TWI736863B - 成型裝置及製造物品的方法 - Google Patents

成型裝置及製造物品的方法 Download PDF

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Publication number
TWI736863B
TWI736863B TW108110232A TW108110232A TWI736863B TW I736863 B TWI736863 B TW I736863B TW 108110232 A TW108110232 A TW 108110232A TW 108110232 A TW108110232 A TW 108110232A TW I736863 B TWI736863 B TW I736863B
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TW
Taiwan
Prior art keywords
substrate
holding
mold
holding force
composition
Prior art date
Application number
TW108110232A
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English (en)
Chinese (zh)
Other versions
TW201943543A (zh
Inventor
佐藤貴洋
Original Assignee
日商佳能股份有限公司
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Application filed by 日商佳能股份有限公司 filed Critical 日商佳能股份有限公司
Publication of TW201943543A publication Critical patent/TW201943543A/zh
Application granted granted Critical
Publication of TWI736863B publication Critical patent/TWI736863B/zh

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/168Finishing the coated layer, e.g. drying, baking, soaking
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2002Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2012Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image using liquid photohardening compositions, e.g. for the production of reliefs such as flexographic plates or stamps
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825Mounting of individual elements, e.g. mounts, holders or supports

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW108110232A 2018-04-11 2019-03-25 成型裝置及製造物品的方法 TWI736863B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018076246A JP7033994B2 (ja) 2018-04-11 2018-04-11 成形装置及び物品の製造方法
JP2018-076246 2018-04-11

Publications (2)

Publication Number Publication Date
TW201943543A TW201943543A (zh) 2019-11-16
TWI736863B true TWI736863B (zh) 2021-08-21

Family

ID=68161669

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108110232A TWI736863B (zh) 2018-04-11 2019-03-25 成型裝置及製造物品的方法

Country Status (5)

Country Link
US (1) US11372327B2 (OSRAM)
JP (1) JP7033994B2 (OSRAM)
KR (1) KR102518784B1 (OSRAM)
CN (1) CN110361929B (OSRAM)
TW (1) TWI736863B (OSRAM)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6762853B2 (ja) * 2016-11-11 2020-09-30 キヤノン株式会社 装置、方法、及び物品製造方法
CN111801134B (zh) * 2018-03-30 2022-06-14 富士胶片株式会社 经皮吸收片制造用模具、具有针状凸部的经皮吸收片的制造装置及方法
JP7507641B2 (ja) * 2020-09-08 2024-06-28 キヤノン株式会社 成形装置及び物品の製造方法
WO2022159468A1 (en) * 2021-01-20 2022-07-28 Applied Materials, Inc. Anti-slippery stamp landing ring
JP7620495B2 (ja) * 2021-05-07 2025-01-23 キヤノン株式会社 成形装置、および物品製造方法
US12282251B2 (en) * 2021-09-24 2025-04-22 Canon Kabushiki Kaisha Method of shaping a surface, shaping system, and method of manufacturing an article

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100059904A1 (en) * 2008-09-11 2010-03-11 Canon Kabushiki Kaisha Imprint apparatus

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WO2007067469A2 (en) 2005-12-08 2007-06-14 Molecular Imprints, Inc. Method for expelling gas positioned between a substrate and a mold
JP4845564B2 (ja) * 2006-03-31 2011-12-28 株式会社東芝 パターン転写方法
CN102089708A (zh) 2008-06-09 2011-06-08 得克萨斯州大学系统董事会 适应性纳米形貌雕刻
NL2003380A (en) 2008-10-17 2010-04-20 Asml Netherlands Bv Imprint lithography apparatus and method.
KR101960362B1 (ko) * 2010-04-27 2019-03-20 캐논 나노테크놀로지즈 인코퍼레이티드 나노임프린트 리소그래피를 위한 기판/주형의 분리 제어
JP5744423B2 (ja) * 2010-06-18 2015-07-08 キヤノン株式会社 インプリント装置、インプリント方法及びデバイスの製造方法
JP6004738B2 (ja) * 2011-09-07 2016-10-12 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP6029494B2 (ja) * 2012-03-12 2016-11-24 キヤノン株式会社 インプリント方法およびインプリント装置、それを用いた物品の製造方法
JP6120677B2 (ja) * 2013-05-27 2017-04-26 キヤノン株式会社 インプリント装置、インプリント方法および物品の製造方法
CN105682808B (zh) 2013-08-19 2018-03-27 德克萨斯大学系统董事会 以纳米级精确度可程序化的沉积用户自定义外形的薄膜
JP5745129B2 (ja) * 2014-04-02 2015-07-08 キヤノン株式会社 インプリント装置及びインプリント方法
JP6333031B2 (ja) * 2014-04-09 2018-05-30 キヤノン株式会社 インプリント装置および物品の製造方法
JP2015220299A (ja) * 2014-05-16 2015-12-07 キヤノン株式会社 インプリント装置および物品の製造方法
JP6659104B2 (ja) * 2014-11-11 2020-03-04 キヤノン株式会社 インプリント方法、インプリント装置、型、および物品の製造方法
JP6437387B2 (ja) * 2015-05-25 2018-12-12 東芝メモリ株式会社 基板平坦化方法
JP6647027B2 (ja) * 2015-12-03 2020-02-14 キヤノン株式会社 インプリント装置および物品製造方法
US11104057B2 (en) * 2015-12-11 2021-08-31 Canon Kabushiki Kaisha Imprint apparatus and method of imprinting a partial field
JP2017139268A (ja) * 2016-02-01 2017-08-10 キヤノン株式会社 インプリント装置及び物品の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100059904A1 (en) * 2008-09-11 2010-03-11 Canon Kabushiki Kaisha Imprint apparatus

Also Published As

Publication number Publication date
US11372327B2 (en) 2022-06-28
CN110361929A (zh) 2019-10-22
JP2019186404A (ja) 2019-10-24
JP7033994B2 (ja) 2022-03-11
US20190317397A1 (en) 2019-10-17
TW201943543A (zh) 2019-11-16
KR102518784B1 (ko) 2023-04-07
CN110361929B (zh) 2023-08-18
KR20190118972A (ko) 2019-10-21

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