CN114928686A - Camera assembly, camera assembly packaging method and electronic equipment - Google Patents
Camera assembly, camera assembly packaging method and electronic equipment Download PDFInfo
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- CN114928686A CN114928686A CN202210405772.8A CN202210405772A CN114928686A CN 114928686 A CN114928686 A CN 114928686A CN 202210405772 A CN202210405772 A CN 202210405772A CN 114928686 A CN114928686 A CN 114928686A
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- 238000000034 method Methods 0.000 title claims abstract description 60
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 20
- 239000000853 adhesive Substances 0.000 claims abstract description 123
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- 239000000758 substrate Substances 0.000 claims abstract description 64
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- 230000001678 irradiating effect Effects 0.000 claims abstract description 12
- 239000012945 sealing adhesive Substances 0.000 claims description 8
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Images
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
The application provides a camera assembly, a camera assembly packaging method and electronic equipment. The camera assembly includes: a substrate; the surface of one side of the substrate is provided with a photosensitive chip and a sealing colloid, and the photosensitive chip is packaged on the substrate by the sealing colloid; a voice coil motor is arranged on one side of the sealing colloid, which is far away from the substrate; photosensitive glue is filled between the sealing glue body and the voice coil motor and fixedly connected through the photosensitive glue; the sealing colloid or the voice coil motor is provided with at least one ultraviolet light emitting diode in the projection area of the photosensitive adhesive, and the ultraviolet light emitting diode is used for emitting ultraviolet light capable of irradiating the photosensitive adhesive when the photosensitive adhesive is filled so as to solidify the photosensitive adhesive. The technical scheme that this application shows can solve among the correlation technique camera encapsulation process and be subject to the influence of camera subassembly structure, can't carry out full-automatic operation in photosensitive glue curing process, leads to the problem of camera poor stability to improve camera stability.
Description
Technical Field
The present disclosure relates to the field of camera technologies, and in particular, to a camera assembly, a method for packaging the camera assembly, and an electronic device.
Background
The existing camera component is usually packaged by adopting an active focusing process, and relates to the assembly of a circuit board, a chip, a sealing colloid, a motor, a lens and other parts, and the stability of the camera is very important to be ensured in the packaging process.
Existing camera assembly packaging processes typically include: the chip is arranged in a cavity formed by bending the circuit board, the chip is packaged on the circuit board through the sealing colloid, and the photosensitive adhesive is filled between the sealing colloid and the motor so as to fixedly connect the sealing colloid and the motor. However, the photosensitive adhesive needs to be irradiated by the uv led for curing, and due to the structural limitation of the circuit board, the conventional irradiation method is generally: the opening of the circuit board connected with the outside from the cavity is manually opened so that the photosensitive adhesive is exposed, and the photosensitive adhesive is irradiated from the outside through the ultraviolet light-emitting diode so that the photosensitive adhesive is cured.
The existing opening part for connecting the self-cavity of the circuit board with the outside is manually opened so as to expose the photosensitive adhesive, the photosensitive adhesive is irradiated from the outside through the ultraviolet light emitting diode, the mode of curing the photosensitive adhesive is difficult to carry out automatic operation, meanwhile, the precision of an active focusing process is easily influenced, and the stability of the camera is poor.
Disclosure of Invention
The embodiment of the application provides a camera assembly, a camera assembly packaging method and electronic equipment, and can solve the problem that in the related art, the camera packaging process is limited by the influence of a camera assembly structure, and full-automatic operation cannot be performed in the photosensitive adhesive curing process, so that the stability of the camera is poor, and the stability of the camera is improved.
In order to achieve the above purpose, the embodiments of the present application provide the following technical solutions:
in a first aspect, the present application illustrates a camera assembly comprising: a substrate; a photosensitive chip and a sealing colloid are arranged on the surface of one side of the substrate, and the sealing colloid encapsulates the photosensitive chip on the substrate; a voice coil motor is arranged on one side of the sealing colloid, which is far away from the substrate; photosensitive glue is filled between the sealing glue body and the voice coil motor and is fixedly connected with the voice coil motor through the photosensitive glue; the sealing colloid or the voice coil motor is provided with at least one ultraviolet light emitting diode in the projection area of the photosensitive adhesive, and the ultraviolet light emitting diode is used for emitting ultraviolet light capable of irradiating the photosensitive adhesive when the photosensitive adhesive is filled so as to solidify the photosensitive adhesive. Adopt this embodiment, set up ultraviolet emitting diode at the projection area of photosensitive glue through sealing colloid or voice coil motor to make ultraviolet emitting diode can send the ultraviolet ray that can shine to photosensitive glue from inside, can carry out full automatic operation in the curing process at photosensitive glue, in order to improve camera stability.
In one implementation, the encapsulant includes at least one first interconnect via; the at least one first interconnection through hole is positioned in the projection area of the photosensitive adhesive and is communicated with the photosensitive adhesive; at least one ultraviolet light emitting diode is disposed within the at least one first interconnect via. Adopt this embodiment, make ultraviolet emitting diode send the ultraviolet ray that can shine to the photosensitive glue from first interconnection via hole, can carry out full automatic operation in the photosensitive glue curing process to improve camera stability.
In one implementation, the voice coil motor includes at least one second interconnect via; the at least one second interconnection through hole is positioned in the projection area of the photosensitive adhesive and is communicated with the photosensitive adhesive; at least one ultraviolet light emitting diode is disposed within the at least one second interconnect via. By adopting the embodiment, the ultraviolet light-emitting diode emits ultraviolet light capable of irradiating the photosensitive adhesive from the second interconnection through hole, and full-automatic operation can be performed in the curing process of the photosensitive adhesive so as to improve the stability of the camera.
In one implementation, the height of the UV LED is greater than 0.48 mm and less than 0.55 mm, such that the illuminated area of the UV LED can cure the photo-sensitive adhesive. With the present embodiment, the photosensitive adhesive can be cured in the irradiation area of the ultraviolet light emitting diode by setting the height of the ultraviolet light emitting diode within a certain range.
In one implementation, the hole pattern of the first interconnect via includes at least any one of: cylindrical hole patterns, pentagonal prism hole patterns, hexagonal prism hole patterns and cuboid hole patterns. By adopting the embodiment, the hole type of the first interconnection via hole can be set according to actual conditions, so that the light-emitting angle of the ultraviolet light-emitting diode can be cured by the photosensitive adhesive.
In one implementation, the hole pattern of the second interconnect via includes at least any one of: cylindrical hole patterns, pentagonal prism hole patterns, hexagonal prism hole patterns and cuboid hole patterns. By adopting the embodiment, the hole pattern of the second interconnection via hole can be set according to actual conditions, so that the light-emitting angle of the ultraviolet light-emitting diode can be cured by the photosensitive adhesive.
In one implementation, when the hole type of the first interconnection via hole is a rectangular parallelepiped hole type, the length of a side of the first interconnection via hole, which is communicated with the photosensitive adhesive, is greater than or equal to 1.5 mm, and the width of the side is greater than or equal to 0.6 mm, so that the irradiation area of the ultraviolet light emitting diode can cover the photosensitive adhesive. By adopting the embodiment, the size of the first interconnection through hole can be set according to actual conditions, so that the light-emitting angle of the ultraviolet light-emitting diode can be cured by the photosensitive adhesive.
In one implementation, when the hole type of the second interconnection via is a rectangular parallelepiped hole type, the length of a side of the second interconnection via, which is in communication with the photosensitive adhesive, is greater than or equal to 1.5 mm, and the width of the side is greater than or equal to 0.6 mm, so that the irradiation area of the ultraviolet light emitting diode can cure the photosensitive adhesive. By adopting the embodiment, the size of the second interconnection via hole can be set according to actual conditions, so that the light-emitting angle of the ultraviolet light-emitting diode can be cured by the photosensitive adhesive.
In a second aspect, an embodiment of the present application further provides a camera assembly packaging method, which is applied to the camera assembly shown in the first aspect and the various implementation manners of the first aspect, and includes: welding or bonding the photosensitive chip on the surface of one side of the substrate, and preparing a sealing colloid on the surface of one side of the substrate so that the photosensitive chip is packaged on the substrate by the sealing colloid; a voice coil motor is arranged on one side of the sealing colloid, which is far away from the substrate; filling photosensitive glue between the sealing glue body and the voice coil motor so as to fixedly connect the sealing glue body and the voice coil motor through the photosensitive glue; at least one ultraviolet light emitting diode is arranged in the projection area of the photosensitive adhesive of the sealing adhesive body or the voice coil motor, and the ultraviolet light emitting diode is used for emitting ultraviolet light capable of irradiating the photosensitive adhesive when the photosensitive adhesive is filled so as to solidify the photosensitive adhesive. Adopt this embodiment, set up ultraviolet emitting diode at the projection area of photosensitive glue through sealing colloid or voice coil motor to make ultraviolet emitting diode can send the ultraviolet ray that can shine to photosensitive glue from inside, can carry out full automatic operation in the curing process at photosensitive glue, in order to improve camera stability.
In one implementation mode, at least one first interconnection via hole is prepared on the sealing glue body, and the at least one first interconnection via hole is located in a projection area of the photosensitive glue and is communicated with the photosensitive glue; at least one ultraviolet light emitting diode is disposed within the at least one first interconnect via. By adopting the embodiment, the ultraviolet light emitting diode emits ultraviolet light capable of irradiating the photosensitive adhesive from the first interconnection through hole, and full-automatic operation can be performed in the curing process of the photosensitive adhesive so as to improve the stability of the camera.
In one implementation, at least one second interconnect via is fabricated on the voice coil motor; the at least one second interconnection through hole is positioned in the projection area of the photosensitive adhesive and is communicated with the photosensitive adhesive; at least one ultraviolet light emitting diode is disposed within the at least one second interconnect via. By adopting the embodiment, the ultraviolet light emitting diode emits the ultraviolet light capable of irradiating the photosensitive adhesive from the second interconnection through hole, and the full-automatic operation can be performed in the curing process of the photosensitive adhesive so as to improve the stability of the camera.
In one implementation, the height of the UV LED is made greater than 0.48 mm and less than 0.55 mm so that the illuminated area of the UV LED can cure the photo-sensitive adhesive. With the present embodiment, the photosensitive adhesive can be cured in the irradiation area of the ultraviolet light emitting diode by setting the height of the ultraviolet light emitting diode within a certain range.
In one implementation, the hole pattern of the first interconnect via is prepared as at least any one of: cylindrical hole patterns, pentagonal prism hole patterns, hexagonal prism hole patterns and cuboid hole patterns. By adopting the embodiment, the hole type of the first interconnection via hole can be set according to actual conditions, so that the light-emitting angle of the ultraviolet light-emitting diode can be cured by the photosensitive adhesive.
In one implementation, the hole pattern of the second interconnect via is prepared as at least any one of: cylindrical hole patterns, pentagonal prism hole patterns, hexagonal prism hole patterns and cuboid hole patterns. By adopting the embodiment, the hole pattern of the second interconnection via hole can be set according to actual conditions, so that the light-emitting angle of the ultraviolet light-emitting diode can be cured by the photosensitive adhesive.
In one implementation, when the hole pattern of the first interconnection via is prepared as a rectangular parallelepiped hole pattern, a side of the first interconnection via in communication with the photosensitive paste has a length of 1.5 mm or more and a width of 0.6 mm or more, so that the irradiation region of the ultraviolet light emitting diode can be cured with the photosensitive paste. By adopting the embodiment, the size of the first interconnection through hole can be set according to actual conditions, so that the light-emitting angle of the ultraviolet light-emitting diode can be cured by the photosensitive adhesive.
In one implementation, when the hole pattern of the second interconnection via is prepared as a rectangular parallelepiped hole pattern, a side of the second interconnection via in communication with the photosensitive paste has a length of 1.5 mm or more and a width of 0.6 mm or more, so that the irradiation region of the ultraviolet light emitting diode can be cured with the photosensitive paste. By adopting the embodiment, the size of the second interconnection via hole can be set according to actual conditions, so that the light-emitting angle of the ultraviolet light-emitting diode can be cured by the photosensitive adhesive.
In a third aspect, embodiments of the present application further provide an electronic device including a camera assembly as shown in the first aspect and its various implementation manners.
Above illustrated technical scheme, can solve among the correlation technique camera encapsulation process and be subject to the influence of camera subassembly structure, can't carry out full-automatic operation in photosensitive glue curing process, lead to the problem of camera poor stability to improve camera stability.
Drawings
FIG. 1 schematically illustrates a camera assembly according to an embodiment of the present application;
FIG. 2 schematically illustrates a bent portion of an embodiment of the present application;
fig. 3 schematically illustrates a manufacturing method of a substrate and a bending portion according to an embodiment of the present disclosure;
FIG. 4 is a schematic diagram illustrating a camera assembly packaging process according to an embodiment of the present application;
FIG. 5 is a schematic diagram illustrating a camera assembly packaging process according to an embodiment of the present application;
FIG. 6 is a schematic diagram illustrating another camera assembly packaging process according to an embodiment of the present application;
FIG. 7 illustrates a first schematic view of a camera head assembly of an embodiment of the present application;
fig. 8 schematically shows a filter diagram according to an embodiment of the present application;
fig. 9 is a schematic structural diagram illustrating an encapsulant according to an embodiment of the present application;
FIG. 10 is a schematic diagram illustrating a first interconnect via distribution according to an embodiment of the present application;
fig. 11 illustrates a first interconnect via hole pattern schematic of an embodiment of the present application;
FIG. 12 is a schematic diagram illustrating a first interconnect via length and width according to an embodiment of the present application;
fig. 13 is a schematic view illustrating an optical path of an ultraviolet light emitting diode according to an embodiment of the present application;
FIG. 14 schematically illustrates a partial view of a substrate in accordance with an embodiment of the present application;
FIG. 15 illustrates a second schematic view of a camera head assembly of an embodiment of the present application;
fig. 16 is a schematic view illustrating a structure of a voice coil motor according to an embodiment of the present application;
fig. 17 schematically illustrates a second interconnect via hole pattern in an embodiment of the present application;
FIG. 18 is a schematic diagram illustrating a second interconnect via length and width according to an embodiment of the present application;
fig. 19 schematically illustrates a first flowchart of a camera assembly packaging method according to an embodiment of the present application;
fig. 20 schematically illustrates a second flowchart of a camera assembly packaging method according to an embodiment of the present application.
Detailed Description
The technical solutions of the embodiments of the present application will be clearly described below with reference to the drawings in the embodiments of the present application.
In the description of this application, "/" means "or" unless otherwise stated, for example, A/B may mean A or B. "and/or" herein is merely an association relationship describing an associated object, and means that there may be three relationships, for example, a and/or B, and may mean: a exists alone, A and B exist simultaneously, and B exists alone. Further, "at least one" means one or more, "a plurality" means two or more. The terms "first", "second", and the like do not necessarily limit the number and execution order, and the terms "first", "second", and the like do not necessarily limit the difference.
It is noted that the words "exemplary" or "such as" are used herein to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "e.g.," is not necessarily to be construed as preferred or advantageous over other embodiments or designs. Rather, use of the word "exemplary" or "such as" is intended to present relevant concepts in a concrete fashion.
In order to facilitate the technical solutions of the embodiments of the present application to be understood by the skilled person, the technical terms related to the embodiments of the present application are explained below.
1. An ultraviolet Light Emitting Diode (Ultra Violet Light Emitting Diode) refers to a Light Emitting Diode with a Light Emitting center wavelength of 400 nm or less. Through professional design, the UV LED can present light spots with different shapes and different illumination intensities, and the UV LED light source is suitable for the requirements of the production fields of edge sealing, printing and the like.
2. Active Alignment (AA) process is a technique for determining the relative positions of components in the assembly process of a camera assembly. In the traditional camera assembly packaging process, multiple assembling of parts such as a circuit board, a chip, a lens base and a lens is involved, the parts are moved and assembled according to parameters adjusted by equipment, so that the superposition tolerance of the parts is large, a photographed picture possibly deviates from the center of the picture in the actual application process of the camera assembly, and the definition of four corners of the picture is uneven. The AA process may actively align each component as it is assembled and assemble the next component in place, depending on the actual conditions of the assembled semi-finished product. The AA processing procedure can reduce the assembly tolerance of the whole camera assembly and effectively improve the product consistency of the camera assembly.
3. A Voice Coil Motor (VCM), which is one type of Motor. Can be in permanent magnetic field, through the direct current size that changes the coil in the motor to the tensile position of control spring leaf, thereby drive the camera lens and move from top to bottom, camera assembly can adjust the position of camera lens through VCM, presents clear image in order to realize the auto focus function.
4. The Rigid-Flex printed circuit board (RFPC) is a printed circuit board with high reliability and excellent flexibility, which is formed by laminating a flexible substrate made of polyimide or a polyvinyl acetate film and a prepreg. The wiring structure has the characteristics of high wiring density, light weight and good bending property.
Fig. 1 illustrates a schematic view of a camera assembly. As shown in fig. 1, the camera assembly may include: base plate 1, 1 side surface of base plate is provided with sensitization chip 2 and seals colloid 3, seals colloid 3 and encapsulates sensitization chip 2 on base plate 1, and the 1 one side of keeping away from of sealing colloid 3 is provided with voice coil motor 4, seals to fill between colloid 3 and the voice coil motor 4 to have photosensitive adhesive 5, and photosensitive adhesive 5 will seal colloid 3 and voice coil motor 4 fixed connection.
It should be noted that the photosensitive adhesive 5 may be an ultraviolet curing adhesive, and a photosensitizer contained in the ultraviolet curing adhesive generates active free radicals or cations after absorbing ultraviolet light under the irradiation of ultraviolet light, so as to initiate monomer polymerization, crosslinking, and grafting chemical reactions, so that the ultraviolet curing adhesive is converted from a liquid state to a solid state in a short time.
As shown in fig. 2, the camera head assembly further includes: the kink 6, kink 6 set up in base plate 1 top, form the cavity that is used for holding sealing colloid 3, voice coil motor 4 and photosensitive glue 5 in base plate 1 top, and kink 6 still includes: an opening 61 for communicating the cavity with the outside, and the bent portion 6 and the substrate 1 are formed integrally.
Fig. 3 schematically illustrates a manufacturing method of a substrate and a bent portion. As shown in fig. 3, taking a mobile phone as an example, since there is a limitation on the thickness of the mobile phone, it is necessary to set the thickness of the camera module to be smaller and configure more electrical connections to make the camera module perform its function, so that the RFPC board can be used to prepare the substrate 1 and the bending portion 6, and the RFPC board is bent by a bending jig, so that the substrate 1 and the bending portion 6 form a cavity for accommodating the encapsulant 3, the voice coil motor 4 and the photosensitive adhesive 5, and the bending portion 6 is electrically connected to the voice coil motor 4.
Fig. 4 schematically illustrates a camera assembly packaging process. As shown in fig. 4, the process of assembling the camera module using the AA process is as follows: set up sensitization chip 2 on base plate 1, encapsulate sensitization chip 2 on base plate 1 through sealing colloid 3, set up voice coil motor 4 in keeping away from 1 one side of base plate of sealing colloid 3, fill photosensitive adhesive 5 between sealing colloid 3 and voice coil motor 4. Wherein, because the kink 6 is integrated structure with base plate 1, seal colloid 3, voice coil motor 4 and photosensitive glue 5 and all be located base plate 1 and the cavity that kink 6 formed inside, at this moment, photosensitive glue 5 is because not being shone by UV LED, is the liquid. If the photosensitive adhesive 5 needs to be converted from a liquid state to a solid state, the bending part 6 needs to be manually opened from the opening 61 according to the manner shown in fig. 5 to expose the photosensitive adhesive 5, and the UV LED is applied to the photosensitive adhesive 5 from the outside to cure the photosensitive adhesive 5. This embodiment shows a way that is difficult to automate and at the same time easily affects the accuracy of the AA process. Meanwhile, the UV LED irradiation is performed from the outside in the manner shown in this embodiment, which results in insufficient curing degree of the photosensitive adhesive 5, affecting the stability of the camera assembly.
Fig. 6 illustrates another camera assembly packaging process schematic. As shown in fig. 6, in the process of assembling the camera by using the AA process, if the photosensitive adhesive 5 needs to be converted from a liquid state to a solid state, the UV LED can be further irradiated to the photosensitive adhesive 5 by refraction through the light path by adding a reflector. The method shown in this embodiment requires that the operation machine for AA process has enough space for installing the mirror, and the existing operation machine does not have the installation space for the mirror, which is not easy to implement. Meanwhile, the embodiment also performs UV LED irradiation from the outside, resulting in insufficient curing degree of the photosensitive paste 5, affecting stability of the camera assembly.
In order to solve the above problem, embodiments of the present application provide a camera assembly.
The camera assembly provided by the embodiment of the application can be used for electronic equipment. The electronic device in the embodiment of the present application may be, for example, a mobile terminal or a fixed terminal having a touch screen, such as a tablet computer (PAD), a Personal Digital Assistant (PDA), a handheld device having a wireless communication function, a computing device, a vehicle-mounted device, or a wearable device, a Virtual Reality (VR) terminal device, an Augmented Reality (AR) terminal device, a wireless terminal in industrial control (industrial control), a wireless terminal in self driving (self driving), a wireless terminal in remote medical (remote medical), a wireless terminal in smart grid (smart grid), a wireless terminal in transportation safety (transportation safety), a wireless terminal in smart city (smart city), and a wireless terminal in smart home (smart home). The electronic device according to the present application can be mounted on
Harmony
Or other operating system, which is not limited in this application.
Fig. 7 schematically illustrates a first schematic view of a camera head assembly provided by an embodiment of the present application. As shown in fig. 7, the camera assembly includes: the substrate 1, 1 side surface of substrate is provided with sensitization chip 2 and seals colloid 3, seals colloid 3 and encapsulates sensitization chip 2 in substrate 1.
The substrate 1 includes, but is not limited to, a rigid Circuit Board (PCB), a Flexible Circuit Board (FPCB), or an RFPC. The corresponding control circuit of camera subassembly can be printed on base plate 1, each part coordinated control in the camera subassembly of being convenient for.
The photosensitive chip 2 may be at least one type of a Charge Coupled Device (CCD) or a Metal-Oxide Semiconductor (CMOS), and the embodiment of the present application does not limit the specific type of the photosensitive chip 2.
As shown in fig. 8, the encapsulant 3 includes a filter 31 located in the projection area of the photosensitive chip 2, and external light can be emitted from the filter 31 to make the photosensitive chip 2 sensitive.
As further shown in fig. 7, a voice coil motor 4 is disposed on a side of the sealing compound 3 away from the substrate 1; photosensitive adhesive 5 is filled between the sealing adhesive body 3 and the voice coil motor 4 and is fixedly connected with the voice coil motor through the photosensitive adhesive 5.
In one implementation, a lens 7 is further disposed inside the voice coil motor 4, the lens 7 may be disposed on a coil support of the voice coil motor 4, and when a coil of the voice coil motor 4 is energized, a magnet in the voice coil motor 4 generates a force on the coil to realize movement of the lens 7. Wherein, coil support, coil and magnet are all according to current arrangement mode, not shown in this application's figure.
The sealing colloid 3 is provided with at least one ultraviolet light emitting diode 8 in the projection area of the photosensitive colloid 5, and the ultraviolet light emitting diode 8 is used for emitting ultraviolet light capable of irradiating the photosensitive colloid 5 when the photosensitive colloid 5 is filled so as to solidify the photosensitive colloid 5.
Fig. 9 is a schematic structural diagram illustrating an encapsulant of a camera head assembly according to an embodiment of the present disclosure. As shown in fig. 9, the encapsulant 3 includes at least one first interconnect via 32; at least one first interconnection via 32 is located in the projection area of the photosensitive adhesive 5 and is communicated with the photosensitive adhesive 5; at least one ultraviolet light emitting diode 8 is disposed within the at least one first interconnect via 32.
In one implementation, the uv led 8 is disposed on the substrate 1 and electrically connected to the substrate 1. The distribution mode of the ultraviolet light emitting diodes 8 can be as follows: the two ultraviolet light-emitting diodes 8 are symmetrically distributed at the edge of the substrate 1; four ultraviolet light emitting diodes 8 may be symmetrically distributed at the edge of the substrate 1. It should be noted that, in the embodiment of the present application, the number of the ultraviolet light emitting diodes 8 is not limited, and the setting of the ultraviolet light emitting diodes 8 may be set according to the actual situation according to the height of the sealing compound body 3 and the thickness of the photosensitive adhesive 5.
Fig. 10 schematically illustrates a first interconnect via distribution pattern in the embodiment of the present application. As shown in fig. 10, the first interconnect vias 32 may be distributed in the following manner: the two first interconnecting through holes 32 are symmetrically distributed at the edge of the sealing colloid 3; the four first interconnect vias 32 may also be symmetrically distributed at the edge of the molding compound 3. It should be noted that, in the embodiment of the present application, the number of the first interconnect vias 32 is not limited, and the arrangement of the first interconnect vias 32 may be set according to practical conditions according to the height of the encapsulant 3 and the thickness of the photosensitive paste 5. The first interconnection via 32 also needs to be correspondingly arranged according to the position of the ultraviolet light emitting diode 8.
Fig. 11 schematically illustrates a first interconnect via hole pattern in the embodiment of the present application. As shown in fig. 11, the hole pattern of the first interconnect via 32 includes at least any one of: a cylindrical hole pattern as shown by the a structure in fig. 11, a pentagonal prism hole pattern as shown by the B structure in fig. 11, a rectangular parallelepiped hole pattern as shown by the C structure in fig. 11, and a hexagonal prism hole pattern as shown by the D structure in fig. 11.
In the embodiment of the present application, the irradiation area of the ultraviolet light emitting diode 8 does not need to completely cover the photosensitive adhesive 5, and the photosensitive adhesive 5 can be cured only within the minimum curing range. Taking a camera assembly in a current mobile phone as an example, the bonding area of the photosensitive adhesive 5 is usually larger than 30 square millimeters and smaller than 40 square millimeters, and the minimum curing range corresponding to the bonding area is 4.8 square millimeters. Based on this, the hole pattern of the first interconnect via 32, the hole area of the first interconnect via 32, and the height of the ultraviolet light emitting diode 8 are set.
In one implementation, as shown in fig. 12, when the hole pattern of the first interconnection via 32 is a rectangular parallelepiped hole pattern, the length of the side of the first interconnection via 32 communicating with the photosensitive paste 5 is greater than or equal to 1.5 mm, and the width is greater than or equal to 0.6 mm, so that the irradiated area of the ultraviolet light emitting diode can be cured with the photosensitive paste.
Fig. 13 schematically shows a light path of the ultraviolet light emitting diode in the embodiment of the present application. As shown in fig. 13, the irradiation angle of the ultraviolet light emitting diode 8 is greater than 120 degrees and less than 150 degrees. In one implementation, the height of the uv led 8 is greater than 0.48 mm and less than 0.55 mm, so that the irradiated area of the uv led 8 can cure the photosensitive adhesive 5.
It should be noted that the hole type of the first interconnection via 32, the hole area of the first interconnection via 32, and the height of the ultraviolet light emitting diode 8 are not limited to the values described in the embodiments of the present application, and the specific setting manner may be set according to actual situations.
Fig. 14 schematically illustrates a partial view of a substrate of a camera head assembly provided by an embodiment of the present application. As shown in fig. 14, the camera head assembly further includes: the bending part 6, the bending part 6 and the bending part 6 are arranged above the substrate 1, a cavity for containing the sealing colloid 3, the voice coil motor 4 and the photosensitive adhesive 5 is formed above the substrate 1, and the bending part 6 and the substrate 1 are of an integrated structure so that the bending part 6 and the substrate 1 can be electrically connected.
In a specific implementation, the substrate 1 and the bent portion 6 may be made of PCB material, and the substrate 1 and the bent portion 6 may be connected by welding or bonding, so that the substrate 1 and the bent portion 6 form an integrated groove; or the substrate 1 and the bent part 6 are both made of FPCB materials, and the whole FPCB plate is bent through a bending jig so that the substrate 1 and the bent part 6 form an integrated groove; or preparing the substrate 1 and the bent part 6 by using an RFPC board, wherein the substrate 1 is made of a PCB material, the bent part 6 is made of an FPCB material, and bending the RFPC board by using a bending jig so as to form an integrated groove by using the substrate 1 and the bent part 6.
In the camera assembly shown above, the ultraviolet light emitting diode 8 is arranged in the projection area of the photosensitive adhesive 5 of the sealing adhesive body 3, and the first interconnection via hole 32 is arranged on the sealing adhesive body 3, so that the ultraviolet light emitting diode 8 emits ultraviolet light capable of irradiating the photosensitive adhesive 5 from the first interconnection via hole 32, and full-automatic operation can be performed in the curing process of the photosensitive adhesive 5, so as to improve the stability of the camera; simultaneously, this application embodiment is through carrying out UV LED to photosensitive glue 5 from inside and shine, and its irradiation position can improve the curing degree of photosensitive glue 5 to improve the stability of camera.
Fig. 15 is a second schematic view schematically illustrating a camera head assembly provided by an embodiment of the present application. As shown in fig. 15, in one implementation, the voice coil motor 4 is provided with at least one uv led 8 in the projection area of the photosensitive adhesive 5, and the uv led 8 is used for emitting uv light capable of irradiating the photosensitive adhesive 5 when the photosensitive adhesive 5 is filled to cure the photosensitive adhesive 5.
In one implementation, the uv led 8 is disposed on a sidewall of the voice coil motor 4 and electrically connected to the voice coil motor 4. The distribution mode of the ultraviolet light emitting diodes 8 can be as follows: the two ultraviolet light emitting diodes 8 are symmetrically distributed on the side wall of the voice coil motor 4; the four ultraviolet lights 8 may also be symmetrically distributed at the side wall of the voice coil motor 4. It should be noted that, the number of the ultraviolet light emitting diodes 8 is not limited in the embodiment of the present application, and the setting of the ultraviolet light emitting diodes 8 may be set according to the practical situation according to the height of the voice coil motor 4 and the thickness of the photosensitive adhesive 5.
Fig. 16 schematically illustrates a structure of a voice coil motor of a camera head assembly provided in an embodiment of the present application. As shown in fig. 16, in one implementation, the voice coil motor 4 includes at least one second interconnect via 41; at least one second interconnection via 41 is located in the projection area of the photosensitive adhesive 5 and is communicated with the photosensitive adhesive 5; at least one ultraviolet light emitting diode 8 is disposed within the at least one second interconnect via 41.
In one implementation, the second interconnect vias 41 may be distributed in the following manner: the two second interconnecting through holes 41 are symmetrically distributed at the side wall position of the voice coil motor 4; four second interconnection vias 41 may be symmetrically distributed at the sidewall of the vcm 4. It should be noted that, the number of the second interconnecting vias 41 is not limited in the embodiment of the present application, and the arrangement of the second interconnecting vias 41 may be set according to practical conditions according to the height of the voice coil motor 4 and the thickness of the photosensitive adhesive 5. The second interconnecting via hole 41 also needs to be correspondingly arranged according to the position of the ultraviolet light emitting diode 8.
In one implementation, the height of the uv led 8 is greater than 0.48 mm and less than 0.55 mm, so that the irradiated area of the uv led 8 can cure the photosensitive adhesive 5.
Fig. 17 schematically shows a second interconnect via hole pattern in the embodiment of the present application. As shown in fig. 17, the hole pattern of the second interconnect via 41 includes at least any one of: a cylindrical hole pattern as shown by the structure E in fig. 17, a pentagonal prism hole pattern as shown by the structure F in fig. 17, a rectangular parallelepiped hole pattern as shown by the structure G in fig. 17, and a hexagonal prism hole pattern as shown by the structure H in fig. 17.
In one implementation, as shown in fig. 18, when the hole pattern of the second interconnection via 41 is a rectangular parallelepiped hole pattern, the length of the side of the second interconnection via in communication with the photosensitive paste is greater than or equal to 1.5 mm, and the width is greater than or equal to 0.6 mm, so that the irradiated area of the ultraviolet light emitting diode can be cured with the photosensitive paste.
Above camera subassembly that shows, the projection area through the photosensitive glue 5 at voice coil motor 4 sets up ultraviolet emitting diode 8, and set up second interconnection via hole 41 on voice coil motor 4, so that ultraviolet emitting diode 8 sends the ultraviolet ray that can shine to photosensitive glue 5 from second interconnection via hole 41, can carry out full automatic operation in photosensitive glue 5 curing process, in order to improve camera stability, simultaneously, this application embodiment is through carrying out UV LED to photosensitive glue 5 from inside and shining, its irradiation position can improve photosensitive glue 5's solidification degree, in order to improve camera's stability.
The embodiment of the application further provides a camera assembly packaging method, and the method is used for manufacturing the camera assembly in any one of the embodiments and each implementation mode.
Fig. 19 schematically illustrates a first flowchart of a camera assembly packaging method provided by an embodiment of the present application.
As shown in fig. 19, the method provided in the embodiments of the present application may include the following steps:
s101: at least one ultraviolet light emitting diode 8 is fabricated on the substrate 1.
In one implementation, the uv led 8 is disposed on the substrate 1 and electrically connected to the substrate 1. The distribution mode of the ultraviolet light emitting diodes 8 can be as follows: the two ultraviolet light-emitting diodes 8 are symmetrically distributed at the edge of the substrate 1; four ultraviolet light emitting diodes 8 can also be symmetrically distributed at the edge position of the substrate 1. It should be noted that, in the embodiment of the present application, the number of the ultraviolet light emitting diodes 8 is not limited, and the setting of the ultraviolet light emitting diodes 8 may be set according to the actual situation according to the height of the sealing compound body 3 and the thickness of the photosensitive compound 5.
In one implementation, the height of the uv led 8 is greater than 0.48 mm and less than 0.55 mm, so that the irradiated area of the uv led 8 can cure the photosensitive adhesive 5.
S102: welding or bonding the photosensitive chip 2 on one side surface of the substrate 1, and preparing the sealing colloid 3 on one side surface of the substrate 1, so that the photosensitive chip 2 is packaged on the substrate 1 by the sealing colloid 3.
In one implementation, the photosensitive chip 2 may be prepared as at least one type of CCD or CMOS, and the embodiment of the present application does not limit the specific type of the photosensitive chip 2.
S103: at least one first interconnect via 32 is prepared on the encapsulant 3.
In one implementation, the first interconnect vias 32 may be distributed in the following manner: the two first interconnecting through holes 32 are symmetrically distributed at the edge of the sealing colloid 3; the four first interconnection vias 32 may also be symmetrically distributed at the edge of the molding compound 3. It should be noted that, in the embodiment of the present application, the number of the first interconnect vias 32 is not limited, and the arrangement of the first interconnect vias 32 may be set according to the actual situation according to the height of the encapsulant 3 and the thickness of the photosensitive adhesive 5. The first interconnecting via hole 32 also needs to be correspondingly arranged according to the position of the ultraviolet light emitting diode 8.
In one implementation, the hole pattern of the first interconnect via 32 includes at least any one of: cylindrical hole patterns, pentagonal prism hole patterns, hexagonal prism hole patterns and cuboid hole patterns.
S104: the side of the sealing colloid 3 far away from the substrate 1 is coated with photosensitive glue 5.
In one implementation, the photosensitive glue 5 may be a uv curable glue.
S105: the voice coil motor 4 is arranged on one side of the photosensitive adhesive 5 far away from the substrate.
S106: the ultraviolet light emitting diode 8 is energized so that the irradiated area of the ultraviolet light emitting diode 8 can cure the photosensitive adhesive 5.
In the camera assembly packaging method, the ultraviolet light emitting diode 8 is arranged in the projection area of the photosensitive adhesive 5 of the sealing adhesive body 3, and the first interconnection via hole 32 is arranged on the sealing adhesive body 3, so that the ultraviolet light emitting diode 8 emits ultraviolet light capable of irradiating the photosensitive adhesive 5 from the first interconnection via hole 32, and full-automatic operation can be performed in the curing process of the photosensitive adhesive 5, so that the stability of the camera is improved; simultaneously, this application embodiment is through carrying out UV LED to photosensitive glue 5 from inside and shine, and its irradiation position can improve photosensitive glue 5's curing degree to improve the stability of camera.
Fig. 20 schematically illustrates a second flowchart of a camera assembly packaging method provided in an embodiment of the present application.
As shown in fig. 20, the method provided in the embodiment of the present application may include the following steps:
s201: welding or bonding the photosensitive chip 2 on one side surface of the substrate 1, and preparing a sealing colloid 3 on one side surface of the substrate 1, so that the photosensitive chip 2 is packaged on the substrate 1 by the sealing colloid 3.
In one implementation, the photosensitive chip 2 may be prepared as at least one type of CCD or CMOS, and the embodiment of the present application does not limit the specific type of the photosensitive chip 2.
S202: at least one second interconnection via 41 is prepared on the voice coil motor 4.
In one implementation, the second interconnect vias 41 may be distributed in the following manner: the two second interconnecting through holes 41 are symmetrically distributed at the side wall position of the voice coil motor 4; four second interconnection vias 41 may be symmetrically distributed at the sidewall of the vcm 4. It should be noted that, the number of the second interconnecting vias 41 is not limited in the embodiment of the present application, and the arrangement of the second interconnecting vias 41 may be set according to practical conditions according to the height of the voice coil motor 4 and the thickness of the photosensitive adhesive 5. The second interconnection via 41 also needs to be correspondingly arranged according to the position of the ultraviolet light emitting diode 8.
S203: at least one ultraviolet light emitting diode 8 is prepared on the side wall of the voice coil motor 4.
In one implementation, the uv led 8 is disposed on a sidewall of the voice coil motor 4 and electrically connected to the voice coil motor 4. The distribution mode of the ultraviolet light emitting diodes 8 can be as follows: the two ultraviolet light-emitting diodes 8 are symmetrically distributed on the side wall of the voice coil motor 4; the four ultraviolet lights 8 may also be symmetrically distributed at the side wall of the voice coil motor 4. It should be noted that, the number of the ultraviolet light emitting diodes 8 is not limited in the embodiment of the present application, and the setting of the ultraviolet light emitting diodes 8 may be set according to the practical situation according to the height of the voice coil motor 4 and the thickness of the photosensitive adhesive 5.
It should be noted that the preparation sequence of steps S202 and S203 in the embodiment of the present application is not limited to the preparation sequence shown in the embodiment of the present application, and step S202 may be performed simultaneously with step S201, or simultaneously with step S203, or after step S203, and step S202 and step S203 only need to be guaranteed to be completed before step S205.
S204: the side of the sealing colloid 3 far away from the substrate 1 is coated with photosensitive glue 5.
In one implementation, the photosensitive glue 5 may be a uv curable glue.
S205: the voice coil motor 4 is arranged on the side of the photosensitive adhesive 5 far away from the substrate.
S206: the ultraviolet light emitting diode 8 is energized so that the irradiated area of the ultraviolet light emitting diode 8 can cure the photosensitive adhesive 5.
Above-mentioned camera subassembly encapsulation method that shows, set up ultraviolet emitting diode 8 through the projection area at voice coil motor 4's photosensitive glue 5, and set up second interconnection via hole 41 on voice coil motor 4, so that ultraviolet emitting diode 8 sends the ultraviolet ray that can shine to photosensitive glue 5 from second interconnection via hole 41, can carry out full automatic operation in photosensitive glue 5 curing process, in order to improve camera stability, simultaneously, this application embodiment is through carrying out UV LED to photosensitive glue 5 from inside and shining, its irradiation position can improve photosensitive glue 5's solidification degree, in order to improve camera's stability.
The embodiment of the application also provides electronic equipment, which comprises the camera assembly provided by any one of the embodiments and each implementation mode thereof.
Above-mentioned electronic equipment that shows can solve among the correlation technique camera encapsulation process and be subject to the influence of camera subassembly structure, can't carry out full-automatic operation in the photosensitive glue curing process, lead to the problem of camera poor stability, simultaneously, this application embodiment is through carrying out UV LED to photosensitive glue 5 from inside and shine, and its irradiation position can improve photosensitive glue 5's solidification degree to improve the stability of camera.
The above embodiments are only intended to be specific embodiments of the present application, and are not intended to limit the scope of the embodiments of the present application, and any modifications, equivalent substitutions, improvements, and the like made on the basis of the technical solutions of the embodiments of the present application should be included in the scope of the embodiments of the present application.
Claims (17)
1. A camera head assembly, comprising: a substrate;
a photosensitive chip and a sealing colloid are arranged on the surface of one side of the substrate, and the photosensitive chip is packaged on the substrate by the sealing colloid;
a voice coil motor is arranged on one side of the sealing colloid, which is far away from the substrate;
photosensitive adhesive is filled between the sealing adhesive body and the voice coil motor and fixedly connected through the photosensitive adhesive;
the sealing colloid or the voice coil motor is arranged in a projection area of the photosensitive adhesive and is provided with at least one ultraviolet light emitting diode, and the ultraviolet light emitting diode is used for emitting ultraviolet light capable of irradiating the photosensitive adhesive when the photosensitive adhesive is filled so as to solidify the photosensitive adhesive.
2. The camera head assembly of claim 1,
the sealing colloid comprises at least one first interconnection through hole; the at least one first interconnection through hole is positioned in a projection area of the photosensitive adhesive and is communicated with the photosensitive adhesive;
the at least one ultraviolet light emitting diode is disposed within the at least one first interconnect via.
3. The camera head assembly of claim 1,
the voice coil motor comprises at least one second interconnect via; the at least one second interconnection through hole is positioned in a projection area of the photosensitive adhesive and is communicated with the photosensitive adhesive;
the at least one ultraviolet light emitting diode is disposed within the at least one second interconnect via.
4. The camera head assembly of claim 1,
the height of the ultraviolet light emitting diode is more than 0.48 mm and less than 0.55 mm, so that the irradiation area of the ultraviolet light emitting diode can solidify the photosensitive adhesive.
5. The camera head assembly of claim 2,
the hole pattern of the first interconnection via at least comprises any one of the following: cylindrical hole patterns, pentagonal prism hole patterns, hexagonal prism hole patterns and cuboid hole patterns.
6. A camera assembly according to claim 3,
the hole pattern of the second interconnection via at least comprises any one of the following: cylindrical hole patterns, pentagonal prism hole patterns, hexagonal prism hole patterns and cuboid hole patterns.
7. A camera head assembly according to claim 5,
when the hole type of the first interconnection via hole is a cuboid hole type, the length of one side, communicated with the photosensitive adhesive, of the first interconnection via hole is larger than or equal to 1.5 millimeters, and the width of the side is larger than or equal to 0.6 millimeter, so that the photosensitive adhesive can be cured in an irradiation area of the ultraviolet light emitting diode.
8. The camera head assembly of claim 6,
when the hole type of the second interconnection via hole is a cuboid hole type, the length of one side, communicated with the photosensitive adhesive, of the second interconnection via hole is larger than or equal to 1.5 millimeters, and the width of the side is larger than or equal to 0.6 millimeter, so that the photosensitive adhesive can be cured in the irradiation area of the ultraviolet light-emitting diode.
9. A camera head assembly packaging method, applied to a camera head assembly according to any one of claims 1 to 8, comprising:
welding or bonding a photosensitive chip on the surface of one side of a substrate, and preparing a sealing colloid on the surface of one side of the substrate so that the photosensitive chip is packaged on the substrate by the sealing colloid;
arranging a voice coil motor on one side of the sealing colloid, which is far away from the substrate;
filling photosensitive glue between the sealing glue body and the voice coil motor so as to fixedly connect the sealing glue body and the voice coil motor through the photosensitive glue;
and arranging at least one ultraviolet light-emitting diode in the projection area of the photosensitive adhesive for the sealing adhesive body or the voice coil motor, wherein the ultraviolet light-emitting diode is used for emitting ultraviolet light capable of irradiating the photosensitive adhesive when the photosensitive adhesive is filled so as to solidify the photosensitive adhesive.
10. The camera head assembly packaging method of claim 9,
preparing at least one first interconnection through hole on the sealing glue body, wherein the at least one first interconnection through hole is positioned in a projection area of the photosensitive glue and is communicated with the photosensitive glue;
the at least one ultraviolet light emitting diode is disposed within the at least one first interconnect via.
11. The camera head assembly packaging method of claim 9,
preparing at least one second interconnect via on the voice coil motor; the at least one second interconnection via hole is positioned in the projection area of the photosensitive adhesive and is communicated with the photosensitive adhesive;
the at least one ultraviolet light emitting diode is disposed within the at least one second interconnect via.
12. The camera head assembly packaging method of claim 9,
the height of the ultraviolet light emitting diode is prepared to be more than 0.48 mm and less than 0.55 mm so that the irradiation area of the ultraviolet light emitting diode can cure the photosensitive adhesive.
13. The camera head assembly packaging method of claim 10,
preparing the hole pattern of the first interconnection via as any one of the following: cylindrical hole patterns, pentagonal prism hole patterns, hexagonal prism hole patterns and cuboid hole patterns.
14. The camera head assembly packaging method of claim 11,
preparing the hole pattern of the second interconnection via as any one of the following: cylindrical hole patterns, pentagonal prism hole patterns, hexagonal prism hole patterns and cuboid hole patterns.
15. The camera head assembly packaging method of claim 13,
when the hole pattern of the first interconnection via hole is prepared into a cuboid hole pattern, the length of one side, communicated with the photosensitive adhesive, of the first interconnection via hole is larger than or equal to 1.5 millimeters, and the width of the side is larger than or equal to 0.6 millimeter, so that the irradiation area of the ultraviolet light emitting diode can be cured with the photosensitive adhesive.
16. The camera head assembly packaging method of claim 14,
when the hole pattern of the second interconnection via hole is prepared into a cuboid hole pattern, the length of one side, communicated with the photosensitive adhesive, of the second interconnection via hole is larger than or equal to 1.5 millimeters, and the width of the side is larger than or equal to 0.6 millimeter, so that the photosensitive adhesive can be cured in the irradiation area of the ultraviolet light emitting diode.
17. An electronic device comprising the camera assembly of any one of claims 1-8.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210405772.8A CN114928686A (en) | 2022-04-18 | 2022-04-18 | Camera assembly, camera assembly packaging method and electronic equipment |
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| CN202210405772.8A CN114928686A (en) | 2022-04-18 | 2022-04-18 | Camera assembly, camera assembly packaging method and electronic equipment |
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