TWI732970B - Water treatment method and apparatus - Google Patents
Water treatment method and apparatus Download PDFInfo
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- TWI732970B TWI732970B TW106139248A TW106139248A TWI732970B TW I732970 B TWI732970 B TW I732970B TW 106139248 A TW106139248 A TW 106139248A TW 106139248 A TW106139248 A TW 106139248A TW I732970 B TWI732970 B TW I732970B
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/72—Treatment of water, waste water, or sewage by oxidation
- C02F1/722—Oxidation by peroxides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D61/00—Processes of separation using semi-permeable membranes, e.g. dialysis, osmosis or ultrafiltration; Apparatus, accessories or auxiliary operations specially adapted therefor
- B01D61/02—Reverse osmosis; Hyperfiltration ; Nanofiltration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D61/00—Processes of separation using semi-permeable membranes, e.g. dialysis, osmosis or ultrafiltration; Apparatus, accessories or auxiliary operations specially adapted therefor
- B01D61/02—Reverse osmosis; Hyperfiltration ; Nanofiltration
- B01D61/025—Reverse osmosis; Hyperfiltration
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/008—Control or steering systems not provided for elsewhere in subclass C02F
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/30—Treatment of water, waste water, or sewage by irradiation
- C02F1/32—Treatment of water, waste water, or sewage by irradiation with ultraviolet light
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/30—Treatment of water, waste water, or sewage by irradiation
- C02F1/32—Treatment of water, waste water, or sewage by irradiation with ultraviolet light
- C02F1/325—Irradiation devices or lamp constructions
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/44—Treatment of water, waste water, or sewage by dialysis, osmosis or reverse osmosis
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/44—Treatment of water, waste water, or sewage by dialysis, osmosis or reverse osmosis
- C02F1/441—Treatment of water, waste water, or sewage by dialysis, osmosis or reverse osmosis by reverse osmosis
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/72—Treatment of water, waste water, or sewage by oxidation
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
- C02F2103/02—Non-contaminated water, e.g. for industrial water supply
- C02F2103/04—Non-contaminated water, e.g. for industrial water supply for obtaining ultra-pure water
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
- C02F2103/34—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32
- C02F2103/346—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32 from semiconductor processing, e.g. waste water from polishing of wafers
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2209/00—Controlling or monitoring parameters in water treatment
- C02F2209/22—O2
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Abstract
Description
本發明關於將係處理對象之水的被處理水中所含之有機物進行分解處理的水處理方法及裝置。The present invention relates to a water treatment method and device for decomposing organic matter contained in the water to be treated, which is the water to be treated.
自以往,作為半導體裝置之製造步驟、液晶顯示裝置之製造步驟中所使用的洗滌水等,係使用已將有機物、離子成分、微粒、細菌等高程度除去之超純水等純水。尤其製造包含半導體裝置之電子零件時,其洗滌步驟中使用大量的純水,對於其水質的要求亦日益增加。就電子零件製造之洗滌步驟等中所使用的純水而言,為了防止純水中所含之有機物在之後的熱處理步驟中碳化而引起絕緣不良等,要求水質管理項目之一的總有機碳(TOC;Total Organic Carbon)濃度為極低的水平。Conventionally, as washing water used in the manufacturing steps of semiconductor devices and liquid crystal display devices, pure water such as ultrapure water from which organic matter, ion components, particles, bacteria, and the like have been removed to a high degree has been used. Especially when manufacturing electronic parts including semiconductor devices, a large amount of pure water is used in the washing step, and the requirements for the water quality are also increasing. For the pure water used in the washing step of electronic parts manufacturing, in order to prevent the organic matter contained in the pure water from being carbonized in the subsequent heat treatment step and causing insulation failure, the total organic carbon ( TOC; Total Organic Carbon) concentration is extremely low.
伴隨如此之對於純水水質的高度要求越發明顯,近年來人們研究了各種將純水中所含之微量的有機物(TOC成分)進行分解並除去的方法。作為如此之方法之代表性者,係使用藉由紫外線氧化處理之有機物之分解除去步驟。With such a high demand for pure water quality, various methods have been studied in recent years to decompose and remove trace amounts of organic matter (TOC components) contained in pure water. As a representative of such a method, an organic matter decomposition and removal step by ultraviolet oxidation treatment is used.
一般而言,藉由紫外線氧化處理進行有機物的分解除去時,例如使用具備不銹鋼製的反應槽與設置於該反應槽內之管狀紫外線燈的紫外線氧化裝置,於反應槽內導入被處理水並對被處理水照射紫外線。就紫外線燈而言,例如,使用產生具有254nm與185nm之各波長之紫外線的低壓紫外線燈。對被處理水照射包含185nm之波長的紫外線的話,被處理水中生成羥基自由基(・OH)等氧化物種,藉由該氧化物種之氧化能力,被處理水中的微量有機物分解為二氧化碳、有機酸。以此種方式對於被處理水施以紫外線氧化處理而獲得之處理水,之後送至配置於後段的離子交換裝置,以除去二氧化碳、有機酸。Generally speaking, when the organic matter is decomposed and removed by ultraviolet oxidation treatment, for example, an ultraviolet oxidation device equipped with a reaction tank made of stainless steel and a tubular ultraviolet lamp installed in the reaction tank is used, and the water to be treated is introduced into the reaction tank. The treated water is irradiated with ultraviolet rays. As for the ultraviolet lamp, for example, a low-pressure ultraviolet lamp that generates ultraviolet rays having respective wavelengths of 254 nm and 185 nm is used. When the treated water is irradiated with ultraviolet rays with a wavelength of 185nm, oxide species such as hydroxyl radicals (・OH) are generated in the treated water, and the trace organic matter in the treated water is decomposed into carbon dioxide and organic acid due to the oxidation ability of the oxide species. In this way, the treated water is subjected to ultraviolet ray oxidation treatment to obtain the treated water, and then sent to the ion exchange device arranged in the subsequent stage to remove carbon dioxide and organic acids.
但,一般的利用紫外線氧化裝置之TOC之氧化分解方法中係使用紫外線燈,紫外線燈非常昂貴,儘管如此,隨著使用期間經過,紫外線強度仍會降低,故需要例如1年更換1次左右。故,使用紫外線氧化裝置之TOC之氧化分解處理,存在諸如紫外線燈之更換費用的削減及能量耗費量的削減之抑制運行成本的課題。However, the general oxidative decomposition method of TOC using ultraviolet oxidizers uses ultraviolet lamps, which are very expensive. However, the intensity of ultraviolet rays will still decrease as the period of use passes, so it needs to be replaced about once a year, for example. Therefore, the oxidative decomposition treatment of TOC using the ultraviolet oxidizer has problems such as the reduction of the replacement cost of the ultraviolet lamp and the reduction of energy consumption, such as the reduction of operating costs.
為了提高TOC的分解效率,例如專利文獻1中,就使用低壓紫外線氧化裝置除去被處理水中之TOC的水處理裝置而言,提出了在低壓紫外線氧化裝置之前段設置將氧氣添加至被處理水中的溶存氧濃度調整步驟者。低壓紫外線氧化裝置係使用低壓紫外線燈的氧化裝置。又,專利文獻2中提出了於低壓紫外線氧化裝置之前段,在被處理水中添加預定量的過氧化氫(H2 O2 )。In order to improve the decomposition efficiency of TOC, for example, in Patent Document 1, regarding a water treatment device that uses a low-pressure ultraviolet oxidation device to remove TOC in the water to be treated, it is proposed to install a device that adds oxygen to the water to be treated before the low-pressure ultraviolet oxidation device. Those who adjust the concentration of dissolved oxygen. The low-pressure ultraviolet oxidizer is an oxidizer using low-pressure ultraviolet lamps. In addition, Patent Document 2 proposes to add a predetermined amount of hydrogen peroxide (H 2 O 2 ) to the water to be treated before the low-pressure ultraviolet oxidizer.
近年來,為了因應水資源的枯竭與惡化,大量使用超純水的半導體工廠等中亦強烈希望省水。為了實現省水,將使用過的水回收並再利用係有效,為了提高水回收率,例如有人研究用於將在使用端使用過後的高TOC濃度之排放水進行處理,進一步進行回收並處理的技術。如此之技術一般亦稱為排放水處理技術、排放水回收處理技術等。為了將高TOC濃度之排放水作為生成超純水之原水進行回收並再利用,需將TOC濃度減低至不耗費能量成本,且不會使末端之超純水水質惡化的水平。對高TOC濃度之被處理水進行處理的技術,有對於被處理水添加過氧化氫、臭氧(O3 )等氧化劑,藉由紫外線照射將TOC予以氧化分解的技術。此時,設想被處理水中之TOC濃度為mg/L量級,又,係以原本含有許多各種雜質之被處理水作為對象,故使用例如開放系之反應容器進行紫外線照射。另外,就紫外線源而言,一般使用產生254nm之波長的低壓紫外線燈或高壓紫外線燈。 [先前技術文獻] [專利文獻]In recent years, in order to cope with the depletion and deterioration of water resources, there is also a strong desire to save water in semiconductor factories that use a large amount of ultrapure water. In order to save water, it is effective to recover and reuse the used water. In order to increase the water recovery rate, for example, it is studied to treat the discharged water with high TOC concentration after use at the end of use, and further recover and treat it. Technology. Such technology is generally also referred to as discharge water treatment technology, discharge water recovery treatment technology, etc. In order to recover and reuse the discharged water with high TOC concentration as raw water for generating ultrapure water, the TOC concentration needs to be reduced to a level that does not consume energy costs and does not deteriorate the quality of the ultrapure water at the end. The technology for treating water with high TOC concentration includes adding oxidants such as hydrogen peroxide and ozone (O 3 ) to the water to be treated, and oxidizing and decomposing TOC by ultraviolet irradiation. At this time, it is assumed that the TOC concentration of the water to be treated is on the order of mg/L, and the water to be treated originally contains many various impurities as the object, so for example, an open system reaction vessel is used for ultraviolet irradiation. In addition, as for the ultraviolet source, a low-pressure ultraviolet lamp or a high-pressure ultraviolet lamp that generates a wavelength of 254 nm is generally used. [Prior Art Document] [Patent Document]
[專利文獻1]日本特開2011-167633號公報 [專利文獻2]日本特開2011-218248號公報 [專利文獻3]日本特開平5-305297號公報[Patent Document 1] Japanese Patent Application Publication No. 2011-167633 [Patent Document 2] Japanese Patent Application Publication No. 2011-218248 [Patent Document 3] Japanese Patent Application Publication No. 5-305297
[發明所欲解決之課題] 為了將被處理水中之TOC成分分解除去,一般進行照射紫外線以使TOC成分氧化的處理,但就能將被處理水中之TOC除去多少的觀點來看的話,至今為止的技術難說是最優化的。尤其如專利文獻2所示般添加過氧化氫並進行紫外線氧化處理時,關於優化過氧化氫的添加量,難說是進行了充分的研究。因此,欲提高被處理水中之TOC除去率時,存在紫外線照射量過度增大,所需電力量變大,能量成本上升,又,裝置規模亦變大的課題。[Problem to be solved by the invention] In order to decompose and remove the TOC component in the water to be treated, generally irradiated with ultraviolet rays to oxidize the TOC component, but from the viewpoint of how much TOC can be removed from the water to be treated, so far The technology is hard to say is the most optimized. In particular, when hydrogen peroxide is added and the ultraviolet oxidation treatment is performed as shown in Patent Document 2, it is difficult to say that sufficient research has been conducted on the optimization of the amount of hydrogen peroxide added. Therefore, when an attempt is made to increase the TOC removal rate in the water to be treated, the amount of ultraviolet radiation is excessively increased, the amount of power required increases, the energy cost increases, and the scale of the device also increases.
本發明旨在提供可使裝置小型化,能壓低包括能量成本之運行成本,且可改善有機物之分解效率的水處理方法及裝置。 [解決課題之手段]The present invention aims to provide a water treatment method and device that can miniaturize the device, reduce operating costs including energy costs, and improve the decomposition efficiency of organic matter. [Means to solve the problem]
本案發明人等發現,藉由添加過氧化氫並進行紫外線照射以進行被處理水中之有機物的分解處理時,紫外線氧化處理後之溶存氧濃度與TOC除去率、過氧化氫添加量之間存在相關性,並找出能將過氧化氫添加量控制為最佳的關係,而完成了本發明。亦即,本發明之水處理方法,係對被處理水所含之有機物進行分解處理的水處理方法,具有:於被處理水中添加過氧化氫的過氧化氫添加階段,對於添加有過氧化氫之被處理水照射紫外線的紫外線照射階段,以及測定來自紫外線照射階段之出口水之溶存氧濃度的階段;根據測得之溶存氧濃度,控制過氧化氫添加階段之過氧化氫的添加量。The inventors of this case found that when hydrogen peroxide is added and ultraviolet radiation is applied to decompose the organic matter in the water to be treated, there is a correlation between the dissolved oxygen concentration after the ultraviolet oxidation treatment, the TOC removal rate, and the amount of hydrogen peroxide added. The present invention has been completed by finding out the relationship that can control the amount of hydrogen peroxide added to the best. That is, the water treatment method of the present invention is a water treatment method that decomposes the organic matter contained in the water to be treated. It has a hydrogen peroxide addition stage in which hydrogen peroxide is added to the water to be treated. The treated water is irradiated with ultraviolet rays during the ultraviolet irradiation stage, and the stage of measuring the dissolved oxygen concentration of the outlet water from the ultraviolet irradiation stage; according to the measured dissolved oxygen concentration, the amount of hydrogen peroxide added in the hydrogen peroxide addition stage is controlled.
本發明之水處理裝置,係對被處理水所含之有機物進行分解處理的水處理裝置,具有:過氧化氫添加裝置,於被處理水中添加過氧化氫;紫外線照射裝置,對於添加有過氧化氫之被處理水照射紫外線;溶存氧測定手段,測定紫外線照射裝置之出口水之溶存氧濃度;以及控制手段,根據溶存氧測定手段中測得之溶存氧濃度,控制過氧化氫添加裝置中之過氧化氫的添加量。 [發明之效果]The water treatment device of the present invention is a water treatment device that decomposes and treats the organic matter contained in the water to be treated. It has: a hydrogen peroxide addition device to add hydrogen peroxide to the water to be treated; an ultraviolet irradiation device for the addition of peroxide The treated water of hydrogen is irradiated with ultraviolet rays; the dissolved oxygen measurement means measures the dissolved oxygen concentration in the outlet water of the ultraviolet irradiation device; and the control means controls the hydrogen peroxide addition device based on the dissolved oxygen concentration measured in the dissolved oxygen measurement means The amount of hydrogen peroxide added. [Effects of Invention]
根據本發明,可改善被處理水中之有機物的分解效率,並達成高TOC除去率,藉此,可實現裝置的小型化與運行成本的減低。According to the present invention, the decomposition efficiency of organic matter in the water to be treated can be improved, and a high TOC removal rate can be achieved, whereby the miniaturization of the device and the reduction of operating costs can be achieved.
然後,參照圖示對本發明之較佳實施形態進行說明。Then, a preferred embodiment of the present invention will be described with reference to the drawings.
圖1顯示基於本發明之水處理裝置的基本構成。圖1所示之水處理裝置具備:過氧化氫添加裝置20,於被處理水中添加過氧化氫(H2
O2
);紫外線照射裝置30,與過氧化氫添加裝置20之出口連接,對於添加有過氧化氫之被處理水照射紫外線;係溶存氧測定手段之溶存氧計(DO計)41,測定紫外線照射裝置30之出口水之溶存氧濃度;係控制手段之控制裝置40,根據DO計41測得之溶存氧濃度,控制被處理水中的H2
O2
添加量。過氧化氫添加裝置20具備:儲存H2
O2
之貯槽21、以及與貯槽21之出口連接的脈衝控制型泵浦22,藉由來自控制裝置40之訊號控制泵浦22的脈衝,以使H2
O2
與被處理水混合。控制裝置40接收來自DO計41之溶存氧之測定結果,基於該測定結果發出控制過氧化氫添加裝置20內之泵浦22之脈衝的訊號,並輸出至過氧化氫添加裝置20。Figure 1 shows the basic structure of a water treatment device based on the present invention. The water treatment device shown in Fig. 1 includes: a hydrogen
如後述實施例所示般,本案發明人等發現:對於添加有H2
O2
之被處理水進行紫外線氧化處理時,被處理水中之溶存氧濃度會影響TOC除去率,且紫外線氧化處理後之溶存氧濃度與TOC除去率、H2
O2
的添加量之間存在相關性。尤其當添加H2
O2
時其添加量少的話,無關於H2
O2
的添加量,紫外線氧化處理後之溶存氧濃度亦小,當增加H2
O2
的添加量時,紫外線氧化處理後之溶存氧濃度超過某一值的情況下,TOC除去率不一定會提高。因此,控制裝置40宜以使紫外線照射裝置30之出口水中之溶存氧濃度成為例如不超過0.1mg/L之範圍的方式控制過氧化氫添加裝置20將H2
O2
添加至被處理水中。As shown in the following examples, the inventors of the present case found that when the water to be treated with added H 2 O 2 is subjected to ultraviolet oxidation treatment, the concentration of dissolved oxygen in the water to be treated will affect the TOC removal rate, and the effect after the ultraviolet oxidation treatment There is a correlation between the concentration of dissolved oxygen, the TOC removal rate and the amount of H 2 O 2 added. Especially when the addition amount of H 2 O 2 is small, regardless of the addition amount of H 2 O 2 , the dissolved oxygen concentration after ultraviolet oxidation treatment is also small. When the addition amount of H 2 O 2 is increased, after ultraviolet oxidation treatment When the dissolved oxygen concentration exceeds a certain value, the TOC removal rate may not necessarily increase. Therefore, the control device 40 preferably controls the hydrogen peroxide addition device 20 to add H 2 O 2 to the water to be treated so that the dissolved oxygen concentration in the outlet water of the
就紫外線照射裝置30而言,宜使用照射包含波長為185nm以下之成分之紫外線以進行紫外線氧化處理的紫外線氧化裝置。圖1所示之水處理裝置中,來自紫外線照射裝置30之出口水,係利用該水處理裝置進行處理並供給至外部的水。As for the
添加H2 O2 並進行紫外線照射處理的以往的水處理裝置中,就用於紫外線照射處理之紫外線照射裝置而言,一般使用產生波長254nm之紫外線的殺菌燈、高壓汞燈。又,上述專利文獻2中記載之系統,係藉由循環精製處理製造超純水的系統,係使用產生包含波長185nm之成分之紫外線的低壓紫外線氧化裝置,於被處理水中加入H2 O2 並進行紫外線氧化處理。波長185nm之紫外線一般藉由低壓汞燈產生,低壓汞燈同時也產生波長254nm之紫外線。其比例以強度比計為約1:9,波長254nm之成分的強度較大。波長185nm之紫外線為低強度,但具有可將有機物直接分解的優點。另一方面,波長254nm之紫外線,係藉由與H2 O2 反應生成羥基自由基(・OH)而將有機物予以分解。基於本發明之水處理裝置中所使用的紫外線照射裝置,就紫外線源而言,例如使用產生波長185nm與波長254nm之兩者之紫外線的汞燈,亦可使用除此以外的紫外線源,例如紫外線LED(發光二極體)。In the conventional water treatment device that adds H 2 O 2 and performs ultraviolet irradiation treatment, the ultraviolet irradiation device used for the ultraviolet irradiation treatment generally uses germicidal lamps and high-pressure mercury lamps that generate ultraviolet rays with a wavelength of 254 nm. In addition, the system described in the above-mentioned Patent Document 2 is a system for producing ultrapure water by cyclic purification treatment. It uses a low-pressure ultraviolet oxidizer that generates ultraviolet rays containing components with a wavelength of 185 nm, and adds H 2 O 2 to the water to be treated. Carry out ultraviolet oxidation treatment. Ultraviolet rays with a wavelength of 185nm are generally generated by low-pressure mercury lamps, which also generate ultraviolet rays with a wavelength of 254nm. The ratio is about 1:9 in terms of intensity ratio, and the intensity of the component with a wavelength of 254nm is greater. Ultraviolet light with a wavelength of 185nm is of low intensity, but it has the advantage of directly decomposing organic matter. On the other hand, ultraviolet light with a wavelength of 254nm decomposes organic matter by reacting with H 2 O 2 to generate hydroxyl radicals (・OH). Based on the ultraviolet irradiation device used in the water treatment device of the present invention, as far as ultraviolet sources are concerned, for example, a mercury lamp that generates ultraviolet rays with a wavelength of 185nm and a wavelength of 254nm is used, and other ultraviolet sources, such as ultraviolet rays, may also be used. LED (Light Emitting Diode).
被處理水之溶存氧濃度高的情況下,若欲使紫外線照射裝置30之出口水中之溶存氧濃度成為例如0.1mg/L以下的話,則無法添加有機物分解所需之足夠量的H2
O2
,就結果而言,會有TOC除去率無法提高的情況。此時,宜在過氧化氫添加裝置20之前段設置將被處理水之溶存氧濃度減低的脱氧裝置。圖2所示之水處理裝置,係使用產生包含波長185nm之成分之紫外線的紫外線氧化裝置31作為圖1所示之水處理裝置中進行紫外線氧化處理的紫外線照射裝置30,並於過氧化氫添加裝置20之前段設置脱氧裝置10。就脱氧裝置10而言,只要是能將溶存於水中的氧(O2
)除去即可,可使用任意裝置,例如可使用真空脱氣裝置、膜脱氣裝置及氮氣脱氣裝置中之任意者。考量可減低水中之溶存氧濃度,同時可將揮發性有機物、碳酸等除去至氣相中,而減低該等於水中的濃度的觀點,真空脱氣裝置、膜脱氣裝置及氮氣脱氣裝置為較佳。作為其他脱氧裝置,亦可使用添加氫(H2
)並藉由鈀(Pd)觸媒使氧與氫反應而生成水,以將氧除去者。When the dissolved oxygen concentration of the water to be treated is high, if the dissolved oxygen concentration in the outlet water of the
水中之溶存氧濃度,於大氣壓下飽和時為7~8mg/L左右。即使是溶存氧濃度低的超純水,暴露於大氣中時,立即會有氧溶入,溶存氧濃度上升。故,一般而言,從各種製程排出來的排放水中之溶存氧濃度超過1mg/L,大多數的情況下為接近於大氣壓下之飽和量的值。根據本案發明人等的發現,溶存氧濃度超過1mg/L的話,即使添加H2
O2
並進行紫外線氧化處理,也未必會觀察到TOC除去率的改善。因此,基於本發明之水處理裝置中,設置脱氧裝置10時,宜使脱氧裝置10之出口水之溶存氧濃度成為1mg/L以下。溶存氧會吸收紫外線,因此當溶存氧濃度高時,本來該利用於有機物之分解反應的紫外線量減少,有機物分解變得難以進行。另一方面,藉由將溶存氧某程度地除去,可減小紫外線被吸收的影響。其結果,紫外線有效率地與有機物發生反應而改善TOC除去率。又,藉由紫外線與H2
O2
有效率地反應並生成羥基自由基,羥基自由基與有機物反應而改善TOC除去率。故,藉由使脱氧裝置10之出口水之溶存氧濃度成為1mg/L以下,就基準而言,藉由成為於大氣壓下之飽和量之1/10以下,可更顯著地發揮本發明之效果。更佳為使脱氧裝置10之出口水之溶存氧濃度成為0.5mg/L以下,尤佳為0.1mg/L以下。亦可將溶存氧減低至極低濃度,例如減低至μg/L,但即使進行高度脱氧處理至μg/L之量級,獲得之TOC除去性能也不會有重大的差異。考慮由脱氧處理所需之成本與TOC除去率構成的成本以及相應的效果的話,脱氧裝置10之出口水之溶存氧濃度宜為0.05mg/L以上1mg/L以下。The dissolved oxygen concentration in the water is about 7-8mg/L when saturated at atmospheric pressure. Even the ultrapure water with low dissolved oxygen concentration, when exposed to the atmosphere, oxygen will dissolve immediately and the dissolved oxygen concentration will increase. Therefore, generally speaking, the dissolved oxygen concentration in the discharged water discharged from various processes exceeds 1 mg/L, and in most cases it is a value close to the saturation under atmospheric pressure. According to the findings of the inventors of the present application, if the dissolved oxygen concentration exceeds 1 mg/L, even if H 2 O 2 is added and the ultraviolet oxidation treatment is performed, the TOC removal rate may not necessarily be improved. Therefore, in the water treatment device based on the present invention, when the
圖3顯示基於本發明之水處理裝置之另一構成例。基於本發明之水處理裝置,係藉由紫外線氧化處理將被處理水中之TOC成分予以分解並除去TOC,但當被處理水中之TOC濃度高時,紫外線氧化處理的負荷變得過大,因此,宜在進行紫外線氧化處理之前,具體而言,宜在添加H2
O2
之前減低被處理水之TOC。圖3所示之水處理裝置,係於圖2所示之水處理裝置中之脱氧裝置10之前段設置逆滲透裝置15。被處理水首先供給至逆滲透裝置15,在逆滲透裝置15中減低TOC,之後供給至脱氧裝置10。其結果,圖3所示之水處理裝置中,減輕了紫外線氧化裝置31中之TOC除去的負荷。逆滲透裝置15宜使用逆滲透膜設置成多段的多段處理裝置。藉由使用設置成多段的逆滲透膜,可進一步排除掉TOC,減低紫外線氧化處理的負荷。Fig. 3 shows another configuration example of the water treatment device based on the present invention. Based on the water treatment device of the present invention, the TOC component in the water to be treated is decomposed and removed by ultraviolet oxidation treatment. However, when the TOC concentration in the water to be treated is high, the load of the ultraviolet oxidation treatment becomes too large. Therefore, it is suitable Before the UV oxidation treatment, specifically, it is advisable to reduce the TOC of the water to be treated before adding H 2 O 2. The water treatment device shown in FIG. 3 is provided with a
設置於逆滲透裝置15之逆滲透膜,宜使用TOC除去能力高的逆滲透膜,例如用於海水淡化等之高阻擋率的逆滲透膜。具體而言,特徵為每1MPa有效壓力下之通透通量為0.5m3
/m2
/d以下者。基於本發明之水處理裝置中可使用之逆滲透膜,例如可列舉:Hydranautics公司的SWC系列的膜、東麗公司的TM800系列的膜、DOW公司的SW30系列的膜、栗田工業公司的HR-RO系列的膜等。更具體而言,逆滲透膜可使用Hydranautics公司製的SWC5MAX(0.32m3
/m2
/d)、Hydranautics公司製的SWC6MAX(0.43m3
/m2
/d)、DOW公司製的SW30ULE(0.39m3
/m2
/d)、DOW公司製的SW30HRLE(0.25m3
/m2
/d)、東麗公司製的TM820V(0.32m3
/m2
/d)、東麗公司製的TM820K(0.20m3
/m2
/d)、栗田工業公司製的HR-RO(0.36m3
/m2
/d)等。此處,括號內的數值係該逆滲透膜之每1MPa有效壓力下之通透通量。The reverse osmosis membrane installed in the
此外,通透通量,係將通透水量除以膜面積而得者。「有效壓力」,係JIS K3802:2015「膜用語」記載之將平均操作壓力減去滲透壓差及下游側壓力而得的作用於膜的有效壓力。此外,平均操作壓力為於膜的上游側之膜供給水之壓力亦即運轉壓力與濃縮水之壓力亦即濃縮水出口壓力的平均值,以下式表示。 平均操作壓力=(運轉壓力+濃縮水出口壓力)/2In addition, the permeable flux is obtained by dividing the permeable water volume by the membrane area. "Effective pressure" is the effective pressure applied to the membrane by subtracting the average operating pressure from the osmotic pressure difference and the downstream pressure as described in JIS K3802:2015 "membrane terminology". In addition, the average operating pressure is the average value of the pressure of the membrane feed water on the upstream side of the membrane, that is, the operating pressure, and the pressure of the concentrated water, that is, the outlet pressure of the concentrated water, expressed by the following formula. Average operating pressure = (operating pressure + concentrated water outlet pressure)/2
每1MPa有效壓力下之通透通量,可由膜製造廠商的商品型錄記載之資訊,例如通透水量、膜面積、評價時之回收率、NaCl濃度等計算出。又,於1個或多個壓力容器中裝填有多個通透通量相同的膜時,可由壓力容器之平均操作壓力/下游側壓力、原水水質、通透水量、膜數量等資訊計算出所裝填的膜的通透通量。The permeation flux per 1MPa effective pressure can be calculated from the information recorded in the product catalog of the membrane manufacturer, such as permeable water volume, membrane area, recovery rate during evaluation, NaCl concentration, etc. In addition, when multiple membranes with the same permeable flux are filled in one or more pressure vessels, the average operating pressure of the pressure vessel/downstream pressure, raw water quality, permeable water volume, number of membranes and other information can be used to calculate the filled The permeable flux of the membrane.
逆滲透膜的膜形狀並無特別限定,例如可列舉環狀型、平膜型、螺旋型、中空纖維型等,螺旋型可為4英吋型、8英吋型、16英吋型等中之任意者。The membrane shape of the reverse osmosis membrane is not particularly limited. For example, ring type, flat membrane type, spiral type, hollow fiber type, etc. can be mentioned. The spiral type can be 4 inches, 8 inches, 16 inches, etc. Any of them.
圖3所示之水處理裝置中,逆滲透裝置15係設置於脱氧裝置10之前段,但用於減低紫外線氧化處理之負荷的逆滲透裝置15的位置,只要是在過氧化氫添加裝置20之入口側,可為任意位置。故,亦可如圖4所示般,交換脱氧裝置10與逆滲透裝置15的位置,被處理水首先供給至脱氧裝置10,脱氧裝置10之出口水經由逆滲透裝置15供給至過氧化氫添加裝置20。進一步,在不設置脱氧裝置10之構成中,設置逆滲透裝置15亦係有效。圖5顯示如下之水處理裝置:未設置脱氧裝置10,過氧化氫添加裝置20之入口與逆滲透裝置15連接,藉由逆滲透裝置15減低了TOC之被處理水供給至過氧化氫添加裝置20。In the water treatment device shown in FIG. 3, the
本發明中,亦可在紫外線照射裝置之出口側設置用於除去紫外線氧化處理中之分解產物、來自被處理水之離子性雜質的離子交換裝置。圖6所示之水處理裝置中,對於圖3所示之水處理裝置,進一步設置供給紫外線氧化裝置31之出口水的離子交換裝置35。來自離子交換裝置35之出口水,係利用該水處理裝置進行處理並供給至外部的水。In the present invention, an ion exchange device for removing decomposition products in the ultraviolet oxidation treatment and ionic impurities from the water to be treated can also be installed on the outlet side of the ultraviolet irradiation device. In the water treatment device shown in FIG. 6, the water treatment device shown in FIG. 3 is further provided with an
被處理水所含之有機物中,於接受紫外線氧化處理之前的階段亦含有離子性的物質,而藉由添加H2
O2
進行之紫外線氧化處理,會生成各種有機酸、碳酸等離子性物質。離子交換裝置35將該等離子性物質除去。就離子交換裝置35而言,例如由填充有離子交換樹脂之離子交換塔構成。紫外線氧化裝置31之出口水中之離子性雜質的濃度大時,宜使用再生型離子交換裝置。係紫外線氧化處理所產生之反應產物的有機酸、碳酸,在水中為陰離子的形態,故用於離子交換裝置35之離子交換樹脂至少為陰離子交換樹脂。有機酸、碳酸為弱酸,故為了確實地將它們除去,陰離子交換樹脂宜使用強鹼性陰離子交換樹脂。進一步,藉由使用陰離子交換樹脂與陽離子交換樹脂之混合樹脂作為離子交換樹脂,或使用填充有混合樹脂之混床式離子交換塔作為離子交換塔,可獲得高純度的處理水。The organic matter contained in the water to be treated also contains ionic substances in the stage before receiving the ultraviolet oxidation treatment, and the ultraviolet oxidation treatment by adding H 2 O 2 will generate various organic acids and carbonic acid ionic substances. The
紫外線氧化裝置31之出口水所含之過剩的H2
O2
,有使離子交換裝置35內之離子交換樹脂氧化劣化之虞。因此,宜於離子交換裝置35之前段除去H2
O2
。圖7所示之水處理裝置,係在圖6所示之水處理裝置中之紫外線氧化裝置31與離子交換裝置35之間設置將水中之H2
O2
予以分解的過氧化氫分解裝置37。紫外線氧化裝置31之出口水,通過過氧化氫分解裝置37而除去過氧化氫,之後供給至離子交換裝置35。過氧化氫分解裝置35,例如為填充有活性碳之分解塔。就能以低成本有效地分解H2
O2
者而言,宜使用活性碳。或也可在過氧化氫分解裝置37中,使用鈀(Pd)觸媒將H2
O2
予以分解。 The excess H 2 O 2 contained in the outlet water of the
以上,對基於本發明之水處理裝置的各種構成例進行了說明,該等水處理裝置,例如可用於對TOC濃度為0.1mg/L以上,溶存氧濃度為超過1mg/L之被處理水中的有機物進行分解處理。由後述實施例可知,根據本發明,能以高TOC除去率處理以mg/L之量級含有TOC的被處理水。Above, various structural examples of the water treatment device based on the present invention have been described. These water treatment devices can be used, for example, to treat water with a TOC concentration of 0.1 mg/L or more and a dissolved oxygen concentration of more than 1 mg/L. Organic matter is decomposed. As can be seen from the following examples, according to the present invention, the treated water containing TOC on the order of mg/L can be treated with a high TOC removal rate.
本發明中的被處理水,例如係來自製程排放水者。本發明之水處理方法,可用於回收並處理製程排放水,尤其可用於回收並處理從半導體製造步驟等使用超純水之製程排出來的排放水。利用本發明之水處理方法處理過的水,可作為用於生成超純水之原水使用。故,本發明之水處理方法,可用於將來自使用超純水之製程的排放水進行回收、處理、循環再利用而生成超純水。The water to be treated in the present invention is, for example, the water discharged from the process. The water treatment method of the present invention can be used to recover and treat process discharge water, in particular, it can be used to recover and process discharge water discharged from processes that use ultrapure water such as semiconductor manufacturing steps. The water treated by the water treatment method of the present invention can be used as raw water for generating ultrapure water. Therefore, the water treatment method of the present invention can be used to recover, treat, and recycle the discharged water from a process using ultrapure water to generate ultrapure water.
圖8顯示基於本發明之水處理裝置的應用例。基於本發明之水處理裝置81,係將從使用超純水之製程即超純水使用製程83回收來的回收水作為被處理水,將其進行處理並生成減低了有機物的回收水。超純水使用製程83中使用之超純水,係藉由供給一次純水之超純水製造裝置82製得,來自水處理裝置81之減低了有機物之回收水,與一次純水混合並供給至超純水製造裝置82。圖8所示之系統中,藉由水處理裝置81實現超純水的回收再利用,只需將超純水使用製程83中耗費且無法回收之超純水之分量的一次純水供給至超純水製造裝置82即可,因而可達成大幅的省水。 [實施例]Fig. 8 shows an application example of the water treatment device based on the present invention. Based on the
然後,藉由針對本案發明人等為了完成本發明而進行之實驗結果予以說明,對本發明進行更加詳細地說明。Next, the present invention will be described in more detail by explaining the results of experiments conducted by the inventors of the present application to complete the present invention.
[實驗例1] 組裝圖9所示之構成的裝置。該裝置係對於純水進行藉由膜脱氣所為之脱氧處理後,添加異丙醇(CH3 CH(OH)CH3 ;IPA),進一步添加H2 O2 ,並對於添加有IPA與H2 O2 的水進行紫外線氧化處理。就此處所使用之純水的水質而言,電阻為1MΩ・cm以上,TOC為3μg/L以下,溶存氧濃度為7.8mg/L,H2 O2 濃度為1μg/L以下。該裝置係以含有IPA作為有機物(TOC成分)之純水作為被處理水,並對該被處理水所含之有機物進行分解處理的裝置,添加IPA之前的藉由膜脱氣所為之脱氧處理,可以說是用於減低被處理水之溶存氧濃度的處理。若考慮藉由膜脱氣一般不能除去水中的IPA之情事,利用圖9所示之裝置,可獲得與將含有IPA之被處理水供給至脱氧處理以進行脱氧處理,之後添加H2 O2 並進行紫外線氧化處理之情形相同的結果。[Experimental Example 1] The device with the configuration shown in Fig. 9 was assembled. This device deoxidizes pure water by membrane degassing, adds isopropanol (CH 3 CH(OH)CH 3 ; IPA), further adds H 2 O 2 , and adds IPA and H 2 O 2 water is subjected to ultraviolet oxidation treatment. As far as the water quality of the pure water used here is concerned, the resistance is 1MΩ・cm or more, the TOC is 3μg/L or less, the dissolved oxygen concentration is 7.8mg/L, and the H 2 O 2 concentration is 1μg/L or less. The device uses pure water containing IPA as the organic matter (TOC component) as the water to be treated, and decomposes the organic matter contained in the water to be treated. Deoxidation by membrane degassing before adding IPA, It can be said to be used to reduce the dissolved oxygen concentration of the water to be treated. Considering that the IPA in the water is generally not removed by membrane degassing, the device shown in Figure 9 can be used to obtain and supply the treated water containing IPA to the deoxygenation treatment for deoxygenation treatment, and then add H 2 O 2 and The same result was obtained when UV oxidation treatment was carried out.
圖9所示之裝置中,純水供給至係脱氧裝置之膜脱氣模組11。使用Celgard製「Liqui-Cel G284」作為膜脱氣模組11,利用泵浦12將膜脱氣模組11之氣相側進行減壓,施以脱氣處理以使溶存氧濃度成為預定濃度。對於通過膜脱氣模組11減低了溶存氧濃度的水,藉由貯槽51及泵浦52添加預定量的IPA作為TOC成分。藉此,生成減低了溶存氧濃度的被處理水。進一步,對於該被處理水,藉由貯槽21及泵浦22添加預定量的H2
O2
。將添加有H2
O2
之被處理水的一部分分流出來,分別利用溶存氧計(DO計)56及TOC計57對其溶存氧濃度及TOC濃度進行線上測定。DO計56使用TOA Electronics公司製DO-30A,TOC計57使用Sievers公司製的SIEVERS900型TOC計。利用DO計56測得之溶存氧濃度為膜脱氣模組11之出口水中的溶存氧濃度,亦即於紫外線氧化裝置31之入口之溶存氧濃度。利用TOC計57測得之TOC測定值TOC0為被處理水的TOC濃度。In the device shown in Fig. 9, pure water is supplied to the
將添加有H2
O2
之被處理水中未分流側的水供給至紫外線氧化裝置31。紫外線氧化裝置31使用日本PHOTOSCIENCE公司製JPW-2,在紫外線氧化裝置31內,配置4支產生波長254nm之光與波長185nm之光之兩者的低壓紫外線燈(日本PHOTOSCIENCE公司製的165W之紫外線燈AZ-9000W)作為紫外線燈。利用DO計41測定紫外線氧化裝置31之出口水之溶存氧濃度,同時將紫外線氧化裝置31之出口水的一部分分流出來,並通入離子交換裝置35,利用TOC計58測定來自離子交換裝置35之出口水亦即該水處理裝置之處理水的TOC濃度TOC1。DO計41使用TOA Electronics公司製DO-30A,TOC計58使用Sievers公司製的SIEVERS900型TOC計。The water on the undivided side of the water to be treated to which H 2 O 2 has been added is supplied to the ultraviolet oxidation device 31. The
離子交換裝置35使用混床式離子交換裝置。混床式離子交換裝置係具有丙烯酸樹脂製之圓筒容器(內徑25mm、高度1000mm),並於該容器內填充有300mL混床的離子交換樹脂(EG-5A:奧璐佳瑙公司製)者。此時,離子交換樹脂層的高度為約600mm。The
依下列計算式定義該水處理裝置中之TOC除去率: TOC除去率(%)=((TOC0-TOC1)/TOC0)×100Define the TOC removal rate in the water treatment device according to the following calculation formula: TOC removal rate (%) = ((TOC0-TOC1)/TOC0)×100
如上述般,TOC0係被處理水之TOC濃度,亦即利用TOC計57測得之TOC濃度,TOC1係來自離子交換裝置35之處理水的TOC濃度,亦即利用TOC計58測得之TOC濃度。As mentioned above, TOC0 is the TOC concentration of the water to be treated, that is, the TOC concentration measured by the
藉由膜脱氣模組11調整紫外線氧化裝置31之入口的溶存氧濃度,使其成為50μg/L,並調整IPA的添加量,使被處理水之TOC濃度,亦即於紫外線氧化裝置31之入口的TOC濃度成為500μg/L,於該狀態下將H2
O2
的添加量調整為0mg/L、2.5mg/L、5.0mg/L、10.0mg/L,針對各情形進行TOC除去率、於紫外線氧化裝置31之出口之溶存氧濃度,亦即利用DO計41測得之溶存氧濃度的測定。結果顯示於表1。此外,供給至紫外線氧化裝置31的水量為800L/小時。由該結果可知:藉由添加H2
O2
,TOC除去率得到改善,且被處理液之TOC濃度與於紫外線氧化裝置31之入口之溶存氧濃度為固定的話,過度添加H2
O2
時,反而TOC除去率會降低,於紫外線氧化裝置31之出口之溶存氧濃度上升。由此可知,藉由測定於紫外線氧化裝置31之出口之溶存氧濃度,可將H2
O2
的添加量控制為最佳。The
又,藉由另外略過膜脱氣模組11而將溶存氧濃度調整為7.8mg/L,並將H2
O2
的添加量設定為0mg/L,測定TOC除去率、於紫外線氧化裝置31之出口之溶存氧濃度。其結果亦顯示於表1。此時的TOC除去率為82%,由此可知:藉由將被處理水中之溶存氧濃度減低,並對添加有H2
O2
之被處理水照射紫外線,TOC除去率得到改善。Also, by skipping the
【表1】
[實驗例2] 將被處理水之TOC濃度,亦即於紫外線氧化裝置31之入口的TOC濃度設定為1000μg/L,進一步追加H2
O2
添加量為20.0mg/L的情形,除此以外,以與實驗例1相同的條件進行實驗。結果顯示於表2。由該等也獲得如下結果:藉由將被處理水中之溶存氧濃度減低,並添加H2
O2
,TOC除去率得到改善。[Experimental example 2] The TOC concentration of the water to be treated, that is, the TOC concentration at the entrance of the
又,藉由另外略過膜脱氣模組11而將溶存氧濃度調整為7.8mg/L,並將H2
O2
的添加量設定為0mg/L、2.5mg/L,測定TOC除去率。該等結果亦顯示於表2。可知略過膜脱氣模組11,係不減低溶存氧濃度而幾乎使其維持在大氣壓下之飽和量,但如此般被處理液之溶存氧濃度高的情況下,即使添加H2
O2
,紫外線氧化處理中之TOC除去率亦不會改善。In addition, the dissolved oxygen concentration was adjusted to 7.8 mg/L by skipping the membrane degassing module 11 separately, and the addition amount of H 2 O 2 was set to 0 mg/L and 2.5 mg/L, and the TOC removal rate was measured. These results are also shown in Table 2. It can be seen that skipping the
【表2】
[實驗例3] 將於紫外線氧化裝置31之入口的溶存氧濃度設定為500μg/L,H2
O2
添加量設定為0mg/L、1.5mg/L、2.5mg/L、5.0mg/L,除此以外,以與實驗例1同樣的條件進行實驗。結果顯示於表3。[Experimental example 3] The dissolved oxygen concentration at the entrance of the
【表3】
[實驗例4] 將於紫外線氧化裝置31之入口的溶存氧濃度設定為1000μg/L,H2
O2
添加量設定為0mg/L、1.5mg/L、2.0mg/L、2.5mg/L,除此以外,以與實驗例1同樣的條件進行實驗。結果顯示於表4。[Experimental example 4] The dissolved oxygen concentration at the entrance of the
【表4】
[實驗例5] 藉由膜脱氣模組11調整紫外線氧化裝置31之入口之溶存氧濃度,使其成為50μg/L,調整IPA的添加量,使被處理水之TOC濃度(於紫外線氧化裝置31之入口的TOC濃度)成為100μg/L。於該狀態下將H2
O2
的添加量調整為0mg/L、0.2mg/L、0.4mg/L,針對各情形進行TOC除去率測定。供給至紫外線氧化裝置31的水量為2000L/小時。除此以外,以與實驗例1同樣的條件進行實驗。結果顯示於表5。[Experimental Example 5] The
【表5】
10‧‧‧脱氧裝置
11‧‧‧膜脱氣模組
12、22、52‧‧‧泵浦
15‧‧‧逆滲透裝置
20‧‧‧過氧化氫添加裝置
21、51‧‧‧貯槽
30‧‧‧紫外線照射裝置
31‧‧‧紫外線氧化裝置
35‧‧‧離子交換裝置
37‧‧‧過氧化氫分解裝置
40‧‧‧控制裝置
41、56‧‧‧溶存氧計(DO計)
57、58‧‧‧TOC計
81‧‧‧水處理裝置
82‧‧‧超純水製造裝置
83‧‧‧超純水使用製程
10‧‧‧
【圖1】係顯示基於本發明之水處理裝置之基本構成的圖。 【圖2】係顯示水處理裝置之另一構成例的圖。 【圖3】係顯示水處理裝置之又另一構成例的圖。 【圖4】係顯示水處理裝置之又另一構成例的圖。 【圖5】係顯示水處理裝置之又另一構成例的圖。 【圖6】係顯示水處理裝置之又另一構成例的圖。 【圖7】係顯示水處理裝置之又另一構成例的圖。 【圖8】係顯示基於本發明之水處理裝置之適用例的圖。 【圖9】係顯示實施例中使用之裝置之構成的圖。[Figure 1] is a diagram showing the basic structure of a water treatment device based on the present invention. [Figure 2] is a diagram showing another example of the structure of the water treatment device. [Figure 3] is a diagram showing yet another example of the structure of the water treatment device. [Figure 4] is a diagram showing yet another example of the structure of the water treatment device. [Figure 5] is a diagram showing yet another example of the structure of the water treatment device. [Figure 6] is a diagram showing yet another example of the structure of the water treatment device. [Figure 7] is a diagram showing yet another example of the structure of the water treatment device. [Figure 8] is a diagram showing an application example of the water treatment device based on the present invention. [Fig. 9] is a diagram showing the structure of the device used in the embodiment.
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