TWI739024B - 電漿處理裝置 - Google Patents

電漿處理裝置 Download PDF

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Publication number
TWI739024B
TWI739024B TW107127210A TW107127210A TWI739024B TW I739024 B TWI739024 B TW I739024B TW 107127210 A TW107127210 A TW 107127210A TW 107127210 A TW107127210 A TW 107127210A TW I739024 B TWI739024 B TW I739024B
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TW
Taiwan
Prior art keywords
processing
plasma
plasma processing
data
prediction model
Prior art date
Application number
TW107127210A
Other languages
English (en)
Chinese (zh)
Other versions
TW201933418A (zh
Inventor
梅田祥太
野木慶太
鹿子嶋昭
白石大輔
Original Assignee
日商日立全球先端科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商日立全球先端科技股份有限公司 filed Critical 日商日立全球先端科技股份有限公司
Publication of TW201933418A publication Critical patent/TW201933418A/zh
Application granted granted Critical
Publication of TWI739024B publication Critical patent/TWI739024B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32926—Software, data control or modelling
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/28—Investigating the spectrum
    • G01J3/443—Emission spectrometry
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01J37/32972—Spectral analysis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/20—Pc systems
    • G05B2219/26—Pc applications
    • G05B2219/2602—Wafer processing

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
TW107127210A 2018-01-17 2018-08-06 電漿處理裝置 TWI739024B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-005761 2018-01-17
JP2018005761A JP7058129B2 (ja) 2018-01-17 2018-01-17 プラズマ処理装置

Publications (2)

Publication Number Publication Date
TW201933418A TW201933418A (zh) 2019-08-16
TWI739024B true TWI739024B (zh) 2021-09-11

Family

ID=67214239

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107127210A TWI739024B (zh) 2018-01-17 2018-08-06 電漿處理裝置

Country Status (4)

Country Link
US (1) US11289313B2 (enExample)
JP (1) JP7058129B2 (enExample)
KR (1) KR102100210B1 (enExample)
TW (1) TWI739024B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11966203B2 (en) 2019-08-21 2024-04-23 Kla Corporation System and method to adjust a kinetics model of surface reactions during plasma processing
JP7542417B2 (ja) 2019-12-27 2024-08-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理方法、基板処理システム、及び学習用データの生成方法
JP7429623B2 (ja) * 2020-08-31 2024-02-08 株式会社日立製作所 製造条件設定自動化装置及び方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8992721B2 (en) * 2009-10-09 2015-03-31 Hitachi High-Technologies Corporation Plasma processing apparatus
TW201515095A (zh) * 2013-10-04 2015-04-16 Applied Materials Inc 匹配兩電漿反應器之預測方法
US20160379896A1 (en) * 2015-06-26 2016-12-29 Hitachi High-Technologies Corporation Plasma processing apparatus and data analysis apparatus
TW201724157A (zh) * 2015-06-12 2017-07-01 Tokyo Electron Ltd 電漿處理裝置、電漿處理裝置之控制方法及記憶媒體
TW201742101A (zh) * 2016-03-03 2017-12-01 蘭姆研究公司 使用一或多夾具及效率決定匹配網路模型之參數的系統及方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4317701B2 (ja) * 2003-03-12 2009-08-19 東京エレクトロン株式会社 処理結果の予測方法及び予測装置
JP2004335841A (ja) * 2003-05-09 2004-11-25 Tokyo Electron Ltd プラズマ処理装置の予測装置及び予測方法
JP2005051269A (ja) * 2004-10-12 2005-02-24 Hitachi Ltd 半導体処理装置
WO2007066404A1 (ja) * 2005-12-08 2007-06-14 Spansion Llc 半導体製造装置、その制御システムおよびその制御方法
JP2009049382A (ja) 2007-07-26 2009-03-05 Panasonic Corp ドライエッチング方法およびドライエッチング装置
JP4836994B2 (ja) * 2008-06-11 2011-12-14 株式会社日立製作所 半導体処理装置
JP6220319B2 (ja) 2014-07-17 2017-10-25 株式会社日立ハイテクノロジーズ データ解析方法及びプラズマエッチング方法並びにプラズマ処理装置
JP6310866B2 (ja) * 2015-01-30 2018-04-11 株式会社日立ハイテクノロジーズ プラズマ処理装置及びプラズマ処理方法並びに解析方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8992721B2 (en) * 2009-10-09 2015-03-31 Hitachi High-Technologies Corporation Plasma processing apparatus
TW201515095A (zh) * 2013-10-04 2015-04-16 Applied Materials Inc 匹配兩電漿反應器之預測方法
TW201724157A (zh) * 2015-06-12 2017-07-01 Tokyo Electron Ltd 電漿處理裝置、電漿處理裝置之控制方法及記憶媒體
US20160379896A1 (en) * 2015-06-26 2016-12-29 Hitachi High-Technologies Corporation Plasma processing apparatus and data analysis apparatus
TW201742101A (zh) * 2016-03-03 2017-12-01 蘭姆研究公司 使用一或多夾具及效率決定匹配網路模型之參數的系統及方法

Also Published As

Publication number Publication date
KR20190087940A (ko) 2019-07-25
US11289313B2 (en) 2022-03-29
JP2019125506A (ja) 2019-07-25
JP7058129B2 (ja) 2022-04-21
KR102100210B1 (ko) 2020-04-14
US20190221407A1 (en) 2019-07-18
TW201933418A (zh) 2019-08-16

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