TWI731860B - Object holding device, exposure apparatus, manufacturing method of flat panel display, and device manufacturing method - Google Patents

Abstract

The object holding device includes: a holding face (60) having a holding face for holding a substrate; a pipe part (50) having a pipe for controlling the gas between the holding face and the substrate and a holding face (60) placed thereon; and a base The part (40) is provided with the pipe part (50). Furthermore, in the duct section (50), the ducts extend in the first direction, and a plurality of ducts are arranged in a second direction intersecting the first direction.

Description

Object holding device, exposure device, method for manufacturing flat panel display, and method for manufacturing element

The present invention relates to an object holding device, an exposure device, a method for manufacturing a flat panel display, and a method for manufacturing an element. More specifically, it relates to an object holding device including a holding member for holding an object, and an object to be held by the object holding device. Exposure device for exposure, flat panel display using the above-mentioned exposure device, and manufacturing method of device.

Previously, in the lithography step of manufacturing electronic components (micro-components) such as liquid crystal display components and semiconductor components (integrated circuits, etc.), the following exposure device was used, that is, the energy beam was used to form the mask or the reticle ( Hereinafter collectively referred to as "mask") the pattern is transferred to a glass plate or wafer (hereinafter collectively referred to as "substrate").

In this type of exposure apparatus, the substrate holder of the substrate stage device performs flat correction of the substrate along the substrate placement surface by vacuum suction of the substrate so as not to form wrinkles or unevenness (for example, refer to the patent Literature 1).

Here, in recent years, the substrates to be exposed have tended to be thinner, and there is a possibility that the plane of the substrate may be difficult to correct due to the unevenness, grooves, or through holes formed on the substrate mounting surface of the substrate holder.

[Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2004-273702

According to a first aspect of the present invention, there is provided an object holding device including: a holding portion having a holding surface for holding an object; a gas flow path portion having a flow path for controlling the gas between the holding surface and the object, and is placed There is the holding portion; and the base portion on which the gas flow path portion is placed; the flow path is connected to the gas flow path portion, extends in a first direction, and is arranged in a second direction intersecting the first direction Plural.

According to a second aspect of the present invention, there is provided an exposure apparatus including: the object holding device of the first aspect; and a pattern forming device that uses an energy beam to form a predetermined pattern on the object held by the object holding device.

According to a third aspect of the present invention, there is provided a method for manufacturing a flat panel display, including: exposing a substrate used in the flat panel display using the exposure device of the second aspect; and developing the exposed substrate.

According to a fourth aspect of the present invention, there is provided a device manufacturing method, which includes an operation of exposing an object using the exposure device of the second aspect, and an operation of developing the exposed object.

10‧‧‧LCD Exposure Device

20‧‧‧Substrate stage device

30‧‧‧Substrate holder

40‧‧‧Bottom

50‧‧‧Pipeline

60‧‧‧Keep your face

P‧‧‧Substrate

Fig. 1 is a diagram schematically showing the structure of a liquid crystal exposure apparatus according to an embodiment.

Fig. 2 shows the substrate holder of the substrate stage device of the liquid crystal exposure device of Fig. 1 The three-dimensional view.

Fig. 3 is an exploded view of the substrate holder of Fig. 2.

Fig. 4 is a diagram showing a modification of the substrate holder.

Figures 5(a) and 5(b) are diagrams showing the carrying-in and carrying-out bracket devices of the substrate stage device (a side view and a front view, respectively).

Fig. 6(a)~Fig. 6(c) are diagrams for explaining the exchange action of the substrate on the substrate holder (Part 1~Part 3).

Figures 7(a) and 7(b) are diagrams (fourth and five) for explaining the exchange action of the substrate on the substrate holder.

Figures 8(a) and 8(b) are diagrams showing a holder cleaning device (a side view and a front view, respectively) included in the substrate stage device.

Figures 9(a) and 9(b) are diagrams (side view and front view, respectively) for explaining the cleaning action (part one) of the substrate holder using the holder cleaning device.

Figures 10(a) and 10(b) are diagrams (side view and front view, respectively) for explaining the cleaning action (part 2) of the substrate holder using the holder cleaning device.

Figures 11(a) and 11(b) are diagrams (side view and front view, respectively) for explaining the cleaning action (part 3) of the substrate holder using the holder cleaning device.

Fig. 12 is a diagram for explaining the cleaning action (fourth) of the substrate holder using the holder cleaning device.

Fig. 13 is a diagram for explaining the cleaning action (part 5) of the substrate holder using the holder cleaning device.

Figure 14 is used to illustrate the cleaning action of the substrate holder using the holder cleaning device (the Six) the picture.

Fig. 15 is a diagram showing a modification (part 1) of the holder cleaning device.

Fig. 16 is a diagram showing a modification (part 2) of the holder cleaning device.

Fig. 17 is a diagram showing a modification (part 3) of the holder cleaning device.

Fig. 18 is a diagram showing a modification (part 4) of the holder cleaning device.

Hereinafter, an embodiment will be described using FIGS. 1 to 14.

FIG. 1 schematically shows the structure of a liquid crystal exposure apparatus 10 according to an embodiment. The liquid crystal exposure device 10 is a step-and-scan projection exposure device, a so-called scanner, which combines a rectangular (square) glass substrate P (hereinafter referred to as substrate P) used in, for example, liquid crystal display devices (flat panel displays). ) As the exposure target.

The liquid crystal exposure device 10 includes an illumination system 12, a mask stage device 14 for holding a mask M formed with patterns such as circuit patterns, and a projection optical system 16, coating the surface (the surface facing the +Z side in FIG. 1) The substrate stage device 20 holding the substrate P of the resist (sensor), and the control system for these. Hereinafter, the relative scanning direction of the exposure light mask M and the substrate P with respect to the projection optical system 16 is defined as the X-axis direction, and the direction orthogonal to the X-axis in the horizontal plane is defined as the Y-axis direction. The direction of the handover is assumed to be the Z-axis direction for description.

The lighting system 12 is configured in the same manner as the lighting system disclosed in the specification of US Patent No. 5,729,331, for example. The illumination system 12 uses light emitted from a light source (such as a mercury lamp) not shown in the figure to pass through a reflector, a dichroic mirror, a shutter, a wavelength selection filter, various lenses, etc., which are not shown, as exposure light (illumination light). Light) IL irradiates the mask M. As illuminating light For IL, for example, light such as i-ray (wavelength 365nm), g-ray (wavelength 436nm), h-ray (wavelength 405nm) or the like (or a combined light of the above-mentioned i-ray, g-ray, and h-ray) is used.

The mask stage device 14 holds the mask M by vacuum suction, for example. The mask stage device 14 is driven with a predetermined long stroke at least in the scanning direction (X-axis direction) by a mask stage driving system (not shown) including a linear motor, for example. The position information of the mask stage device 14 is obtained by, for example, a mask stage measurement system (not shown) including a linear encoder system.

The projection optical system 16 is disposed under the mask stage device 14. The projection optical system 16 is a so-called multi-lens projection optical system having the same configuration as the projection optical system disclosed in the specification of US Patent No. 6,552,775, etc., for example, is provided with a plurality of optical systems that form an upright image that is telecentric on both sides.

In the liquid crystal exposure apparatus 10, if the illuminating light IL from the illuminating system 12 illuminates the mask M located in a predetermined illumination area, the illuminating light that has passed through the mask M transmits through the projection optical system 16. The projected image of the pattern of the mask M in the illumination area (the image of a part of the pattern) is formed in the exposure area on the substrate P. Furthermore, with respect to the illumination area (illumination light IL), the mask M relatively moves in the scanning direction, and with respect to the exposure area (illumination light IL), the substrate P relatively moves in the scanning direction, thereby performing one exposure on the substrate P In the scanning exposure of the irradiation area, the pattern formed on the mask M (the entire pattern corresponding to the scanning range of the mask M) is transferred to the exposure irradiation area. Here, the illumination area on the mask M and the exposure area on the substrate P (irradiation area of the illumination light) are in a relationship that is optically conjugated to each other by the projection optical system 16.

The substrate stage device 20 includes a platen 22, a substrate stage 24, a self-weight support device 26, and a substrate holder 30.

The pressure plate 22 is configured such that the upper surface (+Z surface) is parallel to the XY plane. It is composed of a rectangular plate-shaped member in a plan view (viewed from the +Z side), and is installed on the floor F via an anti-vibration device not shown. The substrate stage 24 is composed of a thin box-shaped member having a rectangular shape in plan view. The self-weight supporting device 26 is downloaded and placed on the platen 22 in a non-contact state, and supports the self-weight of the substrate table 24 from below. The substrate holder 30 is integrally fixed on the upper surface of the substrate table 24. Also, although not shown, the substrate stage device 20 includes a substrate stage drive system, including a linear motor, for example, and moves the substrate stage 24 (and the substrate holder 30) along the X-axis and Y-axis directions (along the XY plane). ) Drive with a predetermined long stroke, and micro drive in 6 degrees of freedom (X-axis, Y-axis, Z-axis, θx, θy, and θz) directions; and substrate stage measurement system, such as optical interferometer system, etc. , Obtain the position information of the substrate holder 30 in the 6-degree-of-freedom direction.

The substrate holder 30 is composed of a thin box-shaped member with a rectangular overall shape in a plan view, and the substrate P is placed on the upper surface (the +Z side surface). The aspect ratio of the upper surface of the substrate holder 30 is approximately the same as that of the substrate P, but the lengths of the long and short sides of the upper surface of the substrate holder 30 are set to be slightly shorter than the lengths of the long and short sides of the substrate P, respectively In the state where the substrate P is placed on the upper surface of the substrate holder 30, the vicinity of the ends of the four sides of the substrate P protrudes outward from the substrate holder 30. This is because the resist applied on the surface of the substrate P may also adhere to the back side near the end of the substrate P, and the resist does not adhere to the substrate holder 30.

As can be seen from FIGS. 2 and 3, the substrate holder 30 includes a base portion 40, a pipe portion 50 and a holding surface portion 60. The base portion 40, the duct portion 50, and the holding surface portion 60 are each formed in a rectangular plate shape in a plan view as a whole. The substrate holder 30 has a pipe portion 50 arranged (laminated) on the base portion 40, and further has a holding surface portion 60 arranged (laminated) on the pipe portion 50, whereby the whole has a three-layer structure. In the present embodiment, the base portion 40, the pipe portion 50, and the holding surface portion 60 are fixed to each other by, for example, an adhesive, but the present invention is not limited to this. For example, they may be fastened to each other by bolts. Moreover, guarantee The holding portion 60 and the pipe portion 50 may also be fixed to each other by vacuum suction. Moreover, the holding surface part 60 and the duct part 50 may be comprised so that attachment and detachment and exchange are possible.

The base portion 40 as the lowermost layer is formed thicker than the pipe portion 50 and the holding surface portion 60. Although the structure of the base portion 40 is not particularly limited, it is desirably lightweight and high rigidity (especially high rigidity in the thickness direction). The base portion 40 of the present embodiment is provided with a so-called sandwich structure, that is, for example, the upper surface, the lower surface, and each side surface of a honeycomb structure plate-shaped member (not shown) formed of aluminum alloy, for example, are attached with CFRP. (carbon-fiber-reinforced plastic, carbon fiber reinforced plastic) made of plate-shaped members, lightweight and high rigidity, and easy to manufacture.

The pipeline portion 50 as the intermediate layer includes a plurality of (for example, 13 in FIGS. 2 and 3) corner tubes 52 extending in the X-axis direction and having a rectangular cross-section of YZ. In addition, the number of corner tubes 52 is not particularly limited. The dimension of the long side direction (X-axis direction) of the corner tube 52 is set to be substantially the same as the dimension of the base part 40 in the X-axis direction. In this embodiment, a gap narrower than the width direction (Y-axis direction) dimension of the diagonal tube 52 is formed between the adjacent diagonal tubes 52, but there may be no gap between the adjacent diagonal tubes 52.

Both ends in the longitudinal direction of each corner tube 52 are closed by a cover member (not shown). In addition, a joint (not shown) for gas piping is attached to one of the pair of cover members installed at both ends of the angle tube 52 in the longitudinal direction. In addition, in the present embodiment, the above-mentioned unillustrated joint is installed at the ends of all corner pipes 52, but it is not limited to this. For example, it may be installed only on a part of a plurality of corner pipes 52.

A through hole 58 is formed at a predetermined position on the upper surface of the corner tube 52 (all the corner tubes 52 in this embodiment) to which the above-mentioned joints are installed among the plurality of corner tubes 52 (refer to FIG. 3). In addition, in FIG. 3, the through hole 58 is larger than the actual figure. Moreover, the substrate holder shown in Figure 3 In 30, for example, one or two through holes 58 are formed per one corner tube 52, but the number of through holes 58 formed in one corner tube 52 is not particularly limited.

The holding surface 60 as the uppermost layer is a part holding the substrate P (refer to FIG. 1), and has a plurality of flat plates 62. The flat plate 62 is formed of, for example, black granite (gabbro) or ceramics, and its thickness is set to, for example, about 5 mm to 10 mm. The entire surface of each flat plate 62 (the surface facing the +Z side in FIGS. 2 and 3) is finished to be very flat. In addition, in the present embodiment, for example, 15 flat plates 62 are laid on the pipe section 50 (a plurality of corner pipes 52) with substantially no gaps (at intervals of substantially negligible gaps), whereby the holding surface 60 is formed, but the flat plates The number of blocks of 62 is not particularly limited. For example, it may be 14 blocks or less (for example, 1 block), or 16 blocks or more.

A plurality of (for example, 15 in this embodiment) through holes 68 for gas ejection and/or vacuum suction are formed in the holding surface 60. The positions of the plurality of through-holes 68 are formed at positions corresponding to the positions of the plurality of through-holes 58 formed in the pipe section 50, that is, on the holding surface 60 (the plurality of flat plates 62) overlap the pipe section 50 ( In the state (refer to FIG. 2) on the plurality of corner tubes 52), the position where the through hole 58 and the through hole 68 overlap in the up-down direction (the same position in the XY plane). The through hole 58 is formed by mechanical processing using a drill or the like, for example. In addition, in FIGS. 2 and 3, the through hole 68 is larger than the actual illustration. Furthermore, in this embodiment, one through hole 68 is formed for each flat plate 62, but it is not limited to this. For example, a plurality of through holes 68 may be formed in one flat plate 62, or may be formed in a corner tube according to The positional relationship of the through holes 58 of 52 is that among the plurality of flat plates 62, there are flat plates 62 in which the through holes 68 are not formed. Among them, the plurality of through holes 68 are desirably formed at substantially equal intervals to cover the entire surface of the upper surface (substrate mounting surface) of the substrate holder 30.

Moreover, in this embodiment, the holding face 60 is arranged by arranging a plurality of flat plates 62 The rows are formed (by laying), and therefore, it is preferable that there is no step difference between the plates 62. In the assembly of the substrate holder 30, as an example, for example, on a flat member such as the platen 22 (refer to FIG. 1), a plurality of flat plates 62 are placed on one surface (the surface on the side that functions as the substrate placement surface after assembly) The plurality of flat plates 62 and the plurality of corner tubes 52 are fixed by an adhesive, for example, in a state where they are arranged and placed in a downward facing state. Thereby, one surface of the plurality of flat plates 62 can be respectively imitated on the surface of the pressure plate 22 and joined without step. In addition, the assembling sequence of the substrate holder 30 is not limited to this. For example, a plurality of corner tubes 52 constituting the pipe section 50 may be arranged on the platen 22 and assembled to form a surface that mimics the surface of the platen 22. After the plane is flat, a plurality of flat plates 62 constituting the holding surface 60 are arranged on the pipe portion 50 (the plane imitating the surface of the pressure plate 22). Alternatively, after assembling a plurality of corner tubes 52 that constitute the pipe portion 50 that is not smooth (not a single plane formed by the plurality of corner pipes 52), the adhesive may be applied to the pipe portion 50 (the plurality of corner pipes 52). ), and arrange a plurality of flat plates 62 on the pipe section 50 (adhesive), thereby forming a plane. Furthermore, as the assembly sequence of the substrate holder 30, the order of the holding face 60, the pipe part 50, and the base part 40, that is, the upper side of the substrate holder 30 first (in order from the upper side) is to be assembled. The situation has been explained, but it is not limited to this, and it may be assembled by stacking the upper side members in order from the lower side.

The joints (not shown) attached to the plurality of corner pipes 52 constituting the pipeline section 50 can be switched (selectively) connected to the outside of the substrate holder 30, not shown, via pipe members such as pipe bodies. Vacuum device and pressurized gas supply device not shown. The vacuum device sucks the air inside the corner tube 52, and the diagonal tube 52 supplies vacuum suction. The substrate holder 30 sucks the air between the upper surface of the holding surface 60 and the substrate P (see FIG. 1) placed on the holding surface 60 through the through holes 58 and 68 by the aforementioned vacuum suction force. With this, the base The plate P is sucked and held on the holding face 60, and substantially the entire surface is along (imitated) the upper surface of the holding face 60 (a plurality of flat plates 62) to obtain a plane correction. In addition, the case where the flow of gas is formed by a plurality of corner pipes 52 in the pipeline portion 50 has been described, but the configuration of the pipeline portion 50 is not limited to this, and can be appropriately changed. For example, a groove may be formed on the surface of a plate-shaped member, and another plate-shaped member (cover) may be superimposed on the plate-shaped member, thereby forming the pipe section 50 (gas flow path). In this case, the duct section 50 is composed of two plate-shaped members. Moreover, in this case, the base part 40 may be used as the other plate-shaped member (cover) mentioned above, and the holding surface part 60 may be used as the other plate-shaped member (cover) mentioned above. In this case, the duct part 50 can be formed by one plate-shaped member.

Furthermore, pressurized gas (for example, compressed air) is supplied from the inside of the diagonal pipe 52 from the aforementioned pressurized gas supply device. The substrate holder 30 ejects (discharges) pressurized gas through the through holes 58 and 68 to the lower surface of the substrate P (see FIG. 1) placed on the holding surface 60. Thereby, the board|substrate P will be in the state which left (floating) substantially the whole surface with respect to the upper surface of the holding surface part 60.

The switching between the supply of the vacuum suction force and the supply of the pressurized gas is appropriately performed by a main control device not shown, for example, via a valve or the like. By appropriately switching the supply of vacuum suction to the substrate holder 30 and the supply of pressurized gas, the main control device can arbitrarily switch between vacuum suction and holding of the substrate P on the substrate holder 30 and non-contact support of the substrate P on the substrate. Keeper 30.

In addition, the main control device may generate a time difference in the timing of discharging the pressurized gas by using a plurality of through holes 68 formed in the holding surface 60, or appropriately exchange the through holes 68 for vacuum suction and the discharge of pressurized gas. The part of the hole 68, or use suction and exhaust to appropriately change the air pressure, so as to optimize the grounding state of the substrate P (for example, the back of the substrate P No air will be trapped between it and the upper surface of the substrate holder 30). In addition, it is also possible to connect a vacuum device to a part of a plurality of corner tubes 52, and connect a pressurized gas supply device to the remaining corner tubes 52 that are not connected to the vacuum device. In this case, in the substrate holder 30, the part where the substrate P is adsorbed and held is separated from the part where the substrate P is non-contacted and supported, and the control is easy.

Here, in the present embodiment, the pipe section 50 is composed of a plurality of members (corner pipes 52), but as long as it can supply pressurized gas or vacuum suction to substantially the entire upper surface of the holding surface 60, the pipe The structure of the path portion 50 can be appropriately changed. For example, it may be an integrated structure like the pipe portion 50A of the substrate holder 30A shown in FIG. 4. The pipe section 50A is a sandwich structure in which, for example, a plurality of strip-shaped plates 54c (longitudinal ribs) formed of CFRP extending in the X-axis direction and parallel to the XZ plane are spaced apart at predetermined intervals in the Y-axis direction. It is arranged between a pair of thin plates 54a and 54b formed by CFRP. In the substrate holder 30A, both ends of the pipeline formed by the plates 54a to 54c are also closed by a cover member not shown. In addition, a through hole may be formed in the plate 54c to communicate with a pair of adjacent pipes. In this case, there is no need to install joints for gas piping in all of the multiple pipelines. In this case, in order to prevent the CFRP from generating static electricity, the CFRP may be coated. Moreover, the material forming the pipe portion 50 (corner tube 52) is not limited to CFPR, and may be metal materials such as aluminum and stainless steel. Furthermore, as a material for forming the duct portion 50, a material having a linear expansion coefficient different from at least one of the material forming the base portion 40 and the material forming the holding surface portion 60 is preferably used. Thereby, the force acting in the arrangement direction (the Y-axis direction in FIGS. 2 and 3) of the plurality of flow paths forming the pipe section 50 can be dispersed.

Furthermore, the substrate stage device 20, as shown in FIG. 5(a), includes a pair (one is stacked on the inner side of the paper, so it is not shown) carrying out carriage device 70a for carrying out the substrate P from the substrate holder 30 (Refer to Figure 1) the action; and a pair (refer to Figure 5 (b)) to carry in the carriage device 70b, It is used to carry the substrate P into the substrate holder 30. A pair of carry-out bracket devices 70a are arranged at a predetermined interval along the Y-axis direction on the +X side of the substrate holder 30, and a pair of carry-in bracket devices 70b are arranged at a predetermined interval along the Y-axis direction on the −X side of the substrate holder 30.

The structure of the pair of carrying-in bracket devices 70b is substantially the same except for the configuration difference, and therefore, the following description will be given to one carrying-in bracket device 70b. The carry-in bracket device 70b includes a holding pad 72b, a Z actuator 76z, and an X actuator 76x. The holding pad 72b can be partially inserted into the cutout 32b (not shown in FIGS. 2 and 3) formed on the upper surface of the substrate holder 30 (holding surface 60 (see FIG. 2 and the like)). The holding pad 72b can suck and hold the vicinity of the end on the -X side of the substrate P (see FIG. 1) from the lower surface side by vacuum suction supplied from a vacuum device not shown.

The holding pad 72b is mounted on the X actuator 76x via a shaft 74 extending in the Z-axis direction, and is driven by the X actuator 76x with a predetermined stroke in the X-axis direction. Furthermore, the X actuator 76x (that is, the holding pad 72b) is driven by the Z actuator 76z mounted on the substrate table 24 with a predetermined stroke in the Z-axis direction.

The structure of each of the pair of carry-out bracket devices 70a is substantially the same as that of the carry-in bracket device 70b except for the configuration and function. That is, the carrying-out bracket device 70a includes a holding pad 72a that can be partially inserted into the cutout 32a (not shown in FIGS. 2 and 3) formed on the upper surface of the substrate holder 30 to support the holding pad 72a. The X actuator 76x driven by the shaft 74 in the X axis direction, and the Z actuator 76z used to drive the X actuator 76x (ie, the holding pad 72a) in the Z axis direction, so that the substrate can be sucked and held from the lower surface side Near the end of P (refer to Figure 1) on the +X side.

Next, use FIGS. 6(a) to 7(b) to explain the exchange operation of the substrate P on the substrate holder 30 using the unloading bracket device 70a and the loading bracket device 70b. Bright. The following substrate exchange operations are performed under the management of the main control device not shown.

FIG 6 (a), the holding completion of exposure of _one substrate P substrate holder 30 for unloading the substrate P _1, is positioned at the predetermined substrate exchange position. The substrate holder 30 from the substrate mounting surface of the pressurized gas below _a surface of the substrate P is ejected, the floating substrate P _1. At this time, the pair of suction devices 70a near the unloading carriage holding the substrate P + X side end of _1. The main control device drives the pair of holding pads 72a of the carrying-out bracket device 70a in the +X direction with a predetermined stroke (for example, about 50 mm to 100 mm). Thereby, the _{vicinity of the +X-side end of the substrate P 1} protrudes from the vicinity of the +X-side end of the substrate holder 30. Then, to the substrate exchange position located above the substrate holder 30, the following ₁ after exposure of the substrate P ₂ P substrate by the substrate transfer robot hand 36 with the conveyance.

Next, as shown in FIG. 6( b ), _{the portion near the end of the +X side of the substrate P 1} that is not held by the pair of carry-out bracket devices 70 a is sucked and held by the substrate carry-out device 34. One pair of carriage unloading means 70a releasing of _holding the substrate P is attracted. Then, above the substrate holder 30, the P conveyed to the vicinity of the end portion of the _substrate above the substrate P ₂ -X side of the apparatus by one pair of brackets 70b adsorption loading remains.

Then, as shown in FIG 6 (c), the main control unit 34 by the substrate carry-out device to drive the + X direction, the movement of the substrate P ₁ + X direction. P ₁ to the substrate holder 30 on the substrate surface and a substrate stage arranged on the + X side of the apparatus 20 of the guide as the guide beams move parallel to the horizontal plane is substantially above the ground surface 38, since the substrate holder 30 to the The guide beam 38 is moved up. Beam 38 has an air bearing guide, the substrate P moves in the _one pair of discharge below the surface of _a substrate P of pressurized gas, whereby the non-contact support the substrate P _1. Also, the substrate holder 30 is also pressurized by the gas discharge surface of the substrate under P _1, and functions equally with the air bearing.

In addition, in parallel with the above-mentioned _{unloading operation of the substrate P 1} , the robot hand 36 moves to the +X side at a high acceleration, thereby retreating from above the substrate holder 30. In this case, the manipulator 36 in order to reduce the friction between the _substrate P, and the robot 36 under _a surface of the substrate P is ejected pressurized gas. If the robot hand 36 retreats from above the substrate holder 30, the substrate P ₂ is held by a pair of carry-in bracket devices 70b near the end of the −X side, and thus remains above the substrate holder 30.

The loss of support from the bottom of the robot 36 moves the substrate P ₂ (dropped) by its own weight downward direction of gravity, as shown in FIG 7 (a), the land on the substrate holder 30. In addition, the main control device also lowers and drives the pair of holding pads 72b carried in the carriage device 70b. At this time, the substrate P ₂ moves slowly at an acceleration smaller than the acceleration of gravity due to the air resistance between the substrate P _{2 and the upper surface of the substrate holder 30.} Moreover, the substrate holder 30 continues to spray pressurized gas from the upper surface after the _{substrate P 1 is carried out, thereby alleviating the impact of the substrate P 2} on the substrate holder 30 when it is landed.

Furthermore, since the pressurized gas is ejected from the substrate holder 30, the substrate P _{2 is} landed on the substrate holder 30 between the substrate P ₂ and the upper surface (substrate mounting surface) of the substrate holder 30. A tiny gap is formed by the static pressure of the above-mentioned pressurized gas. Based on the output of the substrate position measuring system (not shown), the main control device causes a pair of holding pads to be carried into the carrier device 70b in _{the state where the above-mentioned minute gap is formed (the substrate P 2 is supported by the substrate holder 30 in a non-contact state)} 72b independently minute driving the X-axis direction, thereby aligning the substrate ₂ of P.

After completion of the alignment operation, FIG. 7 (b), the substrate holder 30 to stop the discharge of the pressurized gas, and the substrate P ₂ held by vacuum suction. A pair of holding pads 72b of the carried-in bracket device 70b are accommodated in the cutout 32b of the substrate holder 30 (refer to FIG. 5(a)).

Next, the cleaning device of the substrate holder 30 will be described. In the conventional substrate holder (so-called ejector pin type substrate holding device) that supports the substrate P from below by a plurality of pins In the substrate holder), the dirt attached to the upper surface of the substrate holder falls between the plurality of pins, so the possibility of directly attaching to the back surface of the substrate P is low. On the other hand, as described above, in the substrate holder 30 of the present embodiment, the holding surface 60 that functions as a substrate placing surface is formed flat by a plurality of flat plates 62, so that dirt is directly attached to the substrate placing surface. The possibility of face is high.

Therefore, as shown in FIGS. 8(a) and 8(b), the substrate stage device 20 of this embodiment has a cleaning device 80 that includes a cleaning device 80 for cleaning the upper surface of the substrate holder 30 (substrate mounting Surface) of the cleaner 90. The cleaning device 80 has a pair of support blocks 82a spaced along the X-axis direction on the +Y side and -Y side of the substrate holder 30, respectively. A pair of support blocks 82a are installed on the side surface of the substrate holder 30 through the angle steel 82b having an L-shaped cross section of YZ. Furthermore, a guide rod 84a extending in the X-axis direction is bridged between the pair of supporting blocks 82a. The guide rod 84a is provided with a slider 84b (for example, a linear bush) that can move freely in the X-axis direction along the guide rod 84a.

A plate-shaped base member 86 extending in the -X direction is mounted on the slider 84b. The base member 86 axially supports a pair of link members 88 arranged in parallel to each other in the longitudinal direction of the middle portion thereof so as to be rotatable around the Y-axis direction.

The cleaner 90 is composed of a member with a rectangular XZ cross-section extending in the Y-axis direction. The length of the Y-axis direction is set in such a way that the end on the ±Y side protrudes outward from the end on the ±Y side of the substrate holder 30 It is slightly longer than the length in the Y-axis direction of the upper surface of the substrate holder 30 (holding surface 60 (refer to FIGS. 2 and 3)). The cleaner 90 is formed of, for example, a porous body using PVA (polyvinyl alcohol) as a raw material. The cleaner 90 is inserted between the vicinity of the upper end of the pair of link members 88 on the +Y side of the substrate holder 30 and the vicinity of the upper end of the pair of link members 88 on the -Y side of the substrate holder 30 , And is pivotally supported by the link member 88 rotatably around the Y-axis direction. In addition, the cleaner 90 may not be directly installed on the link member 88, for example, for exchange and position adjustment. It is easy to install and can be installed via other components.

The cleaner 90 is arranged in such a way that its lower surface is parallel to the upper surface of the substrate holder 30. If each link member 88 rotates in the Y-axis direction relative to the base member 86, it will maintain the posture in the XZ plane (cleaning Under the condition that the parallel between the lower surface of the device 90 and the upper surface of the substrate holder 30 is maintained, it rotates around the Y-axis direction. In addition, tapered recesses 92 are formed in the vicinity of both ends of the upper surface of the cleaner 90, respectively. The function of the recess 92 will be described later.

In the vicinity of the lower end of the pair of link members 88, there is attached an auxiliary plate member 96 in which a notch groove 94 that opens upward (+Z side) is formed. The pair of link members 88 are respectively attached to the auxiliary plate member 96 rotatably around the direction of the Y axis.

9(a) and 9(b) show a state in which the above-mentioned carry-in bracket device 70b and the cleaning device 80 are combined. In the state where the slider 84b (and the base member 86) is located on the most -X side of the movable range, the cleaner 90 and the notch groove 94 formed in the auxiliary plate member 96 will not become an obstacle to the above-mentioned substrate exchange operation. It is arranged on the outer side (-X side) of the substrate holder 30. The rotation range of the cleaner 90 is restricted by the restriction pin 82c attached to the angle steel 82b.

Next, the operation of the cleaning device 80 will be described. In this embodiment, the cleaning operation of the substrate holder 30 is performed in a state where the substrate holder 30 is located at a predetermined cleaning position. The cleaning position is not particularly limited, and may be the same as the above-mentioned substrate exchange position, for example. In the state where the substrate holder 30 is in the cleaning position, above (for example, the top surface) of the substrate holder 30, as shown in Figure 9(a) and Figure 9(b), an actuator for fixing the cleaner is arranged器98. The actuator 98 is spaced apart in the Y-axis direction to correspond to the recess 92 of the above-mentioned cleaner 90, and is provided as a pair.

From the state shown in Fig. 9(a) and Fig. 9(b), the main control device, not shown, as shown in Fig. 10(a) and Fig. 10(b), moves the axis 74 of the carriage device 70b to − Drive in Z direction, The control pin 78 attached to the shaft 74 is fitted into the notch groove 94 formed in the auxiliary plate member 96. In addition, when the shaft 74 is driven in the -X direction in a state where the control pin 78 is fitted in the notch groove 94, the auxiliary plate member 96 moves in the -X direction. Thereby, as shown in FIGS. 11(a) and 11(b), the cleaner 90 is rotated via a pair of link members 88, and the lower surface of the cleaner 90 is in contact with the upper surface of the substrate holder 30 (opposite) .

Then, as shown in FIG. 12, the main control device drives the actuator 98 and inserts the ball 98 a of the actuator 98 into the recess 92 of the cleaner 90. Thereby, the relative movement of the cleaner 90 in the XY plane with respect to the actuator 98 is restricted. Then, the shaft 74 of the carrying-in bracket device 70b is driven in the +Z direction, and thereby the control pin 78 is separated from the slit groove 94.

In this state, the main control device drives the substrate holder 30 with a long stroke in the -X direction as shown in FIG. 13. The moving speed of the substrate holder 30 at this time is not particularly limited, but it is preferably, for example, a speed that is slower than the moving speed of the substrate holder 30 during the scanning exposure operation. Thereby, the cleaner 90 and the substrate holder 30 relatively move along the X-axis direction. Furthermore, the base member 86 supporting the cleaner 90 via the link member 88 moves along the guide rod 84a integrally with the slider 84b. FIG. 14 shows a state where the cleaning of the surface of the substrate holder 30 is completed. Through the cleaning action described above, the dirt attached to the surface of the substrate holder 30 is removed by the cleaner 90.

In addition, the material of the cleaner 90 can be appropriately changed, and for example, stone, metal, synthetic resin, etc. may also be used. Moreover, the cleaner 90 may be an air bearing that discharges pressurized gas in a non-contact manner with respect to the substrate holder 30, or, like the cleaning device 80A shown in FIG. 15, a roller-type cleaner 90A may also be used. In this case, the frictional resistance between the cleaner 90A and the substrate holder 30 is reduced, and the cleaner 90A and the substrate holder 30 can move relatively smoothly.

Moreover, it is also possible to install a high-pressure nozzle in the cleaner 90 to blow off the dirt and also Perform vacuum suction. Furthermore, a brush may be installed on the cleaner 90, and the substrate holder 30 may be moved while cleaning. Furthermore, it is also possible to wipe the surface of the substrate holder 30 while discharging water or steam from the cleaner 90. Moreover, it may be a combination of these.

Moreover, in the above-mentioned embodiment, the substrate holder 30 is moved relative to the fixed position cleaner 90 to clean the substrate holder 30. However, for example, as shown in FIG. 16, the X driving device 98A may be fitted into The actuator 98 in the state of the cleaner 90 moves relative to the substrate holder 30 in the X-axis direction, thereby cleaning the substrate holder 30. Furthermore, as shown in FIG. 17, a hook 36A may be attached to the robot hand 36 for substrate transfer, and the robot hand 36 can move the cleaner 90 relative to the substrate holder 30. In this case, the hook 36A can be brought into spherical contact with the fastening part of the cleaner 90 to suppress the generation of dust, or an air bearing or a magnet can be used for non-contact fastening. Moreover, like the cleaning device 80B shown in FIG. 18, the slider 84b can also be driven relative to the substrate holder 30 by the X drive device 84c installed between the pair of supporting blocks 82a. As the X drive device, you can use: a belt drive device that uses a linear motor and a rotary motor, a traction drive device that uses a metal wire, a rack and pinion drive device, etc.

According to the substrate holder 30 of the present embodiment described above, since most of the substrate mounting surface (the upper surface of the substrate holder 30) is a flat surface, for example, compared with the conventional ejector pin type substrate holder, even the substrate P Plane correction can be performed reliably even with thinning. Moreover, since the unevenness is minimal, the reflectance or amount of reflection is approximately constant, and uneven transfer caused by exposure is unlikely to occur. Therefore, high-precision exposure becomes possible.

Furthermore, the base part 40 of the honeycomb structure, the piping part 50 composed of a plurality of corner tubes 52, and the holding face part 60 formed of stone or CFRP are used for the three-layer structure substrate holder 30 which is lightweight and highly rigid, and the substrate The surface of the holder 30 is excellent in flatness. Moreover, the substrate is solid The holder 30 functions as an air bearing, so that the substrate P can be completely floated on the substrate holder 30. Therefore, the substrate holder 30 can function as a lower surface guide for sliding out the substrate P.

Furthermore, the holding surface 60 whose upper surface functions as a substrate placement surface is formed of, for example, a flat plate 62 of black granite (gabbro) or ceramics. Therefore, the surface has high rigidity, and even if it repeatedly contacts the substrate P, there is little wear. Moreover, the reflectivity is low, and even if it is worn, the reflectivity is less likely to change. Moreover, because it is a brittle material, even if the surface is damaged, it will not bulge like a metal material. Moreover, because the surface is hard, it is easy to perform feed processing with a small amount of cutting by grinding or polishing, and as a result, the flatness is easily improved. Moreover, since the heat capacity is large and the temperature change is slow, it is difficult to cause rapid deformation such as the deformation of the substrate P. Furthermore, in the case of stone or porous ceramics, the ringing effect between the substrates P is not easily caused due to the presence of minute holes.

Furthermore, between the base portion 40 and the holding surface portion 60, the pipe portion 50 formed by a plurality of corner pipes 52 is arranged as an intermediate layer, so that the production of the gas pipe path and the flatness adjustment of the substrate placement surface can be easily performed. In addition, the piping joint is arranged on the side surface of the substrate holder 30, and therefore, compared with the case where gas is supplied from the bottom surface of the substrate holder 30 to the pipe part 50 through the base part 40, the rigidity of the base part 40 can be suppressed from decreasing. And the structure of the base part 40 becomes simple, and assembly or maintenance becomes easy.

Furthermore, in the present embodiment, when the substrate P is placed on the substrate holder 30, the substrate P is caused to drop due to its own weight. At this time, for the substrate P, due to the air resistance between the back surface of the substrate P and the surface of the substrate holder 30, the force (air resistance) that hinders the drop caused by its own weight is exerted. Moreover, in this embodiment, the surface of the substrate holder 30 is substantially flat, so the substrate The air between the back surface of the board P and the surface of the substrate holder 30 will not escape, and the above-mentioned air resistance can be reliably caused to act on the substrate P. Therefore, the substrate P can be slowly landed on the substrate holder 30.

In addition, the structure of the above-mentioned embodiment can be changed suitably. For example, in the substrate holder 30 of the above-mentioned embodiment, the through holes 58 are formed in all of the plurality of corner tubes 52 of the pipe section 50, and the (closed) corner tubes 52 that are not formed with the through holes 58 may be prepared. , By supplying pressurized gas to the sealed corner tube 52 (or vacuum suction of the gas in the corner tube 52) to deform the corner tube 52, thereby controlling the surface of the substrate holder 30 (holding surface 60) The flatness. In this case, it is possible to make the upper surface of the substrate holder 30 a high-precision plane without relying on the processing of the holding surface 60.

Furthermore, in the above-mentioned embodiment, the plurality of flat plates 62 forming the holding surface 60 are mechanically formed with a plurality of through holes 68, but as long as the pressurized gas supplied from the pipe portion 50 can be ejected or from the pipe portion 50 The suction of the gas by the supplied vacuum suction force is not limited to this. For example, the flat plate 62 may be formed by a porous member, and the ejection of the pressurized gas and the suction of the gas may be performed through the minute holes of the porous member. In addition, in the substrate holder 30 of the above-mentioned embodiment, the area of the base portion 40, the pipe portion 50, and the holding surface 60 in a plan view are set to be approximately the same, but as long as the overlapped arrangement is not limited to this, the area of these Can be different from each other. Moreover, the substrate holder 30 of the above-mentioned embodiment performs both the discharge of the pressurized gas and the suction of the gas, but it is not limited to this, and only one of them may be performed.

Furthermore, in the above-mentioned embodiment, the pipe portion 50 is formed by a plurality of corner pipes 52, but it is not limited to this. A groove may be formed on the surface of the plate-shaped member, and the base portion 40 or the holding surface may be overlapped on the plate-shaped member. 60, thereby forming the pipe portion 50 (the flow path of the gas). In this case, the base portion 40 or the holding surface 60 may also be the same as the surface facing the plate-shaped member forming the duct portion 50 A groove is formed at the corresponding position of the groove.

Moreover, the light source used in the illumination system 12 and the wavelength of the illumination light IL irradiated from the light source are not particularly limited. For example, ArF excimer laser light (wavelength 193nm), KrF excimer laser light (wavelength 248nm) and other ultraviolet rays are not particularly limited. Vacuum ultraviolet light such as light or F2 laser light (wavelength 157nm).

Furthermore, in the above-mentioned embodiment, an equal magnification system is used as the projection optical system 16, but it is not limited to this, and a reduction system or an enlargement system may also be used.

Moreover, the use of the exposure device is not limited to the exposure device for the liquid crystal that transfers the pattern of the liquid crystal display element to the square glass plate. It can also be widely used in, for example, the manufacture of organic EL (Electro-Luminescence) panels. Exposure equipment, exposure equipment used in semiconductor manufacturing, exposure equipment used in the manufacture of thin film magnetic heads, micro-machines, DNA wafers, etc. Moreover, not only the manufacture of micro-elements such as semiconductor elements, but also the production of photomasks or reticles used in photoexposure equipment, EUV exposure equipment, X-ray exposure equipment, and electronic beam exposure equipment, etc., to transfer circuit patterns Exposure devices to glass substrates or silicon wafers.

Moreover, the object to be exposed is not limited to a glass plate, and may be other objects such as a wafer, a ceramic substrate, a film member, or a blank mask. In addition, when the exposure target is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and may include, for example, a film-like (a flexible sheet-like member). In addition, the exposure apparatus of this embodiment is particularly effective when a substrate having a length of one side or a diagonal length of 500 mm or more is an exposure target. Moreover, when the substrate of the exposure target is a flexible sheet, the sheet may also be formed in a roll shape.

Electronic components such as liquid crystal display elements (or semiconductor elements) go through the following steps And manufacturing, that is, the step of designing the function and performance of the device, the step of making a photomask (or reticle) based on the design step, and the step of making a glass substrate (or wafer) by the above-mentioned various embodiments. Exposure device and its exposure method. The lithography step of transferring the pattern of the photomask (reticle) to the glass substrate, the developing step of developing the exposed glass substrate, and the part other than the part where the resist remains by etching. The etching step to remove the exposed components, the resist removal step to remove the resist that is not needed after the etching is completed, the component assembly step, the inspection step, etc. In this case, in the lithography step, the above-mentioned exposure method is performed using the exposure device of the above-mentioned embodiment, and the device pattern is formed on the glass substrate, so that a high-integrity device can be manufactured with good productivity.

[Industrial availability]

As explained above, the object holding device of the present invention is suitable for holding objects. Moreover, the exposure device of the present invention is suitable for exposing objects. Moreover, the manufacturing method of the flat panel display of the present invention is suitable for the manufacturing of the flat panel display. Moreover, the device manufacturing method of the present invention is suitable for the manufacture of micro devices.

30‧‧‧Substrate holder

40‧‧‧Bottom

50‧‧‧Pipeline

52‧‧‧Angle Tube

60‧‧‧Keep your face

62‧‧‧Plate

Claims (18)

An object holding device comprising: a holding portion having a holding surface for holding an object; a gas flow path portion having a flow path forming member that constitutes a flow path through which gas supplied between the holding surface and the object can flow, and is placed There are the holding portion; and the base portion on which the gas flow path portion is placed. The gas flow path portion is configured such that the flow path extends in a first direction and is arranged in a second direction intersecting the first direction. Furthermore, the flow path forming member is formed so that the gas flowing through the flow path can be supplied between the holding surface and the object through a through hole formed in a placement surface on which the holding portion is placed. For example, the object holding device of the first item of the scope of patent application, wherein the holding portion includes a plurality of holding members provided with the holding surface. For example, the object holding device of item 1 or 2 of the scope of patent application, wherein the gas flow path portion includes a plurality of flow path members provided with the flow path. As for the object holding device of claim 1 or 2, wherein the holding portion or the base portion is joined to the flow path forming member formed with the flow path in such a manner that the groove formed in the flow path forming member constitutes the flow path. The area other than the slot area. For example, the object holding device of item 1 or 2 of the scope of patent application, wherein the holding portion has at least one first through hole, and the flow path communicates with the first through hole. For example, the object holding device of item 5 of the scope of patent application, wherein the mounting surface has at least a second through hole through which the gas can pass, The flow path forming member is configured such that the gas flowing through the flow path is supplied between the holding surface and the object through the first and second through holes. For example, the object holding device according to the first or second patent application, wherein the flow path forming member constitutes a suction path through which the gas sucked from between the holding surface and the object can flow. For example, the object holding device of item 1 or 2 of the scope of patent application, wherein the above-mentioned base has a blank space layer formed with a plurality of blank spaces. For example, the object holding device of claim 8, wherein the base portion is configured to sandwich the empty space layer by a first member on one side of the empty space layer and a second member on the other side. For example, the object holding device of the first or second patent application, wherein the base portion, the holding portion, and the gas flow path portion are formed in a plate shape, and are stacked on top of each other. For example, the object holding device of item 1 or 2 of the scope of patent application, wherein the holding part is formed of stone or ceramics. For example, the object holding device of the first or the second item of the scope of patent application is further provided with a driving device for holding a part of the outer peripheral portion of the object held on the holding surface to drive the object. For example, the object holding device of item 12 of the scope of patent application, which further includes a cleaning device, including a cleaning member arranged to be movable between an opposing position facing the holding surface and a spaced position separated from the placing surface, Cleaning the holding surface by relatively moving the cleaning member with respect to the holding portion, The cleaning member is driven between the facing position and the spaced position by the driving device. An exposure device includes: an object holding device as described in any one of items 1 to 13 in the scope of patent application; and a pattern forming device that uses an energy beam to form a predetermined pattern on the object held by the object holding device. Such as the exposure device of item 14 of the scope of patent application, wherein the above-mentioned object system is used for the substrate of flat panel display. Such as the exposure device of the 15th patent application, wherein the length of at least one side or the diagonal length of the above-mentioned substrate is 500mm or more. A method for manufacturing a flat panel display includes: exposing the above-mentioned substrate using an exposure device such as item 15 or 16 of the scope of patent application; and developing the above-mentioned exposed substrate. A method for manufacturing a device includes: exposing the above-mentioned object using the exposure device as claimed in item 14 of the scope of patent application; and developing the above-mentioned exposed object.

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