TW201308419A - Apparatus and mothod for treating substrate - Google Patents

Abstract

Provided are an apparatus and method for treating a substrate, and more particularly, to an apparatus and method for treating a substrate using a supercritical fluid. The apparatus for treating a substrate includes a process chamber in which an organic solvent remaining on a substrate is dissolved using a fluid provided as a supercritical fluid to dry the substrate and a recycling unit in which the organic solvent is separated from the fluid discharged from the process chamber to recycle the fluid.

Description

Apparatus and method for processing a substrate

The invention herein relates to apparatus and methods for processing substrates, and more particularly to apparatus and methods for processing substrates using supercritical fluids.

The semiconductor device can be fabricated via various steps including photolithography steps for forming a circuit pattern on a substrate such as a germanium wafer or the like. When manufacturing a semiconductor device, various foreign matters such as particles, organic contaminants, metal impurities, and the like may be generated. Foreign matter may cause substrate defects to directly adversely affect the yield of the semiconductor device. Therefore, a cleaning step for removing foreign matter can be substantially involved in the semiconductor manufacturing process.

In general, in a typical cleaning step, a foreign matter held on a substrate is removed using a cleaning agent, and then the substrate is cleaned using deionized water (DI water) to dry the cleaned substrate using isopropyl alcohol (IPA). However, in the case where the semiconductor device has a fine circuit pattern, the drying step may have low efficiency. Further, since the damage of the circuit pattern (i.e., pattern cracking) frequently occurs during the drying step, the drying step is not suitable for a semiconductor device having a line width of about 30 nm or less.

Therefore, in order to solve the above limitations, research on a technique for drying a substrate using a supercritical fluid is being actively conducted.

The present invention provides an apparatus for processing a substrate using a supercritical fluid and a method of processing the substrate using the apparatus.

The present invention also provides an apparatus for processing a substrate, wherein supercritical fluid recycling is used for drying the substrate, and a method of processing the substrate using the apparatus.

The features of the present invention are not limited to the features described above, and other features not described herein will be apparent from the description and drawings.

The present invention provides an apparatus for processing a substrate.

Embodiments of the present invention provide an apparatus for processing a substrate, the apparatus comprising: a processing chamber in which a fluid provided as a supercritical fluid is used to dissolve an organic solvent remaining on the substrate; and a recycling unit in which the organic solvent is The fluid exiting the processing chamber separates to recirculate the fluid.

In some embodiments, the recycling unit can include a separation module for cooling the fluid, wherein the organic solvent is dissolved to separate the organic solvent from the fluid.

In other embodiments, a plurality of separation modules may be provided, and the plurality of separation modules may be connected to each other in series.

In other embodiments, the separation module may include: a separation tank into which the fluid discharged from the processing chamber is introduced; a cooling chamber for cooling the separation tank; and a drain pipe disposed on the drain The lower portion of the separation tank is for discharging an organic solvent that is liquefied and separated from the fluid; and a first exhaust pipe disposed in an upper portion of the separation tank to discharge a fluid separated from the organic solvent.

In other embodiments, the separation module can further include an inflow tube for supplying fluid discharged from the processing chamber into the lower portion of the separation tank.

In other embodiments, the separation module may further include a back pressure regulator disposed in the first exhaust pipe to constantly maintain the separation groove Department pressure.

In a further embodiment, the recycling unit may further include a column module that provides an absorbing material for absorbing the organic module into the fluid discharged from the separation module to The fluid separation provides a plurality of column modules, and the plurality of column modules can be connected to each other in series.

In still further embodiments, a plurality of column modules can be provided, and the plurality of column modules can be connected in parallel with each other.

In still further embodiments, the column module can include: an absorption column for providing absorbing material to the fluid discharged from the separation module; and a temperature maintaining member for constantly maintaining the absorption tube An internal temperature of the column; and a second exhaust pipe for discharging the fluid separated from the organic solvent by the absorbing material.

In still further embodiments, the column module may further include a concentration sensor disposed in the second exhaust pipe to detect a fluid contained in the second exhaust pipe The concentration of the organic solvent in the medium.

In still further embodiments, the absorbent material can comprise a zeolite.

In still further embodiments, the recycling unit can include a column module that provides an absorbing material for absorbing the organic module into the fluid discharged from the processing chamber to separate the organic solvent from the Fluid separation.

In other embodiments of the present invention, a method for processing a substrate includes: using a fluid provided as a supercritical fluid to dissolve an organic solvent remaining on the substrate to dry the substrate; and separating the organic solvent from the fluid to This fluid is recycled.

In some embodiments, recycling of the fluid can include cooling the fluid, wherein the organic solvent is dissolved to separate the organic solvent from the fluid.

In other embodiments, recycling of the fluid can further include providing an absorbing material for absorbing the organic solvent into the fluid to separate the organic solvent from the fluid.

In other embodiments of the present invention, an apparatus for processing a substrate includes: a processing chamber in which a fluid provided as a supercritical fluid is used to dissolve an organic solvent remaining on the substrate to dry the substrate; and a storage tank in which the liquid a state storing the fluid; a water supply tank receiving fluid from the storage tank to generate a supercritical fluid and providing the supercritical fluid into the processing chamber; and a recycling unit, wherein the organic solvent is discharged from the processing chamber The fluid is separated to recirculate the fluid and the recirculated fluid is supplied to the storage tank.

In some embodiments, the recycling unit can include a separation module for cooling the fluid, wherein the organic solvent is dissolved to separate the organic solvent from the fluid.

In other embodiments, the recycling unit may further include a column module that provides an absorbing material for absorbing the organic module into the fluid discharged from the separation module to cause the organic solvent and the fluid Separation.

In other embodiments, the apparatus can further include a first condenser for changing a gaseous fluid discharged from the recirculation unit to a liquid fluid to supply the liquid fluid to the storage tank.

In other embodiments, the apparatus may further include: a second condenser for changing a gaseous fluid discharged from the storage tank to a liquid fluid; and a pump that receives the liquid fluid from the second condenser to The liquid fluid is supplied to the water supply tank; and wherein, in the water supply tank, a fluid compressed by the pump at a pressure greater than a critical pressure is heated at a temperature greater than a critical temperature to generate a supercritical fluid.

In other embodiments of the invention, a method for processing a substrate includes: storing a liquid fluid in a storage tank; changing the stored fluid to a supercritical fluid; and dissolving the residue on the substrate using a fluid provided as a supercritical fluid An organic solvent to dry the substrate; separating the organic solvent from the fluid, wherein the organic solvent is dissolved to recycle the fluid; and changing the recycled fluid to a liquid fluid to supply the liquid fluid to the storage tank in.

In some embodiments, the recycling of the fluid can include a first recycling step of cooling the fluid, wherein the organic solvent is dissolved to separate the organic solvent from the fluid.

In other embodiments, the recycling of the fluid can further include a second recycling step of providing an absorbent material for absorbing the organic solvent into the fluid to separate the organic solvent from the fluid.

The drawings are included to provide a further understanding of the invention, and the drawings are incorporated in this specification. The drawings illustrate the exemplary embodiments of the invention and, together with the embodiments

The preferred embodiments of the present invention are provided so that this invention will be thorough and complete, and the scope of the invention will be fully disclosed to those skilled in the art. However, the invention may be embodied in different forms and should not be construed as being limited to the embodiments set forth herein. It will be apparent, therefore, that various modifications and changes may be made in the invention without departing from the spirit and scope of the invention.

It will also be understood that although specific terms are used and the drawings are attached hereto The exemplary embodiments of the present invention are readily described, but the invention is not limited by the terms and the drawings.

In addition, detailed descriptions of well-known functions or configurations are omitted so as not to unnecessarily obscure the subject matter of the present invention.

The apparatus 100 for processing a substrate according to the present invention may be an apparatus for performing a cleaning step on the substrate S.

Here, it should be comprehensively understood that the substrate S may include various wafers (including germanium wafers), glass substrates, organic substrates, and the like, and products for manufacturing semiconductor devices, displays, and films including the circuits formed thereon. A substrate for its analogs.

Hereinafter, an apparatus 100 for processing a substrate according to an embodiment will be described.

1 is a plan view of an apparatus 100 for processing a substrate in accordance with an embodiment of the present invention.

The apparatus 100 for processing a substrate includes an indexing module 1000, a processing module 2000, a supercritical fluid supply unit 3000, and a recycling unit 4000. The indexing module 1000 receives the substrate S from the outside to provide the substrate S to the processing module. The processing module 2000 performs a cleaning step on the substrate S. The supercritical fluid supply unit 3000 supplies the supercritical fluid to be used in the cleaning step, and the recycling unit 4000 uses the supercritical fluid recycle in the cleaning step.

The index module 1000 can be an equipment front end module (EFEM). Moreover, the index module 1000 includes a load port 1100 and a transfer frame 1200. The load port 1100, the transfer frame 1200, and the processing module 2000 can be continuously arranged in a row.

Here, the arrangement direction of the load port 1100, the transfer frame 1200, and the processing module 2000 is referred to as a first direction X. Moreover, when viewed from the upper side, the direction perpendicular to the first direction X is referred to as the second direction Y and perpendicular to the first direction The direction of X and the second direction Y is referred to as the third direction Z.

At least one load port 1100 can be disposed in the index module 1000.

The load port 1100 is disposed on one side of the transfer frame 1200. When the load port 1100 is provided in plural, the load ports 1100 may be arranged in a row along the second direction Y.

The number and configuration of the load ports 1100 are not limited to the above examples. For example, the number and configuration of load ports 1100 can be appropriately selected in view of the footprint of device 100 for processing substrates, processing efficiency, and relative configuration of other devices 100 for processing substrates.

The carrier C in which the substrate C is received is disposed on the load port 1100. The carrier C is transported from the outside and then loaded onto the load port 1100 or unloaded from the load port 1100 and then transferred to the outside. For example, carrier C can be transferred between devices 100 for processing substrates by a transfer unit such as a suspended lift conveyor (OHT). Here, the substrate S may be transferred by replacing the OHT or the worker by another transfer unit such as an automated guided vehicle, a track guided vehicle or the like.

The substrate S is received into the carrier C. A front opening standard box (FOUP) can be used as the carrier C.

At least one slot for supporting the edge of the substrate S may be disposed within the carrier C.

When the slots are provided in plural, the slots may be spaced apart from each other along the third direction Z.

Therefore, the substrate S can be placed in the carrier C. For example, carrier C can receive 25 substrates S.

The interior of the carrier C can be isolated from the outside by an openable door and thus sealed. Therefore, the substrate S received in the carrier C can be prevented from being contaminated dye.

The transfer frame 1200 transfers the substrate S between the carrier C located on the load port 1100 and the processing module 2000. The transfer module 1200 includes an indexing robot 1210 and an index track 1220.

Index track 1220 provides a path of movement for indexing robot 1210. The index track 1220 can be disposed in a direction parallel to the length direction of the second direction Y.

The indexing robot 1210 transmits the substrate S. The indexing robot 1210 can include a base 1211, a body 1212, and an arm 1213.

The base 1211 is disposed on the index rail 1220. Moreover, the base 1211 can be moved along the index rail 1220. The body 1212 is coupled to the base 1211. Moreover, the body 1212 can move over the base 1211 along a third direction Z or about an axis defined in the third direction Z. The arm 1213 is disposed on the body 1212. Moreover, the arm 1213 can be moved back and forth. A hand can be placed on the end of the arm 1213 to pick up or place the substrate S. The indexing robot 1210 can include at least one arm 1213. When the arms 1213 are provided in plurality, the arms 1213 may be stacked on the body 1212 and disposed in the third direction Z. Here, each arm 1213 can operate independently.

Thus, in the indexing robot 1210, the pedestal 1211 can move over the index track 1220 in the second direction Y. Moreover, the indexing robot 1210 can take out the substrate S from the carrier C according to the operation of the body 1212 and the arm 1213 to transfer the substrate S into the processing module 2000 or take out the substrate S from the processing module 2000 to receive the substrate S in the carrier C. .

The index track 1220 may be omitted in the transfer block 1200 and the indexing robot 1210 may be fixed to the transfer frame 1200. In this case, the indexing robot 1210 can be disposed on a central portion of the transfer frame 1200.

The processing module 2000 receives the substrate S from the index module 1000 to the substrate S Perform the cleaning steps. The processing module 2000 includes a buffer chamber 2100, a transfer chamber 2200, a first processing chamber 2300, and a second processing chamber 2500. The buffer chamber 2100 and the transfer chamber 2200 are disposed along the first direction X, and the transfer chamber 2200 is disposed in a length direction parallel to the first direction X. The processing chambers 2300 and 2500 may be disposed on a side surface of the transfer chamber 2200 in the second direction Y.

Here, the first processing chamber 2300 may be disposed on one side of the transfer chamber 2200 in the second direction Y, and the second processing chamber 2500 may be disposed opposite the side on which the first processing chamber is disposed On the other side. The first processing chamber 2300 can be provided in one or more. When a plurality of first processing chambers 2300 are provided, the first processing chambers 2300 can be disposed on one side of the transfer chamber 2200 in the first direction X, stacked in the third direction Z, or disposed in a combination thereof. Similarly, the second processing chamber 2500 can be provided in one or more. When a plurality of second processing chambers are provided, the second processing chambers may be disposed on one side of the transfer chamber 2500 in the first direction X, stacked in the third direction Z, or disposed in a combination thereof.

However, the configuration of each of the chambers in the processing module 200 is not limited to the above examples. That is, the chambers can be properly placed in consideration of processing efficiency. For example, the first processing chamber 2300 and the second processing chamber 2500 may be disposed in a first direction X on a plane on the same side as the transfer module 2200, or stacked on each other, as necessary.

The buffer chamber 2100 is disposed between the transfer frame 1200 and the transfer chamber 2200 to provide a buffer space. The substrate S transferred between the index module 1000 and the processing module 2000 can be temporarily parked in the buffer space. At least one buffer slot on which the substrate S is placed may be provided in the buffer chamber 2100. When the buffer slot is provided in plural, the buffer slots may be along the third direction Z This is separated.

The substrate taken from the carrier C by the indexing robot 1210 may be located in the buffer slot, or the substrate C transported from the processing chambers 2300 and 2500 by the transfer robot 2210 of the transfer chamber 2200 may be located in the buffer slot. On the other hand, the indexing robot 1210 or the transfer robot 2210 can take out the substrate S from the buffer slot to receive the substrate S in the carrier C or transfer the substrate S into the processing chambers 2300 and 2500.

The transfer chamber 2200 transfers the substrate S between the chambers 2100, 2300 and 2500 disposed therearound. The buffer chamber 2100 may be disposed on one side of the transfer chamber 2200 in the first direction X. The processing chambers 2300 and 2500 can be disposed on one or both sides of the transfer chamber 2200 in the second direction Y. Accordingly, the transfer chamber 2200 can transfer the substrate S between the buffer chamber 2100, the first process chamber 2300, and the second process chamber 2500.

The transfer chamber 2200 includes a transfer rail 2220 and a transfer robot 2210.

The transport track 2220 provides a path of movement for the transfer robot 2210. The transfer rail 2220 can be disposed parallel to the first direction X. The transfer robot 2210 transfers the substrate S. The transfer robot 2210 can include a base 2211, a body 2212, and an arm 2213. Since each of the components of the transfer robot 2210 is similar to each of the components of the indexing robot 1210, a detailed description thereof will be omitted. The transfer robot 2210 transfers the substrate S between the buffer chamber 2100, the first processing chamber 2300, and the second processing chamber 2500 by the operation of the body 2212 and the arm 2213 while the susceptor 2211 moves along the transfer rail 2220.

The first processing chamber 2300 and the second processing chamber 2500 may perform different processes from each other on the substrate S. Here, the first process performed in the first process chamber 2300 and the second process performed in the second process chamber 2500 may be continuously performed.

For example, a chemical step, a cleaning step, and a first drying step can be performed in the first processing chamber 2300. Moreover, a second drying step that is a subsequent step of the first step can be performed in the second processing chamber 2500. Here, the first drying step may be a wet drying step performed using an organic solvent, and the second drying step may be a supercritical drying step performed using a supercritical fluid. Only one of the first drying step and the second drying step may be selectively performed as necessary.

Hereinafter, the first processing chamber 2300 will be described. 2 is a cross-sectional view of the first processing chamber 2300 of FIG.

The first step is performed in the first processing chamber 2300. Here, the first step may include at least one of a chemical step, a cleaning step, and a first drying step. As mentioned previously, the first drying step can be omitted.

The first processing chamber 2300 includes a housing 2310 and a processing unit 2400. The outer casing 2310 defines an outer wall of the first processing chamber 230, and the processing unit 2400 is disposed within the outer casing 2310 to perform the first step.

The processing unit 2400 includes a spin head 2410, a fluid supply member 2420, a recovery container 2430, and a lifting member 2440.

The substrate S is located on the spin head 2410. Moreover, the spin head 2410 rotates the substrate S during the progress of the step. The spin head 2410 may include a support plate 2411, a support pin 2412, a clamp pin 2413, a rotating shaft 2414, and a motor 2415.

The support plate 2411 has an upper portion having a shape similar to that of the substrate S. That is, the upper portion of the support plate 2411 may have a circular shape. A plurality of support pins 2412 on which the substrate S is placed and a plurality of clamping pins 2413 for fixing the substrate S are disposed on the support plate 2411. The rotating shaft 2414 rotated by the motor 2415 is fixed and coupled to the bottom surface of the support plate 2411. The motor 2415 generates a rotational force using an external power source to pass the rotating shaft 2414. The support plate 2411 is rotated. Thus, the substrate S can be located on the spin head 2410, and the support plate 2411 can be rotated to rotate the substrate during the first step of progression.

Each of the support pins 2412 protrudes from the top surface of the support plate 2411 in the third direction Z. A plurality of support pins 2412 are disposed to be spaced apart from each other by a predetermined distance. The support pin 2412 may be configured in a ring shape when viewed from the upper side. The surface behind the substrate S can be placed on the support pin 2412. Accordingly, the substrate S is positioned on the support pins 2412 such that the substrate S is separated from the top surface of the support plate 2411 by the support pins 2412 by the protruding distance of each of the support pins 2412.

Each of the clamping pins 2413 can protrude further from the top surface of the support plate 2411 in the third direction Z than each of the support pins 2412. Thus, the clamping pin 2413 can be disposed further from the center of the support plate 2411 than the support pin 2412. The clamping pin 2413 is movable between a fixed position and a picking position along the radial direction of the support plate 2411. Here, the fixed position indicates a position spaced apart from the center of the support plate 2411 by a distance corresponding to the radius of the substrate S, and the pickup position indicates a position away from the center of the support plate 2411 from the fixed position. When the substrate S is loaded on the spin head 2410 by the transfer robot 2210, the clamp pin 2413 is placed at the pickup position. When the substrate S is loaded and then the steps are performed, the clamping pin 2413 can be moved to a fixed position to contact the side surface of the substrate S, thereby fixing the substrate S in a normal position. Moreover, when the step is completed, and then the transfer robot 2210 picks up the substrate S to unload the substrate S, the grip pin 2413 can be moved to the pickup position again. Therefore, the pin 2413 prevents the substrate S from being separated from the normal position by the rotational force when the spin head 2410 is rotated.

The fluid supply part 2420 supplies fluid to the substrate S. The fluid supply component 2420 can include a nozzle 2421, a support member 2422, a support shaft 2423, and a drive Actuator 2424. The support shaft 2423 is disposed such that its length direction is parallel to the third direction Z. The driver 2424 is coupled to the lower end of the support shaft 2423. The driver 2424 rotates the support shaft 2423 or vertically moves the support shaft 2423 along the third direction Z. The support member 2422 is vertically coupled to the upper portion of the support shaft 2423. A nozzle 2421 is disposed on a bottom surface of one end of the support member 2422.

The nozzle 2421 is movable between the processing position and the standby position by the rotation and lifting of the driver 2424 by the support shaft 2423. Here, the processing position indicates that the nozzle 2421 is disposed at a position directly above the support plate 2411, and the standby position indicates that the nozzle 2421 is disposed to be displaced from the upper side of the support plate 2411.

At least one fluid supply component 2420 can be provided in the processing unit 2400. When the fluid supply member 2420 is provided in plural, each of the fluid supply members 2420 may supply fluids differently from each other, respectively. For example, each of the plurality of fluid supply components 2420 can supply a cleaning agent, a rinsing agent, or an organic solvent. Here, the cleaning agent may include hydrogen peroxide (H ₂ O ₂ ) solution, ammonia water (NH ₄ OH), hydrochloric acid (HCl), and sulfuric acid (H ₂ SO ₄ ) and hydrogen peroxide (H ₂ O ₂ ) solution. A mixed solution, or a hydrofluoric acid (HF) solution. Deionized water can be used primarily as a rinsing agent. The organic solvent may include isopropanol, ethylene glycol, 1-propanol, tetra hydraulic franc, 4-hydroxy, 4-methyl, 2-pentanone, 1-butanol, 2-butanol, Methanol, ethanol, n-propanol or dimethyl ether. For example, the first fluid supply component 2420a can spray an aqueous ammonia hydrogen peroxide solution, the second fluid supply component can spray deionized water, and the third fluid supply component 2420c can spray an isopropanol solution. However, the organic solvent may not be in a liquid state but may be in a gaseous state. If the organic solvent is supplied in a gaseous state, the organic solvent may be mixed with an inert gas.

When the substrate S is located on the spin head 2410, the fluid supply member can be The 2420 moves from the standby position to the processing position to supply the fluid to the substrate S. For example, the fluid supply component 2420 can supply a cleaning agent, a rinsing agent, and an organic solvent to perform a chemical step, a cleaning step, and a first drying step, respectively. As described above, the spin head 2410 can be rotated by the motor 2415 to uniformly supply the fluid onto the top surface of the substrate S during the progress of the step.

The recovery container 2430 provides a space in which the first step is performed. Moreover, the recovery vessel 2430 recovers the fluid used in the first step. When viewed from the upper side, the recovery container 2430 is placed around the spin head 2410 to surround the spin head 2410 and has an open upper side. At least one recovery container 2430 can be provided in the processing unit 2400. Hereinafter, a processing unit 2400 including three recovery containers 2430, that is, a first recovery container 2430a, a second recovery container 2430b, and a third recovery container 2430c will be described. However, the number of recovery containers 2430 can be selected differently depending on the number of fluids and the conditions of the first step.

Each of the first recovery container 2430a, the second recovery container 2430b, and the third recovery container 2430c may have a circular ring shape to surround the spin head 2410. Moreover, the first recovery container 2430a, the second recovery container 2430b, and the third recovery container 2430c may be disposed away from the center of the spin head 2410 in the order of the first recovery container 2430a, the second recovery container 2430b, and the third recovery container 2430c. . That is, the first recovery container 2430a surrounds the spin head 2410, the second recovery container 2430b surrounds the first recovery container 2430a, and the third recovery container 2430c surrounds the second recovery container 2430b. Therefore, the inflow hole 2431 can be disposed in the third direction Z.

The first recovery container 2430a has a first inflow hole 2431a defined by its internal space. The second recovery container 2430b has a second inflow hole defined by a space between the first recovery container 2430a and the second recovery container 2430b 2431b. The third recovery container 2430c has a third recovery container 2430c defined by a space between the second recovery container 2430b and the third recovery container 2430c. A recovery line 2432 extending downward in the third direction Z is connected to the bottom surface of each of the first recovery container 2430a, the second recovery container 2430b, and the third recovery container 2430c. Each of the first recovery line 2432a, the second recovery line 2432b, and the third recovery line 2432c discharges the recovered fluid into the first recovery container 2430a, the second recovery container 2430b, and the third recovery container 2430c to The fluid is supplied to an external fluid recirculation system (not shown). The fluid recirculation system (not shown) can recycle the recovered fluid to reuse the fluids.

The lifting member 2440 moves the recovery container 2430 in the third direction Z. Therefore, the recovery container 2430 can change the relative height relative to the spin head 2410. When the recovery container 2430 is provided in plural, the inflow hole 2431 of one recovery container 2430 can be selectively adjusted in height such that the inflow hole 2431 is disposed on the horizontal plane of the substrate S on the spin head 2410.

The lifting member 2440 includes a bracket 2441, a lifting shaft 2442, and an elevator 2443. The bracket 2441 is fixed to the recovery container 2430. One end of the bracket 2441 is fixed and coupled to the lifting shaft 2442 that is moved in the third direction Z by the elevator 2443. When the recovery container 2430 is provided in plural, the bracket 2441 can be coupled to the outermost recovery container 2430.

When the substrate S is loaded on or unloaded from the spin head 2410, the lifting member 2440 can move the recovery container 2430 downward to prevent the recovery container 2430 from interfering with the path of the transfer robot 2210 for transporting the substrate S.

Moreover, when the fluid is supplied by the fluid supply member 2420 and the spin head 2410 is rotated to perform the first step, the lifting member 2440 can be in the third direction Z The recovery container 2430 is moved up to position the inflow hole 2431 of the recovery container 2430 on the same horizontal plane as the substrate S, so that the fluid that has escaped from the substrate S due to the centrifugal force caused by the rotation of the substrate S is recovered. For example, in the case where the first step is performed in the order of the chemical step by the cleaning agent, the cleaning step by the rinsing agent, and the first drying step by the organic solvent, the cleaning agent is supplied, In the rinsing agent and the organic solvent, the first inflow hole 2431a, the second inflow hole 2431b, and the third inflow hole 2431c can be moved to the same horizontal plane as the substrate S to separately recover the fluid to the first recovery container 2430a, and the second recovery The container 2430b and the third recovery container 2430c are in the container. As described above, when the used fluid is recovered, environmental pollution can be prevented, and expensive fluid can be recycled to reduce the semiconductor manufacturing cost.

The lifting member 2440 can move the spin head 2410 in the third direction Z instead of moving the recovery container 2430.

Hereinafter, the second processing chamber will be described.

The second step is performed in the second processing chamber 2500. Here, the second step may be a second drying step for drying the substrate S using a supercritical fluid.

A supercritical fluid means a fluid in a state in which the material exceeds a critical temperature and a critical pressure, that is, the material cannot be classified into a liquid state and a gaseous state because it reaches a critical state. The molecular density of a supercritical fluid is similar to the molecular density of a liquid, and its viscosity is similar to the viscosity of a gas. Supercritical fluids have the advantage of chemical reactions due to their extremely high diffusivity, permeability and solubility. Moreover, since the supercritical fluid does not apply an interfacial tension to the fine structure due to its extremely low surface tension, the drying efficiency can be excellent when the semiconductor device is dried, and pattern cracking can be prevented.

Hereinafter, a carbon dioxide (CO ₂ ) supercritical fluid mainly used for drying the substrate S will be described. However, the invention is not limited to the composition and type of supercritical fluid.

Fig. 3 is a view illustrating a phase transition of carbon dioxide. When the carbon dioxide temperature is about 31.1 ° C or higher and the pressure is about 7.38 Mpa or more, the carbon dioxide can be changed to a supercritical state. Carbon dioxide can be non-toxic, non-flammable and inert. Moreover, supercritical carbon dioxide has a critical temperature and pressure that is less than the critical temperature and pressure of other fluids. Therefore, supercritical carbon dioxide can be adjusted in temperature and pressure to easily control its solubility. Moreover, supercritical carbon dioxide can have a diffusion coefficient that is about 10 to about 100 times less than the diffusion coefficient of water or other solvents and an extremely low surface tension when compared to water or other solvents. Thus, supercritical carbon dioxide can have physical properties suitable for performing the drying step. Moreover, carbon dioxide can be recycled by by-products from various chemical reactions. In addition, the supercritical carbon dioxide used in the drying step can be recycled and reused to reduce environmental pollution.

4 is a cross-sectional view of the second processing chamber 2500 of FIG. 1. The second processing chamber 2500 includes a housing 2510, a heating component 2520, a support member 2530, a supercritical fluid supply tube 2540, and an exhaust tube 2550.

The inside of the outer casing 2510 can provide a space sealed from the outside to dry the substrate S. The outer casing 2510 can be formed of a material that is sufficiently resistant to high pressures. A heating member 2520 for heating the inside of the outer casing 2510 may be disposed between the inner and outer walls of the outer casing 2510. Of course, the invention is not limited to the location of the heating component 2520. For example, the heating component 2520 can be disposed at a different location than the location described above.

The support member 2530 supports the substrate S. The support member 2530 can be fixed and mounted within the outer casing 2510. Alternatively, the support member 2530 may not be fixed However, it is rotatable to rotate the substrate S on the support member 2530.

The supercritical fluid supply pipe 2540 supplies the supercritical fluid into the outer casing 2510. The supercritical fluid supply pipe 2540 includes at least one of an upper supply pipe 2540a and a lower supply pipe 2540b. The upper supply pipe 2540a is connected to the upper portion of the outer casing 2510 and the supercritical fluid supply unit 3000. The lower supply pipe 2540b is connected to the lower portion of the outer casing 2510 and the supercritical fluid supply unit 3000. Each of the upper supply tube 2540a and the lower supply tube 2540b may include a valve V for adjusting the flow rate of the supercritical fluid. Valve V can be a switching valve or a flow control valve. Therefore, the supercritical fluid can be supplied into the outer casing 2510 via at least one of the upper supply pipe 2540a and the lower supply pipe 2540b according to the progress of the second drying step. Here, the lower supply tube 2540b can be branched from the upper supply tube 2540b. Therefore, the upper supply pipe 2540a and the lower supply pipe 2540b can be connected to the same supercritical fluid supply unit 3000. Alternatively, the upper supply pipe 2540a and the lower supply pipe 2540b may be connected to the supercritical fluid supply unit 3000 differently from each other, respectively.

The supercritical fluid within the outer casing 2510 can be discharged via the exhaust pipe 2550. The valve V can be disposed in the discharge pipe 2550. A drain tube 2550 can be disposed below the outer casing 2510. Alternatively, the vent tube 2550 can be disposed over the outer casing 2510.

FIG. 5 is a cross-sectional view of the second processing chamber 2500 of FIG. 1 in accordance with another embodiment. The second processing chamber 2500 according to another embodiment may further include a gas supply tube 2560.

The gas supply pipe 2560 supplies an inert gas into the outer casing 2510. Here, the inert gas may include N ₂ , He, Ne, and Ar. The gas supply pipe 2560 is connected to the outer casing 2510 and the gas supply source G.

The gas supply pipe 2560 can be coupled to an upper portion of the outer casing 2510. A valve V for adjusting the flow rate may be disposed in the gas supply pipe 2560.

When the gas supply pipe 2560 is supplied to the second process chamber 2500, the inert gas may be exhausted through the discharge pipe 2550. To this end, two discharge tubes 2550a and 2550b can be provided to the second processing chamber 2500. Here, the supercritical fluid may be discharged through the first exhaust pipe 2550a, and the inert gas may be exhausted through the second exhaust pipe 2550b.

In the second processing chamber 2500, the number and configuration of the supercritical fluid supply tube 2540, the gas supply tube 2560, and the discharge tube 2550 can be changed in consideration of processing efficiency, occupation area, and the like. For example, the supercritical fluid supply tube 2540 or the discharge tube 2550 can be disposed on a side surface of the outer casing 2510. For another example, the first exhaust pipe 2550a can be coupled to the lower portion of the outer casing 2510 and the second exhaust pipe 2550b can be coupled to the upper portion of the outer casing 2510.

Thus, a second drying step using a supercritical fluid can be performed in the second processing chamber 2500. For example, in the second processing chamber 2500, a second drying step using a supercritical fluid may be performed on the substrate S, and a chemical step, a cleaning step, and a first drying step using an organic solvent are continuously performed on the substrate S. When the substrate S is placed on the support member 2530 by the transfer robot 2210, the heating member 2520 heats the inside of the outer casing 2510, and supplies the supercritical fluid via the supercritical fluid supply pipe 2540.

Therefore, a supercritical fluid atmosphere can be formed within the outer casing 2510. When a supercritical atmosphere is formed, the supercritical fluid can dissolve the organic solvent remaining on the substrate S because the organic solvent is not used after the organic solvent is used in the first drying step that is finally performed in the first processing chamber 2300. It is completely dry. When the organic solvent is sufficiently dissolved and the substrate S is dried, the supercritical fluid is discharged through the discharge holes. Next, the substrate S is unloaded from the support member 2530 by the transfer robot 2210 to take it out.

The supercritical fluid supply unit 3000 supplies the supercritical fluid into the second processing chamber 2500, and the recycling unit 4000 recirculates the supercritical fluid used in the second processing chamber 2500 to supply the recirculated supercritical fluid To the supercritical fluid supply unit 3000. The supercritical fluid supply unit 3000 and the recirculation unit 4000 may be implemented as separate individual devices, or all or part of the supercritical fluid supply unit 3000 and the recirculation unit 4000 may be included in the device 100 to process the substrate as one component.

Hereinafter, a supercritical fluid of carbon dioxide will be described. However, for the convenience of description, this is merely an example. Supercritical fluids can have different compositions.

Figure 6 is a view illustrating a circulation path of a supercritical fluid. Referring to Figure 6, the supercritical fluid can be recirculated while simultaneously circulating in the supercritical fluid supply unit 3000, the second processing chamber 2500, and the recirculation unit 4000.

The supercritical fluid supply unit 3000 may include a storage tank 3100, a water supply tank 3200, a first condenser 3300, a second condenser 3400, and a pump 3500.

The carbon dioxide is stored in the storage tank 3100 in a liquid state. Carbon dioxide may be supplied from the external or recirculating unit 400 and then stored in the storage tank 3100. Here, the carbon dioxide supplied from the external or recirculation unit 4000 may be in a gaseous state. The first condenser 3300 changes the gaseous carbon dioxide to liquid carbon dioxide to store the liquid carbon dioxide in the storage tank 3100. Since the volume of the liquid carbon dioxide is smaller than the volume of the gaseous carbon dioxide, a large amount of carbon dioxide can be stored in the storage tank 3100.

The water supply tank 3200 receives carbon dioxide from the storage tank 3100 to change the carbon dioxide to a supercritical fluid state. The supercritical fluid is then supplied to the second processing chamber 2500 of the processing module 2000. When the valve V connecting the storage tank 3100 to the water supply tank 3200 is opened, the carbon dioxide stored in the storage tank 3100 is moved to the water supply tank 3200 while being changed to a gaseous state. Here, second The condenser 3400 and the pump 3500 can be disposed in a line connecting the storage tank 3100 to the water supply tank 3200. The second condenser 3400 changes the carbon dioxide having a gaseous state to carbon dioxide having a liquid state. The pump 3500 changes the liquid carbon dioxide to gaseous carbon dioxide compressed via a critical pressure to supply the gaseous carbon dioxide into the water supply tank 3200. The water supply tank 3200 can heat the supplied carbon dioxide at a temperature above a critical temperature to generate a supercritical fluid, and then transfer the supercritical fluid to the second processing chamber 2500. Here, the carbon dioxide discharged from the water supply tank 3200 may be in a state of compressing carbon dioxide at a pressure of about 100 bar to about 150 bar. The water supply tank 3200 can supply liquid or gaseous carbon dioxide into the second processing chamber 2500 when liquid or gaseous carbon dioxide is required in the second processing chamber 2500 as the steps progress.

Figure 7 is a view of the recycling unit of Figure 6 in accordance with an embodiment of the present invention, and Figure 8 is a view of the recycling unit 4000 of Figure 6 in accordance with another embodiment of the present invention.

The recycling unit 4000 recirculates the supercritical fluid containing the organic solvent for the second drying step in the second processing chamber 2500 to supply the recycled supercritical fluid to the supercritical fluid supply unit 3000. The recycling unit 4000 can include at least one of the separation module 4100 and the column module 4200.

The separation module 4100 cools the carbon dioxide to liquefy the organic solvent contained in the carbon dioxide, thereby separating the organic solvent from the carbon dioxide. The column module 4200 allows carbon dioxide to pass through a space in which the absorbing material A for absorbing the organic solvent is disposed to separate the organic solvent from the carbon dioxide.

A plurality of separation modules 4100 can be provided in the recycling unit 4000. Here, the separation modules 4100 can be connected to each other in series. For example, the first point The module 4100a is coupled to the second processing chamber 2500 to separate the carbon dioxide from the organic solvent for the first time. Next, the second separation module 4100b is connected to the first separation module 4100a to separate the carbon dioxide and the organic solvent from each other for the second time. Therefore, the separation of carbon dioxide and organic solvent by the separation module 4100 can be performed several times to obtain relatively pure carbon dioxide.

Moreover, a plurality of column modules 4200 can be provided in the recycling unit 4000. Here, the column modules 4200 can be connected to each other in series. Moreover, the separation of carbon dioxide from the organic solvent by the column module 4200 can be performed several times. For example, the first column module 4200a is coupled to the separation module 4100 to first filter the organic solvent from the carbon dioxide. Next, the second column module 4200b is connected to the first column module 4200a to filter the organic solvent from carbon dioxide for the second time.

Alternatively, the column modules 4200 can be connected in parallel with each other. Here, it may take a long time to separate the organic solvent using the column module 4200. Moreover, it may be difficult to filter a large amount of carbon dioxide using the column module 4200. However, when a plurality of column modules are placed in parallel with each other, a large amount of carbon dioxide can be filtered. For example, each of the first column module 4200a, the second column module 4200b, and the third column module 4200c is connected to the separation module 4100 to filter organic solvent from carbon dioxide, thereby providing carbon dioxide. To the supercritical fluid supply unit 3000.

9 is a cross-sectional view of the separation module 4100 of FIG. The separation module 4100 can include a separation tank 4110, a cooling member 4120, an inflow tube 4130, an exhaust pipe 4140, a drain pipe 4150, and a pressure regulator 4160.

The separation tank 4110 provides a space in which carbon dioxide and an organic solvent are separated from each other. The cooling member 4120 is disposed between the inner wall and the outer wall of the separation groove 4110 to cool the separation groove 4110. Cooling component 4120 can be implemented for cooling But the pipeline of water flow.

The carbon dioxide discharged from the second processing module 2500 is introduced into the inflow pipe 4130. When the separation module 4100 is provided in plural, the carbon dioxide discharged from the previous separation module 4100 can be introduced into the inflow pipe 4130. The inflow pipe 4130 has an end through which carbon dioxide is supplied to a lower portion of the separation groove 4110. The carbon dioxide supplied to the lower portion of the separation tank 4110 is cooled by the cooling member 4120. Therefore, the organic solvent contained in the carbon dioxide is liquefied to separate the organic solvent from the carbon dioxide.

The separated carbon dioxide is discharged through the exhaust pipe 4140 connected to the upper portion of the separation tank 4110, and the liquid organic solvent is discharged through the drain pipe 4150 connected to the lower portion of the separation tank 4110. A valve V may be disposed in each of the inflow pipe 4130, the exhaust pipe 4140, and the drain pipe 4150 to control inflow and discharge.

The pressure regulator 4160 adjusts the internal pressure in the separation tank 4110. For example, the pressure regulator 4160 can be a reverse pressure regulator disposed in the exhaust pipe 4140.

10 is a view of the column module 4200 of FIG. The column module 4200 can include an absorption column 4210, a temperature maintaining member 4220, an inflow tube 4230, an exhaust tube 4240, and a concentration sensor 4250.

The absorption column 4210 provides a space in which the organic solvent is separated from the carbon dioxide. The absorbent material A is disposed within the absorbent column 4210. Here, the absorbing material A may be a material for absorbing an organic solvent. For example, the absorbent material A can be a zeolite. Carbon dioxide is introduced into the absorption column via an inflow tube 4230. The inflow tube 4230 can be coupled to the separation module 4100. When the column modules 4200 are provided in series, the inflow tubes 4230 can be connected to the previous column modules 4200. Carbon dioxide passes through the absorption column 4210 and is discharged to the exhaust pipe 4240.

The absorbing material A is supplied to carbon dioxide while carbon dioxide passes through the absorption column 4210 to absorb the organic solvent from the carbon dioxide. Therefore, the organic solvent contained in the carbon dioxide is removed to recycle the carbon dioxide. When carbon dioxide and organic solvents are separated from each other, heat may occur. Therefore, the temperature maintaining member 4220 can maintain the inside of the absorption column 4210 at a predetermined temperature so that the organic solvent can be easily separated from the carbon dioxide.

The concentration sensor 4250 can detect the concentration of the organic solvent contained in the carbon dioxide discharged from the absorption column 4210. The concentration sensor 4250 is disposed in the exhaust pipe 4240. When a plurality of absorber strings 4210 are provided in series, the concentration sensor 4250 can be disposed only in the last absorber string 4210. Of course, the concentration sensor 4250 can be disposed in each of the absorption strings 4210. Since the amount of the organic solvent that can be absorbed by the absorbing material A is limited, the absorbing material A can be exchanged when the concentration of the organic solvent contained in the carbon dioxide discharged through the concentration sensor 4250 is higher than the preset concentration. The carbon dioxide discharged from the column module 4200 is supplied to the supercritical fluid supply unit 3000.

Although in the present embodiment, the column module 4200 is connected to the separation module 4100 in the recycling unit 4000, the invention is not limited thereto. For example, when the separation module 4100 is omitted in the recycling unit 4000, the column module 4200 can be directly connected to the second processing chamber 2500.

Hereinafter, a substrate processing method using the substrate processing apparatus 100 according to the present invention will be described.

This is merely an example for convenience of description, and therefore, the substrate processing method, the supercritical fluid recycling method, and the supercritical fluid discharge method according to the present invention may use other substrate processing apparatuses capable of performing the same or similar functions as the substrate processing apparatus 100. Executing, but for processing substrates according to the present invention Except for device 100.

11 is a flow chart illustrating a substrate processing method in accordance with an embodiment of the present invention. The substrate processing method according to an embodiment of the present invention may be a cleaning step using a supercritical fluid.

The substrate processing method according to an embodiment of the present invention includes: transferring the substrate S from the carrier C located on the load port 1100 to the buffer chamber 2100 (S110); transferring the substrate S from the buffer chamber 2100 to the first processing chamber 2300 (S120); performing the first step (S130); transferring the first processing chamber 2300 to the second processing chamber 2500 (S140); performing the second step (S150); and the substrate S from the second processing chamber The chamber 2500 is transferred into the buffer chamber 2100 (S160); and the substrate S is transferred from the buffer chamber 2100 to the carrier C (170). Hereinafter, each of these steps will be described.

In operation S110, the indexing robot 1210 transfers the substrate S from the carrier C into the buffer chamber 2100.

The carrier C received from the externally transferred substrate S is placed on the load port 1100. A carrier opener (not shown) or an indexing robot 1210 opens the gate of the carrier C to cause the indexing robot 1210 to take the substrate S out of the carrier C. Next, the indexing robot 1210 transfers the substrate taken out from the carrier C into the buffer chamber 2100.

In operation S120, the transfer robot 2210 transfers the substrate S from the buffer chamber 2100 into the first processing chamber 2300.

When the substrate S is placed on the buffer slot of the buffer chamber 2100 by the index robot 1210, the transfer robot 2210 takes out the substrate S from the buffer slot. The transfer robot 2210 transfers the substrate S into the first processing chamber 2300.

In operation S130, the first processing chamber performs the first step. Figure 12 To illustrate a flow chart of a first step in accordance with an embodiment of the present invention.

In operation S131, the substrate S is placed on the support pin 2412 by the transfer robot 2210, and loaded on the spin head 2410. When the substrate S is placed on the support pin 2412, the clamp pin 2413 is moved from the pickup position to the fixed position to fix the substrate S. When the substrate S is seated, the fluid supply member 2420 supplies the fluid onto the substrate S in operation S132. Here, the spin head 2410 is rotated to rotate the substrate S while the fluid is supplied onto the substrate S. Therefore, the fluid can be uniformly supplied onto the entire surface of the substrate S. Moreover, the recovery container 2430 can be vertically moved to recover the fluid that has escaped from the substrate S due to the rotation of the substrate S after supplying the fluid onto the substrate S.

Specifically, in operation S132a (first chemical step), when the substrate S is seated, the first fluid supply member 2420a is moved from the standby position to the processing position to spray the first cleaning agent onto the substrate S. Therefore, particles, organic contaminants, metal impurities, and the like remaining on the substrate S can be removed. Here, the first inflow hole 2431a of the first recovery container 2430a can be moved to the same horizontal plane as the substrate S to recover the first cleaning agent.

Next, in operation S132b (first cleaning step), the first fluid supply member 2420a is moved to the standby position, and the second fluid supply member 2420b is moved from the standby position to the processing position to spray the rinsing agent. Therefore, the residue of the first cleaning agent remaining on the substrate S can be cleaned. Here, the second inflow hole 2431b of the second recovery container 2430b can be moved to the same horizontal plane as the substrate S to recover the rinsing agent.

Next, in operation S132c (first drying step), the second fluid supply part 2420b is returned to the standby position, and the third fluid supply part 2420c is moved from the standby position to the processing position to spray the organic solvent. Therefore, the rinsing agent remaining on the substrate S can be replaced with an organic solvent. Here, the third The third inflow hole 2431c of the recovery container 2430c can be moved to the same horizontal plane as the substrate S to recover the organic solvent. Moreover, carbon dioxide may be supplied in a state in which the organic solvent is heated at a temperature greater than room temperature or in a heated vapor state. Moreover, in operation S132c, the spin head 2410 can rotate the substrate S so that the organic solvent can be easily dried after completion of the spraying of the organic solvent.

The step of spraying the second cleaning agent by the fourth fluid supply part 2420d (second chemical step) and the step of spraying the rinsing agent by the second fluid supply part 2420b may be additionally performed between operation S132b and operation S132c (second cleaning step) . Here, the first cleaning agent and the second cleaning agent may be provided as components different from each other to effectively remove foreign substances different from each other, respectively.

Moreover, operation S132c may be omitted as necessary.

When the spraying of the fluid onto the substrate S is completed, the rotation of the spin head 2410 can be completed, and the clamping pin 2413 can be moved from the fixed position to the pickup position. In operation S133, the substrate S can be picked up by the transfer robot 2210, and the substrate S is unloaded from the spin head 2410.

In operation S140, the transfer robot 2210 transfers the substrate S from the first processing chamber 2300 to the second processing chamber 2500.

The transfer robot 2210 picks up the substrate S located on the spin head 2140 to take out the substrate from the first processing chamber 2300. The transfer robot 2210 transfers the substrate S into the second processing chamber 2500. The substrate S transferred into the second processing chamber 2500 is located on the support member 2530.

In operation S150, the second processing chamber 2500 performs the second step. Figure 13 is a flow chart illustrating a second step in accordance with an embodiment of the present invention.

In operation S151, the substrate S is loaded on the support member 2530 of the second processing chamber 2500. In operation S152, before loading the substrate S And thereafter, a critical state is formed within the outer casing 2510. Here, the critical state may indicate a state in which the temperature and the pressure exceed the critical temperature and the critical pressure, respectively.

In operation S152a, the heating member 2520 heats the inside of the outer casing 2510 to form a critical state. Therefore, the inside of the outer casing 2510 can be increased to a temperature greater than the critical temperature. Next, in operation S152b, an inert gas is introduced into the outer casing 2510 via the gas supply pipe 2560. Thus, the interior of the outer casing 2510 can be filled with an inert gas and increased to a pressure above the critical pressure.

In operation S153, when a critical state is formed, the supercritical fluid is supplied into the outer casing 2510 via the supercritical fluid supply pipe 2540. For example, operation S153 can be performed as follows.

First, in operation S153a, the supercritical fluid may be supplied from the lower portion of the outer casing 2510 via the lower supply pipe 2540b. Here, in operation S153b, the inert gas may be discharged to the outside via the discharge pipe 2550.

Since the supercritical fluid is continuously supplied and filled with the inert gas, the inside of the outer casing 2510 can be filled only with the supercritical fluid to form a supercritical fluid phenomenon.

When the supercritical phenomenon is formed, the supply of the supercritical fluid via the lower supply pipe 2540b is stopped in operation S153c to supply the supercritical fluid via the upper supply pipe 2540a in operation S153d. Therefore, the drying of the substrate S using the supercritical fluid can be performed quickly. In this step, since the inside of the outer casing 2510 is in a critical state, the substrate S can be less damaged or damaged, even if the supercritical fluid is directly sprayed onto the substrate S at a high speed.

When the substrate S is dried, the supercritical fluid is discharged in operation S154. Here, an inert gas may be supplied to the outer casing 2510 to discharge the supercritical fluid.

In the same case, since the substrate S is not sufficiently dried in operation S153, operations S153 and S154 can be repeatedly performed as necessary. Figure 14 is a view illustrating the supply and discharge of supercritical fluid. For example, the supercritical fluid may be supplied in operation S153 until the interior of the outer casing 2510 has a pressure of about 150 bar, and then the supercritical fluid may be discharged until the interior of the outer casing 2510 has a pressure of about 100 bar.

Moreover, according to the experiment, since the drying of the substrate S under the supercritical atmosphere and the inert atmosphere was observed, the removal rate of the isopropyl alcohol remaining on the circuit pattern of the substrate S was remarkably increased, in contrast, In the supercritical atmosphere, the substrate S is dried for a long time, so that two operations S153 and 154 can be repeatedly performed to increase the drying efficiency. Alternatively, operation S153 may be performed for a long time to dry the substrate S.

In operation S155, when the discharge of the supercritical fluid is completed, the inert gas is exhausted to reduce the internal pressure of the outer casing 2510.

Although the inert gas is used in the current embodiment to perform the second drying step, the invention is not limited thereto. For example, the second drying step can be performed using only the supercritical fluid without using an inert gas. Specifically, liquid carbon dioxide may be supplied first, and then, the hot carbon dioxide may be continuously heated to change the liquid carbon dioxide to gaseous carbon dioxide. The gaseous carbon dioxide can then be compressed to form a supercritical atmosphere.

When the supercritical fluid is used to dry the substrate S, generation of particles, static electricity, and pattern cracking occurring in the first drying step using isopropyl alcohol or in the spin drying step of the rotating substrate S can be prevented, and can also be prevented The generation of water marks on the surface of the substrate S improves the performance and yield of the semiconductor device.

In operation S160, the transfer robot 2210 transfers the substrate S from the second processing chamber 2500 into the buffer chamber 2100. When the second step is completed, the transfer robot 2210 unloads the substrate S from the support member 2530 to take out the substrate S from the second processing chamber 2500, thereby mounting the substrate S to the buffer chamber 2100. On the buffer slot.

In operations S120, S140, and S160, one or a whole of the substrate may be transferred by the arm 2213 of the transfer robot 2210 that is different from each other. For example, in each of operations S120, S140, and S160, the substrate S can be transferred by the arm 2213 of the transfer robot 2210 that is different from each other. Alternatively, the substrate S may be transferred by the same arm 2213 in operations S120 and S140, and the substrate S may be transferred by the different arms 2213 in operation S160. This operation is performed to prevent the hand of the arm 2213 from being contaminated because the substrate S has different states in operations S120, S140, and S160, so that secondary pollution is transferred to the substrate S of the next operation by the contaminated arm 2213. Specifically, in operation S120, the transferred substrate S may be the substrate S before the cleaning step is performed. Moreover, in operation S140, the substrate S may be an undried substrate. That is, foreign matter, detergent, rinsing agent or organic solvent may remain on the substrate S, and therefore, the hand of the arm 2213 may be contaminated by the above materials. Therefore, when the substrate S is picked up by the arm 2213 which is soiled by the above material in the second step, the substrate S may be contaminated again.

In operation S170, the indexing robot 1210 transfers the substrate S from the buffer chamber 2100 to the carrier C. The indexing robot 1210 holds the substrate S mounted on the buffer slot to mount the substrate on the slot of the carrier C. Here, operation S190 may be performed using an arm 1213 different from the arm 1213 for operating in S110. Therefore, as described above, the substrate S can be prevented from being contaminated. When all the substrates S are completely received, the carrier C can be transported to the outside by a suspended lift conveyor (OHT).

Figure 15 is a flow chart illustrating the steps for processing a substrate in accordance with another embodiment of the present invention. The substrate processing method according to another embodiment of the present invention may be a cleaning step using a supercritical fluid.

A supercritical fluid recycling method according to another embodiment includes: storing carbon dioxide (S210); changing carbon dioxide to a supercritical fluid (S220); performing a drying step (S230) using the supercritical fluid; recycling carbon dioxide (S240) And storing recycled carbon dioxide (S250). Hereinafter, each of these steps will be described.

In operation S210, carbon dioxide is stored in the storage tank 3100. Carbon dioxide is received from an external carbon dioxide supply source F or a recycle unit 4000 and stored in a liquid state. Here, carbon dioxide can be received in a gaseous state. Therefore, the first condenser 3300 can change the gaseous carbon dioxide to liquid carbon dioxide to supply the liquid carbon dioxide into the storage tank 3100.

In operation S220, the water supply tank 3200 changes carbon dioxide to a supercritical fluid. The water supply tank 3200 can receive carbon dioxide from the storage tank 3100 to change the carbon dioxide into a supercritical fluid. Specifically, carbon dioxide is discharged from the storage tank 3100 and moved into the water supply tank 3200. Here, carbon dioxide can be changed to gaseous carbon dioxide by changing the pressure. The second condenser 3400 and the pump 3500 are disposed in a line connecting the storage tank 3100 and the water supply tank 3200. The second condenser 3400 changes the gaseous carbon dioxide to liquid carbon dioxide, and the pump 3500 changes the liquid carbon dioxide to high pressure gaseous carbon dioxide to supply the high pressure gaseous carbon dioxide to the water supply tank 3200. The water supply tank 3200 heats the high pressure gaseous carbon dioxide to produce a supercritical fluid. A water supply tank 3200 provides the supercritical fluid to the second processing chamber 2500.

In operation S230, the second processing chamber 2500 performs a drying step using a supercritical fluid. The second processing chamber 2500 receives supercritical fluid from the water supply tank 3200 to dry the substrate S using the supercritical fluid. Here, the drying step may be the second drying step described above. The second processing chamber 2500 discharges the supercritical fluid during or after the drying step.

In operation S240, the recycling unit 4000 recirculates carbon dioxide.

In operation S241, the separation module 4100 cools the discharged supercritical fluid to separate the organic solvent from the supercritical fluid. When the supercritical fluid is introduced into the separation tank 4110, the cooling member 4120 cools the supercritical fluid to liquefy the organic solvent dissolved in the supercritical fluid, thereby separating the organic solvent. The organic solvent is discharged through a drain pipe 4150 disposed at a lower portion of the separation tank 4110, and the carbon dioxide separated from the organic solvent is separated via an upper exhaust pipe 4140 disposed at an upper portion of the separation tank 4110. In the separation by cooling the supercritical fluid, the internal temperature of the separation tank 4110 is important.

FIG. 16 is a graph illustrating the efficiency of the separation unit 4100, and FIG. 17 is a table illustrating the efficiency of the separation unit 4100. 16 and 17 illustrate the amount and efficiency of the organic solvent excreted when the separation unit 4110 has an internal temperature of about 10 ° C, about 20 ° C, and about 30 ° C. As described above, when the operation S241 is performed at a temperature of about 10 ° C, it is seen that the operation efficiency is improved by about 10% as compared with when the operation S241 is performed at a temperature of about 30 °C.

In operation S242, the column module 4200 again separates the organic solvent from the carbon dioxide, wherein the organic solvent is mainly separated by the separation module 4100. Supercritical fluid or gaseous carbon dioxide is introduced via the inflow tube 4230 to pass through the absorption column 4210 and then discharged into the exhaust pipe 4240. Here, carbon dioxide passes through the absorbent material A. In this step, the organic solvent dissolved in the carbon dioxide is absorbed in the absorbent material A. Therefore, the organic solvent is separated, and pure carbon dioxide is discharged through the exhaust pipe 4240. Therefore, carbon dioxide can be recycled through the above steps.

In operation S250, the recycling unit 4000 supplies the recycled carbon dioxide to the storage tank 3100. When the recycling step is completed, the dioxide will be oxidized. The carbon moves and is stored in the storage tank 3100. Here, the carbon dioxide discharged from the recirculation unit 4000 is in a gaseous state. Therefore, the gaseous carbon dioxide is changed to liquid carbon dioxide by the first condenser 3300 and stored in the storage tank 3100.

In the above substrate processing method according to the present invention, the steps performed in each embodiment are not essential. Thus, each embodiment can optionally include the steps described above. Additionally, the embodiments can be implemented by being separated or combined with one another. Moreover, the steps performed in each embodiment can be implemented by separate or combined with the steps performed in another embodiment.

Moreover, the steps performed in each embodiment are not necessarily performed continuously in accordance with the described order. For example, the steps described later may be performed prior to the steps previously described.

Moreover, the substrate processing method according to the present invention can be stored in a computer readable recording medium having a code or program for executing the substrate processing method.

According to the present invention, a supercritical fluid can be used to dry the substrate.

According to the present invention, a supercritical fluid can be used to dry the substrate to effectively perform the drying step and prevent damage to the substrate.

According to the present invention, the supercritical fluid used in the drying step can be recycled.

According to the invention, the supercritical fluid is cooled to separate the organic solvent.

According to the present invention, an absorbing material for absorbing an organic solvent can be used to separate the organic solvent from the fluid supplied as a supercritical fluid.

According to the present invention, the supercritical fluid can be reused in the drying step again to reduce the manufacturing cost and prevent environmental pollution from occurring.

The features of the present invention are not limited to the above features, and those skilled in the art Other features not described herein will be clearly understood from the description and the drawings.

Although specific embodiments of the invention have been shown and described, it will be understood that Such modifications, changes and substitutions may be made without departing from the spirit and scope of the invention, and such modifications, changes and substitutions are not limited by the foregoing embodiments and the accompanying drawings. Moreover, some or all of the above-described embodiments may be selectively combined and constructed so that various modifications are possible without limitation to the configuration and arrangement of the above embodiments.

100‧‧‧Devices for processing substrates

1000‧‧‧ index module

1100‧‧‧Load port

1200‧‧‧Transfer frame/transfer module

1210‧‧‧ indexing robot

1211‧‧‧Base

1212‧‧‧ Ontology

1213‧‧‧ Arm

1220‧‧‧ index track

2000‧‧‧Processing module

2100‧‧‧ buffer chamber

2200‧‧‧Transfer chamber

2210‧‧‧Transfer robot

2211‧‧‧Base

2212‧‧‧ Ontology

2213‧‧‧ Arm

2220‧‧‧Transport

2300‧‧‧First processing chamber

2310‧‧‧Shell

2400‧‧‧Processing unit

2410‧‧‧Rotating head

2411‧‧‧Support board

2412‧‧‧Support pin

2413‧‧‧Clamp pin

2414‧‧‧Rotary axis

2415‧‧‧Motor

2420‧‧‧ Fluid supply parts

2421‧‧‧Nozzles

2422‧‧‧Support

2423‧‧‧Support shaft

2424‧‧‧ drive

2430‧‧‧Recycling container

2430a‧‧‧First recycling container

2430b‧‧‧Second recycling container

2430c‧‧‧ third recycling container

2431‧‧‧Inflow hole

2431a‧‧‧First inflow hole

2431b‧‧‧Second inflow hole

2431c‧‧‧ third inflow hole

2432‧‧‧Recycling pipeline

2432a‧‧‧First recovery pipeline

2432b‧‧‧Second recovery pipeline

2432c‧‧‧ Third recovery pipeline

2440‧‧‧ lifting parts

2441‧‧‧ bracket

2442‧‧‧ Lifting shaft

2443‧‧‧ Lifts

2500‧‧‧Second processing chamber

2510‧‧‧Shell

2520‧‧‧heating parts

2530‧‧‧Support parts

2540‧‧‧Supercritical fluid supply tube

2540a‧‧‧Upper supply tube

2540b‧‧‧Lower supply tube

2550‧‧‧Exhaust pipe/exhaust pipe

2550a‧‧‧Draining tube

2550b‧‧‧Draining tube

2560‧‧‧ gas supply pipe

3000‧‧‧Supercritical Fluid Supply Unit

3100‧‧‧ storage tank

3200‧‧‧Water supply tank

3300‧‧‧First condenser

3400‧‧‧second condenser

3500‧‧‧ pump

4000‧‧‧Recycling unit

4100‧‧‧Separation module

4100a‧‧‧First separation module

4100b‧‧‧Second separation module

4110‧‧‧Separation tank

4120‧‧‧ Cooling parts

4130‧‧‧Inflow pipe

4140‧‧‧Exhaust pipe

4150‧‧‧Drainage pipe

4160‧‧‧pressure regulator

4200‧‧‧Pipe module

4200a‧‧‧First column module

4200b‧‧‧Second column module

4200c‧‧‧Three column module

4210‧‧‧absorbing column

4220‧‧‧ Temperature maintenance unit

4230‧‧‧Inflow pipe

4240‧‧‧Exhaust pipe

4250‧‧‧ concentration sensor

A‧‧‧Absorbent materials

C‧‧‧ Carrier

F‧‧‧External carbon dioxide supply

G‧‧‧ gas supply source

S‧‧‧Substrate

X‧‧‧ first direction

Y‧‧‧second direction

Z‧‧‧ third direction

1 is a plan view of an apparatus for processing a substrate in accordance with an embodiment of the present invention.

2 is a cross-sectional view of the first processing chamber of FIG. 1.

Fig. 3 is a view illustrating a phase transition of carbon dioxide.

4 is a cross-sectional view of the second processing chamber of FIG. 1.

Figure 5 is a cross-sectional view of the second processing chamber of Figure 1 in accordance with another embodiment of the present invention.

Figure 6 is a view illustrating a circulation path of a supercritical fluid.

Figure 7 is a view of the recycling unit of Figure 6 in accordance with an embodiment of the present invention.

Figure 8 is a view of the recycling unit of Figure 6 in accordance with another embodiment of the present invention.

Figure 9 is a cross-sectional view of the separation module of Figure 7.

Figure 10 is a cross-sectional view of the column module of Figure 6.

Figure 11 is a flow chart illustrating the steps for processing a substrate in accordance with an embodiment of the present invention.

Figure 12 is a flow chart illustrating the first step in accordance with an embodiment of the present invention.

Figure 13 is a flow chart illustrating a second step in accordance with an embodiment of the present invention.

Figure 14 is a view illustrating the supply and discharge of a supercritical fluid.

Figure 15 is a flow chart illustrating the steps for processing a substrate in accordance with another embodiment of the present invention.

Figure 16 is a graph illustrating the efficiency of the separation unit.

Figure 17 is a table illustrating the efficiency of the separation unit.

100‧‧‧Devices for processing substrates

1000‧‧‧ index module

1100‧‧‧Load port

1200‧‧‧Transfer frame/transfer module

1210‧‧‧ indexing robot

1211‧‧‧Base

1212‧‧‧ Ontology

1213‧‧‧ Arm

1220‧‧‧ index track

2000‧‧‧Processing module

2100‧‧‧ buffer chamber

2200‧‧‧Transfer chamber

2210‧‧‧Transfer robot

2211‧‧‧Base

2212‧‧‧ Ontology

2213‧‧‧ Arm

2220‧‧‧Transport

2300‧‧‧First processing chamber

2310‧‧‧Shell

2500‧‧‧Second processing chamber

2510‧‧‧Shell

Claims (24)

An apparatus for processing a substrate, the apparatus comprising: a processing chamber in which a fluid provided as a supercritical fluid is used to dissolve an organic solvent remaining on a substrate to dry the substrate; and a recycling unit, Wherein the organic solvent is separated from the fluid discharged from the processing chamber to recycle the fluid. The apparatus of claim 1, wherein the recycling unit comprises a separation module for cooling the fluid, wherein the organic solvent is dissolved to separate the organic solvent from the fluid. The apparatus of claim 2, wherein the separation module is provided in plurality, and the plurality of separation modules are connected to each other in series. The apparatus of claim 2, wherein the separation module comprises: a separation tank into which the fluid discharged from the processing chamber is introduced; and a cooling member for cooling the separation tank; a drain pipe disposed in a lower portion of the separation tank to discharge the organic solvent liquefied and separated from the fluid; and a first exhaust pipe disposed in an upper portion of the separation tank to The fluid separated from the organic solvent is discharged. The apparatus of claim 4, wherein the separation module further comprises an inflow tube for supplying the fluid discharged from the processing chamber to the lower portion of the separation tank. The apparatus of claim 4, wherein the separation module further comprises a back pressure regulator disposed in the first exhaust pipe to constantly maintain an internal pressure of the separation tank. The apparatus of any one of claims 2 to 6, wherein the The recycling unit further includes a column module that provides an absorbing material for absorbing the organic module into the fluid discharged from the separation module to separate the organic solvent from the fluid. The apparatus of claim 7, wherein the column module is provided in plurality, and the plurality of column modules are connected to each other in series. The apparatus of claim 7, wherein the column module is provided in plurality, and the plurality of column modules are connected in parallel with each other. The apparatus of claim 7, wherein the column module comprises: an absorption column for supplying the absorbing material to the fluid discharged from the separation module; and a temperature maintaining member for Constantly maintaining an internal temperature of one of the absorption columns; and a second exhaust pipe for discharging the fluid separated from the organic solvent by the absorbing material. The device of claim 10, wherein the column module further comprises a concentration sensor, wherein the concentration sensor is disposed in the second exhaust pipe to detect the second exhaust pipe The concentration of one of the organic solvents in the fluid discharged. The apparatus of claim 7, wherein the absorbing material comprises zeolite. The apparatus of claim 1, wherein the recycling unit comprises a column module, the column module providing an absorbing material for absorbing the organic module to the fluid discharged from the processing chamber The organic solvent is separated from the fluid. A method for processing a substrate, the method comprising: Dissolving an organic solvent remaining on the substrate to dissolve the substrate using a fluid provided as a supercritical fluid; and separating the organic solvent from the fluid to recirculate the fluid. The method of claim 14, wherein the recycling of the fluid comprises cooling the fluid, wherein the organic solvent is dissolved to separate the organic solvent from the fluid. The method of claim 15, wherein the recycling of the fluid further comprises providing an absorbent material for absorbing the organic solvent into the fluid to separate the organic solvent from the fluid. An apparatus for processing a substrate, the apparatus comprising: a processing chamber, wherein a fluid provided as a supercritical fluid is used to dissolve an organic solvent remaining on the substrate to dry the substrate; and a storage tank Storing the fluid in a liquid state; a water supply tank receiving the fluid from the storage tank to produce the supercritical fluid and providing the supercritical fluid into the processing chamber; and a recycling unit, wherein the organic The solvent is separated from the fluid discharged from the processing chamber to recirculate the fluid, and the recycled fluid is supplied to the storage tank. The apparatus of claim 17, wherein the recycling unit comprises a separation module for cooling the fluid, wherein the organic solvent is dissolved to separate the organic solvent from the fluid. The apparatus of claim 18, wherein the recycling unit further comprises a column module, the column module providing an absorbing material for absorbing the organic module to be discharged from the separation module The fluid is separated from the fluid by the organic solvent. The device of claim 19, further comprising a first condensation And for changing the gaseous fluid discharged from the recycling unit to a liquid fluid to supply the liquid fluid into the storage tank. The apparatus of claim 20, further comprising: a second condenser for changing the gaseous fluid discharged from the storage tank to the liquid fluid; and a pump receiving the second condensation The liquid fluid supplies the liquid fluid to the water supply tank; and wherein, in the water supply tank, heating at a temperature greater than a critical temperature is performed by the pump at a pressure greater than a critical pressure The fluid to produce the supercritical fluid. A method for processing a substrate, the method comprising: storing a liquid fluid in a storage tank; changing the stored fluid to a supercritical fluid; and dissolving the residue using the fluid provided as the supercritical fluid An organic solvent on the substrate to dry the substrate; separating the organic solvent from the fluid, wherein the organic solvent is dissolved to recycle the fluid; and changing the recycled fluid to a liquid fluid to Fluid is supplied to the storage tank. The method of claim 22, wherein the recycling of the fluid comprises a first recycling step of cooling the fluid, wherein the organic solvent is dissolved to separate the organic solvent from the fluid. The method of claim 23, wherein the recycling of the fluid further comprises providing a absorbing material for absorbing the organic solvent into the fluid to separate the organic solvent from the fluid. step.