TWI752688B - Adjustable microelectromechanical system (MEMS) probe card and its assembly method - Google Patents

Abstract

The invention discloses an adjustable micro-electromechanical system (MEMS) probe card. According to an embodiment, in a microelectromechanical system (MEMS) probe card in which an upper plate and a lower plate are combined and a plurality of probes are mounted therein, forming a plurality of first pinholes on the upper plate includes forming In the first space on one side of the first pinhole and the second space formed on the other side of the first pinhole, the width of the first space is larger than that of the second space. In this way, the pitch can be shortened by improving the bending performance of the probes, and the bending performance of the probes can be further improved by the positional deviation between the first pinhole and the second pinhole after the upper plate and the lower plate are combined. Bends more elastically when in contact with the device.

Description

Adjustable MEMS probe card and its assembling method

The content disclosed in the invention relates to an adjustable micro-electromechanical system (MEMS) probe card.

Unless explicitly indicated in this specification, the contents described in this section are not prior art related to the scope of the present application, and are not admitted to be prior art by inclusion in this section.

Micro-Electro-Mechanical System (MEMS, Micro-Electro-Mechanical System) is a system that integrates mechanical elements, sensors, actuators, and electronic devices on common substrates such as silicon substrates through micro-fabrication technology.

While electronic devices are fabricated using integrated circuit (IC) process procedures such as complementary metal oxide semiconductor (CMOS), bipolar (Bipolar) or bipolar complementary metal oxide semiconductor (BICMOS) engineering, and electromechanical devices to selectively etch specific parts of the silicon wafer or add new structural layers compatible "micromachining" engineering to produce micromechanical components.

Microelectromechanical systems (MEMS) devices include microscopic structures on the micrometer scale (1 millionth of a meter).

An important part of microelectromechanical systems (MEMS) technology is derived from integrated circuit (IC) technology. For example, like integrated circuits, microelectromechanical systems (MEMS) structures are realized in thin film form and patterned using photolithographic methods.

And like integrated circuits, microelectromechanical systems (MEMS) structures are fabricated on wafers through a series of evaporation, photolithography, and etching.

The higher the complexity of a microelectromechanical system (MEMS) structure, the more complex the fabrication engineering of the microelectromechanical system (MEMS) device.

For example, an array of microelectromechanical systems (MEMS) probes can be assembled into a probe card. The probe card is the interface between the electronic test system and the semiconductor wafer to be tested.

The probe card provides an electrical path between the test system and the loops on the wafer, so loops can be checked for validity and tested at the wafer level before the chips on the wafer are diced and packaged.

As shown in FIG. 1 , in the micro-electromechanical system (MEMS) probe card M, an upper board 100 ′ and a lower board 200 ′ are combined and a plurality of probes 500 ′ are installed in the probe card M, and the upper ends of the probes 500 ′ In combination with a micro electronic logic circuit (MLC) 700', a plurality of silicon interposers 750' are connected on the micro electronic logic circuit (MLC) 700'. The silicon interposer 750' is formed on the printed circuit board 800' and is printed on The upper part of the circuit board 800' is combined with the upper fixing part 900'.

The probe 800' is a conductive needle-shaped body of a certain length whose lower end is sharply formed and a head is formed at the upper end, and is combined in a state of bending with a predetermined curvature having a prestress in consideration of bending elasticity.

The probe bends when the device comes into contact with the front end of the probe's lower end, and frequent bending deformation can cause fatigue buildup and further lead to problems of deformation or damage.

[Prior Technology Literature]

(Patent Document 1) Korean Patent Application No. 10-2008-0000248.

The object of the present disclosure is to provide an adjustable microelectromechanical system (MEMS) probe card and its assembly which can shorten the pitch by improving the bending performance of the probe and thereby solve the problems caused by the restriction of the pitch method.

The purpose of the embodiment is to form a plurality of first pinholes on the upper plate in a micro-electromechanical system (MEMS) probe card in which the upper plate and the lower plate are combined and a plurality of probes are installed therein, A tunable micro-electromechanical system (MEMS) comprising a first space formed on one side of the first pinhole and a second space formed on the other side of the first pinhole, the width of the first space being larger than that of the second space The probe card is reached.

In an embodiment, the probe includes a main body formed with a certain length, a head formed at the upper end of the main body, and a front end formed sharply at the lower end of the main body, and the width a of the main body is smaller than the thickness b.

According to the disclosed embodiments, the pitch can be shortened by improving the bending performance of the probes, and the bending of the probes can be further improved by the positional deviation of the respective first pinholes and the second pinholes after the upper plate and the lower plate are combined performance, allowing for more elastic flexing when in contact with the device.

100: Upper plate

200: Lower plate

220: 2nd pinhole

310: 1st pinhole

321: Space 1

322: 2nd space

323: 3rd space

324: 4th space

500: Probe

500b: Probe

520: Subject

522: Groove

540: Head

560: Front end

600: Equipment

100’: Upper Plate

200’: lower plate

500’: Probe

700’: Miniature Electronic Logic Circuit (MLC)

750’: Silicon Interposer

800': PCB

900’: Upper Fixture

a: width

b: thickness

M: Micro Electro Mechanical Systems (MEMS) probe card

1 is a cross-sectional view illustrating a tunable microelectromechanical system (MEMS) probe card of a suitable embodiment.

FIG. 2 is a schematic diagram illustrating an assembly sequence of a tunable microelectromechanical system (MEMS) probe card of a suitable embodiment.

FIG. 3 is a schematic diagram illustrating before and after deformation of the probe according to the applicable example.

FIG. 4 is a front view illustrating another embodiment of the probe of the applicable embodiment.

Next, the preferred embodiments are described in detail as follows with reference to the drawings.

The embodiments described in the following content are only for the convenience of those with ordinary knowledge in the technical field to which the present invention pertains to easily implement the present invention, and the technical idea and scope of the present invention are not limited thereby.

In addition, the size, shape, etc. of the components shown in the drawings may be exaggerated for clarity and convenience of description, and are specifically defined in consideration of the structure and effect of the present invention. Terms may vary due to user, user's intention or custom, and the above-mentioned terms should be defined on the basis of the overall content of this specification.

1 is a cross-sectional view illustrating a tunable microelectromechanical system (MEMS) probe card of an applicable embodiment, and FIG. 2 is an assembly sequence of the tunable microelectromechanical system (MEMS) probe card of an applicable embodiment. FIG. 3 is a schematic diagram illustrating the probe of the applicable embodiment before and after deformation, and FIG. 4 is a front view illustrating another example of the probe of the applicable embodiment.

As shown in FIG. 1 to FIG. 4 , the tunable micro-electromechanical system (MEMS) probe card of the applicable embodiment is formed by combining the upper board 100 and the lower board 200 and has a plurality of probes 500 installed therein. In a microelectromechanical system (MEMS) probe card, a plurality of first pinholes 310 are formed on the upper plate 100 , including a first space 321 formed on one side of the first pinhole 310 and a first pinhole 310 formed in the first pinhole 310 In the second space 322 on the other side, the width of the first space 321 is larger than that of the second space 322 .

A plurality of second pinholes 220 to which the probes 500 can be coupled are formed in the lower plate 200 . The lower panel 200 includes a third space 323 corresponding to the first space 321 of the upper panel 100 and a fourth space 324 corresponding to the second space 322 of the upper panel 100 , and the fourth space 324 is wider than the third space 323 .

Preferably, the first pinholes 310 and the second pinholes 220 are mutually displaced to form positional deviations. Due to the positional deviation as described above, when the plate 100 and the lower plate 200 are joined together, the probes 500 joined to the first pinholes 310 and the second pinholes 220 are brought into a buckling state.

The probe 500 includes a main body 520 formed with a certain length, a head 540 formed at the upper end of the main body 520, and a front end 560 formed sharply at the lower end of the main body 520. The width a of the main body 520 is smaller than the thickness b.

As shown in FIG. 4 , a plurality of grooves 522 are formed on both sides of the main body 520 for the probe 500b applicable to other embodiments.

Thereby, the thickness of the portion where the groove 522 is formed can be reduced and the elastic force can be increased, thereby improving the bending characteristics.

Referring to FIG. 3 , P1 is the state before the probe is buckled, and P2 is the state after the probe is buckled.

在寬度a小於厚度b即a<b的情況下，探針500的壓曲的變形方向為-X、+X方向，即左右彎曲可能比較容易，但是會因為厚度b變大(針的厚度變厚)而導致間距的制約。

When the width a is smaller than the thickness b, that is, a<b, the deformation directions of the buckling of the probe 500 are -X and +X directions, that is, it may be easier to bend left and right, but because the thickness b increases (the thickness of the needle increases Thickness) resulting in spacing constraints.

反之，在寬度a以及厚度b相同即a=b的情況下，探針500的壓曲的變形方向將難以預測(-X、+X方向，-Z、+Z方向)。

Conversely, when the width a and the thickness b are the same, that is, a=b, the deformation directions of the buckling of the probe 500 are difficult to predict (-X, +X directions, -Z, +Z directions).

Therefore, as the thickness b increases (the thickness of the frame increases), the pitch is restricted.

較佳地，如圖3的截面圖所示，在寬度a大於厚度b即a>b的情況下，探針500的壓曲的變形方向為-Z、+Z方向。

Preferably, as shown in the cross-sectional view of FIG. 3 , when the width a is greater than the thickness b, that is, a>b, the deformation directions of the buckling of the probe 500 are −Z and +Z directions.

Therefore, the pitch can be shortened by reducing the thickness b (thinning the thickness of the frame).

Thereby, the condition of the cross-sectional length a>b can be satisfied while the pitch is shortened.

Next, the assembly process will be described with reference to FIG. 2 .

(step 1)

The upper plate 100 and the lower plate 200 are arranged to face each other.

At this point, the probe 500 will be in a straight state.

(step 2)

Next, the upper plate 100 is moved to be aligned with the lower plate 200 .

During the above process, the main body 520 of the probe 500 will bend and enter a buckling state.

(step 3)

When the front end 560 of the probe 500 exposed from the second pin hole 220 of the lower board 200 to the outside comes into contact with the wafer plate placed in the apparatus 600 , the main body 520 of the probe 500 will bend under the action of pressure and further aggravate its buckling state.

As described above, since the width is greater than the thickness, the buckling of the probe 500 will mainly occur in the front-rear direction, that is, the -Z and +Z directions.

Through the difference in thickness of the probes 500 as described above, the pitch can be shortened.

Although the description has been made in conjunction with the preferred embodiments, those skilled in the art to which the present invention pertains can make various modifications and variations without departing from the spirit and scope of the invention, and the above-mentioned variations and modifications belong to the accompanying within the scope of the patented invention.

100’: Upper Plate

200’: lower plate

500’: Probe

700’: Miniature Electronic Logic Circuit (MLC)

750’: Silicon Interposer

800': PCB

900’: Upper Fixture

M: Micro Electro Mechanical Systems (MEMS) probe card

Claims (3)

An adjustable micro-electro-mechanical system (MEMS) probe card, characterized in that: in a micro-electro-mechanical system (MEMS) probe card which is formed by combining an upper plate and a lower plate and has a plurality of probes installed in it, A plurality of first pinholes are formed on the upper plate, including a first space formed on one side of the first pinhole and a second space formed on the other side of the first pinhole, and the width of the first space is larger than A second space; wherein the probe includes a main body, a head formed at the upper end of the main body, and a tip portion formed sharply at the lower end of the main body; and, in order to control the buckling direction of the probe and reduce the The width (a) of the main body is smaller than the thickness (b), and the two sides of the main body of the probe are formed with a plurality of grooves, and the thickness of the part where the grooves are formed becomes thinner. An assembling method of an adjustable micro-electromechanical system (MEMS) probe card, characterized in that: in the method for assembling the adjustable micro-electromechanical system (MEMS) probe card as described in claim 1, comprising: The first process of arranging the upper plate and the lower plate so as to face each other; and by moving the upper plate and arranging the upper plate so as to be aligned with the lower plate, the main body of the probe is bent and buckling during the above process The second construction of the state. The method for assembling a tunable microelectromechanical system (MEMS) probe card according to claim 2, wherein as a process performed after the second process, when the second pinhole of the lower plate is exposed to the outside When the front end of the probe comes into contact with the wafer plate placed in the apparatus, the main body of the probe bends and further exacerbates its buckling state.

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