TWI740970B - 積層體基板、導電性基板、積層體基板的製造方法、導電性基板的製造方法 - Google Patents

積層體基板、導電性基板、積層體基板的製造方法、導電性基板的製造方法 Download PDF

Info

Publication number
TWI740970B
TWI740970B TW106121706A TW106121706A TWI740970B TW I740970 B TWI740970 B TW I740970B TW 106121706 A TW106121706 A TW 106121706A TW 106121706 A TW106121706 A TW 106121706A TW I740970 B TWI740970 B TW I740970B
Authority
TW
Taiwan
Prior art keywords
layer
blackened
copper
substrate
base metal
Prior art date
Application number
TW106121706A
Other languages
English (en)
Chinese (zh)
Other versions
TW201829177A (zh
Inventor
渡邉寛人
Original Assignee
日商住友金屬礦山股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商住友金屬礦山股份有限公司 filed Critical 日商住友金屬礦山股份有限公司
Publication of TW201829177A publication Critical patent/TW201829177A/zh
Application granted granted Critical
Publication of TWI740970B publication Critical patent/TWI740970B/zh

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Laminated Bodies (AREA)
  • Physical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
TW106121706A 2016-07-12 2017-06-29 積層體基板、導電性基板、積層體基板的製造方法、導電性基板的製造方法 TWI740970B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2016-137717 2016-07-12
JP2016137717A JP7049759B2 (ja) 2016-07-12 2016-07-12 積層体基板、導電性基板、積層体基板の製造方法、導電性基板の製造方法

Publications (2)

Publication Number Publication Date
TW201829177A TW201829177A (zh) 2018-08-16
TWI740970B true TWI740970B (zh) 2021-10-01

Family

ID=60952988

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106121706A TWI740970B (zh) 2016-07-12 2017-06-29 積層體基板、導電性基板、積層體基板的製造方法、導電性基板的製造方法

Country Status (5)

Country Link
JP (1) JP7049759B2 (ko)
KR (1) KR102365980B1 (ko)
CN (1) CN109416605B (ko)
TW (1) TWI740970B (ko)
WO (1) WO2018012185A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI718654B (zh) * 2019-09-04 2021-02-11 郡宏光電股份有限公司 觸控裝置用之導電板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013129183A (ja) * 2011-11-22 2013-07-04 Toray Ind Inc 積層体
CN204302942U (zh) * 2013-12-09 2015-04-29 阿尔卑斯电气株式会社 静电传感器

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4086132B2 (ja) 2001-11-16 2008-05-14 株式会社ブリヂストン 透明導電性フィルムおよびタッチパネル
JP2008311565A (ja) 2007-06-18 2008-12-25 Dainippon Printing Co Ltd ディスプレイ用複合フィルタ
JP5517019B2 (ja) * 2008-05-26 2014-06-11 住友金属鉱山株式会社 プリント配線基板およびプリント配線基板の製造方法
JP5361579B2 (ja) 2009-07-09 2013-12-04 信越ポリマー株式会社 大型ディスプレイ用のセンサパネル及びその製造方法
JP2013069261A (ja) 2011-09-08 2013-04-18 Dainippon Printing Co Ltd タッチパネル用電極基材、及びタッチパネル、並びに画像表示装置
TWI506752B (zh) * 2012-04-18 2015-11-01 Lg Chemical Ltd 導電結構體及其製備方法
KR102170097B1 (ko) * 2013-10-31 2020-10-26 스미토모 긴조쿠 고잔 가부시키가이샤 도전성 기판 및 도전성 기판 제조방법
JP6230025B2 (ja) 2014-07-04 2017-11-15 国立大学法人信州大学 熱応答試験の解析方法および解析プログラム
CN106575172B (zh) * 2014-07-31 2022-04-29 住友金属矿山股份有限公司 触控面板用导电性基板、触控面板用导电性基板的制造方法
JP2016103138A (ja) * 2014-11-28 2016-06-02 日東電工株式会社 透明導電性基材

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013129183A (ja) * 2011-11-22 2013-07-04 Toray Ind Inc 積層体
CN204302942U (zh) * 2013-12-09 2015-04-29 阿尔卑斯电气株式会社 静电传感器

Also Published As

Publication number Publication date
JP7049759B2 (ja) 2022-04-07
TW201829177A (zh) 2018-08-16
KR20190030659A (ko) 2019-03-22
JP2018010420A (ja) 2018-01-18
CN109416605A (zh) 2019-03-01
WO2018012185A1 (ja) 2018-01-18
CN109416605B (zh) 2022-06-07
KR102365980B1 (ko) 2022-02-22

Similar Documents

Publication Publication Date Title
TWI688973B (zh) 導電性基板
JP6201804B2 (ja) 細線パターンの形成方法、及び導電性基板の製造方法
WO2017065184A1 (ja) 積層体基板、積層体基板の製造方法、導電性基板、及び導電性基板の製造方法
TWI740970B (zh) 積層體基板、導電性基板、積層體基板的製造方法、導電性基板的製造方法
JP6687033B2 (ja) 導電性基板
WO2016208654A1 (ja) 積層体基板、導電性基板、積層体基板の製造方法、導電性基板の製造方法
JP6823363B2 (ja) 導電性基板、導電性基板の製造方法
JP6455366B2 (ja) 積層体基板、導電性基板、積層体基板の製造方法、導電性基板の製造方法
JP6417964B2 (ja) 積層体基板、配線基板ならびにそれらの製造方法
JP6531596B2 (ja) 積層体基板、導電性基板、積層体基板の製造方法、導電性基板の製造方法
JP6932908B2 (ja) 積層体基板、導電性基板、積層体基板の製造方法、導電性基板の製造方法
JP6729007B2 (ja) 積層体基板、導電性基板、積層体基板の製造方法、導電性基板の製造方法
JP2017133063A (ja) 積層体基板、導電性基板、積層体基板の製造方法、導電性基板の製造方法