TWI733406B - Plug-in hole structure of circuit board and manufacturing method thereof - Google Patents

Abstract

The present invention is a plug-in hole structure of circuit board and manufacturing including: a) providing a substrate having a first surface and a second surface; b) drilling a plurality of expansion holes on the substrate, wherein the expansion holes are disposed at intervals and arranged in a ring; c) drilling a plug-in hole on the substrate, wherein the plug-in hole is communicated with the expansion holes for forming an insertion hole together; and d) forming a conductive layer on the inner wall of the insertion hole. Moreover, the invention further provides a plug-in hole structure of circuit board. Thereby, the pins of the electronic components are well soldered to the plug-in hole to improve the process yield of the circuit board.

Description

Plug-in hole structure of circuit board and manufacturing method thereof

The present invention relates to a circuit board structure, in particular to a welding hole (plug-in hole) structure of a circuit board and a manufacturing method thereof.

In addition to laying electronic circuits on general circuit boards, there are also some circuit boards that need to be plugged in electronic components; also, because some electronic components have pins, when they are to be connected to the circuit board, corresponding plug-in holes ( Welding holes) to pass through the pins of the electronic component and solder the pins of the electronic component to the back of the circuit board.

Furthermore, in order to achieve rapid and mass production, the electronic component pins on the aforementioned circuit boards are usually tinned by a wave solder process using a soldering furnace, so as to pass through the sockets. The pins of the electronic components are connected to the circuit board to achieve the purpose of electrical connection. However, because the wave soldering process usually takes a short time, the heat conduction of the plug-in holes of the circuit board is very slow, so that the tin material in the soldering furnace cannot climb up to the pins of the electronic components in a short time, resulting in defects such as poor soldering. Affect the electrical characteristics of electronic components and reduce the yield of circuit boards.

In view of this, the inventor of the present invention focused on the above-mentioned prior art, especially concentrated research and the application of scientific theory, and tried to solve the above-mentioned problems, which became the goal of the present inventor's improvement.

An object of the present invention is to provide a plug-in hole structure of a circuit board, whereby pins of electronic components are well welded to the plug-in hole, so as to improve the welding speed, reliability and process yield of the circuit board.

In order to achieve the above objective, the present invention is a method of manufacturing a circuit board plug-in hole for inserting at least one electronic component, including: a) providing a substrate, the substrate having a first surface and a second surface opposite to each other Surface; b) drilling a plurality of expansion holes through the first surface and the second surface on the substrate, the expansion holes are arranged at intervals and arranged in a ring; c) drilling through the first surface on the substrate A plug-in hole on one surface and the second surface, the plug-in hole communicates with the expansion holes and forms a plug hole together; and d) a conductive layer is formed on the inner wall of the plug hole in the step c).

In order to achieve the above-mentioned object, the present invention is a plug-in hole structure of a circuit board, which includes a substrate, a plug-in hole, a plurality of expansion holes and a conductive layer. The substrate has a first surface and a second surface opposite to each other; the plug-in hole is provided on the substrate and penetrates the first surface and the second surface; a plurality of expansion holes is provided on the substrate and penetrates the first surface and the second surface, and the expansion holes are arranged at intervals And are arranged in a ring shape on the outer periphery of the plug-in hole, and the expansion hole communicates with the plug-in hole to jointly form the plug hole; and the conductive layer is formed on the inner wall of the plug hole.

Compared with the prior art, the method for manufacturing the plug-in holes of the circuit board of the present invention mainly firstly arranges a plurality of expansion holes spaced in a circular arrangement on the substrate, and then sets the plug-in holes at the center position enclosed by the expansion holes, and The plug-in hole is connected with the expansion hole to form a plug-in hole together, thereby expanding the range of the plug-in hole, and forming a conductive layer on the inner wall of the plug-in hole to complete the electrical connection between the plug-in hole and the circuit board; The pins of the electronic components are inserted into the sockets of the circuit board and sent to the tin furnace for soldering, so that the solder is attached to the conductive layers of the pins and sockets; accordingly, the circuit board of the present invention is When the pins are in the plug-in hole, the welding speed can be accelerated and the welding time can be saved; in addition, the pins of electronic components can be welded well The electronic components are connected to the plug-in hole to combine the electronic components on the circuit board, thereby improving the reliability of the circuit board and the process yield, and increasing the utility of the present invention.

1: circuit board

2: electronic components

3: pin

4: Solder

10: substrate

11: The first surface

12: second surface

20: Plug-in hole

200: Socket hole

30: expansion hole

40: conductive layer

41: The first welding pad

42: The second soldering pad

a)~g): Steps

FIG. 1 is a schematic diagram of the circuit board and electronic components of the present invention before being inserted.

2 is a schematic diagram of the manufacturing method of the plug-in hole of the circuit board of the present invention.

3 to 7 are schematic diagrams of the manufacturing process of the plug-in hole of the circuit board of the present invention.

FIG. 8 is a schematic diagram of the assembly of the circuit board and electronic components of the present invention after being inserted.

The detailed description and technical content of the present invention are described as follows in conjunction with the drawings. However, the drawings are only provided for reference and description, and are not intended to limit the present invention.

Please refer to FIG. 1, which is a schematic diagram of the circuit board and electronic components of the present invention before being inserted. The present invention provides a plug-in hole structure of a circuit board for plugging at least one electronic component 2, including a substrate 10, a plug-in hole 20, a plurality of expansion holes 30 and a conductive layer 40. The plug-in hole 20 and the expansion holes 30 are arranged on the substrate 10, and the conductive layer 40 is arranged on the inner wall surface of the plug-in hole 20 and the expansion holes 30 to form a circuit board 1 accordingly. A more detailed description of the plug-in hole structure and manufacturing method of the circuit board 1 is as follows.

Please also refer to FIG. 2, which is a schematic diagram of the manufacturing process of the plug-in hole of the circuit board of the present invention; and, please also refer to FIGS. 3 to 7, which is a schematic diagram of the manufacturing process of the plug-in hole of the circuit board of the present invention. The method of manufacturing the plug-in hole of the circuit board 1 of the present invention is as follows. As shown in FIG. 3, in step a), first, a substrate 10 is provided. The substrate 10 has a first surface 11 and a second surface 12 opposite to each other; preferably, the substrate 10 is a multi-layer substrate, such as a bakelite board. Or made of glass fiber and other materials.

In addition, please refer to FIG. 4, step b), a plurality of expansion holes 30 penetrating the first surface 11 and the second surface 12 are drilled on the substrate 10, and the expansion holes 30 are arranged at intervals and in a ring shape. arrangement. 5, step c), an insert hole 20 is drilled through the first surface 11 and the second surface 12 in the substrate 10, and the insert hole 20 is connected to the expansion holes 30 and formed together A plug hole 200.

In this embodiment, the plug-in hole 20 is set as a round hole. In addition, the expansion holes 30 are respectively set as half holes, and the two ends of each expansion hole 30 are respectively connected to the periphery of the plug-in hole 20; The expansion holes 30 are arranged radially on the periphery of the plug-in hole 20. For example, the outline of the plug-in hole 200 may be arranged in a plum blossom shape.

Please refer to FIGS. 6 and 7 at the same time. Finally, in step d), a conductive layer 40 is formed on the inner wall surface of the insertion hole 200 (consisting of the insertion hole 20 and the expansion holes 30) in the step c). Preferably, the conductive layer 40 is a copper foil layer, and the conductive layer 40 forms an electrical connection with the circuit (not shown) of the substrate 10.

Specifically, the expansion holes 30 are arranged at intervals and annularly arranged on the outer periphery of the plug hole 20, and the expansion holes 30 are connected to the plug hole 20 to jointly form the plug hole 200. In addition, the conductive layer 40 is formed on the inner wall surface of the insertion hole 200.

In an embodiment of the present invention, the method of manufacturing the plug-in hole 20 of the circuit board 1 further includes step e), forming a first bonding pad 41 on the first surface 11, and forming a first bonding pad 41 on the second surface 12. Two soldering pads 42. The conductive layer 40 is connected to the first soldering pad 41 and the second soldering pad 42. Preferably, the first bonding pad 41, the second bonding pad 42 and the conductive layer 40 are integrally formed through an electroplating process.

That is, the plug-in hole structure of the circuit board 1 further includes a first bonding pad 41 and a second bonding pad 42. The first welding pad 41 is formed on the first surface 11 of the periphery of the insertion hole 200, and the first The two welding pads 42 are formed on the second surface 12 of the periphery of the insertion hole 200. The conductive layer 40 connects the first bonding pad 41 and the second bonding pad 42 to achieve the purpose of mutual conduction.

It should be noted that, in this embodiment, the insertion hole 200 is a Plating Through Hole. In actual implementation, it is not limited to this. The insertion hole 200 can be simply set as a through hole to pass through. The first bonding pad 41 and/or the second bonding pad 42 complete electrical connection.

Please continue to refer to FIG. 8, which is a schematic diagram of the assembly of the circuit board and electronic components of the present invention after being inserted. The method for manufacturing the plug-in hole of the circuit board 1 of the present invention further includes step f), placing an electronic component 2 on the substrate 10 and inserting the pin 3 into the plug hole 200.

Finally, proceed to step g), sending the circuit board 1 with the electronic component 2 inserted into a tin furnace (not shown) with solder 4 so that part of the solder 4 adheres to the pin 3, and , A part of the solder 4 will also adhere to the second soldering pad 42 and the conductive layer 40 of the plug hole 200; it should be noted that at the same time, a part of the solder 4 will adhere to the conductive layer 40 On the first bonding pad 41. Thereby, the pin 3 of the electronic component 2 is combined in the plug hole 200 through the solder 4, and the electronic component 2 is combined on the circuit board 1 accordingly.

For example, assuming that the hole diameter of the plug-in hole 20 provided on a conventional circuit board is 0.66 mm, a plurality of expansion holes 30 are arranged at intervals on the periphery of the plug-in hole 20 and arranged in a ring to form the plug-in hole 200. In addition, The hole diameter of the plug hole 200 is about 1.27 mm. In this case, when welding is performed at the position of the plug hole 200, the welding time can be greatly shortened. For example, when the welding time under the hole diameter of the original plug hole 20 requires 12.5 seconds, change to the plug hole 200 The welding time under the hole diameter can be shortened to 7.5 to 6 seconds; and when the welding time under the hole diameter of the original plug hole 20 needs 5.5 seconds, the welding time under the hole diameter of the plug hole 200 can be shortened to 3.5 second.

Furthermore, when the peripheral edge of the plug-in hole 20 of the conventional circuit board has a large area of soldering pad (copper foil), the solder will flow slowly due to the faster heat dissipation, and the soldering speed will also be slowed down. On the other hand, when the plug hole 200 of the present invention has a larger area of the first solder pad 41 and the second solder pad 42 (a larger area of copper foil), the soldering speed is significantly faster than the conventional one.

In addition, the pin 3 of the electronic component 2 may be partially skewed when inserted into the plug-in hole 20 of the conventional circuit board, resulting in an uneven gap between the pin 3 and the conductive layer 40, resulting in a small gap between the pin 3 and the conductive layer 40. The welding cannot be done reliably. On the other hand, the plug hole 200 of the present invention can be provided with the expansion hole 30 to allow the solder to flow to the place where the gap of the pin 3 is small, thereby improving the soldering yield of the pin 3.

In summary, the circuit board 1 of the present invention accelerates the welding speed through the arrangement of the plug-in hole 200, thereby saving welding time, increasing reliability and improving yield.

The above descriptions are only preferred embodiments of the present invention, and are not intended to determine the patent scope of the present invention. Other equivalent changes using the patent spirit of the present invention should all belong to the patent scope of the present invention.

1: circuit board

2: electronic components

3: pin

10: substrate

11: The first surface

12: second surface

20: Plug-in hole

200: Socket hole

30: expansion hole

40: conductive layer

Claims (10)

A method for manufacturing a plug-in hole of a circuit board for inserting at least one electronic component includes: a) providing a substrate with a first surface and a second surface opposite to each other; b) drilling on the substrate A plurality of expansion holes penetrating the first surface and the second surface, the expansion holes are spaced apart and arranged in a ring shape; c) an insert penetrating the first surface and the second surface is drilled on the substrate The plug hole is connected to the expansion holes and forms a plug hole together; and d) a conductive layer is formed on the inner wall of the plug hole in the step c). The method for manufacturing a plug-in hole of a circuit board according to claim 1, further comprising e) forming a first bonding pad on the first surface, and forming a second bonding pad on the second surface, and the conductive layer is The first welding pad and the second welding pad are connected. The method for manufacturing a plug-in hole of a circuit board according to claim 1, further comprising f) placing the electronic component on the substrate and inserting the pins into the plug-in hole. The method for manufacturing a plug-in hole of a circuit board according to claim 3, which further comprises g) sending the circuit board into which the electronic component is inserted into a tin furnace with solder so that the solder adheres to the plug On the conductive layer of the contact hole, the pins of the electronic component are combined in the insertion hole through the solder. According to the method for manufacturing a plug-in hole of a circuit board according to claim 1, wherein the expansion holes in step b) are respectively set as half holes; the plug-in hole in step c) is set as a round hole. A plug-in hole structure of a circuit board for inserting at least one electronic component, comprising: a substrate having a first surface and a second surface opposite to each other; A plug-in hole is provided on the substrate and penetrates the first surface and the second surface; a plurality of expansion holes is provided on the substrate and penetrates the first surface and the second surface, and the expansion holes are arranged at intervals And are arranged in a ring shape on the outer periphery of the plug-in hole, and the expansion holes are respectively half-opened and communicate with the plug-in hole to form a plug-in hole; and a conductive layer is formed on the inner wall surface of the plug-in hole . The plug-in hole structure of the circuit board according to claim 6, wherein the plug-in hole is a round hole, and the outline of the plug-in hole is plum blossom. The plug-in hole structure of the circuit board according to claim 7, wherein the two ends of each expansion hole are respectively connected to the periphery of the plug-in hole. The plug-in hole structure of the circuit board according to claim 6, which further includes a first bonding pad and a second bonding pad, the first bonding pad is formed on the first surface of the periphery of the plug hole, and the second A soldering pad is formed on the second surface of the periphery of the insertion hole, and the conductive layer is connected to the first soldering pad and the second soldering pad. The plug-in hole structure of the circuit board according to claim 9, wherein the first bonding pad, the second bonding pad and the conductive layer are integrally formed through an electroplating process.

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