TWI728695B - 用於判定與半導體晶圓之質量相關之資訊之方法與裝置 - Google Patents

用於判定與半導體晶圓之質量相關之資訊之方法與裝置 Download PDF

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Publication number
TWI728695B
TWI728695B TW109104472A TW109104472A TWI728695B TW I728695 B TWI728695 B TW I728695B TW 109104472 A TW109104472 A TW 109104472A TW 109104472 A TW109104472 A TW 109104472A TW I728695 B TWI728695 B TW I728695B
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TW
Taiwan
Prior art keywords
semiconductor wafer
weight
quality
weighing device
measurement
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TW109104472A
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English (en)
Chinese (zh)
Other versions
TW202021006A (zh
Inventor
羅伯特 約翰 威比
艾德恩 克瑪茲
Original Assignee
英商美特拉斯有限公司
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Publication of TW202021006A publication Critical patent/TW202021006A/zh
Application granted granted Critical
Publication of TWI728695B publication Critical patent/TWI728695B/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G19/00—Weighing apparatus or methods adapted for special purposes not provided for in the preceding groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
    • B06B1/0648—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element of rectangular shape
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G17/00—Apparatus for or methods of weighing material of special form or property
    • G01G17/02—Apparatus for or methods of weighing material of special form or property for weighing material of filamentary or sheet form
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G3/00—Weighing apparatus characterised by the use of elastically-deformable members, e.g. spring balances
    • G01G3/12—Weighing apparatus characterised by the use of elastically-deformable members, e.g. spring balances wherein the weighing element is in the form of a solid body stressed by pressure or tension during weighing
    • G01G3/16—Weighing apparatus characterised by the use of elastically-deformable members, e.g. spring balances wherein the weighing element is in the form of a solid body stressed by pressure or tension during weighing measuring variations of frequency of oscillations of the body
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
    • G01H11/08—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW109104472A 2013-09-04 2014-09-04 用於判定與半導體晶圓之質量相關之資訊之方法與裝置 TWI728695B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB1315715.1 2013-09-04
GBGB1315715.1A GB201315715D0 (en) 2013-09-04 2013-09-04 Method and device for determining information relating to the mass of a semiconductor wafer

Publications (2)

Publication Number Publication Date
TW202021006A TW202021006A (zh) 2020-06-01
TWI728695B true TWI728695B (zh) 2021-05-21

Family

ID=49397261

Family Applications (2)

Application Number Title Priority Date Filing Date
TW109104472A TWI728695B (zh) 2013-09-04 2014-09-04 用於判定與半導體晶圓之質量相關之資訊之方法與裝置
TW103130650A TWI688021B (zh) 2013-09-04 2014-09-04 用於判定與半導體晶圓之質量相關之資訊之方法與裝置

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW103130650A TWI688021B (zh) 2013-09-04 2014-09-04 用於判定與半導體晶圓之質量相關之資訊之方法與裝置

Country Status (7)

Country Link
US (1) US9903750B2 (OSRAM)
EP (1) EP3042164B1 (OSRAM)
JP (1) JP6449889B2 (OSRAM)
GB (1) GB201315715D0 (OSRAM)
SG (1) SG11201601091PA (OSRAM)
TW (2) TWI728695B (OSRAM)
WO (1) WO2015033108A1 (OSRAM)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201315715D0 (en) * 2013-09-04 2013-10-16 Metryx Ltd Method and device for determining information relating to the mass of a semiconductor wafer
GB201405926D0 (en) * 2014-04-02 2014-05-14 Metryx Ltd Semiconductor wafer weighing apparatus and methods
JP6953242B2 (ja) * 2017-09-06 2021-10-27 株式会社ディスコ 高さ検出装置、及びレーザー加工装置
GB201806377D0 (en) * 2018-04-19 2018-06-06 Metryx Ltd Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology method
CN113029070B (zh) * 2019-12-25 2023-04-18 中国科学院微电子研究所 一种监测原子层沉积薄膜生长厚度的方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4156361A (en) * 1976-01-14 1979-05-29 Sartorius-Werke Gmbh Calibratable electromagnetically compensating balance
US5625170A (en) * 1994-01-18 1997-04-29 Nanometrics Incorporated Precision weighing to monitor the thickness and uniformity of deposited or etched thin film
TW200625016A (en) * 2004-10-12 2006-07-16 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
TW200818258A (en) * 2006-07-28 2008-04-16 Asml Netherlands Bv Lithographic apparatus, method of calibrating a lithographic apparatus and device manufacturing method
US20080087106A1 (en) * 2006-10-11 2008-04-17 Robert John Wilby Measuring apparatus
US20090090564A1 (en) * 2007-10-05 2009-04-09 Neopost Technologies High Capacity and High Resolution Scale
TW200943014A (en) * 2008-01-07 2009-10-16 Metryx Ltd Method of controlling semiconductor device fabrication
US20100206098A1 (en) * 2007-10-04 2010-08-19 Robert John Wilby Semiconductor wafer metrology apparatus and method
TW201043931A (en) * 2009-03-31 2010-12-16 Memc Electronic Materials Systems and methods for weighing a pulled object
US8173283B2 (en) * 2008-11-27 2012-05-08 Kyocera Corporation Ceramic substrate

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2913962B2 (ja) * 1991-11-27 1999-06-28 株式会社島津製作所 板状試料測定用天びん
JP2576338B2 (ja) * 1992-07-31 1997-01-29 株式会社島津製作所 ウエハ自動秤量システム
JP3652021B2 (ja) * 1996-07-23 2005-05-25 三洋機工株式会社 重量測定方法
JP4420646B2 (ja) * 2003-10-09 2010-02-24 花王株式会社 荷重測定装置
GB0719460D0 (en) * 2007-10-04 2007-11-14 Metryx Ltd Measurement apparatus and method
JP5289918B2 (ja) * 2008-12-10 2013-09-11 アンリツ産機システム株式会社 重量選別装置
JP2013088393A (ja) * 2011-10-21 2013-05-13 Daihatsu Motor Co Ltd 重量差測定装置
PL2690415T5 (pl) * 2012-07-23 2022-10-10 Mettler-Toledo Gmbh Siłomierz z ciężarkiem przesuwnym
GB201315715D0 (en) * 2013-09-04 2013-10-16 Metryx Ltd Method and device for determining information relating to the mass of a semiconductor wafer

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4156361A (en) * 1976-01-14 1979-05-29 Sartorius-Werke Gmbh Calibratable electromagnetically compensating balance
US5625170A (en) * 1994-01-18 1997-04-29 Nanometrics Incorporated Precision weighing to monitor the thickness and uniformity of deposited or etched thin film
TW200625016A (en) * 2004-10-12 2006-07-16 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
TW200818258A (en) * 2006-07-28 2008-04-16 Asml Netherlands Bv Lithographic apparatus, method of calibrating a lithographic apparatus and device manufacturing method
US20080087106A1 (en) * 2006-10-11 2008-04-17 Robert John Wilby Measuring apparatus
US20100206098A1 (en) * 2007-10-04 2010-08-19 Robert John Wilby Semiconductor wafer metrology apparatus and method
US20090090564A1 (en) * 2007-10-05 2009-04-09 Neopost Technologies High Capacity and High Resolution Scale
TW200943014A (en) * 2008-01-07 2009-10-16 Metryx Ltd Method of controlling semiconductor device fabrication
US8173283B2 (en) * 2008-11-27 2012-05-08 Kyocera Corporation Ceramic substrate
TW201043931A (en) * 2009-03-31 2010-12-16 Memc Electronic Materials Systems and methods for weighing a pulled object

Also Published As

Publication number Publication date
EP3042164A1 (en) 2016-07-13
TW202021006A (zh) 2020-06-01
JP6449889B2 (ja) 2019-01-09
SG11201601091PA (en) 2016-03-30
GB201315715D0 (en) 2013-10-16
TW201517195A (zh) 2015-05-01
WO2015033108A1 (en) 2015-03-12
EP3042164B1 (en) 2019-05-22
JP2016537641A (ja) 2016-12-01
US20160195424A1 (en) 2016-07-07
US9903750B2 (en) 2018-02-27
TWI688021B (zh) 2020-03-11

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