TWI756142B - Substrate cutting device and operating method of substrate cutting device - Google Patents

Abstract

A substrate cutting device is suitable for inspecting a plurality of packages after a package substrate is cut. The substrate cutting device includes a first stage, a first photography module, a second photography module, a first drying module, a second drying module, a transfer arm, and a movable bearing table. The first drying module and the second drying module can dry the packages, so that the residue of lotion can be avoided, thereby improving the detection accuracy. In addition, an operating method of a substrate cutting device can be applied to the aforementioned substrate cutting device, so that the movable stage does not need to be turned over during the operation process, thereby avoiding the problem of insufficient adsorption force and facilitating space planning.

Description

Substrate cutting device and operation method of substrate cutting device

The present invention relates to a semiconductor packaging equipment, in particular to a substrate cutting device and an operating method of the substrate cutting device.

In the process of packaging an integrated circuit (IC), a substrate is used to carry the integrated circuit, and then the substrate is cut according to a preset cutting line to form a plurality of packages. Since chips are generated in the process of cutting the package substrate, the packages need to be cleaned after cutting. In addition, defects such as chipping or cracking may occur during cutting, which reduces the quality and reliability of the final product. Therefore, it is also necessary to inspect the packages for defects after cutting, so as to avoid shipment of defective products. However, if the packages are inspected by image recognition after cleaning the packages, the detection accuracy is likely to be poor due to residual lotion.

Referring to FIG. 1 , a conventional substrate cutting apparatus is suitable for inspecting a plurality of packages 8 after a package substrate (not shown in the drawings) is cut into a plurality of packages 8 . Each package 8 includes a first surface 81 to be inspected and a second surface 82 opposite to the first surface 81 . A front-rear axis D1 and an up-down axis D2 perpendicular to the front-rear axis D1 are defined. The conventional substrate cutting device includes a first stage 91 , a first camera module 92 disposed behind the first stage 91 and photographed from bottom to top, and a first camera module 92 disposed behind the first camera module 92 And the second photographing module 93 that shoots from top to bottom, a second stage 94 located below the second photographing module 93, and a second stage 94 that can move along the front-rear axis D1 and can move up and down along the up-and-down axis D2. The transfer arm 95, and a movable carrying platform 96 which can move along the front and rear axis D1 and can be turned over around its own axis.

The transfer arm 95 can move between a first position, a second position, a third position, and a fourth position. In the first position, the transfer arm 95 is located above the first stage 91 and away from the first stage 91 . In the second position, the transfer arm 95 is located above the first stage 91 and approaches the first stage 91 . In the third position, the transmission arm 95 is located above the first camera module 92 and away from the first camera module 92 . In the fourth position, the transmission arm 95 is located above the first camera module 92 and approaches the first camera module 92 .

The movable stage 96 is movable between a fifth position and a sixth position. In the fifth position, the movable stage 96 is located above the first camera module 92 . In the sixth position, the movable stage 96 is located between the second camera module 96 and the second stage 94 .

Referring to FIGS. 2 and 3 , initially, the transfer arm 95 is lowered from the first position to the second position and the packages 8 are adsorbed by the first surfaces 81 of the packages 8 , so that the packages 8 The transfer arm 95 moves with it. Then, the transfer arm 95 moves backward from the first position to the third position. At the same time, the movable platform 96 is located at the fifth position and between the transfer arm 95 and the first camera module 92 . Next, referring to FIG. 4 and FIG. 5 , the transfer arm 95 first descends to the fourth position and releases the suction relationship with the packages 8 , and then rises to the third position again. In this way, the packages 8 are placed on the movable stage 96 . Then, the movable stage 96 absorbs the packages 8 from the second surfaces 81 of the packages 8 and turns over around its own axis, so that the first surfaces 81 of the packages 8 can be captured by the first camera module 81 Shoot and perform image recognition. Next, referring to FIGS. 6 and 7 , the movable stage 96 moves backward from the fifth position to the sixth position, and releases the suction relationship with the packages 8 , so that the packages 8 are carried placed on the second stage. Then, the movable stage 96 moves forward from the sixth position to the fifth position, so that the second surfaces 82 of the packages 8 can be photographed by the second camera module 93 for image recognition.

According to the aforementioned operation method, the first surface 81 and the second surface 82 of the packages 8 can be photographed by the first camera module 92 and the second camera module 93 for image recognition, so that defects can be effectively eliminated products and improve the reliability of the final product. However, since the movable stage 96 needs to be turned over during the actuation process, in order to overcome centrifugal force and gravity, the force for adsorbing the packages 8 needs to be higher than a certain level, otherwise the arrangement of the packages 8 will be affected, and even As a result, the packages 8 are thrown off. In addition, in terms of mechanism design, it is also necessary to give the movable support platform 96 an appropriate space to be turned over, which causes the problem of difficulty in space planning.

Therefore, an object of the present invention is to provide a substrate cutting device capable of improving detection accuracy.

Another object of the present invention is to provide an operating method of a substrate cutting device which can avoid insufficient adsorption force due to inversion during the operating process and is easy to perform space planning.

Therefore, the substrate cutting device of the present invention is suitable for inspecting a plurality of packages after a package substrate is cut into a plurality of packages. Each package includes a first surface to be inspected and a second surface opposite the first surface. The substrate cutting device includes a first stage, a first photography module, a second photography module, a first drying module, a second drying module, a transfer arm, and a movable bearing table.

A front-rear axis and an up-down axis perpendicular to the front-rear axis are defined. The first photographing module is disposed behind the first stage and shoots from bottom to top. The second camera module is arranged behind the first camera module and shoots from top to bottom. The first drying module is disposed between the first stage and the first photographing module along the front-rear direction and blows airflow from bottom to top. The second drying module is disposed between the first photographing module and the second photographing module along the front-rear direction and blows airflow from top to bottom. The transfer arm can move along the front-rear axis and can lift up and down along the up-down axis. The movable bearing platform can move along the front-rear axial direction.

The transfer arm can move between a first position, a second position, a third position, and a fourth position. In the first position, the transfer arm is above the first stage and away from the first stage. In the second position, the transfer arm is located above the first stage and approaches the first stage. In the third position, the transmission arm is located above the first camera module and away from the first camera module. In the fourth position, the transmission arm is located above the first camera module and approaches the first camera module.

The movable platform can move between a fifth position and a sixth position. In the fifth position, the movable stage is located above the first camera module. In the sixth position, the movable stage is located below the second camera module.

The operating method of the substrate cutting device of the present invention includes the following steps:

(A) Preparation of a substrate cutting device suitable for inspecting a package substrate after a package substrate is cut into a plurality of packages. Each package includes a first surface to be inspected and a second surface opposite the first surface. The substrate cutting device includes a first stage, a first photography module, a second photography module, a first drying module, a second drying module, a transfer arm, and a movable bearing table.

A front-rear axis and an up-down axis perpendicular to the front-rear axis are defined. The first photographing module is disposed behind the first stage and shoots from bottom to top. The second camera module is arranged behind the first camera module and shoots from top to bottom. The first drying module is disposed between the first stage and the first photographing module along the front-rear direction and blows airflow from bottom to top. The second drying module is disposed between the first photographing module and the second photographing module along the front-rear direction and blows airflow from top to bottom. The transfer arm can move along the front-rear axis and can lift up and down along the up-down axis. The movable bearing platform can move along the front-rear axial direction.

The transfer arm can move between a first position, a second position, a third position, and a fourth position. In the first position, the transfer arm is above the first stage and away from the first stage. In the second position, the transfer arm is located above the first stage and approaches the first stage. In the third position, the transmission arm is located above the first camera module and away from the first camera module. In the fourth position, the transmission arm is located above the first camera module and approaches the first camera module.

The movable platform can move between a fifth position and a sixth position. In the fifth position, the movable stage is located above the first camera module. In the sixth position, the movable stage is located below the second camera module.

(B) The transfer arm is lowered from the first position to the second position and the packages are adsorbed by the first surfaces of the packages, so that the packages move with the transfer arm.

(C) The transfer arm is raised from the second position to the first position, and then moved from the first position to the third position. During the process of moving the transfer arm from the first position to the third position, the first drying module dries the second surfaces of the packages.

(D) When the transfer arm absorbs the packages and is located at the third position, the first camera module photographs the second surfaces of the packages and performs image recognition.

(E) When the movable platform is located at the fifth position, the transfer arm descends from the third position to the fourth position and releases the suction relationship with the packages, so that the packages are placed on the event platform.

(F) The movable stage moves from the fifth position to the sixth position, so that the second camera module captures the first surfaces of the packages and performs image recognition. During the movement of the movable stage from the fifth position to the sixth position, the second drying module dries the first surfaces of the packages.

The effect of the present invention is that since the first drying module and the second drying module can dry the packages, the residue of lotion can be avoided, thereby improving the detection accuracy. In addition, when the transfer arm absorbs the packages and is located at the third position, the first camera module will photograph the second surfaces of the packages and perform image recognition, and the movable stage does not need to be operated during operation It can be turned over in the middle, thus avoiding the problem of insufficient suction force and easy space planning.

Referring to FIG. 8 , an embodiment of the substrate cutting device of the present invention is suitable for inspecting the packages 7 after a package substrate (not shown in the drawings) is cut into a plurality of packages 7 . Each package 7 includes a first surface 71 to be inspected and a second surface 72 opposite to the first surface 71 . For the sake of brevity, "an embodiment of the apparatus" will be used to represent "an embodiment of the substrate cutting apparatus of the present invention" in the relevant sections.

The device embodiment includes a first stage 1, a first photographing module 21, a second photographing module 22, a first drying module 31, a second drying module 32, a conveying arm 4, a The movable stage 5 , a first sensor 61 , and a second sensor 62 .

A front-rear axis X and an up-down axis Y perpendicular to the front-rear axis X are defined. The first camera module 21 is disposed behind the first stage 1 and shoots from bottom to top. The second camera module 22 is disposed behind the first camera module 21 and shoots from top to bottom. The first drying module 31 is disposed between the first stage 1 and the first photographing module 21 along the front-rear direction and blows airflow from bottom to top, and includes a first blowing component 311 and a first gas Heating assembly 312 . The second drying module 32 is disposed between the first photographing module 21 and the second photographing module 22 along the front-rear direction and blows airflow from top to bottom, and includes a second blowing component 321 and a second Gas heating assembly 322 .

The conveying arm 4 can move along the front-rear axis X and can lift up and down along the vertical axis Y, and has a heating module 41 embedded in the interior. The transfer arm 4 can move among a first position, a second position, a third position, and a fourth position. In the first position, the transfer arm 4 is located above the first stage 1 and away from the first stage 1 . In the second position, the transfer arm 4 is located above the first stage 1 and approaches the first stage 1 . In the third position, the transmission arm 4 is located above the first camera module 21 and away from the first camera module 21 . In the fourth position, the transmission arm 4 is located above the first camera module 21 and approaches the first camera module 21 .

The movable platform 5 can move between a fifth position and a sixth position along the front-rear axis X. In the fifth position, the movable stage 5 is located above the first camera module 21 . In the sixth position, the movable stage 5 is located below the second camera module 22 . The first sensor 61 is disposed above the first camera module 21 and is used to detect whether the movable stage 5 is located at the fifth position. The second sensor 62 is disposed below the second camera module 22 and is used to detect whether the movable stage 5 is located at the sixth position.

Referring to FIG. 9 , an embodiment of the operating method for cutting a substrate of the present invention includes steps S1 to S7 , and can be applied to the aforementioned apparatus embodiments. For the sake of brevity, "the method embodiment" will be referred to as "the embodiment of the operation method for cutting the substrate of the present invention" in the relevant sections.

In step S1, a substrate cutting device similar or identical to the device embodiment (as shown in FIG. 8) is prepared. Since the embodiment of the method is directly applied to the embodiment of the apparatus for description, for the sake of brevity, the description of the part of the structure will not be repeated, and the same element number will be cited for further description.

Referring to FIG. 10, step S2, the transfer arm 4 is lowered from the first position to the second position and the packages 7 are adsorbed by the first surface 71 of the packages 7, so that the packages 7 follow the Teleport arm 4 moves.

Referring to FIG. 11 , step S3 , the transfer arm 4 is raised from the second position to the first position, and then moved from the first position to the third position. During the process of moving the transfer arm 4 from the first position to the third position, the first drying module 31 blows dry the second surfaces 72 of the packages 7 . It should be noted that in this embodiment of the method, the first drying module 31 heats the gas through the first gas heating element 312 and blows the heated gas through the first blowing element 311 , and the conveying arm 4 has the The heating module 41 can further improve the drying efficiency of the packages 7 .

In step S4, when the transfer arm 4 adsorbs the packages 7 and is located at the third position, the first camera module 21 photographs the second surfaces 72 of the packages 7 and performs image recognition. It should be noted that, since the second surfaces 72 of the packages 7 have been blown dry by the first drying module 31 before the shooting, the image recognition using the first photographing module 21 will not be subjected to residual residues. Therefore, the detection accuracy can be improved.

It should be noted that, in order to prevent the movable stage 5 from hindering the first photographing module 21 from shooting in the step S4, the preset position of the movable stage 5 in this embodiment of the method is the sixth position. However, this is just an example, and the preset position of the movable stage 5 may also be other positions that will not hinder the shooting of the first camera module 21 , which should not be limited thereto.

Referring to FIG. 12, step S5, the movable platform 5 is moved from the sixth position to the fifth position. Referring to FIG. 13 again, when the movable platform 5 is located at the fifth position, the transfer arm 4 descends from the third position to the fourth position and releases the suction relationship with the packages 7, so that the The package body 7 is placed on the movable stage 5 .

Referring to FIG. 14 , step S6 , after the packages 7 are placed on the movable platform 5 , the transfer arm 4 is raised from the fourth position to the third position, so as to prevent the packages 7 from and the transfer arm 4 collision.

Referring to FIG. 15 , step S7 , the movable stage 5 is moved from the fifth position to the sixth position, so that the second camera module 22 captures the first surfaces 71 of the packages 7 and performs image recognition. During the movement of the movable stage 5 from the fifth position to the sixth position, the second drying module 32 blows dry the first surfaces 71 of the packages 7 . In this embodiment of the method, the second drying module 32 heats the gas through the second gas heating element 322 and blows the heated gas through the second blowing element 321 to improve the drying efficiency of the packages 7 .

It should be noted that, since the first surfaces 71 of the packages 7 have been blown dry by the second drying module 32 before the shooting, the second photographing module 22 will not be subjected to residual residues during image recognition. Therefore, the detection accuracy can be further improved.

In this way, the first surface 71 and the second surface 72 of the packages 7 are respectively photographed by the second camera module 22 and the first camera module 21 for image recognition, and are also passed through the heating mold before being photographed. The group 41 , the first drying module 31 and the second drying module 32 avoid residues of lotion and improve the detection accuracy, thereby effectively avoiding the shipment of defective packages 7 . In addition, the movable platform 5 does not need to be turned over during the actuation process, and naturally it is no longer necessary to consider the problems of insufficient adsorption force caused by centrifugal force and gravity, disturbed arrangement, and dropped components as in the prior art. In addition, compared with the prior art, this embodiment of the apparatus omits a carrier for receiving the packages 7 (refer to the second carrier 94 described in paragraph [0003]), thereby reducing the number of components. In addition, there is no need to prepare the movement space required for turning, which reduces the difficulty of mechanism design.

To sum up, in the substrate cutting device and the operating method of the substrate cutting device of the present invention, since the first drying module 31 and the second drying module 32 can blow dry the packages 7, lotion can be avoided. residues, thereby improving the detection accuracy. In addition, when the transfer arm 4 absorbs the packages 7 and is located at the third position, the first camera module 21 will photograph the second surfaces 72 of the packages 7 and perform image recognition. 5. It does not need to be turned over during the actuation process, so as to avoid the problem of insufficient adsorption force and easy to carry out space planning, so it can indeed achieve the purpose of the present invention.

However, the above are only examples of the present invention, and should not limit the scope of implementation of the present invention. Any simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the contents of the patent specification are still included in the scope of the present invention. within the scope of the invention patent.

1: The first stage 21: The first photography module 22: Second photography module 31: The first drying module 311: The first blowing component 312: First gas heating assembly 32: Second drying module 321: Second blower assembly 322: Second gas heating assembly 4: Teleport Arm 41: Heating module 5: Activity platform 61: First sensor 62: Second sensor 7: Package body 71: First Surface 72: Second Surface X: Front and rear axis Y: up and down axis S1~S7: Steps

Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, wherein: FIG. 1 is a schematic diagram of a structure of a conventional substrate cutting device and a plurality of packages; FIG. 2 is a schematic action diagram illustrating that a conveying arm of the conventional substrate cutting device is lowered from a first position to a second position; 3 is a schematic diagram of the operation, illustrating that the transfer arm of the conventional substrate cutting device moves backward from the first position to a third position, and a movable stage is positioned at a fifth position; 4 is a schematic diagram of the operation, illustrating that the transfer arm of the conventional substrate cutting device is lifted to the third position after the suction relationship with the packages is released at a fourth position; 5 is a schematic diagram of the operation, illustrating that the movable stage of the conventional substrate cutting device is turned over around its own axis; 6 is a schematic diagram of the operation, illustrating that the movable stage of the conventional substrate cutting device moves backward from the fifth position to a sixth position; 7 is a schematic diagram of the operation, illustrating that the movable stage of the conventional substrate cutting device releases the suction relationship with the packages, so that the packages are placed on a second stage, and the The sixth position is moved forward to the fifth position; 8 is a schematic structural diagram of a device embodiment of the substrate cutting device of the present invention and a plurality of packages; FIG. 9 is a block flow diagram of a method embodiment of the operating method for substrate cutting according to the present invention; 10 is a schematic diagram of an operation, illustrating that a conveying arm is lowered from a first position to a second position in an embodiment of the method; FIG. 11 is a schematic diagram of an operation, illustrating the movement of the transfer arm from the first position to a third position in the method embodiment; FIG. 12 is a schematic diagram of an operation, illustrating that a movable platform moves from a sixth position to a fifth position in the method embodiment; FIG. 13 is a schematic diagram of the operation, illustrating that the transfer arm is lowered from the third position to a fourth position in the method embodiment; FIG. 14 is a schematic diagram of the operation, illustrating that the transfer arm is raised from the fourth position to the third position in the embodiment of the method; and FIG. 15 is a schematic diagram of an operation, illustrating that the movable platform moves backward from the fifth position to the sixth position in the embodiment of the method.

1: The first stage

21: The first photography module

22: Second photography module

31: The first drying module

311: The first blowing component

312: First gas heating assembly

32: Second drying module

321: Second blower assembly

322: Second gas heating assembly

4: Teleport Arm

41: Heating module

5: Activity platform

61: First sensor

62: Second sensor

7: Package body

71: First Surface

72: Second Surface

X: Front and rear axis

Y: up and down axis

Claims (6)

A substrate cutting device is suitable for inspecting the packages after a package substrate is cut into a plurality of packages, each package includes a first surface to be inspected and a surface opposite to the first surface. The second surface, the substrate cutting device includes: a first stage; a first camera module, defining a front-rear axis and an up-down axis perpendicular to the front-rear axis, the first camera module is disposed behind the first stage and shoots from bottom to top; a second camera module, disposed behind the first camera module and shooting from top to bottom; a first drying module, disposed between the first stage and the first photographing module along the front-rear direction and blowing airflow from bottom to top; a second drying module, disposed between the first photographing module and the second photographing module along the front-rear direction and blowing airflow from top to bottom; a conveying arm, which can move along the front-rear axis and lift up and down along the up-down axis; and a movable bearing platform, which can move along the front and rear axis; The transfer arm is movable between a first position, a second position, a third position, and a fourth position. In the first position, the transfer arm is located above the first stage and away from the first position A stage, in the second position, the transfer arm is located above the first stage and approaching the first stage, in the third position, the transfer arm is positioned above the first camera module and away from When the first camera module is in the fourth position, the transmission arm is located above the first camera module and approaches the first camera module, The movable stage is movable between a fifth position and a sixth position. In the fifth position, the movable stage is located above the first camera module, and in the sixth position, the movable stage is located below the second camera module. The substrate cutting device according to claim 1, wherein the transfer arm has a heating module embedded therein. The substrate cutting device according to claim 1, further comprising a first sensor disposed above the first camera module and used for detecting whether the movable stage is located at the fifth position, and a first sensor disposed on the A second sensor below the second camera module and used for detecting whether the movable platform is located at the sixth position. The substrate cutting device according to claim 1, wherein the first drying module includes a first blowing component and a first gas heating component, the second drying module includes a second blowing component, and a A second gas heating assembly. An operating method of a substrate cutting device, comprising the following steps: (A) Prepare a substrate cutting device suitable for inspecting the packages after a package substrate is cut into a plurality of packages, each package including a first surface to be inspected and a surface opposite to the package. The second surface of the first surface, the substrate cutting device includes: a first stage, a first camera module, defining a front-rear axis and an up-down axis perpendicular to the front-rear axis, the first camera module is disposed behind the first stage and shoots from bottom to top, a second camera module, disposed behind the first camera module and shooting from top to bottom, A first drying module is arranged between the first stage and the first photographing module along the front-rear direction and blows airflow from bottom to top, A second drying module is disposed between the first photographing module and the second photographing module along the front-rear direction and blows airflow from top to bottom, a conveying arm that can move along the front-rear axis and can lift up and down along the up-down axis, and a movable bearing platform, which can move along the front and rear axis, The transfer arm is movable between a first position, a second position, a third position, and a fourth position. In the first position, the transfer arm is located above the first stage and away from the first position A stage, in the second position, the transfer arm is located above the first stage and approaching the first stage, in the third position, the transfer arm is positioned above the first camera module and away from When the first camera module is in the fourth position, the transmission arm is located above the first camera module and approaches the first camera module, The movable stage is movable between a fifth position and a sixth position. In the fifth position, the movable stage is located above the first camera module, and in the sixth position, the movable stage is located below the second camera module; (B) the transfer arm is lowered from the first position to the second position and the packages are adsorbed by the first surface of the packages, so that the packages move with the transfer arm; (C) The transfer arm is raised from the second position to the first position, and then moved from the first position to the third position. During the process of moving the transfer arm from the first position to the third position, the first position A drying module blows dry the second surfaces of the packages; (D) when the transfer arm absorbs the packages and is located at the third position, the first camera module photographs the second surfaces of the packages and performs image recognition; (E) When the movable platform is located at the fifth position, the transfer arm descends from the third position to the fourth position and releases the suction relationship with the packages, so that the packages are placed at the event platform; (F) The movable stage moves from the fifth position to the sixth position, so that the second camera module captures the first surfaces of the packages and performs image recognition, and the movable stage moves from the fifth position to During the sixth position, the second drying module dries the first surfaces of the packages. The operating method of the substrate cutting device according to claim 5, further comprising a step (I) after the packages are placed on the movable stage, the transfer arm is raised from the fourth position to the third position , so as to prevent the packages from colliding with the transfer arm.

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