TWI743655B - 半導體製造裝置及半導體裝置的製造方法 - Google Patents

半導體製造裝置及半導體裝置的製造方法 Download PDF

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Publication number
TWI743655B
TWI743655B TW109101654A TW109101654A TWI743655B TW I743655 B TWI743655 B TW I743655B TW 109101654 A TW109101654 A TW 109101654A TW 109101654 A TW109101654 A TW 109101654A TW I743655 B TWI743655 B TW I743655B
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TW
Taiwan
Prior art keywords
die
amount
peeling
aforementioned
block
Prior art date
Application number
TW109101654A
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English (en)
Chinese (zh)
Other versions
TW202103249A (zh
Inventor
名久井勇輝
五十嵐維月
齊藤明
岡本樹
栗原芳弘
Original Assignee
日商捷進科技有限公司
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Publication date
Application filed by 日商捷進科技有限公司 filed Critical 日商捷進科技有限公司
Publication of TW202103249A publication Critical patent/TW202103249A/zh
Application granted granted Critical
Publication of TWI743655B publication Critical patent/TWI743655B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H10P72/7442—Separation by peeling

Landscapes

  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
TW109101654A 2019-03-01 2020-01-17 半導體製造裝置及半導體裝置的製造方法 TWI743655B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-038082 2019-03-01
JP2019038082A JP7237655B2 (ja) 2019-03-01 2019-03-01 半導体製造装置および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
TW202103249A TW202103249A (zh) 2021-01-16
TWI743655B true TWI743655B (zh) 2021-10-21

Family

ID=72280762

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109101654A TWI743655B (zh) 2019-03-01 2020-01-17 半導體製造裝置及半導體裝置的製造方法

Country Status (4)

Country Link
JP (1) JP7237655B2 (https=)
KR (1) KR102316869B1 (https=)
CN (1) CN111640702B (https=)
TW (1) TWI743655B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12159850B2 (en) 2020-12-25 2024-12-03 Yibu Semiconductor Co., Ltd. Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly
CN112992699B (zh) * 2021-02-01 2024-03-22 上海易卜半导体有限公司 半导体封装方法、半导体组件以及包含其的电子设备
US12500203B2 (en) 2021-02-22 2025-12-16 Yibu Semiconductor Co., Ltd. Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly
TW202520412A (zh) * 2023-10-12 2025-05-16 日商松下知識產權經營股份有限公司 拾取系統、接合裝置、分類裝置及控制方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080318346A1 (en) * 2007-06-19 2008-12-25 Renesas Technology Corp. Manufacturing method for semiconductor integrated device

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Publication number Priority date Publication date Assignee Title
JPH10189690A (ja) * 1996-12-26 1998-07-21 Hitachi Ltd 半導体チップのピックアップ方法及びピックアップ装置
KR100278137B1 (ko) * 1997-09-04 2001-01-15 가나이 쓰도무 반도체소자의 탑재방법 및 그 시스템, 반도체소자 분리장치 및ic카드의 제조방법
JP2000323437A (ja) * 1999-05-12 2000-11-24 Sony Corp 半導体チップ剥離装置
JP2000353710A (ja) * 1999-06-14 2000-12-19 Toshiba Corp ペレットピックアップ装置および半導体装置の製造方法
JP4574251B2 (ja) 2003-09-17 2010-11-04 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US20050274457A1 (en) * 2004-05-28 2005-12-15 Asm Assembly Automation Ltd. Peeling device for chip detachment
JP5583475B2 (ja) * 2010-05-19 2014-09-03 キヤノンマシナリー株式会社 ピックアップ装置
JP2012059829A (ja) * 2010-09-07 2012-03-22 Elpida Memory Inc 半導体チップの剥離装置、ダイボンディング装置、半導体チップの剥離方法、半導体装置の製造方法
JP2013214683A (ja) * 2012-04-04 2013-10-17 Mitsubishi Electric Corp 半導体チップのピックアップ装置
JP2014109511A (ja) * 2012-12-03 2014-06-12 Canon Machinery Inc 位置決め方法、位置決め装置、およびダイボンダ
JP6349496B2 (ja) * 2014-02-24 2018-07-04 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
JP2017034117A (ja) * 2015-08-03 2017-02-09 日立化成株式会社 ダイシング・ダイボンディング一体型テープ
JP7071916B2 (ja) * 2016-04-28 2022-05-19 リンテック株式会社 保護膜付き半導体チップの製造方法及び半導体装置の製造方法
JP6797569B2 (ja) * 2016-06-13 2020-12-09 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
EP3522207B1 (en) * 2016-09-28 2020-09-16 Fuji Corporation Wafer feeding apparatus and component mounting apparatus
TWI685046B (zh) * 2017-03-24 2020-02-11 日商新川股份有限公司 拾取裝置以及拾取方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080318346A1 (en) * 2007-06-19 2008-12-25 Renesas Technology Corp. Manufacturing method for semiconductor integrated device

Also Published As

Publication number Publication date
CN111640702B (zh) 2023-08-08
KR102316869B1 (ko) 2021-10-25
TW202103249A (zh) 2021-01-16
JP7237655B2 (ja) 2023-03-13
KR20200105753A (ko) 2020-09-09
JP2020141114A (ja) 2020-09-03
CN111640702A (zh) 2020-09-08

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