TWI755718B - Lens packaging module and method for manufacturing the same - Google Patents

Abstract

A method for manufacturing a lens packaging module, including: providing a circuit board, wherein the circuit board has a first optical channel; mounting at least one surface bonding element on the circuit board, and electrically connecting the surface bonding element and the circuit board; placing the circuit board with the surface bonding element in a mold and injecting glue to form a sealant layer, wherein the sealant layer covers the surface bonding element on the circuit board, and the sealant layer includes a second optical channel facing the first optical channel; performing surface treatment on the circuit board after forming the sealant layer; and providing a filter element and fixing the filter element in the second light channel, wherein the filter element faces the first light channel. The disclosure also relates to a lens packaging module. The lens packaging module and the manufacturing method thereof provided by the present disclosure can improve the pollution and damage to the chip during the glue injection process and can reduce the cost.

Description

Lens packaging module and method of making the same

The invention relates to a lens packaging module and a manufacturing method thereof.

In the process of assembling cameras and image recognition modules, dust and glue contamination on photosensitive/light-emitting elements and filter elements are the main defects affecting product quality, and they are also the biggest production yield loss factors. These defects are usually only after the completion of Lenses and refractors are easily detected after they are adhered. Due to irreversible factors in the manufacturing process, scrapping is often the only way to deal with these defective products.

裂、切割崩缺在模組製程中通常採用單一基板，多顆放置於矩陣載盤中進行封裝加工，造成封裝成本居高不下。 Ceramic substrates are the most common substrate materials for cameras and image recognition modules based on their high strength, high thermal conductivity, high thermal cycle performance, high insulation, and low thermal expansion coefficient.

Cracks and dicing chips usually use a single substrate in the module manufacturing process, and multiple chips are placed in the matrix carrier for packaging processing, resulting in high packaging costs.

In view of this, the present invention provides a lens packaging module which can improve the contamination and damage of the chip during the glue injection process and can reduce the cost.

It is also necessary to provide a manufacturing method of the above-mentioned lens packaging module.

A lens packaging module, comprising: a circuit board, the circuit board has a first optical channel; at least one surface-attached element, the surface-attached element is located on the circuit board and is electrically connected with the circuit board; a an encapsulant layer, the encapsulant layer is formed on the circuit board and covers the surface-attached element; the encapsulant layer includes a second light channel, and the second light channel faces the first light channel; and a filter element; the filter element is fixed in the second optical channel and faces the first optical channel.

Further, the circuit board further includes at least one accommodating groove, the surface bonding element is accommodated in the accommodating groove and is electrically connected with the circuit board, and the encapsulant layer is filled in the inner wall of the accommodating groove and the circuit board. The surfaces are joined between elements.

Further, the encapsulant layer further includes a step portion, and the step portion extends from the inner wall of the second optical channel to the center of the second optical channel.

Further, the encapsulant layer also covers the inner wall of the first optical channel.

Further, the filter element is fixed on the step portion.

Further, the filter element is formed on the circuit board.

Further, the lens packaging module further includes a photosensitive/light-emitting element and a lens element, and the photosensitive/light-emitting element is fixed in the groove, faces the filter element, and is electrically connected to the circuit board; The lens element is formed on the encapsulant layer and faces the filter element.

A manufacturing method of a lens packaging module, comprising: providing a circuit board, the circuit board has a first optical channel; mounting at least one surface-attached element on the circuit board, and electrically connecting the surface-attached element and the the circuit board; placing the circuit board with the surface-attached elements in a mold and injecting glue to form an encapsulant layer covering the surface-attached elements on the circuit board, the The encapsulant layer includes a second optical channel, the second optical channel is facing the first optical channel; the surface treatment is performed on the circuit board after the encapsulant layer is formed; and a filter element is provided, and the The filter element is fixed in the second optical channel and faces the first optical channel.

Further, the circuit board further includes at least one accommodating groove, the surface bonding element is accommodated in the accommodating groove and is electrically connected with the circuit board, and the encapsulant layer is filled in the inner wall of the accommodating groove and the circuit board. The surfaces are joined between elements.

Further, the encapsulant layer further includes a step portion, and the step portion extends from the inner wall of the second optical channel to the center of the second optical channel.

In the lens packaging module and the manufacturing method of the lens packaging module provided by the present invention, 1) firstly, the surface-attached components are packaged on the circuit board by the method of sealing and injection molding, and after surface treatment, the filter is placed components, which can improve the pollution and damage of the filter components during the glue injection process, and achieve the purpose of protecting the passive components (surface-attached components), and avoid the surface-attached components from being damaged during the placement of the filter components or during the dispensing process; The circuit board with optical channels and grooves can replace the ceramic substrate in the prior art, which can reduce the packaging cost.

100,200,300: Lens packaging module

10: circuit board

101: First Surface

102: Second Surface

11: Substrate

12: The first optical channel

13: Groove

14: Conductive circuit layer

141: First pad

142: Second pad

143: Third pad

15: Containment slot

20: Surface-attached components

30: sealant layer

31: The second optical channel

32: Step part

40: Photosensitive/Light-emitting element

50: Conductive block

60: filter element

61: Viscose layer

70: Lens Assembly

FIG. 1 is a cross-sectional view of a circuit board according to a preferred embodiment of the present invention.

FIG. 2 is a cross-sectional view of the circuit board shown in FIG. 1 after mounting at least one surface-attached component.

FIG. 3 is a cross-sectional view of the circuit board shown in FIG. 2 after forming an encapsulant layer covering the surface-bonded components.

FIG. 4 is a cross-sectional view of a photosensitive/light-emitting element formed on the circuit board shown in FIG. 3 by flip-chip technology.

FIG. 5 is a cross-sectional view of fixing a filter element in the encapsulant layer shown in FIG. 4 .

FIG. 6 is a cross-sectional view after a lens assembly is fixed in the sealing compound layer shown in FIG. 5 to form a lens packaging module.

7 is a cross-sectional view of the lens packaging module provided by the second embodiment of the present invention.

FIG. 8 is a cross-sectional view of the lens packaging module provided by the third embodiment of the present invention.

In order to further illustrate the technical means and effects adopted by the present invention to achieve the predetermined purpose of the invention, the following describes the specific implementation, structure, The features and their effects are described in detail as follows. Obviously, the described embodiments are only some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

It should be noted that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. when an element is considered is "disposed on" another element, which may be disposed directly on the other element or may also coexist with a centrally disposed element.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Please refer to FIGS. 1-6, the present invention provides a manufacturing method of a lens packaging module 100, including the steps:

The first step, referring to FIG. 1 , provides a circuit board 10 .

The circuit board 10 includes a first surface 101 and a second surface 102 opposite to the first surface 101 .

The circuit board 10 further includes a first optical channel 12 and a groove 13 , and the first optical channel 12 communicates with the groove 13 . The first light channel 12 is recessed from the first surface 101 to the second surface 102 . The groove 13 is recessed from the second surface 102 to the first surface 101 .

The circuit board 10 further includes a base material 11 and at least one conductive circuit layer 14 embedded in the base material 11 . The conductive circuit layer 14 includes at least one first pad 141 , at least one second pad 142 and at least one third pad 143 . The first pad 141 is exposed from the first surface 101 , the second pad 142 is exposed from the groove 13 , and the third pad 143 is exposed from the second surface 102 exposed.

In the second step, referring to FIG. 2 , at least one surface-attached component 20 is mounted on the first surface 101 of the circuit board 10 , and the surface-attached component 20 is electrically connected to the circuit board 10 .

The third step, please refer to FIG. 3 , form an encapsulant layer 30 covering the surface-attached element 20 on the circuit board 10 , and perform surface treatment on the circuit board 10 with the encapsulant layer 30 deal with.

Wherein, the encapsulant layer 30 includes a second optical channel 31 , and the second optical channel 31 faces the first optical channel 12 . In this embodiment, the size of the second optical channel 31 is larger than that of the first optical channel 12 .

In this embodiment, the encapsulant layer 30 further includes a step portion 32 , and the step portion 32 extends from the inner wall of the second optical channel 31 to the center of the second optical channel 31 .

In this embodiment, the distance between the surface-mounted component 20 and the side edge of the circuit board 10 is greater than or equal to 50um, and the size is mainly for placing passive components (surface-mounted component 20 ) during the mounting process. The points that need to be considered in the setting of the dimensions are: tolerance of passive components, tolerance of substrate openings, optical recognition accuracy and mechanical accuracy of mounting passive components (surface-attached component 20).

The surface treatment is to remove mold wax and dust on the surface of the circuit board 10 with the encapsulant layer 30, so as to improve the pollution and damage of the filter element during the glue injection process.

In this embodiment, the surface treatment is plasma cleaning.

The fourth step, please refer to FIG. 4 , provide a photosensitive/light-emitting element 40 , fix the photosensitive/light-emitting element 40 in the groove 13 and electrically connect the photosensitive/light-emitting element 40 with the circuit board 10 .

In this embodiment, the photosensitive/light emitting element 40 is fixed in the groove 13 by flip chip.

In this embodiment, the photosensitive/light emitting element 40 is electrically connected to the second pad 142 through at least one conductive block 50 .

In this embodiment, the surface of the photosensitive/light-emitting element 40 away from the second pad 142 is lower than the second surface 102 .

The fifth step, referring to FIG. 5 , provides a filter element 60 , and fixes the filter element 60 in the second optical channel 31 and faces the first optical channel 12 .

In this embodiment, the filter element 60 is fixed on the stepped portion 32 .

The sixth step, referring to FIG. 6 , provides a lens element 70 , and fixes the lens element 70 on the surface of the encapsulant layer 30 away from the first surface 101 .

Wherein, the lens element 70 faces the filter element 60 .

The lens element 70 may be a lens module or a voice coil motor.

Referring to FIG. 6 , the first embodiment of the present invention further provides a lens packaging module 100 , the lens packaging module 100 includes a circuit board 10 , at least one surface bonding element 20 , an encapsulant layer 30 , a photosensitive/luminous Element 40 , a filter element 60 and a lens element 70 . The surface-attached element 20 is formed on the circuit board 10 , the encapsulant layer 30 is formed on the circuit board 10 and covers the surface-attached element 20 , and the photosensitive/light-emitting element 40 is embedded in the circuit board 10 . In the circuit board 10 , the filter element 60 is fixed in the second light channel 31 of the encapsulant layer 30 and is opposite to the photosensitive/light-emitting element 40 , and the lens element 70 is located in the encapsulant layer 30 above and facing the filter element 60 .

The circuit board 10 includes a first surface 101 and a second surface 102 opposite to the first surface 101 .

The circuit board 10 further includes a first optical channel 12 and a groove 13 , and the first optical channel 12 communicates with the groove 13 . The first light channel 12 is recessed from the first surface 101 to the second surface 102 . The groove 13 is recessed from the second surface 102 to the first surface 101 .

The circuit board 10 further includes a base material 11 and at least one conductive circuit layer 14 embedded in the base material 11 . The conductive circuit layer 14 includes at least one first pad 141 , at least one second pad 142 and at least one third pad 143 . The first pad 141 is exposed from the first surface 101 , the second pad 142 is exposed from the groove 13 , and the third pad 143 is exposed from the second surface 102 exposed.

Wherein, the surface-attached element 20 is on the first surface 101 of the circuit board 10 and is electrically connected to the circuit board 10 .

Wherein, the encapsulant layer 30 is located on the first surface 101 and covers the surface-attached element 20 .

Wherein, the encapsulant layer 30 includes a second optical channel 31 , and the second optical channel 31 faces the first optical channel 12 . In this embodiment, the size of the second optical channel 31 is larger than that of the first optical channel 12 .

In this embodiment, the encapsulant layer 30 further includes a step portion 32 , and the step portion 32 extends from the inner wall of the second optical channel 31 to the center of the second optical channel 31 .

In this embodiment, the distance d between the surface-mounted component 20 and the side edge of the circuit board 10 is greater than or equal to 50um, and the main purpose of setting the d is to set passive components ( The surface is attached to the element 20), and the points to be considered when setting the d include: the tolerance of the passive element, the tolerance of the opening of the substrate, the recognition accuracy and mechanical accuracy of the passive element, and the like.

Wherein, the photosensitive/light-emitting element 40 is fixed in the groove 13 and is electrically connected to the circuit board 10 .

In this embodiment, the photosensitive/light emitting element 40 is electrically connected to the second pad 142 through at least one conductive block 50 .

In this embodiment, the surface of the photosensitive/light-emitting element 40 away from the second pad 142 is lower than the second surface 102 .

The filter element 60 is fixed in the second optical channel 31 and faces the first optical channel 12 .

In this embodiment, the filter element 60 is fixed on the stepped portion 32 .

In this embodiment, the filter element 60 is fixed on the step portion 32 by an adhesive layer 61 .

In this embodiment, the filter element 60 is an infrared filter for filtering infrared light.

Wherein, the lens element 70 is fixed on the surface of the encapsulant layer 30 away from the first surface 101 .

Wherein, the lens element 70 faces the filter element 60 .

The lens element 70 may be a lens module or a voice coil motor.

Referring to FIG. 7 , the second embodiment of the present invention provides a lens packaging module 200 . The lens packaging module 200 is similar in structure to the lens packaging module 100 , and the only difference is that: the circuit board 10 is also At least one receiving groove 15 is included, and the receiving groove 15 is formed concavely from the first surface 101 to the second surface 102 , and the surface-attached element 20 is received in the receiving groove 15 and is connected with the receiving groove 15 . The circuit board 10 is electrically connected, and the encapsulant layer 30 is filled between the inner wall of the receiving groove 15 and the surface-attached element 20 and covers the surface-attached element 20 . In this embodiment, a step portion is not formed in the second optical channel 31 of the encapsulant layer 30 , and the filter element 60 is accommodated in the second optical channel 31 and located on the circuit board 10 . on the first surface 101.

In the second embodiment, a manufacturing method of the lens packaging module 200 is also provided, which is similar to the manufacturing method of the lens packaging module 100, and the difference is only that: in the first step, the provided circuit board 10 further includes At least one receiving slot 15 is provided. In the second step, the surface-attached element 20 is accommodated in the receiving groove 15 , and soldering and infrared reflow are performed on the exposed surface of the surface-attached element 20 to bond the surface-attached element 20 with the surface-attached element 20 . The circuit board 10 is electrically connected. In the third step, the encapsulant layer 30 is filled between the inner wall of the receiving groove 15 and the surface-attached element 20 and covers the surface-attached element 20 .

Referring to FIG. 8 , a third embodiment of the present invention provides a lens packaging module 300 . The lens packaging module 300 is similar in structure to the lens packaging module 100 , and the only difference is that the sealing compound layer 30 is also The inner wall of the first optical channel 12 is covered.

In the lens packaging module and the manufacturing method of the lens packaging module provided by the present invention, 1) the surface-attached components are firstly packaged on the circuit board by the method of sealing and injection molding, and after the surface treatment, the filter components are placed, which can improve the injection molding performance. The gluing process contaminates and damages the filter element, and achieves the purpose of protecting the passive element (surface-attached element), and avoids the surface-attached element from being damaged during the placement of the filter element or the dispensing process; 2) With optical channels and concave The circuit board with the groove replaces the ceramic substrate in the prior art, which can reduce the packaging cost; 3) form a receiving groove on the circuit board and encapsulate the surface-attached element in the receiving groove and accommodate and fix the photosensitive/light-emitting element in the receiving groove; The groove on the circuit board can not only reduce the total height of the lens packaging module, reduce the height difference between the photosensitive/light-emitting element and the filter element, but also reduce the light refraction and improve the afterimage in imaging; 4) the above The encapsulant layer also covers the inner wall of the first optical channel, which can reduce light interference and improve the imaging quality; 5) The encapsulant layer is used to replace the bracket used to support the lens and the filter element in the prior art, which can eliminate the need for the base and the filter element. The surface is attached to a reserved dispensing distance between the element and the filter element, thereby reducing the packaging assembly area of the lens packaging module.

The above is only the preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. , without departing from the scope of the technical solution of the present invention, when the technical content disclosed above can be used to make some changes or modifications to equivalent embodiments of equivalent changes, provided that the content of the technical solution of the present invention is not departed from, according to the technical essence of the present invention Any simple modifications, equivalent changes and modifications made to the above embodiments still fall within the scope of the technical solutions of the present invention.

100: Lens packaging module

101: First Surface

102: Second Surface

11: Substrate

12: The first optical channel

13: Groove

14: Conductive circuit layer

141: First pad

142: Second pad

20: Surface-attached components

30: sealant layer

31: The second optical channel

32: Step part

40: Photosensitive/Light-emitting element

50: Conductive block

60: filter element

61: Viscose layer

70: Lens Assembly

Claims (9)

A lens packaging module, comprising: a circuit board, the circuit board has a first optical channel and a groove communicated with the first optical channel; the circuit board further includes a base material and an inner buried At least one conductive circuit layer in the substrate, the conductive circuit layer includes at least one second pad, the second pad is exposed from the groove; at least one surface is connected to the element, the surface Then the element is located on the circuit board and is electrically connected to the circuit board; an encapsulant layer is formed on the circuit board and covers the surface to attach the element; the encapsulant layer includes a a second optical channel, the second optical channel is facing the first optical channel, the encapsulant layer also covers the inner wall of the first optical channel; and a filter element; the filter element is fixed in the second light channel and facing the first light channel; a light-sensing/light-emitting element; the light-sensing/light-emitting element is fixed in the groove and facing the filter element, the light-sensing/light-emitting element The second pad is electrically connected by at least one conductive block. The lens packaging module according to claim 1, wherein the circuit board further comprises at least one receiving groove, the surface-attached element is received in the receiving groove and is electrically connected to the circuit board, and the sealing body A layer is filled between the inner wall of the receiving groove and the surface-bonded element. The lens packaging module according to claim 1 or 2, wherein the sealing compound layer further comprises a step portion, and the step portion extends from the inner wall of the second optical channel to the center of the second optical channel extended formation. The lens packaging module according to claim 3, wherein the filter element is fixed on the step portion. The lens package module according to claim 1 or 2, wherein the filter element is formed on the circuit board. The lens packaging module according to claim 1 or 2, wherein the lens packaging module further comprises a lens element, and the lens element is formed on the encapsulant layer and faces the filter element. A method for manufacturing a lens packaging module, comprising: providing a circuit board, the circuit board having a first optical channel and a groove communicating with the first optical channel; the circuit board further comprising a base material and At least one conductive circuit layer embedded in the base material, the conductive circuit layer includes at least one second pad, the second pad is exposed from the groove; paste on the circuit board At least one surface-attached element is installed, and the surface-attached element is electrically connected to the circuit board; the circuit board with the surface-attached element is placed in a mold and glued to be placed on the circuit board forming an encapsulant layer covering the surface-attached element, the encapsulant layer including a second optical channel, the second optical channel facing the first optical channel; the encapsulant layer also covering the the inner wall of the first optical channel; surface treatment of the circuit board after forming the encapsulant layer; and providing a filter element, and fixing the filter element in the second optical channel and facing the the first optical channel; providing a photosensitive/light-emitting element, fixing the photosensitive/light-emitting element in the groove and making the photosensitive/light-emitting element electrically connected to the second pad through at least one conductive block . The method for manufacturing a lens package module according to claim 7, wherein the circuit board further comprises at least one receiving groove, and the surface-attached element is received in the receiving groove and is electrically connected to the circuit board, so that the The encapsulant layer is filled between the inner wall of the receiving groove and the surface bonding element. The method for manufacturing a lens encapsulation module according to claim 7, wherein the encapsulant layer further comprises a step portion, and the step portion extends from the inner wall of the second optical channel to the outer surface of the second optical channel. Center extension is formed.

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