CN109532002A - Photocuring 3D printer - Google Patents
Photocuring 3D printer Download PDFInfo
- Publication number
- CN109532002A CN109532002A CN201811628028.4A CN201811628028A CN109532002A CN 109532002 A CN109532002 A CN 109532002A CN 201811628028 A CN201811628028 A CN 201811628028A CN 109532002 A CN109532002 A CN 109532002A
- Authority
- CN
- China
- Prior art keywords
- pipe
- resin
- resin pool
- refrigerator
- photocuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000016 photochemical curing Methods 0.000 title claims abstract description 20
- 239000011347 resin Substances 0.000 claims abstract description 126
- 229920005989 resin Polymers 0.000 claims abstract description 126
- 238000001816 cooling Methods 0.000 claims abstract description 35
- 239000003507 refrigerant Substances 0.000 claims description 6
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 4
- 238000005057 refrigeration Methods 0.000 claims 1
- 238000007639 printing Methods 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 7
- 239000002826 coolant Substances 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000002572 peristaltic effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 238000010146 3D printing Methods 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000112 cooling gas Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/245—Platforms or substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/307—Handling of material to be used in additive manufacturing
- B29C64/314—Preparation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
Abstract
This disclosure relates to a kind of photocuring 3D printer, the photocuring 3D printer includes resin pool and cooling structure, the cooling structure includes the first refrigerator, first pipe and second pipe, one end of the first pipe is connected to first refrigerator, its other end is connected to the resin in the resin pool, one end of the second pipe is connected to first refrigerator, its other end is connected to the resin in the resin pool, and first refrigerator, the first pipe, the second pipe and the resin pool form resin circulation loop.The photocuring 3D printer solves the problems, such as that the heat dissipating methods such as coolant duct are laid below LCD screen in the prior art influences printing precision, is conducive to improve printing precision, extends the service life of resin pool film.
Description
Technical field
This disclosure relates to 3D printing technique field, and in particular, to a kind of photocuring 3D printer.
Background technique
It is exothermic reaction that photosensitive resin, which is converted into solid polymerization reaction by fluid state by light excitation, and heat is in short-term
It is interior to disseminate away, it is deposited in resin pool bottom of pond, so that the resin temperature in resin pool is increased and is distributed in ladder, is more leaned on
Nearly resin pool bottom of pond, temperature are higher.High temperature increases the bonding force between release film and type-script, and reduce release film uses the longevity
Life.While the excessively high service life that can greatly reduce associated electronic components in printer of temperature, it is with LCD photocuring 3D printer
Example, when LCD screen surface local temperature is more than 70 DEG C, LCD screen be can not work normally, and imaging will appear stain, therefore temperature mistake
Height will lead to that printing shaping is defective or printing shaping failure.
Various cooling devices in the prior art, such as liquid is cooling, can use laying coolant duct
Or the method for setting groove flows through coolant liquid on cooling substrate, so that the heat on cooling object be taken away.
Summary of the invention
Purpose of this disclosure is to provide a kind of photocuring 3D printer, which is solved in the prior art
The problem of heat dissipating methods such as coolant duct influence printing precision is laid below LCD screen, is conducive to improve printing precision, be extended
The service life of resin pool film.
To achieve the goals above, the disclosure provides a kind of photocuring 3D printer, including resin pool and cooling structure, should
Cooling structure includes the first refrigerator, first pipe and second pipe, one end of the first pipe and first refrigerator
Connection, the other end are connected to the resin in the resin pool, and one end of the second pipe is connected to first refrigerator,
Its other end is connected to the resin in the resin pool, first refrigerator, the first pipe, the second pipe and institute
It states resin pool and forms resin circulation loop.
Optionally, the cooling structure further includes pump, and the resin in the resin pool is pumped to described first by the pump
In refrigerator.
Optionally, the nozzle of the nozzle of the first pipe and the second pipe is vertically inserted into the resin pool.
Optionally, the lower end of the nozzle of the lower end of the nozzle of the first pipe and/or the second pipe is in first party
Upward cross sectional shape is triangular in shape, and the hypotenuse is towards extending in the resin pool.
Optionally, the nozzle of the nozzle of the first pipe and the second pipe protrudes into the resin pool in the horizontal direction
It is interior.
Optionally, the cooling structure includes the cooling pipe in the resin pool and for flowing through for refrigerant.
Optionally, the cooling structure further includes the second refrigerator, and the both ends of the cooling pipe are respectively with described second
Refrigerator connection.
Optionally, the cooling pipe is along the circumferentially distributed of the resin bottom of pond portion.
Through the above technical solutions, since the resin in resin pool can form resin circulation loop through the first refrigerator,
So as to make the resin in resin pool maintain suitable temperature, damage of the high temperature to resin pool film is thereby reduced, is extended
The service life of resin pool film reduces the bonding force between resin pool film and type-script, is conducive to improve printing precision, avoid
The influences of the heat dissipating methods bring to printing precision such as coolant duct are laid below display screen.
Other feature and advantage of the disclosure will the following detailed description will be given in the detailed implementation section.
Detailed description of the invention
Attached drawing is and to constitute part of specification for providing further understanding of the disclosure, with following tool
Body embodiment is used to explain the disclosure together, but does not constitute the limitation to the disclosure.In the accompanying drawings:
Fig. 1 provides the structural schematic diagram of photocuring 3D printer for the first embodiment of the disclosure;
Fig. 2 is a kind of position view of the resin pool that embodiment provides and nozzle of the disclosure;
Fig. 3 provides the position view of resin pool and nozzle for disclosure another embodiment;
Fig. 4 provides the structural schematic diagram of photocuring 3D printer for second of embodiment of the disclosure.
Description of symbols
100 resin pool, 101 resin pool film
110 shaped platform, 120 bearing substrate
130 display screens 140 pump
151 first refrigerator, 152 second refrigerator
160 first pipe, 165 nozzle
170 second pipe, 180 transmission mechanism
181 motor, 182 guide rail
183 bracket, 184 feed screw nut's assembly
190 cooling pipes
Specific embodiment
It is described in detail below in conjunction with specific embodiment of the attached drawing to the disclosure.It should be understood that this place is retouched
The specific embodiment stated is only used for describing and explaining the disclosure, is not limited to the disclosure.
Refering to fig. 1, embodiment of the present disclosure provides a kind of photocuring 3D printer, which includes tree
Rouge pond 100, display screen 130 and cooling structure, wherein resin pool 100 includes the resin pool film 101 positioned at its bottom, display screen
130 are located at the lower section of resin pool 100, which includes the first refrigerator 151, first pipe 160 and second pipe 170,
One end of first pipe 160 is connected to the first refrigerator 151, and the other end is connected to the resin in resin pool 100, second pipe
170 one end is connected to the first refrigerator 151, and the other end is connected to the resin in resin pool 100, the first refrigerator 151,
One pipeline 160, second pipe 170 and resin pool 100 form resin circulation loop.
Through the above technical solutions, since the resin in resin pool 100 can form resin circulation through the first refrigerator 151
The resin in circuit, higher temperature can enter the first refrigerator 151 through first pipe 160, it drops in the first refrigerator 151
Temperature, then, the resin of lower temperature are transmitted back in resin pool 100 through second pipe 170, so as to make in resin pool 100
Resin maintains suitable temperature, thereby reduces damage of the high temperature to resin pool film 101, extends the use of resin pool film 101
Service life reduces the bonding force between resin pool film 101 and type-script.
On the other hand, the prior art covers the way of cooling substrate or cooling pipe below LCD screen, although these are cooled down
Structure uses transparent material, but still can generate change to the emitting light path of LCD screen, influences printing precision and molding surface
Quality.The present embodiment compared with prior art, due to avoiding that any medium is arranged between LCD screen and resin pool 100, to eliminate
The interference of medium bring, improves printing precision.
Wherein, the display screen 130 in the disclosure is LCD screen.
It should be noted that first refrigerator 151 can be semiconductor cooler, it is not necessarily to refrigerant, also there is body
Small, the light-weight advantage of product.
Refering to fig. 1, which further includes pump 140, wherein pump 140 is set on resin circulation loop, example
As in first pipe 160 as shown in Figure 1, for providing power for the flowing of resin in resin circulation loop, will specifically set
Resin in rouge pond 100 is pumped to the first refrigerator 151, or by resin pumped back resin pool 100 after cooling.
In embodiment of the present disclosure, above-mentioned pump 140 can use peristaltic pump, and peristaltic pump can be contacted to avoid fluid and be pumped
Body is conducive to the cleannes for keeping resin, meanwhile, peristaltic pump is not necessarily to valve and sealing element, installs and safeguards and is more convenient.
Refering to fig. 1 and Fig. 2, in embodiment of the present disclosure, the nozzle 165 of first pipe 160 and the pipe of second pipe 170
Vertically insertion resin pool 100 is interior and extend into resin for mouth 165, when the nozzle 165 and second pipe of first pipe 160
When 170 nozzle 165 is close to resin pool film 101, be conducive to make close to the resin of the higher temperature of resin pool film 101 from
The nozzle 165 of one pipeline 160 is extracted out, and the resin of lower temperature is delivered to resin pool from the nozzle 165 of second pipe 170
In 100, when the resin of lower temperature is close to resin pool film 101, can more rapidly it cool down to resin pool film 101, from
And resin pool film 101 is kept to be in suitable temperature.
Referring to Fig.2, further, the lower end of the nozzle 165 of first pipe 160 and/or the nozzle 165 of second pipe 170
Lower end cross sectional shape in a first direction it is triangular in shape, the hypotenuse is towards extending in resin pool 100, wherein
Above-mentioned first direction refers to the axis institute of the axis of the nozzle 165 of first pipe 160 and the nozzle 165 of second pipe 170
Plane, when the lower end of 165 lower end of nozzle of first pipe 160 and/or the nozzle 165 of second pipe 170 is triangular in shape,
On the one hand, be conducive to the resin close to resin pool film 101 and rapidly enter first pipe 160, after cooling through the first refrigerator 151
Resin is quickly delivered in resin pool 100 and close to resin pool film 101, to reduce the temperature of resin pool film 101, another party
Face is conducive to the resin inside resin pool 100 and rapidly enters first pipe 160, and the resin being discharged through second pipe 170 can
It rapidly spreads into resin pool 100, quickly to reduce the temperature of resin pool film 101, prolongs its service life;It needs to illustrate
It is, when the cross sectional shape of the lower end of the nozzle 165 of first pipe 160 in a first direction is triangular in shape, to be conducive to higher temperatures
The resin of degree enters first pipe 160, when the lower end section in a first direction of the nozzle 165 of second pipe 170 is in triangle
When shape, the resin for being conducive to lower temperature is spread in resin pool 100, when the lower end and second of the nozzle 165 of first pipe 160
When the section of the lower end of the nozzle 165 of pipeline 170 in a first direction is triangular in shape, the tree of higher temperature can be accelerated simultaneously
Rouge enters first pipe 160 and the resin of quickening lower temperature is spread in resin pool 100, to accelerate to reduce resin pool film
101 temperature.
Refering to Fig. 3, in some embodiments, the nozzle 165 of first pipe 160 and the nozzle 165 of second pipe 170 are gone back
Can parallel and close in resin pool film 101 be arranged, that is, first pipe 160 nozzle 165 and second pipe 170 nozzle
165 relative to resin pool 100 in horizontally disposed, the resin being also beneficial in resin pool 100 rapidly recycles, to accelerate to reduce
The temperature of resin pool film 101, prolongs its service life.
Refering to Fig. 4, in some embodiments, which can also include being located in resin pool 100 and for supplying
The cooling pipe 190 that refrigerant flows through, by the way that cooling pipe 190 is arranged in resin pool 100, make resin in resin pool 100 with
Refrigerant in cooling pipe 190 carries out heat exchange, also can reduce the temperature of resin in resin pool 100, and above-mentioned refrigerant can be with
Using coolant liquid or cooling gas.
Refering to Fig. 4, further, which further includes the second refrigerator 152, the both ends difference of cooling pipe 190
It is connected to the second refrigerator 152, wherein the second refrigerator 152 can be semiconductor cooler.
To avoid cooling pipe 190 from influencing the molding of type-script, circumferential direction of the cooling pipe 190 along 100 bottom of resin pool
Distribution, so that cooling pipe 190 is made to avoid the forming area of type-script, in addition, cooling tube 190 can use copper pipeline, with
Accelerate the conduction of heat.
Refering to fig. 1, which further includes shaped platform 110 and transmission mechanism 180, and type-script is formed in
Between resin pool film 101 and shaped platform 110, shaped platform 110 be at least partly movably arranged in resin pool 100 and
Shaped platform 110 is driven by transmission mechanism 180 and is moved, and transmission mechanism 180 includes feed screw nut's assembly 184, bracket 183, guide rail
182 and motor 181, feed screw nut's assembly 184 includes screw rod and nut, and screw rod is driven by motor 181 and rotated, and nut is through branch
Frame 183 is simultaneously fixedly connected with bracket 183, and nut is set in the outside of screw rod, and bracket 183 is substantially L-shaped, bracket 183 and molding
Platform 110 connection and with 182 slidable connection of guide rail, the guide rail 182 along resin pool 100 short transverse be arranged, in this way, when electricity
When machine 181 drives screw rod rotation, bracket 183 can drive shaped platform 110 to move up and down along the extending direction of guide rail 182.
In embodiment of the present disclosure, refering to fig. 1, which further includes bearing substrate 120, bearing substrate
120 are located at the lower section of resin pool 100 and for carrying display screen 130.
The preferred embodiment of the disclosure is described in detail in conjunction with attached drawing above, still, the disclosure is not limited to above-mentioned reality
The detail in mode is applied, in the range of the technology design of the disclosure, a variety of letters can be carried out to the technical solution of the disclosure
Monotropic type, these simple variants belong to the protection scope of the disclosure.It is further to note that in above-mentioned specific embodiment
Described in each particular technique feature can be combined in any appropriate way in the case of no contradiction, be
Avoid unnecessary repetition, no further explanation will be given to various combinations of possible ways for the disclosure.
In addition, any combination can also be carried out between a variety of different embodiments of the disclosure, as long as it is without prejudice to originally
Disclosed thought equally should be considered as disclosure disclosure of that.
Claims (8)
1. a kind of photocuring 3D printer, which is characterized in that including resin pool (100) and cooling structure, which includes
First refrigerator (151), first pipe (160) and second pipe (170), one end of the first pipe (160) and described the
One refrigerator (151) connection, the other end are connected to the resin in the resin pool (100), and the one of the second pipe (170)
End is connected to first refrigerator (151), and the other end is connected to the resin in the resin pool (100), first system
Cooler (151), the first pipe (160), the second pipe (170) and the resin pool (100) form resin and are recycled back to
Road.
2. photocuring 3D printer according to claim 1, which is characterized in that the cooling structure further includes pump (140),
Resin in the resin pool (100) is pumped in first refrigerator (151) by the pump (140).
3. photocuring 3D printer according to claim 1, which is characterized in that the nozzle of the first pipe (160)
(165) it is vertically inserted into the resin pool (100) with the nozzle (165) of the second pipe (170).
4. photocuring 3D printer according to claim 3, which is characterized in that the nozzle of the first pipe (160)
(165) cross sectional shape of the lower end of the nozzle (165) of lower end and/or the second pipe (170) in a first direction is in three
Angular, which extends towards the resin pool (100) is interior.
5. photocuring 3D printer according to claim 1, which is characterized in that the nozzle of the first pipe (160)
(165) it is protruded into the resin pool (100) in the horizontal direction with the nozzle (165) of the second pipe (170).
6. photocuring 3D printer according to claim 1-5, which is characterized in that the cooling structure includes position
Cooling pipe (190) in the resin pool (100) and for being flowed through for refrigerant.
7. photocuring 3D printer according to claim 6, which is characterized in that the cooling structure further includes the second refrigeration
Device (152), the both ends of the cooling pipe (190) are connected to second refrigerator (152) respectively.
8. photocuring 3D printer according to claim 6, which is characterized in that the cooling pipe (190) is along the tree
Rouge pond (100) bottom it is circumferentially distributed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811628028.4A CN109532002A (en) | 2018-12-28 | 2018-12-28 | Photocuring 3D printer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811628028.4A CN109532002A (en) | 2018-12-28 | 2018-12-28 | Photocuring 3D printer |
Publications (1)
Publication Number | Publication Date |
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CN109532002A true CN109532002A (en) | 2019-03-29 |
Family
ID=65857842
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201811628028.4A Withdrawn CN109532002A (en) | 2018-12-28 | 2018-12-28 | Photocuring 3D printer |
Country Status (1)
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CN (1) | CN109532002A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110978517A (en) * | 2019-12-26 | 2020-04-10 | 深圳市极光尔沃科技股份有限公司 | Constant temperature system of LCD 3D printer |
CN112060571A (en) * | 2020-08-31 | 2020-12-11 | 深圳市纵维立方科技有限公司 | Printing method and printing apparatus |
CN112976570A (en) * | 2019-12-12 | 2021-06-18 | 三纬国际立体列印科技股份有限公司 | Heat radiator for stereo printer |
EP3991944A1 (en) * | 2020-11-03 | 2022-05-04 | Shenzhen Anycubic Technology Co., Ltd. | Feeding device and 3d printer |
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US20070275162A1 (en) * | 2006-05-23 | 2007-11-29 | Shonan Gosei-Jushi Seisakusho K.K. | Pipeline lining method |
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CN206325544U (en) * | 2016-12-19 | 2017-07-14 | 希玛石油制品(镇江)有限公司 | Reactor cooling device |
CN107639829A (en) * | 2017-10-11 | 2018-01-30 | 安溪县贤彩茶叶机械有限公司 | A kind of cooling back installation for 3D printing equipment injection molding |
CN108582788A (en) * | 2018-05-30 | 2018-09-28 | 芜湖聚网信息技术有限公司 | 3D printing workbench with cooling body |
CN109049685A (en) * | 2018-08-01 | 2018-12-21 | 北京金达雷科技有限公司 | Photocuring 3D printer and Method of printing |
CN109153176A (en) * | 2016-05-12 | 2019-01-04 | 惠普发展公司,有限责任合伙企业 | The cooling of building material in 3 D-printing system |
CN209492175U (en) * | 2018-12-28 | 2019-10-15 | 北京金达雷科技有限公司 | Photocuring 3D printer |
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US20070275162A1 (en) * | 2006-05-23 | 2007-11-29 | Shonan Gosei-Jushi Seisakusho K.K. | Pipeline lining method |
CN105109048A (en) * | 2015-09-24 | 2015-12-02 | 北京金达雷科技有限公司 | Photocureable 3D printer and resin bath for same |
CN109153176A (en) * | 2016-05-12 | 2019-01-04 | 惠普发展公司,有限责任合伙企业 | The cooling of building material in 3 D-printing system |
CN206325544U (en) * | 2016-12-19 | 2017-07-14 | 希玛石油制品(镇江)有限公司 | Reactor cooling device |
CN107639829A (en) * | 2017-10-11 | 2018-01-30 | 安溪县贤彩茶叶机械有限公司 | A kind of cooling back installation for 3D printing equipment injection molding |
CN108582788A (en) * | 2018-05-30 | 2018-09-28 | 芜湖聚网信息技术有限公司 | 3D printing workbench with cooling body |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112976570A (en) * | 2019-12-12 | 2021-06-18 | 三纬国际立体列印科技股份有限公司 | Heat radiator for stereo printer |
CN110978517A (en) * | 2019-12-26 | 2020-04-10 | 深圳市极光尔沃科技股份有限公司 | Constant temperature system of LCD 3D printer |
CN112060571A (en) * | 2020-08-31 | 2020-12-11 | 深圳市纵维立方科技有限公司 | Printing method and printing apparatus |
CN112060571B (en) * | 2020-08-31 | 2022-07-08 | 深圳市纵维立方科技有限公司 | Printing method and printing apparatus |
EP3991944A1 (en) * | 2020-11-03 | 2022-05-04 | Shenzhen Anycubic Technology Co., Ltd. | Feeding device and 3d printer |
US11660816B2 (en) | 2020-11-03 | 2023-05-30 | Shenzhen Anycubic Technology Co., Ltd. | Regulating resin temperature by recirculating on hot or cold side of peltier effect block |
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