TW202124969A - Adjustable microelectromechanical system (MEMS) probe card and assembling method thereof which can shorten the spacing by improving the bending performance of the probe to solve the problem caused by the restriction of the spacing - Google Patents

Abstract

The present invention discloses an adjustable microelectromechanical system (MEMS) probe card. According to an embodiment, in a microelectromechanical system (MEMS) probe card formed by a combination of an upper plate and a lower plate and having a plurality of probes installed therein, a plurality of first pinholes are formed on the upper plate, a first space is formed on one side of the first pinholes, a second space is formed on the other side of the first pinholes, and the width of the first space is larger than that of the second space. Thereby, the spacing can be shortened by improving the bending performance of the probe. The positional deviation of the first pinholes and second pinholes after the upper plate and the lower plate are combined can further improve the bending performance of the probe, thereby bending more elastically when in contact with a device. In addition, the probe includes a main body, a head formed at the upper end of the main body, and a front end part formed sharply at the lower end of the main body, wherein the width (a) of the main body is smaller than the thickness (b) of the main body. A plurality of grooves are formed in the main body of the probe. A method for assembling an adjustable MEMS probe card includes a first process of arranging the upper plate and the lower plate in a state of facing each other; and a second process in which the upper plate is moved to be aligned with the lower plate and the body of the probe is bent to be a bending press state. Thus, the adjustable microelectromechanical system (MEMS) probe card and assembling method thereof according to the present can shorten the spacing by improving the bending performance of the probe to solve the problem caused by the restriction of the spacing.

Description

Adjustable micro-electromechanical system (MEMS) probe card and assembly method thereof

The content disclosed in the present invention relates to an adjustable microelectromechanical system (MEMS) probe card.

Unless there is a clear instruction in this specification, the content described in this section is not the prior art related to the scope of the patent application of this application, and cannot be regarded as prior art because it is included in this section.

Micro-Electro-Mechanical System (MEMS, Micro-Electro-Mechanical System) is a system that integrates mechanical components, sensors, actuators, and electronic devices on common substrates such as silicon substrates through micro-manufacturing technology.

While using integrated circuit (IC) process procedures (such as complementary metal oxide semiconductor (CMOS), bipolar (Bipolar) or bipolar complementary metal oxide semiconductor (BICMOS) engineering) to manufacture electronic devices, the use of As well as electronic mechanical devices, a compatible "micromachining" process that selectively etches specific parts of the silicon wafer or adds a new structural layer to manufacture micromechanical components.

Microelectromechanical system (MEMS) devices include microstructures in units of micrometers (one millionth of a meter).

An important part of MEMS technology is derived from integrated circuit (IC) technology. For example, like the integrated circuit, the micro-electromechanical system (MEMS) structure is realized in the form of a thin film and patterned by photolithography.

And like the integrated circuit, the micro-electromechanical system (MEMS) structure is manufactured on the wafer through a series of evaporation, photolithography, and etching.

The higher the complexity of the MEMS structure, the more complicated the manufacturing engineering of the MEMS device.

For example, the array of microelectromechanical system (MEMS) probes can be assembled into a probe card. The probe card is the interface between the electronic test system and the semiconductor wafer to be tested.

The probe card provides an electrical path between the test system and the circuit on the wafer, so the validity of the circuit can be checked and tested at the wafer level before the wafer on the wafer is diced and packaged.

As shown in FIG. 1, an upper board 100' and a lower board 200' are combined in a microelectromechanical system (MEMS) probe card M, and a plurality of probes 500' are installed in the probe card M, and the upper end of each probe 500' Combined with a micro electronic logic circuit (MLC) 700', a plurality of silicon interposers 750' are connected to the micro electronic logic circuit (MLC) 700'. The silicon interposers 750' are formed on the printed circuit board 800', and the printed circuit board The upper part of the circuit board 800' is combined with an upper fixing member 900'.

The probe 800' is a conductive needle-shaped body formed with a sharp lower end of a body of a certain length and a head formed on the upper end, and is combined in a pre-stressed and bent state with a certain curvature in consideration of bending elasticity.

When the device is in contact with the front end of the lower end of the probe, the probe will bend, and frequent bending deformation will cause the accumulation of fatigue and further lead to the problem of deformation or damage.

[Advanced Technical Literature] (Patent Document 1) Korean Patent Application No. 10-2008-0000248.

The purpose of the disclosure of the present invention is to provide a tunable microelectromechanical system (MEMS) probe card and its assembly which can shorten the pitch by improving the bending performance of the probe and thereby solve the problems caused by the restriction of the pitch method.

The purpose of the embodiment can be achieved by forming a plurality of first pinholes on the upper plate in a micro-electromechanical system (MEMS) probe card which is formed by a combination of an upper plate and a lower plate and has a plurality of probes installed therein. A tunable microelectromechanical system (MEMS) including a first space formed on one side of the first pinhole and a second space formed on the other side of the first pinhole, the width of the first space is greater than that of the second space The probe card is reached.

In an embodiment, the probe includes a main body formed with a certain length, a head formed at the upper end of the main body, and a tip portion formed sharply at the lower end of the main body, and the width a of the main body is smaller than the thickness b.

According to the disclosed embodiment, the pitch can be shortened by improving the bending performance of the probe, and the bending of the probe can be further improved by the position deviation of the first pinhole and the second pinhole after the upper plate and the lower plate are combined. Performance, so that it can bend more elastically when in contact with the device.

Next, the preferred embodiment is described in detail in conjunction with the drawings as follows.

The embodiments described in the following content are only for the convenience of those who have ordinary knowledge in the technical field to which the present invention belongs can easily implement the present invention, and the technical idea and scope of the present invention are not limited thereby.

In addition, the size or shape of the constituent elements illustrated in the drawings may be exaggerated for clarity and convenience of description, and are specifically defined in consideration of the structure and function of the present invention. Terms may change due to the intentions or conventions of users and users, and the above-mentioned terms should be defined on the basis of the overall content in this specification.

FIG. 1 is a cross-sectional view illustrating an adjustable microelectromechanical system (MEMS) probe card of an applicable embodiment, and FIG. 2 is an assembly sequence of an adjustable microelectromechanical system (MEMS) probe card of an applicable embodiment For schematic diagrams, FIG. 3 is a schematic diagram illustrating the probe of the applicable embodiment before and after deformation, and FIG. 4 is a front view of another embodiment of the probe of the applicable embodiment.

As shown in Figures 1 to 4, the adjustable microelectromechanical system (MEMS) probe card of the applicable embodiment, In a micro-electromechanical system (MEMS) probe card that is formed by combining the upper board 100 and the lower board 100 and has a plurality of probes 500 installed therein, A plurality of first pinholes 310 are formed on the upper plate 100, including a first space 321 formed on one side of the first pinhole 310 and a second space 322 formed on the other side of the first pinhole 310. The width of the first space 321 is greater than that of the second space 322.

The lower plate 200 is formed with a plurality of second pinholes 220 to which the probes 500 can be connected. The lower panel 200 includes a third space 323 corresponding to the first space 321 of the upper panel 100 and a fourth space 324 corresponding to the second space 322 of the upper panel 100. The width of the fourth space 324 is larger than the third space 323.

Preferably, the first pinhole 310 and the second pinhole 220 are misaligned to form a position deviation. By virtue of the positional deviation as described above, when the board 100 and the lower board 200 are combined, the probe 500 connected to each of the first pinhole 310 and the second pinhole 220 will enter a buckled state.

The probe 500 includes a body 520 formed with a certain length, a head 540 formed at the upper end of the body 520, and a tip portion 560 formed sharply at the lower end of the body 520. The width a of the body 520 is smaller than the thickness b.

As shown in FIG. 4, the probe 500 b applicable to other embodiments has a plurality of grooves 522 formed on both sides of the main body 520.

Thereby, the thickness of the portion where the groove 522 is formed can be reduced and the elastic force can be increased, thereby improving the bending characteristics.

Referring to Figure 3, P1 is the state before the probe is buckled, and P2 is the state after the probe is buckled.

① When the width a is less than the thickness b, that is, a<b, The direction of deformation of the buckling of the probe 500 is the −X and +X directions, that is, it may be easier to bend left and right, but the thickness b becomes larger (the thickness of the needle becomes thicker), which will restrict the pitch.

② Conversely, when the width a and the thickness b are the same, that is, a=b, The direction of deformation of the buckling of the probe 500 will be difficult to predict (-X, +X directions, -Z, +Z directions). As a result, the thickness b becomes larger (the thickness of the frame becomes thicker), which may restrict the pitch.

③ Preferably, as shown in the cross-sectional view of Figure 3, In the case where the width a is greater than the thickness b, that is, a>b, The deformation directions of the buckling of the probe 500 are −Z and +Z directions. Therefore, the pitch can be shortened through the decrease of the thickness b (the thickness of the frame becomes thinner). Thereby, the condition of cross-sectional length a>b can be satisfied while the pitch is shortened.

Next, the assembly process will be explained with reference to FIG. 2.

(step 1) The upper plate 100 and the lower plate 200 are arranged in a state facing each other. At this time, the probe 500 will be in a straight state.

(Step 2) Next, by moving the upper plate 100, the upper plate 100 is arranged in a state consistent with the lower plate 200. During the above process, the main body 520 of the probe 500 will bend and enter a buckled state.

(Step 3) When the front end 560 of the probe 500 exposed from the second pinhole 220 of the lower board 200 to the outside comes into contact with the wafer board placed in the device 600, the main body 520 of the probe 500 will bend under the action of pressure. And further aggravate its buckling state. As described above, because the width is greater than the thickness, the buckling of the probe 500 will mainly occur in the front and rear directions, that is, the -Z and +Z directions. Through the difference in the thickness of the probe 500 as described above, the pitch can be shortened.

Although described in conjunction with the preferred embodiments, those with ordinary knowledge in the technical field to which the present invention pertains can make various modifications and variations without departing from the spirit and scope of the invention, and the above-mentioned changes and modifications are all attached herewith. The invention is within the scope of the patent application.

100: upper plate 200: lower plate 220: 2nd pinhole 310: 1st pinhole 321: first space 322: Second Space 323: The 3rd Space 324: The 4th Space 500: Probe 500b: Probe 520: main body 522: groove 540: head 560: Front end 600: Equipment 100’: Upper plate 200’: Lower plate 500’: Probe 700’: Miniature Electronic Logic Circuit (MLC) 750’: Silicon Intermediate Layer 800’: Printed Circuit Board 900’: Upper fixing a: width b: thickness M: Microelectromechanical system (MEMS) probe card

FIG. 1 is a cross-sectional view illustrating a tunable microelectromechanical system (MEMS) probe card of the applicable embodiment. 2 is a schematic diagram illustrating the assembly sequence of the adjustable micro-electromechanical system (MEMS) probe card of the applicable embodiment. Fig. 3 is a schematic diagram illustrating the probe before and after the deformation of the applied embodiment. Fig. 4 is a front view illustrating another embodiment of the probe to which the embodiment is applied.

100’: Upper plate

200’: Lower plate

500’: Probe

700’: Miniature Electronic Logic Circuit (MLC)

750’: Silicon Intermediate Layer

800’: Printed Circuit Board

900’: Upper fixing

M: Microelectromechanical system (MEMS) probe card

Claims (5)

An adjustable micro-electromechanical system (MEMS) probe card, which is characterized by: In a microelectromechanical system (MEMS) probe card that is composed of an upper board and a lower board, and multiple probes are installed inside, A plurality of first pinholes are formed on the upper plate, including a first space formed on one side of the first pinhole and a second space formed on the other side of the first pinhole. The width of the first space is greater than The second space. The adjustable microelectromechanical system (MEMS) probe card as described in claim 1, wherein: The above-mentioned probes include: The width (a) of the main body, the head formed at the upper end of the main body, and the front end formed sharply at the lower end of the main body, is smaller than the thickness (b) of the main body. The adjustable microelectromechanical system (MEMS) probe card as described in claim 1, wherein: A plurality of grooves are formed in the main body of the probe. A method for assembling an adjustable micro-electromechanical system (MEMS) probe card, which is characterized in that: The method for assembling the adjustable microelectromechanical system (MEMS) probe card according to any one of Claim 1 to Patent Scope 3 includes: The first process of arranging the upper plate and the lower plate in a state facing each other; and, The second process in which the upper plate is moved to be aligned with the lower plate, and the main body of the probe bends and enters a buckled state in the above process. The assembling method of an adjustable microelectromechanical system (MEMS) probe card as described in claim 4, wherein: As a process implemented after the above-mentioned second process, when the tip of the probe that is exposed from the second pinhole of the lower plate to the outside comes into contact with the wafer plate installed in the device, the body of the probe is bent and further aggravated Its buckling state.

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