TWI756038B - 粗糙化處理銅箔、附有載體銅箔、覆銅層壓板及印刷配線板 - Google Patents

粗糙化處理銅箔、附有載體銅箔、覆銅層壓板及印刷配線板 Download PDF

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Publication number
TWI756038B
TWI756038B TW110103167A TW110103167A TWI756038B TW I756038 B TWI756038 B TW I756038B TW 110103167 A TW110103167 A TW 110103167A TW 110103167 A TW110103167 A TW 110103167A TW I756038 B TWI756038 B TW I756038B
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TW
Taiwan
Prior art keywords
copper foil
roughened
filter
carrier
less
Prior art date
Application number
TW110103167A
Other languages
English (en)
Chinese (zh)
Other versions
TW202134482A (zh
Inventor
細川眞
髙梨哲聡
溝口美智
平岡慎哉
Original Assignee
日商三井金屬鑛業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商三井金屬鑛業股份有限公司 filed Critical 日商三井金屬鑛業股份有限公司
Publication of TW202134482A publication Critical patent/TW202134482A/zh
Application granted granted Critical
Publication of TWI756038B publication Critical patent/TWI756038B/zh

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
    • C23C2222/20—Use of solutions containing silanes

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
TW110103167A 2020-02-04 2021-01-28 粗糙化處理銅箔、附有載體銅箔、覆銅層壓板及印刷配線板 TWI756038B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-016981 2020-02-04
JP2020016981 2020-02-04

Publications (2)

Publication Number Publication Date
TW202134482A TW202134482A (zh) 2021-09-16
TWI756038B true TWI756038B (zh) 2022-02-21

Family

ID=77199987

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110103167A TWI756038B (zh) 2020-02-04 2021-01-28 粗糙化處理銅箔、附有載體銅箔、覆銅層壓板及印刷配線板

Country Status (5)

Country Link
JP (1) JP7177956B2 (ko)
KR (1) KR20220106199A (ko)
CN (1) CN115038818A (ko)
TW (1) TWI756038B (ko)
WO (1) WO2021157363A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102480377B1 (ko) * 2018-08-10 2022-12-23 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판
EP4391734A1 (en) * 2022-12-21 2024-06-26 JX Metals Corporation Copper foil, laminate, and flexible printed wiring board

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1322259A (zh) * 1999-09-21 2001-11-14 三井金属鉱业株式会社 带载体箔的电解铜箔及其制造方法和使用该带载体箔的电解铜箔的敷铜层压板
TW201718948A (zh) * 2015-07-03 2017-06-01 Mitsui Mining & Smelting Co 粗糙化處理銅箔、貼銅層積板及印刷電路板
CN107002265A (zh) * 2015-01-22 2017-08-01 三井金属矿业株式会社 带载体的极薄铜箔及其制造方法
CN109072472A (zh) * 2016-04-14 2018-12-21 三井金属矿业株式会社 表面处理铜箔、带载体铜箔、以及使用它们的覆铜层叠板及印刷电路板的制造方法
CN110546313A (zh) * 2017-04-25 2019-12-06 古河电气工业株式会社 表面处理铜箔

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3392066B2 (ja) * 1998-01-19 2003-03-31 三井金属鉱業株式会社 複合銅箔およびその製造方法並びに該複合銅箔を用いた銅張り積層板およびプリント配線板
JP2005048277A (ja) * 2003-07-15 2005-02-24 Mitsui Mining & Smelting Co Ltd キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法
KR20130126666A (ko) * 2010-12-14 2013-11-20 쓰리엠 이노베이티브 프로퍼티즈 컴파니 이미지 및 이의 제조 방법
MY183238A (en) * 2015-03-24 2021-02-18 Mitsui Mining & Smelting Co Ltd Ultra-thin copper foil with carrier, manufacturing method therefor, copper-clad laminate, and printed wiring board
JP6200042B2 (ja) 2015-08-06 2017-09-20 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
WO2018110579A1 (ja) 2016-12-14 2018-06-21 古河電気工業株式会社 表面処理銅箔および銅張積層板
KR102480377B1 (ko) * 2018-08-10 2022-12-23 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1322259A (zh) * 1999-09-21 2001-11-14 三井金属鉱业株式会社 带载体箔的电解铜箔及其制造方法和使用该带载体箔的电解铜箔的敷铜层压板
CN107002265A (zh) * 2015-01-22 2017-08-01 三井金属矿业株式会社 带载体的极薄铜箔及其制造方法
TW201718948A (zh) * 2015-07-03 2017-06-01 Mitsui Mining & Smelting Co 粗糙化處理銅箔、貼銅層積板及印刷電路板
CN109072472A (zh) * 2016-04-14 2018-12-21 三井金属矿业株式会社 表面处理铜箔、带载体铜箔、以及使用它们的覆铜层叠板及印刷电路板的制造方法
CN110546313A (zh) * 2017-04-25 2019-12-06 古河电气工业株式会社 表面处理铜箔

Also Published As

Publication number Publication date
JPWO2021157363A1 (ko) 2021-08-12
WO2021157363A1 (ja) 2021-08-12
TW202134482A (zh) 2021-09-16
JP7177956B2 (ja) 2022-11-24
CN115038818A (zh) 2022-09-09
KR20220106199A (ko) 2022-07-28

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