TWM599517U - Through hole structure of circuit board - Google Patents

Abstract

This creation is a plug-in hole structure of a circuit board for plugging in electronic components, including a substrate, a plug-in hole, a plurality of expansion holes and a conductive layer. The substrate has a first surface and a second surface; the plug-in holes and a plurality of expansion holes are arranged on the substrate and penetrate the first surface and the second surface; the expansion holes are arranged at intervals and arranged in a ring on the outer periphery of the plug hole, and the expansion holes are connected The plug-in holes together form a plug-in hole; the conductive layer is formed on the inner wall surface of the plug-in hole, so that the pins of the electronic component are well welded to the plug-in hole to improve the process yield of the circuit board.

Description

Plug-in hole structure of circuit board

This creation is about a circuit board structure, especially a solder hole (plug-in hole) structure of a circuit board.

In addition to laying electronic circuits on general circuit boards, there are also some circuit boards that need to be plugged in electronic components; also, because some electronic components have pins, when connecting to the circuit board, the corresponding plug-in hole ( Welding holes), so as to pass through the pins of the electronic component and solder the pins of the electronic component to the back of the circuit board.

Furthermore, in order to achieve rapid and mass production, the electronic component pins on the aforementioned circuit boards are usually tinned by a wave solder process using a soldering furnace so as to pass through the sockets. The pins of the electronic components are connected to the circuit board to achieve the purpose of electrical connection. However, because the wave soldering process usually takes a short time, the heat conduction of the plug-in holes of the circuit board is very slow, so that the tin material in the tin furnace cannot climb up to the pins of the electronic components in a short time, resulting in defects such as poor soldering. Affect the electrical characteristics of electronic components and reduce the yield of circuit boards.

In view of this, the creator has focused on the above-mentioned existing technology, specially researched and cooperated with the application of academic theory, and tried his best to solve the above-mentioned problems, which became the goal of the creator's improvement.

One of the purposes of this creation is to provide a plug-in hole structure for a circuit board, by which the pins of electronic components can be well welded to the plug-in hole, so as to improve the welding speed, reliability and process yield of the circuit board.

In order to achieve the above purpose, this creation is a circuit board plug-in hole structure, including a substrate, a plug-in hole, a plurality of expansion holes and a conductive layer. The substrate has a first surface and a second surface opposite to each other; the plug-in holes are provided on the substrate and penetrate the first surface and the second surface; a plurality of expansion holes are provided on the substrate and penetrate the first surface and the second surface, and the expansion holes are arranged at intervals And are arranged in a ring shape on the outer periphery of the plug-in hole, and the expansion hole communicates with the plug-in hole to jointly form the plug hole; and the conductive layer is formed on the inner wall surface of the plug hole.

Compared with the prior art, the structure of the plug-in hole of the circuit board of this creation is mainly to set a plurality of expansion holes spaced in a circular arrangement on the substrate, and then set the plug-in hole at the center position enclosed by the expansion hole, and make The plug-in hole communicates with the expansion hole to jointly form a plug-in hole, thereby expanding the range of the plug-in hole, and forming a conductive layer on the inner wall of the plug-in hole to complete the electrical connection between the plug-in hole and the circuit board; The pins of the components are inserted into the sockets of the circuit board and sent to the soldering furnace for soldering, so that the solder is attached to the conductive layer of the pins and sockets; accordingly, the circuit board of this creation is connected When the pin is in the plug-in hole, the welding speed can be accelerated and the welding time can be saved; in addition, the pin of the electronic component can be well welded in the plug-in hole so that the electronic component is combined on the circuit board, thereby improving the process yield of the circuit board , Increase the practicality of this creation.

The detailed description and technical content of this creation are described below with the drawings. However, the accompanying drawings are only for reference and explanation, and are not used to limit the creation.

Please refer to Figure 1, which is a schematic diagram of the circuit board and electronic components of this creation before plugging. The present invention provides a plug-in hole structure of a circuit board for plugging at least one electronic component 2, including a substrate 10, a plug-in hole 20, a plurality of expansion holes 30, and a conductive layer 40. The plug-in hole 20 and the expansion holes 30 are arranged on the substrate 10, and the conductive layer 40 is arranged on the inner wall surface of the plug-in hole 20 and the expansion holes 30 to form a circuit board 1 accordingly. A more detailed description of the plug-in hole structure and manufacturing method of the circuit board is as follows.

Please also refer to Fig. 2, which is a schematic diagram of the manufacturing process of the plug-in hole of the circuit board of this creation; and, please also refer to Figs. 3 to 7, which is a schematic diagram of the manufacturing process of the plug-in hole of the circuit board of this creation. The manufacturing method of the plug-in hole of the creative circuit board 1 is as follows. As shown in FIG. 3, in step a), first, a substrate 10 is provided. The substrate 10 has a first surface 11 and a second surface 12 opposite to each other; preferably, the substrate 10 is a multilayer substrate, such as a bakelite board. Or made of glass fiber and other materials.

In addition, please refer to FIG. 4, step b), drill a plurality of expansion holes 30 penetrating the first surface 11 and the second surface 12 on the substrate 10, and the expansion holes 30 are arranged at intervals and in a ring shape arrangement. 5, step c), the substrate 10 is drilled through the first surface 11 and the second surface 12 an insert hole 20, the insert hole 20 is connected to the expansion holes 30 and formed together A plug hole 200.

In this embodiment, the plug-in hole 20 is set as a round hole. In addition, the expansion holes 30 are respectively set as half-openings, and the two ends of each expansion hole 30 are respectively connected to the periphery of the plug-in hole 20; accordingly, the The expansion holes 30 are arranged radially on the periphery of the insertion hole 20. For example, the outline of the insertion hole 200 may be arranged in a plum blossom shape.

Please refer to FIGS. 6 and 7 at the same time. Finally, in step d), a conductive layer 40 is formed on the inner wall of the insertion hole 200 (consisting of the insertion hole 20 and the expansion holes 30) in the step c). Preferably, the conductive layer 40 is a copper foil layer, and the conductive layer 40 forms an electrical connection with a circuit (not shown) of the substrate 10.

Specifically, the expansion holes 30 are arranged at intervals and annularly arranged on the outer periphery of the plug hole 20, and the expansion holes 30 communicate with the plug hole 20 to form the plug hole 200 together. In addition, the conductive layer 40 is formed on the inner wall surface of the insertion hole 200.

In an embodiment of the present invention, the method for manufacturing the plug-in hole 20 of the circuit board 1 further includes step e), forming a first bonding pad 41 on the first surface 11, and forming a first soldering pad 41 on the second surface 12. Two soldering pads 42. The conductive layer 40 is connected to the first soldering pad 41 and the second soldering pad 42. Preferably, the first bonding pad 41, the second bonding pad 42 and the conductive layer 40 are integrally formed through an electroplating process.

That is, the plug hole structure of the circuit board 1 further includes a first solder pad 41 and a second solder pad 42. The first welding pad 41 is formed on the first surface 11 of the periphery of the insertion hole 200, and the second welding pad 42 is formed on the second surface 12 of the periphery of the insertion hole 200. The conductive layer 40 connects the first bonding pad 41 and the second bonding pad 42 to achieve the purpose of mutual conduction.

It should be noted that, in this embodiment, the insertion hole 200 is a Plating Through Hole. In actual implementation, it is not limited by this. The insertion hole 200 can be simply set as a through hole through The first bonding pad 41 and/or the second bonding pad 42 complete the electrical connection.

Please continue to refer to Figure 8, which is a schematic diagram of the assembled circuit board and electronic components created for this creation. The method for manufacturing the plug-in hole of the circuit board 1 of the present invention further includes step f), placing an electronic component 2 on the substrate 10 and inserting the pin 3 into the plug-in hole 200.

Finally, proceed to step g), sending the circuit board 1 with the electronic component 2 inserted into a tin furnace (not shown) with solder 4 so that part of the solder 4 adheres to the pin 3, and , A part of the solder 4 will also adhere to the second solder pad 42 and the conductive layer 40 of the plug hole 200; it should be noted that at the same time, a part of the solder 4 will adhere to the conductive layer 40 On the first bonding pad 41. Thereby, the pin 3 of the electronic component 2 is combined in the socket 200 through the solder 4, and the electronic component 2 is combined on the circuit board 1 accordingly.

For example, assuming that the hole diameter of the plug-in hole 20 provided on a conventional circuit board is 0.66 mm, a plurality of expansion holes 30 are arranged at intervals on the periphery of the plug-in hole 20 and arranged in a ring to form the plug-in hole 200. In addition, The hole diameter of the plug hole 200 is about 1.27 mm. In this case, when welding is performed at the position of the plug hole 200, the welding time can be greatly shortened. For example, when the welding time under the hole diameter of the original plug hole 20 requires 12.5 seconds, change to the plug hole 200 The welding time under the hole diameter can be shortened to 7.5 to 6 seconds; and when the welding time under the hole diameter of the original plug hole 20 needs 5.5 seconds, the welding time under the hole diameter of the plug hole 200 can be shortened to 3.5 second.

Furthermore, when the peripheral edge of the plug-in hole 20 of the traditional circuit board has a large area of soldering pad (copper foil), the solder flow is slow due to the faster heat dissipation, and the soldering speed will also be slow. On the other hand, when the insertion hole 200 of the present invention has a larger area of the first solder pad 41 and the second solder pad 42 (a larger area of copper foil), the soldering speed is significantly faster than the conventional one.

In addition, the pin 3 of the electronic component 2 may be partially skewed when inserted into the plug-in hole 20 of the conventional circuit board, resulting in an uneven gap between the pin 3 and the conductive layer 40, resulting in the pin 3 having a smaller gap. The welding cannot be done reliably. On the other hand, the socket hole 200 of the present invention can be provided with the expansion hole 30 to allow the solder to flow to the place where the gap of the pin 3 is small, thereby improving the soldering yield of the pin 3.

In summary, the circuit board 1 of the present invention accelerates the welding speed through the setting of the socket 200, thereby saving welding time, increasing reliability and improving yield.

The above descriptions are only the preferred embodiments of this creation, and are not used to define the patent scope of this creation. Other equivalent changes using the patent spirit of this creation should all belong to the patent scope of this creation.

1: circuit board

2: electronic components

3: pin

4: Solder

10: substrate

11: First surface

12: second surface

20: Plug-in hole

200: socket

30: expansion hole

40: conductive layer

41: The first welding pad

42: The second solder pad

a)~g): Steps

Figure 1 is a schematic diagram of the circuit board and electronic components of this creation before they are connected.

Fig. 2 is a schematic diagram of the manufacturing method of the socket hole of the circuit board of this creation.

3 to 7 are schematic diagrams of the manufacturing process of the socket holes of the circuit board of this invention.

Figure 8 is a schematic diagram of the circuit board and electronic components of this creation after they are connected.

1: circuit board

2: electronic components

3: pin

10: substrate

11: First surface

12: second surface

20: Plug-in hole

200: socket

30: expansion hole

40: conductive layer

Claims (5)

A plug-in hole structure of a circuit board for plugging at least one electronic component, including: A substrate having a first surface and a second surface opposite to each other; A plug-in hole arranged on the substrate and penetrating the first surface and the second surface; A plurality of expansion holes are provided on the substrate and penetrate through the first surface and the second surface, the expansion holes are arranged at intervals and are arranged annularly on the outer periphery of the plug hole, and the expansion holes communicate with the plug Holes to form a plug hole together; and A conductive layer is formed on the inner wall of the plug hole. The plug-in hole structure of the circuit board according to claim 1, wherein the plug-in hole is a round hole, and the expansion holes are half holes respectively; the expansion holes are arranged radially on the periphery of the plug-in hole. The plug-in hole structure of the circuit board according to claim 2, wherein the two ends of each expansion hole are respectively connected to the periphery of the plug-in hole. The plug-in hole structure of the circuit board according to claim 1, which further includes a first bonding pad and a second bonding pad, the first bonding pad is formed on the first surface of the periphery of the plug hole, and the second A welding pad is formed on the second surface of the periphery of the insertion hole, and the conductive layer is connected to the first welding pad and the second welding pad. The circuit board plug-in hole structure of claim 4, wherein the first bonding pad, the second bonding pad, and the conductive layer are integrally formed through an electroplating process.

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