TWI726814B - Circuit board fastening structure - Google Patents

Circuit board fastening structure Download PDF

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Publication number
TWI726814B
TWI726814B TW109132478A TW109132478A TWI726814B TW I726814 B TWI726814 B TW I726814B TW 109132478 A TW109132478 A TW 109132478A TW 109132478 A TW109132478 A TW 109132478A TW I726814 B TWI726814 B TW I726814B
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Taiwan
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conductive
circuit board
base
seat
rotating
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TW109132478A
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Chinese (zh)
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TW202213873A (en
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朱衍興
郭毓泰
李建儀
王清任
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和碩聯合科技股份有限公司
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Priority to TW109132478A priority Critical patent/TWI726814B/en
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Publication of TWI726814B publication Critical patent/TWI726814B/en
Priority to CN202110901603.9A priority patent/CN114205999A/en
Publication of TW202213873A publication Critical patent/TW202213873A/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/144Stacked arrangements of planar printed circuit boards

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

A circuit board fastening structure for connecting a first circuit board with a second circuit board is provided. The circuit board fastening structure includes a base, a seat, a supporting post and a rotating member. The base configured on the first circuit board includes a touch surface having a conductive part and an isolation part. The seat is configured on the second circuit board. The supporting post connects between the base and the seat. The rotating member electrically connects with the seat and includes a rotating surface and a conductive elastomer. The supporting post passes through the rotating member. The conductive elastomer connects with the rotating surface and extends toward the base. The rotating member can rotate relative to the base to make the conductive elastomer contacts the conductive part or the isolation part.

Description

電路板搭接結構Circuit board overlap structure

本發明提出一種電路板搭接結構,尤指一種可選擇電性導通與否的電路板搭接結構。 The present invention provides a circuit board overlap structure, in particular to a circuit board overlap structure that can be electrically connected or not.

圖1為習知電路板搭接結構之示意圖。現有電子產品常有電路板之間或與其他組件的堆疊結構。如圖1所示,為了將第一電路板1、第二電路板2和底座3搭接在一起,可透過搭接柱4來連接。搭接柱4可例如是透過螺接、卡接等方式來將多個構件搭接在一起。在此,是以螺接為例說明,搭接柱4包含有螺柱41及螺帽42。螺柱41兩端分別通過第一電路板1的通孔11及第二電路板2的通孔21,一端鎖附在底座3上,另一端與螺帽42鎖附。 Figure 1 is a schematic diagram of a conventional circuit board lap structure. Existing electronic products often have a stacked structure between circuit boards or with other components. As shown in FIG. 1, in order to lap the first circuit board 1, the second circuit board 2 and the base 3 together, they can be connected through the lap post 4. The lap post 4 may be used to lap multiple components together, for example, by means of screw connection, clamping connection, or the like. Here, the screw connection is taken as an example for description. The lap post 4 includes a stud 41 and a nut 42. The two ends of the stud 41 respectively pass through the through hole 11 of the first circuit board 1 and the through hole 21 of the second circuit board 2, one end is locked to the base 3, and the other end is locked to the nut 42.

在一些情形下,為了使兩電路板間的電性連通,通孔11、21為導電孔,搭接柱4也是由導電材質構成。然而,在一些情形下,搭接位置若位在電路板上的電性敏感區域,會使用電性絕緣材質構成的搭接柱4來進行搭接。藉此,可避免搭接造成的電性連通引發如靜電放電(Electrostatic Discharge,ESD)或電磁干擾(Electromagnetic Interference,EMI)等問題。因此,在組裝電子產品時,因應不同的需求,需要使用不同材質的搭接柱4來進行搭接。如此一來,不僅增加備料成本,也增加組裝複雜度與生產錯誤率。 In some cases, in order to make the electrical communication between the two circuit boards, the through holes 11 and 21 are conductive holes, and the lap post 4 is also made of conductive material. However, in some cases, if the lap position is located in an electrically sensitive area on the circuit board, the lap post 4 made of an electrically insulating material will be used for the overlap. In this way, problems such as electrostatic discharge (ESD) or electromagnetic interference (EMI) caused by electrical connection caused by overlap can be avoided. Therefore, when assembling electronic products, in response to different needs, it is necessary to use the lap posts 4 of different materials for lap joints. As a result, it not only increases the cost of material preparation, but also increases assembly complexity and production error rate.

鑑於上述問題,本發明一實施例提出一種電路板搭接結構,適於連接第一電路板及第二電路板。電路板搭接結構包含:基座、座體、支撐柱及旋轉件。基座用於設置於第一電路板,並包含接觸面,接觸面具有導電部及隔離部。座體用於設置於第二電路板。支撐柱連接於基座與座體之間。旋轉件電連接座體,並包含旋轉面及導電彈性體。支撐柱穿設旋轉件。導電彈性體連接於旋轉面,並朝基座延伸。旋轉件能夠相對於基座旋轉而使導電彈性體接觸導電部或隔離部。 In view of the foregoing problems, an embodiment of the present invention provides a circuit board lap structure, which is suitable for connecting the first circuit board and the second circuit board. The circuit board lap structure includes: a base, a seat body, a supporting column and a rotating part. The base is used to be arranged on the first circuit board, and includes a contact surface, and the contact surface has a conductive portion and an isolation portion. The base body is used to be arranged on the second circuit board. The support column is connected between the base and the seat body. The rotating part is electrically connected to the base body and includes a rotating surface and a conductive elastic body. The supporting column is provided with a rotating part. The conductive elastic body is connected to the rotating surface and extends toward the base. The rotating member can rotate relative to the base to make the conductive elastic body contact the conductive part or the isolation part.

在一些實施例中,導電部及隔離部分別與支撐柱接觸於接觸面的位置相距相同距離。 In some embodiments, the conductive portion and the isolation portion are respectively separated from the position where the support pillar contacts the contact surface by the same distance.

在一些實施例中,導電彈性體為一圓弧段。圓弧段的一端具有延伸部,延伸部連接於旋轉件的旋轉面。圓弧段的另一端具有接觸部,接觸部接觸於基座的接觸面。 In some embodiments, the conductive elastomer is a circular arc segment. One end of the arc segment has an extension, and the extension is connected to the rotating surface of the rotating member. The other end of the arc segment has a contact portion, and the contact portion is in contact with the contact surface of the base.

在一些實施例中,導電彈性體為一圓弧段。圓弧段包含位於相對二端的二延伸部及位於此二延伸部之間的接觸部。此二延伸部端連接於旋轉件的旋轉面。接觸部接觸於基座的接觸面。 In some embodiments, the conductive elastomer is a circular arc segment. The arc segment includes two extension portions located at two opposite ends and a contact portion located between the two extension portions. The ends of the two extensions are connected to the rotating surface of the rotating member. The contact portion is in contact with the contact surface of the base.

在一些實施例中,電路板搭接結構更包含導電構件,位於座體及旋轉件之間,使得旋轉件經由導電構件電連接座體。 In some embodiments, the circuit board overlap structure further includes a conductive member located between the base and the rotating part, so that the rotating part is electrically connected to the base via the conductive member.

在一些實施例中,導電構件包含至少一導電彈片。導電彈片呈卷繞狀的抵接旋轉件。 In some embodiments, the conductive member includes at least one conductive elastic sheet. The conductive elastic sheet is in the shape of a coil and abuts against the rotating member.

在一些實施例中,導電構件包含複數導電彈片。此些導電彈片呈拱形柵狀而環繞且浮凸於座體。 In some embodiments, the conductive member includes a plurality of conductive elastic sheets. These conductive elastic sheets are arc-shaped grids around and embossed on the base.

在一些實施例中,旋轉件呈筒狀而罩覆於座體外側,並具有環側壁,環側壁與導電構件相連接。 In some embodiments, the rotating member is cylindrical and covers the outside of the seat body, and has a ring side wall that is connected to the conductive member.

在一些實施例中,基座包含相疊合的導電座及隔離座。導電座具有導電凸塊,隔離座具有透孔。導電凸塊經過透孔顯露於隔離座表面而形成導電部。 In some embodiments, the base includes a conductive base and an isolation base that are overlapped. The conductive seat has a conductive bump, and the isolation seat has a through hole. The conductive bump is exposed on the surface of the isolation seat through the through hole to form a conductive portion.

在一些實施例中,隔離座還具有定位槽,以形成隔離部。 In some embodiments, the isolation seat further has a positioning groove to form an isolation portion.

在一些實施例中,該導電座包含相疊合的第一導電座及第二導電座。第一導電座具有導電柱,第二導電座具有開口。導電柱通過開口而凸出以形成導電凸塊。 In some embodiments, the conductive seat includes a first conductive seat and a second conductive seat that are overlapped. The first conductive seat has a conductive pillar, and the second conductive seat has an opening. The conductive pillar protrudes through the opening to form a conductive bump.

依據本發明一些實施例之電路板搭接結構,可將二電路板搭接在一起,並且可選擇此二電路板是否透過此搭接結構電性導通。如此一來,無需因應電性導通與否準備不同的搭接材料,可節省備料成本。另一方面,也能降低組裝複雜度與生產錯誤率。 According to the circuit board overlap structure of some embodiments of the present invention, two circuit boards can be overlapped together, and it can be selected whether the two circuit boards are electrically connected through the overlap structure. In this way, there is no need to prepare different lap materials according to whether the electrical conduction or not, and the material preparation cost can be saved. On the other hand, it can also reduce assembly complexity and production error rate.

1:第一電路板 1: The first circuit board

11:通孔 11: Through hole

2:第二電路板 2: The second circuit board

21:通孔 21: Through hole

3:底座 3: base

4:搭接柱 4: lap post

41:螺柱 41: Stud

42:螺帽 42: Nut

100:基座 100: Pedestal

110:導通部 110: Conduction part

120:接觸面 120: contact surface

121:導電部 121: conductive part

122:隔離部 122: Isolation Department

130:導電座 130: Conductive seat

131:導電凸塊 131: conductive bump

132:立柱 132: Column

140:隔離座 140: isolation seat

141:透孔 141: Through Hole

142:定位槽 142: positioning slot

143:窗口 143: Window

144:空心柱 144: Hollow Column

150:第一導電座 150: The first conductive seat

151:導電柱 151: Conductive column

160:第二導電座 160: second conductive seat

161:開口 161: open

162:立柱 162: Column

200:座體 200: seat body

210:導通部 210: Conduction part

220:抵接面 220: contact surface

221:凹槽 221: Groove

230:連接部 230: connecting part

300:支撐柱 300: support column

310:卡接部 310: Card connector

400:旋轉件 400: Rotating parts

410:旋轉面 410: Rotating Surface

420:導電彈性體 420: conductive elastomer

421:延伸部 421: Extension

422:接觸部 422: Contact

430:貫孔 430: Through hole

440:環側壁 440: Ring sidewall

500:導電構件 500: conductive member

510:導電彈片 510: conductive shrapnel

520:導電彈片 520: conductive shrapnel

530:導電帶 530: Conductive tape

610:第一電路板 610: The first circuit board

620:第二電路板 620: second circuit board

[圖1]為習知電路板搭接結構之示意圖。 [Figure 1] is a schematic diagram of a conventional circuit board lap structure.

[圖2]為本發明一實施例之電路板搭接結構之立體剖視圖。 [Figure 2] is a perspective cross-sectional view of a circuit board lap structure according to an embodiment of the present invention.

[圖3]為本發明一實施例之電路板搭接結構之剖面圖。 [Figure 3] is a cross-sectional view of a circuit board lap structure according to an embodiment of the present invention.

[圖4]為本發明一實施例之電路板搭接結構之另一狀態之剖面圖。 [Figure 4] is a cross-sectional view of another state of the circuit board overlap structure of an embodiment of the present invention.

[圖5]為本發明一實施例之電路板搭接結構之立體分解圖(一)。 [Figure 5] is a three-dimensional exploded view (1) of the circuit board lap structure according to an embodiment of the present invention.

[圖6]為本發明一實施例之電路板搭接結構之立體分解圖(二)。 [Figure 6] is a three-dimensional exploded view (2) of the circuit board lap structure according to an embodiment of the present invention.

[圖7]及[圖8]為本發明一些實施例之導電彈性體之立體示意圖。 [Fig. 7] and [Fig. 8] are three-dimensional schematic diagrams of conductive elastomers according to some embodiments of the present invention.

[圖9]為本發明另一實施例之基座之立體分解圖。 [Figure 9] is a perspective exploded view of a base of another embodiment of the present invention.

[圖10]為本發明另一實施例之電路板搭接結構之剖面圖。 [Figure 10] is a cross-sectional view of a circuit board lap structure according to another embodiment of the present invention.

合併參照圖2至圖6。圖2為本發明一實施例之電路板搭接結構之立體剖視圖。圖3為本發明一實施例之電路板搭接結構之剖面圖。圖4為本發明一實施例之電路板搭接結構之另一狀態之剖面圖。圖5為本發明一實施例之電路板搭接結構之立體分解圖(一)。圖6為本發明一實施例之電路板搭接結構之立體分解圖(二)。電路板搭接結構可適於連接第一電路板610及第二電路板620。電路板搭接結構包含有基座100、座體200、支撐柱300及旋轉件400。 Refer to Figure 2 to Figure 6 together. 2 is a perspective cross-sectional view of a circuit board overlap structure according to an embodiment of the invention. 3 is a cross-sectional view of a circuit board overlap structure according to an embodiment of the invention. 4 is a cross-sectional view of another state of the circuit board overlap structure according to an embodiment of the present invention. Fig. 5 is a three-dimensional exploded view (1) of the circuit board overlap structure according to an embodiment of the present invention. Fig. 6 is a three-dimensional exploded view (2) of the circuit board overlap structure according to an embodiment of the present invention. The circuit board overlap structure may be suitable for connecting the first circuit board 610 and the second circuit board 620. The circuit board overlapping structure includes a base 100, a base 200, a supporting column 300 and a rotating member 400.

基座100用於設置於第一電路板610。基座100包含有導通部110及接觸面120。接觸面120具有導電部121及隔離部122。導通部110與導電部121電性連接,導通部110與隔離部122電性隔絕。基座100設置於第一電路板610時,導電部121可經由導通部110和第一電路板610電性導通。在本實施例中,導通部110還可供透過表面黏著技術(Surface Mount Technology,SMT)固定設置於第一電路板610,但本發明非以此為限。在一些實施例中,基座100可透過其他方式(如插接、螺接、卡接等)固定設置於第一電路板610。 The base 100 is used to be disposed on the first circuit board 610. The base 100 includes a conductive portion 110 and a contact surface 120. The contact surface 120 has a conductive portion 121 and an isolation portion 122. The conductive portion 110 is electrically connected to the conductive portion 121, and the conductive portion 110 is electrically isolated from the isolation portion 122. When the base 100 is disposed on the first circuit board 610, the conductive portion 121 can be electrically connected to the first circuit board 610 via the conductive portion 110. In this embodiment, the conductive portion 110 can also be fixedly disposed on the first circuit board 610 through Surface Mount Technology (SMT), but the present invention is not limited to this. In some embodiments, the base 100 may be fixedly arranged on the first circuit board 610 through other methods (such as plug-in connection, screw connection, snap connection, etc.).

基座100由多個構件組成。在此,基座100包含相疊合的導電座130及隔離座140。導電座130由導電材質構成,隔離座140由電性絕緣材質構成。導電座130具有導電凸塊131,隔離座140具有透孔141。導電凸塊131經過透孔141顯露於隔離座140表面而形成導電部121。隔 離座140還具有一定位槽142,以形成隔離部122。導電座130還具有立柱132,隔離座140還具有窗口143及空心柱144。窗口143與空心柱144的內部空間連通,空心柱144的內部空間與立柱132相應。藉此,立柱132可通過窗口143伸入空心柱144的內部空間中,以形成支撐柱300。 The base 100 is composed of multiple components. Here, the base 100 includes a conductive seat 130 and an isolation seat 140 that are overlapped. The conductive base 130 is made of a conductive material, and the isolation base 140 is made of an electrically insulating material. The conductive seat 130 has a conductive bump 131, and the isolation seat 140 has a through hole 141. The conductive bump 131 is exposed on the surface of the isolation seat 140 through the through hole 141 to form the conductive portion 121. Separate The separation seat 140 also has a positioning groove 142 to form an isolation portion 122. The conductive seat 130 further has a column 132, and the isolation seat 140 further has a window 143 and a hollow column 144. The window 143 communicates with the inner space of the hollow column 144, and the inner space of the hollow column 144 corresponds to the upright column 132. Thereby, the upright post 132 can extend into the inner space of the hollow post 144 through the window 143 to form the support post 300.

在一些實施例中,隔離座140透過射出成型方式形成。 In some embodiments, the isolation seat 140 is formed by injection molding.

在一些實施例中,導電部121由導電材質構成,隔離部122由電性絕緣材質構成。在一些實施例中,隔離部122由導電材質構成,並透過其他電性絕緣元件與導通部110電性隔絕。 In some embodiments, the conductive portion 121 is made of a conductive material, and the isolation portion 122 is made of an electrically insulating material. In some embodiments, the isolation portion 122 is made of a conductive material, and is electrically isolated from the conductive portion 110 by other electrically insulating elements.

座體200設置於第二電路板620。座體200包含導通部210、抵接面220及連接部230。導通部210與連接部230電性連接。連接部230電性連接旋轉件400。在本實施例中,電路板搭接結構還包含有導電構件500。導電構件500由導電材質構成。導電構件500位於座體200與旋轉件400之間,而分別電性連接於旋轉件400及座體200的連接部230。藉此,旋轉件400可經由導電構件500電性連接座體200。在一些實施例中,連接部230可透過其他方式電性連接旋轉件400,例如添加導電劑(如導電油)在緊密疊套的旋轉件400與座體200之間。 The base 200 is disposed on the second circuit board 620. The base 200 includes a conductive portion 210, a contact surface 220 and a connecting portion 230. The conducting portion 210 is electrically connected to the connecting portion 230. The connecting portion 230 is electrically connected to the rotating member 400. In this embodiment, the circuit board lap structure further includes a conductive member 500. The conductive member 500 is made of a conductive material. The conductive member 500 is located between the base 200 and the rotating element 400, and is electrically connected to the rotating element 400 and the connecting portion 230 of the base 200, respectively. In this way, the rotating member 400 can be electrically connected to the base 200 via the conductive member 500. In some embodiments, the connecting portion 230 may be electrically connected to the rotating member 400 in other ways, for example, a conductive agent (such as conductive oil) is added between the closely-packed rotating member 400 and the base 200.

參照圖4,支撐柱300連接於基座100與座體200之間,使得基座100與座體200保持有一間距。在本實施例中,支撐柱300的一端是固定連接基座100,支撐柱300的另一端抵接於座體200的抵接面220。在此,抵接面220是與導通部210相對,但本發明不以此為限。需說明的是,為了清楚呈現旋轉件400,圖2及圖3呈現的是支撐柱300尚未抵接座體200的抵接面220的狀態示意圖。 4, the support column 300 is connected between the base 100 and the base 200, so that the base 100 and the base 200 maintain a distance. In this embodiment, one end of the support column 300 is to fix the connection base 100, and the other end of the support column 300 abuts against the contact surface 220 of the base 200. Here, the contact surface 220 is opposite to the conducting portion 210, but the invention is not limited to this. It should be noted that, in order to clearly show the rotating member 400, FIGS. 2 and 3 show a schematic diagram of a state where the support column 300 has not abutted against the abutting surface 220 of the base body 200.

如圖2及圖5所示,在一些實施例中,座體200的抵接面220包含一凹槽221,可容接部分的支撐柱300,以輔助穩固地抵接支撐柱300。在此,凹槽221的開口形狀是以圓形為例,但本發明非限於此。當支撐柱300抵接於座體200,基座100與旋轉件400相接觸(為了呈現導電彈性體420,圖4並未明顯繪示)。基座100與旋轉件400提供支撐力量來維持第一電路板610與第二電路板620之間的間距。 As shown in FIGS. 2 and 5, in some embodiments, the abutting surface 220 of the seat body 200 includes a groove 221 that can receive a portion of the support column 300 to assist in firmly abutting the support column 300. Here, the opening shape of the groove 221 is a circle as an example, but the present invention is not limited to this. When the supporting column 300 abuts on the base 200, the base 100 contacts the rotating member 400 (in order to present the conductive elastic body 420, it is not clearly shown in FIG. 4). The base 100 and the rotating member 400 provide supporting force to maintain the distance between the first circuit board 610 and the second circuit board 620.

旋轉件400包含有旋轉面410及導電彈性體420。旋轉面410上具有貫孔430,可供支撐柱300穿設旋轉件400,使得旋轉件400的旋轉面410可以支撐柱300為軸心旋轉。導電彈性體420連接於旋轉面410,並朝基座100延伸。因此,透過旋轉件400相對於基座100旋轉,而可使導電彈性體420接觸導電部121或隔離部122。當導電彈性體420接觸導電部121時,基座100的導通部110和座體200的導通部210電性連接,使得第一電路板610與第二電路板620可經由此搭接結構電性導通。當導電彈性體420接觸隔離部122時,基座100的導通部110和座體200的導通部210電性隔絕,使得第一電路板610與第二電路板620不經由此搭接結構電性導通。 The rotating element 400 includes a rotating surface 410 and a conductive elastic body 420. The rotating surface 410 has a through hole 430 for the supporting column 300 to pass through the rotating member 400 so that the rotating surface 410 of the rotating member 400 can rotate the supporting column 300 as an axis. The conductive elastic body 420 is connected to the rotating surface 410 and extends toward the base 100. Therefore, by rotating the rotating member 400 relative to the base 100, the conductive elastic body 420 can be brought into contact with the conductive portion 121 or the isolation portion 122. When the conductive elastic body 420 contacts the conductive portion 121, the conductive portion 110 of the base 100 and the conductive portion 210 of the base 200 are electrically connected, so that the first circuit board 610 and the second circuit board 620 can be electrically connected through the overlapping structure Conduction. When the conductive elastic body 420 contacts the isolation portion 122, the conductive portion 110 of the base 100 and the conductive portion 210 of the base 200 are electrically isolated, so that the first circuit board 610 and the second circuit board 620 are not electrically connected through the overlapping structure. Conduction.

在一些實施例中,支撐柱300固定連接基座100與座體200中的至少一者。 In some embodiments, the support column 300 is fixedly connected to at least one of the base 100 and the base 200.

在一些實施例中,支撐柱300是分別可卸式連接基座100與座體200,旋轉件400相對於支撐柱300可為可旋轉。 In some embodiments, the support column 300 is a detachable connection between the base 100 and the base 200, and the rotating member 400 can be rotatable relative to the support column 300.

在本實施例中,支撐柱300的一端具有卡接部310。在此卡接部310為箭矢狀的彈性扣爪,用於扣勾旋轉件400,以避免旋轉件400 脫離支撐柱300。支撐柱300的位於末端的箭矢狀部位(即卡接部310的末端)可供容接於座體200的抵接面220的凹槽221(如圖4所示)。 In this embodiment, one end of the support column 300 has a clamping portion 310. Here, the clamping portion 310 is an arrow-shaped elastic clasp, which is used to hook the rotating part 400 to avoid the rotating part 400. Detach from the support column 300. The arrow-shaped portion of the support column 300 at the end (ie, the end of the clamping portion 310) can be accommodated in the groove 221 of the abutting surface 220 of the seat body 200 (as shown in FIG. 4).

在本實施例中,旋轉件400還包含有環側壁440,連接於旋轉面410,使得旋轉件400呈一筒狀。旋轉件400罩覆於座體200外側。也就是說,筒狀的內部空間用以容置導電構件500及座體200。環側壁440與導電構件500相連接,使得座體200與旋轉件400之間經由導電構件500電性連接。 In this embodiment, the rotating member 400 further includes a ring side wall 440 connected to the rotating surface 410 so that the rotating member 400 has a cylindrical shape. The rotating member 400 covers the outside of the base 200. In other words, the cylindrical inner space is used for accommodating the conductive member 500 and the base 200. The ring sidewall 440 is connected to the conductive member 500 so that the base 200 and the rotating part 400 are electrically connected via the conductive member 500.

在一些實施例中,導電構件500可例如是以導線或導電彈片等形式實現。在本實施例中,導電構件500包含有複數導電彈片510、520。導電彈片520呈拱形柵狀而環繞且浮凸於座體200。也就是說,導電彈片520環繞於座體200側面間隔排列,且每一導電彈片520呈拱形而朝向遠離座體200的方向凸起。導電彈片520之凸起部位抵頂旋轉件400的環側壁440,以保持導電構件500與旋轉件400之間的電性連接,此外還可使旋轉件400保持穩固。導電構件500還包含二導電帶530,分別連接導電彈片520的兩端。在本實施例中,導電彈片510是以二個為例,但本發明不限於此,亦可為更多或更少的數量。導電彈片510的一端與導電構件500的其他構件相連(在此是連接導電帶530)以電性連接於座體200。導電彈片510呈卷繞狀而具彈性回復力,可充分抵頂旋轉件400,以保持導電構件500與旋轉件400之間的電性連接。導電彈片510朝向座體200的方向卷繞。導電彈片510除了抵接旋轉件400之外,其末端還可與座體200接觸。 In some embodiments, the conductive member 500 may be realized in the form of a wire or a conductive spring sheet, for example. In this embodiment, the conductive member 500 includes a plurality of conductive elastic pieces 510 and 520. The conductive elastic sheet 520 is in the shape of an arched grid and surrounds and emboss on the base 200. In other words, the conductive elastic pieces 520 are arranged at intervals around the side surface of the base 200, and each conductive elastic piece 520 is arched and protrudes in a direction away from the base 200. The protruding part of the conductive elastic piece 520 presses against the ring side wall 440 of the rotating member 400 to maintain the electrical connection between the conductive member 500 and the rotating member 400, and also to keep the rotating member 400 stable. The conductive member 500 further includes two conductive strips 530 respectively connected to two ends of the conductive elastic sheet 520. In this embodiment, two conductive elastic sheets 510 are taken as an example, but the present invention is not limited to this, and there may be more or less number. One end of the conductive elastic piece 510 is connected to other members of the conductive member 500 (here, the connecting conductive band 530) to be electrically connected to the base 200. The conductive elastic sheet 510 is wound and has an elastic restoring force, and can fully press against the rotating member 400 to maintain the electrical connection between the conductive member 500 and the rotating member 400. The conductive elastic sheet 510 is wound toward the direction of the base 200. In addition to abutting the rotating member 400, the conductive elastic piece 510 can also contact the base 200 at its end.

座體200還包含連接部230,以供連接導電構件500。在本 實施例中,連接部230位於座體200的側面並相對導通部210及抵接面220呈凹陷狀,使得導電構件500的柵狀導電彈片520及二導電帶530可夾卡於其中。 The base 200 further includes a connecting portion 230 for connecting the conductive member 500. In this In the embodiment, the connecting portion 230 is located on the side surface of the base 200 and is recessed relative to the conductive portion 210 and the contact surface 220, so that the grid-shaped conductive elastic piece 520 and the two conductive strips 530 of the conductive member 500 can be clamped therein.

在本實施例中,導電彈性體420為一圓弧段,包含分別位於相對二端的二延伸部421及位於延伸部421之間的接觸部422。延伸部421連接於旋轉件400的旋轉面410。接觸部422接觸於基座100的接觸面120。藉此,可透過將旋轉件400左旋(順時針)或右旋(逆時針)來改變導電彈性體420接觸於基座100的位置。 In this embodiment, the conductive elastic body 420 is a circular arc segment, and includes two extension portions 421 located at two opposite ends, and a contact portion 422 located between the extension portions 421. The extension 421 is connected to the rotating surface 410 of the rotating member 400. The contact portion 422 is in contact with the contact surface 120 of the base 100. Thereby, the position of the conductive elastic body 420 in contact with the base 100 can be changed by rotating the rotating member 400 leftward (clockwise) or rightward (counterclockwise).

參照圖7及圖8,係為本發明一些實施例之導電彈性體420之立體示意圖。有別於前述實施例之導電彈性體420具有二延伸部421,在此導電彈性體420僅有一延伸部421,延伸部421位於導電彈性體420的一端,導電彈性體420的另一端具有用於接觸於基座100的接觸面120的一接觸部422。如圖7所示之旋轉件400適於以左旋來改變導電彈性體420接觸於基座100的位置;如圖8所示之旋轉件400適於以右旋來改變導電彈性體420接觸於基座100的位置。 7 and 8 are three-dimensional schematic diagrams of the conductive elastomer 420 according to some embodiments of the present invention. Different from the conductive elastic body 420 in the previous embodiment, it has two extensions 421. Here, the conductive elastic body 420 has only one extension 421. The extension 421 is located at one end of the conductive elastic body 420, and the other end of the conductive elastic body 420 has A contact portion 422 in contact with the contact surface 120 of the base 100. The rotating member 400 shown in FIG. 7 is adapted to rotate left to change the position where the conductive elastic body 420 contacts the base 100; the rotating member 400 shown in FIG. 8 is adapted to rotate right to change the position where the conductive elastic body 420 contacts the base 100. Seat 100 position.

在一些實施例中,接觸部422具有一凸點,可供定位於導電部121或隔離部122,但本發明不以此為限。 In some embodiments, the contact portion 422 has a bump for positioning on the conductive portion 121 or the isolation portion 122, but the invention is not limited thereto.

在一些實施例中,是透過對旋轉件400的旋轉面410沖切來形成為圓弧段的導電彈性體420。 In some embodiments, the conductive elastic body 420 is formed into a circular arc segment by punching the rotating surface 410 of the rotating member 400.

參照圖3及圖6。在一些實施例中,相應於為圓弧段的導電彈性體420,基座100的導電部121及隔離部122分別與支撐柱300接觸於接觸面120的位置相距有相同距離。也就是說,導電部121及隔離部122 位於以支撐柱300接觸於接觸面120的位置為圓心的一圓周上。 Refer to Figure 3 and Figure 6. In some embodiments, corresponding to the conductive elastic body 420 having a circular arc segment, the conductive portion 121 and the isolation portion 122 of the base 100 are respectively separated from the position where the support column 300 contacts the contact surface 120 at the same distance. In other words, the conductive portion 121 and the isolation portion 122 It is located on a circle with the position where the support column 300 contacts the contact surface 120 as the center of the circle.

參照圖9及圖10。圖9為本發明另一實施例之基座100之立體分解圖。圖10為本發明另一實施例之電路板搭接結構之剖面圖。相較於前述實施例之差異在於,導電座130可由多個構件組成。在此,導電座130包含相疊合的第一導電座150及第二導電座160。第一導電座150具有導電柱151,第二導電座160具有開口161及立柱162。導電柱151通過開口161而凸出,以形成導電凸塊131。立柱162可伸入空心柱144的內部空間中,以形成前述支撐柱300。相較於以單一構件來形成導電座130,透過多個構件來組成導電座130,可降低每一構件成形的製作難度。 Refer to Figure 9 and Figure 10. FIG. 9 is an exploded perspective view of a base 100 according to another embodiment of the present invention. 10 is a cross-sectional view of a circuit board overlap structure according to another embodiment of the invention. Compared with the foregoing embodiment, the difference is that the conductive base 130 can be composed of multiple components. Here, the conductive seat 130 includes a first conductive seat 150 and a second conductive seat 160 that are overlapped. The first conductive seat 150 has a conductive pillar 151, and the second conductive seat 160 has an opening 161 and a pillar 162. The conductive pillar 151 protrudes through the opening 161 to form a conductive bump 131. The upright post 162 can extend into the inner space of the hollow post 144 to form the aforementioned support post 300. Compared with forming the conductive seat 130 with a single component, the conductive seat 130 is formed by multiple components, which can reduce the manufacturing difficulty of forming each component.

在一些實施例中,第一導電座150及第二導電座160之間透過膠合方式固定。 In some embodiments, the first conductive base 150 and the second conductive base 160 are fixed by gluing.

在一些實施例中,座體200及旋轉件400是由導電材質構成。 In some embodiments, the base 200 and the rotating member 400 are made of conductive materials.

上述之實施例之基座100、座體200、支撐柱300、旋轉件400及導電構件500的形狀僅為例示,本發明不以此為限。 The shapes of the base 100, the base 200, the supporting column 300, the rotating member 400, and the conductive member 500 of the above-mentioned embodiment are only examples, and the present invention is not limited thereto.

依據本發明一些實施例之電路板搭接結構,可將二電路板搭接在一起,並且可選擇此二電路板是否透過此搭接結構電性導通。如此一來,無需因應電性導通與否準備不同的搭接材料,可節省備料成本。另一方面,也能降低組裝複雜度與生產錯誤率。此外,依據本發明一些實施例之電路板搭接結構,透過SMT設置在電路板上,可節省電路板的走線空間。 According to the circuit board overlap structure of some embodiments of the present invention, two circuit boards can be overlapped together, and it can be selected whether the two circuit boards are electrically connected through the overlap structure. In this way, there is no need to prepare different lap materials according to whether the electrical conduction or not, and the material preparation cost can be saved. On the other hand, it can also reduce assembly complexity and production error rate. In addition, the circuit board lap structure according to some embodiments of the present invention is arranged on the circuit board through SMT, which can save the wiring space of the circuit board.

100:基座 100: Pedestal

110:導通部 110: Conduction part

120:接觸面 120: contact surface

121:導電部 121: conductive part

122:隔離部 122: Isolation Department

130:導電座 130: Conductive seat

131:導電凸塊 131: conductive bump

140:隔離座 140: isolation seat

142:定位槽 142: positioning slot

200:座體 200: seat body

210:導通部 210: Conduction part

220:抵接面 220: contact surface

230:連接部 230: connecting part

300:支撐柱 300: support column

310:卡接部 310: Card connector

400:旋轉件 400: Rotating parts

410:旋轉面 410: Rotating Surface

420:導電彈性體 420: conductive elastomer

440:環側壁 440: Ring sidewall

500:導電構件 500: conductive member

510:導電彈片 510: conductive shrapnel

520:導電彈片 520: conductive shrapnel

530:導電帶 530: Conductive tape

610:第一電路板 610: The first circuit board

620:第二電路板 620: second circuit board

Claims (11)

一種電路板搭接結構,適於連接一第一電路板及一第二電路板,該電路板搭接結構包含:一基座,用於設置於該第一電路板,該基座包含一接觸面,該接觸面具有一導電部及一隔離部;一座體,用於設置於該第二電路板;一支撐柱,連接於該基座與該座體之間;及一旋轉件,電連接該座體,該旋轉件包含一旋轉面及一導電彈性體,該支撐柱穿設該旋轉件,該導電彈性體連接於該旋轉面,並朝該基座延伸,該旋轉件能夠相對於該基座旋轉而使該導電彈性體接觸該導電部或該隔離部。 A circuit board overlap structure suitable for connecting a first circuit board and a second circuit board. The circuit board overlap structure includes: a base for being arranged on the first circuit board, the base including a contact Surface, the contact mask has a conductive part and an isolating part; a seat body for being arranged on the second circuit board; a support column connected between the base and the seat body; and a rotating part, which is electrically connected The base body, the rotating member includes a rotating surface and a conductive elastic body, the support column passes through the rotating member, the conductive elastic body is connected to the rotating surface and extends toward the base, and the rotating member can be relative to the The base rotates to make the conductive elastic body contact the conductive part or the isolation part. 如請求項1所述之電路板搭接結構,其中該導電部及該隔離部分別與該支撐柱接觸於該接觸面的位置相距相同距離。 The circuit board overlap structure according to claim 1, wherein the conductive portion and the isolation portion are respectively separated from the position where the support column contacts the contact surface at the same distance. 如請求項1所述之電路板搭接結構,其中該導電彈性體為一圓弧段,該圓弧段的一端具有一延伸部,該延伸部連接於該旋轉件的該旋轉面,該圓弧段的另一端具有一接觸部,該接觸部接觸於該基座的該接觸面。 The circuit board overlap structure according to claim 1, wherein the conductive elastic body is an arc segment, one end of the arc segment has an extension, and the extension is connected to the rotating surface of the rotating member. The other end of the arc segment has a contact portion, and the contact portion contacts the contact surface of the base. 如請求項1所述之電路板搭接結構,其中該導電彈性體為一圓弧段,該圓弧段包含位於相對二端的二延伸部及位於該二延伸部之間的一接觸部,該二延伸部端連接於該旋轉件的該旋轉面,該接觸部接觸於該基座的該接觸面。 The circuit board overlap structure according to claim 1, wherein the conductive elastic body is an arc segment, and the arc segment includes two extension portions located at two opposite ends and a contact portion located between the two extension portions, the The ends of the two extension parts are connected to the rotating surface of the rotating part, and the contact part contacts the contact surface of the base. 如請求項1所述之電路板搭接結構,更包含一導電構件,位於該座體及該旋轉件之間,使得該旋轉件經由該導電構件電連接該座體。 The circuit board lap structure described in claim 1 further includes a conductive member located between the base body and the rotating member, so that the rotating member is electrically connected to the base body through the conductive member. 如請求項5所述之電路板搭接結構,其中該導電構件包含至少一導電彈片,該至少一導電彈片呈卷繞狀的抵接該旋轉件。 The circuit board overlap structure according to claim 5, wherein the conductive member includes at least one conductive elastic sheet, and the at least one conductive elastic sheet is wound against the rotating member. 如請求項5所述之電路板搭接結構,其中該導電構件包含複數導電彈片,該些導電彈片呈拱形柵狀而環繞且浮凸於該座體。 The circuit board lap structure according to claim 5, wherein the conductive member includes a plurality of conductive elastic sheets, and the conductive elastic sheets are arc-shaped grid-shaped surrounding and embossed on the base. 如請求項5所述之電路板搭接結構,其中該旋轉件呈筒狀而罩覆於該座體外側,並具有一環側壁,該環側壁與該導電構件相連接。 The circuit board lap structure according to claim 5, wherein the rotating member is cylindrical and covers the outside of the seat body, and has a ring side wall connected with the conductive member. 如請求項1所述之電路板搭接結構,其中該基座包含相疊合的一導電座及一隔離座,該導電座具有一導電凸塊,該隔離座具有一透孔,該導電凸塊經過該透孔顯露於該隔離座表面而形成該導電部。 The circuit board lap structure according to claim 1, wherein the base includes a conductive base and an isolation base that are superimposed, the conductive base has a conductive bump, the isolation base has a through hole, and the conductive bump The block is exposed on the surface of the isolation seat through the through hole to form the conductive portion. 如請求項9所述之電路板搭接結構,其中該隔離座還具有一定位槽,以形成該隔離部。 The circuit board overlap structure according to claim 9, wherein the isolation seat further has a positioning groove to form the isolation portion. 如請求項9所述之電路板搭接結構,其中該導電座包含相疊合的一第一導電座及一第二導電座,該第一導電座具有一導電柱,該第二導電座具有一開口,該導電柱通過該開口而凸出以形成該導電凸塊。 The circuit board lap structure according to claim 9, wherein the conductive seat includes a first conductive seat and a second conductive seat that are superimposed, the first conductive seat has a conductive column, and the second conductive seat has An opening through which the conductive pillar protrudes to form the conductive bump.
TW109132478A 2020-09-18 2020-09-18 Circuit board fastening structure TWI726814B (en)

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TW109132478A TWI726814B (en) 2020-09-18 2020-09-18 Circuit board fastening structure
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TWI828515B (en) * 2023-01-11 2024-01-01 康揚企業股份有限公司 Spacer columns with conductive function (2)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090111297A1 (en) * 2007-10-31 2009-04-30 Quanta Computer Inc. Connecting apparatus adapted in a board module
TWM484833U (en) * 2014-01-08 2014-08-21 Wistron Corp Circuit board adapter and fixing structure thereof
TWM538266U (en) * 2016-08-04 2017-03-11 Molex Taiwan Ltd Power connection device assembly and power connection device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100402448B1 (en) * 1994-04-07 2003-10-22 가부시끼가이샤 엠푸라스 Socket assembly
JP5596633B2 (en) * 2010-08-30 2014-09-24 ミック電子工業株式会社 Switch device
DE102011005173A1 (en) * 2011-03-07 2012-09-13 Robert Bosch Gmbh Contacting plug for direct contacting of a printed circuit board
WO2012171565A1 (en) * 2011-06-16 2012-12-20 Siemens Aktiengesellschaft Electrical contact device for connecting circuit boards
WO2015119257A1 (en) * 2014-02-07 2015-08-13 日本発條株式会社 Connection structure for semiconductor mounting substrate and connection unit for semiconductor mounting substrate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090111297A1 (en) * 2007-10-31 2009-04-30 Quanta Computer Inc. Connecting apparatus adapted in a board module
TWM484833U (en) * 2014-01-08 2014-08-21 Wistron Corp Circuit board adapter and fixing structure thereof
TWM538266U (en) * 2016-08-04 2017-03-11 Molex Taiwan Ltd Power connection device assembly and power connection device

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