitoring sheet needs to measure two different characteristics. This is because the ternary chemical solution includes additional unknown values (such as the second chemical component) that require additional properties to be measured. For example, 58 200947171 to determine the concentration of each chemical' fluid monitoring unit 1291, i292 is configured to measure conductivity and refractive index. The measured values are then used to determine the oxidized money and hydrogen peroxide concentration. The chemical concentrations and target ranges were compared to determine agreement. Based on the Handu value, the controller 126 responds to adjust the concentration of the - or chemical in the fresh chemical solution. Alternatively or additionally, the controller may discharge the chemical solution and adjust the flow rate and/or concentration of the fresh chemical solution such that the chemical solution of the reflux recovery tank 1202 falls within the target range. ❹ ❹ Figure 12 shows an exemplary model for deriving a liquid chemical (such as S(M) chemical compound: degree. In this example, the model preset is to measure ammonium hydroxide, hydrogen peroxide and DIW. The refractive index value and the reduction potential value of the mixture of various concentrations (such as concentration) of the M solution. The measured values are represented by the U-th graph. For each compound, the refractive index is indicated on the χ axis, and the reduction is performed: The position is not drawn again. In the figure, the concentration "Α" refers to the specific blend hydrogen concentration, and the concentration ''Β' refers to the hydrogen (four) degree. It can be seen that as the concentration of any chemical increases, The refractive index also increases. Under the control, the = position increases with the increase of the concentration A, but the reduction potential decreases with the increase of the Han degree W as described above, and the special characteristics (such as the concentration) of the ternary chemical solution are determined not to be (four). The specific example shown in Fig. 10, fluid monitoring: 2291, configured to measure the refractive index and reduction potential of the chemical solution for this purpose 'fluid monitoring units 1291, 1 and zy2 are equipped with two senses of operation, rogue monitoring The unit is used to judge before processing. First, the 'rogue monitoring unit 1291 measures The liquid rate reduction potential is cleaned. From the two measured values, the controller 126 can determine the concentration of each chemical by comparing the measurement model of Fig. 12 200947171 Fig. 12. Since each point in the figure is related to the known concentration value, the measurement is performed by the measured value. The cleaning solution concentration can be inferred. Subsequently, the controller 126 compares the estimated concentration value with the target concentration value range to determine whether the cleaning liquid falls within the specification. If the estimated value falls within the specification, the controller 126 allows the processing to continue without any need. The fluid monitoring unit 1292 can take the same procedure to determine the concentration of the cleaning liquid after treatment. First, the fluid monitoring unit 1292 measures the refractive index and the reduction potential of the cleaning liquid. The two measured values are plotted in Fig. 12 to determine the special measurement value. The associated known concentration value. Subsequently, the controller 126 compares the estimated concentration value to the target concentration value range to determine if the cleaning fluid falls within the specification. If the estimated value does not fall within the specification, the controller 126 will cause the system to change. Fig. 13 shows an example in which the adjustment system causes the concentration value to fall within the target range. Section 13 is a partial enlarged view of Fig. 12. Solution The initial concentration has a measured refractive index and a reduced potential value as indicated by Fig. 13. When operating, these measured values become values indicated by Ε 2. From the value of Ε2, the controller 丨26 can determine that the concentration of the solution has decreased. The mixer is instructed to supply a higher concentration solution to replenish the lost chemical. Ε3 indicates the refractive index and reduction potential value after the recovery tank replenishment solution has been supplied. It can be seen that the value of Ε3 is substantially equivalent to Ε2 value. The current concentration is substantially the same as the initial concentration or falls within the target concentration range. As above, the relationship between the 'temperature or m parameter change# affects the chemical solution characteristics. Figure 14 shows the temperature change for the conductivity of the SC4 solution. Influencing the example.® contains different concentrations of hydrogen peroxide and ammonium hydroxide: The SC-i solution is measured for conductivity and green is made into a three-dimensional coordinate map. Solution Conductivity 200947171 degrees are measured at two different temperatures, specifically 25 ° C and 50 ° C. It can be seen that the increase in temperature causes an increase in conductivity. In a particular embodiment of the invention, the system includes one or more thermometers for measuring the temperature at different locations in the system. For example, at least one flow monitoring unit is equipped with a thermometer to monitor the temperature upstream and/or downstream of the processing station. Figure 15 shows the comparison of the actual concentration value with the concentration value derived using the model as shown in Fig. 12. This comparison used eight different SC-1 blends. First, the actual concentrations of the chemicals (i.e., ammonium hydroxide and hydrogen peroxide) are plotted. Next, these concentrations were arbitrarily selected to measure the refractive index and the reduction potential value. The measured values are compared to the model as shown in Fig. 12 to derive the concentration values as described above. The estimated concentration values are plotted in Figure 15, as indicated by the "calculation" value points on the graph. It can be seen that the numerical reality derived from the model as shown in Fig. 12 approximates the actual concentration. In this aspect, these results illustrate the accuracy and reproducibility of using the 12th model. Vacuum pump sub-cakes. Figure 16A illustrates a specific example of a vacuum pump sub-system 120 that is suitable for use with the processing system 100. The vacuum pump sub-system 120 includes a pump 907 and a fluid collection unit 909. As shown, the pump is integrated into a processing tool located within the clean room environment 103, which is located outside the clean room 1〇3, such as in a common room where a gas source or power source is placed. In general, the vacuum pumping system 120 operates to collect waste fluids and separate gases from the fluid to assist in waste management. Therefore, the vacuum pump sub-system 120 is coupled to the vacuum chambers 436, 438 (Fig. 4) and the vacuum chamber 8〇2 via the vacuum line 902 (Fig. 8 200947171). Therefore, the vacuum line 902 can respectively consume the vacuum line 444 446 shown in Fig. 4. Although the i6A diagram does not show one or more vacuum lines (such as lines 444, 446 shown in the fourth circle) that can be placed in the vacuum line 902 and/or the vacuum tank, the tank can be selectively vacuumed. As previously described, it is coupled to the output pipeline 21 of the processing station 204. Further, a vacuum gauge 9〇4 is provided in the vacuum line 902 for measuring the pressure of the vacuum line 9〇2. In one embodiment, the active pressure control system 9A8 is disposed on the vacuum line 902. In general, the active pressure control system 9〇8 operates to maintain the vacuum line 902 at a predetermined pressure. Controlling the pressure expectations in this manner ensures that the process performed by each of the processing stations 2G4 (as shown in Figure 4) is controlled. For example, assuming that the process performed by the particular processing station 204 is to maintain a vacuum line 9〇2 pressure of $4 Torr, the active pressure control system 908 can maintain a predetermined pressure under the PID control (collaborative controller 126). In one embodiment, the active pressure control system 9A includes a pressure transducer 910 and a pressure regulator 912 that are in electrical communication with one another. The pressure transducer 910 measures the pressure of the vacuum line 902 and then signals the pressure regulator 912 to cause the pressure regulator 912 to open or close the individual variable orifices based on the difference between the measured pressure and the configured (predetermined) pressure. In one embodiment, the pump 907 is placed downstream of the active pressure control system 908. The pump 907 is used to make the vacuum line 9〇2 a vacuum. In a particular embodiment, the pump 907 is a Venturi vacuum generator. Although the operation of the Venturi vacuum generator is well known, it is briefly described here. It should be understood, however, that the specific examples of the invention are not limited to a particular Venturi vacuum generator operation or structural aspect. In general, the Venturi vacuum generator 9〇7 operates to move the prime mover 62 200947171 fluid (MF) through the narrow tube to increase the velocity of the motive fluid, thereby removing gas and mist. When the velocity of the original current is accelerated to form a pressure drop, a vacuum is generated. The motive fluid for the Venturi vacuum generator 9A can be provided by any suitable source of pressurized gas, such as pressurized dry air (CDA), nitrogen, argon, and helium. Other suitable motive fluids include ammonia, hydrogen peroxide, cleaning and etching chemicals, liquid chemicals, liquid particulate removers, and combinations thereof. A typical processing system makes it easy to find one or more motive fluids. Therefore, one or more motive fluids can be selected as the source of the alternate motive fluid. In one embodiment, the motive fluid is supplied at a pressure of from about 60 pounds per square inch to about 100 pounds per square inch, preferably from about 75 pounds per square inch to about 85 pounds per square inch. The Venturi vacuum generator 907 operates to maintain a pressure in the tank 436 of from about 25 Torr to about 600 Torr, preferably from about 5 Torr to about 450 Torr. In one embodiment, controller 126 is used to control the flow of motive fluid to the Venturi vacuum generator 907 and to regulate the pressure of the Venturi vacuum generator 9〇7 and the motive fluid. Controller 126 is configured to communicate the processing station 2〇4 with the vacuum requirements of pre-processing slot 436. In addition, controller 126 can convert each of the motive fluid sources to meet process requirements. Referring now to Figure 17, there is shown a specific example of a Venturi vacuum generator 9A. The Venturi vacuum generator 907 includes an inlet 981 for introducing a motive fluid to the nozzle 982. Suction inlet 983 connects vacuum line 902 from tank 430 to fluidly connect vacuum line 9〇2 and Venturi vacuum generator 9〇7. The Venturi vacuum generator 907 includes a restriction zone upstream of the nozzle 982. The restricted zone 984 causes the velocity of the motive fluid to increase and the pressure to drop, thereby creating a vacuum in the restricted zone 984. The vacuum draws the fluid from the vacuum line 9〇2 into the Venturi 63 200947171 empty generator 907. The pumped fluid mixes with the motive fluid and is forced to flow through the restriction zone 984. A diffuser 985 having an inner diameter larger than the restriction zone 984 is placed upstream of the restriction zone 984. The diffuser 985 causes the fluid to slow down and increase in pressure before exiting the Venturi vacuum generator 907. The fluid is discharged to the fluid flow line 9 15 of the connection tank 906. ❹ ❹ The Venturi vacuum generator is especially suitable because it is small and can be placed close to the process to provide the required vacuum. Its size and settings provide several advantages in the manufacturing process. First, the location of the Venturi vacuum generator adjacent to the processing station can increase the efficiency of the vacuum generator. In general, the vacuum efficiency decreases as the vacuum path increases. Therefore, the vacuum generator is preferably placed close to the processing station. As shown in Fig. 16A, the 'Ven's vacuum generator 907 is integrated with the processing tool. In this aspect, the vacuum line 902 is from the tank 436 to the Venturi vacuum generator 9〇7 from i 吋 to 4 inches, preferably from 丨英吋 to 2 inches, more preferably 3 inches to I] English. Second, the Venturi vacuum generator can be installed in a limited space available for the manufacture of flooring due to integration into the processing equipment. The Venturi vacuum generator can also be integrated into the tool to provide greater installation efficiency and performance reproducibility for a variety of mounting designs. The first Venturi true generator generally does not have any moving parts, thus reducing maintenance costs. The fourth 'Ven's vacuum generator can be powered by any suitable gas source, which is common to most manufacturing equipment. The Venturi Realizer is easy to operate so that it is effectively bolted between the open and closed positions, and the chemical process saves power. The Venturi vacuum generator generates a vacuum whenever the motive fluid is supplied. Since the Venturi vacuum generator has no running parts and components, it is only opened and closed by controlling the supply of motive fluid. For example, when the value 馍f ^ ^ ^ is sent to the wafer processing station, the chemical process 64 200947171 may be idle. During this interval, the Venturi vacuum generator can be turned off to preserve the motive fluid. The generator can be quickly turned on when the wafer is subsequently placed in position for processing. In one embodiment, the Venturi vacuum pump and its associated valves and lines can be fabricated from very inert polymeric materials. In this aspect, the polymeric material will not corrode or degrade in the wet chemical environment. The polymeric material can be selected from a high purity resin which allows the removal chemical to remain pure and reusable. ❹ Figure 16B is a detailed view of the collecting unit 909 shown in Fig. 16A. The discharge 帮 of the pump 907 is connected to a fluid flow line 915 which terminates in a tank 906. In a specific example, the tank 9〇6 is configured to further separate the liquid and gas fed to the liquid/gas stream. For this purpose, the slot 9〇6 includes an entrance of the jet plate 916 to the slot 906. Once the ejector plate 9〇6 is encountered, the liquid will condense from the turbulent flow due to the blunt force. Again, the tank 906 can be operated at atmospheric pressure to aid in gas condensation. The slot 906 optionally includes a demister 92. The mist eliminator 92 〇 generally includes an array of surfaces that are placed obliquely (e.g., about 9 degrees) relative to the fluid to be flowed through the demister 920. The jet plate and demister surface further promote the condensation of liquid from the gas. The liquid condensed from the incoming stream remains in the liquid storage region 918 in the lower portion of the tank 906, and any residual vapor is removed by the vent line 924. In a specific example, the deaeration baffle 922 is placed below the demister, such as directly below the ejector plate 9f6. The degassing baffle 922 extends across the liquid storage area 918 and forms an opening 92丨 at the end. In this configuration, the degassing baffle 922 allows liquid to enter the liquid storage area 918 via the opening 92i, but prevents the moisture of the liquid from being reintroduced with the incoming liquid/air flow. In a Zhao example, the flow contained in the tank 906 is exchanged by heat to maintain a predetermined fluid temperature of 65 200947171. For example, in one embodiment, the fluid is maintained below 10 °C. For this purpose, vacuum pump sub-system 120 optionally includes a cooling circuit 950. A pump 937 (e.g., a centrifugal pump) provides mechanical power to cause fluid to flow through the cooling circuit 950. Cooling circuit 950 includes an outlet line 936 and a pair of return lines 962, 964. The first return line 962 is fluidly coupled to the inlet of the outlet line 936 and the heat exchanger 954. The second return line 964 is coupled to the outlet of the heat exchanger 954 and terminates in a tank 906 where the cooling fluid is distributed to the liquid storage area 918 of the tank 906. For example, valve 960 is provided in second return line 964 to separate cooling circuit 950 and tank 906. Thus, the temperature control fluid causes some vapor/moisture to condense from the incoming fluid. In one embodiment, heat exchanger 954 is in fluid communication with onboard cooling system 952. In a particular embodiment, the onboard cooling system 952 is a dichlorodifluoromethane based cooling system that allows dihalogenated difluoromethane to flow through the heat exchanger 954. As used herein, "onboard" means that the cooling system 952 is substantially integrated with the heat exchanger 954. In another embodiment, the cooling system 95 2 is an "outboard" component, such as a separate chiller. In operation, the fluid of the tank 906 can circulate through the cooling circuit 950 continuously or periodically from the tank 906. As the fluid flows through heat exchanger 954, the fluid passes through cooling and return tank 906. The heat exchange effect (i.e., the temperature brought into the sealing fluid) caused by the heat exchanger 954 can be controlled by operating the cooling system 952. For this purpose, the temperature sensor 953 is provided with fluid contained in the liquid storage area 918 of the communication groove 906. The measured values obtained by the temperature sensor 953 are supplied to the controller 126. Controller 126 then sends appropriate control signals to cooling system 952 to cause cooling system 952 to adjust the temperature of the di-dioxane (or other body using cooling stream 66 200947171). It will also be appreciated that the portion of the fluid within the liquid storage region 918 is cooled by heat exchange with the environment surrounding the tank 906. As such, the fluid can be maintained at a predetermined temperature.

In one embodiment, the cooling fluid from the cooling circuit 95A is selectively injected into the vacuum line 9〇2 upstream of the Venturi vacuum generator 907. Therefore, vacuum pump sub-system 120 includes a feed line 957 that branches from second return line 964. A valve 956 is provided in the feed line 957 to thereby fluidly connect or separate the cooling circuit 950 and the vacuum line 9〇h. Although the valve 956 is still open, part of the cooling fluid will flow from the cooling circuit 95 through the feed line 957 into the vacuum line 9〇2 . Therefore, the cooling seal flow passes through the vacuum line 9 () 2 to the Venturi vacuum generator 907 to enter the gas/liquid flow. Thus, a relatively low temperature cooling stream urges some of the vapor/moisture to self-enter the gas/liquid stream before entering the pump 907. This additional cooling step is particularly beneficial for processes that exotherm and exit the tank at a high temperature of 4%. In one embodiment, the temperature at which the incoming stream (from the vacuum tank through the vacuum line 9〇2) is between about 1 and about 1 (the cooling seal fluid temperature is between about 5 ° C and about 10 °). In a specific example, the vacuum system 12 is configured to monitor one or more constituent concentrations of the fluid within the liquid tank. Monitoring the chemical rolling can, for example, protect any components of the pump 907 (eg, Other components of the metal) and/or vacuum pump sub-system 12. For this purpose, the system 120 shown in Figure (10) includes the active chemical concentration control system placed in the cooling circuit 950. In this illustrative example, The concentration control system 940 includes a chemical monitor 942 that electrically communicates with the pneumatic valve 944, such as a two-way link state. It should be appreciated that the pneumatic Μ 944 may not be in direct communication with each other but through the 67 200947171 controller 126. The chemical monitor 942 checks the concentration of one or more constituents of the fluid flowing through the outlet line 936. If it exceeds the configuration point of the chemical monitor 942, the chemical monitor 942 (or the controller 126 responds to the chemical monitor) The signal of 942 sends a signal to the pneumatic valve 944, whereby the pneumatic valve 944 opens the communication discharge line 938 to allow at least a portion of the fluid to drain. In this illustrative embodiment, the check valve 939 is disposed in the discharge line 938 to prevent fluid backflow ( Backflow) » Additionally, a back pressure regulator 946 is provided at the discharge line 938 or upstream of the discharge line. The back pressure regulator 946 ensures that the cooling circuit 95 is maintained at a sufficient pressure to allow fluid to continue to flow through the cooling circuit 95. In an example, the trough 906 is selectively fluidly coupled to one of a plurality of different excretions. Then, depending on the composition (ie, composition or concentration) of the collected fluid, a particular one of the plurality of excretions is selected. For example, in the case of a collection fluid containing a solvent, collection The fluid can be directed to the first drain; in the case of a non-solvent, the collector fluid can be directed to the second drain. In at least one aspect, this embodiment is used to avoid deposit buildup in a particular drain line, such as solvent and non-solvent being drained by the same This may occur during processing. The monitoring system can be used to independently dispense chemical solutions, such as HF, NH3, HC1 or ΙΡΑβ chemical solutions. The different drainage enthalpies are directed (or some of the solution composition can be directed to different drainages). In one embodiment, this is achieved by using a sound velocity sensor to measure the change in solution density in the tank 9〇6. And more generally, whenever the system 12 is in operation) 'Set the active level control system 928 to maintain sufficient fluid level in the tank 9〇 6. In one embodiment, the active level control system 928 includes A pneumatic valve 93〇 and a plurality of fluid level sensors 68 200947171 are provided in the input line 926. The fluid level sensor includes, for example, a high level fluid sensor 934! and a low level fluid sensor 93h. . Pneumatic valve 930 and a plurality of fluid level sensors 934u are in electrical communication with one another via controller 126, as indicated by dashed connection path 932. In operation, the fluid level in tank 906 is sufficiently lowered to travel through low fluid level sensor 93h. In response, controller 126 issues a control signal to cause pneumatic valve 930 to open and allow communication of first fluid source 970 (e.g., a source of deionized water (DIW)) and tank 906 via inlet line 926. Once the flow in the tank 906 returns to the level between the high and low level sensors 934z, the pneumatic valve 930 is closed. In addition to maintaining sufficient fluid level in the tank 906, the active level control system also begins to perform a discharge cycle in response to the signal from the same level sensor 93. In other words, in the event that the fluid level in tank 9〇6 rises sufficiently through the high fluid level sensor, the detector then signals to controller 126. Controller 126 signals that pneumatic valve 944 is open and fluid is allowed to flow to discharge line 938. In addition, it is conceivable that #906 is coupled to any amount of fluid or additive. For example, in one embodiment, the tank 9〇6 engages the neutralizer source. The neutralizing agent can be used to neutralize the various components of the feed stream from the vacuum tank through the vacuum tube 902. In a particular embodiment, the neutralizing agent is an acid or a base and is capable of neutralizing the acid or acid, respectively. The neutralizer of the neutralizer source μ can be selectively introduced to the trough state by 胄 974 _ 972 and the inlet, 926, _. One or two sources 97〇, 972 can be configured to be placed in communication slots. The 18th edge of the vacuum pumping system 12 〇 another Zhao gong pu 系统 system 12 〇 including the pump * South 987 and the fluid collection unit 989. The pump 987 and the fluid collection unit 989 are disposed outside the clean room 103 as shown in Fig. 69 200947171. For example, 'Junpu 987 is located in the common room under the clean room 1〇3. In a specific example, the pump 987 is a Venturi vacuum generator, and its configuration is similar to that of the 17th. The pump 987 is connected to the slot 436 via a vacuum line 902. In one example, vacuum line 902 has a length of from about 15 inches to about 35 inches. A vacuum can be created by supplying a motive fluid such as compressed dry air (CDA) to a Venturi vacuum generator 987. The fluid discharged from the pump 987 is introduced into the atmospheric tank 906 to be separated. The separation gas is released via the exhaust unit 991, and the collected liquid is discharged via the outlet 992. In another embodiment, one or two of the separated gases and liquids are recovered for storage, or recycled back to the blender 108 or other suitable input line in the processing system, as shown in the specific example of Figure 16B above. Fig. 19 shows another specific example of the vacuum pumping system 丨2〇. The vacuum pump sub-system 120 includes a Venturi vacuum generator 丨〇〇7 and a rogue collection unit 1010. As shown, the pump 1007 and the fluid collection unit 1〇1 are disposed outside the clean room 103. In this embodiment, the motive fluid is a liquid, such as water. The water is supplied to the Venturi vacuum generator 1007 to form a vacuum, thereby drawing the fluid of the vacuum line 1002, which is coupled to the tank 436. The fluid in the generator directs the collection unit 1010 where it separates the liquid and gas. The separation gas is released via the exhaust unit 1012. The separated liquid is discharged through the outlet line 1〇14. In one embodiment, the frequency of discharge depends on the liquid level 1 〇丨. Centrifugal pump 1016 can be configured to increase the pressure of liquid flowing through outlet line 1〇14. At least a portion of the liquid directing recirculation line 1018 acts as a motive fluid to operate the Venturi vacuum generator 1007. A valve 1020 disposed downstream of the outlet line 1〇14 and the recirculation line 1〇18 is operated to discharge liquid. 200947171 The specifics of the chemical management system are described here. The specific examples disclosed are merely illustrative, and those skilled in the art will be able to understand other examples within the scope of the invention. For example, some of the foregoing specific examples suggest that the blender 1 8 can be provided in a machine specific example of the processing tool, and the machine 1 8 can be omitted altogether. That is, special special solutions can be formulated to use concentrations without blending. In this example, the source tank of the special solution can be coupled to the input flow control subsystem 112 (as shown in the figure). Preferred processes and apparatus for practicing the invention have been described above. Many modifications and refinements of the above specific examples will be readily apparent to those skilled in the art without departing from the scope of the invention. The foregoing is merely illustrative, and other specific embodiments of the integrated process and apparatus may be employed without departing from the scope of the invention. The scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS [0010] In order to better understand the nature and purpose of the present invention, reference should be made to the detailed description of the same or similar elements in the drawings. A diagram of a processing system invented by a specific example, showing an onboard component. Figure 2 is a diagram of a processing system in accordance with another embodiment of the present invention, showing the onboard and external components. Figure 3 is a diagram of a semiconductor fabrication system in accordance with an embodiment of the present invention. Figure 0 71 200947171 Figure 4 is a diagram of a processing system in accordance with an embodiment of the present invention. Figure 5 is a schematic illustration of one exemplary embodiment of a semiconductor wafer cleaning system' including a cleaning bath connected to a point-of-use control blender system that prepares and delivers cleaning fluid to a cleaning bath during a cleaning process. Fig. 6 is a schematic view of the process control blender system of Fig. 5 for illustrating a specific example. Figure 7 is a diagram of a processing system in accordance with an embodiment of the present invention with an external load blender.

Figure 8A is a diagram of a processing system in accordance with an embodiment of the present invention with a recycling system. Figure 8B is a diagram of a processing system in accordance with an embodiment of the present invention with a recycling system. Figure 8C is a diagram of a processing system in accordance with an embodiment of the present invention with a recycling system. Figure 9 is a diagram showing another specific example of the recycling system.

Figure 10 is a diagram showing one specific example of a dual chemical recovery system. Figure 11 is a graph showing the relationship between the concentration and conductivity of the HF solution (IV). Figure 12 is a graph showing the dissolved potential values of sc-1 at different concentrations. & Refractive Index and Reduction Adjustment Solution Reading Fig. U is a partially enlarged view of Fig. 12, an example of the continuation thereof. μ Fig. 14 is a graph showing the effect of temperature on conductivity. Fig. 15 is a graph showing the comparison of the actual Han value with the concentration value obtained by the exemplary method according to the present invention - the spear 72 200947171. Figure 16A is a diagram of a vacuum pump system in accordance with an embodiment of the present invention. Figure 16B is a detailed view of one specific example of a collection unit in a vacuum pump system. Figure 17 shows a specific example of a Venturi vacuum pump. Figure 18 is a diagram showing another specific example of the vacuum pump sub-system. Figure 19 is a diagram showing another specific example of the vacuum pump sub-system.

[Main component symbol description] 100 Processing system 102 Processing chamber 102 A Clean room 102B Processing room / Multi-station room / Clean room 103 Chemical management system / Clean room environment / Clean room 104 Input subsystem 106 Output subsystem 108 Combine/Mixer Unit 110 Vaporizer 112 Input Flow Control System 1 14 Input Line 116 Output Flow Control System 117 Fluid Line 118 Vacuum Tank System 120 Vacuum Pump Sub System 73 200947171 122 Output Line 124 Single Processing Station 126 Controller 128 Control Signal 130 Input Signal 200 Processing System 204 Processing Station/Room 206 Input Line Group 208 Drain 210 Output Line Set/Output Line 300 Processing System 302 Front End Section 304 Transfer Room 306 Transfer Robot 308 Cleaning Module 310 Cleaning Module 312 Processing Tool 400 Processing System 402 Input 404 Supply Line 406 Chemical Monitor / Concentration Monitor 408 Flow Control Unit 410 Supply Line Usage Point / Use Line 412 Supply Line Use Point / Use Line

74 200947171 ❹ 414 414 Supply Line Usage Point / Use Line 416 Container 418 Container 420 Gas Inlet 421 Level Sensor 422 Inlet 423 Level Sensor 424 Concentration Monitoring System 426 Concentration Monitoring System 428 Flow Control Device 430 Flow Control Device 432 Fluid management device 434 fluid management device 436 tank 437 liquid level sensor 438 tank 439 liquid level sensor 440 pressurized gas 442 pressurized gas 444 vacuum line 446 vacuum line 448 recovery line 452 drain line 500 blender system 75 200947171 502 Tank 506 Supply Line 508 Supply Line 510 Supply Line 512 Flow Line 514 Flow Line 516 Overflow Line 518 Drain Line 520 Valve/Drain Valve 522 Flow Line/Drain Line 524 Pump 526 Recirculation Line/Flow Line 528 Concentration Monitoring Unit 530 Flow line 532 Three-way valve 534 Drain line 536 Dotted line 602 Check valve 604 Check valve 606 Check valve 608 Electronic valve 610 Electronic valve 612 Electronic valve 614 Electronic three-way valve 76 200947171

616 Electronic three-way wide 618 Pressure regulator 620 Branch line 621 Flow control valve 622 Branch line 624 Branch line 626 NH4OH flow line 628 Flow control valve 630 Static mixer 632 Concentration sensor 634 Flow line 636 H2〇2 Flow line 638 Flow Control valve 640 Static mixer 642 Flow line 644 Concentration sensor 646 Pressure regulator 648 Three-way valve 650 Drain line 652 Flow line 654 Electronic valve 700 Centered blender system 702 Filling station 704 Flow line 77 200947171 706 708 710 712 714 716 717 719 720 721 722 724 726 800A 800B 800C 802 804 806 808 810 812 814 818 Flow Control Unit Processing Tool Flow Control Unit Filter Filling Loop / Flow Line Segment Container Flow Level Sensor Pressurized Gas Input Valve Exhaust Hole/Gas Input Container Filling Circuit Valve Recycling System Recovery System Recovery System Tank Recycling Line Pump Pneumatic Valve Filter Flow Management Device/Upstream Device Flow Management Device/Downstream Device Concentration Monitor 78 200947171 ❹ 828 828 Shot Plate 830 Mist Eliminator 832 liquid storage Release zone 834 Degassing baffle 836 Opening 902 Vacuum line 904 Vacuum gauge 906 Slot 907 Pump / Venturi vacuum generator 908 Pressure control system 909 Fluid collection unit 910 Pressure transmitter / pressure transducer 912 Pressure regulator 915 Fluid flow line 916 Punch plate 918 Liquid storage area 920 Mist 921 Opening 922 Degassing baffle 924 Exhaust line 926 Input line / Inlet line 928 Level control system 930 Pneumatic valve 932 Dotted communication path 79 200947171 934 Fluid level sensing 936 outlet line 937 pump 938 drain line 939 check valve 940 concentration control system 942 chemical monitor 944 pneumatic valve 945 bidirectional communication path 946 back pressure regulator 950 cooling circuit 952 cooling system 953 temperature sensor 954 heat exchanger 956 Valve 957 Feed Line 960 Valve 962 Return Line 964 Return Line 970 First Fluid Source 972 Neutralizer Source 974 Valve 981 Inlet 982 Nozzle 80 200947171

983 Suction inlet 984 Restricted area 985 Diffuser 987 Pump / Venturi vacuum generator 989 Fluid collection unit 991 Exhaust 992 Outlet 1002 Vacuum line 1007 Venturi vacuum generator / pump 1010 Fluid collection unit 1011 Liquid level 1012 Exhaust 1014 Outlet Line 1016 Centrifugal Pump 1018 Recirculation Line 1020 Valve 1100 Recovery System 1102 Recovery Tank 1104 Treatment Station 1105 Container Member 1106 Supply Line / Inlet / HF Inlet Line 1108 Supply Line / Inlet / DIW Inlet Line 1110 Flow Line 1112 Flow Line 81 200947171 1117 Pump 1118 Outlet Line 1120 Valve 1121 Valve 1122 Flow Line 1128 Fluid Monitoring Unit 1132 Three Directions Wide 1141 Mixer 1 142 Mixer 1150 Distribution System 1151 Containing Tank 1152 Containing Tank 1155, FI Filter 1160 Recirculation Line / Flow line 1161 Drain valve 1165 Process inlet line 1170 Recovery line 1171 Drain valve 1181, Ml Fluid monitoring unit 1182, M2 Fluid monitoring unit 1200 Processing system 1202 Recovery tank 1204 Processing station 1205 processing station

82 200947171

1206 Chemical Inlet 1208 Blender/Mixer Unit 1211 Blending System 1212 Refueling System 1231A Chemical Room 1231B Chemical Room 1232A Chemical Room 1232B Chemical Room 1238 Drain Line 1250 Distribution System 1260 Recirculation Line 1270 Recovery Line 1281 First Monitoring Unit 1282 second monitoring unit 1291 first monitoring unit / fluid monitoring unit 1292 second monitoring unit / fluid monitoring unit MF motive fluid 83

Claims (1)

200947171 X. Patent Application Range: 1 'A method for controlling the fluid of a treatment system, comprising: mixing two or more chemical compounds in a hand-held machine to supply the solution to the recovery tank; distributing the solution to the treatment station Determining whether a chemical compound reaches a predetermined concentration as far as the solution is detected between the recovery tank and the treatment station; once at least the solution is determined to flow the solution to the treatment station; a chemical compound is removed from the treatment station at a predetermined concentration a portion of the solution; The solution removal portion is refluxed to the recovery tank; the solution removal portion is monitored at a position between the treatment station and the recovery tank to determine whether at least one chemical compound in the solution removal portion reaches a predetermined concentration of the dendrite removal portion At least a predetermined concentration of the chemical compound is passed to the treatment station. 2. The method of claim </RTI> wherein the at least a portion of the solution removal portion and the remaining portion of the solution removal portion are discharged once it is determined that the at least one chemical compound in the removal portion of the solution does not reach the predetermined concentration Part of the flow to the recovery tank. 3. The method of claim 2, wherein the step of adjusting the concentration of the solution from the blender to the recovery tank until the concentration of the solution between the recovery tank and the treatment station reaches a predetermined concentration. 4. The method of claim </ RTI> wherein the concentration of the solution from the blender to the recovery tank is increased once it is determined that the solution 84 200947171 removes the ++ of the at least one chemical compound from the predetermined concentration. The concentration of the solution between the recovery tank and the treatment station reaches a predetermined concentration. The method of claim 1, wherein the dispensing the solution to the treatment comprises arranging/combining the liquid to the at least one holding tank and dispensing the solution from the holding tank to the processing station. 6. The method of claim 5, wherein the solution is dispensed into two holding tanks. ❹ 7. The method of claim 6, wherein the two holding tanks alternately fill the solution and dispense the solution to the processing station. 8. The method of claim 5, wherein the solution is monitored at a location between the at least one containment tank and the processing station. 9. The method of claim 5, wherein a portion of the solution dispensed from the at least one holding tank is recycled back to the recovery tank. The method of claim 1, wherein monitoring the solution removal portion comprises measuring at least one characteristic of the solution. 11. The method of claim 10, wherein the at least one characteristic is selected from the group consisting of conductivity, refractive index, redox power &amp; infrared, ultraviolet, pH, and combinations thereof. 12. The method of claim 1, further comprising determining the concentration as a function of the measured characteristic. The method comprises: a solution mixed with a fluid from a recovery line from a recovery line 13. a control treatment system is mixed in a recovery tank; 85 200947171 distributing the mixed solution to a treatment station; between the recovery tank and the treatment station Measuring the mixed solubility to determine the concentration of a chemical compound in the mixed solution; determining whether the concentration of the chemical compound falls within a predetermined target concentration. Once the chemical compound in the mixed solution is determined to reach the target, The mixed solution flows to the processing station, and at least a portion of the mixed helium is removed from the processing station via the recovery line to measure the characteristics of the removed portion of the mixed solution to determine the characteristic of a chemical compound in the mixed portion of the mixed solution. It is determined whether the concentration of the chemical compound falls: and 'and within the standard concentration of 孭疋a; once the chemical compound degree in the portion of the solution is determined, the solution removal portion flows to the recovery tank. The target concentration is as follows: 14. The method of claim 2, wherein the at least one chemical compound in the solution removal portion: if the concentration is determined, the at least a portion of the mixed solution is discharged: The remaining portion of the liquid removal portion flows to the recovery tank. The knives will be mixed and dissolved. 15. The method of claim 14 is to increase the concentration of the solution from the supply line until the recovery tank and the step contain the concentration of the enhanced solution to a predetermined target concentration. Mixing between stations 16. The method of claim 13 wherein eight to the treatment station comprises dispensing the mixed solution to at least one mixed solution containing the mixed solution solution of the nanogas tank to the treatment station. And distribution 17. As in the method of claim 16, the portion of the mixed solution dispensed from at least one of the 86,470,171 holding tanks is recycled back to the recovery, as in claim 13 of the patent application. From the group consisting of conductivity, fold (4), redox potential, infrared, and the combination of the strains and combinations thereof. , ultraviolet light, pH 19 · A system comprising: a solution for manufacturing a solution; and a chemical blending machine for mixing chemical compound recovery tanks for mixing a recovery solution from a chemical blending mechanism station; ---W sleeve; a first chemical monitor configured to monitor the mixing (10) from the distribution = and to at least a chemical compound up to a predetermined concentration controller configured to determine the mixed solution At least learning the compound to reach a predetermined concentration of the mixed solution determined by the first-chemical monitor to the processing station; A, a recovery line, fluidly connecting the outlet of the processing station and arranging the recovery tank to move at least a portion of the treatment chamber after use The mixed solution is recovered and returned to the recovery tank; and the second chemical monitor 'configured to monitor the mixed Q / night recovery portion' to determine whether at least one of the chemical compounds in the recovery portion is ready before entering the recovery tank concentration. 20. The system of claim 19, wherein the first beta and the second monitor are the same. 21. The system of claim 19, wherein the beta spear 1 and the second 87 2009 47171 monitor The (four) amount of the mixed solution (four) material is configured to be free conductivity, refractive index, oxidation, and wherein the characteristic is selected from the group consisting of pH and a combination thereof. Infrared, ultraviolet, 22. For example, in the scope of claim 19, two holding tanks, 苴,, 'where the dispensing system packs 1 back to the trough, which is configured to take the solution to the treatment station ^ Λ α / combined liquid And dispensing the mixture 23. The scope of the invention includes: a system in which the chemical is blended with ❹ (a) at least one input, each round of A pulls; 'receives the respective chemical compound to produce a solution ( b) at least one mixing station for mixing the liquid; and (c) a first concentration monitor located downstream of at least _ mixing stations. 24. If the scope of application for patents is the scope of Article I; the 环 营 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The dispensing system and the recovery tank are in fluid connection. 25. The system of the invention, in the scope of the patent item, &amp; π a system, wherein once the mixed ' '&gt; portion is determined, the at least one chemical 彳 1 person &amp; The $1^# σ 芊 compound reaches the predetermined/operator determined by the second chemical sputum monitor configured to cause the mixed solution recovery portion to flow to the recovery tank. 26. The system of claim 4, wherein the controller is configured to raise the concentration of the solution in the chemical blender until the at least one chemical compound in the mixed talc reaches a predetermined concentration . 27. The system of claim 19, further comprising a second 88 200947171 processing station in fluid communication with the dispensing system to receive the mixed solution and in fluid communication with the recovery line to at least a portion of The mixed solution is refluxed to the recovery tank. 28. The system of claim 19, wherein the processing station comprises at least two chambers and the mixed solution is dispensed to one of the at least two chambers. 29. The system of claim 28, further comprising a second recovery tank for dispensing the second mixed solution to a different one of the at least two chambers. XI. Schema: as the next page ❿ 89