CN109532002A - Photocuring 3D printer - Google Patents

Photocuring 3D printer Download PDF

Info

Publication number
CN109532002A
CN109532002A CN201811628028.4A CN201811628028A CN109532002A CN 109532002 A CN109532002 A CN 109532002A CN 201811628028 A CN201811628028 A CN 201811628028A CN 109532002 A CN109532002 A CN 109532002A
Authority
CN
China
Prior art keywords
pipe
resin
resin pool
refrigerator
photocuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201811628028.4A
Other languages
Chinese (zh)
Inventor
李厚民
刘振亮
雷阳阳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BEIJING JINDALEI TECHNOLOGY Co Ltd
Original Assignee
BEIJING JINDALEI TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BEIJING JINDALEI TECHNOLOGY Co Ltd filed Critical BEIJING JINDALEI TECHNOLOGY Co Ltd
Priority to CN201811628028.4A priority Critical patent/CN109532002A/en
Publication of CN109532002A publication Critical patent/CN109532002A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/106Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/124Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/245Platforms or substrates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30Auxiliary operations or equipment
    • B29C64/307Handling of material to be used in additive manufacturing
    • B29C64/314Preparation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00Apparatus for additive manufacturing; Details thereof or accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y40/00Auxiliary operations or equipment, e.g. for material handling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)

Abstract

This disclosure relates to a kind of photocuring 3D printer, the photocuring 3D printer includes resin pool and cooling structure, the cooling structure includes the first refrigerator, first pipe and second pipe, one end of the first pipe is connected to first refrigerator, its other end is connected to the resin in the resin pool, one end of the second pipe is connected to first refrigerator, its other end is connected to the resin in the resin pool, and first refrigerator, the first pipe, the second pipe and the resin pool form resin circulation loop.The photocuring 3D printer solves the problems, such as that the heat dissipating methods such as coolant duct are laid below LCD screen in the prior art influences printing precision, is conducive to improve printing precision, extends the service life of resin pool film.

Description

Photocuring 3D printer
Technical field
This disclosure relates to 3D printing technique field, and in particular, to a kind of photocuring 3D printer.
Background technique
It is exothermic reaction that photosensitive resin, which is converted into solid polymerization reaction by fluid state by light excitation, and heat is in short-term It is interior to disseminate away, it is deposited in resin pool bottom of pond, so that the resin temperature in resin pool is increased and is distributed in ladder, is more leaned on Nearly resin pool bottom of pond, temperature are higher.High temperature increases the bonding force between release film and type-script, and reduce release film uses the longevity Life.While the excessively high service life that can greatly reduce associated electronic components in printer of temperature, it is with LCD photocuring 3D printer Example, when LCD screen surface local temperature is more than 70 DEG C, LCD screen be can not work normally, and imaging will appear stain, therefore temperature mistake Height will lead to that printing shaping is defective or printing shaping failure.
Various cooling devices in the prior art, such as liquid is cooling, can use laying coolant duct Or the method for setting groove flows through coolant liquid on cooling substrate, so that the heat on cooling object be taken away.
Summary of the invention
Purpose of this disclosure is to provide a kind of photocuring 3D printer, which is solved in the prior art The problem of heat dissipating methods such as coolant duct influence printing precision is laid below LCD screen, is conducive to improve printing precision, be extended The service life of resin pool film.
To achieve the goals above, the disclosure provides a kind of photocuring 3D printer, including resin pool and cooling structure, should Cooling structure includes the first refrigerator, first pipe and second pipe, one end of the first pipe and first refrigerator Connection, the other end are connected to the resin in the resin pool, and one end of the second pipe is connected to first refrigerator, Its other end is connected to the resin in the resin pool, first refrigerator, the first pipe, the second pipe and institute It states resin pool and forms resin circulation loop.
Optionally, the cooling structure further includes pump, and the resin in the resin pool is pumped to described first by the pump In refrigerator.
Optionally, the nozzle of the nozzle of the first pipe and the second pipe is vertically inserted into the resin pool.
Optionally, the lower end of the nozzle of the lower end of the nozzle of the first pipe and/or the second pipe is in first party Upward cross sectional shape is triangular in shape, and the hypotenuse is towards extending in the resin pool.
Optionally, the nozzle of the nozzle of the first pipe and the second pipe protrudes into the resin pool in the horizontal direction It is interior.
Optionally, the cooling structure includes the cooling pipe in the resin pool and for flowing through for refrigerant.
Optionally, the cooling structure further includes the second refrigerator, and the both ends of the cooling pipe are respectively with described second Refrigerator connection.
Optionally, the cooling pipe is along the circumferentially distributed of the resin bottom of pond portion.
Through the above technical solutions, since the resin in resin pool can form resin circulation loop through the first refrigerator, So as to make the resin in resin pool maintain suitable temperature, damage of the high temperature to resin pool film is thereby reduced, is extended The service life of resin pool film reduces the bonding force between resin pool film and type-script, is conducive to improve printing precision, avoid The influences of the heat dissipating methods bring to printing precision such as coolant duct are laid below display screen.
Other feature and advantage of the disclosure will the following detailed description will be given in the detailed implementation section.
Detailed description of the invention
Attached drawing is and to constitute part of specification for providing further understanding of the disclosure, with following tool Body embodiment is used to explain the disclosure together, but does not constitute the limitation to the disclosure.In the accompanying drawings:
Fig. 1 provides the structural schematic diagram of photocuring 3D printer for the first embodiment of the disclosure;
Fig. 2 is a kind of position view of the resin pool that embodiment provides and nozzle of the disclosure;
Fig. 3 provides the position view of resin pool and nozzle for disclosure another embodiment;
Fig. 4 provides the structural schematic diagram of photocuring 3D printer for second of embodiment of the disclosure.
Description of symbols
100 resin pool, 101 resin pool film
110 shaped platform, 120 bearing substrate
130 display screens 140 pump
151 first refrigerator, 152 second refrigerator
160 first pipe, 165 nozzle
170 second pipe, 180 transmission mechanism
181 motor, 182 guide rail
183 bracket, 184 feed screw nut's assembly
190 cooling pipes
Specific embodiment
It is described in detail below in conjunction with specific embodiment of the attached drawing to the disclosure.It should be understood that this place is retouched The specific embodiment stated is only used for describing and explaining the disclosure, is not limited to the disclosure.
Refering to fig. 1, embodiment of the present disclosure provides a kind of photocuring 3D printer, which includes tree Rouge pond 100, display screen 130 and cooling structure, wherein resin pool 100 includes the resin pool film 101 positioned at its bottom, display screen 130 are located at the lower section of resin pool 100, which includes the first refrigerator 151, first pipe 160 and second pipe 170, One end of first pipe 160 is connected to the first refrigerator 151, and the other end is connected to the resin in resin pool 100, second pipe 170 one end is connected to the first refrigerator 151, and the other end is connected to the resin in resin pool 100, the first refrigerator 151, One pipeline 160, second pipe 170 and resin pool 100 form resin circulation loop.
Through the above technical solutions, since the resin in resin pool 100 can form resin circulation through the first refrigerator 151 The resin in circuit, higher temperature can enter the first refrigerator 151 through first pipe 160, it drops in the first refrigerator 151 Temperature, then, the resin of lower temperature are transmitted back in resin pool 100 through second pipe 170, so as to make in resin pool 100 Resin maintains suitable temperature, thereby reduces damage of the high temperature to resin pool film 101, extends the use of resin pool film 101 Service life reduces the bonding force between resin pool film 101 and type-script.
On the other hand, the prior art covers the way of cooling substrate or cooling pipe below LCD screen, although these are cooled down Structure uses transparent material, but still can generate change to the emitting light path of LCD screen, influences printing precision and molding surface Quality.The present embodiment compared with prior art, due to avoiding that any medium is arranged between LCD screen and resin pool 100, to eliminate The interference of medium bring, improves printing precision.
Wherein, the display screen 130 in the disclosure is LCD screen.
It should be noted that first refrigerator 151 can be semiconductor cooler, it is not necessarily to refrigerant, also there is body Small, the light-weight advantage of product.
Refering to fig. 1, which further includes pump 140, wherein pump 140 is set on resin circulation loop, example As in first pipe 160 as shown in Figure 1, for providing power for the flowing of resin in resin circulation loop, will specifically set Resin in rouge pond 100 is pumped to the first refrigerator 151, or by resin pumped back resin pool 100 after cooling.
In embodiment of the present disclosure, above-mentioned pump 140 can use peristaltic pump, and peristaltic pump can be contacted to avoid fluid and be pumped Body is conducive to the cleannes for keeping resin, meanwhile, peristaltic pump is not necessarily to valve and sealing element, installs and safeguards and is more convenient.
Refering to fig. 1 and Fig. 2, in embodiment of the present disclosure, the nozzle 165 of first pipe 160 and the pipe of second pipe 170 Vertically insertion resin pool 100 is interior and extend into resin for mouth 165, when the nozzle 165 and second pipe of first pipe 160 When 170 nozzle 165 is close to resin pool film 101, be conducive to make close to the resin of the higher temperature of resin pool film 101 from The nozzle 165 of one pipeline 160 is extracted out, and the resin of lower temperature is delivered to resin pool from the nozzle 165 of second pipe 170 In 100, when the resin of lower temperature is close to resin pool film 101, can more rapidly it cool down to resin pool film 101, from And resin pool film 101 is kept to be in suitable temperature.
Referring to Fig.2, further, the lower end of the nozzle 165 of first pipe 160 and/or the nozzle 165 of second pipe 170 Lower end cross sectional shape in a first direction it is triangular in shape, the hypotenuse is towards extending in resin pool 100, wherein Above-mentioned first direction refers to the axis institute of the axis of the nozzle 165 of first pipe 160 and the nozzle 165 of second pipe 170 Plane, when the lower end of 165 lower end of nozzle of first pipe 160 and/or the nozzle 165 of second pipe 170 is triangular in shape, On the one hand, be conducive to the resin close to resin pool film 101 and rapidly enter first pipe 160, after cooling through the first refrigerator 151 Resin is quickly delivered in resin pool 100 and close to resin pool film 101, to reduce the temperature of resin pool film 101, another party Face is conducive to the resin inside resin pool 100 and rapidly enters first pipe 160, and the resin being discharged through second pipe 170 can It rapidly spreads into resin pool 100, quickly to reduce the temperature of resin pool film 101, prolongs its service life;It needs to illustrate It is, when the cross sectional shape of the lower end of the nozzle 165 of first pipe 160 in a first direction is triangular in shape, to be conducive to higher temperatures The resin of degree enters first pipe 160, when the lower end section in a first direction of the nozzle 165 of second pipe 170 is in triangle When shape, the resin for being conducive to lower temperature is spread in resin pool 100, when the lower end and second of the nozzle 165 of first pipe 160 When the section of the lower end of the nozzle 165 of pipeline 170 in a first direction is triangular in shape, the tree of higher temperature can be accelerated simultaneously Rouge enters first pipe 160 and the resin of quickening lower temperature is spread in resin pool 100, to accelerate to reduce resin pool film 101 temperature.
Refering to Fig. 3, in some embodiments, the nozzle 165 of first pipe 160 and the nozzle 165 of second pipe 170 are gone back Can parallel and close in resin pool film 101 be arranged, that is, first pipe 160 nozzle 165 and second pipe 170 nozzle 165 relative to resin pool 100 in horizontally disposed, the resin being also beneficial in resin pool 100 rapidly recycles, to accelerate to reduce The temperature of resin pool film 101, prolongs its service life.
Refering to Fig. 4, in some embodiments, which can also include being located in resin pool 100 and for supplying The cooling pipe 190 that refrigerant flows through, by the way that cooling pipe 190 is arranged in resin pool 100, make resin in resin pool 100 with Refrigerant in cooling pipe 190 carries out heat exchange, also can reduce the temperature of resin in resin pool 100, and above-mentioned refrigerant can be with Using coolant liquid or cooling gas.
Refering to Fig. 4, further, which further includes the second refrigerator 152, the both ends difference of cooling pipe 190 It is connected to the second refrigerator 152, wherein the second refrigerator 152 can be semiconductor cooler.
To avoid cooling pipe 190 from influencing the molding of type-script, circumferential direction of the cooling pipe 190 along 100 bottom of resin pool Distribution, so that cooling pipe 190 is made to avoid the forming area of type-script, in addition, cooling tube 190 can use copper pipeline, with Accelerate the conduction of heat.
Refering to fig. 1, which further includes shaped platform 110 and transmission mechanism 180, and type-script is formed in Between resin pool film 101 and shaped platform 110, shaped platform 110 be at least partly movably arranged in resin pool 100 and Shaped platform 110 is driven by transmission mechanism 180 and is moved, and transmission mechanism 180 includes feed screw nut's assembly 184, bracket 183, guide rail 182 and motor 181, feed screw nut's assembly 184 includes screw rod and nut, and screw rod is driven by motor 181 and rotated, and nut is through branch Frame 183 is simultaneously fixedly connected with bracket 183, and nut is set in the outside of screw rod, and bracket 183 is substantially L-shaped, bracket 183 and molding Platform 110 connection and with 182 slidable connection of guide rail, the guide rail 182 along resin pool 100 short transverse be arranged, in this way, when electricity When machine 181 drives screw rod rotation, bracket 183 can drive shaped platform 110 to move up and down along the extending direction of guide rail 182.
In embodiment of the present disclosure, refering to fig. 1, which further includes bearing substrate 120, bearing substrate 120 are located at the lower section of resin pool 100 and for carrying display screen 130.
The preferred embodiment of the disclosure is described in detail in conjunction with attached drawing above, still, the disclosure is not limited to above-mentioned reality The detail in mode is applied, in the range of the technology design of the disclosure, a variety of letters can be carried out to the technical solution of the disclosure Monotropic type, these simple variants belong to the protection scope of the disclosure.It is further to note that in above-mentioned specific embodiment Described in each particular technique feature can be combined in any appropriate way in the case of no contradiction, be Avoid unnecessary repetition, no further explanation will be given to various combinations of possible ways for the disclosure.
In addition, any combination can also be carried out between a variety of different embodiments of the disclosure, as long as it is without prejudice to originally Disclosed thought equally should be considered as disclosure disclosure of that.

Claims (8)

1. a kind of photocuring 3D printer, which is characterized in that including resin pool (100) and cooling structure, which includes First refrigerator (151), first pipe (160) and second pipe (170), one end of the first pipe (160) and described the One refrigerator (151) connection, the other end are connected to the resin in the resin pool (100), and the one of the second pipe (170) End is connected to first refrigerator (151), and the other end is connected to the resin in the resin pool (100), first system Cooler (151), the first pipe (160), the second pipe (170) and the resin pool (100) form resin and are recycled back to Road.
2. photocuring 3D printer according to claim 1, which is characterized in that the cooling structure further includes pump (140), Resin in the resin pool (100) is pumped in first refrigerator (151) by the pump (140).
3. photocuring 3D printer according to claim 1, which is characterized in that the nozzle of the first pipe (160) (165) it is vertically inserted into the resin pool (100) with the nozzle (165) of the second pipe (170).
4. photocuring 3D printer according to claim 3, which is characterized in that the nozzle of the first pipe (160) (165) cross sectional shape of the lower end of the nozzle (165) of lower end and/or the second pipe (170) in a first direction is in three Angular, which extends towards the resin pool (100) is interior.
5. photocuring 3D printer according to claim 1, which is characterized in that the nozzle of the first pipe (160) (165) it is protruded into the resin pool (100) in the horizontal direction with the nozzle (165) of the second pipe (170).
6. photocuring 3D printer according to claim 1-5, which is characterized in that the cooling structure includes position Cooling pipe (190) in the resin pool (100) and for being flowed through for refrigerant.
7. photocuring 3D printer according to claim 6, which is characterized in that the cooling structure further includes the second refrigeration Device (152), the both ends of the cooling pipe (190) are connected to second refrigerator (152) respectively.
8. photocuring 3D printer according to claim 6, which is characterized in that the cooling pipe (190) is along the tree Rouge pond (100) bottom it is circumferentially distributed.
CN201811628028.4A 2018-12-28 2018-12-28 Photocuring 3D printer Withdrawn CN109532002A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811628028.4A CN109532002A (en) 2018-12-28 2018-12-28 Photocuring 3D printer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811628028.4A CN109532002A (en) 2018-12-28 2018-12-28 Photocuring 3D printer

Publications (1)

Publication Number Publication Date
CN109532002A true CN109532002A (en) 2019-03-29

Family

ID=65857842

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811628028.4A Withdrawn CN109532002A (en) 2018-12-28 2018-12-28 Photocuring 3D printer

Country Status (1)

Country Link
CN (1) CN109532002A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110978517A (en) * 2019-12-26 2020-04-10 深圳市极光尔沃科技股份有限公司 Constant temperature system of LCD 3D printer
CN112060571A (en) * 2020-08-31 2020-12-11 深圳市纵维立方科技有限公司 Printing method and printing apparatus
CN112976570A (en) * 2019-12-12 2021-06-18 三纬国际立体列印科技股份有限公司 Heat radiator for stereo printer
EP3991944A1 (en) * 2020-11-03 2022-05-04 Shenzhen Anycubic Technology Co., Ltd. Feeding device and 3d printer

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070275162A1 (en) * 2006-05-23 2007-11-29 Shonan Gosei-Jushi Seisakusho K.K. Pipeline lining method
CN105109048A (en) * 2015-09-24 2015-12-02 北京金达雷科技有限公司 Photocureable 3D printer and resin bath for same
CN206325544U (en) * 2016-12-19 2017-07-14 希玛石油制品(镇江)有限公司 Reactor cooling device
CN107639829A (en) * 2017-10-11 2018-01-30 安溪县贤彩茶叶机械有限公司 A kind of cooling back installation for 3D printing equipment injection molding
CN108582788A (en) * 2018-05-30 2018-09-28 芜湖聚网信息技术有限公司 3D printing workbench with cooling body
CN109049685A (en) * 2018-08-01 2018-12-21 北京金达雷科技有限公司 Photocuring 3D printer and Method of printing
CN109153176A (en) * 2016-05-12 2019-01-04 惠普发展公司,有限责任合伙企业 The cooling of building material in 3 D-printing system
CN209492175U (en) * 2018-12-28 2019-10-15 北京金达雷科技有限公司 Photocuring 3D printer

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070275162A1 (en) * 2006-05-23 2007-11-29 Shonan Gosei-Jushi Seisakusho K.K. Pipeline lining method
CN105109048A (en) * 2015-09-24 2015-12-02 北京金达雷科技有限公司 Photocureable 3D printer and resin bath for same
CN109153176A (en) * 2016-05-12 2019-01-04 惠普发展公司,有限责任合伙企业 The cooling of building material in 3 D-printing system
CN206325544U (en) * 2016-12-19 2017-07-14 希玛石油制品(镇江)有限公司 Reactor cooling device
CN107639829A (en) * 2017-10-11 2018-01-30 安溪县贤彩茶叶机械有限公司 A kind of cooling back installation for 3D printing equipment injection molding
CN108582788A (en) * 2018-05-30 2018-09-28 芜湖聚网信息技术有限公司 3D printing workbench with cooling body
CN109049685A (en) * 2018-08-01 2018-12-21 北京金达雷科技有限公司 Photocuring 3D printer and Method of printing
CN209492175U (en) * 2018-12-28 2019-10-15 北京金达雷科技有限公司 Photocuring 3D printer

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112976570A (en) * 2019-12-12 2021-06-18 三纬国际立体列印科技股份有限公司 Heat radiator for stereo printer
CN110978517A (en) * 2019-12-26 2020-04-10 深圳市极光尔沃科技股份有限公司 Constant temperature system of LCD 3D printer
CN112060571A (en) * 2020-08-31 2020-12-11 深圳市纵维立方科技有限公司 Printing method and printing apparatus
CN112060571B (en) * 2020-08-31 2022-07-08 深圳市纵维立方科技有限公司 Printing method and printing apparatus
EP3991944A1 (en) * 2020-11-03 2022-05-04 Shenzhen Anycubic Technology Co., Ltd. Feeding device and 3d printer
US11660816B2 (en) 2020-11-03 2023-05-30 Shenzhen Anycubic Technology Co., Ltd. Regulating resin temperature by recirculating on hot or cold side of peltier effect block

Similar Documents

Publication Publication Date Title
CN109532002A (en) Photocuring 3D printer
JP6561846B2 (en) Cooling device and electronic device
US20170196120A1 (en) Liquid cooling of electronic devices
WO2016035436A1 (en) Heat transport device and electronic equipment
US20090129021A1 (en) Gas station television
CN102830581B (en) Radiating device of projector
CN106486433B (en) IGBT radiator
CN102194529A (en) Patch type heat-radiating device with active cooling
CN209492175U (en) Photocuring 3D printer
CN2891005Y (en) Liquid cooling radiator of audio and video apparatus
WO2020244377A1 (en) Laser projection device
CN107124853A (en) Liquid cooling apparatus and its electronic equipment of application
CN107894673A (en) Lightening display device
CN107908043A (en) Display device and its wall-mounted cooling mechanism
CN103953907A (en) LED (light emitting diode) liquid-cooling heat dissipation system and big-power LED spotlight
CN101907820B (en) DMD (Digital Mirror Device) heat-radiation structure and projector applied same
CN1980562A (en) Liquid-cooling type electronic-device radiator
CN108161002A (en) Fin cooling system, cooling fins and its increasing material manufacturing method
CN209356836U (en) A kind of cooling system of laser display apparatus
CN116706654A (en) Optical fiber mode stripper cooling structure and laser with same
CN214311635U (en) Multiple heat radiation structure based on computer chip earlier stage test
CN212634672U (en) Transverse cooling system of laser marking Z-axis focusing module
CN207752287U (en) A kind of anhydrous cooling system of laser projection
JP2006132819A (en) Heat exchanger and liquid-cooling system using the same
CN108389843B (en) Liquid cooling heat dissipation system

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information

Address after: 100081 Department of science and technology building 2008, No. 683, district 683, Zhongguancun South Street, Haidian District, Beijing

Applicant after: Youyouzao Technology (Beijing) Co.,Ltd.

Address before: 100081 room 2008, science and technology building, No. 9 South Avenue, Beijing, Haidian District, Zhongguancun

Applicant before: GOLD ARRAY TECHNOLOGY (BEIJING), LLC

CB02 Change of applicant information
WW01 Invention patent application withdrawn after publication

Application publication date: 20190329

WW01 Invention patent application withdrawn after publication