TWI740984B - 加熱接合用片材,以及附切晶帶之加熱接合用片材 - Google Patents
加熱接合用片材,以及附切晶帶之加熱接合用片材 Download PDFInfo
- Publication number
- TWI740984B TWI740984B TW106124578A TW106124578A TWI740984B TW I740984 B TWI740984 B TW I740984B TW 106124578 A TW106124578 A TW 106124578A TW 106124578 A TW106124578 A TW 106124578A TW I740984 B TWI740984 B TW I740984B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- bonding
- heating
- aforementioned
- sheet
- Prior art date
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 113
- 238000005245 sintering Methods 0.000 claims abstract description 119
- 238000013508 migration Methods 0.000 claims abstract description 105
- 230000005012 migration Effects 0.000 claims abstract description 105
- 230000001070 adhesive effect Effects 0.000 claims description 84
- 239000000853 adhesive Substances 0.000 claims description 83
- 230000002265 prevention Effects 0.000 claims description 55
- 239000011230 binding agent Substances 0.000 claims description 45
- 229910052751 metal Inorganic materials 0.000 claims description 40
- 239000002184 metal Substances 0.000 claims description 40
- 239000010419 fine particle Substances 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 18
- 239000013078 crystal Substances 0.000 claims description 7
- 238000005304 joining Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 205
- 239000004065 semiconductor Substances 0.000 description 70
- -1 polyethylene carbonate Polymers 0.000 description 56
- 235000012431 wafers Nutrition 0.000 description 45
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 41
- 238000000034 method Methods 0.000 description 33
- 239000000178 monomer Substances 0.000 description 32
- 239000012790 adhesive layer Substances 0.000 description 30
- 239000010408 film Substances 0.000 description 28
- 229920000058 polyacrylate Polymers 0.000 description 24
- 239000000758 substrate Substances 0.000 description 22
- 238000004519 manufacturing process Methods 0.000 description 21
- 239000002923 metal particle Substances 0.000 description 21
- 238000001035 drying Methods 0.000 description 20
- 238000009835 boiling Methods 0.000 description 19
- 238000000576 coating method Methods 0.000 description 19
- 239000011347 resin Substances 0.000 description 17
- 229920005989 resin Polymers 0.000 description 17
- 239000011248 coating agent Substances 0.000 description 16
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 15
- 230000005855 radiation Effects 0.000 description 15
- 150000001875 compounds Chemical class 0.000 description 14
- 238000007789 sealing Methods 0.000 description 14
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 10
- 229920005601 base polymer Polymers 0.000 description 10
- 229910052799 carbon Inorganic materials 0.000 description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 9
- 229920000515 polycarbonate Polymers 0.000 description 9
- 239000004417 polycarbonate Substances 0.000 description 9
- 229910052709 silver Inorganic materials 0.000 description 9
- 239000004332 silver Substances 0.000 description 9
- 239000007787 solid Substances 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 8
- 125000000524 functional group Chemical group 0.000 description 8
- 239000004615 ingredient Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 239000003960 organic solvent Substances 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 238000011282 treatment Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 7
- 238000003466 welding Methods 0.000 description 7
- 239000004925 Acrylic resin Substances 0.000 description 6
- 229920000178 Acrylic resin Polymers 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 239000003973 paint Substances 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 125000000217 alkyl group Chemical group 0.000 description 5
- 238000005227 gel permeation chromatography Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000003999 initiator Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 239000003431 cross linking reagent Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 238000003847 radiation curing Methods 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 3
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 3
- 239000005751 Copper oxide Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- 229910000431 copper oxide Inorganic materials 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- 239000004922 lacquer Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 235000013772 propylene glycol Nutrition 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 229910001923 silver oxide Inorganic materials 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000002411 thermogravimetry Methods 0.000 description 3
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- LAVARTIQQDZFNT-UHFFFAOYSA-N 1-(1-methoxypropan-2-yloxy)propan-2-yl acetate Chemical compound COCC(C)OCC(C)OC(C)=O LAVARTIQQDZFNT-UHFFFAOYSA-N 0.000 description 2
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- BBMCTIGTTCKYKF-UHFFFAOYSA-N 1-heptanol Chemical compound CCCCCCCO BBMCTIGTTCKYKF-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- AUZRCMMVHXRSGT-UHFFFAOYSA-N 2-methylpropane-1-sulfonic acid;prop-2-enamide Chemical compound NC(=O)C=C.CC(C)CS(O)(=O)=O AUZRCMMVHXRSGT-UHFFFAOYSA-N 0.000 description 2
- AGBXYHCHUYARJY-UHFFFAOYSA-N 2-phenylethenesulfonic acid Chemical compound OS(=O)(=O)C=CC1=CC=CC=C1 AGBXYHCHUYARJY-UHFFFAOYSA-N 0.000 description 2
- BWVZAZPLUTUBKD-UHFFFAOYSA-N 3-(5,6,6-Trimethylbicyclo[2.2.1]hept-1-yl)cyclohexanol Chemical compound CC1(C)C(C)C2CC1CC2C1CCCC(O)C1 BWVZAZPLUTUBKD-UHFFFAOYSA-N 0.000 description 2
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- 150000001491 aromatic compounds Chemical class 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 125000005587 carbonate group Chemical group 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 125000002843 carboxylic acid group Chemical group 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical compound CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- 238000007429 general method Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 150000002466 imines Chemical class 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- RBQRWNWVPQDTJJ-UHFFFAOYSA-N methacryloyloxyethyl isocyanate Chemical compound CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- 239000011859 microparticle Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000005416 organic matter Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001228 polyisocyanate Polymers 0.000 description 2
- 239000005056 polyisocyanate Substances 0.000 description 2
- 229920000379 polypropylene carbonate Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- KCXFHTAICRTXLI-UHFFFAOYSA-N propane-1-sulfonic acid Chemical group CCCS(O)(=O)=O KCXFHTAICRTXLI-UHFFFAOYSA-N 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 125000000542 sulfonic acid group Chemical group 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- SWFHGTMLYIBPPA-UHFFFAOYSA-N (4-methoxyphenyl)-phenylmethanone Chemical compound C1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1 SWFHGTMLYIBPPA-UHFFFAOYSA-N 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 1
- ORTVZLZNOYNASJ-UPHRSURJSA-N (z)-but-2-ene-1,4-diol Chemical compound OC\C=C/CO ORTVZLZNOYNASJ-UPHRSURJSA-N 0.000 description 1
- ZWVMLYRJXORSEP-UHFFFAOYSA-N 1,2,6-Hexanetriol Chemical compound OCCCCC(O)CO ZWVMLYRJXORSEP-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- 229940043375 1,5-pentanediol Drugs 0.000 description 1
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 1
- CUVLMZNMSPJDON-UHFFFAOYSA-N 1-(1-butoxypropan-2-yloxy)propan-2-ol Chemical compound CCCCOCC(C)OCC(C)O CUVLMZNMSPJDON-UHFFFAOYSA-N 0.000 description 1
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- 239000005968 1-Decanol Substances 0.000 description 1
- HYLLZXPMJRMUHH-UHFFFAOYSA-N 1-[2-(2-methoxyethoxy)ethoxy]butane Chemical compound CCCCOCCOCCOC HYLLZXPMJRMUHH-UHFFFAOYSA-N 0.000 description 1
- SNAQINZKMQFYFV-UHFFFAOYSA-N 1-[2-[2-(2-methoxyethoxy)ethoxy]ethoxy]butane Chemical compound CCCCOCCOCCOCCOC SNAQINZKMQFYFV-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- RERATEUBWLKDFE-UHFFFAOYSA-N 1-methoxy-2-[2-(2-methoxypropoxy)propoxy]propane Chemical compound COCC(C)OCC(C)OCC(C)OC RERATEUBWLKDFE-UHFFFAOYSA-N 0.000 description 1
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 1
- FENFUOGYJVOCRY-UHFFFAOYSA-N 1-propoxypropan-2-ol Chemical compound CCCOCC(C)O FENFUOGYJVOCRY-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- BRKORVYTKKLNKX-UHFFFAOYSA-N 2,4-di(propan-2-yl)thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC(C(C)C)=C3SC2=C1 BRKORVYTKKLNKX-UHFFFAOYSA-N 0.000 description 1
- UXCIJKOCUAQMKD-UHFFFAOYSA-N 2,4-dichlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC(Cl)=C3SC2=C1 UXCIJKOCUAQMKD-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- LZHUBCULTHIFNO-UHFFFAOYSA-N 2,4-dihydroxy-1,5-bis[4-(2-hydroxyethoxy)phenyl]-2,4-dimethylpentan-3-one Chemical compound C=1C=C(OCCO)C=CC=1CC(C)(O)C(=O)C(O)(C)CC1=CC=C(OCCO)C=C1 LZHUBCULTHIFNO-UHFFFAOYSA-N 0.000 description 1
- LCHAFMWSFCONOO-UHFFFAOYSA-N 2,4-dimethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC(C)=C3SC2=C1 LCHAFMWSFCONOO-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- WULAHPYSGCVQHM-UHFFFAOYSA-N 2-(2-ethenoxyethoxy)ethanol Chemical compound OCCOCCOC=C WULAHPYSGCVQHM-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- MTVLEKBQSDTQGO-UHFFFAOYSA-N 2-(2-ethoxypropoxy)propan-1-ol Chemical compound CCOC(C)COC(C)CO MTVLEKBQSDTQGO-UHFFFAOYSA-N 0.000 description 1
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical compound CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- CUDYYMUUJHLCGZ-UHFFFAOYSA-N 2-(2-methoxypropoxy)propan-1-ol Chemical compound COC(C)COC(C)CO CUDYYMUUJHLCGZ-UHFFFAOYSA-N 0.000 description 1
- XYVAYAJYLWYJJN-UHFFFAOYSA-N 2-(2-propoxypropoxy)propan-1-ol Chemical compound CCCOC(C)COC(C)CO XYVAYAJYLWYJJN-UHFFFAOYSA-N 0.000 description 1
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- RJBIZCOYFBKBIM-UHFFFAOYSA-N 2-[2-(2-methoxyethoxy)ethoxy]propane Chemical compound COCCOCCOC(C)C RJBIZCOYFBKBIM-UHFFFAOYSA-N 0.000 description 1
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 description 1
- YJTIFIMHZHDNQZ-UHFFFAOYSA-N 2-[2-(2-methylpropoxy)ethoxy]ethanol Chemical compound CC(C)COCCOCCO YJTIFIMHZHDNQZ-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- VUIWJRYTWUGOOF-UHFFFAOYSA-N 2-ethenoxyethanol Chemical compound OCCOC=C VUIWJRYTWUGOOF-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- NPSJHQMIVNJLNN-UHFFFAOYSA-N 2-ethylhexyl 4-nitrobenzoate Chemical compound CCCCC(CC)COC(=O)C1=CC=C([N+]([O-])=O)C=C1 NPSJHQMIVNJLNN-UHFFFAOYSA-N 0.000 description 1
- 239000004808 2-ethylhexylester Substances 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- YRNDGUSDBCARGC-UHFFFAOYSA-N 2-methoxyacetophenone Chemical compound COCC(=O)C1=CC=CC=C1 YRNDGUSDBCARGC-UHFFFAOYSA-N 0.000 description 1
- CRWNQZTZTZWPOF-UHFFFAOYSA-N 2-methyl-4-phenylpyridine Chemical compound C1=NC(C)=CC(C=2C=CC=CC=2)=C1 CRWNQZTZTZWPOF-UHFFFAOYSA-N 0.000 description 1
- JEHFRMABGJJCPF-UHFFFAOYSA-N 2-methylprop-2-enoyl isocyanate Chemical compound CC(=C)C(=O)N=C=O JEHFRMABGJJCPF-UHFFFAOYSA-N 0.000 description 1
- MYISVPVWAQRUTL-UHFFFAOYSA-N 2-methylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3SC2=C1 MYISVPVWAQRUTL-UHFFFAOYSA-N 0.000 description 1
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 1
- YYIOIHBNJMVSBH-UHFFFAOYSA-N 2-prop-2-enoyloxynaphthalene-1-sulfonic acid Chemical compound C1=CC=C2C(S(=O)(=O)O)=C(OC(=O)C=C)C=CC2=C1 YYIOIHBNJMVSBH-UHFFFAOYSA-N 0.000 description 1
- CYUZOYPRAQASLN-UHFFFAOYSA-N 3-prop-2-enoyloxypropanoic acid Chemical compound OC(=O)CCOC(=O)C=C CYUZOYPRAQASLN-UHFFFAOYSA-N 0.000 description 1
- HMBNQNDUEFFFNZ-UHFFFAOYSA-N 4-ethenoxybutan-1-ol Chemical compound OCCCCOC=C HMBNQNDUEFFFNZ-UHFFFAOYSA-N 0.000 description 1
- JSZCJJRQCFZXCI-UHFFFAOYSA-N 6-prop-2-enoyloxyhexanoic acid Chemical compound OC(=O)CCCCCOC(=O)C=C JSZCJJRQCFZXCI-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- JRRXCTQDDIKZJT-UHFFFAOYSA-N P(=O)(O)(O)O.OCCC(C(=O)N)=C Chemical class P(=O)(O)(O)O.OCCC(C(=O)N)=C JRRXCTQDDIKZJT-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- URLYGBGJPQYXBN-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methyl prop-2-enoate Chemical compound OCC1CCC(COC(=O)C=C)CC1 URLYGBGJPQYXBN-UHFFFAOYSA-N 0.000 description 1
- OFLYIWITHZJFLS-UHFFFAOYSA-N [Si].[Au] Chemical compound [Si].[Au] OFLYIWITHZJFLS-UHFFFAOYSA-N 0.000 description 1
- KJVBXWVJBJIKCU-UHFFFAOYSA-N [hydroxy(2-hydroxyethoxy)phosphoryl] prop-2-enoate Chemical compound OCCOP(O)(=O)OC(=O)C=C KJVBXWVJBJIKCU-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- LIPOUNRJVLNBCD-UHFFFAOYSA-N acetyl dihydrogen phosphate Chemical class CC(=O)OP(O)(O)=O LIPOUNRJVLNBCD-UHFFFAOYSA-N 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 229940088601 alpha-terpineol Drugs 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 125000004069 aziridinyl group Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- CLHAOIOLCMPIRX-UHFFFAOYSA-N benzoic acid diphenylmethanone Chemical compound OC(=O)C1=CC=CC=C1.C=1C=CC=CC=1C(=O)C1=CC=CC=C1 CLHAOIOLCMPIRX-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- CGXDIDXEMHMPIX-UHFFFAOYSA-N bis(3-methylphenyl)methanone Chemical class CC1=CC=CC(C(=O)C=2C=C(C)C=CC=2)=C1 CGXDIDXEMHMPIX-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 229930006711 bornane-2,3-dione Natural products 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- BMRWNKZVCUKKSR-UHFFFAOYSA-N butane-1,2-diol Chemical compound CCC(O)CO BMRWNKZVCUKKSR-UHFFFAOYSA-N 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 150000001728 carbonyl compounds Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004587 chromatography analysis Methods 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical group C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- GCFAUZGWPDYAJN-UHFFFAOYSA-N cyclohexyl 3-phenylprop-2-enoate Chemical compound C=1C=CC=CC=1C=CC(=O)OC1CCCCC1 GCFAUZGWPDYAJN-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 238000004455 differential thermal analysis Methods 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920001179 medium density polyethylene Polymers 0.000 description 1
- 239000004701 medium-density polyethylene Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- OPECTNGATDYLSS-UHFFFAOYSA-N naphthalene-2-sulfonyl chloride Chemical compound C1=CC=CC2=CC(S(=O)(=O)Cl)=CC=C21 OPECTNGATDYLSS-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000002898 organic sulfur compounds Chemical class 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- WCVRQHFDJLLWFE-UHFFFAOYSA-N pentane-1,2-diol Chemical compound CCCC(O)CO WCVRQHFDJLLWFE-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 description 1
- AAYRWMCIKCRHIN-UHFFFAOYSA-N propane-1-sulfonic acid;prop-2-enamide Chemical group NC(=O)C=C.CCCS(O)(=O)=O AAYRWMCIKCRHIN-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 1
- 229920001862 ultra low molecular weight polyethylene Polymers 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/02—Compacting only
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B23/00—Layered products comprising a layer of cellulosic plastic substances, i.e. substances obtained by chemical modification of cellulose, e.g. cellulose ethers, cellulose esters, viscose
- B32B23/04—Layered products comprising a layer of cellulosic plastic substances, i.e. substances obtained by chemical modification of cellulose, e.g. cellulose ethers, cellulose esters, viscose comprising such cellulosic plastic substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B23/042—Layered products comprising a layer of cellulosic plastic substances, i.e. substances obtained by chemical modification of cellulose, e.g. cellulose ethers, cellulose esters, viscose comprising such cellulosic plastic substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B23/00—Layered products comprising a layer of cellulosic plastic substances, i.e. substances obtained by chemical modification of cellulose, e.g. cellulose ethers, cellulose esters, viscose
- B32B23/04—Layered products comprising a layer of cellulosic plastic substances, i.e. substances obtained by chemical modification of cellulose, e.g. cellulose ethers, cellulose esters, viscose comprising such cellulosic plastic substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B23/06—Layered products comprising a layer of cellulosic plastic substances, i.e. substances obtained by chemical modification of cellulose, e.g. cellulose ethers, cellulose esters, viscose comprising such cellulosic plastic substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B23/00—Layered products comprising a layer of cellulosic plastic substances, i.e. substances obtained by chemical modification of cellulose, e.g. cellulose ethers, cellulose esters, viscose
- B32B23/10—Layered products comprising a layer of cellulosic plastic substances, i.e. substances obtained by chemical modification of cellulose, e.g. cellulose ethers, cellulose esters, viscose next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B23/00—Layered products comprising a layer of cellulosic plastic substances, i.e. substances obtained by chemical modification of cellulose, e.g. cellulose ethers, cellulose esters, viscose
- B32B23/12—Layered products comprising a layer of cellulosic plastic substances, i.e. substances obtained by chemical modification of cellulose, e.g. cellulose ethers, cellulose esters, viscose next to a particulate layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/10—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/14—Layered products comprising a layer of synthetic resin next to a particulate layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/288—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyketones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/16—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer formed of particles, e.g. chips, powder or granules
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/44—Number of layers variable across the laminate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/025—Particulate layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/105—Metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2405/00—Adhesive articles, e.g. adhesive tapes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
Abstract
本發明提供一種加熱接合用片材,其係與其他片材貼合時,可抑制成分的移轉。
一種加熱接合用片材,其特徵係具有藉由加熱形成燒結層之燒結前層、及成分移轉防止層。
Description
本發明係關於加熱接合用片材,以及附切晶帶之加熱接合用片材。
半導體裝置之製造中,將半導體元件接著在金屬導線架等被黏物之方法(所謂的晶片接合法),從過去的金-矽共晶開始、發展到藉由焊接、樹脂膏之方法。現今,有使用導電性之樹脂膏之方法。
近年,進行電力控制或供給的電力半導體裝置的普及變得顯著。電力半導體裝置因電流隨時在流通,發熱量大。因此,在電力半導體裝置所使用之導電性之接著劑被期望具有高散熱性和低電阻。
電力半導體裝置要求低損失之高速動作。過去,電力半導體裝置使用IGBT(絕緣閘雙極電晶體,Insulated Gate Bipolar Transistor)或MOSFET(金氧半場效應電晶體,Metal-Oxide-Semiconductor Field-Effect Transistor)等的使用Si的半導體。近年,使用SiC或GaN等的半導體也被開發,可預想以後之擴大發展。
使用SiC或GaN的半導體,有能隙大、絕緣破壞電場高等特徵,可低損失、高速作動、且高溫作動。高溫作動,是在熱環境嚴苛 的汽車或小型電力變換機等之優勢所在。用在熱環境嚴苛用途的半導體裝置,預計係在250℃左右的高溫作動,習知的接合‧接著材料之焊接和導電性接著劑上會有熱特性、信賴性的問題產生。
因此,過去有提出一種固晶片材,其係由空孔率15~50體積%,含有銀及/或銅,碳成分為1.5質量%以下之多孔質片材所構成(例如,參照專利文獻1)。
【專利文獻1】國際公開第2015/060346號
然而,專利文獻1之固晶片材,係碳成分為1.5質量%以下。因此,專利文獻1之固晶片材,有片材作成時之作業性低之問題。具體而言,專利文獻1,係作成含有多量金屬成分之膏狀組成物後,一度塗佈於玻璃板上於200℃加熱形成硬化膜,進一步,將此剝離得到固晶片材。
此外,專利文獻1之固晶片材,由於碳成分少,燒結前之階段之密著性低。因此,在燒結前之階段,與接合對象之間難以暫時固定之問題存在。
另一方面,本發明者們研究之結果,於加熱接合用片材含有 多一點的有機成分,即使想要提升片材作成時之作業性、或燒結前暫時接著時之接著力,有無法發揮原本性能之情形。
關於這點,本發明者們進行深入研究。查明其結果,例如,將加熱接合用片材貼附於切晶帶等之其他膠帶而使用之情形,則從加熱接合用片材移轉成分之一部分至其他膠帶,而加熱接合用片材無法發揮原本之性能。此外,亦查明有從其他膠帶移轉成分之一部份至加熱接合用片材之情形,此情形亦相同,加熱接合用片材無法發揮原本之性能。
本發明係有鑑於前述問題點而成者,其目的在於提供一種加熱接合用片材,以及具有該加熱接合用片材之附切晶帶之加熱接合用片材,其係與其他片材貼合時,能抑制成分之移轉。
本案發明者,研究關於能解決前述傳統的問題點之加熱接合用片材。其結果,發現藉由採用下述之構成,與其他片材貼合時,可抑制成分之移轉,從而完成本發明。
亦即,本發明之加熱接合用片材,其特徵係具有藉由加熱形成燒結層之燒結前層、及成分移轉防止層。
根據前述構成,具有燒結前層及成分移轉防止層。因此,與其他的片材貼合而使用時,成分移轉防止層接觸其他片材的狀態下積層使用,可防止成分移轉防止層的成分移轉。其結果,可抑制燒結前層之成分移轉至其他片材,或其他片材之成分移轉至燒結前層。
前述構成中,前述燒結前層,係包含金屬微粒子、及有機黏 合劑;前述成分移轉防止層,係至少包含有機黏合劑者為佳。
若前述燒結前層包含金屬微粒子,則可藉由加熱形成燒結層。此外,若前述燒結前層及前述成分移轉防止層包含有機黏合劑,則作為片材容易處理。此外,若前述燒結前層包含有機黏合劑,則容易控制在燒結前之階段之密著性。
此外,即使前述燒結前層包含有機黏合劑,由於存在成分移轉防止層,因此可抑制燒結前層之成分移轉至其他片材,或其他片材之成分移轉至燒結前層。
前述構成中,前述燒結前層所含有的金屬微粒子之含有量,係相對於燒結前層全體,在30~70體積%之範圍內;前述成分移轉防止層所含有的金屬微粒子之含有量,係相對於成分移轉防止層全體,在0~30體積%之範圍內者為佳。
若前述燒結前層所含有的金屬微粒子之含有量,係相對於燒結前層全體,在30~70體積%之範圍內,藉由加熱,可合適地形成燒結層。
此外,若前述成分移轉防止層所含有的金屬微粒子之含有量,係相對於成分移轉防止層全體,在0~30體積%之範圍內者,則能減少燒結前層之成分移轉至其他片材之通道。其結果,更能抑制成分之移轉。
前述構成中,前述燒結前層所含有之有機黏合劑,係包含熱分解性黏合劑;前述成分移轉防止層所含有之有機黏合劑,係包含熱分解性黏合劑者 為佳。
若前述燒結前層所含有之有機黏合劑包含熱分解性黏合劑,則藉由加熱形成燒結層時,熱分解性黏合劑被熱分解。其結果,可更合適地形成燒結層。
此外,熱分解性黏合劑,有低分子量成分難以通過的傾向。因此,若前述成分移轉防止層所含有之有機黏合劑,包含熱分解性黏合劑,則能適宜地抑制燒結前層之成分移轉至其他片材。
前述構成中,前述燒結前層所含有之有機黏合劑,係相對於燒結前層之有機黏合劑全體,包含分子量500以下之有機成分20~80重量%;前述成分移轉防止層所含有之有機黏合劑,係相對於成分移轉防止層之有機黏合劑全體,包含分子量500以下之有機成分0~20重量%者為佳。
分子量500以下之有機成分,於熱分解性黏合劑分散金屬微粒子時,可容易分散。因此,若前述燒結前層所含有之有機黏合劑,包含分子量500以下之有機成分20~80重量%,則金屬微粒子之處理能變得容易。此外,若使用分子量500以下之有機成分,調整任意的機械特性變得容易。
另一方面,分子量500以下之有機成分,由於分子量小,屬於容易移轉至其他片材之成分。因此,若前述成分移轉防止層所含有之有機黏合劑,包含分子量500以下之有機成分0~20重量%之範圍內,可以說容易移轉之成分為少量。因此,可抑制從成分移轉防止層成分移轉至燒結 前層或其他片材。
前述構成中,前述燒結前層之厚度為5~100μm之範圍內;前述成分移轉防止層之厚度為2~10μm之範圍內者為佳。
若前述燒結前層之厚度為5~100μm之範圍內,可更適宜地形成燒結層。
此外,成分移轉防止層,不含金屬微粒子,或含有量比燒結前層少。因此,若過厚則干擾燒結之接合。所以,若前述成分移轉防止層之厚度為2~10μm之範圍內,則能防止給予燒結之結合過大的影響。
此外,本發明之附切晶帶之加熱接合用片材,其特徵係,其係具有切晶帶、及前述加熱接合用片材,前述加熱接合用片材,係前述切晶帶及前述成分移轉防止層接觸之態樣下,積層於前述切晶帶上。
根據前述附切晶帶之加熱接合用片材,由於與切晶帶一體成形,故能省略與切晶帶貼合的步驟。此外,由於存在成分移轉防止層,因此能抑制燒結前層之成分移轉至切晶帶,或切晶帶之成分移轉至燒結前層。
1‧‧‧基材
2‧‧‧黏著劑層
3、3’‧‧‧加熱接合用片材
4‧‧‧半導體晶圓
5‧‧‧半導體晶片
6‧‧‧被黏物
7‧‧‧焊接導線
8‧‧‧密封樹脂
10、12‧‧‧附切晶帶之加熱接合用片材
11‧‧‧切晶帶
31‧‧‧燒結前層
32‧‧‧成分移轉防止層
【圖1】表示本發明之一實施型態之附切晶帶之加熱接合用片材之斷 面模式圖。
【圖2】表示本發明之其他實施型態之附切晶帶之加熱接合用片材之斷面模式圖。
【圖3】用於說明本實施型態之半導體裝置之一製造方法之斷面模式圖。
(附切晶帶之加熱接合用片材)
關於本發明之一實施型態中之加熱接合用片材、及附切晶帶之加熱接合用片材,在以下進行說明。本實施型態中的加熱接合用片材,可列舉如下述說明之附切晶帶之加熱接合用片材中,其係沒有貼上切晶帶的狀態。因此,以下說明附切晶帶之加熱接合用片材,並就加熱用接合片材在其中加以說明。圖1係表示本發明之一實施型態的附切晶帶之加熱接合用片材之斷面模式圖。圖2係表示本發明之另一實施型態的其他附切晶帶之加熱接合片材之斷面模式圖。
如圖1所示,附切晶帶之加熱接合用片材10係具有在切晶帶11上積層加熱接合用片材3之構成。切晶帶11係在基材1上積層黏合劑層2所構成,而加熱接合用片材3設置於該黏合劑層2上。
本發明之附切晶帶之加熱接合用片材,如圖2所示之附切晶帶之加熱接合用片材12,亦可以僅在加工黏貼部分上形成加熱接合用片材3’之構成。
(加熱接合用片材)
加熱接合用片材3、3’係片材狀。因並非膏狀,而為片材狀,可抑制貼附時之溢出或覆蓋到貼附對象物表面。
本實施型態之加熱接合用片材3、3’,係具有藉由加熱形成燒結層之燒結前層31、及成分移轉防止層32。加熱接合用片材3,係切晶帶11及成分移轉防止層32接觸之態樣下,積層於切晶帶11上。
本實施型態,說明加熱接合用片材3為燒結前層31及成分移轉防止層32之2層所構成之情形,但只要不違背本發明之宗旨,亦可進一步具有其他層。此外,本發明中,燒結前層,亦可為複數積層藉由加熱形成燒結層之層之構成。
亦即,本發明之加熱接合用片材,只要具有燒結前層及成分移轉防止層即可,其構成並無特別限定。
形成加熱接合用片材3、3’與切晶帶11貼合之形態之情形,亦即,附切晶帶之加熱接合用片材10、12之情形,由於具有成分移轉防止層32,在供應使用之前的期間,可防止燒結前層31之成分移轉至切晶帶11,或切晶帶11之成分移轉至燒結前層31。
此外,加熱接合用片材3、3’不與切晶帶11一體化,而形成單體之片材之情形,由於具有成分移轉防止層32,與其他片材貼合而使用時,於其他片材接觸成分移轉防止層32之態樣下積層而使用,則成分移轉防止層32防止成分的移轉。其結果,在與其他片材貼合後,供應使用之前的期間,可抑制燒結前層31之成分移轉至其他片材,或其他片材之成分移轉至燒結前層31。
(燒結前層)
燒結前層31,係藉由加熱形成燒結層之層。
燒結前層31,係包含金屬微粒子、及有機黏合劑者為佳。若燒結前層31包含金屬微粒子,則可藉由加熱形成燒結層。此外,若燒結前層31包含有機黏合劑,則作為片材容易處理。此外,若燒結前層31包含有機黏合劑,則容易控制在燒結前之階段之密著性。
燒結前層31所含有之金屬微粒子之含有量,相對於燒結前層31全體,在30~70體積%之範圍內為佳。前述金屬微粒子之含有量,在35~65體積%之範圍內為更佳,在40~60體積%之範圍內為特佳。若前述金屬微粒子在30~70體積%之範圍內,藉由加熱,可適宜地形成燒結層。其結果,可燒結金屬微粒子,或熔融而接合2物(例如,半導體晶片及導線架)。
於燒結前層31所含有的金屬微粒子之含有量,藉由以下方法測量。又,後述之成分移轉防止層32所含有之金屬微粒子之含有量,亦藉由相同方法測量。
1.燒結前層在冷卻環境離子拋光,露出斷面。
2.斷面使用場發射掃描式電子顯微鏡SU8020(製造商:日立高科技)攝影。攝影條件,係加速電壓5kV、倍率50000倍,得到反射電子像作為影像資料。
3.使用影像解析軟體Image J,將得到的影像資料自動2值化處理,接著藉由相對於全體之來自金屬微粒子之明亮部分之面積算出。此時,一般而言於觀察之斷面垂直的方向中,由於來自金屬微粒子之明亮部分之面積為均一,因此體積%與在此得到之面積%相同。
前述金屬微粒子,可列舉燒結性金屬微粒子。
前述燒結性金屬粒子,適合使用金屬微粒子的凝集體。金屬微粒子可列舉由金屬所成之微粒子等。前述金屬可列舉為金、銀、銅、氧化銀、氧化銅等。其中,較佳係選自銀、銅、氧化銀、氧化銅所成群中至少一種。如前述金屬微粒子係選自銀、銅、氧化銀、氧化銅所成群中至少一種時,可更適合地進行加熱接合。
前述燒結性金屬粒子之平均粒徑,較佳係0.0005μm以上,更佳係0.001μm以上。平均粒徑之下限,可例示為0.01μm、0.05μm、0.1μm。另一方面,燒結性金屬粒子之平均粒徑,較佳係以30μm以下,更佳係25μm以下。平均粒徑之上限,可例示為20μm、15μm、10μm、5μm。
前述燒結性金屬粒子之平均粒徑由以下方法測量。亦即,前述燒結性金屬粒子用SEM(掃描式電子顯微鏡)觀察,測量平均粒徑。又,SEM觀察中,例如,燒結性金屬粒子為微米尺寸時,用5000倍觀察;亞微米尺寸時,用50000倍觀察;奈米尺寸時,用300000倍觀察為佳。
前述燒結性金屬粒子之形狀無特別限定,例如,球狀、棒狀、鱗片狀、不定形。
燒結前層31所含有之有機黏合劑,係含有熱分解性黏合劑者為佳。
若含有前述熱分解性黏合劑,藉由加熱形成燒結層時,則熱分解性黏合劑熱分解。其結果,可更適宜地形成燒結層。
前述熱分解性黏合劑,係在23℃為固體為佳。本說明書中,「固體」係指,具體而言藉由前述流變儀黏度測定在23℃之黏度為大於100,000Pa‧s。若前述熱分解性黏合劑在23℃為固體,則在常溫(23℃)下容易使加熱接合用片材形成為薄膜狀,且處理性提高。
前述熱分解性黏合劑,通常超過分子量500。
本說明書中所謂「熱分解性黏合劑」,係指加熱接合步驟中可使其熱分解之黏合劑。前述熱分解性黏合劑,在加熱接合步驟後,於燒結層(加熱後之燒結前層31),幾乎不殘留者為佳。前述熱分解性黏合劑,可列舉例如,即使含在燒結前層31,大氣環境下,以昇溫速度10℃/分之條件,從23℃昇溫到400℃後以能量分散型X射線分析所得之碳濃度為15重量%以下之材料。例如,作為熱分解黏合劑,若採用更容易熱分解之材料,即使相對含有量較多,在加熱接合步驟後,可幾乎不殘留於燒結層(加熱後之燒結前層31)。
前述熱分解性黏合劑,可列舉聚碳酸酯、丙烯酸樹脂、乙基纖維素、聚乙烯醇等。此等材料可單獨、或混合2種以上使用。其中,從高熱分解性之觀點而言,聚碳酸酯為佳。
前述聚碳酸酯樹脂,若能在加熱接合步驟中使其熱分解者即可,並無特別限定,可列舉為主鏈的碳酸酯基(-O-CO-O-)間不含芳香族化合物(例如,苯環等),由脂肪族鏈構成的脂肪族聚碳酸酯,或主鏈的碳酸酯基(-O-CO-O-)間含芳香族化合物的芳香族聚碳酸酯。其中,以脂肪族聚碳酸酯為佳。
前述脂肪族聚碳酸酯,可列舉為聚乙烯碳酸酯、聚丙烯碳酸酯等。其 中,以形成片材的塗漆製造中對有機溶劑的溶解性的觀點而言,以聚乙烯碳酸酯為佳。
前述芳香族聚碳酸酯,可列舉主鏈含雙酚A構造者等。
前述聚碳酸酯樹脂的重量平均分子量在10,000~1,000,000的範圍內較合適。又,重量平均分子量是藉由GPC(凝膠滲透層析儀)測量,由聚苯乙烯換算而得之數值。
前述丙烯酸樹脂,在加熱接合步驟可使其熱分解的範圍中,可列舉為碳數30以下,尤其具有碳數4~18的直鏈或者分枝的烷基的丙烯酸,或甲基丙烯酸的酯之1種或2種以上作為成分之聚合物(丙烯酸共聚物)等。前述烷基可列舉例如,甲基、乙基、丙基、異丙基、n-丁基、t-丁基、異丁基、戊基、異戊基、己基、庚基、環己基、2-乙基己基、辛基、異辛基、壬基、異壬基、癸基、異癸基、十一烷基、十二烷基、十三烷基、十四烷基、硬脂基、十八烷基,或月桂基等。
此外,作為形成聚合物(丙烯酸共聚物)之其他單體,無特別限定,可列舉例如丙烯酸、甲基丙烯酸、丙烯酸羧乙酯、丙烯酸羧戊酯、衣康酸、馬來酸、富馬酸、或巴豆酸等含有羧基的單體,馬來酸酐或衣康酸酐等酸酐單體,(甲基)丙烯酸2-羥乙基、(甲基)丙烯酸2-羥丙基、(甲基)丙烯酸4-羥丁基、(甲基)丙烯酸6-羥己基、(甲基)丙烯酸8-羥辛基、(甲基)丙烯酸10-羥癸基、(甲基)丙烯酸12-羥十二烷基或(4-羥甲基環己基)-丙烯酸甲酯等含有羥基的單體、苯乙烯磺酸、丙烯磺酸、2-(甲基)丙烯醯胺-2-甲基丙磺酸、(甲基)丙烯醯胺丙磺酸、丙磺酸(甲基)丙烯酸酯或(甲基)丙烯醯氧基萘磺酸等含有磺酸基之單體,或2-羥乙 基丙烯醯基磷酸酯等含有磷酸基之單體。
丙烯酸樹脂之中,較佳係重量平均分子量為1萬~100萬者,更佳係3萬~70萬者。若在上述數值範圍內時,則加熱接合步驟前的接著性,以及加熱接合步驟時的熱分解性優良。又,重量平均分子量是藉由GPC(凝膠滲透層析儀)測量,由聚苯乙烯換算而得之數值。
此外,丙烯酸樹脂中,在200℃~400℃熱分解之丙烯酸樹脂為佳。
燒結前層31所含有之有機黏合劑,相對於燒結前層之有機黏合劑全體,含有分子量500以下之有機成分20~80重量%為佳。前述分子量500以下之有機成分之含有量,在30~70重量%者為更佳,在40~60重量%者為特佳。
分子量500以下之有機成分,於金屬微粒子分散於熱分解性黏合劑時,可使其容易分散。因此,若燒結前層31所含有之有機黏合劑,含有分子量500以下之有機成分20~80重量%,金屬微粒子之處理可變得容易。此外,若使用分子量500以下之有機成分,調整任意的機械特性變得容易。
燒結前層31所含有之分子量500以下之有機成分之含有量,藉由以下方法測量。又,後述之成分移轉防止層32所含有之分子量500以下之有機成分之含有量,亦藉由相同方法測量。
採取加熱接合用片材之燒結前層部分,浸泡於氯仿,靜置12小時。將此溶液以0.45μm膜過濾器過濾,對濾液進行GPC分離。使用TOSOH公司製HLC-8320GPC,藉由以下條件進行分離,分離‧ 回収分子量500以下之成分與超過分子量500之成分後,藉由求得個別的乾燥重量而求得重量比。
層析柱:Shodex H2003/H2002/H2001
溶離液:氯仿
流量:4mL/min
檢測器:RI
層析柱溫度:室温(23℃)
注入量:3000μL
分子量以聚苯乙烯換算而得。
分子量500以下之有機成分,含有低沸點黏合劑者為佳。又,本說明書中,分子量500以下之有機成分係指,包含低沸點黏合劑、及低沸點黏合劑以外之分子量500以下之有機成分之概念。低沸點黏合劑以外之分子量500以下之有機成分,係可含在燒結前層31,亦可不含在燒結前層31。
前述低沸點黏合劑,用於使前述金屬微粒子之處理變得容易。此外,前述低沸點黏合劑,亦用於調整任意之機械物性。具體而言,使前述金屬微粒子分散於前述低沸點黏合劑,可作為含有金屬微粒子之糊膏使用。
前述低沸點黏合劑,通常在23℃為液狀。本說明書中,「液狀」係指包含半液狀。具體而言,藉由動態黏彈性測定裝置(流變儀)黏度測定在23℃之黏度為100,000Pa‧s以下。
黏度測定之條件,如同下述。
流變儀:Thermo SCIENTFIC公司製MER III
治具:平行板20mmφ、間距100μm、剪斷速度1/秒)
前述低沸點黏合劑,沸點為100℃以上400℃以下。前述低沸點黏合劑之具體例,例如,可列舉戊醇、己醇、庚醇、辛醇、1-癸醇、乙二醇、二甘醇、丙二醇、丁二醇、α-松油醇、1,6-己二醇、異莰基環己醇(MTPH)等之一價及多價醇類、乙二醇丁醚、乙二醇苯醚、二甘醇甲醚、二甘醇乙醚、二甘醇丁醚、二甘醇異丁醚、二甘醇己醚、三甘醇甲醚、二甘醇二甲醚、二甘醇二乙醚、二甘醇二丁醚、二甘醇丁甲醚、二甘醇異丙甲醚、三甘醇二甲醚、三甘醇丁甲醚、丙二醇丙醚、二丙二醇甲醚、二丙二醇乙醚、二丙二醇丙醚、二丙二醇丁醚、二丙二醇二甲醚、三丙二醇甲醚、三丙二醇二甲醚等醚類、乙二醇乙醚乙酸酯、乙二醇丁醚乙酸酯、二甘醇乙醚乙酸酯、二甘醇丁醚乙酸酯、二丙二醇甲基醚乙酸酯(DPMA)等。亦可將此等之2種以上併用。其中,將沸點相異之2種類併用為佳。若使用沸點相異之2種類,則於片材形狀之維持方面優異。
又,燒結前層31,除了前述成分以外,例如,亦可適度含有可塑劑等。
燒結前層31,大氣環境下,以昇溫速度10℃/分之條件,從23℃昇溫到400℃後以能量分散型X射線分析所得之碳濃度為15重量%以下者為佳,在12重量%以下者為更佳,在10重量%以下者為特佳。若前述碳濃度為15重量%以下,則燒結前層31,進行昇溫至400℃後有機物幾乎不存在。其結果,加熱接合步驟後,耐熱性優良,於高溫環境下亦得到高的信賴性、熱特性。
燒結前層31,大氣環境下,以昇溫速度10℃/分之條件,從23℃至500℃進行示差熱分析時之峰值存在於150~350℃者為佳,存在於170~320℃者為更佳,存在於180~310℃者為特佳。若前述峰值存在於150~350℃,則可以說有機物(例如,構成燒結前層31之樹脂成分)在該溫度區域熱分解。其結果,加熱接合步驟後之耐熱性更優良。
燒結前層31之厚度,係在5~100μm之範圍內者為佳,更佳係在20~90μm之範圍內,特佳係在40~80μm之範圍內。若燒結前層31之厚度,在5~100μm之範圍內,則可更適宜地形成燒結層。
燒結前層31之厚度,藉由以下方法測量。又,後述之成分移轉防止層32之厚度亦藉由相同的方法測量。
1.燒結前層在冷卻環境離子拋光,露出斷面。
2.斷面使用場發射掃描式電子顯微鏡SU8020(製造商:日立高科技)攝影。攝影條件,係加速電壓5kV、倍率2000倍,得到反射電子像作為影像資料。
3.使用影像解析軟體Image J,從得到的影像資料測量厚度。
(成分移轉防止層)
成分移轉防止層32,係為了抑制燒結前層31之成分移轉至切晶帶11,或切晶帶11之成分移轉至燒結前層31之層。
又,成分移轉防止層32,由於大量含有藉由加熱分解之成分,因此加熱燒結前層31形成燒結層時,幾乎被分解而消失。
成分移轉防止層32,至少包含有機黏合劑者為佳。若成分移轉防止層32包含有機黏合劑,則容易作為片材處理。此外,燒結前層31即使包含有機黏合劑,由於存在成分移轉防止層32,因此可抑制燒結前層31之成分移轉至切晶帶11,或切晶帶11之成分移轉至燒結前層31。
成分移轉防止層32所含有之有機黏合劑,包含熱分解性黏合劑者為佳。熱分解性黏合劑,有低分子量成分難以通過的傾向。因此,成分移轉防止層32所含有之有機黏合劑,若包含熱分解性黏合劑,則可適宜地抑制燒結前層31之成分移轉至切晶帶11,或切晶帶11之成分移轉至燒結前層31。
前述熱分解性黏合劑,可採用在燒結前層31使用之物相同者。
前述熱分解性黏合劑之含有量,相對於成分移轉防止層32全體,在80~100重量%者為佳,在90~100重量%者為更佳。若前述熱分解性黏合劑之含有量,相對於成分移轉防止層32全體,在80~100重量%,則可適宜地抑制在燒結前層31及切晶帶11之間成分的移轉。
成分移轉防止層32所含有之有機黏合劑,相對於成分移轉防止層之有機黏合劑全體,含有分子量500以下之有機成分0~20重量%者為佳。亦即,不含分子量500以下之有機成分,或者即使含有有機成分,在20重量%以下者為佳。前述分子量500以下之有機成分之含有量,在0~15重量%者為更佳,在0~10重量%者為特佳。
分子量500以下之有機成分,由於分子量小,係容易移轉至其他片材(本實施型態為切晶帶11)之成分。在此,若成分移轉防止層32所含有之有機黏合劑,含有分子量500以下之有機成分在0~20重量%之範圍內,則可說是容易移轉之成分較少。因此,可抑制從成分移轉防止層32成分移轉至燒結前層31或切晶帶11。
前述分子量500以下之有機成分,可採用在燒結前層31使用之物相同者。
成分移轉防止層32,不含金屬微粒子,或者即使含有金屬微粒子,相對於成分移轉防止層全體在30體積%以下之範圍內為佳。亦即,成分移轉防止層32所含有之金屬微粒子之含有量,相對於成分移轉防止層全體,在0~30體積%之範圍內為佳。若成分移轉防止層32所含有之金屬微粒子之含有量,相對於成分移轉防止層全體,在0~30體積%之範圍內,則可減少燒結前層31之成分移轉至切晶帶11之通道。其結果,更能抑制成分的移轉。
前述金屬微粒子,可採用在燒結前層31使用之物相同者。
成分移轉防止層32之厚度,在2~10μm之範圍內為佳,更佳係在2.5~8μm之範圍內,特佳係在3~6μm之範圍內。成分移轉防止層32,不含金屬微粒子,或者含有量比燒結前層少。因此,若過厚則干擾燒結之接合。因此,若成分移轉防止層32之厚度,在2~10μm之範圍內,則可防止給予燒結之結合過大的影響。
尤其是將成分移轉防止層32之厚度在前述數值範圍內減薄之情形,係不含金屬微粒子,或在前述數值範圍內,減少含有量者為佳。因為 可以減少低分子成分之通道。
另一方面,將成分移轉防止層32之厚度在前述數值範圍內增厚之情形,金屬微粒子在前述數值範圍內,增加含有量者為佳。有厚度之情形,於燒結後存在成分移轉防止層32之部分之接合力有減弱的可能性。因此,藉由含有某程度的金屬微粒子,可擁有燒結後之接合力。又,若增厚,則容易控制燒結前之黏著力。
加熱接合用片材3、3’,可用一般方法製造。例如,製造含有為了形成燒結前層31之前述各成分的塗漆,以塗漆在基材隔板上塗佈成所定厚度,形成塗佈膜後,乾燥該塗佈膜,得到燒結前層31。
另一方面,製造含有為了形成成分移轉防止層32之前述各成分的塗漆,以塗漆在基材隔板上塗佈成所定厚度,形成塗佈膜後,乾燥該塗佈膜,得到成分移轉防止層32。
然後,藉由貼合燒結前層31及成分移轉防止層32,製造加熱接合用片材3、3’。
作為塗漆所使用的溶劑雖無特別限定,惟較佳係能使前述各成分均一溶解、混練或分散的有機溶劑或酒精溶劑。前述有機溶劑,可列舉例如,為二甲基甲醯胺、二甲基乙醯胺、N-甲基吡咯烷酮、丙酮、丁酮、環己酮等酮系溶劑、甲苯、二甲苯等。又,前述酒精溶劑,可列舉為乙二醇、二甘醇、1,2-丙二醇、1,3-丙二醇、1,2-丁二醇、1,3-丁二醇、1,4-丁二醇、2-丁烯-1,4-二醇、1,2,6-己三醇、丙三醇、辛二醇、2-甲基-2,4-戊二醇、松油醇。
塗佈方法無特別限定。作為溶劑塗工方法,可列舉例如,薄 膜塗佈機、凹版塗佈機、滾輪式塗佈機、反向式塗佈機、刮刀式塗佈機、管刮刀塗佈機、網版印刷等。其中,以塗佈厚度之均一性較高之觀點,較佳係薄膜塗佈機。又,塗佈膜的乾燥條件無特別限定,例如,可以乾燥溫度70~160℃、乾燥時間1~5分鐘進行。又,塗佈膜乾燥後根據所使用的溶劑種類,會有溶劑無全部氣化而殘留於塗膜中之情形。
燒結前層31含有前述低沸點黏合劑時,因應前述乾燥條件,前述低沸點黏合劑之一部份有揮發之情形。因此,因應前述乾燥條件,改變構成燒結前層31之各成分之比例。例如,即使同樣之塗漆所形成之燒結前層31,乾燥溫度越高,或乾燥時間越長,佔燒結前層31全體之金屬微粒子之含有量、或熱分解性黏合劑之含有量越多。因此,使燒結前層31中之金屬微粒子或熱分解性黏合劑之含有量形成所需的量,設定前述乾燥條件為佳。
成分移轉防止層32含有前述低沸點黏合劑之情形亦相同。
基材隔板,可使用藉由聚對苯二甲酸乙二酯(PET)、聚乙烯、聚丙烯、或氟素系剥離劑、長鏈烷基丙烯酸酯系剝離劑等之剝離劑進行表面塗佈的塑膠薄膜或紙張。
加熱接合用片材3、3’之其他製造方法,例如,可列舉前述各成分以攪拌器混合,所得之混合物加壓成形而作成燒結前層31、成分移轉防止層32,並將此等貼合之方法。攪拌器可列舉為行星攪拌器等。
加熱接合用片材3、3’之全體之厚度,加熱前在23℃之厚度,在20~100μm者為佳,在30~90μm者為更佳。
(切晶帶)
切晶帶11係在基材1上積層黏著劑層2所構成者。
基材1係附切晶帶之加熱接合用片材10、12之強度母體,較佳係具有紫外線透過性者。基材1,可列舉例如,低密度聚乙烯、直鏈狀聚乙烯、中密度聚乙烯、高密度聚乙烯、超低密度聚乙烯、隨機共聚合聚丙烯、嵌段共聚合聚丙烯、均聚丙烯、聚丁烯、聚甲基戊烯等聚烯烴,乙烯-醋酸乙烯共聚合物、離子鍵聚合物樹脂、乙烯-(甲基)丙烯酸共聚合物、乙烯-(甲基)丙烯酸酯(隨機、交替)共聚合物、乙烯-丁烯共聚合物、乙烯-己烯共聚合物、聚胺酯、聚乙烯對苯二甲酯、聚乙烯萘二甲酯等的聚酯,聚碳酸酯、聚醯亞胺、聚醚醚酮、聚醚醯亞胺、聚醯胺、全芳香族聚醯胺、聚二苯硫醚、芳綸(紙)、玻璃、玻璃布、氟素樹脂、聚氯乙烯、聚偏二氯乙烯、纖維素樹脂、矽酮樹脂、金屬(箔)、紙等。
又,基材1之材料,可列舉為前述樹脂之交聯等之聚合物。前述塑膠薄膜,可不做延伸處理,亦可視需要進行一軸或二軸之延伸處理。如藉由延伸處理等賦予熱伸縮性之樹脂片材,在切割後該基材1可藉由熱收縮使黏著劑層2與加熱接合用片材3、3’之接著面積降低,可達到使半導體晶片之回收容易化的目的。
基材1之表面,為提高與鄰接層之密著性、保持性等,可實施慣用之表面處理,例如,鉻酸處理、臭氧暴露、火焰暴露、高壓電擊暴露、離子化放射線處理等化學性或物理性處理,利用底塗劑(例如,下述黏著物質)所進行之塗佈處理。
基材1之厚度並無特別的限制,可適當地決定,一般為5~200μm左右。
用於黏著劑層2之形成的黏著劑並無特別限制,例如,可使用丙烯酸系黏著劑、橡膠系黏著劑等的一般感壓性接著劑。前述感壓性接著劑,如基於以半導體晶圓或玻璃等怕污染的電子零件之超純水或酒精等有機溶劑之清淨洗淨性等觀點而言,較佳係以丙烯酸系聚合物為基礎聚合物之丙烯酸黏著劑。
作為前述丙烯酸系聚合物,可列舉例如,(甲基)丙烯酸烷基酯(例如,甲酯、乙酯、丙酯、異丙酯、丁酯、異丁酯、s-丁酯、t-丁酯、戊酯、異戊酯、己酯、庚酯、辛酯、2-乙基己酯、異辛酯、壬酯、癸酯、異癸酯、十一酯、十二酯、十三酯、十四酯、十六酯、十八酯、二十酯等烷基之碳數1~30,尤其是碳數4~18的直鏈狀或分枝鏈狀之烷基酯等),以及(甲基)丙烯酸環烷基酯(例如,環戊酯、環己酯等)之1種或2種以上作為單體成分使用之丙烯酸系聚合物等。又,(甲基)丙烯酸酯即係指丙烯酸酯及/或甲基丙烯酸酯,本發明中之(甲基),皆為同樣意義。
前述丙烯酸系聚合物,以凝集力、耐熱性等的改良為目的,可視需要含有與前述(甲基)丙烯酸烷酯或環烷酯共聚合之其他單體成分之對應單位。此種單體成分,可列舉例如,丙烯酸、甲基丙烯酸、羧乙基(甲基)丙烯酸酯、羧戊基(甲基)丙烯酸酯、衣康酸、馬來酸、富馬酸、丁烯酸等含羧基之單體;馬來酸酐、衣康酸酐等酸酐單體;(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸6-羥基己酯、(甲基)丙烯酸8-羥基辛酯、(甲基)丙烯酸10-羥基癸酯、(甲基)丙烯酸12-羥基月桂酯、(4-羥基甲基環己基)甲基(甲基)丙烯酸酯等含羥基之單體;苯乙烯磺酸、烯丙基磺酸、2-(甲基)丙烯醯胺- 2-甲基丙磺酸、(甲基)丙烯醯胺丙磺酸、磺酸丙基(甲基)丙烯酸酯、(甲基)丙烯醯氧基萘磺酸等含磺酸基之單體;2-羥乙基丙烯醯基磷酸酯等含磷酸基之單體;丙烯醯胺、丙烯腈等。此等可共聚合之單體成分可使用1種或2種以上。此等可共聚合之單體之使用量在全部單體成分之40重量%以下為佳。
進一步,為使前述丙烯酸系聚合物進行交聯,可視需要包含多官能性單體等作為共聚合用單體成分。此種多官能性單體,可列舉例如,己二醇二(甲基)丙烯酸酯、(聚)乙二醇二(甲基)丙烯酸酯、(聚)丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、環氧(甲基)丙烯酸酯、聚酯(甲基)丙烯酸酯、胺基甲酸(甲基)丙烯酸酯等。此等多官能性單體亦可使用1種或2種以上。從黏著特性等之觀點而言,多官能性單體之使用量在全部單體成分之30重量%以下為佳。
前述丙烯酸系聚合物係,可藉由使單一單體或2種以上之單體混合物進行聚合而得。聚合亦可以溶液聚合、乳化聚合、塊狀聚合、懸浮聚合等任一方式進行。以防止對潔淨之被黏物之污染等之觀點而言,以低分子量物質之含量較小為佳。以此點而言,丙烯酸系聚合物之數量平均分子量較佳係10萬以上,更較佳係20萬~300萬左右,特佳係30萬~100萬左右。
此外,由於前述黏著劑中,為提高作為基礎聚合物之丙烯酸系聚合物等之數量平均分子量,因此可適宜地採用外部交聯劑。作為外部 交聯方法之具體手段,可列舉添加聚異氰酸酯化合物、環氧化合物、氮丙環化合物、三聚氰胺系交聯劑等所謂交聯劑使其反應之方法。使用外部交聯劑時,其使用量係根據與該應交聯之基礎聚合物之平衡,進一步,可根據作為黏著劑之使用用途來適當決定。一般而言,對於前述基礎聚合物100重量份,以約5重量份以下,進一步以0.1~5重量份配合為佳。進一步,黏著劑視需要,除前述成分外,亦可使用過去習知的各種黏著賦予劑、抗老化劑等之添加劑。
黏著劑層2,亦可由放射線硬化型黏著劑形成。放射線硬化型黏著劑,可藉由紫外線等之放射線之照射控制其黏著力。例如,若在加熱接合用片材3貼合之狀態下照射紫外線,則與加熱接合用片材3之間可產生錨定效果。藉此,可提升黏著劑層2及加熱接合用片材3之密著性。此外,貼合加熱接合用片材前,藉由照射放射線,可降低黏著劑層2及加熱接合用片材3之黏著力。
放射線硬化型黏著劑係具有碳-碳雙鍵等放射線硬化性之官能基,且可使用表現黏著性之物質,無特別限制。放射線硬化型黏著劑,可例示如,在前述丙烯酸系黏著劑、橡膠系黏著劑等一般感壓性黏著劑上,配合放射線硬化性之單體成分或低聚物成分之添加型放射線硬化型黏著劑。
配合放射線硬化性之單體成分,可列舉例如,胺基甲酸酯低聚物、胺基甲酸(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、四羥甲基四(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇單羥基五(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、 1,4-丁二醇二(甲基)丙烯酸酯等。又,放射線硬化性之低聚物成分可列舉胺基甲酸酯系、聚醚系、聚酯系、聚碳酸酯系、聚丁二烯系等各種低聚物,其分子量係100~30000左右之範圍者為適當。放射線硬化性之單體成分或低聚物成分之配合量,可因應前述黏著劑層之種類,黏著劑層之黏著力之可降低量,做適當的決定。一般而言,對於構成黏著劑之丙烯酸系聚合物等的基礎聚合物100重量份,例如為5~500重量份、較佳為40~150重量份左右。
此外,放射線硬化型黏著劑,可列舉除前述說明之添加型放射線硬化型黏著劑外,基礎聚合物還可列舉使用內在型之放射線硬化型黏著劑,其係在聚合物側鏈或主鏈中間或主鏈末端具有碳-碳雙鍵者。內在型放射線硬化型黏著劑,因不需含有低分子成分之低聚物或含量不多,故低聚物成分不會隨時間經過在黏著劑中移動,能形成安定層構造之黏著劑層而較佳。
前述具有碳-碳雙鍵之基礎聚合物,可使用具有碳-碳雙鍵且具有黏著性者,並無特別限制。作為此種基礎聚合物,基本骨架係以丙烯酸系聚合物者為佳。作為丙烯酸系聚合物之基本骨架,可列舉前述例示之丙烯酸系聚合物。
前述對丙烯酸系聚合物之碳-碳雙鍵之導入法無特別限制,可採用各種方法,以分子設計之觀點,係以碳-碳雙鍵導入聚合物側鏈為容易。可列舉例如,事先,在丙烯酸系聚合物單體中共聚合具有官能基之單體後,將可與此官能基反應之官能基以及具有碳-碳雙鍵之化合物,在維持碳-碳雙鍵之放射線硬化性狀態下使其縮合或加成反應之方法。
此等官能基之組合之例,可列舉羧酸基及環氧基、羧酸基和氮丙環基、羥基及異氰酸酯基等。此等官能基之組合中,從追蹤反應之容易度而言,係以羥基和異氰酸酯基之組合較適合。此外,根據此等官能基之組合,若是生成前述具有碳-碳雙鍵之丙烯酸系聚合物之組合時,官能基在丙烯酸系聚合物和前述化合物之任一側皆可;而前述較佳之組合,丙烯酸系聚合物具有羥基,前述化合物具有異氰酸酯基之情形則為合適。此種情形,具有碳-碳雙鍵之異氰酸酯化合物,可列舉例如,甲基丙烯醯異氰酸酯、2-甲基丙烯醯氧乙基異氰酸酯、m-異丙烯-α、α-二甲基芐基異氰酸酯等。此外,作為丙烯酸系聚合物,前述例示之含有羥基之單體或2-羥基乙基乙烯醚、4-羥基丁基乙烯醚、二甘醇單乙烯醚之醚系化合物等用於共聚合之物。
前述內在型之放射線硬化型黏著劑,可單獨使用前述含有碳-碳雙鍵之基礎聚合物(尤其係丙烯酸系聚合物),也可在不惡化其特性的程度配合前述放射線硬化性之單體成分或低聚物成分等。放射線硬化性之低聚物成分等,對於通常基礎聚合物100重量份係30重量份之範圍內,較佳則係0~10重量份之範圍。
前述放射線硬化型黏著劑係,藉由紫外線等使其硬化時含有光聚合引發劑。作為光聚合引發劑,可列舉例如,4-(2-羥基乙氧基)苯基(2-羥基-2-丙基)酮、α-羥基-α,α’-二甲基苯乙酮、2-甲基-2-羥基苯丙酮、1-羥基環己苯酮等之α-酮系化合物;甲氧基苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、2,2-二乙氧基苯乙酮、2-甲基-1-〔4-(甲硫)-苯基〕-2-嗎啉丙烷-1等苯 乙酮系化合物;苯偶姻乙醚、苯偶姻異丙醚、茴香偶姻甲醚等之苯偶姻乙醚系化合物;芐基二甲基縮酮等之縮酮系化合物;2-萘磺醯氯等芳香族磺醯氯系化合物;1-苯甲酮-1,1-丙二酮-2-(o-乙氧羰基)肟等之光活性肟系化合物;二苯甲酮、苯甲醯安息香酸、3,3’-二甲基-4-甲氧基二苯甲酮等之二苯甲酮系化合物;噻噸酮、2-氯噻噸酮、2-甲基噻噸酮、2,4-二甲基噻噸酮、噻噸酮、異丙基噻噸酮、2,4-二氯噻噸酮、2,4-二乙基噻噸酮、2,4-二異丙基噻噸酮等之噻噸酮系化合物;樟腦醌;鹵化酮;醯基氧化磷;醯基磷酸酯等。光聚合引發劑之配合量,相對於構成黏著劑之丙烯酸系聚合物等之基礎聚合物100重量比,例如為0.05~20重量比左右。
又,放射線硬化型黏著劑,可列舉例如,日本特開昭60-196956號公報所揭露,有2個以上不飽和鍵之加成聚合化合物、含有具有環氧基之烷氧基矽烷等光聚合性化合物、及羰基化合物、有機硫磺化合物、過氧化物、胺、鎓鹽系化合物等之光聚合引發劑之橡膠系黏著劑或丙烯酸系黏著劑等。
前述放射線硬化型之黏著劑層2中,可視需要,含有藉由放射線照射來著色之化合物。因黏著劑層2含有著色之化合物,可藉由放射線照射,將僅被放射線照射之部分著色。亦即,可使圖1所示加工黏貼部分3a之對應部分2a著色。因此,能以目視直接判斷黏著劑層2是否被放射線照射過,加工黏貼部分3a容易被識別,加工之黏貼更為容易。又,用光感測器等檢測半導體晶片時,其檢測精度提高,半導體晶片撿取時不會發生錯誤操作。藉由放射線照射所著色之化合物,在放射線照射前為無 色或淺色,藉由放射線照射成為有色之化合物,可列舉例如無色染料等。藉由放射線照射而著色之化合物,其使用比例,可適當設定。
黏著劑層2之厚度,雖無特別限定,但從防止晶片切斷面之缺陷或固定保持加熱接合用片材3、3’之兼顧性等觀點而言,係以1~50μm左右為佳。較佳為2~30μm,更佳為5~25μm。
本實施例型態之切晶帶11,例如,能以如下製作。
首先,基材1,可由過去習知的製膜方法來製膜。該製膜方法,可例示如壓延(calendaring)製膜法、在有機溶劑中之鑄膜(casting)法、在密閉系統之吹膜擠出法、T模擠出法、共擠出法、乾式層壓法等。
接著,基材1上塗佈黏著劑組成物溶液,形成塗佈膜後,該塗佈膜在所定條件下乾燥(視需求加熱交聯),形成黏著劑層2。塗佈方法無特別限定,可列舉例如,滾輪塗工、網版塗工、凹版塗工等。又,乾燥條件,例如可在乾燥溫度80~150℃、乾燥時間0.5~5分之間之範圍內進行。此外,在隔板上塗佈黏著劑組成物形成塗佈膜後,在前述乾燥條件下乾燥塗佈膜而形成黏著劑層2亦可。之後,在基材1上將隔板與黏著劑層2一起貼合。藉此,製作切晶帶11。
附切晶帶之加熱接合用片材10、12,可用一般方法製造。例如,將切晶帶11之黏著劑層2與加熱接合用片材3貼合,可製造附切晶帶之加熱接合用片材10。
附切晶帶之加熱接合用片材10,以隔板覆蓋加熱接合用片材3者為佳。可列舉例如,貼合切晶帶11及加熱接合用片材3後,剝離於加熱接合用片材3積層之前述基材隔板,於剝離前述基材隔板後之附切晶帶之加 熱接合用片材10之加熱接合用片材3之露出面,貼附隔板之方法。亦即,貼合切晶帶11、加熱接合用片材3、及前述隔板之順序積層之形態為佳。
上述實施型態係,說明關於切晶帶及加熱接合用片材所積層之附切晶帶之加熱接合用片材。然而,本發明之加熱接合用片材,亦可提供不貼合切晶帶之狀態。
加熱接合用片材,在不貼合切晶帶之形態之情況下,夾於2片之隔板形成附有兩面隔板之加熱接合用片材為佳。亦即,第1隔板、加熱接合用片材、及第2隔板之順序積層所形成附有兩面隔板之加熱接合用片材為佳。
又,加熱接合用片材,形成不貼合切晶帶之形態時,僅加熱接合用片材之一側之面積層隔板之形態亦可。
(半導體裝置之製造方法)
本實施型態中之半導體裝置之製造方法包含:準備前述加熱接合用片材之步驟、及於前述加熱接合用片材,貼合切晶帶,得到附切晶帶之加熱接合用片材之步驟、及將前述附切晶帶之加熱接合用片材與半導體晶圓之背面貼合之貼合步驟、及將前述半導體晶圓連同前述加熱接合用片材切割,形成晶片狀之半導體晶片之切晶步驟、及將前述半導體晶片,從前述附切晶帶之加熱接合用片材,連同前述加熱接合用片材撿拾之撿拾步驟、及介由前述加熱接合用片材,使半導體晶片在被黏物上加熱接合之加熱 接合步驟(以下,亦稱為第1實施型態)。
此外,本實施型態中半導體裝置之製造方法包含:準備前述所記載之附切晶帶之加熱接合用片材之步驟、及將前述附切晶帶之加熱接合用片材與半導體晶圓之背面貼合之貼合步驟、及將前述半導體晶圓連同前述加熱接合用片材切割,形成晶片狀之半導體晶片之切晶步驟、及將前述半導體晶片,從前述附切晶帶之加熱接合用片材,連同前述加熱接合用片材撿拾之撿拾步驟、及介由前述加熱接合用片材,將前述半導體晶片於被黏物上進行加熱接合之加熱接合步驟(以下,亦稱為第2實施型態)。
第1實施型態中半導體裝置之製造方法,相對於第2之實施型態中半導體裝置之製造方法,其使用附切晶帶之加熱接合用片材,在第1實施型態中半導體裝置之製造方法中,於以單體使用加熱接合用片材之部分不同,而其他部分相同。第1之實施型態中半導體裝置之製造方法中,準備加熱接合用片材後,若將其與切晶帶進行貼合步驟,之後,可與第2實施型態中半導體裝置之製造方法相同地進行。因此,以下針對第2實施型態中半導體裝置之製造方法加以說明。
本實施型態中半導體裝置之製造方法中,首先,準備附切晶帶之加熱接合用片材10、12(準備步驟)。
加熱接合用片材3、3’,具有燒結前層31、及成分移轉防止層32。由於具有成分移轉防止層32,在供應使用之前的期間,可 防止燒結前層31之成分移轉至切晶帶11,或切晶帶之成分移轉至燒結前層31。
附切晶帶之加熱接合用片材10、12,可在加熱接合用片材3、3’上任意設置之隔板上適宜地剝離,如以下使用。以下,一邊參照圖1、圖3使用附切晶帶之加熱接合用片材10之情形為例,加以說明。
首先,附切晶帶之加熱接合用片材10中加熱接合用片材3之半導體晶圓黏貼部分3a上,壓接半導體晶圓4,將此保持接著並固定(貼合步驟)。本步驟,是用壓著滾輪等之按壓方法一邊按壓一邊進行。裝載時之黏貼溫度並無特別限定,例如在23~90℃之範圍內為佳。
半導體晶圓4,於一側之面形成電極墊,於其他的面(以下,稱作背面)之最表面形成銀薄膜為佳。前述銀薄膜之厚度,可列舉例如,10nm~1000nm。此外,於半導體晶圓4與前述銀薄膜之間,進一步,亦可形成鈦薄膜。前述鈦薄膜之厚度,可列舉例如,10nm~1000nm。若形成前述銀薄膜,則後述之加熱接合步驟中,半導體晶片5與加熱接合用片材3可強固地加熱接合。此外,若形成前述鈦薄膜則電極之信賴性提升。前述銀薄膜、及前述鈦薄膜,例如,可藉由氣相沉積形成。
接著,進行半導體晶圓4之切割(切晶步驟)。藉此,切斷並單片化半導體晶圓4成所定之尺寸,從而製造半導體晶片5。切晶方法雖無特別限定,例如可從半導體晶圓4之迴路面側,按照普通方法進行。此外,本步驟,例如可採用附切晶帶之加熱接合用片材10,來進行切割之所謂全切之切斷方式等。本步驟所用的切晶裝置並無特別限定,可使用 過去習知之物。此外,由於半導體晶圓4係,藉由切晶帶之加熱接合用片材10接著固定,故可抑制晶片缺陷或晶片飛散的同時,亦可抑制半導體晶圓4的破損。
接著,為剝離在附切晶帶之加熱接合用片材10上接著固定之半導體晶片5,進行半導體晶片5之撿拾(撿拾步驟)。撿拾之方法無特別限定,可採用過去各種習知的方法。可列舉例如將個別半導體晶片5從附切晶帶之加熱接合用片材10側藉由針突起,再將突起之半導體晶片5經由撿拾裝置撿拾之方法等。
作為撿拾條件,以防止破片之觀點,針的突起速度在5~100mm/秒為佳,在5~10mm/秒更佳。
此處之撿拾,係黏著劑層2為紫外線硬化型之情形,其係在該黏著劑層2照射紫外線後進行。藉此,對於黏著劑層2之加熱接合用片材3之黏著力降低,使半導體晶片5之剝離變得容易。其結果,可在撿拾半導體晶片5時不使其受損。紫外線照射時之照射強度、照射時間等之條件並無特別限定,可視需要適當設定。此外,紫外線照射所使用之光源,可使用習知之物。此外,將黏著劑層事先照射紫外線使其硬化,貼合此硬化之黏著劑層與加熱接合用片材之情形,或貼合黏著劑層與加熱接合用片材後,經放射線照射之情形,並不需紫外線照射。
接著,撿拾之半導體晶片5,介由加熱接合用片材3,而黏晶(加熱接合)於被黏物6(加熱接合步驟)。被黏物6,可列舉有導線架、TAB薄膜、基板或另外製作之半導體晶片等。被黏物6,例如,可為容易變形之變形型被黏物,亦可為不易變形之非變形型被黏物(半導體晶圓 等)。
前述導線架,可列舉Cu導線架、42Alloy導線架等之金屬導線架。又,前述基板,可使用過去習知之物。可列舉例如玻璃環氧基、BT(雙馬來醯亞胺-三嗪)、聚醯亞胺等構成之有機基板。其中,若使用金屬導線架,可藉由加熱接合與金屬微粒子一體化。又,前述基板,可列舉係在陶瓷板等之絕緣基板上,積層銅電路基板之絕緣電路基板。若使用絕緣電路基板,例如,可製造進行電力的控制或供給之電力半導體裝置。
前述加熱接合步驟,藉由加熱燒結金屬微粒子的同時,可視需要熱分解熱分解性黏合劑。此外,揮發藉由乾燥步驟無法完全揮發所殘留之低沸點黏合劑。加熱溫度為,以180~400℃為佳、190~370℃較佳、在200~350℃進行更佳。此外,加熱時間,以0.3~300分為佳、0.5~240分較佳、在1~180分進行更佳。又加熱接合,亦可在加壓條件下進行。加壓條件,以1~500kg/cm2的範圍內為佳、5~400kg/cm2的範圍內更佳。在加壓下之加熱接合,例如,可如倒裝焊接機之加熱與加壓可同時進行之裝置來進行。此外,平行平板加壓亦可。
接著,可視需要,如圖3所示,在被黏物6之端子部(內引線)之前端與半導體晶片5上之電極墊(無圖示)以焊接導線7做電氣連接(導線焊接步驟)。前述焊接導線7,例如,可使用金線、鋁線或銅線等。進行導線焊接時之溫度,在23~300℃,較佳係在23~250℃之範圍內進行。此外,其加熱時間為數秒~數分內進行。結線為在前述溫度 範圍內之加熱狀態下,藉由超音波之振動能量與藉由施加電壓之壓接能量之併用下進行。
接著,可視需要,如圖3所示,藉由密封樹脂8密封半導體晶片5(密封步驟)。本步驟係為保護在被黏物6所搭載之半導體晶片5或焊接導線7而進行。本步驟可藉由密封用樹脂在模具成型來進行。密封樹脂8,例如使用環氧樹脂。樹脂密封時之加熱溫度,通常在175℃、60~90秒之間進行,但本發明並無限定於此,例如可在165~185℃、數分內處理。藉此,使密封樹脂8硬化。又,本密封步驟,亦可採用在片材狀之密封用片材嵌入半導體晶片5之方法(例如,參照日本專利特開2013-7028號公報)。此外,除了藉由模具之密封樹脂之成型以外,在箱型容器流入矽酮凝膠之凝膠密封型亦可。
接著,可視需要進行加熱,使在前述密封步驟硬化不足之密封樹脂8完全硬化(後硬化步驟)。本步驟中之加熱溫度,因密封樹脂之種類而異,例如在165~185℃之範圍內,加熱時間為0.5~8小時左右。
又,本發明之加熱接合用片材、及附切晶帶之加熱接合用片材,亦可適用於積層有複數半導體晶片且立體實裝之情形。此時,可於半導體晶片間積層加熱接合片材及隔離層,亦可不積層隔離層,而僅在半導體晶片間積層加熱接合用片材,可視製造條件或用途等作適當變更。
此外,本發明之加熱接合用片材、及附切晶帶之加熱接合用片材,不限定於上述例示之用途,可利用2者於加熱接合。
【實施例】
以下,關於本發明所使用之實施例做詳細的說明,但本發明在不超過其主旨之情況下,並不限於以下之實施例。
關於實施例使用成分加以說明。
熱分解性黏合劑A(聚碳酸丙烯酯樹脂):Empower公司製之QPAC40、在23℃固態
低沸點黏合劑A(異冰片環己醇):日本萜化學股份公司製之tersorb MTPH、在23℃液態
金屬微粒子A:三井金屬礦業股份公司製之平均粒徑200nm之銅微粒子
有機溶劑A:甲乙酮(MEK)
(實施例1)
<燒結前層之製作>
熱分解性黏合劑A事先以重量比1:1溶解於MEK之溶液(12重量%)、低沸點黏合劑A(4重量%)、金屬微粒子A(60重量%)、及有機溶劑A(24重量%)放入混合攪拌器(KEYENCE製HM-500)之攪拌槽中,攪拌模式以3分鐘攪拌‧混合。
所得到之塗漆,在離型處理薄膜(三菱樹脂(株)製的MRA38)上塗佈‧乾燥成乾燥後之厚度為70μm得到燒結前層A。乾燥條件為80℃下2分鐘。
<成分移轉防止層之製作>
熱分解性黏合劑A事先以重量比1:1溶解於MEK之溶液(50重量 %)、及有機溶劑A(50重量%)放入混合攪拌器(KEYENCE製HM-500)之攪拌槽中,攪拌模式以3分鐘攪拌‧混合。
所得到之塗漆,在離型處理薄膜(三菱樹脂(株)製的MRA38)上塗佈‧乾燥成乾燥後之厚度為3μm得到成分移轉防止層A。乾燥條件為80℃下2分鐘。
<加熱接合用片材之製作>
將燒結前層A及成分移轉防止層A之塗佈乾燥表面相面對,以油壓式層壓機在70℃貼合,得到加熱接合用片材A。
(實施例2)
<成分移轉防止層之製作>
使用實施例1之成分移轉防止層A用之塗漆,塗佈‧乾燥成乾燥後之厚度為6μm得到成分移轉防止層B。
<加熱接合用片材之製作>
將燒結前層A及成分移轉防止層B之塗佈乾燥表面相面對,以油壓式層壓機在70℃貼合,得到加熱接合用片材B。
〔成分移轉抑制評價〕
<切晶帶之製作>
於具備冷卻管、氮氣導入管、溫度計、及攪拌裝置之反應容器,放入丙烯酸2-乙基己酯100份、丙烯酸-2-羥乙基19份、過氧化苯甲醯0.4份、及甲苯80份,於氮氣氣流中在60℃下進行10小時共聚處理,得到丙烯酸系聚合物A。
於該丙烯酸系聚合物A加入2-甲基丙烯醯氧乙基異氰酸酯1.2 份,在空氣氣流中50℃下進行60小時附加反應處理,得到丙烯酸系聚合物A’。
接著,對於丙烯酸系聚合物A’ 100份,加入聚異氰酸酯化合物(商品名「冠狀錯合物L」,日本聚胺酯(株)製)1.3份、及光聚合起始劑(商品名「Irgacure184」,汽巴精化公司製)3份,製作黏著劑溶液(亦稱作「黏著劑溶液A」)。
將在前述調製之黏著劑溶液A,於PET剝離襯墊之施予矽處理之面上塗佈,在120℃下加熱乾燥2分鐘,形成厚度10μm之黏著劑層A。接著,於黏著劑層A之露出面,貼合厚度125μm之郡是公司製EVA薄膜(乙烯‧蟻酸乙烯酯共聚合體薄膜),在23℃下保存72小時,得到切晶帶A。
<評價>
將實施例之加熱接合用片材,分別在室溫(23℃)下貼附於製作之切晶帶A。接著,進行UV照射(條件:使用紫外線(UV)照射裝置(商品名「UM-810」(日東精機股份公司製)),以紫外線照射積算光量:300mJ/cm2進行紫外線照射)。之後,進一步,在70℃進行10分鐘加熱處理。接著,剝離切晶帶A。又,由於在此之UV照射及加熱處理為所謂的加速試驗,與實際之使用條件有所差異。
對於剝離切晶帶A後之加熱接合用片材(燒結前層A及成分移轉防止層A之2層構成之片材)切取約10mg之樣品,在氮氣環境下,昇溫速度90℃/分之條件下,從23℃至500℃進行熱重量分析。由TG-DTA同時測量裝置(示差熱-熱重量同時測量裝置)測量,更具 體為使用理學電機(株)製之差動型示差熱天秤TG-DTA TG8120。在23℃之重量減少量為0%。又,依此分析得知,若重量比起在23℃之重量減少時,值為負值。在500℃之值(重量減少量(%))為Y。
對於實施例之加熱接合用片材(燒結前層A及成分移轉防止層A之2層構成之片材),不貼附切晶帶直接進行熱重量分析。熱重量分析之方法,與上述相同。在500℃之值(重量減少量(%))為Y0。
〔〔(Y-Y0)/Y0〕×100〕之絕對值超過5之情形,視為足以發生成分移轉,判定為「×」。〔〔(Y-Y0)/Y0〕×100〕之絕對值在0~5之範圍內之情形,視為抑制成分移轉,判定為「○」。結果表示於表1。
1‧‧‧基材
2‧‧‧黏著劑層
3‧‧‧加熱接合用片材
4‧‧‧半導體晶圓
10‧‧‧附切晶帶之加熱接合用片材
11‧‧‧切晶帶
31‧‧‧燒結前層
32‧‧‧成分移轉防止層
Claims (5)
- 一種加熱接合用片材,其特徵係具有藉由加熱形成燒結層之燒結前層、及成分移轉防止層;前述燒結前層,係包含金屬微粒子、及有機黏合劑;前述成分移轉防止層,係至少包含有機黏合劑;前述燒結前層所含有之有機黏合劑,係相對於燒結前層之有機黏合劑全體,包含分子量500以下之有機成分20~80重量%;前述成分移轉防止層所含有之有機黏合劑,係相對於成分移轉防止層之有機黏合劑全體,包含分子量500以下之有機成分0~20重量%。
- 如申請專利範圍第1項所記載之加熱接合用片材,其中,前述燒結前層所含有的金屬微粒子之含有量,係相對於燒結前層全體,在30~70體積%之範圍內;前述成分移轉防止層所含有的金屬微粒子之含有量,係相對於成分移轉防止層全體,在0~30體積%之範圍內。
- 如申請專利範圍第1項所記載之加熱接合用片材,其中,前述燒結前層所含有之有機黏合劑,係包含熱分解性黏合劑;前述成分移轉防止層所含有之有機黏合劑,係包含熱分解性黏合劑。
- 如申請專利範圍第1~3項中任1項所記載之加熱接合用片材,其中,前述燒結前層之厚度為5~100μm之範圍內;前述成分移轉防止層之厚度為2~10μm之範圍內。
- 一種附切晶帶之加熱接合用片材,其特徵係, 其係具有切晶帶、及申請專利範圍第1~4項中任1項所記載之加熱接合用片材,前述加熱接合用片材,係前述切晶帶及前述成分移轉防止層接觸之態樣下,積層於前述切晶帶上。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016170115A JP6815132B2 (ja) | 2016-08-31 | 2016-08-31 | 加熱接合用シート、及び、ダイシングテープ付き加熱接合用シート |
JP2016-170115 | 2016-08-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201811948A TW201811948A (zh) | 2018-04-01 |
TWI740984B true TWI740984B (zh) | 2021-10-01 |
Family
ID=61300481
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106124578A TWI740984B (zh) | 2016-08-31 | 2017-07-21 | 加熱接合用片材,以及附切晶帶之加熱接合用片材 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11390777B2 (zh) |
EP (1) | EP3509092A1 (zh) |
JP (1) | JP6815132B2 (zh) |
CN (1) | CN109690745B (zh) |
TW (1) | TWI740984B (zh) |
WO (1) | WO2018042771A1 (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3608947A4 (en) * | 2017-03-29 | 2020-12-16 | Nitto Denko Corporation | THERMAL BONDING SHEET AND DICE CUTTING STRIP ATTACHED TO A THERMAL BONDING SHEET |
JP2020147820A (ja) * | 2019-03-15 | 2020-09-17 | 日東電工株式会社 | 焼結接合用シートおよび基材付き焼結接合用シート |
JP7252798B2 (ja) * | 2019-03-15 | 2023-04-05 | 日東電工株式会社 | 焼結接合用シートおよび基材付き焼結接合用シート |
JP2020147706A (ja) | 2019-03-15 | 2020-09-17 | 日東電工株式会社 | 基材付き焼結接合用シートの巻回体 |
JP7228422B2 (ja) * | 2019-03-15 | 2023-02-24 | 日東電工株式会社 | 焼結接合用シート、基材付き焼結接合用シート、および焼結接合用材料層付き半導体チップ |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201629455A (zh) * | 2014-12-24 | 2016-08-16 | Nitto Denko Corp | 加熱接合用片材及附有切晶帶之加熱接合用片材 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08229695A (ja) * | 1995-02-28 | 1996-09-10 | Nitto Denko Corp | 金属部材の接合材およびそれを用いた金属部材の接合方法 |
JP4561989B2 (ja) * | 2005-04-22 | 2010-10-13 | 信越化学工業株式会社 | 熱圧着用複層ゴムシート |
JP4781185B2 (ja) * | 2006-07-18 | 2011-09-28 | 日東電工株式会社 | 耐熱ダイシングテープ又はシート |
US8368205B2 (en) * | 2010-12-17 | 2013-02-05 | Oracle America, Inc. | Metallic thermal joint for high power density chips |
JP2012223904A (ja) * | 2011-04-15 | 2012-11-15 | Nitto Denko Corp | 粘着剤層付き透明樹脂フィルム、積層フィルムおよびタッチパネル |
US9583453B2 (en) * | 2012-05-30 | 2017-02-28 | Ormet Circuits, Inc. | Semiconductor packaging containing sintering die-attach material |
JP6542504B2 (ja) * | 2013-02-20 | 2019-07-10 | 日東電工株式会社 | フィルム状接着剤、フィルム状接着剤付きダイシングテープ、半導体装置の製造方法、及び半導体装置 |
KR20160051766A (ko) * | 2013-09-05 | 2016-05-11 | 헨켈 아이피 앤드 홀딩 게엠베하 | 금속 소결 필름 조성물 |
WO2015060346A1 (ja) | 2013-10-23 | 2015-04-30 | 日立化成株式会社 | ダイボンドシート及び半導体装置の製造方法 |
WO2016031551A1 (ja) * | 2014-08-29 | 2016-03-03 | 古河電気工業株式会社 | 導電性接着フィルム |
JP6396189B2 (ja) * | 2014-11-27 | 2018-09-26 | 日東電工株式会社 | 導電性フィルム状接着剤、フィルム状接着剤付きダイシングテープ及び半導体装置の製造方法 |
WO2016104188A1 (ja) * | 2014-12-24 | 2016-06-30 | 日東電工株式会社 | 加熱接合用シート、及び、ダイシングテープ付き加熱接合用シート |
JP6505572B2 (ja) | 2015-09-30 | 2019-04-24 | 日東電工株式会社 | 加熱接合用シート及びダイシングテープ付き加熱接合用シート |
JP2017066485A (ja) | 2015-09-30 | 2017-04-06 | 日東電工株式会社 | シートおよび複合シート |
JP6505571B2 (ja) | 2015-09-30 | 2019-04-24 | 日東電工株式会社 | 加熱接合用シート、及び、ダイシングテープ付き加熱接合用シート |
JP5989928B1 (ja) * | 2016-02-10 | 2016-09-07 | 古河電気工業株式会社 | 導電性接着フィルムおよびこれを用いたダイシング・ダイボンディングフィルム |
JP6967839B2 (ja) * | 2016-03-23 | 2021-11-17 | 日東電工株式会社 | 加熱接合用シート、ダイシングテープ付き加熱接合用シート、及び、接合体の製造方法、パワー半導体装置 |
-
2016
- 2016-08-31 JP JP2016170115A patent/JP6815132B2/ja active Active
-
2017
- 2017-05-18 WO PCT/JP2017/018681 patent/WO2018042771A1/ja unknown
- 2017-05-18 EP EP17845782.6A patent/EP3509092A1/en active Pending
- 2017-05-18 US US16/326,427 patent/US11390777B2/en active Active
- 2017-05-18 CN CN201780052888.5A patent/CN109690745B/zh active Active
- 2017-07-21 TW TW106124578A patent/TWI740984B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201629455A (zh) * | 2014-12-24 | 2016-08-16 | Nitto Denko Corp | 加熱接合用片材及附有切晶帶之加熱接合用片材 |
Also Published As
Publication number | Publication date |
---|---|
WO2018042771A1 (ja) | 2018-03-08 |
US20210198526A1 (en) | 2021-07-01 |
TW201811948A (zh) | 2018-04-01 |
CN109690745A (zh) | 2019-04-26 |
EP3509092A4 (en) | 2019-07-10 |
US11390777B2 (en) | 2022-07-19 |
JP6815132B2 (ja) | 2021-01-20 |
CN109690745B (zh) | 2023-10-13 |
EP3509092A1 (en) | 2019-07-10 |
JP2018037547A (ja) | 2018-03-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI680289B (zh) | 加熱接合用片材、以及附切晶帶加熱接合用片材 | |
JP6870943B2 (ja) | 加熱接合用シート、及び、ダイシングテープ付き加熱接合用シート | |
TWI751134B (zh) | 加熱接合用片材、附切晶帶加熱接合用片材、以及、接合體之製造方法、電力半導體裝置 | |
TWI688443B (zh) | 加熱接合用片材、以及附切晶帶加熱接合用片材 | |
TWI752984B (zh) | 加熱接合用片材,以及附切晶帶之加熱接合用片材 | |
TWI740984B (zh) | 加熱接合用片材,以及附切晶帶之加熱接合用片材 | |
TWI732042B (zh) | 加熱接合用片材及附切晶帶加熱接合用片材 | |
JP6858520B2 (ja) | 加熱接合用シート、及び、ダイシングテープ付き加熱接合用シート | |
TWI700749B (zh) | 加熱接合用片材、以及附切晶帶加熱接合用片材 | |
TWI781936B (zh) | 加熱接合用片材及附切晶帶加熱接合用片材 | |
TWI773672B (zh) | 加熱接合用片材及附切晶帶加熱接合用片材 | |
WO2016104188A1 (ja) | 加熱接合用シート、及び、ダイシングテープ付き加熱接合用シート | |
WO2017057428A1 (ja) | 加熱接合用シート、及び、ダイシングテープ付き加熱接合用シート | |
WO2017057429A1 (ja) | 加熱接合用シート、及び、ダイシングテープ付き加熱接合用シート |