TWI755173B - Take-out method, take-out equipment, bag opening method and take-out system - Google Patents
Take-out method, take-out equipment, bag opening method and take-out system Download PDFInfo
- Publication number
- TWI755173B TWI755173B TW109141227A TW109141227A TWI755173B TW I755173 B TWI755173 B TW I755173B TW 109141227 A TW109141227 A TW 109141227A TW 109141227 A TW109141227 A TW 109141227A TW I755173 B TWI755173 B TW I755173B
- Authority
- TW
- Taiwan
- Prior art keywords
- opening
- bag
- processing device
- packaging part
- module
- Prior art date
Links
Images
Landscapes
- Control And Other Processes For Unpacking Of Materials (AREA)
Abstract
Description
本發明涉及一種取物方法、取物設備、開袋設備及取物系統,特別是一種適用於打開半導體料件的保護袋並取出設置於其內的容置盒的取物方法、取物設備、開袋設備及取物系統。 The present invention relates to a method for taking objects, equipment for taking objects, a bag opening device and a system for taking objects, in particular a method for taking objects and a device for taking objects which are suitable for opening a protective bag of a semiconductor material and taking out a accommodating box arranged therein. , bag opening equipment and retrieval system.
一般來說,承裝有晶圓的晶圓盒(例如FOUP)在運送過程中,為了避免落塵停留在晶圓盒外,或者,避免晶圓盒內的晶圓受到外部靜電的影響,大多會於晶圓盒的外部包覆防塵保護袋或是抗靜電袋;包覆於晶圓盒外的防塵保護袋或是抗靜電袋,大多是會通過膠帶等構件固定。 Generally speaking, during the transportation process of a wafer cassette (such as a FOUP) containing wafers, in order to avoid the dust staying outside the wafer cassette, or to prevent the wafers in the wafer cassette from being affected by external static electricity, most of them will A dust-proof protective bag or an anti-static bag is wrapped on the outside of the wafer box; the dust-proof protective bag or anti-static bag wrapped on the outside of the wafer box is mostly fixed by tapes and other components.
在現有應用中,當外部包覆有防塵保護袋或是抗靜電袋的晶圓盒,其所承載的晶圓欲進入相關的工作站進行處理時,是通過人工的方式,先切斷膠帶再打開防塵保護袋或是抗靜電袋,最後再以人工的方式,將晶圓盒由防塵保護袋或抗靜電袋中取出。如此,不但效率低且需要依賴大量的人力。另外,當相關人員因為各種無法抗拒的因素(例如政府宣布停止上班),而無法上班時,整個晶圓的生產工作,將可能為此停擺,從而可能導致重大損失。 In the existing application, when the wafer cassette is covered with a dust-proof protective bag or an anti-static bag and the wafers carried by it want to enter the relevant workstation for processing, the tape is manually cut and then opened. Dust protection bag or antistatic bag, and finally take out the wafer cassette manually from the dust protection bag or antistatic bag. In this way, it is not only inefficient but also needs to rely on a lot of manpower. In addition, when the relevant personnel are unable to go to work due to various irresistible factors (such as the government's announcement to stop working), the entire wafer production work may be suspended for this, which may lead to heavy losses.
本發明公開一種取物方法、取物設備、開袋設備及取物系統,主要用以改善習知利用人工方式打開半導體料件的保護袋再取出保護袋中的容置盒,需耗費大量人力、效率低、作業人員無法上班時整個生產流程可能為此停擺等問題。 The invention discloses a method, equipment, bag-opening device and a system for picking up objects, which are mainly used to improve the conventional manual method to open a protection bag for semiconductor materials and then take out a storage box in the protection bag, which requires a lot of manpower , low efficiency, and the entire production process may be shut down when operators cannot go to work.
本發明的其中一實施例公開一種取物方法,其用以由一半導體料件的一保護袋中取出一容置盒,所述保護袋具有一容置空間及一開口,所述容置盒是通過所述開口而設置於所述容置空間,所述保護袋定義有一包裝部及一非包裝部,所述包裝部包覆於所述容置盒的外側,所述非包裝部被彎折成為一尾端結構,所述膠帶黏貼於所述包裝部及所述尾端結構,而所述膠帶用以使所述尾端結構固定於所述包裝部,所述取物方法包含:一定位步驟:固定所述半導體料件;一切割步驟:控制至少一刀具機構先後切斷所述膠帶及所述尾端結構,以使所述包裝部形成一取物開口,所述容置盒則能通過所述取物開口露出;一撐開步驟:控制一撐袋機構,撐開所述包裝部;一取出步驟:控制一取物裝置,伸入所述包裝部中,固持所述容置盒,並將所述容置盒由所述包裝部取出。 One of the embodiments of the present invention discloses a method for taking out an object, which is used to take out a accommodating box from a protective bag of a semiconductor material, the protective bag has an accommodating space and an opening, and the accommodating box is It is arranged in the accommodating space through the opening, the protective bag defines a packaging part and a non-packaging part, the packaging part is wrapped on the outside of the accommodating box, and the non-packaging part is bent Folded into a tail end structure, the tape is pasted on the packaging part and the tail end structure, and the tape is used to fix the tail end structure on the packaging part, and the picking method includes: a The positioning step: fixing the semiconductor material; a cutting step: controlling at least one cutter mechanism to cut the tape and the end structure successively, so that the packaging part forms an opening for taking objects, and the accommodating box is can be exposed through the extracting opening; one opening step: controlling a bag-opening mechanism to open the packaging part; one taking out step: controlling a extracting device, extending into the packaging part, and holding the accommodating part box, and take out the accommodating box from the packaging part.
本發明的其中一實施例公開一種取物設備,其用以由一半導體料件的一保護袋中取出一容置盒,所述保護袋具有一容置空間及一開口,所述容置盒是通過所述開口而設置於所述容置空間中,所述保護袋定義有一包裝部及一非包裝部,所述包裝部包覆於所述容置盒的外側,所述非包裝部被彎折成為一尾端結構,所述膠帶黏貼於所述包裝部及所述尾端結構,而所述膠帶用以使所述尾端結構固定於所述包裝部,所述取物設備包含:一處理裝置;一固定機構,其電性連接所述處理裝置,所述處理裝置能控制所述固定機構固定所述半導體料件;至少一刀具機構,其電性連接所述處理裝置,所述刀具機構用以切斷所述膠帶及所述尾端結構;一撐袋機構,其電性連接所述處理裝置,所述撐袋機構用以撐開所述包裝部;一取物裝置,其電性連接所述處理裝置,所述取物裝置用以將設置於所述包裝部中的所述容置盒,由所述包裝部中取出;其中,所述處理裝置是先控制所述固定機構固定所述半導體料件,接著控制所述刀具機構切斷所述膠帶及所述尾端結構,以使所 述包裝部形成一取物開口,所述容置盒則能通過所述取物開口露出,再控制所述撐袋機構,撐開所述包裝部,最後控制所述取物裝置,伸入所述包裝部中,將所述容置盒取出。 One of the embodiments of the present invention discloses a pick-up device, which is used to take out an accommodating box from a protective bag of a semiconductor material, the protective bag has an accommodating space and an opening, and the accommodating box is It is arranged in the accommodating space through the opening, the protective bag defines a packaging part and a non-packaging part, the packaging part is wrapped on the outside of the accommodating box, and the non-packaging part is Bending to form a tail end structure, the tape is pasted on the packaging part and the tail end structure, and the tape is used to fix the tail end structure on the packaging part, and the picking device includes: a processing device; a fixing mechanism, which is electrically connected to the processing device, the processing device can control the fixing mechanism to fix the semiconductor material; at least one cutter mechanism, which is electrically connected to the processing device, the A cutter mechanism is used to cut the tape and the tail end structure; a bag-pulling mechanism is electrically connected to the processing device, and the bag-pushing mechanism is used to open the packaging part; a fetching device is The processing device is electrically connected, and the pick-up device is used to take out the accommodating box set in the packaging part from the packaging part; wherein, the processing device first controls the fixing The mechanism fixes the semiconductor material, and then controls the cutter mechanism to cut the tape and the tail structure, so that all The packaging part forms a fetching opening, and the accommodating box can be exposed through the fetching opening, and then the bag-pushing mechanism is controlled to open the packaging part, and finally the fetching device is controlled to extend into the In the packaging part, the accommodating box is taken out.
本發明的其中一實施例公開一種開袋設備,其用以由一半導體料件的一保護袋中取出一容置盒,保護袋具有一容置空間及一開口,容置盒是通過開口而設置於容置空間,保護袋定義有一包裝部及一非包裝部,包裝部包覆於容置盒的外側,非包裝部被彎折成為一尾端結構,膠帶黏貼於包裝部及尾端結構,而膠帶用以使尾端結構固定於包裝部,開袋設備包含:一處理裝置,其能與一取物裝置通訊連接;一固定機構,其電性連接處理裝置,處理裝置能控制固定機構固定半導體料件;至少一刀具機構,其電性連接處理裝置,刀具機構用以切斷膠帶及尾端結構;一撐袋機構,其電性連接處理裝置,撐袋機構用以撐開包裝部;其中,處理裝置是先控制固定機構固定半導體料件,接著控制刀具機構切斷膠帶及尾端結構,以使包裝部形成一取物開口,容置盒則能通過取物開口露出,再控制撐袋機構,撐開包裝部;當撐袋機構撐開包裝部時,處理裝置能傳遞訊號至取物裝置,以使取物裝置由包裝部中取出容置盒。 One of the embodiments of the present invention discloses a bag opening device, which is used for taking out a accommodating box from a protective bag of a semiconductor material. The protective bag has an accommodating space and an opening, and the accommodating box is opened through the opening. Set in the accommodating space, the protective bag defines a packaging part and a non-packaging part, the packaging part is wrapped on the outside of the accommodating box, the non-packaging part is bent into a tail end structure, and the tape is pasted on the packaging part and the tail end structure , and the tape is used to fix the tail end structure on the packaging part. The bag opening equipment includes: a processing device, which can be connected to a fetching device; a fixing mechanism, which is electrically connected to the processing device, and the processing device can control the fixing mechanism. Fixing the semiconductor material; at least one knife mechanism, which is electrically connected to the processing device, and the knife mechanism is used to cut off the tape and the end structure; a bag-opening mechanism, which is electrically connected to the processing device, and the bag-opening mechanism is used to open the packaging part ; Among them, the processing device first controls the fixing mechanism to fix the semiconductor material, and then controls the cutter mechanism to cut off the tape and the tail end structure, so that the packaging part forms a fetching opening, and the accommodating box can be exposed through the fetching opening, and then controls The bag-opening mechanism opens the packaging part; when the bag-opening mechanism opens the packaging part, the processing device can transmit a signal to the fetching device, so that the fetching device can take out the accommodating box from the packaging part.
綜上所述,本發明的取物方法、取物設備、開袋設備及取物系統可以自動化地切斷半導體料件的膠帶及尾端結構並打開保護袋,再將設置於保護袋中的容置盒取出,於整個過程中,基本上無需人工操作,而可大幅地降低人力的需求,且可大幅提升整體效率。 To sum up, the picking method, picking device, bag opening device and picking system of the present invention can automatically cut off the tape and the tail end structure of the semiconductor material, open the protective bag, and then remove the In the whole process of taking out the accommodating box, there is basically no need for manual operation, which can greatly reduce the demand for manpower, and can greatly improve the overall efficiency.
為能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與附圖,但是此等說明與附圖僅用來說明本發明,而非對本發明的保護範圍作任何的限制。 In order to further understand the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention, but these descriptions and drawings are only used to illustrate the present invention, rather than make any claims to the protection scope of the present invention. limit.
A:半導體料件 A: Semiconductor material
A1:保護袋 A1: Protective bag
A11:容置空間 A11: Accommodating space
A12:開口 A12: Opening
A13:包裝部 A13: Packaging Department
A131:底部 A131: Bottom
A14:非包裝部 A14: Non-packaging department
A15:尾端結構 A15: Tail structure
A151:內側 A151: Inside
A2:容置盒 A2: accommodating box
A3:膠帶 A3: Tape
A4:折痕 A4: Crease
A5:取物開口 A5: Take out the opening
S:開袋系統 S: bag opening system
S1:開袋設備 S1: bag opening equipment
1:處理裝置 1: Processing device
2:固定機構 2: Fixed mechanism
21:推抵裝置 21: Push device
211:驅動器 211: Drive
212:推抵件 212: Push pieces
22:抵壓裝置 22: Pressing device
221:驅動器 221: Drive
222:抵壓件 222: Pressing parts
3:第一刀具機構 3: The first tool mechanism
31:第一刀具 31: The first tool
311:本體 311: Ontology
312:刀刃 312: Blade
313:凸出結構 313: Protruding structure
32:縱向移動模組 32: Vertical movement module
321:滑軌 321: Slide rail
322:滑塊 322: Slider
33:橫向移動模組 33: Lateral movement module
331:滑軌 331: Slide rail
332:滑塊 332: Slider
4:提拉機構 4: Lifting mechanism
41:翻轉裝置 41: Flip device
411:移動模組 411: Mobile Mods
4111:驅動器 4111: Drive
4112:推桿 4112: Putter
4113:連接件 4113: Connector
412:旋轉模組 412: Rotation Module
413:支撐結構 413: Support Structure
414:吸盤組件 414: Suction cup assembly
42:輔助抵壓裝置 42: Auxiliary pressing device
421:縱向移動模組 421: Vertical movement module
422:橫向移動模組 422: Lateral Movement Module
423:輔助抵壓件 423: Auxiliary pressing parts
43:移動裝置 43: Mobile Devices
44:夾持裝置 44: Clamping device
441:移動模組 441: Mobile Mods
4411:滑軌 4411: Slide rail
4412:滑塊 4412: Slider
442:連接臂 442: connecting arm
443:夾具 443: Fixtures
4431:驅動器 4431: Drive
4432:夾臂 4432: Clamp Arm
5:第二刀具機構 5: The second tool mechanism
51:抵靠裝置 51: Abutment device
511:驅動器 511: Drive
512:抵靠板 512: Abutment plate
52:刀具裝置 52: Tool device
521:移動模組 521: Mobile Mods
5211:驅動器 5211: Drive
5212:連接板 5212: Connection board
522:殼體 522: Shell
523:第二刀具 523: Second Tool
524:伸縮機構 524: Telescopic mechanism
6:輸送機構 6: Conveying mechanism
61:軌道 61: Orbit
62:載台 62: Carrier
7:撐袋機構 7: bag support mechanism
71:支撐結構 71: Support Structure
72:升降模組 72: Lifting module
721:升降組件 721: Lifting components
7211:驅動器 7211: Drive
7212:推桿 7212: Putter
73:移動模組 73: Mobile Mods
731:驅動器 731: Drive
732:推桿 732: Putter
733:連接件 733: Connector
74:桿體 74: Rod body
75:輔助移動模組 75: Auxiliary Mobility Module
751:驅動器 751: Drive
752:推桿 752: Putter
753:連接件 753: Connector
76:輔助板體 76: Auxiliary board
77:翻轉裝置 77: Flip device
771:移動模組 771: Mobile Mods
7711:驅動器 7711: Drive
7712:推桿 7712: Putter
772:旋轉模組 772: Rotation Module
773:支撐結構 773: Support Structure
774:吸盤組件 774: Suction Cup Assembly
8:取物裝置 8: Pick-up device
S2:取物設備 S2: Pickup Equipment
S3:中央控制設備 S3: Central control device
S4:袋體回收設備 S4: Bag recycling equipment
S41:縱向移動模組 S41: Vertical movement module
S42:橫向移動模組 S42: Lateral Movement Module
S43:夾持模組 S43: Clamping module
S431:驅動組件 S431: Drive assembly
S432:夾臂 S432: Clamp Arm
S4321:第二抵靠面 S4321: Second contact surface
S433:伸入構件 S433: Projecting into the member
S4331:第一抵靠面 S4331: The first abutting surface
S44:平台 S44: Platform
S45:導引結構 S45: Guiding structure
S46:移動模組 S46: Mobile Mods
圖1為本發明的開袋設備的示意圖。 FIG. 1 is a schematic diagram of the bag opening device of the present invention.
圖2為半導體料件的示意圖。 FIG. 2 is a schematic diagram of a semiconductor material.
圖3為保護袋及容置盒的示意圖。 FIG. 3 is a schematic diagram of the protective bag and the accommodating box.
圖4及圖5為保護袋的不同狀態的示意圖。 4 and 5 are schematic views of different states of the protective bag.
圖6為本發明的開袋設備的固定機構的示意圖。 FIG. 6 is a schematic diagram of the fixing mechanism of the bag opening device of the present invention.
圖7為本發明的開袋設備的固定機構固持半導體料件的示意圖。 FIG. 7 is a schematic diagram of the semiconductor material being held by the fixing mechanism of the bag opening device of the present invention.
圖8至圖12及圖14為本發明的開袋設備切割半導體料件的膠帶並夾持所述尾端結構的作動示意圖。 8 to 12 and 14 are schematic views of the operation of the bag opening device of the present invention to cut the tape of the semiconductor material and clamp the tail end structure.
圖13為本發明的開袋設備的提拉機構的夾持裝置的示意圖。 Fig. 13 is a schematic diagram of the clamping device of the pulling mechanism of the bag opening device of the present invention.
圖15至圖18為本發明的開袋設備切割半導體料件的尾端結構的作動示意圖。 15 to 18 are schematic diagrams of the operation of the bag opening device of the present invention for cutting the tail end structure of the semiconductor material.
圖19為本發明的開袋設備的撐袋機構、提拉機構及輸送機構的局部示意圖。 Fig. 19 is a partial schematic view of the bag opening mechanism, the pulling mechanism and the conveying mechanism of the bag opening device of the present invention.
圖20為本發明的開袋設備的撐袋機構的示意圖。 Fig. 20 is a schematic diagram of the bag opening mechanism of the bag opening device of the present invention.
圖21為本發明的開袋設備的兩個翻轉裝置、輸送機構及半導體料件的示意圖。 21 is a schematic diagram of two inversion devices, a conveying mechanism and a semiconductor material of the bag opening equipment of the present invention.
圖22及圖23為本發明的開袋設備的翻轉裝置將打開包裝部的開口的動作示意圖。 FIG. 22 and FIG. 23 are schematic diagrams of the operation of opening the opening of the packaging portion by the inversion device of the bag opening device of the present invention.
圖24及圖25為本發明的開袋設備的撐袋機構撐開包裝部的動作示意圖。 FIG. 24 and FIG. 25 are schematic diagrams of the action of the bag-opening mechanism of the bag-opening device of the present invention to open the packaging part.
圖26為本發明的開袋系統的示意圖。 Figure 26 is a schematic diagram of the bag opening system of the present invention.
圖27為本發明的開袋系統的袋體回收設備及保護袋的包裝部的示意圖。 27 is a schematic diagram of the bag body recovery equipment and the packaging part of the protective bag of the bag opening system of the present invention.
圖28為本發明的開袋系統的袋體回收設備的夾持模組伸入 保護袋的包裝部的示意圖。 Fig. 28 is the extension of the clamping module of the bag recovery device of the bag opening system of the present invention Schematic diagram of the packaging part of the protective bag.
圖29為本發明的開袋系統的袋體回收設備將保護袋設置於平台的示意圖。 FIG. 29 is a schematic diagram of setting the protective bag on the platform by the bag body recovery device of the bag opening system of the present invention.
圖30為本發明的開袋方法的流程示意圖。 FIG. 30 is a schematic flowchart of the bag opening method of the present invention.
圖31為本發明的開袋方法的另一流程示意圖。 Fig. 31 is another schematic flow chart of the bag opening method of the present invention.
於以下說明中,如有指出請參閱特定圖式或是如特定圖式所示,其僅是用以強調於後續說明中,所述及的相關內容大部份出現於該特定圖式中,但不限制該後續說明中僅可參考所述特定圖式。需特別說明的是,為利清楚地呈現本發明的各個設備、裝置、機構等元件,於本發明的各圖式中,省略了用來支撐設備、裝置、機構等元件的支架。 In the following description, if it is indicated to refer to a specific figure or as shown in a specific figure, it is only used for emphasis in the subsequent description, and most of the related content mentioned appears in the specific figure, However, it is not limited that only the specific drawings may be referred to in this subsequent description. It should be noted that, in order to clearly present the various equipment, devices, mechanisms and other elements of the present invention, the brackets used to support the equipment, devices, mechanisms and other elements are omitted in the drawings of the present invention.
請參閱圖1至圖3,本發明的開袋設備S1用以打開一半導體料件A的一保護袋A1,而使位於保護袋A1內的容置盒A2露出,以便於其他取物裝置(例如各式機械手臂)將該容置盒A2,由保護袋A1中取出。開袋設備S1包含一處理裝置1、一固定機構2、一第一刀具機構3、一提拉機構4、一第二刀具機構5、一輸送機構6及一撐袋機構7。於本實施例中是以開袋設備S1包含兩個刀具機構為例,但開袋設備S1所包含的刀具機構不以此為限,在不同的實施例中,開袋設備S1也可以是僅包含單一個刀具機構。另外,在不同的實施例中,開袋設備S1也可以是不包含所述固定機構2及所述提拉機構4中的至少一個。
Please refer to FIG. 1 to FIG. 3 , the bag opening device S1 of the present invention is used to open a protection bag A1 of a semiconductor material A, so as to expose the accommodating box A2 in the protection bag A1, so as to facilitate other fetching devices ( For example, various mechanical arms) take out the accommodating box A2 from the protective bag A1. The bag opening device S1 includes a processing device 1 , a
處理裝置1電性連接固定機構2、第一刀具機構3、提拉機構4、第二刀具機構5、輸送機構6及撐袋機構7,處理裝置1例如是各式電腦、伺服器等。固定機構2用以固持半導體料件A。第一刀具機構3、提拉機構4及第二刀具機構5用以相互配合,以打開被固定機構2固持的半導體料件A的保護袋A1。輸送機構6用以與固定機構2相互配合,以將被固持的半導體料件A,
於第一刀具機構3、第二刀具機構5及撐袋機構7之間移動。撐袋機構7用以撐開被打開後的半導體料件A的保護袋A1,以利於取物裝置將設置於保護袋A1中的容置盒A2取出。為利清楚地呈現開袋設備S1所包含的各個機構,於本申請的各圖式中省略了用來支撐處理裝置1、第一刀具機構3、第二刀具機構5及撐袋機構7的支架。
The processing device 1 is electrically connected to the
如圖2至圖5所示,半導體料件A包含保護袋A1、一容置盒A2及兩個膠帶A3。保護袋A1具有一容置空間A11及一開口A12,容置盒A2是通過開口A12而設置於容置空間A11。在實際應用中,容置盒A2例如是各式晶圓盒(例如FOUP),而保護袋A1例如是錫箔袋、防靜電袋。如圖3及圖4所示,當容置盒A2設置於保護袋A1中後,一部分的保護袋A1將包覆於容置盒A2的外圍,該部分的保護袋A1定義為一包裝部A13,保護袋A1的其餘部分則定義為一非包裝部A14。如圖2及圖5所示,非包裝部A14具有開口A12的一側被相關人員或設備操作,而向包裝部A13的方向反覆彎折後,將成為一尾端結構A15。尾端結構A15則是被兩條膠帶A3固定於包裝部A13。兩條膠帶A3將尾端結構A15固定於包裝部A13的頂面後,保護袋A1、設置於保護袋A1內的容置盒A2及兩條膠帶A3將共同組成所述半導體料件A。 As shown in FIG. 2 to FIG. 5 , the semiconductor material A includes a protective bag A1 , an accommodating box A2 and two adhesive tapes A3 . The protection bag A1 has an accommodating space A11 and an opening A12, and the accommodating box A2 is disposed in the accommodating space A11 through the opening A12. In practical applications, the accommodating box A2 is, for example, various wafer boxes (eg, FOUP), and the protective bag A1 is, for example, a tin foil bag or an anti-static bag. As shown in FIG. 3 and FIG. 4 , after the accommodating box A2 is set in the protective bag A1, a part of the protective bag A1 will be wrapped around the periphery of the accommodating box A2, and this part of the protective bag A1 is defined as a packaging part A13 , and the rest of the protective bag A1 is defined as a non-packaging portion A14. As shown in FIG. 2 and FIG. 5 , the side of the non-packaging portion A14 with the opening A12 is operated by relevant personnel or equipment, and is repeatedly bent in the direction of the packaging portion A13 to form a tail end structure A15. The tail end structure A15 is fixed to the packaging part A13 by two tapes A3. After the two adhesive tapes A3 fix the end structure A15 on the top surface of the packaging portion A13, the protective bag A1, the accommodating box A2 disposed in the protective bag A1 and the two adhesive tapes A3 together form the semiconductor material A.
如圖1、圖6至圖8所示,輸送機構6可以包含一軌道61及一載台62,載台62可滑動地設置於軌道61。處理裝置1電性連接輸送機構6,載台62能受處理裝置1控制而沿軌道61移動。載台62用以承載半導體料件A,固定機構2設置於載台62,固定機構2用以固持設置於載台62上的半導體料件A。處理裝置1能控制載台62於軌道61上滑動,而使設置於載台62上的半導體料件A,由鄰近第一刀具機構3的位置移動至鄰近第二刀具機構5的位置。
As shown in FIGS. 1 , 6 to 8 , the conveying
固定機構2可以包含四個推抵裝置21及兩個抵壓裝置22。各個推抵裝置21可以包含一驅動器211及一推抵件212。驅動器211與處理裝置1電性連接,推抵件212與驅動器211相連接。處理裝置1能控制驅動器211作
動,而使推抵件212向靠近或遠離載台62的方向移動,據以推抵或不再推抵設置於載台62的半導體料件A的一側。舉例來說,驅動器211可以是包含一氣壓缸(或油壓缸)及多個推桿,處理裝置1能控制氣壓缸,而使推桿及其所連接的推抵件212向靠近或遠離載台62的方向移動。
The
當半導體料件A設置於載台62時,處理裝置1將控制四個推抵裝置21,而使四個推抵件212抵壓半導體料件A的四個側面。在實際應用中,載台62可以是設置有至少一個偵測器,偵測器用以偵測載台62上是否設置有半導體料件A,而處理裝置1能依據偵測器的偵測結果,判斷載台62上是否設置有半導體料件A。當處理裝置1通過偵測器所偵測的結果,判斷載台62上設置有半導體料件A時,處理裝置1則可以是控制四個推抵裝置21作動,而使四個推抵裝置21推抵半導體料件A的四個側面,藉此固持半導體料件A。
When the semiconductor material A is set on the
在具體的實施中,在載台62上設置有半導體料件A時,處理裝置1例如可以是控制四個推抵裝置21同時作動,而使四個推抵件212同時推抵半導體料件A的四側,如此,即使半導體料件A稍有偏差地設置於載台62上,最終仍可以被四個推抵件212推抵,而移動至正確的位置。也就是說,四個推抵裝置21除了具有用來固持設置於載台62上的半導體料件A的功用外,四個推抵裝置21還具有用來使半導體料件A正確地設置於載台62上的功用(即歸正的功用)。
In a specific implementation, when the semiconductor material A is set on the
各個抵壓裝置22包含一驅動器221及一抵壓件222,驅動器221與處理裝置1電性連接,抵壓件222與驅動器221相連接,處理裝置1能控制兩個驅動器221,而使兩個抵壓件222抵壓包裝部A13。在實際應用中,所述驅動器221例如可以是包含氣壓缸及多個推桿,處理裝置1能控制驅動器221作動,而使多個推桿伸縮,以帶動抵壓件222抵壓或不再抵壓半導體料件A的包裝部A13。
Each
兩個抵壓裝置22可以是鄰近於兩個推抵裝置21設置,且處理裝置1控制提拉機構4固持尾端結構A15前,可以是先控制兩個推抵裝置21作動,而使兩個推抵件212不再推抵半導體料件A,再控制兩個抵壓裝置22作動,而使兩個抵壓件222抵壓包裝部A13的一底部A131(如圖2所示)。於本實施例中,是以各個抵壓裝置22鄰近於其中一個推抵裝置21設置,但抵壓裝置22不一定要鄰近其中一個推抵裝置21設置。
The two
如圖8及圖9所示,第一刀具機構3可以是包含一第一刀具31、一縱向移動模組32及一橫向移動模組33。第一刀具31與縱向移動模組32相連接,縱向移動模組32與橫向移動模組33相連接。處理裝置1電性連接縱向移動模組32及橫向移動模組33。處理裝置1能控制縱向移動模組32作動,而使第一刀具31沿一縱向方向(例如是垂直於地面)向設置於載台62上的半導體料件A靠近或遠離。處理裝置1能控制橫向移動模組33作動,而使第一刀具31沿一橫向方向(例如是垂直於縱向方向)向設置於載台62上的半導體料件A靠近或遠離。第一刀具31可以是包含一本體311,所述本體311的一側邊的至少兩個區段設置有一刀刃312,該側邊的其餘區段未設置有刀刃312。
As shown in FIGS. 8 and 9 , the
在實際應用中,第一刀具機構3的縱向移動模組32可以包含有一滑軌321及一滑塊322,滑塊322能受控制而於滑軌321上滑動,第一刀具機構3的橫向移動模組33可以包含有一滑軌331及一滑塊332,滑塊332能受控制而於滑軌331上移動。第一刀具31與縱向移動模組32的滑塊322相連接,縱向移動模組32的滑軌321與橫向移動模組33的滑塊332相連接。
In practical applications, the
在實際應用中,輸送機構6是用來使半導體料件A沿著X軸方向移動,而第一刀具機構3的橫向移動模組33是使第一刀具31沿著Y軸方向移動,第一刀具機構3的縱向移動模組32則是使第一刀具31沿著Z軸方向移動。
In practical applications, the conveying
請復參圖1,開袋設備S1的提拉機構4可以是包含一翻轉裝置41、一輔助抵壓裝置42、一移動裝置43及一夾持裝置44。翻轉裝置41及輔助抵壓裝置42鄰近於第一刀具機構3設置,移動裝置43可由鄰近第一刀具機構3的位置移動至鄰近第二刀具機構5的位置,夾持裝置44與移動裝置43相連接,夾持裝置44用以夾持尾端結構A15,夾持裝置44能隨移動裝置43由鄰近第一刀具機構3的位置移動至鄰近第二刀具機構5的位置。
Referring back to FIG. 1 , the pulling
需說明的是,提拉機構4主要是用來使半導體料件A的尾端結構A15相對於包裝部A13呈直立地設置,於本實施例中是以提拉機構4包含所述翻轉裝置41、輔助抵壓裝置42、移動裝置43及夾持裝置44為例,但提拉機構4所包含的構件不以此為限。
It should be noted that the pulling
如圖8所示,翻轉裝置41可以是包含一移動模組411、一旋轉模組412、一支撐結構413及多個吸盤組件414。移動模組411及旋轉模組412電性連接處理裝置1,移動模組411與旋轉模組412相連接,支撐結構413與旋轉模組412相連接。多個吸盤組件414間隔地設置於支撐結構413,各個吸盤組件414連接一抽氣裝置,處理裝置1能控制抽氣裝置,而使各個吸盤組件414具有吸力或不再具有吸力。
As shown in FIG. 8 , the turning
輔助抵壓裝置42可以是包含一縱向移動模組421、一橫向移動模組422及一輔助抵壓件423,縱向移動模組421與輔助抵壓件423相連接,縱向移動模組421與橫向移動模組422相連接。處理裝置1電性連接輔助抵壓裝置42的縱向移動模組421及橫向移動模組422。處理裝置1能控制輔助抵壓裝置42的縱向移動模組421作動,而使輔助抵壓件423沿一縱向方向(例如是垂直地面,如圖中所示Z軸方向)向半導體料件A靠近或遠離;處理裝置1能控制輔助抵壓裝置42的橫向移動模組422作動,而使輔助抵壓件423沿一橫向方向(例如是垂直縱向方向,如圖中所示Y軸方向)向半導體料件A靠近或遠離。
The auxiliary
處理裝置1能控制移動模組411作動,而使旋轉模組412、支撐結構413及多個吸盤組件414沿一橫向方向(例如是平行於地面,如圖9所示的Y軸方向)向設置於載台62上的半導體料件A靠近或遠離;處理裝置1能控制旋轉模組412作動,而使支撐結構413旋轉(例如是以圖9所示X軸為中心旋轉),據以改變多個吸盤組件414的方向。移動模組411例如是包含一驅動器4111、多個推桿4112及一連接件4113,多個推桿4112的兩端分別與驅動器4111及連接件4113相連接,處理裝置1能控制驅動器4111,而使多個推桿4112帶動連接件4113向靠近或遠離驅動器4111的方向移動,據以帶動旋轉模組412、支撐結構413及多個吸盤組件414沿橫向方向移動。
The processing device 1 can control the movement of the moving
如圖8至圖12及圖14所示,其顯示為開袋設備去除設置於載台62上的半導體料件A的膠帶A3,並夾持尾端結構A15的作動示意圖。如圖8至圖10所示,當載台62設置有半導體料件A,處理裝置1可以是先控制輔助抵壓裝置42作動,而使輔助抵壓件423移動至半導體料件A的尾端結構A15的旁邊,並使輔助抵壓件423抵壓半導體料件A的包裝部A13的頂面,接著,處理裝置1將控制第一刀具機構3作動,而使第一刀具31的兩個刀刃312切割半導體料件A的兩條膠帶A3。
As shown in FIG. 8 to FIG. 12 and FIG. 14 , it is a schematic diagram of the operation of the bag opening device to remove the tape A3 of the semiconductor material A set on the
如圖9及圖10所示,需說明的是,第一刀具31的本體311還可以是包含一凸出結構313,凸出結構313位於兩個刀刃312之間,凸出結構313用來推抵尾端結構A15。凸出結構313的側邊與本體311的另一側邊的距離,大於各個刀刃312的側邊與本體311的另一側邊的距離。
As shown in FIG. 9 and FIG. 10 , it should be noted that the
如圖10所示,當第一刀具31切斷兩條膠帶A3後,處理裝置1可以是控制第一刀具31持續地移動,而使第一刀具31伸入尾端結構A15與非包裝部A14之間,以通過凸出結構313推抵非包裝部A14,據以使尾端結構A15相對於包裝部A13翻轉,翻轉後的尾端結構A15,其內側A151將露出。在第一刀具31推抵尾端結構A15的過程中,輔助抵壓件423可以是仍然抵壓
於包裝部A13的頂面,但不以此為限,輔助抵壓件423也可以是不抵壓包裝部A13。
As shown in FIG. 10 , after the
如圖11及圖12所示,當兩條膠帶A3被切斷,且尾端結構A15被第一刀具31推抵,而尾端結構A15的內側A151露出時,處理裝置1將控制翻轉裝置41作動,而使支撐結構413及設置於其上的多個吸盤組件414移動至尾端結構A15上,此時,處理裝置1將控制抽氣裝置作動,而使多個吸盤組件414產生吸力,並吸附尾端結構A15。當多個吸盤組件414吸附尾端結構A15後,處理裝置1將控制旋轉模組412作動,而使支撐結構413及設置於其上的多個吸盤組件414旋轉90度(角度不以此為限),藉此,使被多個吸盤組件414吸附的尾端結構A15相對於包裝部A13呈直立地設置。
As shown in FIG. 11 and FIG. 12 , when the two tapes A3 are cut, and the end structure A15 is pushed by the
請參閱圖13,夾持裝置44可以包含一移動模組441、一連接臂442及一夾具443。連接臂442與移動模組441相連接,夾具443與連接臂442相連接。處理裝置1電性連接移動模組441,處理裝置1能控制移動模組441作動,而使連接臂442及夾具443由鄰近第一刀具機構3的位置移動至鄰近第二刀具機構5的位置。移動模組441例如可以是包含一滑軌4411及一滑塊4412,滑塊4412與連接臂442相連接,處理裝置1能控制滑塊4412於滑軌4411上滑動。夾具443可以包含一驅動器4431及兩個夾臂4432,兩個夾臂4432與驅動器4431相連接,處理裝置1能控制驅動器4431,而使兩個夾臂4432相對於驅動器4431向彼此相互靠近或遠離的方向旋轉,據以夾持或不再夾持尾端結構A15。
Referring to FIG. 13 , the clamping
如圖1、圖14及圖15所示,當多個吸盤組件414吸附尾端結構A15,而尾端結構A15相對於包裝部A13呈直立地設置時,處理裝置1將控制夾持裝置44作動,而使連接臂442及夾具443先移動至尾端結構A15的上方,再控制夾具443夾持尾端結構A15。當夾具443夾持尾端結構A15後,處理裝置1將控制翻轉裝置41作動,而使多個吸盤組件414不再吸附尾端結構A15,
且處理裝置1將同時控制夾持裝置44及載台62作動,而使夾持裝置44及半導體料件A一同移動至鄰近於第二刀具機構5的位置。
As shown in FIG. 1 , FIG. 14 and FIG. 15 , when the plurality of
如圖15至圖18所示,第二刀具機構5電性連接處理裝置1,處理裝置1能控制第二刀具機構5作動,以切斷尾端結構A15,而使尾端結構A15與包裝部A13分離。具體來說,第二刀具機構5例如可以是包含一抵靠裝置51及一刀具裝置52。抵靠裝置51與刀具裝置52彼此相面對地設置。抵靠裝置51可以包含一驅動器511及一抵靠板512,驅動器511與抵靠板512相連接,處理裝置1電性連接驅動器511,處理裝置1能控制驅動器511作動,而使抵靠板512向靠近或遠離刀具裝置52的方向移動。
As shown in FIG. 15 to FIG. 18 , the
如圖15及圖16所示,刀具裝置52可以包含一移動模組521、一殼體522、一第二刀具523及一伸縮機構524。移動模組521包含兩個驅動器5211及一連接板5212,兩個驅動器5211電性連接處理裝置1,連接板5212與兩個驅動器5211相連接,處理裝置1能控制兩個驅動器5211作動,而使連接板5212向靠近或遠離抵靠裝置51的方向移動。連接板5212與殼體522相連接,第二刀具523設置於殼體522中,殼體522具有穿孔,伸縮機構524設置於殼體522中,伸縮機構524與第二刀具523相連接。處理裝置1電性連接伸縮機構524,處理裝置1能控制伸縮機構524作動,而使第二刀具523的一部分通過穿孔突出於殼體522,或是,使第二刀具523由突出於殼體522的狀態縮回至殼體522中。
As shown in FIG. 15 and FIG. 16 , the
如圖16至圖18所示,當夾持裝置44的夾具443的兩個夾臂4432夾持尾端結構A15,且尾端結構A15對應位於抵靠裝置51及刀具裝置52之間時,處理裝置1將控制抵靠裝置51及第二刀具裝置52的移動模組521的兩個驅動器5211作動,而使抵靠板512及連接板5212共同夾持尾端結構A15。當抵靠板512及連接板5212共同夾持尾端結構A15時,處理裝置1將控制伸縮機構524作動,而使第二刀具523伸出穿孔,並切斷尾端結構A15。
As shown in FIGS. 16 to 18 , when the two clamping
值得一提的是,如圖6、圖15及圖16所示,在較佳的實施例中,處理裝置1在控制第二刀具機構5作動之前,可以是先控制兩個抵壓裝置22作動,而使兩個抵壓件222抵壓保護袋A1的底部A131;當兩個抵壓件222抵壓保護袋A1的底部A131時,處理裝置1將控制夾持裝置44作動,而使夾具443向遠離載台62的方向移動,此時,被夾具443夾持的尾端結構A15與包裝部A13相連接的部分將呈現為相對緊繃的狀態。當被夾具443夾持的尾端結構A15呈現為相對緊繃的狀態時,處理裝置1才接續控制第二刀具機構5作動,而使第二刀具523在抵靠板512及連接板5212共同夾持尾端結構A15的情況下,切割尾端結構A15。通過先使被夾具443夾持的尾端結構A15與包裝部A13相連接的部分呈現為相對緊繃的狀態,再利用第二刀具523切割尾端結構A15的設計,將可以確保第二刀具523能夠順暢地切斷尾端結構A15與包裝部A13兩者間的連接。
It is worth mentioning that, as shown in FIG. 6 , FIG. 15 and FIG. 16 , in a preferred embodiment, the processing device 1 may first control the two
需強調的是,在容置盒A2為晶圓盒且保護袋A1為鋁箔袋或防靜電袋的實施例中,通過使第一刀具31及第二刀具523分別用來切斷半導體料件A的膠帶A3及尾端結構A15的設計,將可以確保第一刀具31及第二刀具523能夠分別順利地切斷膠帶A3及尾端結構A15,且可以確保殘留於第一刀具31上的膠帶A3的黏膠不會沾黏至晶圓盒。在實際應用中,第一刀具31的刀刃可以是呈現為平整狀,第二刀具523的刀刃可以是鋸齒狀,如此,將可快速且順利地分別切割膠帶A3及尾端結構A15。若是使用呈現為鋸齒狀的刀具,依序切割膠帶A3及尾端結構A15,則該刀具切割完膠帶A3(如圖2所示)後,膠帶A3的黏膠將會大量地殘留於刀刃,如此,不但會導致刀刃失去鋒利,還可能發生黏膠沾黏至晶圓盒的問題。
It should be emphasized that, in the embodiment in which the accommodating box A2 is a wafer box and the protective bag A1 is an aluminum foil bag or an anti-static bag, the
如圖17及圖18所示,當第二刀具523切斷尾端結構A15後,處理裝置1將控制抵靠裝置51及刀具裝置52作動,而使抵靠板512及連接板5212不再夾持尾端結構A15,接著,處理裝置1將可以控制載台62於軌道61上移
動,而使設置於載台62上的半導體料件A離開第二刀具機構5。當第二刀具523切斷尾端結構A15後,處理裝置1還可以是控制夾持裝置44作動,以使夾持裝置44移動至特定位置,當夾持裝置44移動至特定位置後,處理裝置1將控制夾具443的兩個夾臂4432不再夾持尾端結構A15,而將尾端結構A15丟棄至所述特定位置。當尾端結構A15被切斷,而與包裝部A13分離後,包裝部A13將形成一取物開口A5,而容置盒A2則將通過取物開口A5露出。
As shown in FIG. 17 and FIG. 18 , after the
請一併參閱圖1、圖18至圖20,當半導體料件A的尾端結構A15被切斷後,處理裝置1將會控制載台62沿著軌道61移動,而使形成有取物開口A5的包裝部A13及設置於其內的容置盒A2移動至撐袋機構7。撐袋機構7用以撐開包裝部A13的取物開口A5,取物開口A5被撐開後,處理裝置1可以是傳遞訊號至取物裝置(圖未示),而取物裝置接收該訊號後,將由包裝部A13中取出容置盒A2。在實際應用中,取物裝置可以是包含機械手臂,但不以此為限,任何可以用來將容置盒A2由包裝部A13中取出的機構,皆屬於取物裝置可具體實施的範圍。
Please refer to FIGS. 1 , 18 to 20 together. After the tail end structure A15 of the semiconductor material A is cut off, the processing device 1 will control the
如圖19及圖20所示,撐袋機構7可以包含兩個支撐結構71、一升降模組72、四個移動模組73、四個桿體74、兩個輔助移動模組75、兩個輔助板體76及兩個翻轉裝置77。兩個支撐結構71可以是固定設置取物設備S2的主要支撐結構(圖未示),而兩個支撐結構71是彼此相面對地設置。升降模組72可以是包含四個升降組件721,各個支撐結構71的兩端可以是連接兩個升降組件721,各個升降組件721可以是包含一驅動器7211及多個推桿7212。處理裝置1電性連接升降模組72,而處理裝置1能控制升降模組72,以使各個升降組件721的驅動器7211作動,從而使多個推桿7212相對於驅動器7211伸縮,據以使兩個支撐結構71相對於載台62上升或下降。關於升降模組72所包含的構件的形式及數量不以上述說明為限,在不同的實施例中,各個支撐結構71也可以是連接一個或是三個以上的升降組件721。
As shown in FIGS. 19 and 20 , the bag-supporting mechanism 7 may include two supporting
各個支撐結構71設置有兩個移動模組73,兩個移動模組73是鄰近於支撐結構71的兩端設置,各個移動模組73連接一個桿體74。處理裝置1電性連接各個移動模組73,而各個處理裝置1能控制各個移動模組73,以使桿體74相對於支撐結構71向遠離或靠近支撐結構71的方向移動。在實際應用中,各個移動模組73例如可以是包含一驅動器731、多個推桿732及一連接件733,多個推桿732與驅動器731相連接,連接件733與多個推桿732的末端相連接,連接件733用以使桿體74與多個推桿732相連接。在實際應用中,各個桿體74可以是大致呈現為圓柱狀,且與移動模組73相連接的各個桿體74,可以是大致垂直於水平線設置。
Each
各個輔助移動模組75設置於其中一個支撐結構71,且各個輔助移動模組75是位於相鄰的兩個移動模組73之間。各個輔助移動模組75可以是包含一驅動器751、多個推桿752及一連接件753,多個推桿752與驅動器751相連接,連接件753固定於多個推桿752的末端,且各個連接件753與一個輔助板體76相連接。處理裝置1電性連接輔助移動模組75,處理裝置1能控制驅動器751作動,以使多個推桿752相對於驅動器751移動,進而使各個輔助板體76向靠近或遠離支撐結構71的方向移動。
Each auxiliary moving
值得一提的是,兩個支撐結構71是位於同一平面,且四個移動模組73及兩個輔助移動模組75能分別使其所連接的四個桿體74及兩個輔助板體76大致於同一平面移動。在實際應用中,處理裝置1可以是使四個移動模組73及兩個輔助移動模組75同步移動,但不以此為限,處理裝置1也可以是依據需求,獨立地控制任一個移動模組73或任一個輔助移動模組75作動。
It is worth mentioning that the two supporting
如圖19及圖21所示,兩個翻轉裝置77鄰近於兩個支撐結構71設置。各個翻轉裝置77可以是固定於開袋設備的主要支撐結構(圖未示)。各個翻轉裝置77可以包含一移動模組771、一旋轉模組772、一支撐結構773及
多個吸盤組件774。移動模組771及旋轉模組772分別電性連接處理裝置1,移動模組771與旋轉模組772相連接。支撐結構773與旋轉模組772相連接,旋轉模組772能受控制而使支撐結構773旋轉。多個吸盤組件774間隔地設置於支撐結構773,各個吸盤組件774連接一抽氣裝置,處理裝置1能控制抽氣裝置,而使各個吸盤組件774具有吸力或不再具有吸力。
As shown in FIGS. 19 and 21 , the two
處理裝置1能控制移動模組771作動,而使旋轉模組772、支撐結構773及多個吸盤組件774沿一橫向方向(例如是平行於地面,如圖21所示的Y軸方向)向設置於載台62上的半導體料件A靠近或遠離;處理裝置1能控制旋轉模組772作動,而使支撐結構773旋轉(例如是以圖9所示X軸為中心旋轉),據以改變多個吸盤組件774的方向。各個移動模組771例如包含有一驅動器7711及多個推桿7712,處理裝置1能控制驅動器7711,而使多個推桿7712伸縮,推桿7712與旋轉模組772相連接。當然,移動模組771所包含的構件不以上述說明為限。
The processing device 1 can control the movement of the moving
如圖22至圖24所示,撐袋機構7撐開包裝部A13的動作流程可以是:當處理裝置1控制載台62沿著軌道61移動至撐袋機構7的下方時,處理裝置1將先控制兩個翻轉裝置77的兩個移動模組771作動,以使兩個支撐結構773及其所連接的多個吸盤組件774移動至包裝部A13的附近;接著,處理裝置1將控制兩個旋轉模組772作動,以使支撐結構773及設置於其上的多個吸盤組件774轉向包裝部A13;而後,處理裝置1將控制抽氣裝置作動,以使多個吸盤組件774吸附包裝部A13。
As shown in FIGS. 22 to 24 , the action flow of the bag opening mechanism 7 to open the packaging part A13 may be as follows: when the processing device 1 controls the
當兩個翻轉裝置77的多個吸盤組件774皆吸附包裝部A13時,處理裝置1將控制兩個旋轉模組772作動,以使兩個支撐結構773向遠離載台62的方向旋轉,如此,被多個吸盤組件774吸附的包裝部A13,將被向遠離容置盒A2的方向翻轉,而包裝部A13的取物開口A5將被開得更大。於
本實施例中,是以各個旋轉模組772使其所連接的支撐結構773旋轉90度,但不以此為限,旋轉模組772使支撐結構773旋轉的角度可以依據需求變化。
When the plurality of
值得一提的是,為了使兩個翻轉裝置77能夠更順利地吸附包裝部A13,並使包裝部A13向遠離容置盒A2的方向翻轉,處理裝置1在控制兩個翻轉裝置77作動之前,可以是先控制兩個抵壓裝置22(如圖6及圖7)作動,以使兩個抵壓件222先抵壓包裝部A13的底部A131。
It is worth mentioning that, in order to enable the two
如圖20、圖23及圖24所示,當兩個翻轉裝置77的多個吸盤組件774吸附包裝部A13並旋轉90度後,處理裝置1可以是先控制四個移動模組771及兩個輔助移動模組75作動,而使四個桿體74及兩個輔助板體76向彼此相互靠近的方向移動(如圖20所示);接著,處理裝置1將控制升降模組72作動,而使兩個支撐結構71向靠近載台62的方向移動,據以使四個桿體74及兩個輔助板體76通過取物開口A5進入包裝部A13中(如圖24所示)。其中,在四個桿體74及兩個輔助板體76通過取物開口A5進入包裝部A13的過程中,處理裝置1可以是控制兩個翻轉裝置77作動,而使吸盤組件774不吸附包裝部A13。
As shown in FIGS. 20 , 23 and 24 , after the
如圖24及圖25所示,當四個桿體74及兩個輔助板體76皆位於包裝部A13中時,處理裝置1將控制四個移動模組73及兩個輔助移動模組75作動,而使四個桿體74及兩個輔助板體76向彼此相互遠離的方向移動,據以將取物開口A5撐到最大的狀態(即,包裝部A13是大致呈現為緊繃的狀態)。在具體的應用中,可以是四個桿體74撐開取物開口A5時,四個桿體74可以是大致位於包裝部A13的四角,而兩個輔助板體76則可以是大致位於包裝部A13的彼此相面對的側面。
As shown in FIG. 24 and FIG. 25 , when the four
當四個桿體74及兩個輔助板體76將包裝部A13撐開至大致呈現為緊繃的狀態時,處理裝置1例如可以是控制取物裝置(例如各式機械手臂
等),以將位於包裝部A13中的容置盒A2取出。所述取物裝置可以是鄰近於撐袋機構7設置,但不以此為限。
When the four
在不同的實施例中,當撐袋機構7通過四個桿體74及兩個輔助板體76撐開取物開口A5時,處理裝置1也可以是控制相關警示裝置(例如各式燈具、喇叭)運作,以通過警示裝置所發出的燈光、聲音等,提示相關人員可以前來將包裝部A13中的容置盒A2取出。在具體的實施中,在取物裝置或是人工將容置盒A2由包裝部A13中取出的過程中,撐袋機構7可以是持續地撐著包裝部A13的取物開口A5,但不以此為限。
In different embodiments, when the bag-opening mechanism 7 opens the object-receiving opening A5 through the four
上述本發明的開袋設備S1可以是不包含取物裝置,而開袋設備S1可以是單獨地被實施、製造及販售。另外,上述本發明的開袋設備S1所包含的處理裝置1、固定機構2、第一刀具機構3、第二刀具機構5、撐袋機構7等,可以是與取物裝置共同組成為一取物設備,亦即,上述開袋設備S1所包含的所有構件可以是與取物裝置一同被實施、製造及販售。
The above-mentioned bag opening device S1 of the present invention may not include a pick-up device, and the bag opening device S1 may be implemented, manufactured and sold independently. In addition, the processing device 1 , the
依上所述,本發明的開袋設備S1及取物設備可以自動地將先將半導體料件A的尾端結構A15切斷,再通過撐袋機構7撐開包裝部A13的取物開口A5,最後,相關人員或是取物裝置則可以輕鬆且方便地,將容置盒A2由包裝部A13中取出。本發明的開袋設備S1及取物設備在切斷尾端結構A15至撐開包裝部A13的流程中,基本上可以是完全自動化而無需人力的參與,而可以大幅避免發生因人工不當操作而造成的半導體料件A損壞的問題。 According to the above, the bag opening device S1 and the picking device of the present invention can automatically cut off the tail end structure A15 of the semiconductor material A, and then open the picking opening A5 of the packaging part A13 through the bag opening mechanism 7. Finally, the relevant personnel or the retrieval device can easily and conveniently take out the accommodating box A2 from the packaging part A13. The bag opening device S1 and the picking device of the present invention can basically be completely automated without human participation in the process of cutting the tail end structure A15 to opening the packaging part A13, and can greatly avoid the occurrence of improper manual operations. The problem of damage to the semiconductor material A.
在實際技術中,是利用人工方式切斷尾端結構A15並將包裝部A13的開口撐開,此種作業方式,不但費時且費工外,還可能因為人工操作不當,而發生容置盒A2被破壞,甚至導致容置盒A2內的晶圓損壞的問題;另外,利用人工的方式,在相關人員因不可抗拒的因素(例如政府封城)而無法上班時,上述工作將無法作業。 In the actual technology, the tail end structure A15 is manually cut off and the opening of the packaging part A13 is opened. This operation method is not only time-consuming and labor-intensive, but also may cause the accommodating box A2 due to improper manual operation. It is damaged, and even leads to the problem of damage to the wafers in the container A2; in addition, using manual methods, when the relevant personnel are unable to go to work due to irresistible factors (such as government closures), the above work will not work.
請一併參閱圖26至圖29,圖26顯示為本發明的開袋系統的示意圖,圖27至圖29顯示為本發明的開袋系統的袋體回收設備的作動示意圖。本發明的開袋系統S包含:一取物設備S2、一中央控制設備S3及一袋體回收設備S4。取物設備S2包含前述開袋設備S1及一取物裝置8,取物裝置8例如是各式機械手臂。關於開袋設備S1的說明,請參閱前載內容,於此不再贅述。取物裝置8用以取出設置於包裝部A13(如圖3所示)中的容置盒A2(如圖3所示)。 Please refer to FIGS. 26 to 29 together. FIG. 26 is a schematic diagram of the bag opening system of the present invention, and FIGS. 27 to 29 are schematic diagrams of the operation of the bag recovery device of the bag opening system of the present invention. The bag opening system S of the present invention includes: a fetching device S2, a central control device S3 and a bag body recycling device S4. The picking device S2 includes the aforementioned bag opening device S1 and a picking device 8, and the picking device 8 is, for example, various types of robotic arms. For the description of the bag opening device S1, please refer to the previous content, and will not be repeated here. The fetching device 8 is used to take out the accommodating box A2 (as shown in FIG. 3 ) provided in the packaging part A13 (as shown in FIG. 3 ).
中央控制設備S3電性連接取物設備S2及袋體回收設備S4,中央控制設備S3能先控制取物設備S2切斷半導體料件A的尾端結構A15,並將設置於包裝部A13中的容置盒A2取出,再控制袋體回收設備S4收折包裝部A13。中央控制設備S3例如是各式電腦、伺服器等。於此所指的中央控制設備S3可以是包含前述處理裝置1,或者,中央控制設備S3也可以是獨立於處理裝置1的設備。 The central control device S3 is electrically connected to the picking device S2 and the bag recycling device S4. The central control device S3 can firstly control the picking device S2 to cut off the tail end structure A15 of the semiconductor material A, and set the bag in the packaging part A13. The accommodating box A2 is taken out, and then the bag body recovery device S4 is controlled to fold the packaging part A13. The central control device S3 is, for example, various computers, servers, and the like. The central control device S3 referred to here may include the aforementioned processing device 1 , or the central control device S3 may also be a device independent of the processing device 1 .
袋體回收設備S4可以包含:一縱向移動模組S41、一橫向移動模組S42、一夾持模組S43、一平台S44及一導引結構S45。於本實施例中是以袋體回收設備S4包含縱向移動模組S41及橫向移動模組S42,共兩個移動模組為例,但袋體回收設備S4所包含的移動模組的數量及形式不以此為限。 The bag recovery device S4 may include: a longitudinal moving module S41, a lateral moving module S42, a clamping module S43, a platform S44 and a guiding structure S45. In this embodiment, the bag recovery device S4 includes a vertical movement module S41 and a lateral movement module S42, a total of two movement modules as an example, but the number and form of the movement modules included in the bag recovery device S4 Not limited to this.
縱向移動模組S41與夾持模組S43相連接,橫向移動模組S42與縱向移動模組S41相連接。中央控制設備S3電性連接縱向移動模組S41及橫向移動模組S42,中央控制設備S3能控制縱向移動模組S41作動,而使夾持模組S43沿一縱向方向(例如是垂直地面的方向,例如是圖中所示Z軸方向)移動,據以靠近或遠離包裝部A13;中央控制設備S3能控制橫向移動模組S42作動,而使夾持模組S43沿一橫向方向(例如是垂直於縱向方向,例如是圖中所示Y軸方向)移動,據以遠離或靠近包裝部A13。 The longitudinal movement module S41 is connected with the clamping module S43, and the lateral movement module S42 is connected with the longitudinal movement module S41. The central control device S3 is electrically connected to the longitudinal movement module S41 and the lateral movement module S42, and the central control device S3 can control the movement of the longitudinal movement module S41 to make the clamping module S43 move along a longitudinal direction (for example, a direction perpendicular to the ground). , for example, in the Z-axis direction shown in the figure) to move closer to or away from the packaging part A13; the central control device S3 can control the lateral movement module S42 to act, so that the clamping module S43 moves in a lateral direction (for example, vertical In the longitudinal direction, for example, the Y-axis direction shown in the figure), it moves away from or close to the packaging part A13.
中央控制設備S3電性連接夾持模組S43,中央控制設備S3能控制夾持模組S43作動,而使夾持模組S43夾持包裝部A13。所述夾持模組S43可以包含一驅動組件S431、兩個夾臂S432及一伸入構件S433。兩個夾臂S432連接驅動組件S431,伸入構件S433位於兩個夾臂S432之間。中央控制設備S3電性連接驅動組件S431,中央控制設備S3能控制驅動組件S431作動,而使兩個夾臂S432向靠近或遠離伸入構件S433的方向移動。驅動組件S431例如是包含滑軌及相關驅動器,而兩個夾臂S432則是可滑動地設置於驅動組件S431的滑軌。 The central control device S3 is electrically connected to the clamping module S43, and the central control device S3 can control the clamping module S43 to act so that the clamping module S43 clamps the packaging part A13. The clamping module S43 may include a driving component S431, two clamping arms S432, and an extending member S433. The two clamping arms S432 are connected to the driving assembly S431, and the extending member S433 is located between the two clamping arms S432. The central control device S3 is electrically connected to the driving component S431, and the central control device S3 can control the driving component S431 to actuate, so that the two clamping arms S432 move toward or away from the protruding member S433. The driving component S431 includes, for example, a sliding rail and a related driver, and the two clamping arms S432 are slidably disposed on the sliding rail of the driving component S431.
伸入構件S433的彼此相反的兩端面定義為一第一抵靠面S4331,各個夾臂S432具有一第二抵靠面S4321,各第二抵靠面S4321面對各第一抵靠面S4331設置。彼此相面對的第一抵靠面S4331及第二抵靠面S4321可以共同夾持包裝部A13。在實際應用中,第一抵靠面S4331及第二抵靠面S4321可以是具有大致相同的外型及尺寸的矩形平面;當然,第一抵靠面S4331及第二抵靠面S4321的外型及尺寸不以圖中所示為限,只要彼此相面對的第一抵靠面S4331及第二抵靠面S4321可以共同夾持包裝部A13,第一抵靠面S4331及第二抵靠面S4321的外型及尺寸可以是依據需求變化。 The opposite end surfaces of the protruding member S433 are defined as a first abutting surface S4331, each clamping arm S432 has a second abutting surface S4321, and each second abutting surface S4321 is disposed facing each first abutting surface S4331 . The first abutting surface S4331 and the second abutting surface S4321 facing each other can jointly clamp the packaging part A13. In practical applications, the first abutting surface S4331 and the second abutting surface S4321 can be rectangular planes with substantially the same shape and size; of course, the shapes of the first abutting surface S4331 and the second abutting surface S4321 And the size is not limited to what is shown in the figure, as long as the first abutting surface S4331 and the second abutting surface S4321 facing each other can jointly clamp the packaging part A13, the first abutting surface S4331 and the second abutting surface S4331 and the second abutting surface The appearance and size of S4321 can be changed according to the demand.
平台S44設置於輸送機構6的軌道61的一旁,導引結構S45設置於平台S44的一端,且平台S44鄰近橫向移動模組S42設置,而袋體回收設備S4的橫向移動模組S42,能使夾持模組S43移動至平台S44的上方。
The platform S44 is arranged on the side of the
袋體回收設備S4回收包裝部A13的流程可以是:如圖27所示,當包裝部A13內的容置盒A2(如圖3所示)被取出,且載台62移動至袋體回收設備S4的下方時,中央控制設備S3可以是先控制固定機構2的兩個抵壓裝置22作動,而使兩個抵壓件222抵壓包裝部A13的底部A131;接著,中央控制設備S3將控制橫向移動模組S42,而使夾持模組S43移動至包裝部A13的開口A12的上方;如圖28所示,而後,中央控制設備S3將控制縱向移動模
組S41作動,而使伸入構件S433通過包裝部A13的取物開口A5進入包裝部A13內,而兩個夾臂S432將對應位於包裝部A13的外側。
The process of recycling the packaging part A13 by the bag body recycling device S4 may be: as shown in FIG. 27 , when the accommodating box A2 (shown in FIG. 3 ) in the packaging part A13 is taken out, and the
如圖28所示,當伸入構件S433位於包裝部A13內,且兩個夾臂S432位於包裝部A13的外側時,中央控制設備S3將控制驅動組件S431作動,而各個夾臂S432向伸入構件S433移動,藉此,使各個夾臂S432與伸入構件S433共同夾持包裝部A13,而受到兩個夾臂S432及伸入構件S433共同夾持的包裝部A13,將沿著位於包裝部A13的兩側的折痕A4折合。 As shown in FIG. 28 , when the protruding member S433 is located in the packaging part A13 and the two clamping arms S432 are located outside the packaging part A13, the central control device S3 will control the driving assembly S431 to actuate, and each clamping arm S432 will protrude into the The member S433 moves, whereby each clamping arm S432 and the extending member S433 jointly clamp the packaging portion A13, and the packaging portion A13 jointly clamped by the two clamping arms S432 and the extending member S433 will be located along the packaging portion A13. The creases on both sides of the A13 are folded to A4.
當兩個夾臂S432及伸入構件S433共同夾持包裝部A13後,中央控制設備S3將控制縱向移動模組S41向遠離包裝部A13的方向移動,此時,兩個抵壓裝置22的兩個抵壓件222仍抵壓包裝部A13的底部A131,藉此,包裝部A13將呈現為被大致拉平的狀態。
After the two clamping arms S432 and the extending member S433 jointly clamp the packaging part A13, the central control device S3 will control the longitudinal movement module S41 to move away from the packaging part A13. Each of the
當包裝部A13呈現為大致被拉平的狀態後,中央控制設備S3將先控制兩個抵壓裝置22不再抵壓包裝部A13的底部A131,接著,控制橫向移動模組S42作動,而使被夾持模組S43夾持的包裝部A13向平台S44的方向移動;在夾持模組S43移動的過程中,包裝部A13將通過導引結構S45,並受導引結構S45的導引,而向平台S44的方向倒下;如圖29所示,包裝部A13向平台S44的方向倒下後,中央控制設備S3將控制夾持模組S43不再夾持包裝部A13,而被折合的包裝部A13將被放置於平台S44。在實際應用中,當中央控制設備S3控制夾持模組S43不再夾持包裝部A13後,中央控制設備S3還可以是控制縱向移動模組S41作動,而使伸入構件S433抵壓平躺於平台S44上的包裝部A13。
When the packaging part A13 is in a state of being substantially flattened, the central control device S3 will first control the two
在不同的實施例中,平台S44可以是連接一移動模組S46,中央控制設備S3電性連接移動模組S46,中央控制設備S3能控制移動模組S46作動,而使平台S44向載台62的方向移動。在中央控制設備S3控制橫向移動模組S42,而使被夾持模組S43夾持的包裝部A13向平台S44的方向移動的過
程中,中央控制設備S3還可以是同時控制移動模組S46作動,而使移動模組S46載台62的方向靠近,進而讓平台S44推抵被夾持模組S43夾持的包裝部A13,如此,將可以使包裝部A13更容易地平躺於平台S44上。
In different embodiments, the platform S44 may be connected to a mobile module S46, the central control device S3 is electrically connected to the mobile module S46, and the central control device S3 can control the movement of the mobile module S46 to make the platform S44 move toward the
請一併參閱圖2、圖3及圖30,本發明的取物方法用以由半導體料件A的保護袋A1中取出容置盒A2,取物方法包含:一定位步驟S11:固定半導體料件;一切割步驟S12:控制至少一刀具機構先後切斷膠帶及尾端結構,以使包裝部形成一取物開口,容置盒則能通過取物開口露出;一撐開步驟S13:控制一撐袋機構,撐開包裝部;一取出步驟S14:控制一取物裝置,伸入包裝部中,固持容置盒,並將容置盒由包裝部取出。 Please refer to FIG. 2 , FIG. 3 , and FIG. 30 together. The method of taking out the object of the present invention is used to take out the accommodating box A2 from the protective bag A1 of the semiconductor material A. The method of taking out the object includes: a positioning step S11 : fixing the semiconductor material A cutting step S12: controlling at least one cutter mechanism to cut off the tape and the tail end structure successively, so that the packaging part forms a fetching opening, and the accommodating box can be exposed through the fetching opening; a spreading step S13: controlling a The bag-supporting mechanism props up the packaging part; a take-out step S14: control a fetching device to extend into the packaging part, hold the accommodating box, and take out the accommodating box from the packaging part.
本發明的取物方法可以是利用前述取物設備執行,但不以此為限。如圖8、圖12及圖17所示,在利用前述取物設備執行本發明的取物方法的實施例中,於切割步驟S2中,是先控制第一刀具機構3切割膠帶A3,以使尾端結構A15呈現為活動狀,再控制第二刀具機構5切割尾端結構A15,以使包裝部A13形成取物開口A5。
The method of extracting objects of the present invention may be performed by using the aforementioned object extracting equipment, but is not limited thereto. As shown in FIG. 8 , FIG. 12 and FIG. 17 , in the embodiment of the method for extracting objects of the present invention using the aforementioned object extracting equipment, in the cutting step S2 , the
請一併參閱圖19、圖21至圖24及圖31,圖31顯示為本發明的取物方法的另一實施例的流程示意圖。本實施例的取物方法包含:一定位步驟S21、一切割步驟S22、一開袋步驟S23、一撐開步驟S24、一取出步驟S25。本實施例的定位步驟S21、切割步驟S22及取出步驟S5,分別與前述實施例的定位步驟S11、切割步驟S12及取出步驟S14相同,於此不再贅述。 Please refer to FIG. 19 , FIG. 21 to FIG. 24 and FIG. 31 together. FIG. 31 is a schematic flowchart of another embodiment of the method for extracting objects of the present invention. The method for extracting objects in this embodiment includes: a positioning step S21 , a cutting step S22 , a bag opening step S23 , a spreading step S24 , and a taking out step S25 . The positioning step S21 , the cutting step S22 and the taking out step S5 in this embodiment are respectively the same as the positioning step S11 , the cutting step S12 and the taking out step S14 in the previous embodiment, and will not be repeated here.
如圖6及圖7所示,本實施例的定位步驟S21為:控制一固定機構2的四個推抵裝置21的驅動器211,以使四個推抵件212分別推抵半導體料
件A的四個側面,並控制兩個抵壓裝置22的驅動器221,以使兩個抵壓件222抵壓包裝部A13,藉此固定設置於一載台62上的半導體料件A。
As shown in FIG. 6 and FIG. 7 , the positioning step S21 in this embodiment is: controlling the
所述開袋步驟S23為:控制多個吸盤組件774(如圖23所示)吸附包裝部A13的外側,並使多個吸盤組件774向遠離容置盒A2(如圖3所示)的方向翻轉。通過開袋步驟S23的設計,將可以擴大取物開口A5(如圖23所示)的口徑。
The bag opening step S23 is: controlling the plurality of suction cup assemblies 774 (as shown in FIG. 23 ) to absorb the outside of the packaging portion A13, and making the plurality of
本實施例的撐開步驟S24與前述撐開步驟S13不同之處在於:使撐袋機構7(如圖20所示)的四個桿體74先伸入包裝部中,再控制至少一移動模組73(如圖20所示)作動,而使四個桿體74(如圖20所示)向遠離容置盒A2(如圖3所示)的方向移動,藉此撐開包裝部A13(如圖25所示)。
The opening step S24 of this embodiment differs from the preceding opening step S13 in that: the four
於上述說明中,主要是以前述本發明的開袋設備的相關構件,作為相關構件的輔助示意,但本實施例所舉的各個構件具體的外型不以前述開袋設備所繪示的外型為限。 In the above description, the relevant components of the bag opening device of the present invention are mainly used as auxiliary illustrations of the relevant components. type is limited.
綜上所述,本發明的取物方法、取物設備及開袋設備可以自動化地快速切斷半導體料件的尾端結構,而使半導體料件的包裝部成打開狀,最後利用取物裝置將容置盒由包裝部中取出,且在整個開袋及取物的過程中,基本上可以不需要人力的參與,如此,將可大幅降低人力的需求;在習知應用中,必須通過人工的方式,切斷半導體料件的膠帶及尾端結構,如此,需耗費大量的人力且效率不佳,再者,容置盒中存放的晶圓非常昂貴,因此,利用人工方式打開半導體料件的包裝部並取出容置盒,還存在有人員可能因為各種因素,而導致晶圓盒中的晶圓損傷的問題。 To sum up, the picking method, the picking device and the bag opening device of the present invention can automatically and quickly cut off the tail end structure of the semiconductor material, so that the packaging part of the semiconductor material is opened, and finally the picking device is used. The accommodating box is taken out from the packaging part, and in the whole process of opening the bag and picking up the object, basically no human participation is required, so the demand for manpower can be greatly reduced; in the conventional application, it must be manually In this way, the tape and the end structure of the semiconductor material are cut off. In this way, a lot of manpower is required and the efficiency is not good. Furthermore, the wafers stored in the accommodating box are very expensive. Therefore, manual methods are used to open the semiconductor material. There is also a problem that personnel may damage the wafers in the wafer box due to various factors.
以上所述僅為本發明的較佳可行實施例,非因此侷限本發明的專利範圍,故舉凡運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的保護範圍內。 The above descriptions are only preferred feasible embodiments of the present invention, which do not limit the scope of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the protection scope of the present invention. .
A : 半導體料件 A5 : 取物開口 61 : 軌道 62 : 載台 7 : 撐袋機構 71 : 支撐結構 7211 : 驅動器 73 : 移動模組 74 : 桿體 75 : 輔助移動模組 76 : 輔助板體 77 : 翻轉裝置 A: Semiconductor material A5: Take out the opening 61: track 62: Carrier 7 : Bag support mechanism 71: Support structure 7211: Drive 73: Mobile Mods 74: Rod body 75 : Auxiliary Mobility Module 76: Auxiliary board 77: Flip device
Claims (15)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110019520.7A CN113998238B (en) | 2020-07-28 | 2021-01-07 | Fetching method, fetching equipment, bag opening equipment and fetching system |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US202063057558P | 2020-07-28 | 2020-07-28 | |
US63/057,558 | 2020-07-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202204232A TW202204232A (en) | 2022-02-01 |
TWI755173B true TWI755173B (en) | 2022-02-11 |
Family
ID=81323441
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109141227A TWI755173B (en) | 2020-07-28 | 2020-11-25 | Take-out method, take-out equipment, bag opening method and take-out system |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI755173B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114474199B (en) * | 2022-02-22 | 2023-12-05 | 山东华信通讯科技有限公司 | Supporting device of photovoltaic solar panel system |
CN114769088B (en) * | 2022-05-17 | 2024-07-09 | 中建科技(济南)有限公司 | Powder loading attachment for powder spraying machine |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0872899A (en) * | 1994-09-05 | 1996-03-19 | Seisan Nipponsha Kk | Bag body with slide fastener |
WO1999030972A1 (en) * | 1997-12-15 | 1999-06-24 | Dominguez Martin Francisco Jav | Foldable container with variable volume |
WO2002018220A1 (en) * | 2000-08-29 | 2002-03-07 | Shin-Etsu Handotai Co., Ltd. | Packaging bag for semiconductor wafer and method of packaging semiconductor wafer using the packaging bag |
US20090029271A1 (en) * | 2003-07-08 | 2009-01-29 | Hoya Corporation | Container for housing a mask blank, method of housing a mask blank, and mask blank package |
CN202957227U (en) * | 2012-11-29 | 2013-05-29 | 上海华力微电子有限公司 | Silicon wafer box |
CN108290643A (en) * | 2015-08-04 | 2018-07-17 | 吉列尔莫·洛佩斯-阿罗斯特吉·萨恩斯 | Program, machine and equipment manufacture flexible encapsulation by folding the folded plate of oneself with 3D |
WO2020089177A1 (en) * | 2018-10-31 | 2020-05-07 | Ferag Ag | Storage device for storing transport units |
-
2020
- 2020-11-25 TW TW109141227A patent/TWI755173B/en active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0872899A (en) * | 1994-09-05 | 1996-03-19 | Seisan Nipponsha Kk | Bag body with slide fastener |
WO1999030972A1 (en) * | 1997-12-15 | 1999-06-24 | Dominguez Martin Francisco Jav | Foldable container with variable volume |
WO2002018220A1 (en) * | 2000-08-29 | 2002-03-07 | Shin-Etsu Handotai Co., Ltd. | Packaging bag for semiconductor wafer and method of packaging semiconductor wafer using the packaging bag |
US20090029271A1 (en) * | 2003-07-08 | 2009-01-29 | Hoya Corporation | Container for housing a mask blank, method of housing a mask blank, and mask blank package |
CN202957227U (en) * | 2012-11-29 | 2013-05-29 | 上海华力微电子有限公司 | Silicon wafer box |
CN108290643A (en) * | 2015-08-04 | 2018-07-17 | 吉列尔莫·洛佩斯-阿罗斯特吉·萨恩斯 | Program, machine and equipment manufacture flexible encapsulation by folding the folded plate of oneself with 3D |
WO2020089177A1 (en) * | 2018-10-31 | 2020-05-07 | Ferag Ag | Storage device for storing transport units |
Also Published As
Publication number | Publication date |
---|---|
TW202204232A (en) | 2022-02-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI755173B (en) | Take-out method, take-out equipment, bag opening method and take-out system | |
WO2022227557A1 (en) | Jig and assembly device | |
CN109178462A (en) | A kind of logistics carton automatic packaging equipment | |
CN110538806A (en) | detection system and feeding and discharging equipment thereof | |
CN212944166U (en) | Solid state hard drives test jig | |
CN109178463A (en) | A kind of logistics packed in cases automation mould closer | |
CN111824480A (en) | Automatic special angle bead mounting machine device | |
CN113998239B (en) | Bag opening method, bag opening equipment and bag opening system | |
CN113772437B (en) | Dustless multistation support plate loading machine | |
CN106144625A (en) | A kind of classification Palletizer of mechanically-based hands | |
TWI754466B (en) | Bag opening method, bag opening equipment and bag opening system | |
CN113998238B (en) | Fetching method, fetching equipment, bag opening equipment and fetching system | |
CN114474700A (en) | Laminating equipment | |
CN213800405U (en) | Structure of packing equipment for putting mask into box | |
KR101457867B1 (en) | Interleaf packing module and wafer packing system having the same | |
US6033173A (en) | Automated access method and device for use with lead frame magazine end cover plates during IC packaging process | |
CN113734505A (en) | Vacuum packaging equipment and using method thereof | |
CN111959865B (en) | Product conveying method and system | |
JP2724085B2 (en) | Device for removing contents from box | |
CN210881102U (en) | Automatic bottom box feeding machine | |
CN114248120A (en) | Automatic assembly line for gateways | |
CN219361581U (en) | Automatic packaging equipment for wafer box | |
CN215399625U (en) | Carton unpacking and sealing machine | |
CN215323581U (en) | Notebook computer and power supply boxing mechanism | |
CN110561831A (en) | Automatic bottom box feeding machine |