CN113998238B

CN113998238B - Fetching method, fetching equipment, bag opening equipment and fetching system

Info

Publication number: CN113998238B
Application number: CN202110019520.7A
Authority: CN
Inventors: 张孟椿
Original assignee: Mirle Automation Corp
Current assignee: Mirle Automation Corp
Priority date: 2020-07-28
Filing date: 2021-01-07
Publication date: 2023-01-31
Anticipated expiration: 2041-01-07
Also published as: CN113998238A

Abstract

The application provides a get thing method, get thing equipment, open bag equipment and get thing system, it is used for taking out an accommodation box by a protection bag of a semiconductor material spare to get the thing method, the protection bag has an accommodation space and an opening, the accommodation box sets up in the accommodation space through the opening, the protection bag definition has a packing portion and a non-packing portion, the cladding of packing portion is in the outside of accommodation box, non-packing portion is buckled and becomes a tail end structure, the sticky tape is pasted in packing portion and tail end structure, and the sticky tape is used for making the tail end structure be fixed in packing portion, it contains to get the thing method: a positioning step: fixing the semiconductor material; a cutting step: controlling at least one cutter mechanism to cut off the adhesive tape and the tail end structure successively so that the packaging part forms a fetching opening, and the accommodating box can be exposed through the fetching opening; a step of opening: controlling a bag opening mechanism to open the packaging part; a taking-out step: controlling a fetching device to extend into the packaging part, fixing the containing box and taking the containing box out of the packaging part.

Description

Fetching method, fetching equipment, bag opening equipment and fetching system

Technical Field

The present disclosure relates to a method, an apparatus, a system and a system for taking out a semiconductor material, and more particularly, to a method, an apparatus, a system and a system for taking out a semiconductor material.

Background

Generally, during the transportation of a wafer pod (e.g., FOUP) containing wafers, a dust-proof protection bag or an antistatic bag is mostly covered on the outside of the wafer pod to prevent dust from staying outside the wafer pod or prevent the wafers in the wafer pod from being affected by external static electricity; the dust-proof protective bag or the antistatic bag wrapped outside the wafer box is usually fixed by means of an adhesive tape or the like.

In the current application, when the wafer box that has dustproof protection bag or antistatic bag in the outside cladding, its wafer that bears wants to get into relevant workstation and handles, through artificial mode, cut off the sticky tape earlier and open dustproof protection bag or antistatic bag, at last with artificial mode again, take out the wafer box in dustproof protection bag or antistatic bag. Thus, it is inefficient and requires a lot of manpower. In addition, when the personnel cannot work due to various irresistible factors, the whole wafer production work may be stopped, thereby causing great loss.

Disclosure of Invention

The application discloses a fetching method, fetching equipment, bag opening equipment and a fetching system, which are mainly used for solving the problems that the conventional method of opening a protection bag of a semiconductor material piece by a manual method and then taking out an accommodating box in the protection bag consumes a large amount of manpower, has low efficiency, and the whole production process is possibly shut down when an operator cannot work.

One of the embodiments of the present application discloses a fetching method, which is used for taking out an accommodating box from a protecting bag of a semiconductor material piece, the protecting bag has an accommodating space and an opening, the accommodating box is arranged in the accommodating space through the opening, the protecting bag is defined with a packaging part and a non-packaging part, the packaging part is coated outside the accommodating box, the non-packaging part is bent to form a tail end structure, an adhesive tape is adhered to the packaging part and the tail end structure, and the adhesive tape is used for fixing the tail end structure to the packaging part, the fetching method comprises: a positioning step: fixing the semiconductor material; a cutting step: controlling at least one cutter mechanism to cut off the adhesive tape and the tail end structure successively so that the packaging part forms an article taking opening, and the accommodating box can be exposed through the article taking opening; a step of opening: controlling a bag opening mechanism to open the packaging part; a taking-out step: controlling a fetching device to extend into the packaging part, fixing the containing box and taking the containing box out of the packaging part.

Optionally, in the cutting step, two cutter mechanisms are controlled in sequence, and the two cutter mechanisms are respectively defined as a first cutter mechanism and a second cutter mechanism; in the cutting step, the first cutter mechanism is controlled to cut the adhesive tape to make the tail end structure present a movable shape, and then the second cutter mechanism is controlled to cut the tail end structure to make the packaging part form an fetching opening.

Optionally, a bag opening step is further included between the cutting step and the opening step: the outer sides of the suction packaging parts of the sucker components are controlled, and the sucker components are turned in the direction far away from the accommodating box.

Optionally, in the step of opening, the four rod bodies of the bag opening mechanism are firstly extended into the packaging part, and then at least one moving module is controlled to move the four rod bodies in a direction away from the accommodating box, so as to open the packaging part.

Optionally, in the positioning step, four pushing devices of a fixing mechanism are controlled to respectively push four side surfaces of the semiconductor material, and two pushing devices are controlled to push the packaging part, so as to fix the semiconductor material arranged on a carrying platform; each pushing device comprises a driver and a pushing piece, and the four drivers are controlled in the positioning step so that the four pushing pieces push the packaging part and the accommodating box; each pressing device comprises a driver and a pressing piece, and in the positioning step, the two drivers of the two pressing devices are controlled, so that the two pressing pieces of the two pressing devices only press the packaging part.

One of the embodiments of the application discloses a get thing equipment, it is used for taking out an accommodation box by a protection bag of semiconductor material spare, the protection bag has an accommodation space and an opening, the accommodation box sets up in the accommodation space through the opening, the protection bag definition has a packing portion and a non-packing portion, packing portion cladding is in the outside of accommodation box, non-packing portion is buckled and becomes a tail end structure, the sticky tape is pasted in packing portion and tail end structure, and the sticky tape is used for making the tail end structure be fixed in packing portion, get the thing equipment and contain: a processing device; the fixing mechanism is electrically connected with the processing device, and the processing device can control the fixing mechanism to fix the semiconductor material; at least one cutter mechanism electrically connected with the processing device, wherein the cutter mechanism is used for cutting off the adhesive tape and the tail end structure; a bag opening mechanism electrically connected with the processing device, the bag opening mechanism is used for opening the packaging part; the object taking device is electrically connected with the processing device and is used for taking the accommodating box arranged in the packaging part out of the packaging part; the processing device controls the fixing mechanism to fix the semiconductor material, controls the cutter mechanism to cut off the adhesive tape and the tail end structure to enable the packaging part to form an article taking opening, enables the containing box to be exposed through the article taking opening, controls the bag opening mechanism to open the packaging part, and finally controls the article taking device to extend into the packaging part to take out the containing box.

Optionally, the object-taking device includes two tool mechanisms respectively defined as a first tool mechanism and a second tool mechanism, the first tool mechanism includes a first tool and a first tool driver, the second tool mechanism includes a second tool and a second tool driver, the processing device is electrically connected to the first tool driver and the second tool driver, the first tool is connected to the first tool driver, the second tool is connected to the second tool driver, the processing device can control the first tool driver to cut off the adhesive tape, and the processing device can control the second tool driver to cut off the tail end structure.

Optionally, the object-taking device further comprises a conveying mechanism, the conveying mechanism comprises a rail and a carrying platform, the carrying platform can be controlled to move along the rail, the fixing mechanism is arranged on the carrying platform, the fixing mechanism comprises four pushing devices, each pushing device comprises a driver and a pushing piece, the driver is electrically connected with the processing device, and the pushing pieces are connected with the driver; when the semiconductor material piece is arranged on the carrying platform, the processing device controls the four pushing devices to enable the four pushing devices to push the packaging part and the accommodating box.

Optionally, the object-taking device further comprises two pressing devices, each pressing device comprises a driver and a pressing piece, the driver is electrically connected with the processing device, and the pressing piece is connected with the driver; the processing device can control the two drivers, so that the two pressing pieces only press the packaging part.

Optionally, the bag opening mechanism comprises a lifting module, two support structures, four rod bodies and four moving modules, the lifting module is electrically connected with the processing device, the two support structures are connected with the lifting module, each support structure is provided with two moving modules, and each rod body is connected with one moving module; the processing device is electrically connected with the lifting module and the four moving modules, the lifting module can be controlled by the processing device, so that the four rod bodies enter the packaging part through the object taking opening, and the four moving modules can be controlled by the processing device, so that the four rod bodies in the packaging part move in the direction away from the containing box to open the packaging part.

Optionally, the bag opening mechanism further comprises two auxiliary moving modules and two auxiliary plate bodies, the two auxiliary moving modules are arranged on the two supporting structures, each auxiliary plate body is connected with one auxiliary moving module, the processing device can control the lifting module so that the two auxiliary plate bodies enter the packaging body, and the processing device can control the two auxiliary moving modules so that the two auxiliary plate bodies move in the direction away from the accommodating box to open the packaging part.

Optionally, the object taking device further comprises two turning devices, each turning device comprises a moving module, a rotating module, a supporting structure and a plurality of sucker components, the moving module and the rotating module are respectively electrically connected with the processing device, the moving module is connected with the rotating module, the supporting structure is connected with the rotating module, the rotating module can be controlled to rotate the supporting structure, and the sucker components are fixed on the supporting structure; the processing device can control the outer sides of the plurality of sucker components to adsorb the packaging parts, and then control the two rotating modules, so that the two supporting structures overturn, and accordingly the plurality of sucker components drive the packaging parts to overturn in the direction away from the accommodating box.

One of the embodiments of the application discloses a bag equipment of opening, it is used for taking out a holding box by a protection bag of semiconductor material spare, the protection bag has an accommodation space and an opening, the holding box sets up in the accommodation space through the opening, the protection bag definition has a packing portion and a non-packing portion, packing portion cladding is in the outside of holding box, non-packing portion is buckled and becomes a tail end structure, the sticky tape is pasted in packing portion and tail end structure, and the sticky tape is used for making the tail end structure be fixed in packing portion, it contains to open a bag equipment: the processing device can be in communication connection with a fetching device; the fixing mechanism is electrically connected with the processing device, and the processing device can control the fixing mechanism to fix the semiconductor material; at least one cutter mechanism electrically connected with the processing device, wherein the cutter mechanism is used for cutting off the adhesive tape and the tail end structure; a bag opening mechanism electrically connected with the processing device, the bag opening mechanism is used for opening the packaging part; the processing device firstly controls the fixing mechanism to fix the semiconductor material, then controls the cutter mechanism to cut off the adhesive tape and the tail end structure, so that the packaging part forms an object taking opening, the containing box can be exposed through the object taking opening, and then controls the bag opening mechanism to open the packaging part; when the bag opening mechanism opens the packaging part, the processing device can transmit a signal to the fetching device so that the fetching device can fetch the containing box from the packaging part.

One embodiment of the present application discloses an extraction system, comprising: the article taking device, the central control device and the bag body recycling device according to any one of claims 6 to 12, wherein the central control device is electrically connected with the article taking device and the bag body recycling device; the central control device can control the fetching device to cut off the tail end structure of the semiconductor material, take out the containing box arranged in the packaging part and control the bag body recovery device to fold the packaging part.

Optionally, the bag recycling equipment comprises at least one moving module, a clamping module and a platform, the moving module is connected with the clamping module, the clamping module comprises two clamping arms and an extending member, the extending member is located between the two clamping arms, each clamping arm is arranged opposite to the extending member, and each clamping arm can be controlled to move towards a direction close to or far away from the extending member so as to clamp or not clamp the packaging part; the central control equipment is electrically connected with the bag body recovery equipment; the central control equipment can control the clamping module and the moving module to clamp the packaging part and move the packaging part to the platform.

In summary, the fetching method, the fetching device, the bag opening device and the fetching system of the application can automatically cut off the adhesive tape and the tail end structure of the semiconductor material and open the protection bag, and then take out the containing box arranged in the protection bag, so that the whole process is basically free of manual operation, the requirement of manpower can be greatly reduced, and the whole efficiency can be greatly improved.

For a better understanding of the nature and technical content of the present application, reference should be made to the following detailed description and accompanying drawings, which are provided to illustrate the present application and are not intended to limit the scope of the present application.

Drawings

Fig. 1 is a schematic view of the bag opening apparatus of the present application.

Fig. 2 is a schematic view of a semiconductor workpiece.

Fig. 3 is a schematic view of the protection bag and the accommodating box.

Fig. 4 and 5 are schematic views of different states of the protection bag.

Fig. 6 is a schematic view of the securing mechanism of the bag opening apparatus of the present application.

Fig. 7 is a schematic view of the fixing mechanism of the pocket opening apparatus of the present application holding a semiconductor piece.

Fig. 8 to 12 and 14 are operation diagrams illustrating the bag opening apparatus of the present application cutting the adhesive tape of the semiconductor material and clamping the tail structure.

Fig. 13 is a schematic view of a gripping device of a lifting mechanism of the bag opening apparatus of the present application.

Fig. 15 to 18 are operation diagrams illustrating the tail end structure of the semiconductor material piece cut by the bag opening device of the present application.

Fig. 19 is a partial schematic view of the bag opening mechanism, the lifting mechanism, and the conveying mechanism of the bag opening apparatus of the present application.

Fig. 20 is a schematic view of a bag opening mechanism of the bag opening apparatus of the present application.

Fig. 21 is a schematic view of two turning devices, a conveying mechanism and a semiconductor material piece of the bag opening device of the present application.

Fig. 22 and 23 are schematic views showing the operation of the reversing device of the bag opening device of the present application to open the opening of the packaging part.

Fig. 24 and 25 are schematic views illustrating the operation of the bag opening mechanism of the bag opening device of the present invention to open the packing section.

Fig. 26 is a schematic view of the bag opening system of the present application.

Fig. 27 is a schematic view of a bag recovery device and a packaging unit of a protection bag of the bag opening system of the present application.

Fig. 28 is a schematic view showing that the holding module of the bag body recovery apparatus of the bag opening system of the present application is inserted into the packing portion of the protection bag.

Fig. 29 is a schematic view of the bag body recovery apparatus of the bag opening system of the present application placing a protection bag on a platform.

Fig. 30 is a schematic flow diagram of the bag opening method of the present application.

Fig. 31 is another schematic flow diagram of the bag opening method of the present application.

Detailed Description

In the following description, reference is made to or shown in the accompanying drawings for the purpose of illustrating the general principles of the invention, and not for the purpose of limiting the same. In particular, in order to clearly show the components of the apparatus, device, mechanism, etc. in the present application, the bracket for supporting the components of the apparatus, device, mechanism, etc. is omitted in the drawings of the present application.

Referring to fig. 1 to 3, the bag opening device S1 of the present application is used to open a protection bag A1 of a semiconductor material a, so as to expose an accommodating box A2 in the protection bag A1, so that other fetching devices (such as various mechanical arms) can take out the accommodating box A2 from the protection bag A1. The bag opening device S1 includes a processing apparatus 1, a fixing mechanism 2, a first cutter mechanism 3, a lifting mechanism 4, a second cutter mechanism 5, a conveying mechanism 6, and a bag opening mechanism 7. In the embodiment, the bag opening device S1 includes two cutter mechanisms, but the cutter mechanism included in the bag opening device S1 is not limited thereto, and in different embodiments, the bag opening device S1 may include only a single cutter mechanism. In addition, in a different embodiment, the bag opening device S1 may not include at least one of the fixing mechanism 2 and the lifting mechanism 4.

The processing device 1 is electrically connected to the fixing mechanism 2, the first cutter mechanism 3, the lifting mechanism 4, the second cutter mechanism 5, the conveying mechanism 6 and the bag opening mechanism 7, and the processing device 1 is, for example, various computers, servers and the like. The fixing mechanism 2 is used for holding the semiconductor material A. The first cutter mechanism 3, the pulling mechanism 4 and the second cutter mechanism 5 are used for cooperating with each other to open the protection bag A1 of the semiconductor material A held by the fixing mechanism 2. The conveying mechanism 6 is used for cooperating with the fixing mechanism 2 to move the held semiconductor material A among the first cutter mechanism 3, the second cutter mechanism 5 and the bag opening mechanism 7. The bag opening mechanism 7 is used for opening the protection bag A1 of the opened semiconductor material piece a, so that the taking device can take out the containing box A2 arranged in the protection bag A1. In order to clearly show the mechanisms included in the bag opening apparatus S1, the support for supporting the processing device 1, the first cutter mechanism 3, the second cutter mechanism 5, and the bag supporting mechanism 7 is omitted in the drawings of the present application.

As shown in fig. 2 to 5, the semiconductor material a includes a protection bag A1, a containing box A2 and two tapes A3. The protection bag A1 has an accommodating space a11 and an opening a12, and the accommodating box A2 is disposed in the accommodating space a11 through the opening a 12. In practical applications, the accommodating box A2 is, for example, a wafer cassette (e.g., FOUP), and the protection bag A1 is, for example, a tin foil bag or an antistatic bag. As shown in fig. 3 and 4, after the accommodating box A2 is disposed in the protection bag A1, a part of the protection bag A1 is wrapped around the accommodating box A2, the part of the protection bag A1 is defined as a wrapping portion a13, and the rest of the protection bag A1 is defined as a non-wrapping portion a14. As shown in fig. 2 and 5, the side of the non-packaging part a14 having the opening a12 is operated by the relevant person or equipment, and is repeatedly bent in the direction of the packaging part a13 to form a tail end structure a15. The tail end structure a15 is fixed to the packaging portion a13 by two adhesive tapes A3. After the tail end structure a15 is fixed on the top surface of the packaging part a13 by the two adhesive tapes A3, the protection bag A1, the containing box A2 arranged in the protection bag A1 and the two adhesive tapes A3 jointly form the semiconductor material piece a.

As shown in fig. 1, 6 and 7, the conveying mechanism 6 may include a rail 61 and a stage 62, and the stage 62 is slidably disposed on the rail 61. The processing device 1 is electrically connected to the transport mechanism 6, and the stage 62 is controlled by the processing device 1 to move along the rail 61. The carrier 62 is used for carrying the semiconductor material a, the fixing mechanism 2 is disposed on the carrier 62, and the fixing mechanism 2 is used for holding the semiconductor material a disposed on the carrier 62. The processing apparatus 1 can control the stage 62 to slide on the rail 61, so that the semiconductor material a arranged on the stage 62 moves from a position adjacent to the first tool mechanism 3 to a position adjacent to the second tool mechanism 5.

The fixing mechanism 2 may comprise four pushing devices 21 and two pressing devices 22. Each pushing device 21 may include a driver 211 and a pushing element 212. The driver 211 is electrically connected to the processing apparatus 1, and the pushing member 212 is connected to the driver 211. The processing apparatus 1 can control the actuator 211 to move the pushing member 212 toward or away from the stage 62, so as to push or not push against the side of the semiconductor material a of the stage 62. For example, the actuator 211 may include a pneumatic cylinder (or an oil cylinder) and a plurality of push rods, and the processing device 1 can control the pneumatic cylinder to move the push rods and the pushing members 212 connected thereto toward or away from the stage 62.

When the semiconductor material a is disposed on the carrier 62, the processing apparatus 1 controls the four pushing devices 21 to push the four pushing members 212 against the four side surfaces of the semiconductor material a. In practical applications, the carrier 62 may be provided with at least one detector for detecting whether the semiconductor material a is disposed on the carrier 62, and the processing apparatus 1 can determine whether the semiconductor material a is disposed on the carrier 62 according to the detection result of the detector. When the processing apparatus 1 determines that the carrier 62 is provided with the semiconductor material a according to the result detected by the detector, the processing apparatus 1 may control the four pushing devices 21 to operate, so that the four pushing devices 21 push against the four sides of the semiconductor material a, thereby holding the semiconductor material a.

In a specific implementation, when the semiconductor material a is disposed on the carrier 62, the processing apparatus 1 may control the four pushing devices 21 to simultaneously operate, so that the four pushing members 212 simultaneously push the four sides of the semiconductor material a, and thus, even if the semiconductor material a is disposed on the carrier 62 with a slight deviation, the semiconductor material a can be finally pushed by the four pushing members 212 to move to a correct position. That is, in addition to the four pushing devices 21 for holding the semiconductor material a on the carrier 62, the four pushing devices 21 also have the function of correctly disposing the semiconductor material a on the carrier 62 (i.e. the function of restoring).

Each pressing device 22 includes a driver 221 and a pressing device 222, the driver 221 is electrically connected with the processing device 1, the pressing device 222 is connected with the driver 221, and the processing device 1 can control the two drivers 221 so that the two pressing devices 222 press the packaging portion a13. In practical applications, the driver 221 may include, for example, a pneumatic cylinder and a plurality of push rods, and the processing device 1 can control the driver 221 to operate, so as to extend and retract the push rods, so as to drive the pressing member 222 to press against or not press against the packaging portion a13 of the semiconductor material a.

The two pressing devices 22 may be disposed adjacent to the two pushing devices 21, and before the processing device 1 controls the lifting mechanism 4 to hold the tail end structure a15, the two pushing devices 21 may be controlled to operate first, so that the two pushing members 212 do not push the semiconductor material a any more, and then the two pressing devices 22 are controlled to operate, so that the two pressing members 222 press a bottom a131 of the packaging portion a13 (as shown in fig. 2). In the present embodiment, each of the pressing devices 22 is disposed adjacent to one of the pressing devices 21, but the pressing device 22 does not have to be disposed adjacent to one of the pressing devices 21.

As shown in fig. 8 and 9, the first cutter mechanism 3 may include a first cutter 31, a longitudinal moving module 32 and a transverse moving module 33. The first cutter 31 is connected with the longitudinal moving module 32, and the longitudinal moving module 32 is connected with the lateral moving module 33. The processing device 1 is electrically connected to the longitudinal moving module 32 and the transverse moving module 33. The processing apparatus 1 can control the longitudinal moving module 32 to move the first tool 31 toward or away from the semiconductor material a disposed on the carrier 62 along a longitudinal direction (e.g., perpendicular to the ground). The processing apparatus 1 can control the lateral moving module 33 to move the first tool 31 toward or away from the semiconductor material a disposed on the carrier 62 along a lateral direction (e.g., perpendicular to the longitudinal direction). The first cutting tool 31 may comprise a body 311, at least two sections of one side of the body 311 are provided with a cutting edge 312, and the rest sections of the side are not provided with the cutting edge 312.

In practical applications, the longitudinal moving module 32 of the first cutting tool mechanism 3 may include a slide rail 321 and a slide block 322, the slide block 322 may be controlled to slide on the slide rail 321, the transverse moving module 33 of the first cutting tool mechanism 3 may include a slide rail 331 and a slide block 332, and the slide block 332 may be controlled to move on the slide rail 331. The first knife 31 is connected with the sliding block 322 of the longitudinal moving module 32, and the sliding rail 321 of the longitudinal moving module 32 is connected with the sliding block 332 of the transverse moving module 33.

In practical application, the conveying mechanism 6 is used for moving the semiconductor material A along the X-axis direction, the transverse moving module 33 of the first cutter mechanism 3 is used for moving the first cutter 31 along the Y-axis direction, and the longitudinal moving module 32 of the first cutter mechanism 3 is used for moving the first cutter 31 along the Z-axis direction.

Referring to fig. 1 again, the lifting mechanism 4 of the bag opening apparatus S1 may include a turning device 41, an auxiliary pressing device 42, a moving device 43 and a clamping device 44. The turning device 41 and the auxiliary pressing device 42 are disposed adjacent to the first tool mechanism 3, the moving device 43 is movable from a position adjacent to the first tool mechanism 3 to a position adjacent to the second tool mechanism 5, the holding device 44 is connected with the moving device 43, the holding device 44 is used for holding the tail end structure a15, and the holding device 44 can move along with the moving device 43 from a position adjacent to the first tool mechanism 3 to a position adjacent to the second tool mechanism 5.

It should be noted that the pulling mechanism 4 is mainly used to erect the tail end structure a15 of the semiconductor material piece a relative to the packaging portion a13, and in this embodiment, the pulling mechanism 4 includes the above-mentioned turning device 41, the auxiliary pressing device 42, the moving device 43 and the clamping device 44 as an example, but the components included in the pulling mechanism 4 are not limited thereto.

As shown in fig. 8, the flipping unit 41 may include a moving module 411, a rotating module 412, a supporting structure 413 and a plurality of chuck assemblies 414. The moving module 411 and the rotating module 412 are electrically connected to the processing apparatus 1, the moving module 411 is connected to the rotating module 412, and the supporting structure 413 is connected to the rotating module 412. A plurality of chuck assemblies 414 are spaced apart from each other on the support structure 413, and each of the chuck assemblies 414 is connected to a suction device, which the processing apparatus 1 can control so that each of the chuck assemblies 414 has suction or no suction.

The auxiliary pressing device 42 may include a longitudinal moving module 421, a transverse moving module 422, and an auxiliary pressing member 423, wherein the longitudinal moving module 421 is connected with the auxiliary pressing member 423, and the longitudinal moving module 421 is connected with the transverse moving module 422. The processing device 1 is electrically connected to the longitudinal moving module 421 and the transverse moving module 422 of the auxiliary pressing device 42. The processing device 1 can control the longitudinal moving module 421 of the auxiliary pressing device 42 to move the auxiliary pressing member 423 toward or away from the semiconductor material a along a longitudinal direction (e.g., vertical to the ground, as shown in the figure, the Z-axis direction); the processing apparatus 1 can control the transverse moving module 422 of the auxiliary pressing device 42 to move the auxiliary pressing member 423 toward or away from the semiconductor material a along a transverse direction (e.g., a vertical longitudinal direction, such as a Y-axis direction shown in the figure).

The processing apparatus 1 can control the moving module 411 to move, so that the rotating module 412, the supporting structure 413 and the plurality of sucker assemblies 414 move towards or away from the semiconductor material a disposed on the carrier 62 along a transverse direction (e.g., parallel to the ground, such as the Y-axis direction shown in fig. 9); the processing apparatus 1 can control the rotation module 412 to rotate the support structure 413 (e.g., rotate about the X-axis shown in fig. 9) to change the orientation of the plurality of chuck assemblies 414. The moving module 411 includes, for example, a driver 4111, a plurality of push rods 4112 and a connecting member 4113, two ends of the plurality of push rods 4112 are respectively connected to the driver 4111 and the connecting member 4113, and the processing device 1 can control the driver 4111 to make the plurality of push rods 4112 drive the connecting member 4113 to move toward or away from the driver 4111, so as to drive the rotating module 412, the supporting structure 413 and the plurality of chuck assemblies 414 to move along the lateral direction.

As shown in fig. 8 to 12 and 14, the operation of the bag opening apparatus for removing the adhesive tape A3 of the semiconductor material a disposed on the carrier 62 and clamping the tail structure a15 is illustrated. As shown in fig. 8 to 10, when the carrier 62 is provided with the semiconductor material a, the processing apparatus 1 may first control the auxiliary pressing device 42 to operate, so that the auxiliary pressing member 423 moves to the side of the tail end structure a15 of the semiconductor material a, and the auxiliary pressing member 423 presses the top surface of the packaging portion a13 of the semiconductor material a, and then the processing apparatus 1 controls the first cutter mechanism 3 to operate, so that the two blades 312 of the first cutter 31 cut the two tapes A3 of the semiconductor material a.

As shown in fig. 9 and 10, it should be noted that the body 311 of the first cutting tool 31 may further include a protruding structure 313, the protruding structure 313 is located between the two cutting edges 312, and the protruding structure 313 is used for pushing the tail end structure a15. The distance between the side of the protruding structure 313 and the other side of the body 311 is greater than the distance between the side of each blade 312 and the other side of the body 311.

As shown in fig. 10, after the first cutter 31 cuts the two tapes A3, the processing device 1 may control the first cutter 31 to move continuously, so that the first cutter 31 extends into between the tail end structure a15 and the non-wrapping portion a14 to push against the non-wrapping portion a14 through the protruding structure 313, thereby turning the tail end structure a15 relative to the wrapping portion a13, and the inside a151 of the turned tail end structure a15 is exposed. While the auxiliary pressing member 423 may still press against the top surface of the packaging portion a13 during the pushing of the first cutter 31 against the tail end structure a15, the auxiliary pressing member 423 may not press against the packaging portion a13.

As shown in fig. 11 and 12, when the two tapes A3 are cut off, the tail structure a15 is pushed by the first cutter 31, and the inner side a151 of the tail structure a15 is exposed, the processing device 1 controls the turning device 41 to operate, so that the supporting structure 413 and the plurality of suction cup assemblies 414 arranged thereon move to the tail structure a15, and at this time, the processing device 1 controls the air suction device to operate, so that the plurality of suction cup assemblies 414 generate suction force and suck the tail structure a15. When the plurality of suction cup assemblies 414 adsorb the tail structure a15, the processing apparatus 1 controls the rotation module 412 to operate, so that the support structure 413 and the plurality of suction cup assemblies 414 disposed thereon rotate 90 degrees (the angle is not limited thereto), thereby enabling the tail structure a15 adsorbed by the plurality of suction cup assemblies 414 to be disposed upright relative to the packaging portion a13.

Referring to fig. 13, the clamping device 44 may include a moving module 441, a connecting arm 442 and a clamp 443. Linking arm 442 is connected to moving module 441 and clamp 443 is connected to linking arm 442. The processing apparatus 1 is electrically connected to the moving module 441, and the processing apparatus 1 can control the moving module 441 to move the connecting arm 442 and the clamp 443 from a position adjacent to the first cutting mechanism 3 to a position adjacent to the second cutting mechanism 5. The moving module 441 can, for example, include a slide rail 4411 and a slider 4412, the slider 4412 is connected to the connecting arm 442, and the processing apparatus 1 can control the slider 4412 to slide on the slide rail 4411. The clamp 443 may include a driver 4431 and two clamping arms 4432, the two clamping arms 4432 are connected to the driver 4431, and the processing apparatus 1 can control the driver 4431 to rotate the two clamping arms 4432 relative to the driver 4431 in a direction to approach or move away from each other, thereby clamping or not clamping the tail structure a15.

As shown in fig. 1, 14 and 15, when the suction cup assemblies 414 suck the tail end structure a15 and the tail end structure a15 is vertically arranged with respect to the packaging portion a13, the processing device 1 controls the clamping device 44 to operate, so that the connecting arm 442 and the clamp 443 move to above the tail end structure a15, and then controls the clamp 443 to clamp the tail end structure a15. After the clamping device 443 clamps the tail structure a15, the processing apparatus 1 controls the turning device 41 to operate, so that the plurality of chuck assemblies 414 no longer adsorb the tail structure a15, and the processing apparatus 1 simultaneously controls the clamping device 44 and the stage 62 to operate, so that the clamping device 44 and the semiconductor material a move together to a position adjacent to the second tool mechanism 5.

As shown in fig. 15 to fig. 18, the second cutter mechanism 5 is electrically connected to the processing apparatus 1, and the processing apparatus 1 can control the second cutter mechanism 5 to operate to cut the tail end structure a15, so as to separate the tail end structure a15 from the packaging portion a13. Specifically, the second tool mechanism 5 may include an abutting device 51 and a tool device 52, for example. The abutment means 51 and the cutter means 52 are arranged facing each other. The abutting device 51 may include a driver 511 and an abutting plate 512, the driver 511 is connected to the abutting plate 512, the processing device 1 is electrically connected to the driver 511, and the processing device 1 can control the driver 511 to move the abutting plate 512 toward or away from the tool device 52.

As shown in fig. 15 and 16, the cutter device 52 may include a moving module 521, a housing 522, a second cutter 523, and a telescopic mechanism 524. The moving module 521 includes two drivers 5211 and a connecting plate 5212, the two drivers 5211 are electrically connected to the processing device 1, the connecting plate 5212 is connected to the two drivers 5211, and the processing device 1 can control the two drivers 5211 to move so that the connecting plate 5212 moves toward or away from the abutting device 51. The connecting plate 5212 is connected to the housing 522, the second cutter 523 is disposed in the housing 522, the housing 522 has a through hole, the telescopic mechanism 524 is disposed in the housing 522, and the telescopic mechanism 524 is connected to the second cutter 523. The processing apparatus 1 is electrically connected to the telescoping mechanism 524, and the processing apparatus 1 can control the telescoping mechanism 524 to operate, so that a part of the second tool 523 protrudes out of the housing 522 through the through hole, or the second tool 523 retracts into the housing 522 from a state of protruding out of the housing 522.

As shown in fig. 16 to 18, when the two clamping arms 4432 of the clamp 443 of the clamping device 44 clamp the tail end structure a15, and the tail end structure a15 is correspondingly located between the abutting device 51 and the cutter device 52, the processing device 1 actuates the two drivers 5211 of the moving module 521 for controlling the abutting device 51 and the second cutter device 52, so that the abutting plate 512 and the connecting plate 5212 clamp the tail end structure a15 together. When the abutting plate 512 and the connecting plate 5212 clamp the tail structure a15 together, the processing apparatus 1 controls the operation of the retracting mechanism 524, so as to extend the second cutter 523 out of the through hole and cut off the tail structure a15.

It should be noted that, as shown in fig. 6, fig. 15 and fig. 16, in a preferred embodiment, before controlling the second cutter mechanism 5 to operate, the processing device 1 may control the two pressing devices 22 to operate, so that the two pressing members 222 press against the bottom a131 of the protection bag A1; when the two pressing members 222 press against the bottom a131 of the protection bag A1, the processing device 1 controls the clamping device 44 to operate, so that the clamp 443 moves away from the carrier 62, and at this time, the portion of the tail end structure a15 clamped by the clamp 443, which is connected to the packaging portion a13, is in a relatively tight state. When the trailing structure a15 clamped by the clamp 443 is in a relatively tight state, the processing apparatus 1 continuously controls the second cutter mechanism 5 to operate, so that the second cutter 523 cuts the trailing structure a15 under the condition that the abutting plate 512 and the connecting plate 5212 clamp the trailing structure a15 together. By making the portion of the tail end structure a15 clamped by the clamp 443 and the packaging portion a13 relatively tense, and then cutting the tail end structure a15 by the second cutter 523, the second cutter 523 can cut off the connection between the tail end structure a15 and the packaging portion a13 smoothly.

It should be emphasized that, in the embodiment where the accommodating box A2 is a wafer box and the protection bag A1 is an aluminum foil bag or an antistatic bag, by the design that the first cutter 31 and the second cutter 523 are respectively used for cutting the tape A3 and the tail end structure a15 of the semiconductor material a, it can be ensured that the first cutter 31 and the second cutter 523 can smoothly cut the tape A3 and the tail end structure a15, respectively, and that the adhesive of the tape A3 remaining on the first cutter 31 cannot stick to the wafer box. In practical applications, the blade of the first cutter 31 may be flat, and the blade of the second cutter 523 may be serrated, so that the adhesive tape A3 and the tail end structure a15 can be cut rapidly and smoothly. If the tape A3 and the tail structure a15 are cut in sequence by using the saw-toothed cutter, a large amount of adhesive of the tape A3 will remain on the blade after the cutter has cut the tape A3 (as shown in fig. 2), which not only results in the blade being sharp but also may cause the problem that the adhesive is stuck to the wafer box.

As shown in fig. 17 and 18, when the second cutter 523 cuts the tail end structure a15, the processing apparatus 1 controls the abutting apparatus 51 and the cutter apparatus 52 to operate, so that the abutting plate 512 and the connecting plate 5212 do not clamp the tail end structure a15 any more, and then the processing apparatus 1 can control the stage 62 to move on the rail 61, so that the semiconductor material a arranged on the stage 62 is separated from the second cutter mechanism 5. After the second cutter 523 cuts the tail structure a15, the processing apparatus 1 may further control the clamping device 44 to operate, so that the clamping device 44 moves to a specific position, and after the clamping device 44 moves to the specific position, the processing apparatus 1 controls the two clamping arms 4432 of the clamp 443 to no longer clamp the tail structure a15, and discards the tail structure a15 to the specific position. When the tail end structure a15 is cut and separated from the packaging portion a13, the packaging portion a13 forms a fetching opening A5, and the accommodating box A2 is exposed through the fetching opening A5.

Referring to fig. 1, 18 to 20, when the tail structure a15 of the semiconductor material a is cut, the processing apparatus 1 controls the stage 62 to move along the rail 61, so that the packaging portion a13 with the fetching opening A5 and the containing box A2 disposed therein move to the bag opening mechanism 7. The bag opening mechanism 7 is used for opening the fetching opening A5 of the packaging portion a13, after the fetching opening A5 is opened, the processing device 1 may transmit a signal to a fetching device (not shown), and after the fetching device receives the signal, the accommodating box A2 is taken out from the packaging portion a13. In practical applications, the fetching device may include a robot arm, but not limited thereto, and any mechanism that can be used to take the accommodating box A2 out of the packaging portion a13 belongs to the scope of the practical implementation of the fetching device.

As shown in fig. 19 and 20, the bag opening mechanism 7 may include two supporting structures 71, a lifting module 72, four moving modules 73, four rods 74, two auxiliary moving modules 75, two auxiliary plates 76, and two turning devices 77. The two support structures 71 may be the main support structure (not shown) fixedly provided with the taking device S2, and the two support structures 71 are disposed facing each other. The lifting module 72 may include four lifting assemblies 721, two ends of each supporting structure 71 may be connected to two lifting assemblies 721, and each lifting assembly 721 may include a driver 7211 and a plurality of push rods 7212. The processing apparatus 1 is electrically connected to the lifting module 72, and the processing apparatus 1 can control the lifting module 72 to actuate the drivers 7211 of the lifting assemblies 721, so that the push rods 7212 extend and contract relative to the drivers 7211, thereby raising or lowering the two support structures 71 relative to the stage 62. The form and number of the components included in the lifting module 72 are not limited to the above description, and in different embodiments, one or more than three lifting assemblies 721 may be connected to each supporting structure 71.

Each support structure 71 is provided with two moving modules 73, the two moving modules 73 are arranged adjacent to both ends of the support structure 71, and each moving module 73 is connected to one rod 74. The processing apparatus 1 is electrically connected to each moving module 73, and each processing apparatus 1 can control each moving module 73 to move the rod 74 relative to the supporting structure 71 in a direction away from or close to the supporting structure 71. In practical applications, each moving module 73 may include, for example, a driver 731, a plurality of pushing rods 732 and a connecting member 733, wherein the plurality of pushing rods 732 are connected to the driver 731, the connecting member 733 is connected to the ends of the plurality of pushing rods 732, and the connecting member 733 is used to connect the rod 74 to the plurality of pushing rods 732. In practical applications, each rod 74 may be substantially cylindrical, and each rod 74 connected to the moving module 73 may be substantially perpendicular to the horizontal line.

Each auxiliary moving module 75 is disposed on one of the supporting structures 71, and each auxiliary moving module 75 is located between two adjacent moving modules 73. Each of the auxiliary moving modules 75 may include a driver 751, a plurality of push rods 752 connected to the driver 751, and a connecting member 753 fixed to ends of the plurality of push rods 752, wherein each of the connecting members 753 is connected to one of the auxiliary plates 76. The processing device 1 is electrically connected to the auxiliary moving module 75, and the processing device 1 can control the actuator 751 to move the plurality of push rods 752 relative to the actuator 751, so as to move each of the auxiliary plates 76 toward or away from the support structure 71.

It should be noted that the two support structures 71 are located on the same plane, and the four moving modules 73 and the two auxiliary moving modules 75 can respectively enable the four rods 74 and the two auxiliary plates 76 connected thereto to move substantially on the same plane. In practical applications, the processing device 1 may move the four moving modules 73 and the two auxiliary moving modules 75 synchronously, but not limited thereto, and the processing device 1 may independently control any one of the moving modules 73 or any one of the auxiliary moving modules 75 to operate according to requirements.

As shown in fig. 19 and 21, two flipping devices 77 are disposed adjacent to the two support structures 71. Each inverting device 77 may be a primary support structure (not shown) secured to the bag opening apparatus. Each flipping mechanism 77 may comprise a movement module 771, a rotation module 772, a support structure 773, and a plurality of chuck assemblies 774. The moving module 771 and the rotating module 772 are respectively electrically connected to the processing apparatus 1, and the moving module 771 is connected to the rotating module 772. Support structure 773 is coupled to a rotation module 772, and rotation module 772 can be controlled to rotate support structure 773. A plurality of chuck assemblies 774 are spaced apart from one another on the support structure 773, each chuck assembly 774 is connected to a suction device, and the processing apparatus 1 can control the suction device such that each chuck assembly 774 has suction or no suction.

The processing apparatus 1 can control the movement module 771 to move the rotation module 772, the support structure 773 and the plurality of chuck assemblies 774 toward or away from the semiconductor material a disposed on the carrier 62 along a transverse direction (e.g., parallel to the ground, such as the Y-axis direction shown in fig. 21); the processing apparatus 1 can control the rotation module 772 to rotate the support structure 773 (e.g., rotate around the X-axis as shown in fig. 9) so as to change the orientation of the chuck assemblies 774. Each moving module 771 includes, for example, a driver 7711 and a plurality of push rods 7712, the processing device 1 can control the driver 7711 to make the plurality of push rods 7712 extend and retract, and the push rods 7712 are connected with the rotating module 772. Of course, the components included in the moving module 771 are not limited to the above description.

As shown in fig. 22 to 24, the operation flow of the bag opening mechanism 7 for opening the packaging part a13 may be: when the processing apparatus 1 controls the carrier 62 to move along the track 61 to the lower side of the bag opening mechanism 7, the processing apparatus 1 will control the two moving modules 771 of the two turning devices 77 to move the two supporting structures 773 and the plurality of chuck assemblies 774 connected thereto to the vicinity of the packaging portion a13; then, the processing apparatus 1 controls the two rotation modules 772 to operate, so that the supporting structure 773 and the plurality of chuck assemblies 774 disposed thereon are turned to the packaging portion a13; then, the processing apparatus 1 controls the suction device to operate, so that the plurality of chuck assemblies 774 absorb the packaging portion a13.

When the suction cup assemblies 774 of the two turning devices 77 all suck the packaging portion a13, the processing device 1 controls the two rotation modules 772 to operate, so that the two support structures 773 rotate in the direction away from the carrier 62, and thus, the packaging portion a13 sucked by the suction cup assemblies 774 is turned in the direction away from the accommodating box A2, and the fetching opening A5 of the packaging portion a13 is opened to be larger. In the embodiment, each of the rotating modules 772 is used to rotate the support structure 773 connected thereto by 90 degrees, but not limited thereto, the angle of the rotating module 772 for rotating the support structure 773 may be varied according to the requirement.

It should be noted that, in order to make the two turning devices 77 more smoothly absorb the packaging portion a13 and turn the packaging portion a13 away from the accommodating box A2, the processing device 1 may control the two pressing devices 22 (as shown in fig. 6 and 7) to operate before controlling the two turning devices 77 to operate, so that the two pressing members 222 press the bottom portion a131 of the packaging portion a13 first.

As shown in fig. 20, 23 and 24, after the suction cup assemblies 774 of the two turning devices 77 suck the packaging portion a13 and rotate 90 degrees, the processing device 1 may first control the four moving modules 771 and the two auxiliary moving modules 75 to move the four rods 74 and the two auxiliary plates 76 in a direction approaching each other (as shown in fig. 20); next, the processing apparatus 1 controls the lifting module 72 to operate, so that the two supporting structures 71 move toward the stage 62, and accordingly the four rods 74 and the two auxiliary plate bodies 76 enter the packaging portion a13 through the fetching opening A5 (as shown in fig. 24). In the process that the four rods 74 and the two auxiliary plates 76 enter the packaging portion a13 through the fetching opening A5, the processing device 1 may control the two turning devices 77 to operate, so that the suction cup component 774 does not adsorb the packaging portion a13.

As shown in fig. 24 and 25, when the four rods 74 and the two auxiliary plates 76 are located in the packaging portion a13, the processing device 1 controls the four moving modules 73 and the two auxiliary moving modules 75 to move the four rods 74 and the two auxiliary plates 76 away from each other, so as to support the object-taking opening A5 to the maximum (i.e., the packaging portion a13 is substantially in a tight state). In a specific application, when four rods 74 are used to open the fetching opening A5, the four rods 74 may be located at substantially four corners of the packaging portion a13, and the two auxiliary plates 76 may be located at substantially opposite sides of the packaging portion a13.

When the four rods 74 and the two auxiliary plates 76 open the packaging portion a13 to a state of being substantially tensed, the processing device 1 may be, for example, a control device (e.g., various mechanical arms, etc.) to take out the accommodating box A2 in the packaging portion a13. The fetching device can be arranged adjacent to the bag opening mechanism 7, but is not limited to this.

In different embodiments, when the bag opening mechanism 7 opens the fetching opening A5 through the four rods 74 and the two auxiliary plates 76, the processing device 1 may also control the operation of related warning devices (such as various lamps and speakers) to prompt related personnel to take out the containing box A2 in the packaging portion a13 in the future through lights, sounds and the like emitted by the warning devices. In a specific implementation, the bag supporting mechanism 7 may continuously support the fetching opening A5 of the packaging portion a13 during the fetching process of the fetching device or the manual fetching process of the containing box A2 from the packaging portion a13, but not limited thereto.

The bag opening apparatus S1 of the present application may not include a pickup device, and the bag opening apparatus S1 may be implemented, manufactured, and sold separately. The processing device 1, the fixing mechanism 2, the first cutter mechanism 3, the second cutter mechanism 5, the bag opening mechanism 7, and the like included in the bag opening device S1 of the present application may be combined with the article taking device to form an article taking device, that is, all the components included in the bag opening device S1 may be implemented, manufactured, and sold together with the article taking device.

According to the above, the bag opening device S1 and the article taking device of the present application can automatically cut off the tail end structure a15 of the semiconductor material piece a, and then open the article taking opening A5 of the packaging portion a13 through the bag opening mechanism 7, and finally, the related person or the article taking device can easily and conveniently take out the accommodating box A2 from the packaging portion a13. The bag opening equipment S1 and the fetching equipment can be basically fully automatic without the participation of manpower in the process of cutting off the tail end structure A15 to the opening packaging part A13, and the problem that the semiconductor material A is damaged due to manual misoperation can be greatly avoided.

In the actual technology, the tail end structure a15 is cut off and the opening of the packaging part a13 is opened manually, which not only takes time and labor, but also may cause the problem that the accommodating box A2 is damaged or even the wafer in the accommodating box A2 is damaged due to improper manual operation; in addition, in a manual mode, when the related personnel cannot work due to irresistible factors, the work cannot be performed.

Referring to fig. 26 to 29 together, fig. 26 is a schematic view of the bag opening system of the present application, and fig. 27 to 29 are schematic views illustrating the operation of the bag recycling apparatus of the bag opening system of the present application. The bag opening system S of the present application comprises: a fetching device S2, a central control device S3 and a bag body recycling device S4. The picking device S2 includes the bag opening device S1 and a picking device 8, and the picking device 8 is a robotic arm. For the description of the bag opening device S1, please refer to the content of the previous description, which is not repeated herein. The picking device 8 is used for picking up the containing box A2 (shown in fig. 3) arranged in the packaging part a13 (shown in fig. 3).

The central control device S3 is electrically connected to the article taking device S2 and the bag recycling device S4, the central control device S3 can control the article taking device S2 to cut off the tail end structure a15 of the semiconductor article a, take out the accommodating box A2 disposed in the packaging portion a13, and control the bag recycling device S4 to fold the packaging portion a13. The central control apparatus S3 is, for example, various computers, servers, and the like. The central control device S3 referred to herein may be a device including the processing apparatus 1, or the central control device S3 may be a device independent of the processing apparatus 1.

The bag recovery apparatus S4 may include: a longitudinal moving module S41, a transverse moving module S42, a clamping module S43, a platform S44 and a guiding structure S45. In the embodiment, the bag recycling apparatus S4 includes two moving modules, namely, the vertical moving module S41 and the horizontal moving module S42, but the number and the form of the moving modules included in the bag recycling apparatus S4 are not limited thereto.

The longitudinal moving module S41 is connected to the clamping module S43, and the lateral moving module S42 is connected to the longitudinal moving module S41. The central control device S3 is electrically connected to the longitudinal moving module S41 and the transverse moving module S42, the central control device S3 can control the longitudinal moving module S41 to move, so that the clamping module S43 moves along a longitudinal direction (e.g. a direction perpendicular to the ground, such as a Z-axis direction shown in the figure) to approach or move away from the packaging portion a13; the central control device S3 can control the lateral moving module S42 to move the holding module S43 along a lateral direction (e.g. perpendicular to the longitudinal direction, such as the Y-axis direction shown in the figure) to move away from or close to the wrapping portion a13.

The central control device S3 is electrically connected to the clamping module S43, and the central control device S3 can control the clamping module S43 to actuate, so that the clamping module S43 clamps the packaging portion a13. The clamping module S43 may include a driving assembly S431, two clamping arms S432, and an extending member S433. The two clamping arms S432 are connected to the driving assembly S431, and the extending member S433 is located between the two clamping arms S432. The central control device S3 is electrically connected to the driving assembly S431, and the central control device S3 can control the driving assembly S431 to move the two clamping arms S432 toward or away from the extending member S433. The driving assembly S431 includes, for example, a slide rail and a related driver, and the two clamping arms S432 are slidably disposed on the slide rail of the driving assembly S431.

Opposite end faces of the protruding member S433 define a first abutting face S4331, each of the arms S432 has a second abutting face S4321, and each of the second abutting faces S4321 is disposed facing each of the first abutting faces S4331. The first abutting surface S4331 and the second abutting surface S4321 facing each other can commonly sandwich the packing portion a13. In practical applications, the first abutting surface S4331 and the second abutting surface S4321 may be rectangular planes with substantially the same shape and size; of course, the shapes and sizes of the first abutting surface S4331 and the second abutting surface S4321 are not limited to those shown in the drawings, as long as the first abutting surface S4331 and the second abutting surface S4321 facing each other can commonly clamp the package portion a13, and the shapes and sizes of the first abutting surface S4331 and the second abutting surface S4321 can be changed as required.

The platform S44 is disposed beside the track 61 of the conveying mechanism 6, the guiding structure S45 is disposed at one end of the platform S44, the platform S44 is disposed adjacent to the traverse module S42, and the traverse module S42 of the bag recycling apparatus S4 can move the clamping module S43 to the upper side of the platform S44.

The procedure of the bag recovery device S4 for recovering the packaging part a13 may be: as shown in fig. 27, when the accommodating box A2 (shown in fig. 3) in the packaging portion a13 is taken out and the carrier 62 moves to the lower side of the bag body recycling apparatus S4, the central control apparatus S3 may first control the two pressing devices 22 of the fixing mechanism 2 to operate, so that the two pressing members 222 press against the bottom a131 of the packaging portion a13; next, the central control device S3 will control the transverse moving module S42 to move the clamping module S43 to the upper part of the opening a12 of the packaging part a13; as shown in fig. 28, the central control device S3 will then control the longitudinal moving module S41 to operate, so that the extending member S433 enters the packaging portion a13 through the fetching opening A5 of the packaging portion a13, and the two clamping arms S432 will be correspondingly located at the outer side of the packaging portion a13.

As shown in fig. 28, when the inserting member S433 is located inside the packaging portion a13 and the two clamping arms S432 are located outside the packaging portion a13, the central control device S3 controls the driving assembly S431 to operate, and each clamping arm S432 moves towards the inserting member S433, so that each clamping arm S432 and the inserting member S433 clamp the packaging portion a13 together, and the packaging portion a13 clamped by the two clamping arms S432 and the inserting member S433 is folded along the folding lines A4 located at two sides of the packaging portion a13.

After the two clamping arms S432 and the extending member S433 clamp the package portion a13 together, the central control device S3 controls the longitudinal moving module S41 to move away from the package portion a13, and at this time, the two pressing members 222 of the two pressing devices 22 still press the bottom portion a131 of the package portion a13, so that the package portion a13 is in a substantially flattened state.

When the packaging part a13 is in a substantially flattened state, the central control device S3 will first control the two pressing devices 22 not to press the bottom a131 of the packaging part a13 any more, and then control the transverse moving module S42 to operate, so that the packaging part a13 clamped by the clamping module S43 moves toward the platform S44; during the movement of the clamping module S43, the packaging part a13 passes through the guiding structure S45 and is guided by the guiding structure S45 to fall down toward the platform S44; as shown in fig. 29, after the wrapping portion a13 falls down toward the platform S44, the central control device S3 controls the clamping module S43 to no longer clamp the wrapping portion a13, and the folded wrapping portion a13 is placed on the platform S44. In practical applications, after the central control device S3 controls the clamping module S43 to no longer clamp the wrapping portion a13, the central control device S3 can also control the longitudinal moving module S41 to actuate, so that the extending member S433 presses the wrapping portion a13 lying on the platform S44.

In various embodiments, the platform S44 may be connected to a moving module S46, the central control device S3 is electrically connected to the moving module S46, and the central control device S3 can control the moving module S46 to move the platform S44 toward the stage 62. In the process that the central control device S3 controls the transverse moving module S42 to move the wrapping portion a13 held by the holding module S43 toward the platform S44, the central control device S3 may also control the moving module S46 to actuate at the same time to make the direction of the carrier 62 of the moving module S46 approach, so that the platform S44 pushes the wrapping portion a13 held by the holding module S43, and thus, the wrapping portion a13 can be laid on the platform S44 more easily.

Referring to fig. 2, 3 and 30, the fetching method of the present application is used to take out the containing box A2 from the protecting bag A1 of the semiconductor material piece a, and the fetching method includes:

a positioning step S11: fixing the semiconductor material;

a cutting step S12: controlling at least one cutter mechanism to cut off the adhesive tape and the tail end structure successively so that the packaging part forms an article taking opening, and the accommodating box can be exposed through the article taking opening;

a expanding step S13: controlling a bag opening mechanism to open the packaging part;

a taking-out step S14: controlling a fetching device to extend into the packaging part, fixing the containing box and taking the containing box out of the packaging part.

The fetching method of the present application can be performed by using the fetching device, but is not limited thereto. As shown in fig. 8, 12 and 17, in the embodiment of the fetching method of the present application executed by the fetching apparatus, in the cutting step S2, the first cutter mechanism 3 is controlled to cut the tape A3 to make the tail end structure a15 present in a movable state, and then the second cutter mechanism 5 is controlled to cut the tail end structure a15 to make the packaging portion a13 form the fetching opening A5.

Referring to fig. 19, fig. 21 to fig. 24 and fig. 31 together, fig. 31 is a schematic flow chart illustrating a fetching method according to another embodiment of the present application. The fetching method of the embodiment comprises the following steps: a positioning step S21, a cutting step S22, a bag opening step S23, a spreading step S24, and a taking-out step S25. The positioning step S21, the cutting step S22 and the retrieving step S5 of the present embodiment are the same as the positioning step S11, the cutting step S12 and the retrieving step S14 of the previous embodiments, and are not repeated herein.

As shown in fig. 6 and 7, the positioning step S21 of the present embodiment is: the drivers 211 of the four pushing devices 21 of a fixing mechanism 2 are controlled to make the four pushing members 212 push against the four sides of the semiconductor material a, respectively, thereby fixing the semiconductor material a on a carrier 62.

The bag opening step S23 comprises the following steps: controlling the plurality of sucker components 774 (shown in fig. 23) to suck the outer side of the packaging portion a13, and turning the plurality of sucker components 774 away from the receiving box A2 (shown in fig. 3). By designing the bag opening step S23, the aperture of the article taking opening A5 (shown in fig. 23) can be enlarged.

The expanding step S24 of the present embodiment is different from the expanding step S13 in that: the four rods 74 of the bag opening mechanism 7 (shown in fig. 20) are first inserted into the packaging portion, and then the at least one moving module 73 (shown in fig. 20) is controlled to operate, so that the four rods 74 (shown in fig. 20) move in a direction away from the accommodating box A2 (shown in fig. 3), thereby opening the fetching opening A5 of the packaging portion a13 (shown in fig. 25).

In the above description, the related components of the bag opening device of the present application are mainly used as auxiliary illustrations of the related components, but the specific shapes of the components in the embodiment are not limited to the shapes of the components in the bag opening device.

In summary, the fetching method, the fetching device and the bag opening device of the present application can automatically and rapidly cut off the tail end structure of the semiconductor material, so that the packaging part of the semiconductor material is opened, and finally the accommodating box is taken out from the packaging part by using the fetching device, and in the whole bag opening and fetching process, the participation of manpower is basically not needed, so that the requirement of manpower can be greatly reduced; in the conventional application, the tape and the tail end structure of the semiconductor material piece must be cut off manually, which consumes a lot of manpower and is inefficient, and the wafers stored in the receiving box are very expensive, so that the packaging part of the semiconductor material piece is opened manually and the receiving box is taken out manually, and there is a problem that the personnel may damage the wafers in the wafer box due to various factors.

The above description is only a preferred embodiment of the present application, and not intended to limit the scope of the present application, so that all equivalent technical changes made by using the contents of the specification and drawings of the present application are included in the protection scope of the present application.

Claims

1. A method for fetching objects, which is characterized in that the fetching method is used for taking out an accommodating box from a protective bag of a semiconductor material, the protective bag is provided with an accommodating space and an opening, the accommodating box is arranged in the accommodating space through the opening, the protective bag is defined with a packaging part and a non-packaging part, the packaging part is coated outside the accommodating box, the non-packaging part is bent to form a tail end structure, an adhesive tape is adhered to the packaging part and the tail end structure, and the adhesive tape is used for fixing the tail end structure on the packaging part, the fetching method comprises the following steps:

a positioning step: fixing the semiconductor material piece;

a cutting step: controlling at least one cutter mechanism to cut off the adhesive tape and the tail end structure successively so that the packaging part forms a fetching opening, and the accommodating box can be exposed through the fetching opening;

a step of opening: controlling a bag opening mechanism to open the packaging part;

a taking-out step: controlling a fetching device to extend into the packaging part, fixedly holding the accommodating box and taking the accommodating box out of the packaging part;

wherein, the first and the second end of the pipe are connected with each other,

in the cutting step, two cutter mechanisms are controlled in sequence, and are respectively defined as a first cutter mechanism and a second cutter mechanism; in the cutting step, the first cutter mechanism is controlled to cut the adhesive tape so as to enable the tail end structure to be in a movable state, and then the second cutter mechanism is controlled to cut the tail end structure so as to enable the packaging part to form the fetching opening.

2. The method for taking out articles of claim 1, wherein a bag opening step is further included between the cutting step and the opening step: and controlling the plurality of sucker components to adsorb the outer side of the packaging part, and enabling the plurality of sucker components to turn over towards the direction far away from the accommodating box.

3. The method according to claim 1, wherein in the step of opening, the four rods of the bag opening mechanism are first inserted into the packaging portion, and then at least one moving module is controlled to move the four rods in a direction away from the receiving box, thereby opening the packaging portion.

4. The method for taking out articles of claim 1, wherein in the positioning step, four pushing devices of a fixing mechanism are controlled to push against four side surfaces of the semiconductor material respectively, and two pushing devices are controlled to push against the packaging portion, thereby fixing the semiconductor material on a carrier; each pushing device comprises a driver and a pushing piece, and in the positioning step, the four drivers are controlled to push the four pushing pieces to the packaging part and the accommodating box; each pressing device comprises a driver and a pressing piece, and in the positioning step, the two drivers of the two pressing devices are controlled, so that the two pressing pieces of the two pressing devices only press the packaging part.

5. The utility model provides an get thing equipment, its characterized in that, get thing equipment is used for taking out a holding box by a protection bag of semiconductor material spare, the protection bag has an accommodation space and an opening, the holding box through the opening set up in the accommodation space, the protection bag is defined to have a packing portion and a non-packing portion, the packing portion cladding in the outside of holding box, non-packing portion is buckled into a tail end structure, a sticky tape paste in packing portion and tail end structure, and the sticky tape is used for making the tail end structure be fixed in packing portion, get the thing equipment and contain:

a processing device;

the fixing mechanism is electrically connected with the processing device, and the processing device can control the fixing mechanism to fix the semiconductor material piece;

the cutter mechanism is electrically connected with the processing device and is used for cutting the adhesive tape and the tail end structure; and

the bag opening mechanism is electrically connected with the processing device and is used for opening the packaging part;

the object taking device is electrically connected with the processing device and is used for taking the accommodating box arranged in the packaging part out of the packaging part;

the processing device controls the fixing mechanism to fix the semiconductor material, then controls the cutter mechanism to cut off the adhesive tape and the tail end structure so that the packaging part forms an article taking opening, the containing box can be exposed through the article taking opening, controls the bag opening mechanism to open the packaging part, and finally controls the article taking device to extend into the packaging part to take out the containing box;

the object taking device comprises two cutter mechanisms which are respectively defined as a first cutter mechanism and a second cutter mechanism, the first cutter mechanism comprises a first cutter and a first cutter driver, the second cutter mechanism comprises a second cutter and a second cutter driver, the processing device is electrically connected with the first cutter driver and the second cutter driver, the first cutter is connected with the first cutter driver, the second cutter is connected with the second cutter driver, the processing device can control the first cutter driver to cut off the adhesive tape, and the processing device can control the second cutter driver to cut off the tail end structure.

6. The object-taking apparatus as claimed in claim 5, further comprising a conveying mechanism, the conveying mechanism comprising a rail and a stage, the stage being controlled to move along the rail, the fixing mechanism being disposed on the stage, the fixing mechanism comprising four pushing devices, each pushing device comprising a driver and a pushing member, the driver being electrically connected to the processing device, the pushing member being connected to the driver; when the semiconductor material piece is arranged on the carrying platform, the processing device controls the four pushing and abutting devices to enable the four pushing and abutting pieces to push and abut against the packaging part and the accommodating box.

7. The apparatus for taking out objects as claimed in claim 5, further comprising two pressing devices, each of the pressing devices comprising a driver and a pressing member, the driver being electrically connected to the processing device, the pressing member being connected to the driver; the processing device can control the two drivers to enable the two pressing pieces to only press the packaging part.

8. The apparatus according to claim 5, wherein the bag supporting mechanism comprises a lifting module, two supporting structures, four rods and four moving modules, the lifting module is electrically connected to the processing device, the two supporting structures are connected to the lifting module, each supporting structure is provided with two moving modules, and each rod is connected to one moving module; the processing device is electrically connected with the lifting module and the four moving modules, the processing device can control the lifting module so that the four rod bodies enter the packaging part through the fetching opening, and the processing device can control the four moving modules so that the four rod bodies in the packaging part move towards the direction far away from the containing box to open the packaging part.

9. The apparatus according to claim 8, wherein the bag-opening mechanism further comprises two auxiliary moving modules and two auxiliary plates, the two auxiliary moving modules are disposed on the two supporting structures, each auxiliary plate is connected to one auxiliary moving module, the processing device can control the lifting module to move the two auxiliary plates into the packaging portion, and the processing device can control the two auxiliary moving modules to move the two auxiliary plates away from the receiving box to open the packaging portion.

10. The object-taking apparatus according to claim 5, further comprising two inverting devices, each of said inverting devices comprising a moving module, a rotating module, a supporting structure and a plurality of sucker members, said moving module and said rotating module being electrically connected to said processing device, respectively, said moving module being connected to said rotating module, said supporting structure being connected to said rotating module, said rotating module being controllable to rotate said supporting structure, a plurality of said sucker members being fixed to said supporting structure; the processing device can control the plurality of sucker components to adsorb the outer side of the packaging part, and then control the two rotating modules to turn over the two supporting structures, so that the plurality of sucker components drive the packaging part to turn over in the direction away from the accommodating box.

11. A bag opening device is characterized in that the bag opening device is used for taking out a containing box from a protecting bag of a semiconductor material piece, the protecting bag is provided with a containing space and an opening, the containing box is arranged in the containing space through the opening, the protecting bag is defined with a packaging part and a non-packaging part, the packaging part is coated outside the containing box, the non-packaging part is bent to form a tail end structure, an adhesive tape is adhered to the packaging part and the tail end structure, the adhesive tape is used for enabling the tail end structure to be fixed on the packaging part, and the bag opening device comprises:

the processing device can be in communication connection with a fetching device;

the processing device controls the fixing mechanism to fix the semiconductor material, then controls the cutter mechanism to cut off the adhesive tape and the tail end structure, so that the packaging part forms an object taking opening, the accommodating box can be exposed through the object taking opening, and controls the bag opening mechanism to open the packaging part; when the bag opening mechanism opens the packaging part, the processing device can transmit signals to the fetching device, so that the fetching device can take out the containing box from the packaging part.

12. An extraction system, comprising: the object-taking device, a central control device and a bag body recycling device according to any one of claims 5 to 10, wherein the central control device is electrically connected with the object-taking device and the bag body recycling device; the central control device can control the fetching device to cut off the tail end structure of the semiconductor material piece, take out the containing box arranged in the packaging part and control the bag body recycling device to fold the packaging part.

13. The system for taking out objects as claimed in claim 12, wherein the bag recycling apparatus comprises at least a moving module, a holding module and a platform, the moving module is connected to the holding module, the holding module comprises two clamping arms and an extending member, the extending member is located between the two clamping arms, each clamping arm is disposed facing the extending member, each clamping arm can be controlled to move toward or away from the extending member, so as to hold or no longer hold the packaging part; the central control equipment is electrically connected with the bag body recovery equipment; the central control device can control the clamping module and the moving module to clamp the packaging part and move the packaging part to the platform.