TWI756229B - 波長變換裝置 - Google Patents

波長變換裝置 Download PDF

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Publication number
TWI756229B
TWI756229B TW106119306A TW106119306A TWI756229B TW I756229 B TWI756229 B TW I756229B TW 106119306 A TW106119306 A TW 106119306A TW 106119306 A TW106119306 A TW 106119306A TW I756229 B TWI756229 B TW I756229B
Authority
TW
Taiwan
Prior art keywords
pulsed laser
wavelength
laser light
delay time
wavelength conversion
Prior art date
Application number
TW106119306A
Other languages
English (en)
Chinese (zh)
Other versions
TW201812422A (zh
Inventor
能丸圭司
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201812422A publication Critical patent/TW201812422A/zh
Application granted granted Critical
Publication of TWI756229B publication Critical patent/TWI756229B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/08—Construction or shape of optical resonators or components thereof
    • H01S3/08086—Multiple-wavelength emission
    • H01S3/0809—Two-wavelenghth emission
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/1006—Beam splitting or combining systems for splitting or combining different wavelengths

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
  • Lasers (AREA)
TW106119306A 2016-07-13 2017-06-09 波長變換裝置 TWI756229B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016138438A JP6698453B2 (ja) 2016-07-13 2016-07-13 波長変換装置
JP2016-138438 2016-07-13

Publications (2)

Publication Number Publication Date
TW201812422A TW201812422A (zh) 2018-04-01
TWI756229B true TWI756229B (zh) 2022-03-01

Family

ID=60995576

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106119306A TWI756229B (zh) 2016-07-13 2017-06-09 波長變換裝置

Country Status (4)

Country Link
JP (1) JP6698453B2 (ko)
KR (1) KR102213577B1 (ko)
CN (1) CN107639342B (ko)
TW (1) TWI756229B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4009018A4 (en) * 2019-08-02 2023-10-11 Ushio Denki Kabushiki Kaisha BROADBAND PULSED LIGHT SOURCE DEVICE, SPECTROMETRY DEVICE, SPECTROMETRY METHOD, AND SPECTROSCOPIC ANALYSIS METHOD
JP7355637B2 (ja) * 2019-12-16 2023-10-03 株式会社ディスコ 検出装置
CN114447752A (zh) * 2020-11-05 2022-05-06 中国科学院微电子研究所 波长可选择激光系统
CN112569477B (zh) * 2020-12-04 2022-07-29 锐可医疗科技(上海)有限公司 激光治疗仪及存储介质

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2379950Y (zh) * 1999-07-15 2000-05-24 赵珂 激光调整与转换装置
CN103296569A (zh) * 2013-06-25 2013-09-11 中国人民解放军国防科学技术大学 基于双波段种子源铒-镱共掺光纤放大器的超连续谱光源

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0212227A (ja) * 1988-06-30 1990-01-17 Hamamatsu Photonics Kk 光パルス発生装置
US6515792B1 (en) * 2000-04-12 2003-02-04 Massachusetts Institute Of Technology Fast optical wavelength shifter
JP2002151771A (ja) * 2000-11-10 2002-05-24 Mitsubishi Cable Ind Ltd 高出力パルス光発生装置
US7145715B2 (en) * 2004-09-23 2006-12-05 Lucent Technologies Inc. Multiple pump parametric apparatus having no idler broadening
JP4527488B2 (ja) 2004-10-07 2010-08-18 株式会社ディスコ レーザ加工装置
US7542490B2 (en) * 2006-04-25 2009-06-02 R. J. Dwayne Miller Reduction of surface heating effects in nonlinear crystals for high power frequency conversion of laser light
WO2008127451A2 (en) * 2006-12-01 2008-10-23 Cornell Research Foundation, Inc. Divided-pulse amplification of short pulses
WO2009093439A1 (ja) * 2008-01-21 2009-07-30 Panasonic Corporation 波長変換レーザ、画像表示装置、及びレーザ加工装置
US8309885B2 (en) * 2009-01-15 2012-11-13 Electro Scientific Industries, Inc. Pulse temporal programmable ultrafast burst mode laser for micromachining
JP5914329B2 (ja) * 2010-05-24 2016-05-11 ギガフォトン株式会社 固体レーザ装置およびレーザシステム
JP2013156448A (ja) * 2012-01-30 2013-08-15 Nikon Corp レーザ装置、露光装置及び検査装置
JP5964621B2 (ja) * 2012-03-16 2016-08-03 株式会社ディスコ レーザー加工装置
JP6287152B2 (ja) * 2013-12-12 2018-03-07 沖電気工業株式会社 光源装置、並びに相関光子対発生装置、偏光量子もつれ光子対発生装置、及び時間位置量子もつれ光子対発生装置
JP5679386B1 (ja) * 2014-02-24 2015-03-04 レーザーテック株式会社 レーザ光源装置、及び検査装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2379950Y (zh) * 1999-07-15 2000-05-24 赵珂 激光调整与转换装置
CN103296569A (zh) * 2013-06-25 2013-09-11 中国人民解放军国防科学技术大学 基于双波段种子源铒-镱共掺光纤放大器的超连续谱光源

Also Published As

Publication number Publication date
KR20180007683A (ko) 2018-01-23
JP2018010123A (ja) 2018-01-18
TW201812422A (zh) 2018-04-01
CN107639342A (zh) 2018-01-30
CN107639342B (zh) 2022-03-11
JP6698453B2 (ja) 2020-05-27
KR102213577B1 (ko) 2021-02-05

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