CN211555857U - Packaging structure of chip - Google Patents
Packaging structure of chip Download PDFInfo
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- CN211555857U CN211555857U CN202020410279.1U CN202020410279U CN211555857U CN 211555857 U CN211555857 U CN 211555857U CN 202020410279 U CN202020410279 U CN 202020410279U CN 211555857 U CN211555857 U CN 211555857U
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Abstract
The utility model discloses a chip packaging structure, which comprises a substrate, a chip and a transparent cover plate, wherein the substrate comprises a first surface and a second surface which are oppositely arranged, and the substrate is provided with a cavity which penetrates through the first surface and the second surface; the chip is fixed on the second surface and comprises a functional surface and a back surface which are oppositely arranged, the functional surface faces the second surface, and the functional surface covers the cavity; the transparent cover plate comprises a light-transmitting part corresponding to the cavity, and optical cement is filled between the light-transmitting part and the functional surface. The utility model discloses a cavity intussuseption is filled with optical cement and/or printing opacity portion, compares in the cavity structure of no any material among the prior art, can improve the regional rigidity of cavity greatly to improve whole packaging structure's reliability, avoid appearing exploding chamber, layering scheduling problem in the reliability survey in-process or in follow-up packaging structure's use, and can avoid the aversion etc. of transparent cover or chip.
Description
Technical Field
The utility model relates to a chip package technical field especially relates to a packaging structure of chip.
Background
The image sensing chip is an electronic device capable of sensing external light and converting the external light into an electrical signal. The image sensor chip is usually manufactured by a semiconductor manufacturing process. After the image sensing chip is manufactured, a series of packaging processes are performed on the image sensing chip to form a packaged structure, so that the packaged structure is used in electronic equipment such as a digital camera and a digital video camera.
Fig. 1 is a schematic diagram of a package structure 200 of an image sensor chip in the prior art.
The package structure 200 includes a substrate 20, a chip 21 and a transparent cover 22, wherein a cavity 201 is formed on the substrate 20 and penetrates through the upper and lower surfaces of the substrate 20, and a functional surface 211 for receiving external light on the chip 21 covers the cavity 201, so that the external light can reach the functional surface 211 of the chip 21 through the transparent cover 22 and the cavity 201.
In practical applications, due to the existence of the cavity 201, the rigidity of the whole package structure 200 is not sufficient, and the structure is not reliable, for example, the cavity explosion and delamination may occur during the reliability test (e.g., high temperature test).
Disclosure of Invention
An object of the utility model is to provide a can improve packaging structure rigidity and packaging structure of reliability.
In order to realize one of the above objects of the present invention, an embodiment of the present invention provides a chip packaging structure, including:
the substrate comprises a first surface and a second surface which are oppositely arranged, and the substrate is provided with a cavity which penetrates through the first surface and the second surface;
the chip is fixed on the second surface and comprises a functional surface and a back surface which are oppositely arranged, the functional surface faces the second surface, and the functional surface covers the cavity;
the transparent cover plate comprises a light-transmitting part corresponding to the cavity, and optical cement is filled between the light-transmitting part and the functional surface.
As an improvement of an embodiment of the present invention, the functional surface is provided with an induction area and an attachment area, the attachment area is connected to the second surface, the induction area corresponds to the cavity, and the optical cement covers the induction area.
As a further improvement of an embodiment of the present invention, the transparent cover plate extends into the cavity.
As a further improvement of an embodiment of the present invention, the side edge of the transparent cover plate and the inner wall of the cavity have a space therebetween, and the space is filled with an injection molding material.
As a further improvement of an embodiment of the present invention, the transparent cover plate includes a top surface away from the optical cement, the top surface protruding out of the first surface.
As a further improvement of an embodiment of the present invention, the injection molding material extends to the first surface, and the injection molding material is kept away from the end surface of the first surface with the top surface flushes each other.
As a further improvement of an embodiment of the present invention, the transparent cover further includes an extension portion disposed around the light transmission portion, and the extension portion is connected to the first surface.
As a further improvement of an embodiment of the present invention, the second surface is provided with an electrical connection area, the package structure further includes a ball-planting structure, the ball-planting structure includes a first end and a second end that are arranged relatively, the first end electric connection the electrical connection area, the second end compare with keep away from at the back the second surface.
As a further improvement of an embodiment of the present invention, the electrical connection region includes a rewiring layer.
As a further improvement of an embodiment of the present invention, the package structure further includes a package adhesive connecting the side edge of the chip and the second surface.
As a further improvement of an embodiment of the present invention, the chip is an image sensing chip.
As a further improvement of an embodiment of the present invention, the substrate is any one of a PCB board, an organic substrate, and a glass substrate.
Compared with the prior art, the beneficial effects of the utility model reside in that: the cavity of the utility model is filled with optical glue and/or light transmission part, compared with the cavity structure without any substance in the prior art, the rigidity of the cavity area can be greatly improved, thereby improving the reliability of the whole packaging structure and avoiding the problems of cavity explosion, delamination and the like in the reliability measuring process or the subsequent use process of the packaging structure; in addition, a structure without a cavity is formed between the transparent cover plate and the chip, so that the bonding strength between the transparent cover plate and the chip is greatly enhanced, and the displacement of the transparent cover plate or the chip is avoided.
Drawings
FIG. 1 is a schematic diagram of a prior art package structure;
fig. 2 is a schematic diagram of a first exemplary package structure of the present invention;
fig. 3 is a schematic diagram of a second exemplary package structure of the present invention;
fig. 4 is a schematic diagram of a package structure according to a third example of the present invention;
FIG. 5 is a diagram illustrating steps of a packaging method according to an embodiment of the present invention;
fig. 6 to 12 are schematic diagrams illustrating steps of a packaging method according to an embodiment of the present invention.
Detailed Description
The present invention will be described in detail below with reference to specific embodiments shown in the drawings. However, these embodiments are not intended to limit the present invention, and structural, methodical, or functional changes that may be made by one of ordinary skill in the art based on these embodiments are all included in the scope of the present invention.
In the various drawings of the present invention, certain dimensions of structures or portions may be exaggerated relative to other structures or portions for ease of illustration, and thus, are used only to illustrate the basic structure of the subject matter of the present invention.
Referring to fig. 2, a schematic diagram of a chip package structure 100 according to an embodiment of the present invention is shown.
The package structure 100 includes a substrate 10, a chip 11 and a transparent cover 12.
The substrate 10 includes a first surface 101 and a second surface 102 disposed opposite to each other, and the substrate 10 has a cavity S penetrating through the first surface 101 and the second surface 102.
Here, the substrate 10 is any one of a PCB board, an organic substrate, and a glass substrate.
The chip 11 is fixed on the second surface 102, the chip 11 includes a functional surface 111 and a back surface 112, which are oppositely disposed, the functional surface 111 faces the second surface 102, and the functional surface 111 covers the cavity S.
Here, the chip 11 is an image sensing chip, but not limited thereto.
Note that, "the chip 11 is fixed to the second surface 102" means that the chip 11 is located on the side of the second surface 102 of the substrate 10, and the chip 11 and the second surface 102 may be directly connected or indirectly connected, in other words, one component is connected or fixed to another component in this embodiment, and two components are directly connected or indirectly connected.
In addition, the cavity S includes a first opening S1 on the first surface 101 and a second opening S2 on the second surface 102, where "the functional surface 111 covers the cavity S" means in a first direction X, a perpendicular projection of the second opening S2 is completely located on the functional surface 111, the first direction X is defined as a direction (i.e., a vertical direction) from the first surface 101 of the substrate 10 to the second surface 102, and a size of the first opening S1 of the present embodiment is equal to a size of the second opening S2, but is not limited thereto.
The transparent cover 12 includes a light-transmitting portion 121 corresponding to the cavity S, and an optical adhesive 13 is filled between the light-transmitting portion 121 and the functional surface 111.
Here, the "transparent portion 121" is defined as a region of the transparent cover plate 12 corresponding to the position of the cavity S, and the "filling of the optical cement 13 between the transparent portion 121 and the functional surface 111" means that the transparent portion 121 and the functional surface 111 are connected by the optical cement 13, and at this time, the optical cement 13 and/or the transparent portion 121 are located in the cavity S, that is, the cavity S is filled with the optical cement 12, or the cavity S is filled with the transparent portion 121, or the cavity S is filled with the optical cement 12 and the transparent portion 121 at the same time, where the "cavity S" means a range surrounded by the first opening S1 and the second opening S2.
It can be understood that, in addition to the optical adhesive 13 and/or the light-transmitting portion 121, other substances may be filled in the cavity S, and the optical adhesive 13 may be an optical material with high light transmittance and low refractive index, so that the influence of the optical adhesive 13 on the light transmission can be reduced as much as possible, so that the light passing through the transparent cover plate 12 reaches the functional surface 111 of the chip 11 more effectively, thereby ensuring the sensing effect of the chip 11.
In the present embodiment, the cavity S is filled with the optical adhesive 13 and/or the light-transmitting portion 121, and compared with a cavity structure without any substance in the prior art, the rigidity of the cavity S region can be greatly improved, so as to improve the reliability of the entire package structure 100, and avoid the problems of cavity explosion, delamination and the like in the reliability testing process or in the subsequent use process (e.g., high-temperature use environment) of the package structure 100.
In addition, a structure without a cavity is formed between the transparent cover plate 12 and the chip 11, so that the bonding strength between the transparent cover plate 12 and the chip 11 is greatly enhanced, and the displacement of the transparent cover plate 12 or the chip 11 is avoided.
In this embodiment, the functional surface 111 is provided with a sensing area 111a and a connection area 111b, the connection area 111b is connected to the second surface 102, the sensing area 111a corresponds to the cavity S, and the optical adhesive 13 covers the sensing area 111a, so that the chip 11 and the substrate 10 can be fixed.
Specifically, the second surface 102 is provided with an electrical connection region 1021, the electrical connection region 1021 is disposed around the second opening S2 of the cavity S, and the electrical connection region 1021 includes a redistribution layer 1021, that is, the package structure 100 of the present embodiment is a fan-out (fan-out) package structure, but not limited thereto.
The connection region 111b of the chip 11 includes a connection terminal 1111b, the connection terminal 1111b is electrically connected to the redistribution layer 1021, the package structure 100 further includes a ball-in-place 14, the ball-in-place 14 includes a first end 141 and a second end 142 opposite to each other, the first end 141 is electrically connected to the electrical connection region 1021, and here, the first end 141 is electrically connected to the redistribution layer 1021, and the ball-in-place 14 is a solder ball.
When the package structure 100 and an external circuit board (e.g., a PCB) are assembled with each other, the electrical connection between the package structure 100 and the external circuit board is realized by soldering the solder balls 14 and the external circuit board, since the solder balls 14 and the connection terminals 1111b of the chip 11 are electrically connected to the redistribution layer 1021, the solder balls 14 and the connection terminals 1111b are electrically connected to each other, and at this time, a signal acquired by the chip 11 can be transmitted to the external circuit board.
In addition, the cavity S of the present embodiment has high rigidity, and the redistribution layer 1021 can be effectively prevented from being separated from the substrate 10 under stress.
In the present embodiment, the second ends 142 of the solder balls 14 are far from the second surface 102 than the back surface 112 of the chip 11, that is, the height of the solder balls 14 is greater than the thickness of the chip 11 in the first direction X, so that the package structure 100 can be electrically connected to an external circuit board through the solder balls 14, and the chip 11 is prevented from being damaged during the soldering process.
In addition, the package structure 100 further includes a package adhesive 15 connecting the side edge of the chip 11 and the second surface 102, so as to improve the stability of the chip 11 and the substrate 10.
The chip 11 of the present embodiment is located in the lower region of the substrate 10, and the substrate 10 has the cavity S, so that the whole package structure 100 is more compact, the whole size of the package structure 100 is smaller, the functional surface 111 above the chip 11 is the optical adhesive 13, and the back surface 112 below the chip 11 has no structure, so that the warpage risk of the chip 11 can be greatly reduced.
The transparent cover 12 of the present embodiment has various forms, and three specific examples are described below as examples.
In a first example, continuing with fig. 2, the transparent cover 12 extends into the cavity S, i.e. at least part of the transparent cover 12 is located within the cavity S.
Here, the rigidity of the transparent cover 12 is strong, and the rigidity of the filler in the cavity S can be greatly improved, thereby further improving the rigidity of the cavity S region, and at this time, it is only necessary to coat a thin layer of optical adhesive 13 on the sensing region 111a to bond the sensing region 111a and the transparent cover 12.
In this example, a gap P is formed between the side edge 122 of the transparent cover plate 12 and the inner wall S3 of the cavity S, and the injection molding material 16 is filled in the gap P, that is, the injection molding material 16 is filled in the cavity S at this time, so that the rigidity of the cavity S area can be further improved, and the gap P is filled with the injection molding material 16, so that the stability of the transparent cover plate 12 can be improved, and the transparent cover plate 12 is prevented from being displaced.
In addition, the transparent cover plate 12 includes a top surface 123 far away from the optical adhesive 13, the top surface 123 protrudes out of the first surface 101, the injection molding material 16 extends to the first surface 101, and an end surface 161 of the injection molding material 16 far away from the first surface 101 and the top surface 123 are flush with each other.
That is to say, the vertical projection of the transparent cover 12 in the first direction X of the present example is completely located within the vertical projection range of the cavity S in the first direction X, the lower half of the transparent cover 12 is located in the cavity S, the upper half of the transparent cover protrudes out of the first surface 101 and is located outside the cavity S, and in the first direction X, there is no overlapping area between the transparent cover 12 and the first surface 101, and the whole area of the transparent cover 12 is the light-transmitting portion 121.
The injection molding compound 16 of the present example extends from the cavity S to the first surface 101, which can stabilize the transparent cover plate 12 and the protection substrate 10, and the injection molding compound 16 has high rigidity, which can improve the reliability of the whole package structure 100.
Referring to fig. 3, a schematic diagram of a package structure 100' of a second example is shown, and for convenience of description, structures of the second example that are similar or identical to those of the first example are numbered similarly or identically.
The second example differs from the first example in that: the transparent cover plate 12 ' in the second example further comprises an extension 124 ' arranged around the light-transmitting portion 121 ', the extension 124 ' being connected to the first surface 101 '.
That is, the transparent cover 12 'of the present example is disposed above the substrate 10', the light-transmitting portion 121 'is located above the cavity S', the extending portion 124 'is located above the first surface 101', the optical cement 13 'fills the cavity S', the light-transmitting portion 121 'and the optical cement 13' are combined with each other, and the cavity S 'is enhanced in rigidity by the optical cement 13' filled therein.
Here, the optical cement 13 ' may also extend to the first surface 101 ' so that the extension portion 124 ' is combined with the first surface 101 ' through the optical cement 13 ', and of course, the extension portion 124 ' may be connected with the first surface 101 ' through other substances.
For other descriptions of the second example, reference may be made to the description of the first example, which is not repeated here.
Referring to fig. 4, a third exemplary package structure 100 ″ is shown.
The third example differs from the second example in that: the transparent cover plate 12 "in the third example further includes an extension portion 124" disposed around the light-transmissive portion 121 ", the extension portion 124" connects the first surface 101 ", the light-transmissive portion 121" extends to the inside of the cavity S "to be combined with the optical cement 13" located in the cavity S ", and the cavity S" is enhanced in rigidity by the optical cement 13 "filled inside and a part of the light-transmissive portion 121".
For other descriptions of the third example, reference may be made to the first example and the second example, which are not described herein again.
An embodiment of the present invention further provides a chip packaging method, taking the first example as an example, and referring to fig. 5 to 12, the chip packaging method includes:
s1: referring to fig. 6, a plurality of substrates 10 are defined on a base in an array distribution, and a cutting channel is formed between adjacent substrates 10;
here, the substrate may be a wafer substrate, a plurality of substrates 10 may be pre-divided on the substrate in an array, and the substrate 10 may be any one of a PCB, an organic substrate, and a glass substrate.
S3: with reference to fig. 7, a plurality of cavities S are formed to penetrate through the first surface 101 and the second surface 102 of the substrate 10;
here, step S3 is preceded by the step of: a redistribution layer 1021 is formed at the second surface 102.
Specifically, the redistribution layer 1021 may be formed on the substrate by electroplating, photolithography, or the like, and the position of the cavity S is reserved in the redistribution layer 1021, and then the cavity S is formed at the position of the reserved cavity S.
S5: referring to fig. 8, the functional surface 111 and the second surface 102 of the chip 11 are fixed, and the functional surface 111 covers the cavity S;
here, step S5 specifically includes:
connecting the connection region 111b at the functional surface 111 of the chip 11 and the second surface 102, and making the sensing region 111a at the functional surface 111 correspond to the cavity S;
an encapsulation adhesive 15 is formed to connect the side edge of the chip 11 and the second surface 102.
Here, the chip 11 is an image sensing chip, but not limited to this, the connection between the chip 11 and the substrate 10 can be realized by a flip-chip method, the connection region 111b includes a connection terminal 1111b, the connection terminal 1111b is electrically connected to the redistribution layer 1021 on the second surface 102, and the provision of the package adhesive 15 can improve the stability of the matching between the chip 11 and the substrate 10.
S7: with reference to fig. 9, an optical adhesive 13 is coated on the functional surface 111;
here, the optical paste 13 may be coated on the sensing region 111a by a dispensing process, and the optical paste 13 covers the sensing region 111a, and the optical paste 13 may be an optical material having high light transmittance and low refractive index.
S9: with reference to fig. 9 and 10, the transparent cover 12 is fixed to the side of the optical adhesive 13 away from the functional surface 111;
here, step S9 specifically includes:
extending the transparent cover plate 12 into the cavity S so that the transparent cover plate 12 is connected with the optical cement 13, and the transparent cover plate 12 protrudes out of the first surface 101 away from the top surface 123 of the optical cement 13;
referring to fig. 10, the upper working surface 301 of the upper mold 30 is abutted against the top surface 123, and the lower working surface 311 of the lower mold 31 is abutted against the back surface 112 of the chip 11, which is away from the functional surface 111;
the upper mold 30 and the lower mold 31 are clamped, and the injection molding material 16 is filled in the gap P between the side edge 122 of the transparent cover plate 12 and the inner wall S3 of the cavity S and the gap P1 between the upper working surface 301 and the first surface 101.
Here, the rigidity of the transparent cover 12 is strong, and the rigidity of the filler in the cavity S can be greatly improved, thereby further improving the rigidity of the cavity S region, and at this time, it is only necessary to coat a thin layer of optical adhesive 13 on the sensing region 111a to bond the sensing region 111a and the transparent cover 12.
In addition, the upper action surface 301 of the upper mold 30 is a plane, the lower action surface 311 of the lower mold 31 is a plane, the upper action surface 301 and the lower action surface 311 are arranged opposite to each other, since the top surface 123 protrudes out of the first surface 101, the upper action surface 301 abuts against the top surface 123, a gap P1 is formed between the upper action surface 301 and the first surface 101, meanwhile, the lower action surface 311 abuts against the back surface 112 of the chip 11, a gap P is formed between the side edge 122 of the transparent cover plate 12 and the inner wall S3 of the cavity S, the gap P is communicated with the gap P1, and when the injection molding material 16 is injected, the injection molding material 16 simultaneously fills the gap P and the gap P1.
It can be understood that, since the upper acting surface 301 abuts against the top surface 123, during the injection process of the molding compound 16, the molding compound 16 does not move to the top surface 123, thereby preventing the top surface 123 of the transparent cover plate 12 from being contaminated, and under the limiting action of the upper acting surface 301, the end surface 161 of the molded molding compound 16 away from the first surface 101 is flush with the top surface 123, so that the grinding process can be omitted.
The cavity S of the present embodiment is further filled with the injection molding material 16, so that the rigidity of the cavity S area can be further improved, the gap P is filled with the injection molding material 16, the stability of the transparent cover plate 12 can be improved, the transparent cover plate 12 is prevented from shifting, the injection molding material 16 on the first surface 101 can play a role in stabilizing the transparent cover plate 12 and protecting the substrate 10, and the injection molding material 16 has stronger rigidity, so that the reliability of the whole packaging structure 100 can be improved.
When the second example corresponds to the above, step S9 specifically includes:
filling the cavity S 'with the optical cement 13';
the transparent cover 12 'is fixed to the first surface 101', and the transparent cover 12 'and the optical glue 13' are fixed to each other.
S11: the substrate is divided based on the dicing channels to form a plurality of singulated packaging structures 100.
Here, step S11 is preceded by the step of:
referring to fig. 12, the solder balls 14 are formed on the redistribution layer 1021, and one end of the solder ball 14 away from the redistribution layer 1021 protrudes out of the back surface 112 of the chip 11 away from the functional surface 111.
In summary, the transparent cover plate 12 and the functional surface 111 of the present embodiment are connected by the optical adhesive 13, and the functional surface 111 is disposed corresponding to the cavity S, at this time, the cavity S is filled with the optical adhesive 13 and/or the transparent cover plate 12, which can greatly improve the rigidity of the cavity S area compared with the cavity structure without any substance in the prior art, thereby improving the reliability of the whole package structure 100, and avoiding the problems of cavity explosion, delamination and the like in the reliability testing process or in the subsequent use process (e.g., high temperature use environment) of the package structure 100.
In addition, a structure without a cavity is formed between the transparent cover plate 12 and the chip 11, so that the bonding strength between the transparent cover plate 12 and the chip 11 is greatly enhanced, and the displacement of the transparent cover plate 12 or the chip 11 is avoided.
For other descriptions of the packaging method of the present embodiment, reference may be made to the description of the packaging structure, and further description is omitted here.
It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.
The above list of details is only for the practical implementation of the present invention, and they are not intended to limit the scope of the present invention, and all equivalent implementations or modifications that do not depart from the technical spirit of the present invention should be included in the scope of the present invention.
Claims (12)
1. A chip package structure, comprising:
the substrate comprises a first surface and a second surface which are oppositely arranged, and the substrate is provided with a cavity which penetrates through the first surface and the second surface;
the chip is fixed on the second surface and comprises a functional surface and a back surface which are oppositely arranged, the functional surface faces the second surface, and the functional surface covers the cavity;
the transparent cover plate comprises a light-transmitting part corresponding to the cavity, and optical cement is filled between the light-transmitting part and the functional surface.
2. The package structure of claim 1, wherein the functional surface is provided with a sensing area and a connection area, the connection area is connected to the second surface, the sensing area corresponds to the cavity, and the optical adhesive covers the sensing area.
3. The package structure of claim 1, wherein the transparent cover extends into the cavity.
4. The package structure according to claim 3, wherein a gap is formed between the side edge of the transparent cover plate and the inner wall of the cavity, and the gap is filled with injection molding material.
5. The package structure of claim 4, wherein the transparent cover plate includes a top surface remote from the optical glue, the top surface protruding beyond the first surface.
6. The package structure of claim 5, wherein the molding compound extends to the first surface, and wherein an end surface of the molding compound remote from the first surface and the top surface are flush with each other.
7. The package structure of claim 1, wherein the transparent cover further comprises an extension disposed around the light-transmissive portion, the extension connecting the first surface.
8. The package structure of claim 1, wherein the second surface is provided with an electrical connection region, the package structure further comprising a ball mount, the ball mount comprising a first end and a second end disposed opposite to each other, the first end being electrically connected to the electrical connection region, and the second end being away from the second surface compared to the back surface.
9. The package structure of claim 8, wherein the electrical connection region comprises a redistribution layer.
10. The package structure of claim 1, further comprising an encapsulant connecting the side edges of the chip and the second surface.
11. The package structure of claim 1, wherein the chip is an image sensor chip.
12. The package structure according to claim 1, wherein the substrate is any one of a PCB board, an organic substrate, and a glass substrate.
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| CN202020410279.1U CN211555857U (en) | 2020-03-26 | 2020-03-26 | Packaging structure of chip |
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| CN202020410279.1U CN211555857U (en) | 2020-03-26 | 2020-03-26 | Packaging structure of chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021190141A1 (en) * | 2020-03-26 | 2021-09-30 | 苏州晶方半导体科技股份有限公司 | Packaging structure for chip and packaging method therefor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021190141A1 (en) * | 2020-03-26 | 2021-09-30 | 苏州晶方半导体科技股份有限公司 | Packaging structure for chip and packaging method therefor |
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