TW202031375A - Cooling system and cooling method - Google Patents

Abstract

A system is disclosed herein. The system includes a tank, a tube, a cooler, and a concentration meter. The tank is configured to contain first liquid. The tube is coupled to the tank and configured to convey the first liquid from the tank. The cooler covers the tube to cool the first liquid conveyed by the tube. The concentration meter is configured to measure a concentration of the first liquid cooled by the cooler.

Description

System and method of operation

Due to manufacturing requirements, the residue of semiconductors in each manufacturing process should be removed. However, there are not enough ways to remove semiconductor residues. Therefore, adequate and accurate removal of semiconductor residues has become a key issue in the field of semiconductor technology.

100‧‧‧Cleaning device

110‧‧‧Tank

112‧‧‧Inner storage tank

114、116‧‧‧External storage tank

120、170‧‧‧Pipe

121, 123, 125, 127, 129‧‧‧valve

130‧‧‧Pump

140‧‧‧Heater

150‧‧‧Filter

160‧‧‧Oscillator

200‧‧‧Concentration measuring device

210‧‧‧Tube

220‧‧‧Cooler

221‧‧‧Fan

222、223‧‧‧Spiral hose

224、250‧‧‧Pump

226‧‧‧Condenser

228‧‧‧Shell

230‧‧‧Concentration meter

240‧‧‧Fan

260‧‧‧Processor

310~380‧‧‧Operation

500‧‧‧Liquid

600‧‧‧Semiconductor device

602‧‧‧Semiconductor substrate

604‧‧‧patterned mask

702‧‧‧Groove

704‧‧‧Fin

706‧‧‧Dielectric layer

N1、N2‧‧‧node

When read in conjunction with the accompanying drawings, the aspect of the present disclosure will be best understood from the following detailed description. It should be noted that according to standard practice in the industry, the various features are not drawn to scale. In fact, for the purpose of clarity, the size of each feature can be increased or decreased arbitrarily.

Figure 1 is a schematic diagram of a system according to various embodiments of the present disclosure;

Figure 2 is a flowchart illustrating the method of operating the system in Figure 1 according to various embodiments of the present disclosure;

Figure 3 is a schematic diagram of the cooler of the system shown in Figure 1 in various embodiments of the present disclosure;

Figure 4 is a schematic diagram of the cooler of the system shown in Figure 1 according to various embodiments of the present disclosure;

Figure 5 is a schematic diagram of the cooler of the system shown in Figure 1 according to various embodiments of the present disclosure;

Figure 6 is a schematic diagram of a system according to various embodiments of the present disclosure;

Figure 7 is a schematic diagram of a system according to various embodiments of the present disclosure;

Fig. 8 is a schematic diagram of a system according to various embodiments of the present disclosure;

Figure 9 is a schematic diagram of the cooler of the system shown in Figure 8 according to various embodiments of the present disclosure;

FIG. 10 is a cross-sectional view of the semiconductor device shown in FIG. 1 in various embodiments according to the present disclosure;

FIG. 11 is a cross-sectional view of the semiconductor device shown in FIG. 1 in various embodiments according to the present disclosure;

FIG. 12 is a cross-sectional view of the semiconductor device shown in FIG. 1 in various embodiments according to the present disclosure.

The following disclosure provides many different embodiments or examples in order to implement different features of the provided subject matter. Specific examples of elements and arrangements are described below to simplify the present disclosure. Of course, these are only examples and are not intended to be limiting. For example, in the following description, forming the first feature above or on the second feature may include an embodiment in which the first feature and the second feature are formed in direct contact; and may also be included between the first feature and the second feature An additional feature is formed so that the first feature and the second feature may not directly contact the embodiment. In addition, the present disclosure may repeat element symbols and/or letters in various examples. This duplicate For the sake of simplicity and clarity and does not indicate the relationship between the various embodiments and/or configurations discussed.

The terms used in this specification generally have their ordinary meaning in the art and in the specific context in which each term is used. The examples used in this specification (including examples of any terms discussed herein) are only illustrative, and do not limit the scope and meaning of this disclosure or any exemplary terms in any way. Likewise, the present disclosure is not limited to the various embodiments given in this specification.

Although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish between elements. For example, without departing from the scope of the embodiment, the first element may be referred to as the second element, and similarly, the second element may be referred to as the first element. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed terms.

The terms "comprise", "comprising", "include", "including", "has", "having", etc. used in this manual Equal is open-ended and means "including but not limited to."

Now refer to Figure 1. Figure 1 is a schematic diagram of a system according to various embodiments of the present disclosure.

As illustrated in Figure 1, the system includes a cleaning device 100 and a concentration measuring device 200. The cleaning device 100 includes a tank 110, a pipe 120, a pump 130, a heater 140, a filter 150, and an oscillator 160. another In one aspect, the concentration measuring device 200 includes a duct 210, a cooler 220, a concentration meter 230, a fan 240, a pump 250, and a processor 260.

In some embodiments, reference is now made to the cleaning device 100. The pipe 120 is coupled to the storage tank 110. Two terminals of the pump 130 are respectively coupled to the pipe 120. Explained in another way, the pipe 120 extends through the pump 130. Two terminals of the heater 140 are respectively coupled to the pipe 120. Explained in another way, the duct 120 extends through the heater 140. Two terminals of the filter 150 are respectively coupled to the pipe 120. Explained in another way, the pipe 120 extends through the filter 150.

In various embodiments, reference is now made to the concentration measuring device 200. The pipe 210 is coupled to the pipe 120 of the cleaning device 100. The cooler 220 covers the duct 210. The concentration meter 230 is coupled to the catheter 210. The processor 260 is coupled to the concentration meter 230, the fan 240, and the pump 250. The pump 250 is coupled to the catheter 210.

The above discussion only describes exemplary connections that can be made in accordance with various alternative embodiments. It will be understood that such various alternative embodiments are not limited to the specific connections described above or those shown in Figure 1.

Refer now to Figure 2. FIG. 2 is a flowchart of a method 300 for operating the system in FIG. 1 according to various embodiments of the present disclosure.

As illustrated in FIG. 2, in operation 310, the storage tank 110 is used to contain the liquid 500. The liquid 500 is used to remove residues of the semiconductor device 600 generated by the manufacturing process. In some embodiments, for example, the liquid 500 is an etching residue remover, a positive photoresist stripper, or any suitable liquid for removing residues generated during the manufacturing process. In various embodiments, for example, the manufacturing process is a deposition process, a photoresist coating process, an etching process, a patterning process, a removal process, or other processes for manufacturing a semiconductor device.

In operation 320, the liquid 500 is moved to circulate in the pipe 120 and the storage tank 110. In some embodiments, the storage tank 110 includes an inner storage tank 112 and an outer storage tank 114. The inner tank 112 is used to contain the liquid 500 inside. If the semiconductor device 600 is immersed in the liquid 500 and the inner tank 112 overflows, the overflowed liquid 500 is further contained in the outer tank 114. In various embodiments, the circulation of the liquid 500 starts from the outer tank 114, the valve 121 is opened to allow the liquid 500 in the outer tank 114 to flow through the valve to the pipe 120, and then the valve 123 is opened to let the liquid in the inner tank 112 500 flows through this valve to the pipe 120. Then, the liquid 500 flows through the valves 121 and 123 to the pump 130, and the pump 130 moves the liquid 500 in the pipe 120. In some embodiments, for example, the pump 130 is a lift pump, a displacement pump, a gravity pump, or any suitable device used to move the liquid 500 in the pipeline 120 by mechanical action.

If the liquid 500 in the storage tank 112 is insufficient and the temperature is not higher than the predetermined temperature, the valve 125 is closed and the valve 127 is opened to allow the liquid 500 to flow through the valve to the pipe 120. Next, the liquid 500 flows through the heater 140 and is heated by this heater. If the liquid 500 in the storage tank 112 is insufficient and the temperature is not higher than the predetermined temperature, the liquid 500 passes through the valve 129 from the side to the inner storage tank 112. In some embodiments, when the liquid 500 in the storage tank 112 is insufficient and the temperature is not higher than the predetermined temperature, the pressure of the pipe 120 and the thickness of the liquid 500 are both too high. Under such conditions, the liquid 500 cannot flow through the filter 150, or the filter 150 will be damaged due to the high pressure in the pipe 120 or the high thickness of the liquid 500. In various embodiments, for example, the valves 121, 123, 125, 127, 129 are hydraulic valves, pneumatic valves, or any suitable valves used to control the flow of liquid 500 through these valves. In some embodiments, for example, the heater 140 It is an electric heater, heating lamp, heating jacket, or any suitable device for heating the liquid 500.

When the liquid 500 in the storage tank 112 is sufficient and the temperature is higher than a predetermined temperature, the residue of the semiconductor device 600 can be removed by the cleaning device 100. After removing the residue of the semiconductor device 600, particles are present in the liquid 500. The filter 150 is used to filter particles in the liquid 500. Under this condition, the circulation of the liquid 500 starts from the outer tank 114, the valve 121 is opened to allow the liquid 500 in the outer tank 114 to flow through the valve to the pipe 120, and then the valve 123 is opened to let the liquid in the inner tank 112 500 flows through this valve to the pipe 120. Then, the liquid 500 flows through the valves 121 and 123 to the pump 130, and the pump 130 moves the liquid 500 in the pipe 120. Next, valve 125 is opened and valve 127 is closed to allow liquid 500 to flow through valve 125 to filter 150. The filter 150 filters particles in the liquid 500 and supplies the liquid 500 without particles to the inner tank 112. In some embodiments, the capacity of the storage tank 110 is in the range of 70 liters to 120 liters. If the capacity of the storage tank 110 is too high, it will be difficult to cool the liquid 500 in the storage tank 110. On the other hand, if the capacity of the storage tank 110 is too low, it is difficult to use enough liquid 500 to remove the residue of the semiconductor device 600 so that the capacity of the storage tank 110 is within a predetermined range.

In operation 330, the catheter 210 is used to retrieve and deliver the liquid 500 from the pipe 120. As illustrated in FIG. 1, the conduit 210 retrieves the liquid 500 from the node N1 of the pipe 120. However, in various embodiments, the conduit 210 may retrieve the liquid 500 from the node N2 of the pipe 120 or any suitable part of the pipe 120 depending on actual needs. In some embodiments, the diameter of the pipe 120 It is in the range of 3 cm to 10 cm. In various embodiments, for example, the diameter of the pipe 120 is 10 cm. If the diameter of the pipe 120 is too high, it is difficult for the pump 250 to move the liquid 500 inside the pipe 120. On the other hand, if the diameter of the pipe 120 is too low, it is difficult for the liquid 500 to circulate and move inside the pipe 120 and the storage tank, so that the diameter of the pipe 120 is within a predetermined range. In some embodiments, the diameter of the catheter is in the range of 5 mm to 1 cm. In various embodiments, for example, the diameter of the catheter 210 is 5 mm. The pipe 210 is used for sampling, and the diameter of the pipe 210 may be smaller than the diameter of the pipe 120. The flow rate of the liquid 500 in the duct 210 is inversely proportional to the cross section of the duct 210. Therefore, if the diameter of the pipe 210 is less than 5 mm, the flow rate of the liquid 500 in the pipe 210 will be too fast. When the flow rate of the liquid 500 in the conduit 210 is too fast, the medicine does not have enough time to mix with the liquid 500, so that the concentration of the liquid 500 will be lower than the actual concentration, and the measurement result of the concentration meter 230 is not accurate. Conversely, if the diameter of the pipe 210 is greater than 1 cm, the flow rate of the liquid 500 in the pipe 210 will be too low. When the flow rate of the liquid 500 in the conduit 210 is too low, the concentration meter 230 cannot measure the concentration of the liquid 500.

In operation 340, the cooler 220 is used to cool the liquid 500 delivered by the conduit 210. As illustrated in FIG. 1, the cooler 220 covers the duct 210 in order to effectively cool the liquid 500 delivered by the duct 210. In some embodiments, for example, the cooler 220 is a water cooling device. In order to facilitate the understanding of the structure of the cooler 220, refer now to FIG. 3. FIG. 3 is a schematic diagram of the cooler 220 of the system shown in FIG. 1 according to various embodiments of the present disclosure.

As illustrated in FIG. 3, the cooler 220 includes a spiral hose 222, and the spiral hose 222 is disposed around the duct 210. In some embodiments, the spiral hose 222 is arranged around and in contact with the conduit 210 to facilitate the cooler 220 to cool the liquid 500 delivered by the conduit 210. In various embodiments, for example, the spiral hose 222 is a polyurethane (PU) tube, a polyvinyl chloride (PVC) tube, or any suitable type of tube. In some embodiments, for example, the liquid system in the spiral hose 222 is used to circulate deionized water, condensate, or any suitable liquid in the spiral hose 222 to cool the liquid 500 delivered by the conduit 210.

As illustrated in FIG. 3, the cooler 220 includes a pump 224 coupled to the spiral hose 222, and the pump 224 is used to move the liquid in the spiral hose 222. In various embodiments, the pump 224 is arranged adjacent to the node N1 as shown in FIG. 1. In some embodiments, for example, the pump 224 is a submersible pump, an onshore pump, or any suitable pump for moving the liquid in the spiral hose 222. As illustrated in Figure 3, the pump 224 moves the liquid in a counterclockwise direction. However, depending on actual needs, the pump 224 can move the liquid in a clockwise direction.

The above discussion only describes exemplary connections and operations that can be made in accordance with various alternative embodiments. It will be understood that such various alternative embodiments are not limited to the specific connections and operations described above or those shown in FIG. 3.

In order to understand the structure of the cooler 220, refer now to FIG. 4. Fig. 4 is a schematic diagram of the cooler 220 of the system shown in Fig. 1 according to various embodiments of the present disclosure.

As illustrated in FIG. 4, for example, the cooler 220 includes a condenser 226. The duct 210 may be provided inside the condenser 226. Explained in another way, the condenser 226 completely covers the duct 210. In various embodiments, for example, the liquid system in the condenser 226 is used to circulate deionized water, condensate, or any suitable liquid in the condenser 226 to cool the liquid 500 delivered by the conduit 210.

As illustrated in Figure 4, the cooler 220 includes a pump 224 coupled to the condenser 226, and the pump 224 is used to move the liquid in the condenser 226. In various embodiments, the pump 224 is arranged adjacent to the node N1 as shown in FIG. 1. As illustrated in Figure 4, the pump 224 moves the liquid in a clockwise direction. However, depending on actual needs, the pump 224 can move the liquid in a counterclockwise direction.

The above discussion only describes exemplary connections and operations that can be made in accordance with various alternative embodiments. It will be understood that such various alternative embodiments are not limited to the specific connections and operations described above or those shown in FIG. 4.

In some embodiments, for example, the cooler 220 is an air cooling device. The air cooling device is arranged on the side of the duct 210. To facilitate understanding of the structure of the cooler 220, reference is now made to FIG. 5. FIG. 5 is a schematic diagram of the cooler 220 of the system shown in FIG. 1 according to various embodiments of the present disclosure.

As illustrated in FIG. 5, the cooler 220 includes a casing 228 and a fan 221. The housing 228 covers the duct 210. The fan 221 is used to blow the air inside the housing 228 so that the liquid 500 delivered by the duct 210 can be cooled.

As illustrated in Figure 5, in some embodiments, the fan 221 is provided on the side of the densitometer 230 in Figure 1. This arrangement can help the fan 221 to keep away from the heater 140 in the first figure, or the fan 221 can blow the heat generated by the heater 140 to the duct 210 and the concentration meter 230 in the first figure.

The above discussion only describes exemplary connections and operations that can be made in accordance with various alternative embodiments. It will be understood that such various alternative embodiments are not limited to the specific connections and operations described above or their connections and operations shown in FIG. 5.

In operation 350, the concentration meter 230 is used to measure the concentration of the liquid 500 cooled by the cooler 220. In various embodiments, the temperature of the liquid 500 in the storage tank 110 is in the range of 65 degrees Celsius to 80 degrees Celsius. In some embodiments, the temperature of the liquid 500 in the storage tank 110 is about 70 degrees Celsius. The properties of the medicament mixed in the liquid 500 will be manifested by increasing its temperature and adding water to the liquid 500 to maintain its flow rate. When the temperature of the liquid 500 is lower than 65 degrees Celsius, the concentration of the liquid 500 will be too high to remove the residue of the semiconductor device 600. Conversely, when the temperature of the liquid 500 is higher than 80 degrees Celsius, the removal rate of the liquid 500 is too high, so that the semiconductor device 600 may be damaged by the liquid 500.

In some embodiments, the temperature of the liquid 500 in the storage tank 110 is in the range of 65 degrees Celsius to 80 degrees Celsius. In various embodiments, The temperature of the liquid 500 in the storage tank 110 is in the range of 110 degrees Celsius to 120 degrees Celsius. If the conduit 210 delivers the liquid 500 with this high temperature to the concentration meter 230, the measurement result of the liquid 500 from the concentration meter 230 is not accurate. Thus, the cooler 220 is used to cool the liquid 500 delivered by the catheter 210 to a predetermined temperature in about two minutes. Compared with the prior art that cools the liquid in the conduit to a temperature in thirty minutes or more, the present disclosure provides a system with a cooler 220 covering the conduit 210, which can be used in about two minutes. The liquid 500 delivered by the conduit 210 is cooled to a temperature. Therefore, the liquid 500 can be cooled more effectively by the system of the present disclosure in FIG. 1.

On the other hand, in various embodiments, the cooler 220 cools the liquid 500 in the conduit 210 to a temperature in the range of 26 degrees Celsius to 29 degrees Celsius. In some embodiments, the cooler 220 cools the liquid 500 in the conduit 210 to a temperature less than 29 degrees Celsius. Therefore, the system provided in Figure 1 can cool the liquid 500 delivered by the conduit 210 until the concentration meter 230 can accurately measure the temperature of the liquid 500.

In operation 360, the fan 240 is used to cool the concentration measuring device 200. In various embodiments, the fan 240 in the concentration measuring device 200 is used to cool the processor 260. However, since the fan 240 is provided inside the concentration measuring device 200, the fan 240 helps to cool the liquid 500 delivered by the duct 210. In some embodiments, the fan 240 is provided on the side of the densitometer 230. Such an arrangement can help the fan 240 to keep away from the heater 140, and the fan 240 blows the heat generated by the heater 140 to the concentration measuring device 200.

In operation 370, the pump 250 is used to provide the liquid to the storage tank 110 according to the concentration of the liquid 500. In operation 380, the heater 140 is used The liquid is heated to a high temperature to remove residues of the semiconductor device 600 generated by the manufacturing process.

In some embodiments, the oscillator 160 and the liquid 500 in the tank 110 are used to remove residues of the semiconductor device 600 generated by the manufacturing process. In some embodiments, for example, the oscillator 160 is an ultrasonic oscillator. The ultrasonic oscillator is used to provide ultrasonic waves to help the semiconductor device 600 remove residues generated by the manufacturing process. In various embodiments, the processor 260 is coupled between the concentration meter 230 and the pump 250, and the processor 260 is used to control the pump 250 according to the concentration of the liquid 500 to provide the liquid into the pipe 120 so as to adjust the liquid 500 concentration. In some embodiments, the storage tank 110 further includes an outer storage tank 116. If the semiconductor device 600 is immersed in the liquid 500 and the inner tank 112 overflows, the overflowed liquid 500 is further contained in the outer tank 114. However, if the outer storage tank 114 also overflows, the overflowing liquid 500 can be further contained by the outer storage tank 116.

Refer now to Figure 6. Figure 6 is a schematic diagram of a system according to various embodiments of the present disclosure.

As illustrated in FIG. 6, the pump 224 used to move the spiral hose 222 and the liquid in the condenser 226 in FIGS. 3 to 4 can be replaced by the pump 250 in FIG. The pump 250 in FIG. 6 is coupled to both the cooler 220 and the concentration meter 230. The pump 250 is used to move the liquid in the cooler 220 to cool the liquid 500 delivered by the conduit 210, and provide the liquid into the storage tank 110 according to the concentration of the liquid 500. Therefore, since the pump 250 in Figure 6 is used as the pump of the cooler 220, the pumps in Figures 3 to 4 inside the cooler 220 224 can be reduced. In various embodiments, for example, the pump 250 is a deionized spike pump.

The above discussion only describes exemplary connections and operations that can be made in accordance with various alternative embodiments. It will be understood that the various alternative embodiments are not limited to the specific connections and operations described above or those shown in FIG. 6.

Now refer to Figure 7. Figure 7 is a schematic diagram of a system according to various embodiments of the present disclosure.

As illustrated in Fig. 7, the pump 224 used to move the spiral hose 222 and the liquid in the condenser 226 in Figs. 3 to 4 can be replaced by the pump 260 in Fig. 7. The pump 250 is coupled to the concentration meter 230 and the processor 260. The pump 250 is used by the processor 260 to provide the liquid to the storage tank 110 according to the concentration of the liquid 500. On the other hand, the pump 260 is coupled to the cooler 220 and is provided adjacent to the concentration meter 230. In some embodiments, the pump 260 and the pump 250 are arranged in parallel. The pump 260 is used to move the liquid in the cooler 220 for cooling the liquid 500 delivered by the conduit 210. In various embodiments, for example, the pump 250 and the pump 260 are deionized spike pumps.

The above discussion only describes exemplary connections and operations that can be made in accordance with various alternative embodiments. It will be understood that such various alternative embodiments are not limited to the specific connections and operations described above or those shown in FIG. 7.

Refer now to Figure 8. Figure 8 is a schematic diagram of a system according to various embodiments of the present disclosure.

As illustrated in Figure 8, the cleaning device 100 further includes at least one air valve 129, which is used to control the flow path of the liquid 500 in the pipe 120, and will be used to control the air delivery of the at least one air valve 129 To the cooler 220 to cool the liquid 500 delivered by the conduit 210. In some embodiments, for example, valve 129 is a pneumatic valve. The valve 129 is thus controlled by air, and the air is delivered to the cooler 220 through the pipe 170 for cooling the liquid 500 delivered by the conduit 210.

In order to understand the structure of the cooler 220, refer now to FIG. 9. FIG. 9 is a schematic diagram of the cooler 220 of the system shown in FIG. 8 according to various embodiments of the present disclosure.

As illustrated in FIG. 8, the cooler 220 includes a spiral hose 223, and the spiral hose 222 is disposed around the duct 210. In some embodiments, the spiral hose 223 is disposed around and in contact with the duct 210 to facilitate the cooler 220 to cool the liquid 500 delivered by the duct 210. In various embodiments, the spiral hose 223 is used to deliver air, to control the valve 129, and thereby to cool the liquid 500 delivered by the conduit 210. However, in some embodiments, for example, the valves 121, 123, 125, 127 are pneumatic valves. Therefore, depending on actual needs, the spiral hose 223 is used to deliver air to control the valves 121, 123, 125, and 127. In various embodiments, for example, the spiral hose 223 is a polyurethane (PU) tube, a polyvinyl chloride (PVC) tube, or any suitable type of tube.

The above discussion only describes exemplary connections and operations that can be made in accordance with various alternative embodiments. It will be understood that the various alternative embodiments are not limited to The specific connections and operations described above or those shown in Figure 9.

Refer now to Figure 10. FIG. 10 is a schematic diagram of a cross-sectional view of the semiconductor device 600 shown in FIG. 1 according to various embodiments of the present disclosure. As shown in the figure, a patterned mask 604 is formed on the semiconductor substrate 602. Refer now to Figure 11. FIG. 11 is a schematic diagram of a cross-sectional view of the semiconductor device 600 shown in FIG. 1 according to various embodiments of the present disclosure. As shown in the figure, the exposed portion of the semiconductor substrate 602 may be etched to form a trench 702 in the semiconductor substrate 602. The semiconductor substrate 602 forms a fin 704 in the region between adjacent trenches 702. The trench 702 can be filled by forming a dielectric layer 706 over the patterned mask 604 and substantially filling the trench 702. Refer now to Figure 12. FIG. 12 is a cross-sectional view of the semiconductor device 600 shown in FIG. 1 according to various embodiments of the present disclosure. As shown, the patterned mask 604 is removed. After removing the patterned mask 604, some residues are still on the semiconductor device 600. At this time, the semiconductor device 600 is put into the tank 110 filled with the liquid 500, and the liquid 500 is used to remove the residue of the semiconductor device 600.

The disclosure also provides a system. This system includes storage tanks, ducts, coolers, and concentration meters. The storage tank is used to hold the first liquid. The conduit is coupled to the sump and used to deliver the first liquid from the sump. The cooler covers the conduit to cool the first liquid delivered by the conduit. The concentration meter is used to measure the concentration of the first liquid cooled by the cooler.

In some embodiments, the cooler includes a water cooling device covering the conduit, and the water cooling device includes a spiral hose disposed around the conduit.

In various embodiments, the water cooling device includes a condenser, and the tube is provided inside the condenser.

In some embodiments, the system further includes a pump. The pump is coupled to the cooler and the concentration meter. The pump is used to move the second liquid in the cooler to cool the first liquid delivered by the conduit, and supply the second liquid to the storage tank according to the concentration of the first liquid.

In various embodiments, the system further includes a first pump and a second pump. The first pump is coupled to the concentration meter. The first pump is used for supplying the second liquid to the storage tank according to the concentration of the first liquid. The second pump is coupled to the cooler and is located adjacent to the concentration meter. The second pump and the first pump are arranged in parallel. The second pump is used to move the second liquid in the cooler for cooling the first liquid delivered by the catheter.

In some embodiments, the system further includes a processor. The processor is coupled between the concentration meter and the first pump. The processor is used for controlling the first pump according to the concentration of the first liquid.

In various embodiments, the cooler includes an air cooling device provided on the side of the duct.

In some embodiments, the air cooling device includes a housing and a fan. The casing covers the duct. The fan is arranged on the side of the densitometer and used to blow the air inside the housing.

The present disclosure also provides a system including a cleaning device and a concentration measuring device. The cleaning device includes a storage tank and a pipeline. The storage tank is used to hold the first liquid. The pipe is coupled to the storage tank. The first liquid circulates inside the pipeline and the storage tank. The concentration measuring device includes a duct, a cooler, a concentration meter, and a fan. guide The tube is coupled to the pipe and used to deliver the first liquid from the pipe. The cooler covers the conduit to cool the first liquid delivered by the conduit. The concentration meter is used to measure the concentration of the first liquid cooled by the cooler. A fan is installed on the side of the concentration meter to cool the concentration measuring device.

In some embodiments, the cleaning device further includes at least one air valve for controlling the flow path of the first liquid in the pipe, and the air used for controlling the at least one air valve is delivered to the cooler for cooling delivered by the duct The first liquid.

In various embodiments, the cooler includes a spiral hose. The spiral hose is arranged around the catheter, and the spiral hose is used to deliver air, for controlling at least one air valve, and thereby for cooling the first liquid delivered by the catheter.

In some embodiments, the cooler includes a housing. The casing covers the duct. The air used to control the air valve is delivered to the housing for blowing the air inside the housing.

In various embodiments, the cooler includes a housing and a fan. The casing covers the duct. The fan is arranged on the side of the densitometer and used to blow the air inside the housing.

In some embodiments, the cooler includes a water cooling device. Water cooling equipment covers the ducts. Water cooling equipment includes spiral hoses. The spiral hose is arranged around the conduit.

In various embodiments, the concentration measuring device further includes a pump. The pump is coupled to the cooler and the concentration meter. The pump is used to move the second liquid in the cooler to cool the first liquid delivered by the conduit, and supply the second liquid into the pipeline according to the concentration of the first liquid.

In some embodiments, the concentration measuring device includes a first pump and a second pump. The first pump is coupled to the concentration meter. The second pump is used for supplying the second liquid into the pipeline according to the concentration of the first liquid. The second pump is coupled to the cooler and is located adjacent to the concentration meter. The second pump and the first pump are arranged in parallel. The second pump is used to move the second liquid in the cooler for cooling the first liquid delivered by the catheter.

In various embodiments, the concentration measurement device includes a processor. The processor is coupled between the concentration meter and the first pump. The processor is used for controlling the first pump according to the concentration of the first liquid, and the fan is used for cooling the processor.

The present disclosure also provides a method including the following operations. The first liquid at the first temperature is led out from the storage tank via the conduit. The first liquid delivered by the catheter is cooled to a second temperature by a cooler covering the catheter. The concentration of the first liquid delivered by the catheter at the second temperature is measured. The second liquid is supplied to the storage tank according to the concentration of the first liquid. The first liquid is heated to a first temperature to remove residues of the semiconductor device generated by the manufacturing process.

In some embodiments, cooling the first liquid delivered by the catheter to the second temperature by the cooler covering the catheter includes: cooling the first liquid delivered by the catheter to the second temperature by a water cooling device including a spiral hose disposed around the catheter The second temperature.

In some embodiments, cooling the first liquid delivered by the duct to the second temperature by the cooler covering the duct includes: the duct is delivered by an air cooling device including a casing covering the duct and a fan that blows air inside the casing The first liquid is cooled to a second temperature.

The features of several embodiments are summarized above so that those skilled in the art can better understand the aspect of the present disclosure. Those familiar with the art should understand that the present disclosure can be easily used as a basis for designing or modifying other processes and structures in order to implement the same purpose and/or achieve the same advantages of the embodiments described herein. Those familiar with the art should also realize that such equivalent structures do not depart from the spirit and scope of the present disclosure, and various changes, substitutions and alterations in this article can be made without departing from the spirit and scope of the present disclosure.

N1、N2‧‧‧node

100‧‧‧Cleaning device

110‧‧‧Tank

112‧‧‧Inner storage tank

114、116‧‧‧External storage tank

120‧‧‧Pipe

130‧‧‧Pump

140‧‧‧Heater

150‧‧‧Filter

160‧‧‧Oscillator

121, 123, 125, 127, 129‧‧‧valve

200‧‧‧Concentration measuring device

210‧‧‧Conduit

220‧‧‧Cooler

230‧‧‧Concentration meter

240‧‧‧Fan

250‧‧‧Pump

260‧‧‧Processor

500‧‧‧Liquid

600‧‧‧Semiconductor device

Claims (20)

A system that includes: A storage tank for holding a first liquid; A conduit coupled to the storage tank and used to deliver the first liquid from the storage tank; A cooler covering the conduit to cool the first liquid delivered by the conduit; and A concentration meter is used to measure a concentration of the first liquid cooled by the cooler. The system according to claim 1, wherein the cooler includes a water cooling device covering the pipe, and the water cooling device includes a spiral hose arranged around the pipe. The system according to claim 2, wherein the water cooling device includes a condenser, and the duct is arranged inside the condenser. The system described in claim 1, further comprising: A pump coupled to the cooler and the concentration meter, wherein the pump is used to move a second liquid in the cooler for cooling the first liquid delivered by the conduit, and according to the first liquid The concentration provides the second liquid to the storage tank. The system described in claim 1, further comprising: A first pump coupled to the concentration meter, wherein the first pump is used to provide a second liquid to the storage tank according to the concentration of the first liquid; and A second pump, coupled to the cooler and arranged adjacent to the concentration meter, wherein the second pump is arranged in parallel with the first pump, and wherein the second pump is used to move the second liquid in the cooler to The first liquid delivered by the catheter is cooled. The system described in claim 5, further comprising: A processor is coupled between the concentration meter and the first pump, wherein the processor is used for controlling the first pump according to the concentration of the first liquid. The system according to claim 1, wherein the cooler includes an air cooling device provided on one side of the duct. The system according to claim 7, wherein the air cooling device includes: A shell covering the conduit; and A fan is arranged on one side of the densitometer and used to blow the air inside the housing. A system that includes: A cleaning device, including: A storage tank for holding a first liquid; and A pipeline coupled to the storage tank, wherein the first liquid circulates inside the pipeline and the storage tank; and A concentration measuring device, including: A pipe coupled to the pipe and used to deliver the first liquid from the pipe; A cooler covering the conduit to cool the first liquid delivered by the conduit; A concentration meter for measuring a concentration of the first liquid cooled by the cooler; and A fan is arranged on one side of the concentration meter to cool the concentration measuring device. The system according to claim 9, wherein the cleaning device further comprises at least one air valve for controlling a flow path of the first liquid in the pipeline, and delivers air for controlling the at least one air valve to The cooler is used to control the first liquid delivered by the catheter. The system according to claim 10, wherein the cooler comprises a spiral hose arranged around the duct, the spiral hose is used to deliver the air, and the air is used to control the at least one air valve to cool the duct The first liquid delivered. The system according to claim 10, wherein the cooler includes: A casing covering the duct, wherein the air used for controlling the air valve is delivered to the casing for blowing the air inside the casing. The system according to claim 9, wherein the cooler includes: A shell covering the conduit; and A fan is arranged on one side of the densitometer and used to blow the air inside the housing. The system according to claim 9, wherein the cooler includes a water cooling device covering the pipe, and the water cooling device includes a spiral hose arranged around the pipe. The system according to claim 9, wherein the concentration measuring device further comprises: A pump coupled to the cooler and the concentration meter, wherein the pump is used to move a second liquid in the cooler to cool the first liquid delivered by the conduit, and according to the first liquid The concentration provides the second liquid into the pipeline. The system according to claim 9, wherein the concentration measuring device further comprises: A first pump coupled to the concentration meter, wherein the first pump is used to provide a second liquid into the pipeline according to the concentration of the first liquid; and A second pump coupled to the cooler and arranged adjacent to the concentration meter, wherein the second pump is arranged in parallel with the first pump, and the second pump is used to move the second liquid in the cooler to cool The first liquid delivered by the catheter. The system according to claim 16, wherein the concentration measuring device further comprises: A processor is coupled between the concentration meter and the first pump, wherein the processor is used for controlling the first pump according to the concentration of the first liquid, and the fan is used for cooling the processor. A method that includes: Leading a first liquid at a first temperature from a storage tank via a conduit; Cooling the first liquid delivered by the catheter to a second temperature by a cooler covering the catheter; Measuring a concentration of the first liquid at the second temperature, and the first liquid system is delivered by the catheter; Providing a second liquid to the storage tank according to the concentration of the first liquid; and The first liquid is heated to the first temperature to remove a plurality of residues of a semiconductor device generated by the manufacturing process. The method according to claim 18, wherein the cooling of the first liquid delivered by the catheter to the second temperature by the cooler covering the catheter comprises: The first liquid delivered by the catheter is cooled to the second temperature by a water cooling device including a spiral hose arranged around the catheter. The method according to claim 18, wherein the cooling of the first liquid delivered by the catheter to the second temperature by the cooler covering the catheter comprises: The first liquid delivered by the duct is cooled to the second temperature by an air cooling device. The air cooling device includes a casing covering the duct and a fan blowing air inside the casing.

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