CN107517333B - Camera shooting assembly and manufacturing method thereof - Google Patents
Camera shooting assembly and manufacturing method thereof Download PDFInfo
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- CN107517333B CN107517333B CN201610417741.9A CN201610417741A CN107517333B CN 107517333 B CN107517333 B CN 107517333B CN 201610417741 A CN201610417741 A CN 201610417741A CN 107517333 B CN107517333 B CN 107517333B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000000853 adhesive Substances 0.000 claims abstract description 89
- 230000001070 adhesive effect Effects 0.000 claims abstract description 89
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 69
- 239000000084 colloidal system Substances 0.000 claims abstract description 53
- 238000000016 photochemical curing Methods 0.000 claims abstract description 37
- 238000005286 illumination Methods 0.000 claims abstract description 19
- 238000001723 curing Methods 0.000 claims description 39
- 229920005989 resin Polymers 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 16
- 238000003384 imaging method Methods 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 2
- 239000003292 glue Substances 0.000 description 17
- 238000001029 thermal curing Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Human Computer Interaction (AREA)
- Testing, Inspecting, Measuring Of Stereoscopic Televisions And Televisions (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
The invention provides a camera shooting assembly and a manufacturing method thereof. The cover body comprises an upper wall, a side wall, an illumination opening and a camera shooting opening, wherein the illumination opening and the camera shooting opening are formed in the upper wall, and the upper wall and the side wall surround the accommodating space. The camera units are arranged in the accommodating space, and the cover body at least covers part of the upper surfaces of the camera units. The light-cured colloid is arranged at the positions corresponding to the light openings, and the light openings expose the light-cured colloid. The thermosetting adhesive is arranged between the upper surfaces and the upper walls of the camera units. The photo-curing colloid is used for fixing the relative positions of the camera units and the cover body. The invention can lead the camera shooting unit to be well fixed in the cover body to form the camera shooting assembly and simultaneously reduce the volume of the whole camera shooting assembly.
Description
Technical Field
The present invention relates to a camera module and a method for manufacturing the same, and more particularly, to a camera module including a plurality of camera units and a method for manufacturing the same.
Background
With the progress of science and technology, more and more electronic products have multifunctional, miniaturized and high-precision designs. In our lives, photographing and photographing functions are indispensable for electronic devices (such as camera systems, handheld devices, and medical detection devices), wherein in order to obtain good image quality and image effect, the electronic devices are equipped with a photographing assembly having a plurality of photographing units to provide a wide range of photographing functions.
However, in the prior art, the camera module of the plurality of camera units usually needs to be assembled together and then installed in the electronic device. Generally, the plurality of camera units are assembled into a camera module by a fixing housing, and the fixing housing needs to provide an additional space for filling glue around the plurality of camera units, so as to fix the plurality of camera units in the housing by injecting adhesive into the space. However, since the fixing housing needs to provide the accommodating spaces for the plurality of photographing units and the space for filling the adhesive, the volume of the entire photographing assembly cannot be reduced.
Disclosure of Invention
The invention provides a camera assembly which has a small volume.
The invention provides a method for manufacturing a camera module, which can manufacture a camera module with a small volume.
The camera shooting assembly of the embodiment of the invention comprises a cover body, a plurality of camera shooting units, light curing colloid and heat curing colloid. The cover body comprises an upper wall, a side wall connected with the upper wall, a plurality of illumination openings and a plurality of camera openings, wherein the illumination openings and the camera openings are formed in the upper wall, and the accommodating space is surrounded by the upper wall and the side wall. The camera units are arranged in the accommodating space, each camera unit comprises an upper surface, and the cover body at least covers part of the upper surfaces of the camera units. The image pickup units respectively take images outwards through one of the image pickup openings. The light-cured colloid is arranged on the positions, corresponding to the illumination openings, of the upper surfaces of the camera units, and the illumination openings expose the light-cured colloid. The thermosetting adhesive is arranged between the upper surfaces and the upper walls of the camera units. Each of the image pickup units is bonded with the cover body through the light curing colloid and the heat curing colloid. The photo-curing colloid is used for fixing the relative positions of the camera units and the cover body.
The method for manufacturing the camera shooting assembly comprises the following steps: providing a cover body, wherein the cover body comprises an upper wall, a plurality of illumination openings and a plurality of camera shooting openings; coating photo-curing colloid and thermosetting colloid on the upper surfaces of the plurality of camera units, wherein the photo-curing colloid is coated on the positions of the illumination openings relative to the cover body; the camera shooting units are covered by the cover body, the upper wall of the cover body covers the thermosetting colloid on the camera shooting units, the light irradiation openings expose the thermosetting colloid on the camera shooting units, and the camera shooting units can shoot images outwards through the camera shooting openings; adjusting the positions and angles of the camera units in the cover body; curing the photo-curing colloid so as to fix the positions of the camera units before being fixed by the thermosetting colloid; and curing the thermosetting colloid so as to fix the camera shooting units in the cover body.
In the embodiment of the invention, in each camera unit, the distribution area of the thermosetting adhesive is shielded by the cover body, so that the thermosetting adhesive is filled in the gap between the upper wall and the upper surface of the camera unit.
In an embodiment of the invention, the shape of the upper surface of each camera unit is rectangular, the distribution area of the light-cured adhesive is adjacent to a corner of the upper surface, and the shape of the accommodating space surrounded by the cover body is substantially rectangular cuboid.
In an embodiment of the present invention, each of the above-mentioned image pickup units further includes a circuit board.
In an embodiment of the invention, the thermosetting colloid is suitable for curing at a curing temperature or at an ordinary temperature.
In an embodiment of the invention, the curing beam is ultraviolet light.
In an embodiment of the present invention, the above-mentioned image pickup units are connected to a circuit board.
In an embodiment of the present invention, a gap between the side wall of the cover and the side surface of the image capturing units is not sufficient for filling the photo-curing adhesive or the thermal-curing adhesive.
Based on the above, the cover body of the image capturing assembly according to the embodiment of the invention is suitable for accommodating a plurality of image capturing units, and the image capturing units are fixed in the cover body through the thermosetting adhesive and the light-curing adhesive, wherein the light-curing adhesive can fix the positions of the image capturing units before being fixed by the thermosetting adhesive, so that the image capturing units can be well fixed in the cover body to form the image capturing assembly. On the other hand, the thermosetting colloid can be coated on the surface of the camera shooting unit in advance, so that the cover body does not need to reserve a space for injecting the thermosetting colloid, and the volume of the whole camera shooting assembly is further reduced.
In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.
Drawings
FIG. 1 is a perspective view of a camera assembly according to a first embodiment of the present invention;
FIGS. 2A-2F are schematic diagrams of steps in a method of fabricating a camera assembly according to a first embodiment of the invention;
fig. 3 is a rear view of the housing of the camera module according to the first embodiment of the present invention.
Description of reference numerals:
100: a camera assembly;
110. 120: an image pickup unit;
112. 122: a camera lens;
152. 162: photo-curing the colloid;
170: a cover body;
171: a light incident surface;
172: illuminating the opening;
174A, 174B: a camera opening;
178: a side wall;
181. 182: a circuit board.
Detailed Description
Fig. 1 is a perspective view of a camera assembly according to a first embodiment of the present invention. Referring to fig. 1, in the first embodiment of the present invention, the image capturing assembly 100 includes an image capturing unit 110, an image capturing unit 120, and a cover 170. The housing 170 includes an upper wall 176, a side wall 178, a plurality of illumination openings 172, and imaging openings 174A, 174B. The side wall 178 is connected to the upper wall 176, and the side wall 178 and the upper wall 176 surround the accommodating space. The camera units 110 and 120 are disposed in the accommodating space, the cover 170 covers the camera unit 110 and one side of the camera unit 120, which is used for capturing images, externally, wherein the upper wall 176 covers the upper surface of the camera unit 110 and the upper surface of the camera unit 120, and the camera openings 174A and 174B are formed in the upper wall 176 of the cover 170, so that the camera unit 110 can capture images externally through the camera opening 174A, and the camera unit 120 can capture images externally through the camera opening 174B.
The camera module 100 of the present embodiment further includes light curable glue 152, 162. The light openings 172 of the cover 170 are formed on the upper wall 176 of the cover 170, and the light curable adhesive 152, 162 is disposed on the upper surfaces of the camera units 110, 120 at positions corresponding to the light openings 172, so that the light openings 172 can expose the light curable adhesive 152, 162 on the camera units 110, 120.
The camera assembly 100 of the present embodiment further includes a thermosetting adhesive (not shown in fig. 1). The thermosetting adhesive is disposed on a portion of the upper surface of the upper wall 176 covering the image pickup units 110 and 120, so that the thermosetting adhesive can bond the image pickup units 110 and 120 and the cover 170 between the image pickup units 110 and 120 and the upper wall 176.
The photo-curing adhesive 152 of the present embodiment fixes the relative positions of the camera unit 110 and the cover 170, the photo-curing adhesive 162 fixes the relative positions of the camera unit 120 and the cover 170, and the thermosetting adhesive is used to adhere and cure between the camera units 110 and 120 and the cover 170 fixed by the photo- curing adhesives 152 and 162. In other words, since the light curable adhesive 152, 162 can adhere to the upper surfaces of the camera units 110, 120 and the upper wall 176 near the light openings 172, the light curable adhesive 152, 162 can fix the relative positions of the cover 170 and the camera units 110, 120 before the thermosetting adhesive is cured.
Since the camera module 100 of the present embodiment fixes the camera units 110 and 120 through the cover 170, the light curing glue 152 and 162, and the thermosetting glue, the light curing glue 152 and 162 can provide a false fixing function for the camera units 110 and 120 in the cover 170, and the relative position between the camera units 110 and 120 and the cover 170 is maintained through the light curing glue 152 and 162, so that the thermosetting glue can be cured and the camera units 110 and 120 can be well fixed in the cover 170.
Further, the material of the photo- curing resin 152, 162 includes photo-curing resin, and the material of the thermosetting resin includes thermosetting resin. Accordingly, the photo-curing gel 152, 162 may provide a pseudo-fixation function before the thermal curing gel is cured by irradiating a light beam having a specific wavelength, but the present invention is not limited thereto. In other embodiments of the present invention, the photo-curing adhesive and the thermal curing adhesive may be both formed of resin that can be directly cured, and the curing speed of the photo-curing adhesive is faster than that of the thermal curing adhesive, so as to provide a pseudo-fixing function before the thermal curing adhesive is cured.
Meanwhile, since the light curable adhesive 152, 162 and the thermosetting adhesive provide a firm bonding effect between the upper wall 176 of the cover 170 and the upper surfaces of the camera units 110, 120, a space for filling adhesive between the side wall 178 of the cover 170 and the camera units 110, 120 is not required, thereby reducing the overall volume of the camera assembly 100. Further, the gap between the sidewall 178 of the cover 170 and the side surface of the camera units 110 and 120 is not sufficient for filling the photo-curing adhesive 152 or 162 or the above-mentioned thermal curing adhesive.
The image capturing unit 110 of the present embodiment includes a circuit board 181, and the image capturing unit 120 includes a circuit board 182, so that the image capturing units 110 and 120 can be electrically connected to external devices, but the present invention is not limited thereto. In other embodiments, the camera unit 110 and the camera unit 120 can be connected to the same circuit board, so that the camera module 100 can be easily electrically connected to external devices.
The method for manufacturing the image pickup assembly 100 and the relative relationship between the components in the above embodiment will be described below with reference to the drawings. Fig. 2A-2F are schematic diagrams of steps in a method of manufacturing the camera assembly 100 according to the first embodiment of the invention. Referring to fig. 2A, a method for manufacturing a camera module according to a first embodiment of the invention first provides a camera unit 110 and a camera unit 120. These camera units 110, 120 are for example adapted to take pictures or films, and these camera units 110, 120 take pictures or films along substantially the same side. Specifically, the image capturing unit 110 includes an upper surface 111 and a side surface 113 connecting the upper surface 111, the image capturing unit 120 includes an upper surface 121 and a side surface 123 connecting the upper surface 121, the upper surface 111 of the image capturing unit 110 and the upper surface 121 of the image capturing unit 120 face in substantially the same direction, and the external image beam enters the image capturing units 110 and 120 through the upper surfaces 111 and 121.
Referring to fig. 2B, in the method for manufacturing the camera assembly of the present embodiment, the photo-curing adhesive 150 and the thermosetting adhesive 130 are disposed on the camera unit 110, and the photo-curing adhesive 160 and the thermosetting adhesive 140 are disposed on the camera unit 120. The thermosetting resin 130, 140 of the present embodiment is formed by thermosetting resin such as Epoxy resin (Epoxy), and the photo-curing resin 150, 160 is ultraviolet curing adhesive (UV-cured adhesive), for example, but the invention is not limited thereto.
Specifically, in the image pickup assembly 100 of the present embodiment, the image pickup unit further includes the image pickup lenses 112, 122, and in the image pickup unit 110, the distribution region B1 of the thermosetting adhesive 130 surrounds the image pickup lens 112, and the distribution region B2 of the thermosetting adhesive 140 surrounds the image pickup lens 122. In the image pickup units 110 and 120, the distribution area a1 of the light curable colloid 150 is different from the distribution area of the thermosetting colloid 130, the distribution area a2 of the light curable colloid 160 is different from the distribution area of the thermosetting colloid 140, the distribution area of the thermosetting colloid 130 is larger than the distribution area of the light curable colloid 150, and the distribution area of the thermosetting colloid 140 is larger than the distribution area of the light curable colloid 160.
On the other hand, referring to fig. 2A, the shapes of the upper surfaces 111 and 121 of the camera units 110 and 120 of the embodiment are rectangular, and the distribution area of the light-cured resin 150 is adjacent to the corner of the upper surface 111 of the camera unit 110, the distribution area of the light-cured resin 160 is adjacent to the corner of the upper surface 121 of the camera unit 120, the distribution area of the heat-cured resin 130 is adjacent to the periphery of the upper surface 111, and the distribution area of the heat-cured resin 140 is adjacent to the periphery of the upper surface 121. Therefore, the photo- curable colloids 150 and 160 and the thermosetting colloids 130 and 140 can well cover the upper surfaces 111 and 121 of the image capturing units 110 and 120.
Referring to fig. 2C, in the method for manufacturing the image pickup module according to the present embodiment, after the thermosetting adhesive bodies 130 and 140 and the photo-curing adhesive bodies 150 and 160 are disposed, the cover 170 covers the image pickup units 110 and 120. The cover 170 covers the thermosetting adhesive 130 on the camera unit 110 and the thermosetting adhesive 140 on the camera unit 120, the light-curing adhesive 150 on the camera unit 110 is exposed by the illumination opening 172 of the cover 170, the light-curing adhesive 160 on the camera unit 120 is exposed by the illumination opening 172 of the cover 170, the camera unit 110 is exposed by the camera opening 174A, and the camera unit 120 is exposed by the camera opening 174B. In other words, the cover 170 covers parts of the upper surfaces 111 and 121 of the image capturing units 110 and 120, and the upper surfaces 111 and 121 of the image capturing units 110 and 120 covered by the cover 170 are coated with the thermosetting adhesive 130 and 140. Meanwhile, the cover 170 exposes the light-curing adhesive 150, 160 on the other surface of the camera units 110, 120, so that light beams or air from the outside can directly irradiate the light-curing adhesive 150, 160 on the camera units 110, 120.
FIG. 2D is a schematic cross-sectional view as indicated by section line I1I1 in FIG. 2C. In detail, when the cover 170 of this embodiment is disposed on the image capturing units 110 and 120, the distribution areas of the thermosetting adhesive 130 and 140 are shielded by the cover 170, so that the thermosetting adhesive 130 is filled in the gap between the upper wall 176 and the upper surface 111 of the image capturing unit 110, and the thermosetting adhesive 140 is filled in the gap between the upper wall 176 and the upper surface 121 of the image capturing unit 120, the thermosetting adhesive 130 can form an adhesive layer between the image capturing unit 110 and the upper wall 176, and further, a part of the surface of the image capturing unit 110 can be connected to a part of the inner surface of the upper wall 176 through the thermosetting adhesive 130. Meanwhile, the thermosetting adhesive 140 may form a glue layer between the camera unit 120 and the upper wall 176, so that a part of the surface of the camera unit 120 may be connected to a part of the inner surface of the upper wall 176 through the thermosetting adhesive 140.
Fig. 2E is a schematic cross-sectional view according to section line I2I2 in fig. 2C. In detail, when the cover 170 of the embodiment is disposed on the camera unit 110, 120, the light-cured adhesive 150 may form an adhesive layer between the camera unit 110 and the cover 170, so that another part of the surface of the camera unit 110 may be connected to the inner surface of the other part of the cover 170 adjacent to the illumination opening 172 through the light-cured adhesive 150. Meanwhile, the light-curing adhesive 160 may form an adhesive layer between the camera unit 120 and the cover 170, so that another part of the surface of the camera unit 120 may be connected to the inner surface of the other part of the cover 170 adjacent to the illumination opening 172 through the light-curing adhesive 160.
As described above, since the photo-curing glue 150, 160 and the thermosetting glue 130, 140 are not yet cured when the cover 170 covers the image pickup unit 110 and the image pickup unit 120, the relative positions between the image pickup units 110, 120 and the cover 170 can be adjusted.
In other embodiments of the present invention, the camera unit 110 and the camera unit 120 may be, for example, configured with a fixture to fix the relative position and angle between the camera unit 110 and the camera unit 120 in advance, and then coat the light curing glue 150, 160 and the thermosetting glue 130, 140. Therefore, when the cover 170 covers the camera units 110 and 120, the camera unit 110 and the camera unit 120 can maintain proper relative positions and angles.
Referring to fig. 2F, in the method for manufacturing the camera module of the present embodiment, after the camera units 110 and 120 are disposed in the cover 170, the photo-curing glue 150 and 160 is cured to form the photo-curing glue 152 and 162, and then the positions of the camera units 110 and 120 before being fixed by the thermal curing glue 130 and 140 are fixed. In other words, the cured photo-curing adhesive 152, 162 may temporarily fix the positions of the image capturing units 110, 120 in the housing 170, and the positions of the image capturing units 110, 120 in the housing 170 may also be located at appropriate positions in the housing 170 due to the fine adjustment step. Therefore, the manufacturing method of the present embodiment can form a good image capturing module 100 after the thermosetting resin 130, 140 is cured in the cover 170.
Specifically, in the present embodiment, the photo-curing colloids 150 and 160 are, for example, photo-curing colloids 152 and 162 by irradiating and curing a curing beam L, the photo-curing colloids 150 and 160 are, for example, Ultraviolet (UV) curing adhesives (UV-curing adhesives), and the curing beam L is, for example, ultraviolet light. The material of the thermosetting resin 130, 140 includes, for example, thermosetting resin such as Epoxy resin (Epoxy), and the thermosetting resin 130, 140 is suitable for curing at normal temperature or curing temperature higher than normal temperature, but the invention is not limited thereto. More specifically, the camera module 100 of the present embodiment may be completed by curing the thermosetting adhesive 130, 140 by a low-temperature baking in an oven.
In the manufacturing method of the camera module 100 of the present embodiment, the thermosetting adhesive 130, 140 and the light-curing adhesive 150, 160 are disposed on the camera units 110, 120 in advance, and then the camera units 110, 120 are disposed in the cover 170, and the light-irradiating opening 172 of the cover 170 exposes the light-curing adhesive 150, 160. Therefore, the cover 170 does not need to reserve an opening for injecting the colloid and a space for flowing the colloid, and the overall volume of the camera module 100 can be greatly reduced. Meanwhile, since the thermosetting adhesive 130, 140 is pre-coated on the camera units 110, 120, the thermosetting adhesive 130, 140 can be more precisely disposed on the surfaces of the camera units 110, 120, and the phenomenon of adhesive overflow is not caused, thereby improving the manufacturing yield of the camera assembly 100.
The cover 170 of this embodiment further includes a light incident surface 171, and the light irradiation openings 172 pass through the light incident surface 171. The projection area of the light irradiation openings 172 along the normal direction of the light incident surface 171 is located in the distribution area of the upper surfaces 111 and 121 of one of the image pickup units 110 and 120. In other words, the illumination openings 172 are used to expose the photo-curing glue 150, 160 on a portion of the upper surface of one of the camera units 110, 120, so that the photo-curing glue 150, 160 on the areas a1, a2 can be illuminated by light beams from the outside.
On the other hand, the imaging openings 174A and 174B of the present embodiment pass through the light incident surface 171, the imaging unit 110 captures an external image through the imaging opening 174A, and the imaging unit 120 captures an external image through the imaging opening 174B.
Fig. 3 is a schematic rear view of the housing of the camera module according to the first embodiment of the present invention. Referring to fig. 2F and fig. 3, in the present embodiment, the sidewall 178 of the cover 170 is used to surround the image capturing units 110 and 120, the light openings 172 are formed on the upper wall 176, and the inner surface 173 of the cover 170 is used to connect the image capturing units 110 and 120 through the thermosetting resin 130 and 140 and the light curing resin 150 and 160. In other words, the side wall 178 and the upper wall 176 of the cover 170 form an accommodating space, and the image capturing units 110 and 120 are accommodated in the accommodating space (i.e., the space surrounded by the side wall 178 and the upper wall 176). Therefore, the image capturing units 110 and 120 can be well fixed in the cover 170, and a high-quality and small-sized image capturing assembly 100 is formed.
On the other hand, referring to fig. 3, the shape of the accommodating space surrounded by the cover 170 of the embodiment is substantially a rectangular cube, and the volume of the accommodating space is similar to the total volume of the image capturing units 110 and 120, so the volume of the image capturing assembly 100 can be greatly reduced. Further, the material of the cover 170 of the embodiment includes, for example, plastic, but the invention is not limited thereto, and in other embodiments, the material of the cover may also include metal or nonmetal.
In summary, the cover body of the image capturing assembly according to the embodiment of the invention is suitable for accommodating a plurality of image capturing units, and exposes the photo-curing adhesive on the image capturing units, so that the image capturing units can be falsely fixed in the cover body through the photo-curing adhesive, and the photo-curing adhesive can fix the positions of the image capturing units before being fixed by the photo-curing adhesive, and meanwhile, the coating areas of the photo-curing adhesive and the photo-curing adhesive are not limited by the size of the opening of the cover body, so that the image capturing units can be well fixed in the cover body to form the image capturing assembly. On the other hand, in the method for manufacturing the camera module according to the embodiment, the thermosetting adhesive may be pre-coated on the surface of the camera unit, so that the cover body does not need to reserve a space for injecting and flowing the thermosetting adhesive, thereby reducing the volume of the whole camera module.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (13)
1. A camera assembly, comprising:
the mask comprises an upper wall, a side wall connected with the upper wall, a plurality of illumination openings and a plurality of camera openings, wherein the illumination openings and the camera openings are formed in the upper wall;
the cover body at least covers part of the upper surfaces of the plurality of camera units, and each camera unit acquires an image outwards through one of the plurality of camera openings;
the light-cured colloid is arranged at the positions, corresponding to the plurality of light irradiation openings, of the upper surfaces of the plurality of camera shooting units, and the light-cured colloid is exposed by the plurality of light irradiation openings; and
a thermosetting adhesive body at least arranged between the upper surfaces of the plurality of camera units and the upper wall; each of the plurality of camera units is bonded with the cover body through the light-cured colloid and the thermosetting colloid, wherein the light-cured colloid is used for fixing the relative positions of the plurality of camera units and the cover body, and in each of the plurality of camera units, the distribution area of the thermosetting colloid is shielded by the cover body, so that the thermosetting colloid is filled in the gap between the upper wall and the upper surface of the camera unit.
2. The camera assembly according to claim 1, wherein the shape of the upper surface of each camera unit is rectangular, the distribution area of the light-curable adhesive is adjacent to the corners of the upper surface, and the accommodating space surrounded by the cover is substantially rectangular cuboid.
3. The camera assembly of claim 1, wherein each of the plurality of camera units further comprises a circuit board.
4. The camera assembly of claim 1, wherein the plurality of camera units are connected to a circuit board.
5. The camera assembly of claim 4, wherein a gap between the side walls of the cover and the side surfaces of the plurality of camera elements is insufficient to fill the light curable gel or the thermally curable gel.
6. The camera assembly of claim 1, wherein the housing comprises plastic.
7. A method for manufacturing a camera module, comprising,
providing a cover body, wherein the cover body comprises an upper wall, a plurality of illumination openings and a plurality of camera shooting openings;
coating photo-curing colloid and thermosetting colloid on the upper surfaces of the plurality of camera units, wherein the photo-curing colloid is coated on the positions of the plurality of illumination openings relative to the cover body;
covering the plurality of camera units with the cover body, covering the thermosetting colloid on the plurality of camera units with the upper wall of the cover body, exposing the light-curing colloid on the plurality of camera units with the plurality of illumination openings, and taking images of the plurality of camera units outwards through the plurality of camera openings;
adjusting the positions and angles of the plurality of camera units in the cover body;
curing the light-cured colloid, and further fixing the positions of the plurality of camera units before being fixed by the heat-cured colloid; and
and curing the thermosetting colloid so as to fix the plurality of camera units in the cover body.
8. The method of manufacturing an imaging module according to claim 7, wherein the cover covers a distribution area of the thermosetting adhesive of each of the plurality of imaging units when the plurality of imaging units are covered with the cover.
9. The method of claim 7, wherein the step of providing the plurality of camera units, the light-curable adhesive and the heat-curable adhesive further comprises disposing the light-curable adhesive in a region of the top surface of each of the plurality of camera units adjacent to a corner, and disposing the heat-curable adhesive around the top surface of each of the plurality of camera units.
10. The method of claim 7, wherein the thermally curable adhesive is adapted to be cured at a curing temperature or at ambient temperature.
11. The method of claim 7, wherein the step of curing the light curable gel further comprises: irradiating and curing the light-cured colloid with a curing beam.
12. The method of claim 11, wherein the curing beam is ultraviolet light.
13. The method of claim 7, wherein the thermosetting resin comprises a thermosetting resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610417741.9A CN107517333B (en) | 2016-06-15 | 2016-06-15 | Camera shooting assembly and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610417741.9A CN107517333B (en) | 2016-06-15 | 2016-06-15 | Camera shooting assembly and manufacturing method thereof |
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| CN107517333A CN107517333A (en) | 2017-12-26 |
| CN107517333B true CN107517333B (en) | 2020-06-05 |
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|---|---|---|---|---|
| TWI266943B (en) * | 2004-12-03 | 2006-11-21 | Premier Image Technology Corp | A fabrication method for hollow integration rod suitable for high temperature operation |
| JP5203089B2 (en) * | 2008-08-14 | 2013-06-05 | ラピスセミコンダクタ株式会社 | Manufacturing method of camera module |
| CN204305163U (en) * | 2014-11-28 | 2015-04-29 | 广东欧珀移动通信有限公司 | Double-camera device and terminal device thereof |
| CN206100224U (en) * | 2016-09-30 | 2017-04-12 | 聚晶半导体股份有限公司 | Shooting assembly |
-
2016
- 2016-06-15 CN CN201610417741.9A patent/CN107517333B/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| CN107517333A (en) | 2017-12-26 |
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