CN111511124A - Tin soldering method for chip and PCB - Google Patents
Tin soldering method for chip and PCB Download PDFInfo
- Publication number
- CN111511124A CN111511124A CN202010154542.XA CN202010154542A CN111511124A CN 111511124 A CN111511124 A CN 111511124A CN 202010154542 A CN202010154542 A CN 202010154542A CN 111511124 A CN111511124 A CN 111511124A
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- CN
- China
- Prior art keywords
- pcb
- chip
- annular
- solder paste
- pad array
- Prior art date
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- 238000005476 soldering Methods 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims abstract description 21
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 17
- 229910000679 solder Inorganic materials 0.000 claims abstract description 25
- 239000011248 coating agent Substances 0.000 claims abstract description 8
- 238000000576 coating method Methods 0.000 claims abstract description 8
- 229910000831 Steel Inorganic materials 0.000 claims description 22
- 239000010959 steel Substances 0.000 claims description 22
- 238000004806 packaging method and process Methods 0.000 claims description 5
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 230000008054 signal transmission Effects 0.000 abstract description 7
- 238000006467 substitution reaction Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000035772 mutation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a tin soldering method for a chip and a PCB, which comprises the following steps: setting an annular bonding pad according to the size of a chip pin; arranging an annular bonding pad array according to the chip pin pitch; coating solder paste on the PCB by using the annular pad array; and soldering the chip on the PCB by using solder paste. The invention can reduce the cross-sectional area of the soldering tin between the PCB and the chip pin, maintain the continuity of impedance, and improve the quality of signal transmission, thereby improving the stability of server products.
Description
Technical Field
The invention belongs to the technical field of PCB soldering, and particularly relates to a soldering method for a chip and a PCB.
Background
With the development of cloud computing applications, informatization gradually covers various fields of society. People's daily life is more and more exchanging through the network, and the network data volume is also increasing, and is also higher to the performance requirement of server, and signal transmission rate is also improving constantly, and is also higher and higher to the transmission path requirement of high-speed signal on the PCB board, wherein influences the important factor of high-speed signal transmission quality and is impedance, keeps very high homogeneity at the conductor cross section on the PCB board, just can guarantee that impedance keeps the fixed value, and does not fluctuate. If the cross-sectional area of the conductor changes (including becoming larger or smaller), the impedance value locally on the high-speed signal transmission path is changed, resulting in poor transmission quality and data error.
Signals are transmitted from a pin of a chip A to a pad, a copper sheet wire, a pad of a chip B and a chip B through a path, the chip and the PCB are connected through soldering tin in the production process of the board card, the cross section area of the soldering tin is far larger than that of the copper sheet wire on the PCB, the characteristic impedance mutation is caused, and the quality of signal transmission is seriously influenced.
Disclosure of Invention
In view of the above-mentioned deficiencies of the prior art, the present invention provides a method for soldering a chip and a PCB, so as to solve the above-mentioned technical problems.
The invention provides a tin soldering method for a chip and a PCB, which comprises the following steps:
setting an annular bonding pad according to the size of a chip pin;
arranging an annular bonding pad array according to the chip pin pitch;
coating solder paste on the PCB by using the annular pad array;
and soldering the chip on the PCB by using solder paste.
Further, the setting of the annular bonding pad according to the size of the chip pin includes:
the outer diameter of the annular bonding pad is set to be 0.55mm according to the width of a chip pin, and the inner diameter of the annular bonding pad is set to be 0.25 mm.
Further, the setting of the annular pad array according to the chip pin pitch includes:
setting the pad pitch of the annular pad array according to the chip pin pitch;
the size of the annular pad array is set according to the chip size.
Further, the setting of the annular pad array according to the chip pin pitch includes:
projecting the designed annular pad array on the thin steel plate;
reserving a radial connecting part in the annular projection of the thin steel plate;
and removing the annular projection on the thin steel plate except the connecting part by using a drilling machine to obtain the hollow steel mesh.
Further, the thickness of the thin steel plate is 1 mm.
Furthermore, the radial connecting part is a cross-shaped filament with the center at the circle center of the annular welding disc.
Further, the step of coating solder paste to the PCB by using the annular pad array includes:
attaching the hollow steel mesh to a chip packaging position of a PCB, horizontally placing the PCB, and enabling the hollow steel mesh to be on the upper surface of the PCB;
and uniformly coating solder paste on the hollow steel mesh to enable the solder paste to be attached to the PCB through the hollow part.
Further, the soldering the chip on the PCB with solder paste includes:
placing the chip on an area of the PCB coated with the solder paste;
and heating by using a high-temperature furnace until the rosin in the tin paste is completely volatilized and the tin is solidified.
The beneficial effect of the invention is that,
the invention provides a soldering tin method for a chip and a PCB (printed Circuit Board), which reduces the cross-sectional area of soldering tin at the joint of the PCB and the chip, keeps the continuity of characteristic impedance and improves the signal transmission quality by designing an annular bonding pad. The invention can reduce the cross-sectional area of the soldering tin between the PCB and the chip pin, maintain the continuity of impedance, and improve the quality of signal transmission, thereby improving the stability of server products.
In addition, the invention has reliable design principle, simple structure and very wide application prospect.
Drawings
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
FIG. 1 is a schematic diagram of a ring pad structure of a method according to one embodiment of the present application.
FIG. 2 is a schematic illustration of an annular pad array of a method of one embodiment of the present application.
FIG. 3 is a schematic view of a ring of solder paste for a method according to one embodiment of the present application.
Fig. 4 is a schematic diagram comparing the effects of the method according to an embodiment of the present application.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
Example 1
The embodiment provides a soldering method for a chip and a PCB, which comprises the following steps:
step S1, setting an annular bonding pad according to the size of the chip pin;
step S2, an annular pad array is arranged according to the chip pin spacing;
step S3, solder paste is smeared on the PCB by utilizing the annular pad array;
and step S4, soldering the chip on the PCB by using solder paste.
Example 2
The embodiment provides a soldering method for a chip and a PCB, which comprises the following steps:
and S1, setting a ring pad (pad) according to the size of the chip pin.
When designing a package by using allegoro software, a circular pad with a diameter of 0.55mm is established, and then a circular blank area with a diameter of 0.25mm is dug out from the pad by taking the center of the circular pad as a center, so that the shape of the pad is changed into a ring with a single side width of 0.1mm, as shown in fig. 1.
And S2, arranging the annular pad array according to the chip pin pitch.
Because the pin pitch of the chip is 1mm, the annular pads are sequentially arranged according to the pin pitch, and the interval between the annular pads is also 1mm, so that an annular welding disk array is formed. Meanwhile, the size of the packaging area of the chip on the PCB is calculated according to the size of the chip, and the size of the annular bonding pad array is determined according to the size of the packaging area.
The shape of the pad annular part is vertically projected on a thin steel plate with the thickness of 1mm, a reserved part of an annular shadow is designed (the reserved part is a connecting line between an annular inner circle and the outside, a cross-shaped connecting line is adopted in the embodiment, the center of the cross is coincided with the center of the annular shadow), the projected shadow part is drilled away by a drilling machine except for the reserved part, and a hollow steel mesh is manufactured, as shown in fig. 2.
And S3, coating solder paste on the PCB by using the annular pad array.
And attaching the hollow steel mesh to the chip packaging position of the PCB, horizontally placing the PCB, and enabling the hollow steel mesh to be on the upper surface of the PCB. And uniformly coating solder paste on the other surface of the steel mesh, so that the solder paste can be attached to the pad through the hollow area, and thus, annular solder paste with the thickness of 1mm exists on the pad, as shown in fig. 3.
And S4, soldering the chip on the PCB by using solder paste.
The steel mesh is taken down, the chip and the package are aligned up and down, after the chip and the package pass through the high-temperature furnace, rosin inside the solder paste volatilizes, after tin is solidified, the chip and the package are connected together through soldering tin, the connecting area between the chip and the pad is changed into a hollow cylinder with the unilateral thickness of 0.1mm through a solid cylinder with the diameter of 0.55mm, and the cross-sectional area of connection is reduced.
After the welding is finished, the signal quality is tested by using a TDR oscilloscope, and as can be seen from reference to FIG. 4, the signal bulge of the annular bonding pad adopted in the embodiment is obviously reduced, so that the purpose of optimizing the signal quality at the joint of the chip pin and the PCB is achieved.
Although the present invention has been described in detail by referring to the drawings in connection with the preferred embodiments, the present invention is not limited thereto. Various equivalent modifications or substitutions can be made on the embodiments of the present invention by those skilled in the art without departing from the spirit and scope of the present invention, and these modifications or substitutions are within the scope of the present invention/any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (8)
1. A tin soldering method for a chip and a PCB is characterized by comprising the following steps:
setting an annular bonding pad according to the size of a chip pin;
arranging an annular bonding pad array according to the chip pin pitch;
coating solder paste on the PCB by using the annular pad array;
and soldering the chip on the PCB by using solder paste.
2. The method of claim 1, wherein said disposing the annular pad according to chip pin size comprises:
the outer diameter of the annular bonding pad is set to be 0.55mm according to the width of a chip pin, and the inner diameter of the annular bonding pad is set to be 0.25 mm.
3. The method of claim 1, wherein the disposing the annular pad array according to the chip pin pitch comprises:
setting the pad pitch of the annular pad array according to the chip pin pitch;
the size of the annular pad array is set according to the chip size.
4. The method of claim 1, wherein the disposing the annular pad array according to the chip pin pitch comprises:
projecting the designed annular pad array on the thin steel plate;
reserving a radial connecting part in the annular projection of the thin steel plate;
and removing the annular projection on the thin steel plate except the connecting part by using a drilling machine to obtain the hollow steel mesh.
5. A method according to claim 4, characterized in that the thickness of the thin steel plate is 1 mm.
6. The method of claim 4, wherein the radial connection is a cross-shaped filament centered at a center of the annular pad.
7. The method of claim 4, wherein the applying solder paste to the PCB board using the annular pad array comprises:
attaching the hollow steel mesh to a chip packaging position of a PCB, horizontally placing the PCB, and enabling the hollow steel mesh to be on the upper surface of the PCB;
and uniformly coating solder paste on the hollow steel mesh to enable the solder paste to be attached to the PCB through the hollow part.
8. The method of claim 1, wherein the soldering the chip on the PCB with solder paste comprises:
placing the chip on an area of the PCB coated with the solder paste;
and heating by using a high-temperature furnace until the rosin in the tin paste is completely volatilized and the tin is solidified.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010154542.XA CN111511124A (en) | 2020-03-08 | 2020-03-08 | Tin soldering method for chip and PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010154542.XA CN111511124A (en) | 2020-03-08 | 2020-03-08 | Tin soldering method for chip and PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111511124A true CN111511124A (en) | 2020-08-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010154542.XA Pending CN111511124A (en) | 2020-03-08 | 2020-03-08 | Tin soldering method for chip and PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111511124A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111948515A (en) * | 2020-08-11 | 2020-11-17 | 深圳市华讯方舟光电技术有限公司 | Test structure of high-frequency pin |
| CN111993768A (en) * | 2020-08-10 | 2020-11-27 | 深圳市华星光电半导体显示技术有限公司 | Steel mesh for printing solder paste, display panel and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003168759A (en) * | 2001-11-29 | 2003-06-13 | Kyocera Corp | Wiring board |
| TW200604777A (en) * | 2004-07-16 | 2006-02-01 | Hon Hai Prec Ind Co Ltd | Motherboard structure for preventing short circuit |
| CN106102316A (en) * | 2016-08-25 | 2016-11-09 | 广东欧珀移动通信有限公司 | Printed circuit board (PCB) and Wave crest Welding method thereof |
| CN106793486A (en) * | 2016-12-22 | 2017-05-31 | 深圳图正科技有限公司 | A kind of IC package assemblies and its assemble method |
| CN110402022A (en) * | 2019-06-27 | 2019-11-01 | 苏州浪潮智能科技有限公司 | A kind of pcb board and terminal |
-
2020
- 2020-03-08 CN CN202010154542.XA patent/CN111511124A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003168759A (en) * | 2001-11-29 | 2003-06-13 | Kyocera Corp | Wiring board |
| TW200604777A (en) * | 2004-07-16 | 2006-02-01 | Hon Hai Prec Ind Co Ltd | Motherboard structure for preventing short circuit |
| CN106102316A (en) * | 2016-08-25 | 2016-11-09 | 广东欧珀移动通信有限公司 | Printed circuit board (PCB) and Wave crest Welding method thereof |
| CN106793486A (en) * | 2016-12-22 | 2017-05-31 | 深圳图正科技有限公司 | A kind of IC package assemblies and its assemble method |
| CN110402022A (en) * | 2019-06-27 | 2019-11-01 | 苏州浪潮智能科技有限公司 | A kind of pcb board and terminal |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111993768A (en) * | 2020-08-10 | 2020-11-27 | 深圳市华星光电半导体显示技术有限公司 | Steel mesh for printing solder paste, display panel and preparation method thereof |
| CN111993768B (en) * | 2020-08-10 | 2021-09-24 | 深圳市华星光电半导体显示技术有限公司 | Steel mesh for printing solder paste, display panel and preparation method thereof |
| CN111948515A (en) * | 2020-08-11 | 2020-11-17 | 深圳市华讯方舟光电技术有限公司 | Test structure of high-frequency pin |
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| PB01 | Publication | ||
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Application publication date: 20200807 |