SG11201601091PA - Method and device for determining information relating to the mass of a semiconductor wafer - Google Patents
Method and device for determining information relating to the mass of a semiconductor waferInfo
- Publication number
- SG11201601091PA SG11201601091PA SG11201601091PA SG11201601091PA SG11201601091PA SG 11201601091P A SG11201601091P A SG 11201601091PA SG 11201601091P A SG11201601091P A SG 11201601091PA SG 11201601091P A SG11201601091P A SG 11201601091PA SG 11201601091P A SG11201601091P A SG 11201601091PA
- Authority
- SG
- Singapore
- Prior art keywords
- mass
- semiconductor wafer
- information relating
- determining information
- determining
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01G—WEIGHING
- G01G19/00—Weighing apparatus or methods adapted for special purposes not provided for in the preceding groups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0648—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element of rectangular shape
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01G—WEIGHING
- G01G17/00—Apparatus for or methods of weighing material of special form or property
- G01G17/02—Apparatus for or methods of weighing material of special form or property for weighing material of filamentary or sheet form
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01G—WEIGHING
- G01G3/00—Weighing apparatus characterised by the use of elastically-deformable members, e.g. spring balances
- G01G3/12—Weighing apparatus characterised by the use of elastically-deformable members, e.g. spring balances wherein the weighing element is in the form of a solid body stressed by pressure or tension during weighing
- G01G3/16—Weighing apparatus characterised by the use of elastically-deformable members, e.g. spring balances wherein the weighing element is in the form of a solid body stressed by pressure or tension during weighing measuring variations of frequency of oscillations of the body
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
- G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
- G01H11/08—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB1315715.1A GB201315715D0 (en) | 2013-09-04 | 2013-09-04 | Method and device for determining information relating to the mass of a semiconductor wafer |
| PCT/GB2014/052573 WO2015033108A1 (en) | 2013-09-04 | 2014-08-21 | Method and device for determining information relating to the mass of a semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201601091PA true SG11201601091PA (en) | 2016-03-30 |
Family
ID=49397261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201601091PA SG11201601091PA (en) | 2013-09-04 | 2014-08-21 | Method and device for determining information relating to the mass of a semiconductor wafer |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9903750B2 (en) |
| EP (1) | EP3042164B1 (en) |
| JP (1) | JP6449889B2 (en) |
| GB (1) | GB201315715D0 (en) |
| SG (1) | SG11201601091PA (en) |
| TW (2) | TWI728695B (en) |
| WO (1) | WO2015033108A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB201315715D0 (en) * | 2013-09-04 | 2013-10-16 | Metryx Ltd | Method and device for determining information relating to the mass of a semiconductor wafer |
| GB201405926D0 (en) * | 2014-04-02 | 2014-05-14 | Metryx Ltd | Semiconductor wafer weighing apparatus and methods |
| JP6953242B2 (en) * | 2017-09-06 | 2021-10-27 | 株式会社ディスコ | Height detector and laser machining equipment |
| CN113029070B (en) * | 2019-12-25 | 2023-04-18 | 中国科学院微电子研究所 | Method for monitoring growth thickness of atomic layer deposition film |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2601165C3 (en) * | 1976-01-14 | 1979-06-28 | Sartorius Gmbh, 3400 Goettingen | Verifiable, electromagnetically compensating scale |
| JP2913962B2 (en) * | 1991-11-27 | 1999-06-28 | 株式会社島津製作所 | Balances for measuring plate samples |
| JP2576338B2 (en) * | 1992-07-31 | 1997-01-29 | 株式会社島津製作所 | Automatic wafer weighing system |
| US5625170A (en) | 1994-01-18 | 1997-04-29 | Nanometrics Incorporated | Precision weighing to monitor the thickness and uniformity of deposited or etched thin film |
| JP3652021B2 (en) * | 1996-07-23 | 2005-05-25 | 三洋機工株式会社 | Weight measurement method |
| JP4420646B2 (en) * | 2003-10-09 | 2010-02-24 | 花王株式会社 | Load measuring device |
| US7256866B2 (en) * | 2004-10-12 | 2007-08-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7804582B2 (en) * | 2006-07-28 | 2010-09-28 | Asml Netherlands B.V. | Lithographic apparatus, method of calibrating a lithographic apparatus and device manufacturing method |
| GB0620196D0 (en) * | 2006-10-11 | 2006-11-22 | Metryx Ltd | Measuring apparatus |
| GB0719469D0 (en) * | 2007-10-04 | 2007-11-14 | Metryx Ltd | Measurement apparatus and method |
| GB0719460D0 (en) | 2007-10-04 | 2007-11-14 | Metryx Ltd | Measurement apparatus and method |
| US7989714B2 (en) | 2007-10-05 | 2011-08-02 | Neopost Technologies | High capacity and high resolution scale |
| GB0800227D0 (en) * | 2008-01-07 | 2008-02-13 | Metryx Ltd | Method of controlling semiconductor device fabrication |
| JP2010129729A (en) * | 2008-11-27 | 2010-06-10 | Kyocera Corp | Sensor-holding substrate and substrate with sensor using the same, and method of manufacturing sensor-holding substrate |
| JP5289918B2 (en) * | 2008-12-10 | 2013-09-11 | アンリツ産機システム株式会社 | Weight sorter |
| US8347740B2 (en) * | 2009-03-31 | 2013-01-08 | Memc Electronic Materials, Inc. | Systems for weighing a pulled object having a changing weight |
| JP2013088393A (en) * | 2011-10-21 | 2013-05-13 | Daihatsu Motor Co Ltd | Weight difference measuring apparatus |
| EP2690415B2 (en) * | 2012-07-23 | 2022-05-18 | Mettler-Toledo GmbH | Force measurement device with sliding weight |
| GB201315715D0 (en) * | 2013-09-04 | 2013-10-16 | Metryx Ltd | Method and device for determining information relating to the mass of a semiconductor wafer |
-
2013
- 2013-09-04 GB GBGB1315715.1A patent/GB201315715D0/en not_active Ceased
-
2014
- 2014-08-21 EP EP14755908.2A patent/EP3042164B1/en active Active
- 2014-08-21 SG SG11201601091PA patent/SG11201601091PA/en unknown
- 2014-08-21 WO PCT/GB2014/052573 patent/WO2015033108A1/en active Application Filing
- 2014-08-21 US US14/911,499 patent/US9903750B2/en active Active
- 2014-08-21 JP JP2016539630A patent/JP6449889B2/en active Active
- 2014-09-04 TW TW109104472A patent/TWI728695B/en active
- 2014-09-04 TW TW103130650A patent/TWI688021B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TW201517195A (en) | 2015-05-01 |
| TWI688021B (en) | 2020-03-11 |
| GB201315715D0 (en) | 2013-10-16 |
| US9903750B2 (en) | 2018-02-27 |
| TW202021006A (en) | 2020-06-01 |
| JP6449889B2 (en) | 2019-01-09 |
| TWI728695B (en) | 2021-05-21 |
| JP2016537641A (en) | 2016-12-01 |
| EP3042164A1 (en) | 2016-07-13 |
| EP3042164B1 (en) | 2019-05-22 |
| US20160195424A1 (en) | 2016-07-07 |
| WO2015033108A1 (en) | 2015-03-12 |
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