CN209496828U - Mechanical arm and Wafer processing apparatus - Google Patents
Mechanical arm and Wafer processing apparatus Download PDFInfo
- Publication number
- CN209496828U CN209496828U CN201920385903.4U CN201920385903U CN209496828U CN 209496828 U CN209496828 U CN 209496828U CN 201920385903 U CN201920385903 U CN 201920385903U CN 209496828 U CN209496828 U CN 209496828U
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- China
- Prior art keywords
- wafer
- cooling
- cooling tube
- mechanical arm
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 claims abstract description 99
- 239000007788 liquid Substances 0.000 claims abstract description 65
- 239000002826 coolant Substances 0.000 claims abstract description 62
- 238000009434 installation Methods 0.000 claims abstract description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- 230000000694 effects Effects 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000000498 cooling water Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 abstract description 21
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 235000012431 wafers Nutrition 0.000 description 112
- 229920002120 photoresistant polymer Polymers 0.000 description 12
- 238000005530 etching Methods 0.000 description 10
- 239000000126 substance Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 4
- 239000003063 flame retardant Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 241000237858 Gastropoda Species 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 235000015110 jellies Nutrition 0.000 description 2
- 239000008274 jelly Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model is related to a kind of mechanical arm and Wafer processing apparatus, wherein the mechanical arm includes: arm ontology, is provided with wafer and places position, for placing wafer；Cooling tube, installation to the arm ontology, and be laid with to the wafer and place position upper surface, the wafer that position upper surface is placed is placed for cooling down the wafer；Liquid coolant sources for providing coolant liquid, and are connected to the cooling tube.Above-mentioned mechanical arm and Wafer processing apparatus include the cooling tube being arranged on arm ontology, during transmitting using mechanical arm or fetching wafer, it can realize the cooling to wafer, it is simple and convenient, cooling to wafer can be realized without reusing individual cooling stations, the process time for substantially reducing wafer increases the production capacity of board.
Description
Technical field
The utility model relates to wafer cooling technology fields, and in particular to a kind of mechanical arm and Wafer processing apparatus.
Background technique
In semiconductor fabrication, it is always necessary to semiconductor etching techniques are used, to etch figure in crystal column surface
Shape produces required lamellar pattern.Wafer etching occupies very heavy specific gravity in the production process of semiconductor devices, wafer
The time that etching technics expends also determines the production duration of semiconductor devices in a sense.However, in the prior art
The speed of wafer etching technics is slower, inefficiency, has been unable to meet the needs of technique production.
Utility model content
The purpose of this utility model is to provide a kind of mechanical arm and Wafer processing apparatus, the technique that wafer can be reduced
Time increases the production capacity of board.
In order to solve the above technical problems, the following provide a kind of mechanical arms, comprising: arm ontology is provided with wafer and puts
Set, for placing wafer；Cooling tube, installation to the arm ontology, and be laid with to the wafer and place position upper surface, it is used for
The cooling wafer places the wafer that position upper surface is placed；Liquid coolant sources for providing coolant liquid, and are connected to the cooling
Pipe.
Optionally, wafer placement position upper surface setting is fluted, for placing the cooling tube, makes the cooling tube
Position upper surface is placed with the wafer to flush.
Optionally, the shape of wafer placement position is identical as wafer shape, and the wafer places the installation of position upper surface
Cooling tube be arranged along the edge that the wafer places position, position one week is placed around the wafer, uniformly to being placed in the crystalline substance
Circle places the cooling effect of the wafer of position.
Optionally, further includes: coolant pump, installation is to the cooling tube, for by the coolant liquid in the liquid coolant sources
It is pumped into the cooling tube, flows coolant liquid in the cooling tube.
Optionally, the cooling tube is metal tube.
Optionally, the coolant liquid is water.
Optionally, the liquid coolant sources include: cooling-water machine, are connected to the coolant pipe, are used for cooling water, make the water
Temperature be lower than a preset value.
In order to solve the above technical problems, a kind of Wafer processing apparatus also provided below, including processing chamber housing, it further include machine
Tool arm is arranged outside the processing chamber housing, for transmitting wafer to be processed, and the manipulator into the processing chamber housing
Arm includes: arm ontology, is provided with wafer and places position, for placing wafer；Cooling tube, installation to the arm ontology, and spread
If placing position upper surface to the wafer, the wafer that position upper surface is placed is placed for cooling down the wafer；Liquid coolant sources are used for
Coolant liquid is provided, and is connected to the cooling tube.
Above-mentioned mechanical arm and Wafer processing apparatus include the cooling tube being arranged on arm ontology, are using mechanical arm
During transmitting or fetching wafer, so that it may realize the cooling to wafer, it is simple and convenient, without reusing individual cooling stations
It can realize the cooling to wafer, substantially reduce the process time of wafer, increase the production capacity of board.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of mechanical arm in a kind of specific embodiment of the utility model.
Fig. 2 is the schematic top plan view of mechanical arm in a kind of specific embodiment of the utility model.
Fig. 3 is the schematic top plan view of mechanical arm in a kind of specific embodiment of the utility model.
Fig. 4 is the structural schematic diagram of Wafer processing apparatus in a kind of specific embodiment of the utility model.
Specific embodiment
Below in conjunction with the drawings and specific embodiments to the utility model proposes a kind of mechanical arm and wafer-process set
It is standby to be described in further detail.
The study found that occupying etching in wafer etching process in cooling stations cool wafers the time it takes and partly leading
Most of body the time it takes.It is to need to carry out in the second half section for carrying out semiconductor etching in cooling stations cool wafers
One process, be in order to fall removal photoresist during raised wafer surface temperature and a process being arranged.It is being brilliant
During circle removal photoresist, wafer, which needs to be placed in high temperature chamber, removes photoresist, therefore the temperature of crystal column surface is in height
Can be increased significantly under the influence of warm chamber, one technique is normally carried out under the influence of being easy, therefore, carry out lower one of technique it
Before, it needs for wafer to be placed into cooling stations cool wafers, makes the temperature of crystal column surface be cooled to down one of technique to be suitable for
Temperature, to prevent from influencing the yield of wafer production.
In primary cooling procedure, it to be cooled to preference temperature, required cooling time is in tens of seconds.Specifically, such as
When removing photoresist using Mai Tesenshipuma XP (Mattson Suprema XP) board, since Mai Tesenshipuma XP board is every
Heater is both provided in the process cavity of one removal photoresist, wafer can also increase significantly in removal photoresist rear surface temperature,
Therefore process cavity that wafer is sent out to the high temperature, send to a cooling stations, cools down by cooling stations to wafer.?
In this case, every wafer requires twenties seconds temperature fall times, has been elongated spent by wafer etching technics significantly
Time has seriously affected the production capacity of etching machine bench.
It is therefore proposed that the technology of time needed for saving cool wafers a kind of is imperative.
Fig. 1,2 are please referred to, wherein Fig. 1 is the structural representation of mechanical arm in a kind of specific embodiment of the utility model
Figure, Fig. 2 are the schematic top plan view of mechanical arm in a kind of specific embodiment of the utility model.
In this specific embodiment, a kind of mechanical arm 100 is provided, comprising: arm ontology 101 is provided with wafer
Position 1011 is placed, for placing wafer 103；Cooling tube 102, installation to the arm ontology 101, and be laid with to the wafer and put
The wafer 103 that 1011 surface of position is placed is placed for cooling down the wafer in 1011 upper surface of set；Liquid coolant sources 104, for mentioning
For coolant liquid, and it is connected to the cooling tube 102.
Cooling tube 102 is installed on arm ontology 101, in the process for transmitting or fetching wafer 103 using mechanical arm 100
In, so that it may realize the cooling effect to wafer 103.
In a specific embodiment, the coolant liquid is water.In fact, the coolant liquid can also be for salt water etc. no
Easy jelly, fire-retardant or fire retardant liquid, such as automotive antifreezing liquid with larger specific heat capacity etc..Indeed, it is possible to according to practical need
To select specific coolant liquid.In this specific embodiment, select water as coolant liquid, price is lower, and the specific heat of water
Hold it is larger, have better cooling effect.
In a specific embodiment, the cooling tube 102 is metal tube.In fact, other can be selected as needed
Material of the metal with high thermal conductivity as metal tube, such as copper, aluminium.Using the higher metal of thermal conductivity as gold
The heat of wafer 103 can just be passed to the coolant liquid trickled in the cooling tube 102 by the material for belonging to pipe, complete wafer 103
It is cooling.
In a specific embodiment, 102 surface of cooling tube is coated with coating, prevent the cooling tube 102 with
When wafer 103 contacts, the metallic pollution of wafer 103 is caused.In a specific embodiment, the coating is Teflon painting
Layer, in fact, other coating can also be selected to be applied to 102 surface of cooling tube as needed forms respective coatings.
In a specific embodiment, the wafer placement 1011 upper surface of position setting is fluted, described for placing
Cooling tube 102 makes the cooling tube 102 place 1011 upper surface of position with the wafer and flushes.Keep cooling tube 102 and the crystalline substance
Circle is placed 1011 upper surface of position and is flushed, so that cooling tube 102 does not interfere with mechanical arm 100 and fetches wafer 103.
In a specific embodiment, the shape of wafer placement position 1011 is identical as 103 shape of wafer, to put
Set wafer 103.The cooling tube 102 that the wafer places the installation of 1011 upper surface of position is set along the edge that the wafer places position 1011
It sets, places position 1,011 1 weeks around the wafer, uniformly to be imitated to the cooling for being placed in the wafer 103 that the wafer places position 1011
Fruit.In this specific embodiment, the wafer is placed position 1011 and is additionally provided with for fetching the conduit that the thimble of wafer 103 passes through
201, at this point, the cooling tube 102 is arranged along 201 edge of conduit, in order to avoid hinder fetching for wafer 103.
In fact, wafer not identical with 103 shape of wafer, which can also be set as needed, places position 1011.As shown in figure 3,
For the schematic top plan view of mechanical arm in a kind of specific embodiment of the utility model.In this specific embodiment, the crystalline substance
The shape that circle places position 1011 is forked type.In this specific embodiment, the cooling tube 102 still fits in the wafer and places
The edge setting of position 1011 places position 1,011 1 weeks around the wafer.In this specific embodiment, 102 pairs of cooling tube placements
It is more uniform in the cooling effect that the wafer places the wafer 103 of 1011 upper surface of position, there is preferable cooling effect.
The crystalline substance is exposed in fact, can also widen to be placed in the wafer and place the cooling tube 102 of 1011 upper surface of position
The area that circle places position 1011 gets more preferably cooling effect to increase the contact area of cooling tube 102 Yu wafer 103.
In a specific embodiment, the mechanical arm further include: coolant pump 105, installation to the cooling tube
102, for the coolant liquid in the liquid coolant sources 104 to be pumped into the cooling tube 102, make coolant liquid in the cooling tube 102
Interior flowing.
The coolant pump 105 includes impeller, pump case, pump shaft, motor and liquid suction tube, and wherein impeller is mounted on pump case
It is interior, and be fastened on pump shaft, pump shaft is directly driven by motor, and liquid suction tube setting is in pump case center.
Before the starting of coolant pump 105, transported liquid is filled in pump case；After starting, impeller drives high speed by pump shaft
Rotation, interlobate liquid also must be with rotation.Under the influence of centrifugal force, liquid is thrown to outer rim from impeller center and is obtained
Energy is obtained, enters pump case to leave impeller outer edge at a high speed.The pump case be snail type pump case, in the snail type pump case, liquid due to
Being gradually expanded for runner and slow down, and part kinetic energy is changed into static energy, discharge pump shell is finally flowed into higher pressure, into
Enter the cooling tube 102 that the pump case is connected to, send to needing place.When liquid flows to outer rim by impeller center, in impeller center
Certain vacuum is formd, there are pressure difference between liquid coolant sources 104, coolant liquid is continuously pressed into leaf from liquid coolant sources 104
It is continual to convey coolant liquid to cooling tube 102 in wheel.
It is constantly flowed between position 1011 and liquid coolant sources 104 in order to allow coolant liquid to place in wafer, in a kind of specific reality
It applies in mode, there are two coolant pumps 105 for setting on the cooling tube 102, and one is constantly pumped into the cooling tube 102
Coolant liquid, one constantly pumps out coolant liquid from the cooling tube 102.In a kind of more preferably specific embodiment, it is pumped out
Coolant liquid also flow into the liquid coolant sources 104, to realize the recycling of coolant liquid.
In a specific embodiment, the liquid coolant sources 104 include: cooling-water machine, are connected to the coolant pipe, are used
In cooling water, make the temperature of the water lower than a preset value.In fact, also can be used even if the coolant liquid is not water
The cooling-water machine is cooled down, and the coolant liquid being recycled is enable to be consistently lower than the preset temperature.
In a specific embodiment, the cooling-water machine is room temperature cooling-water machine, and the temperature for controlling coolant liquid is 0 ° to 35 °
Between, to obtain preferable 103 cooling effect of wafer.In a specific embodiment, the temperature of the coolant liquid is controlled
At 0 ° to 5 °, coolant liquid within this range has optimal 103 cooling effect of wafer.
Referring to Fig. 4, for the structural schematic diagram of Wafer processing apparatus in a kind of specific embodiment of the utility model.At this
In specific embodiment, a kind of Wafer processing apparatus, including processing chamber housing 401 are additionally provided, further includes mechanical arm 100, if
It sets outside the processing chamber housing 401, for transmitting wafer 103 to be processed, and the manipulator into the processing chamber housing 401
Arm 100 includes: arm ontology 101, is provided with wafer and places position 1011, for placing wafer 103；Cooling tube 102, installation to institute
Arm ontology 101 is stated, and is laid with to the wafer and places 1011 upper surface of position, places 1011 surface of position for cooling down the wafer
The wafer 103 of placement；Liquid coolant sources 104 for providing coolant liquid, and are connected to the cooling tube 102.
Wafer 103 is carried due to using the mechanical arm 100 with cooling tube 102, in the mistake for carrying wafer 103
The cooling to wafer 103 can be realized in journey, carry out cool wafers 103 without reusing individual cooling stations, it is simple and convenient, greatly
The process time for shortening wafer 103 greatly, improve the production capacity of the Wafer processing apparatus.
In a specific embodiment, the coolant liquid is water.In fact, the coolant liquid can also be for salt water etc. no
Easy jelly, fire-retardant or fire retardant liquid, such as automotive antifreezing liquid with larger specific heat capacity etc..Indeed, it is possible to according to practical need
To select specific coolant liquid.In this specific embodiment, select water as coolant liquid, price is lower, and the specific heat of water
Hold it is larger, have better cooling effect.
In a specific embodiment, the cooling tube 102 is metal tube.In fact, other can be selected as needed
Material of the metal with high thermal conductivity as metal tube, such as copper, aluminium.Using the higher metal of thermal conductivity as gold
The heat of wafer 103 can just be passed to the coolant liquid trickled in the cooling tube 102 by the material for belonging to pipe, complete wafer 103
It is cooling.
In a specific embodiment, the wafer placement 1011 upper surface of position setting is fluted, described for placing
Cooling tube 102 makes the cooling tube 102 place 1011 upper surface of position with the wafer and flushes.Keep cooling tube 102 and the crystalline substance
Circle is placed 1011 upper surface of position and is flushed, so that cooling tube 102 does not interfere with mechanical arm 100 and fetches wafer 103.
In a specific embodiment, the Wafer processing apparatus is that the removal photoresist in 103 etching device of wafer is set
It is standby, for being cooled down to the wafer 103 for eliminating photoresist, will carrying out down one of technique.The setting of mechanical arm 100 exists
Except the removal photoresist chamber for removing photoresist equipment.Having heaters is set in the removal photoresist chamber, in the mistake of removal photoresist
Cheng Zhong, persistently in an environment of high temperature, 103 surface temperature of wafer is higher, right before carrying out lower one of technique at place for wafer 103
Wafer 103 is cooled down, at this point, carrying wafer 103 using the mechanical arm 100 for being provided with cooling tube 102, can carry crystalline substance
The cooling to wafer 103 is just completed during circle 103, and the temperature of wafer 103 is made to be down to the temperature for being suitable for lower one of technique.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art
Art personnel can also make several improvements and modifications without departing from the principle of this utility model, these improvements and modifications
Also it should be regarded as the protection scope of the utility model.
Claims (8)
1. a kind of mechanical arm characterized by comprising
Arm ontology is provided with wafer and places position, for placing wafer；
Cooling tube, installation to the arm ontology, and be laid with to the wafer and place position upper surface, it is put for cooling down the wafer
The wafer that set upper surface is placed；
Liquid coolant sources for providing coolant liquid, and are connected to the cooling tube.
2. mechanical arm according to claim 1, which is characterized in that wafer placement position upper surface setting is fluted,
For placing the cooling tube, so that the cooling tube is placed position upper surface with the wafer and flush.
3. mechanical arm according to claim 1, which is characterized in that the wafer places the shape and wafer shape phase of position
Together, and the wafer places the cooling tube of position upper surface installation along the edge setting of wafer placement position, puts around the wafer
Set one week, with the cooling effect uniformly to the wafer for being placed in wafer placement position.
4. mechanical arm according to claim 1, which is characterized in that further include:
Coolant pump, installation make cold to the cooling tube for the coolant liquid in the liquid coolant sources to be pumped into the cooling tube
But liquid flows in the cooling tube.
5. mechanical arm according to claim 1, which is characterized in that the cooling tube is metal tube.
6. mechanical arm according to claim 1, which is characterized in that the coolant liquid is water.
7. mechanical arm according to claim 6, which is characterized in that the liquid coolant sources include:
Cooling-water machine is connected to the coolant pipe, is used for cooling water, makes the temperature of the water lower than a preset value.
8. a kind of Wafer processing apparatus, which is characterized in that further include mechanical arm including processing chamber housing, be arranged in the processing
Outside chamber, for transmitting wafer to be processed into the processing chamber housing, and the mechanical arm includes:
Arm ontology is provided with wafer and places position, for placing wafer；
Cooling tube, installation to the arm ontology, and be laid with to the wafer and place position upper surface, it is put for cooling down the wafer
The wafer that set upper surface is placed；
Liquid coolant sources for providing coolant liquid, and are connected to the cooling tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920385903.4U CN209496828U (en) | 2019-03-25 | 2019-03-25 | Mechanical arm and Wafer processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920385903.4U CN209496828U (en) | 2019-03-25 | 2019-03-25 | Mechanical arm and Wafer processing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209496828U true CN209496828U (en) | 2019-10-15 |
Family
ID=68157601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920385903.4U Expired - Fee Related CN209496828U (en) | 2019-03-25 | 2019-03-25 | Mechanical arm and Wafer processing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209496828U (en) |
-
2019
- 2019-03-25 CN CN201920385903.4U patent/CN209496828U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191015 |