CN113998239B

CN113998239B - Bag opening method, bag opening equipment and bag opening system

Info

Publication number: CN113998239B
Application number: CN202110020596.1A
Authority: CN
Inventors: 张孟椿
Original assignee: Mirle Automation Corp
Current assignee: Mirle Automation Corp
Priority date: 2020-07-28
Filing date: 2021-01-07
Publication date: 2023-02-17
Anticipated expiration: 2041-01-07
Also published as: CN113998239A

Abstract

The application discloses a bag opening method, a bag opening device and a bag opening system. The bag opening method is used for opening a protection bag of a semiconductor material piece, the semiconductor material piece comprises the protection bag, an accommodating box and an adhesive tape, the protection bag is defined with a packaging part and a non-packaging part, the packaging part is wrapped on the periphery of the accommodating box, the non-packaging part is bent into a tail end structure, and the adhesive tape is used for fixing the tail end structure on the packaging part; the bag opening method comprises the following steps: a positioning step: fixing the semiconductor material; a first cutting step: controlling the first cutter mechanism to cut off the adhesive tape so as to enable the tail end structure to be in a movable state; a pulling step: controlling the lifting mechanism to hold the tail end structure and enabling the tail end structure to be vertically arranged relative to the non-packaging part; a second cutting step: and controlling the second cutter mechanism to cut off the connecting position of the non-packaging part and the packaging part so as to separate the non-packaging part from the packaging part.

Description

Bag opening method, bag opening equipment and bag opening system

Technical Field

The present disclosure relates to a method, an apparatus and a system for opening a protective bag of a semiconductor device, and more particularly, to a method, an apparatus and a system for opening a protective bag of a semiconductor device.

Background

Generally, in a wafer pod (e.g., FOUP) containing wafers, a dust-proof protection bag or an antistatic bag is usually coated outside the wafer pod to prevent dust from staying outside the wafer pod or prevent the wafers inside the wafer pod from being affected by external static electricity during transportation; the dust-proof protective bag or the antistatic bag wrapped outside the wafer box is usually fixed by means of an adhesive tape or the like.

In current application, when the wafer box that the outside cladding has dustproof protection bag or antistatic bag, when the wafer that its bore wants to get into relevant workstation and handle, through artificial mode, cut off the sticky tape earlier and open dustproof protection bag or antistatic bag again. Thus, it is inefficient and requires a lot of manpower. In addition, when the related personnel cannot work due to various irresistible factors, the production work of the whole wafer may be stopped for the reason, thereby causing a great loss.

Disclosure of Invention

The application discloses a bag opening method, bag opening equipment and a bag opening system, which are mainly used for solving the problems that the conventional manual method for opening a protection bag of a semiconductor material part consumes a large amount of manpower, has low efficiency, and the whole production process is shut down when an operator cannot work.

One embodiment of the application discloses a bag opening method, which is used for opening a protection bag of a semiconductor material, wherein the semiconductor material comprises the protection bag, an accommodating box and at least one adhesive tape, the protection bag is provided with an accommodating space and an opening, the accommodating box is arranged in the accommodating space through the opening, the protection bag is defined with a packaging part and a non-packaging part, the packaging part is coated on the periphery of the accommodating box, the non-packaging part is bent into a tail end structure, the adhesive tape is adhered to the packaging part and the tail end structure, and the adhesive tape is used for fixing the tail end structure to the packaging part; the bag opening method comprises the following steps: a positioning step: fixing the semiconductor material; a first cutting step: controlling a first cutter mechanism to cut off the adhesive tape so as to enable the tail end structure to be in a movable state; a lifting step: controlling a lifting mechanism to hold the tail end structure and enabling the tail end structure to be vertically arranged relative to the non-packaging part; a second cutting step: and controlling a second cutter mechanism to cut off the part of the tail end structure connected with the packaging part so as to separate the tail end structure from the packaging part.

Optionally, a pushing step is further included between the first cutting step and the pulling step: the first cutter mechanism is controlled to extend between the tail end structure and the packaging part and then push against the tail end structure so as to flatten at least one part of the tail end structure and expose the inner side of the tail end structure.

Optionally, in the lifting step, the plurality of sucker components of the lifting mechanism are controlled to adsorb the tail end structure, and then a rotating module of the lifting mechanism is controlled to drive a supporting structure to rotate, so that the plurality of sucker components connected with the supporting structure drive the tail end structure to rotate relative to the packaging part, and further the tail end structure is vertically arranged relative to the packaging part.

Optionally, in the lifting step, when the tail end structure is arranged upright relative to the packaging part, a clamping device of the lifting mechanism is controlled to clamp the non-packaging part, and then the clamping device is controlled to move in a direction away from the packaging part, so as to lift the tail end structure.

One of the embodiments of the application discloses a bag equipment of opening, it is used for opening a protection bag of semiconductor material spare, the semiconductor material spare contains the protection bag, an holding box and an at least sticky tape, the protection bag has an accommodation space and an opening, the holding box sets up in the accommodation space through the opening, the protection bag definition has a packing portion and a non-packing portion, packing portion cladding is in the periphery of holding box, non-packing portion is buckled into a tail end structure, the sticky tape is pasted in packing portion and tail end structure, and the sticky tape is used for making the tail end structure be fixed in packing portion, it contains to open the bag equipment: a processing device; a fixing mechanism electrically connected to the processing device, the fixing mechanism being used for fixing the semiconductor material; the first cutter mechanism is electrically connected with the processing device and is used for cutting the adhesive tape; the lifting mechanism is electrically connected with the processing device, and the processing device can control the lifting mechanism so that the lifting mechanism can fixedly hold the tail end structure and the tail end structure is vertically arranged relative to the packaging part; the second cutter mechanism is electrically connected with the processing device and is used for cutting the tail end structure; the processing device can sequentially control the fixing mechanism and the first cutter mechanism to fix the semiconductor material piece and then cut the adhesive tape; the processing device can sequentially control the lifting mechanism and the second cutter mechanism, firstly lift the tail end structure and then cut the part of the tail end structure connected with the packaging part.

Optionally, the bag opening apparatus further includes a conveying mechanism, the conveying mechanism includes a rail and a carrying platform, the carrying platform can be controlled by the processing device to move along the rail, the fixing mechanism is disposed on the carrying platform, the fixing mechanism includes four pushing devices, each pushing device includes a driver and a pushing member, the driver is electrically connected with the processing device, and the pushing member is connected with the driver; when the semiconductor material piece is arranged on the carrying platform, the processing device can control the four pushing and abutting devices to act, so that the four pushing and abutting pieces abut against the four side surfaces of the semiconductor material piece.

Optionally, the bag opening device further comprises two pressing devices, each pressing device comprises a driver and a pressing piece, the driver of the pressing device is electrically connected with the processing device, and the pressing piece is connected with the driver of the pressing device; the processing device can control the two drivers of the pressing device to act so as to press the two pressing pieces against the packaging part; before the processing device controls the lifting mechanism to fix the tail end structure, the two pressing devices can be controlled first, so that the two pressing pieces press the packaging part.

Optionally, the first tool mechanism comprises a first tool, the first tool comprises a body, one side of the body is provided with two cutting edges and a protruding structure, and the protruding structure is located between the two cutting edges; the processing device can control the first cutter mechanism to operate, so that the protruding structure pushes against the movable tail end structure and the tail end structure is turned relative to the packaging part.

Optionally, the lifting mechanism comprises a turning device, the turning device comprises a moving module, a rotating module, a supporting structure and a plurality of sucker components, the moving module and the rotating module are electrically connected with the processing device, the moving module is connected with the rotating module, the supporting structure is connected with the rotating module, the rotating module can be controlled by the processing device to rotate the supporting structure, and the sucker components are fixed on the supporting structure; the processing device can control the moving module to move the plurality of sucker components to the movable tail end structure; the processing device can control the sucker components to adsorb the tail end structure firstly, and then control the rotating module to actuate, so that the tail end structure rotates relative to the packaging part, and the tail end structure is vertically arranged relative to the packaging part.

Optionally, the lifting mechanism comprises a clamping device, the clamping device comprises a driver and a clamp, the processing device is electrically connected with the driver, the clamp is connected with the driver, and the processing device can control the driver so that the clamp clamps the tail end structure or no longer clamps the tail end structure.

Optionally, the bag opening device comprises a second cutter mechanism, the second cutter mechanism comprises a propping device and a cutter device, the propping device comprises a propping plate, the cutter device comprises a connecting plate, a shell, a second cutter and a telescopic mechanism, the connecting plate is connected with the shell, the second cutter is arranged in the shell, the shell is provided with a through hole, the telescopic mechanism is connected with the second cutter, the processing device is electrically connected with the telescopic mechanism, the processing device can control the telescopic mechanism, so that the second cutter protrudes out of the shell through the through hole, or the second cutter retracts into the shell from a state of protruding out of the shell; the processing device can control the second cutter mechanism, so that the abutting plate of the abutting device and the connecting plate of the cutter device jointly clamp the tail end structure.

One embodiment of the present application discloses a bag opening system, comprising: the bag opening device, the article taking device and the central control device according to any one of the claims 5 to 11, wherein the central control device is electrically connected with the bag opening device and the article taking device; when the bag opening device cuts the tail end structure of the semiconductor material piece away from the packaging part, the central control device can control the fetching device to fetch the containing box arranged in the packaging part.

Optionally, the bag opening system further comprises a bag recycling device, the bag recycling device comprises at least one moving module, a clamping module and a platform, the moving module is connected with the clamping module, the clamping module comprises two clamping arms and an extending member, the extending member is located between the two clamping arms, each clamping arm is arranged opposite to the extending member, and each clamping arm can be controlled to move towards a direction close to or far away from the extending member so as to clamp or not clamp the packaging part; the central control equipment is electrically connected with the bag body recovery equipment; the central control equipment can control the clamping module and the moving module to clamp the packaging part and move the packaging part to the platform.

In summary, the bag opening method, the bag opening device and the bag opening system can automatically cut off the adhesive tape of the semiconductor material piece firstly and then cut off the tail end structure so as to open the protection bag, and in the whole process, manual operation is basically not needed, so that the requirement of manpower can be greatly reduced, and the overall efficiency can be greatly improved.

For a better understanding of the nature and technical content of the present application, reference should be made to the following detailed description and accompanying drawings, which are provided to illustrate the present application and are not intended to limit the scope of the present application.

Drawings

Fig. 1 is a schematic view of the bag opening apparatus of the present application.

Fig. 2 is a schematic view of a semiconductor workpiece.

Fig. 3 is a schematic view of the protection bag and the accommodating box.

Fig. 4 to 6 are schematic views of different states of the protection bag.

Fig. 7 is a schematic view of the securing mechanism of the bag opening apparatus of the present application.

Fig. 8 is a schematic view of the fixing mechanism of the pocket opening apparatus of the present application holding a semiconductor piece.

Fig. 9 to 13 and 15 are operation diagrams illustrating the bag opening apparatus of the present application cutting the adhesive tape of the semiconductor material and clamping the tail structure.

Fig. 14 is a schematic view of a holding device of a pulling mechanism of the bag opening apparatus of the present application.

Fig. 16, 18 to 20 are operation diagrams illustrating the tail end structure of the semiconductor material piece cut by the bag opening device of the present application.

Fig. 17 is a schematic view of a knife arrangement of a second knife mechanism of the bag opening apparatus of the present application.

Fig. 21 is a schematic view of the bag opening system of the present application.

Fig. 22 is a schematic view of a bag body collecting device and a packaging unit of a protection bag of the bag opening system of the present application.

Fig. 23 is a schematic view showing that the holding module of the bag body recovery apparatus of the bag opening system of the present application is inserted into the packing portion of the protection bag.

Fig. 24 is a schematic view of the bag body recovery apparatus of the bag opening system of the present application placing a protection bag on a platform.

Fig. 25 is a schematic flow diagram of the bag opening method of the present application.

Fig. 26 is another schematic flow diagram of the bag opening method of the present application.

Detailed Description

In the following description, reference is made to or is shown in the accompanying drawings for the purpose of illustrating the invention only, and not in any way limiting the scope of the invention. In particular, in order to clearly present the components of the apparatus, device, mechanism, etc. of the present application, the brackets for supporting the components of the apparatus, device, mechanism, etc. are omitted in the drawings of the present application.

Referring to fig. 1 to 7, the bag opening apparatus S1 of the present application is used for opening a protective bag A1 of a semiconductor material a. The bag opening device S1 includes a processing apparatus 1, a fixing mechanism 2, a first cutter mechanism 3, a lifting mechanism 4, and a second cutter mechanism 5. The processing device 1 is electrically connected to the fixing mechanism 2, the first cutter mechanism 3, the lifting mechanism 4 and the second cutter mechanism 5, and the processing device 1 is, for example, various computers, servers, etc. The fixing mechanism 2 is used to hold the semiconductor material A. The first cutter mechanism 3, the pulling mechanism 4 and the second cutter mechanism 5 are used for cooperating with each other to open the protection bag A1 of the semiconductor material A held by the fixing mechanism 2. In order to clearly show the various mechanisms included in the bag opening apparatus S1, a support for supporting the processing device 1, the first cutter mechanism 3, the lifting mechanism 4, and the second cutter mechanism 5 is omitted in fig. 1.

As shown in fig. 1 to 3, the semiconductor part a includes a protection bag A1, a containing box A2 and two tapes A3. The protection bag A1 has an accommodating space a11 and an opening a12, and the accommodating box A2 is disposed in the accommodating space a11 through the opening a 12. In practical applications, the accommodating box A2 is, for example, a wafer cassette (e.g., FOUP), and the protection bag A1 is, for example, a tin foil bag or an antistatic bag. As shown in fig. 3 to 6, after the accommodating box A2 is disposed in the protection bag A1, a part of the protection bag A1 is wrapped around the accommodating box A2, the part of the protection bag A1 is defined as a wrapping portion a13, and the rest of the protection bag A1 is defined as a non-wrapping portion a14. As shown in fig. 2, 5 and 6, the side of the non-packaging part a14 having the opening a12 is operated by a person or an apparatus, and is repeatedly bent in the direction of the packaging part a13 to form a tail end structure a15. The tail end structure a15 is fixed to the packaging portion a13 by two tapes A3. After the tail end structure a15 is fixed on the top surface of the packaging part a13 by the two adhesive tapes A3, the protection bag A1, the containing box A2 arranged in the protection bag A1 and the two adhesive tapes A3 jointly form the semiconductor material piece a.

As shown in fig. 1, fig. 7 and fig. 8, the bag opening apparatus S1 may further include a conveying mechanism 6, wherein the conveying mechanism 6 includes a rail 61 and a stage 62, and the stage 62 is slidably disposed on the rail 61. The processing device 1 is electrically connected to the transport mechanism 6, and the stage 62 is controlled by the processing device 1 to move along the rail 61. The carrier 62 is used for carrying a semiconductor material a (as shown in fig. 2), the fixing mechanism 2 is disposed on the carrier 62, and the fixing mechanism 2 is used for holding the semiconductor material a disposed on the carrier 62. The processing apparatus 1 can control the carrier 62 to slide on the rail 61, so that the semiconductor material a arranged on the carrier 62 moves from a position adjacent to the first tool mechanism 3 to a position adjacent to the second tool mechanism 5.

The fixing mechanism 2 may comprise four pushing devices 21 and two pressing devices 22. Each pushing device 21 may include a driver 211 and a pushing element 212. The driver 211 is electrically connected to the processing apparatus 1, and the pushing element 212 is connected to the driver 211. The processing apparatus 1 can control the actuator 211 to move the pushing member 212 toward or away from the stage 62, so as to push or not push against the side of the semiconductor material a of the stage 62. For example, the actuator 211 may include a pneumatic cylinder (or an oil cylinder) and a plurality of push rods, and the processing device 1 can control the pneumatic cylinder to move the push rods and the pushing members 212 connected thereto toward or away from the stage 62.

When the semiconductor material a is disposed on the carrier 62, the processing apparatus 1 controls the four pushing devices 21 to push the four pushing members 212 against the four side surfaces of the semiconductor material a. In practical applications, the carrier 62 may be provided with at least one detector for detecting whether the semiconductor material a is disposed on the carrier 62, and the processing apparatus 1 can determine whether the semiconductor material a is disposed on the carrier 62 according to the detection result of the detector. When the processing apparatus 1 determines that the carrier 62 is provided with the semiconductor material a according to the result detected by the detector, the processing apparatus 1 may control the four pushing devices 21 to operate, so that the four pushing devices 21 push against the four sides of the semiconductor material a, thereby holding the semiconductor material a.

In a specific implementation, when the semiconductor material a is disposed on the carrier 62, the processing apparatus 1 may control the four pushing devices 21 to simultaneously operate, so that the four pushing members 212 simultaneously push the four sides of the semiconductor material a, and thus, even if the semiconductor material a is disposed on the carrier 62 with a slight deviation, the semiconductor material a can be finally pushed by the four pushing members 212 to move to a correct position. That is, in addition to the four pushing devices 21 for holding the semiconductor material a on the carrier 62, the four pushing devices 21 also have the function of correctly disposing the semiconductor material a on the carrier 62 (i.e. the function of restoring).

Each pressing device 22 includes a driver 221 and a pressing device 222, the driver 221 is electrically connected with the processing device 1, the pressing device 222 is connected with the driver 221, and the processing device 1 can control the two drivers 221 so that the two pressing devices 222 press the packaging portion a13. In practical applications, the driver 221 may include, for example, a pneumatic cylinder and a plurality of push rods, and the processing device 1 can control the driver 221 to operate, so as to extend and retract the push rods, so as to drive the pressing member 222 to press against or not press against the packaging portion a13 of the semiconductor material a.

The two pressing devices 22 may be disposed adjacent to the two pushing devices 21, and before the processing device 1 controls the lifting mechanism 4 to hold the tail end structure a15, the two pushing devices 21 may be controlled to operate first, so that the two pushing members 212 do not push the semiconductor material a any more, and then the two pressing devices 22 are controlled to operate, so that the two pressing members 222 press a bottom portion a131 of the packaging portion a13 (as shown in fig. 2). In the present embodiment, each of the pressing devices 22 is disposed adjacent to one of the pressing devices 21, but the pressing device 22 does not have to be disposed adjacent to one of the pressing devices 21.

As shown in fig. 9, the first cutter mechanism 3 may include a first cutter 31, a longitudinal moving module 32 and a transverse moving module 33. The first cutter 31 is connected to the longitudinal moving module 32, and the longitudinal moving module 32 is connected to the lateral moving module 33. The processing device 1 is electrically connected to the longitudinal moving module 32 and the transverse moving module 33. The processing apparatus 1 can control the longitudinal moving module 32 to move the first tool 31 toward or away from the semiconductor material a disposed on the carrier 62 along a longitudinal direction (e.g., perpendicular to the ground). The processing apparatus 1 can control the lateral moving module 33 to move so that the first tool 31 moves toward or away from the semiconductor article a disposed on the carrier 62 along a lateral direction (e.g., perpendicular to the longitudinal direction). The first cutting tool 31 may comprise a body 311, at least two sections of one side of the body 311 are provided with a cutting edge 312, and the rest sections of the side are not provided with the cutting edge 312.

In practical applications, the longitudinal moving module 32 of the first cutting tool mechanism 3 may include a slide rail 321 and a slide block 322, the slide block 322 may be controlled to slide on the slide rail 321, the transverse moving module 33 of the first cutting tool mechanism 3 may include a slide rail 331 and a slide block 332, and the slide block 332 may be controlled to move on the slide rail 331. The first knife 31 is connected with the slider 322 of the longitudinal moving module 32, and the slide rail 321 of the longitudinal moving module 32 is connected with the slider 332 of the transverse moving module 33.

In practical application, as shown in fig. 9, the conveying mechanism 6 is used for moving the semiconductor material a along the X-axis direction, the transverse moving module 33 of the first cutter mechanism 3 is used for moving the first cutter 31 along the Y-axis direction, and the longitudinal moving module 32 of the first cutter mechanism 3 is used for moving the first cutter 31 along the Z-axis direction.

Referring to fig. 1 again, the lifting mechanism 4 of the bag opening apparatus S1 may include a turning device 41, an auxiliary pressing device 42, a moving device 43 and a clamping device 44. The turning device 41 and the auxiliary pressing device 42 are disposed adjacent to the first cutter mechanism 3, the moving device 43 is movable from a position adjacent to the first cutter mechanism 3 to a position adjacent to the second cutter mechanism 5, the holding device 44 is connected to the moving device 43, the holding device 44 is used for holding the tail end structure a15, and the holding device 44 can move along with the moving device 43 from a position adjacent to the first cutter mechanism 3 to a position adjacent to the second cutter mechanism 5.

It should be noted that the pulling mechanism 4 is mainly used to erect the tail end structure a15 of the semiconductor material piece a relative to the packaging portion a13, and in this embodiment, the pulling mechanism 4 includes the above-mentioned turning device 41, the auxiliary pressing device 42, the moving device 43 and the clamping device 44 as an example, but the components included in the pulling mechanism 4 are not limited thereto.

As shown in fig. 9, the flipping device 41 may include a moving module 411, a rotating module 412, a supporting structure 413 and a plurality of chuck assemblies 414. The moving module 411 and the rotating module 412 are electrically connected to the processing apparatus 1, the moving module 411 is connected to the rotating module 412, and the supporting structure 413 is connected to the rotating module 412. A plurality of chuck assemblies 414 are spaced apart from each other on the support structure 413, and each of the chuck assemblies 414 is connected to a suction device, which the processing apparatus 1 can control so that each of the chuck assemblies 414 has suction or no suction.

The auxiliary pressing device 42 may include a longitudinal moving module 421, a transverse moving module 422, and an auxiliary pressing member 423, wherein the longitudinal moving module 421 is connected with the auxiliary pressing member 423, and the longitudinal moving module 421 is connected with the transverse moving module 422. The processing device 1 is electrically connected to the longitudinal moving module 421 and the transverse moving module 422 of the auxiliary pressing device 42. The processing device 1 can control the longitudinal moving module 421 of the auxiliary pressing device 42 to move the auxiliary pressing member 423 toward or away from the semiconductor material a along a longitudinal direction (e.g., vertical to the ground, as shown in the figure, the Z-axis direction); the processing apparatus 1 can control the transverse moving module 422 of the auxiliary pressing device 42 to move the auxiliary pressing member 423 toward or away from the semiconductor material a along a transverse direction (e.g., a vertical longitudinal direction, such as a Y-axis direction shown in the figure).

The processing apparatus 1 can control the movement module 411 to move, so that the rotation module 412, the support structure 413 and the plurality of chuck assemblies 414 move toward or away from the semiconductor material a disposed on the stage 62 along a transverse direction (e.g., parallel to the ground, such as the Y-axis direction shown in fig. 9); the processing apparatus 1 can control the rotation module 412 to rotate the support structure 413 (e.g., rotate about the X-axis shown in fig. 9) to change the orientation of the plurality of chuck assemblies 414. The moving module 411 includes, for example, a driver 4111, a plurality of push rods 4112 and a connecting member 4113, two ends of the plurality of push rods 4112 are respectively connected to the driver 4111 and the connecting member 4113, and the processing device 1 can control the driver 4111 to make the plurality of push rods 4112 drive the connecting member 4113 to move toward or away from the driver 4111, so as to drive the rotating module 412, the supporting structure 413 and the plurality of chuck assemblies 414 to move along the lateral direction.

Fig. 9 to 13 are schematic views showing the operation of the bag opening apparatus for removing the adhesive tape A3 of the semiconductor material a disposed on the carrier 62 and clamping the tail structure a15. As shown in fig. 9 and 10, when the carrier 62 is provided with the semiconductor material a, the processing apparatus 1 may first control the auxiliary pressing device 42 to move the auxiliary pressing member 423 to the side of the tail end structure a15 of the semiconductor material a, and make the auxiliary pressing member 423 press the top surface of the packaging portion a13 of the semiconductor material a. Then, as shown in fig. 10 and 11, the processing device 1 controls the first knife mechanism 3 to operate, so that the two blades 312 of the first knife 31 cut the two tapes A3 of the semiconductor material a.

As shown in fig. 10, it should be noted that the body 311 of the first cutting tool 31 may further include a protruding structure 313, the protruding structure 313 is located between the two cutting edges 312, and the protruding structure 313 is used to push the tail end structure a15. The distance between the side of the protruding structure 313 and the other side of the body 311 is greater than the distance between the side of each blade 312 and the other side of the body 311.

After the first cutter 31 cuts the two tapes A3, the processing device 1 may control the first cutter 31 to move continuously, so that the first cutter 31 extends between the tail end structure a15 and the non-wrapping portion a14 to push the non-wrapping portion a14 through the protruding structure 313, thereby turning the tail end structure a15 relative to the wrapping portion a13, and the inside a151 of the turned tail end structure a15 is exposed. While the auxiliary pressing member 423 may still press against the top surface of the packaging portion a13 during the pushing of the first cutter 31 against the tail end structure a15, the auxiliary pressing member 423 may not press against the packaging portion a13.

As shown in fig. 11 and 12, when the two tapes A3 are cut off, the tail structure a15 is pushed by the first cutter 31, and the inner side a151 of the tail structure a15 is exposed, the processing apparatus 1 controls the turning apparatus 41 to operate, so that the supporting structure 413 and the plurality of suction cup assemblies 414 disposed thereon move onto the tail structure a15, and at this time, the processing apparatus 1 controls the suction apparatus to operate, so that the plurality of suction cup assemblies 414 generate suction force and adsorb the tail structure a15. As shown in fig. 12 and 13, after the plurality of suction cup assemblies 414 adsorb the tail end structure a15, the processing apparatus 1 controls the rotation module 412 to operate, so as to rotate the support structure 413 and the plurality of suction cup assemblies 414 disposed thereon by 90 degrees (without being limited thereto), thereby enabling the tail end structure a15 adsorbed by the plurality of suction cup assemblies 414 to be disposed upright with respect to the packaging portion a13.

Referring to fig. 14, the clamping device 44 may include a moving module 441, a connecting arm 442 and a clamp 443. Linking arm 442 is connected to moving module 441 and clamp 443 is connected to linking arm 442. The processing apparatus 1 is electrically connected to the moving module 441, and the processing apparatus 1 can control the moving module 441 to move the connecting arm 442 and the clamp 443 from a position adjacent to the first cutting mechanism 3 to a position adjacent to the second cutting mechanism 5. The moving module 441 can, for example, include a slide rail 4411 and a slider 4412, the slider 4412 is connected to the connecting arm 442, and the processing apparatus 1 can control the slider 4412 to slide on the slide rail 4411. The clamp 443 may include a driver 4431 and two clamping arms 4432, the two clamping arms 4432 are connected with the driver 4431, and the processing apparatus 1 can control the driver 4431 to rotate the two clamping arms 4432 relative to the driver 4431 in a direction to approach or separate from each other, so as to clamp or not clamp the tail structure a15.

As shown in fig. 1 and 13 to 16, when the suction cup assemblies 414 suck the tail end structure a15 and the tail end structure a15 is vertically arranged with respect to the packaging portion a13, the processing device 1 controls the clamping device 44 to operate, so that the connecting arm 442 and the clamp 443 move to above the tail end structure a15, and then controls the clamp 443 to clamp the tail end structure a15. After the clamping device 443 clamps the tail structure a15, the processing apparatus 1 controls the turning device 41 to operate, so that the plurality of chuck assemblies 414 no longer adsorb the tail structure a15, and the processing apparatus 1 simultaneously controls the clamping device 44 and the stage 62 to operate, so that the clamping device 44 and the semiconductor material a move together to a position adjacent to the second tool mechanism 5.

As shown in fig. 16 to fig. 19, the second cutter mechanism 5 is electrically connected to the processing apparatus 1, and the processing apparatus 1 can control the second cutter mechanism 5 to operate to cut the tail end structure a15, so as to separate the tail end structure a15 from the packaging portion a13. Specifically, the second tool mechanism 5 may comprise an abutting device 51 and a tool device 52, for example. The abutment means 51 and the cutter means 52 are arranged facing each other. The abutting device 51 may include a driver 511 and an abutting plate 512, the driver 511 is connected to the abutting plate 512, the processing device 1 is electrically connected to the driver 511, and the processing device 1 can control the driver 511 to move the abutting plate 512 toward or away from the cutter device 52.

As shown in fig. 17, the cutter device 52 may include a moving module 521, a housing 522, a second cutter 523 and a telescopic mechanism 524. The moving module 521 includes two drivers 5211 and a connecting plate 5212, the two drivers 5211 are electrically connected to the processing device 1, the connecting plate 5212 is connected to the two drivers 5211, and the processing device 1 can control the two drivers 5211 to move so that the connecting plate 5212 moves toward or away from the abutting device 51. The connecting plate 5212 is connected to the housing 522, the second cutter 523 is disposed in the housing 522, the housing 522 has a through hole 5221, the telescopic mechanism 524 is disposed in the housing 522, and the telescopic mechanism 524 is connected to the second cutter 523. The retracting mechanism 524 may include a driver 5241 and a connecting member 5242, wherein the connecting member 5242 is connected to the driver 5241, and the connecting member 5242 is connected to the second cutter 523. The processing device 1 is electrically connected to the retracting mechanism 524, and the processing device 1 can control the actuator 5241 of the retracting mechanism 524 to actuate, so that the linkage 5242 drives a part of the second cutter 523 to protrude out of the housing 522 through the through hole 5221, or retract the second cutter 523 into the housing 522 from a state of protruding out of the housing 522.

As shown in fig. 16 to fig. 19, when the two clamping arms 4432 of the clamp 443 of the clamping device 44 clamp the tail structure a15, and the tail structure a15 is correspondingly located between the abutting device 51 and the cutter device 52, the processing apparatus 1 actuates the two drivers 5211 of the moving module 521 for controlling the abutting device 51 and the cutter device 52, so that the abutting plate 512 and the connecting plate 5212 clamp the tail structure a15 together. When the abutting plate 512 and the connecting plate 5212 clamp the tail structure a15 together, the processing device 1 controls the operation of the retracting mechanism 524, so that the second cutter 523 extends out of the through hole 5221 and cuts off the tail structure a15.

It should be noted that, as shown in fig. 8, 16 and 18, in the preferred embodiment, the processing device 1 may control the two pressing devices 22 to press the two pressing members 222 against the bottom a131 of the protection bag A1 before controlling the second cutter mechanism 5 to operate; when the two pressing members 222 press against the bottom a131 of the protection bag A1, the processing device 1 controls the clamping device 44 to operate, so that the clamp 443 moves away from the carrier 62, and at this time, the portion of the tail end structure a15 clamped by the clamp 443, which is connected to the packaging portion a13, is in a relatively tight state. When the tail structure a15 clamped by the clamp 443 is in a relatively tight state, the processing apparatus 1 continuously controls the second cutter mechanism 5 to operate, so that the second cutter 523 cuts the tail structure a15 under the condition that the abutting plate 512 and the connecting plate 5212 clamp the tail structure a15 together. By making the portion of the tail end structure a15 clamped by the clamp 443 and the packaging portion a13 relatively tense, and then cutting the tail end structure a15 by the second cutter 523, the second cutter 523 can cut off the connection between the tail end structure a15 and the packaging portion a13 smoothly.

It should be emphasized that, in the embodiment where the accommodating box A2 is a wafer box and the protection bag A1 is an aluminum foil bag or an antistatic bag, by the design that the first cutter 31 and the second cutter 523 are respectively used for cutting the tape A3 and the tail end structure a15 of the semiconductor material a, it can be ensured that the first cutter 31 and the second cutter 523 can smoothly cut the tape A3 and the tail end structure a15, respectively, and that the adhesive of the tape A3 remaining on the first cutter 31 cannot stick to the wafer box. In practical applications, the blade of the first cutter 31 may be flat, and the blade of the second cutter 523 may be serrated, so that the adhesive tape A3 and the tail end structure a15 can be cut rapidly and smoothly. If the tape A3 and the tail structure a15 are cut in sequence by using the saw-toothed cutter, a large amount of adhesive of the tape A3 will remain on the blade after the cutter has cut the tape A3 (as shown in fig. 2), which not only results in the blade being sharp but also may cause the problem that the adhesive is stuck to the wafer box.

As shown in fig. 18 to 20, after the second cutter 523 cuts the tail end structure a15, the processing apparatus 1 controls the abutting apparatus 51 and the cutter apparatus 52 to operate, so that the abutting plate 512 and the connecting plate 5212 do not clamp the tail end structure a15, and then the processing apparatus 1 can control the stage 62 to move on the rail 61, so that the semiconductor material a arranged on the stage 62 is separated from the second cutter mechanism 5. After the second cutter 523 cuts the tail structure a15, the processing apparatus 1 may further control the clamping device 44 to operate, so that the clamping device 44 moves to a specific position, and after the clamping device 44 moves to the specific position, the processing apparatus 1 controls the two clamping arms 4432 of the clamp 443 to no longer clamp the tail structure a15, and discards the tail structure a15 to the specific position. As shown in fig. 20, when the tail end structure a15 is cut and separated from the packaging portion a13, the packaging portion a13 forms an opening A5, and at this time, the bag opening device S1 (shown in fig. 1) completes the operation of opening the protection bag A1 of the semiconductor material a; then, the related equipment or personnel can take out the accommodating box A2 (shown in fig. 3) arranged in the packaging part a13 through the opening A5.

Fig. 21 to 24 are schematic views of the bag opening system of the present application, and fig. 22 to 24 are schematic views illustrating the operation of the bag recycling apparatus of the bag opening system of the present application. The bag opening system S of the present application comprises: a bag opening device S1, a fetching device S2, a central control device S3 and a bag body recycling device S4. For the description of the bag opening device S1, please refer to the content of the previous paragraph, which is not described herein again. The fetching device S2 is used for fetching the accommodating box A2 arranged in the packaging part a13. In a preferred embodiment, the bag opening system S may further include a bag opening device (not shown) for opening the opening A5 of the packing portion a13 (as shown in fig. 22), and the central control device S3 may control the bag opening device to open the opening A5 before the fetching device S2 takes out the containing box A2.

The central control device S3 is electrically connected to the bag opening device S1, the article taking device S2 and the bag recycling device S4, the central control device S3 is configured to control the bag opening device S1 to cut off the tail end structure a15 of the semiconductor material a, control the article taking device S2 to take out the accommodating box A2 disposed in the packaging portion a13, and control the bag recycling device S4 to fold the packaging portion a13. The central control apparatus S3 is, for example, various computers, servers, and the like. The object-taking device S2 may include a robot arm, for example. The central control device S3 referred to herein may be a device including the processing apparatus 1, or the central control device S3 may be a device independent of the processing apparatus 1.

As shown in fig. 22, the bag recovery apparatus S4 may include: a longitudinal moving module S41, a transverse moving module S42, a clamping module S43, a platform S44 and a guiding structure S45. In the embodiment, the bag recycling apparatus S4 includes two moving modules, i.e., the vertical moving module S41 and the horizontal moving module S42, but the number and the form of the moving modules included in the bag recycling apparatus S4 are not limited thereto.

The longitudinal moving module S41 is connected to the holding module S43, and the lateral moving module S42 is connected to the longitudinal moving module S41. The central control device S3 is electrically connected to the longitudinal moving module S41 and the transverse moving module S42, the central control device S3 can control the longitudinal moving module S41 to move, so that the clamping module S43 moves along a longitudinal direction (e.g. a direction perpendicular to the ground, such as a Z-axis direction shown in the figure) to approach or depart from the packaging portion a13; the central control device S3 can control the lateral moving module S42 to move the clamping module S43 along a lateral direction (e.g. perpendicular to the longitudinal direction, such as the Y-axis direction shown in the figure) to move away from or close to the packaging portion a13.

The central control device S3 is electrically connected to the clamping module S43, and the central control device S3 can control the clamping module S43 to actuate, so that the clamping module S43 clamps the package portion a13. The clamping module S43 may include a driving assembly S431, two clamping arms S432, and an extending member S433. Two clamping arms S432 are connected with the driving assembly S431, and the extending member S433 is positioned between the two clamping arms S432. The central control device S3 is electrically connected to the driving assembly S431, and the central control device S3 can control the driving assembly S431 to move the two clamping arms S432 toward or away from the extending member S433. The driving assembly S431 includes, for example, a slide rail and a related driver, and the two clamping arms S432 are the slide rail slidably disposed on the driving assembly S431.

As shown in fig. 22, two opposite end surfaces of the protruding member S433 define a first abutting surface S4331, each of the clamping arms S432 has a second abutting surface S4321, and each of the second abutting surfaces S4321 is disposed to face each of the first abutting surfaces S4331. The first abutting surface S4331 and the second abutting surface S4321 facing each other can commonly sandwich the packing portion a13. In practical applications, the first abutting surface S4331 and the second abutting surface S4321 may be rectangular planes with substantially the same shape and size; of course, the shapes and sizes of the first abutting surface S4331 and the second abutting surface S4321 are not limited to those shown in the drawings, as long as the first abutting surface S4331 and the second abutting surface S4321 facing each other can commonly clamp the package portion a13, and the shapes and sizes of the first abutting surface S4331 and the second abutting surface S4321 can be changed as required.

The platform S44 is disposed beside the track 61 of the feeding mechanism 6, the guiding structure S45 is disposed at one end of the platform S44, and the platform S44 is disposed adjacent to the traverse module S42, and the traverse module S42 of the bag recycling apparatus S4 can move the clamping module S43 to the upper side of the platform S44.

As shown in fig. 22 to 24, the procedure of the bag recovery apparatus S4 for recovering the packaging part a13 may be: as shown in fig. 22, when the accommodating box A2 (shown in fig. 3) in the packaging portion a13 is taken out, and the carrier 62 moves to the lower side of the bag recovery apparatus S4, the central control apparatus S3 may first control the two pressing devices 22 of the fixing mechanism 2 to operate, so that the two pressing members 222 press against the bottom a131 of the packaging portion a13; next, the central control device S3 controls the transverse moving module S42 to move the clamping module S43 above the opening a12 of the packaging part a13; as shown in fig. 23, the central control device S3 will then control the longitudinal moving module S41 to operate, so that the extending member S433 enters the packaging part a13 through the opening A5 of the packaging part a13, and the two clamping arms S432 are correspondingly located outside the packaging part a13.

As shown in fig. 23, when the inserting member S433 is located inside the packaging portion a13 and the two clamping arms S432 are located outside the packaging portion a13, the central control device S3 controls the driving assembly S431 to operate, and each clamping arm S432 moves towards the inserting member S433, so that each clamping arm S432 and the inserting member S433 clamp the packaging portion a13 together, and the packaging portion a13 clamped by the two clamping arms S432 and the inserting member S433 is folded along the folding lines A4 located at two sides of the packaging portion a13.

After the two clamping arms S432 and the extending member S433 clamp the package portion a13 together, the central control device S3 controls the longitudinal moving module S41 to move away from the package portion a13, and at this time, the two pressing members 222 of the two pressing devices 22 still press the bottom portion a131 of the package portion a13, so that the package portion a13 is in a substantially flattened state.

When the packaging part a13 is in a substantially flattened state, the central control device S3 will first control the two pressing devices 22 not to press the bottom a131 of the packaging part a13 any more, and then control the transverse moving module S42 to operate, so that the packaging part a13 clamped by the clamping module S43 moves toward the platform S44; during the movement of the clamping module S43, the packaging part a13 passes through the guiding structure S45 and is guided by the guiding structure S45 to fall down toward the platform S44; as shown in fig. 24, after the wrapping portion a13 falls down toward the platform S44, the central control device S3 controls the clamping module S43 to no longer clamp the wrapping portion a13, and the folded wrapping portion a13 is placed on the platform S44. In practical applications, after the central control device S3 controls the clamping module S43 to no longer clamp the wrapping portion a13, the central control device S3 can also control the longitudinal moving module S41 to actuate, so that the extending member S433 presses the wrapping portion a13 lying on the platform S44.

In various embodiments, the platform S44 may be connected to a moving module S46, the central control device S3 is electrically connected to the moving module S46, and the central control device S3 can control the moving module S46 to move the platform S44 toward the stage 62. In the process that the central control device S3 controls the transverse moving module S42 to move the wrapping portion a13 held by the holding module S43 toward the platform S44, the central control device S3 may also control the moving module S46 to actuate at the same time to make the direction of the carrier 62 of the moving module S46 approach, so that the platform S44 pushes the wrapping portion a13 held by the holding module S43, and thus, the wrapping portion a13 can be laid on the platform S44 more easily.

Please refer to fig. 25, which is a flowchart illustrating a bag opening method according to the present application. The pocket opening method of the present application is used for opening a protection pocket A1 (shown in fig. 3) of a semiconductor material a (shown in fig. 3), and for the detailed description of the semiconductor material a, please refer to the foregoing embodiments, which are not described herein again. The bag opening method comprises the following steps:

a positioning step S101: fixing the semiconductor material;

a first cutting step S102: controlling a first cutter mechanism to cut off the adhesive tape so as to enable the tail end structure to be movable;

a pulling step S103: controlling a lifting mechanism to fix the tail end structure and enabling the tail end structure to be vertically arranged relative to the packaging part;

a second cutting step S104: and controlling a second cutter mechanism to cut off the position where the tail end structure is connected with the packaging part so as to separate the tail end structure from the packaging part.

The bag opening method of the present application can be achieved by applying the bag opening apparatus S1, but is not limited thereto. It should be noted that the first cutter mechanism includes a first cutter dedicated to cutting the tape, and the second cutter mechanism includes a second cutter dedicated to cutting the protective bag, the first cutter has a flat blade, for example, and the second cutter has a saw-toothed blade, for example, the tape and the protective bag are cut by the first cutter and the second cutter having different blades, respectively, so as to prolong the life of the two cutters and prevent the adhesive of the tape from sticking to the box for holding the semiconductor material.

Please refer to fig. 26, which is a schematic flow chart illustrating a bag opening method according to another embodiment of the present application. The bag opening method of the embodiment comprises the following steps:

a positioning step S101: fixing the semiconductor material;

a first cutting step S102: controlling a first cutter mechanism to cut off the adhesive tape so as to enable the tail end structure to be in a movable state;

a pushing step SX: controlling the first cutter mechanism to extend between the tail end structure and the packaging part and push the tail end structure to unfold at least one part of the tail end structure to expose the inner side of the tail end structure;

a pulling step S103A: controlling a plurality of sucker components of a lifting mechanism to adsorb the tail end structure, controlling a rotating module of the lifting mechanism to drive a supporting structure connected with the plurality of sucker components to rotate, so that the tail end structure is vertically arranged relative to the packaging part, then controlling a clamping device of the lifting mechanism to clamp the non-packaging part, and lifting the clamped non-packaging part to a direction far away from the packaging part;

The present embodiment is different from the previous embodiments in the following point: a pushing step SX is further included between the first cutting step S2 and the lifting step S3, and in the lifting step S3, the tail end structure is firstly absorbed through the plurality of sucker components, then the non-packaging part is clamped through the clamping device, and the non-packaging part moves towards the direction far away from the packaging part. By the design of the pushing step SX, the suction cup assembly, the clamping device, etc., the second cutter can more easily cut off the connection of the tail end structure and the packaging part in the second cutting step S4.

In summary, the bag opening device of the present application can automatically and rapidly cut off the tail end structure of the semiconductor material, so that the packaging part of the semiconductor material is opened, and in the whole bag opening process, the participation of manpower is basically not needed, so that the requirement of manpower can be greatly reduced; in the conventional application, the tape and the tail end structure of the semiconductor material must be cut off manually, which consumes a lot of manpower and is inefficient, and the wafers stored in the accommodating box are very expensive, so that there is a problem that the packaging part of the semiconductor material is opened manually, and personnel may damage the wafers in the wafer box due to various factors.

The above description is only a preferred embodiment of the present application, and not intended to limit the scope of the present application, so that all equivalent technical changes made by using the contents of the specification and drawings of the present application are included in the protection scope of the present application.

Claims

1. A bag opening method is characterized in that the bag opening method is used for opening a protection bag of a semiconductor material, the semiconductor material comprises the protection bag, an accommodating box and at least one adhesive tape, the protection bag is provided with an accommodating space and an opening, the accommodating box is arranged in the accommodating space through the opening, the protection bag is defined with a packaging part and a non-packaging part, the packaging part is wrapped on the periphery of the accommodating box, the non-packaging part is bent into a tail end structure, the adhesive tape is adhered to the packaging part and the tail end structure, and the adhesive tape is used for fixing the tail end structure on the packaging part; the bag opening method comprises the following steps:

a positioning step: fixing the semiconductor material piece;

a first cutting step: controlling a first cutter mechanism to cut off the adhesive tape so as to enable the tail end structure to be in a movable state;

a lifting step: controlling a lifting mechanism to fixedly hold the tail end structure and enabling the tail end structure to be vertically arranged relative to the non-packaging part;

a second cutting step: and controlling a second cutter mechanism to cut off the part of the tail end structure connected with the packaging part so as to separate the tail end structure from the packaging part.

2. The method for opening a bag according to claim 1, further comprising a pushing step between the first cutting step and the lifting step: and controlling the first cutter mechanism to extend between the tail end structure and the packaging part and then push the tail end structure to flatten at least one part of the tail end structure so as to expose the inner side of the tail end structure.

3. The method of claim 1, wherein in the lifting step, a plurality of suction cup assemblies of the lifting mechanism are controlled to suck the tail end structure, and a rotating module of the lifting mechanism is controlled to rotate a supporting structure, so that the plurality of suction cup assemblies connected with the supporting structure drive the tail end structure to rotate relative to the packaging portion, and the tail end structure is arranged upright relative to the packaging portion.

4. The bag opening method according to claim 3, wherein in the lifting step, when the tail end structure is arranged upright with respect to the packaging portion, a holding device of the lifting mechanism is controlled to hold the non-packaging portion, and then the holding device is controlled to move in a direction away from the packaging portion to lift the tail end structure.

5. The utility model provides an open bagging apparatus, its characterized in that, open bagging apparatus is used for opening a protection bag of semiconductor material spare, the semiconductor material spare contains protection bag, an accommodation box and an at least sticky tape, the protection bag has an accommodation space and an opening, the accommodation box is through the opening set up in the accommodation space, protection bag definition has a packing portion and a non-packing portion, the packing portion cladding in the periphery of accommodation box, non-packing portion is buckled into a tail end structure, the sticky tape paste in packing portion and tail end structure, and the sticky tape is used for making the tail end structure be fixed in packing portion, open bagging apparatus contains:

a processing device;

the fixing mechanism is electrically connected with the processing device and used for fixing the semiconductor material piece;

the first cutter mechanism is electrically connected with the processing device and is used for cutting the adhesive tape;

the lifting mechanism is electrically connected with the processing device, and the processing device can control the lifting mechanism to enable the lifting mechanism to hold the tail end structure and enable the tail end structure to be vertically arranged relative to the packaging part; and

a second cutter mechanism electrically connected to the processing device, the second cutter mechanism being configured to cut the tail structure;

the processing device can sequentially control the fixing mechanism and the first cutter mechanism to fix the semiconductor material piece and then cut the adhesive tape; the processing device can sequentially control the lifting mechanism and the second cutter mechanism, so that the tail end structure is firstly lifted, and then the part of the tail end structure connected with the packaging part is cut.

6. The bag opening apparatus according to claim 5, further comprising a conveying mechanism, the conveying mechanism comprising a rail and a carrying platform, the carrying platform being controlled by the processing device to move along the rail, the fixing mechanism being disposed on the carrying platform, the fixing mechanism comprising four pushing devices, each pushing device comprising a driver and a pushing member, the driver being electrically connected to the processing device, the pushing member being connected to the driver; when the semiconductor material piece is arranged on the carrying platform, the processing device can control the four pushing and abutting devices, so that the four pushing and abutting pieces abut against the four side faces of the semiconductor material piece.

7. The bag opening apparatus according to claim 5, further comprising two pressing devices, each pressing device comprising a driver and a pressing member, wherein the driver of the pressing device is electrically connected to the processing device, and the pressing member is connected to the driver of the pressing device; the processing device can control the two drivers of the pressing device to press the two pressing pieces against the packaging part; before the processing device controls the lifting mechanism to fix the tail end structure, the two pressing devices can be controlled firstly, so that the two pressing pieces press the packaging part.

8. The bag opener according to claim 5, wherein the first cutter mechanism comprises a first cutter comprising a body having two blades on one side and a projecting structure between the two blades; the processing device can control the first cutter mechanism, so that the protruding structure pushes against the tail end structure in a movable state, and the tail end structure is turned relative to the packaging part.

9. The bag opening apparatus according to claim 5, wherein said lifting mechanism comprises a turning device, said turning device comprises a moving module, a rotating module, a supporting structure and a plurality of sucker members, said moving module and said rotating module are electrically connected to said processing device, said moving module is connected to said rotating module, said supporting structure is connected to said rotating module, said rotating module is controlled by said processing device to rotate said supporting structure, and a plurality of sucker members are fixed to said supporting structure; the processing device can control the moving module to move the sucker assemblies to the movable tail end structure; the processing device can control the sucking disc assemblies to suck the tail end structure firstly, and then control the rotating module to enable the tail end structure to rotate relative to the packaging part, so that the tail end structure is vertically arranged relative to the packaging part.

10. A bag opening apparatus according to claim 5, wherein the lifting mechanism comprises a holding device, the holding device comprises a driver and a clamp, the processing device is electrically connected to the driver, the clamp is connected to the driver, and the processing device is capable of controlling the driver such that the clamp holds the trailing structure or no longer holds the trailing structure.

11. The bag opener according to claim 5, wherein the bag opener comprises a second cutter mechanism, the second cutter mechanism comprises an abutting device and a cutter device, the abutting device comprises an abutting plate, the cutter device comprises a connecting plate, a housing, a second cutter and a telescopic mechanism, the connecting plate is connected with the housing, the second cutter is arranged in the housing, the housing has a through hole, the telescopic mechanism is connected with the second cutter, the processing device is electrically connected with the telescopic mechanism, and the processing device can control the telescopic mechanism to enable the second cutter to protrude out of the housing through the through hole or to retract into the housing from a state of protruding out of the housing; said handling device being able to control said second cutter mechanism such that said abutment plate of said abutment device and a connecting plate of said cutter device together clamp said tail end structure.

12. A bag opening system, comprising: the bag opening device, the article taking device and the central control device according to any one of claims 5 to 11, wherein the central control device is electrically connected with the bag opening device and the article taking device; when the bag opening device cuts the tail end structure of the semiconductor material piece away from the packaging part, the central control device can control the fetching device so as to take out the containing box arranged in the packaging part.

13. The bag opening system according to claim 12, further comprising a bag recycling apparatus, said bag recycling apparatus comprising at least a moving module, a holding module and a platform, said moving module being connected to said holding module, said holding module comprising two clamping arms and an extending member, said extending member being located between two of said clamping arms, each of said clamping arms being disposed facing said extending member, each clamping arm being controllable to move toward or away from said extending member so as to clamp or not clamp said package portion; the central control equipment is electrically connected with the bag body recovery equipment; the central control device can control the clamping module and the moving module to clamp the packaging part and move the packaging part to the platform.