TWI726814B - Circuit board fastening structure - Google Patents
Circuit board fastening structure Download PDFInfo
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- TWI726814B TWI726814B TW109132478A TW109132478A TWI726814B TW I726814 B TWI726814 B TW I726814B TW 109132478 A TW109132478 A TW 109132478A TW 109132478 A TW109132478 A TW 109132478A TW I726814 B TWI726814 B TW I726814B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
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Abstract
Description
本發明提出一種電路板搭接結構,尤指一種可選擇電性導通與否的電路板搭接結構。 The present invention provides a circuit board overlap structure, in particular to a circuit board overlap structure that can be electrically connected or not.
圖1為習知電路板搭接結構之示意圖。現有電子產品常有電路板之間或與其他組件的堆疊結構。如圖1所示,為了將第一電路板1、第二電路板2和底座3搭接在一起,可透過搭接柱4來連接。搭接柱4可例如是透過螺接、卡接等方式來將多個構件搭接在一起。在此,是以螺接為例說明,搭接柱4包含有螺柱41及螺帽42。螺柱41兩端分別通過第一電路板1的通孔11及第二電路板2的通孔21,一端鎖附在底座3上,另一端與螺帽42鎖附。
Figure 1 is a schematic diagram of a conventional circuit board lap structure. Existing electronic products often have a stacked structure between circuit boards or with other components. As shown in FIG. 1, in order to lap the
在一些情形下,為了使兩電路板間的電性連通,通孔11、21為導電孔,搭接柱4也是由導電材質構成。然而,在一些情形下,搭接位置若位在電路板上的電性敏感區域,會使用電性絕緣材質構成的搭接柱4來進行搭接。藉此,可避免搭接造成的電性連通引發如靜電放電(Electrostatic Discharge,ESD)或電磁干擾(Electromagnetic Interference,EMI)等問題。因此,在組裝電子產品時,因應不同的需求,需要使用不同材質的搭接柱4來進行搭接。如此一來,不僅增加備料成本,也增加組裝複雜度與生產錯誤率。
In some cases, in order to make the electrical communication between the two circuit boards, the through
鑑於上述問題,本發明一實施例提出一種電路板搭接結構,適於連接第一電路板及第二電路板。電路板搭接結構包含:基座、座體、支撐柱及旋轉件。基座用於設置於第一電路板,並包含接觸面,接觸面具有導電部及隔離部。座體用於設置於第二電路板。支撐柱連接於基座與座體之間。旋轉件電連接座體,並包含旋轉面及導電彈性體。支撐柱穿設旋轉件。導電彈性體連接於旋轉面,並朝基座延伸。旋轉件能夠相對於基座旋轉而使導電彈性體接觸導電部或隔離部。 In view of the foregoing problems, an embodiment of the present invention provides a circuit board lap structure, which is suitable for connecting the first circuit board and the second circuit board. The circuit board lap structure includes: a base, a seat body, a supporting column and a rotating part. The base is used to be arranged on the first circuit board, and includes a contact surface, and the contact surface has a conductive portion and an isolation portion. The base body is used to be arranged on the second circuit board. The support column is connected between the base and the seat body. The rotating part is electrically connected to the base body and includes a rotating surface and a conductive elastic body. The supporting column is provided with a rotating part. The conductive elastic body is connected to the rotating surface and extends toward the base. The rotating member can rotate relative to the base to make the conductive elastic body contact the conductive part or the isolation part.
在一些實施例中,導電部及隔離部分別與支撐柱接觸於接觸面的位置相距相同距離。 In some embodiments, the conductive portion and the isolation portion are respectively separated from the position where the support pillar contacts the contact surface by the same distance.
在一些實施例中,導電彈性體為一圓弧段。圓弧段的一端具有延伸部,延伸部連接於旋轉件的旋轉面。圓弧段的另一端具有接觸部,接觸部接觸於基座的接觸面。 In some embodiments, the conductive elastomer is a circular arc segment. One end of the arc segment has an extension, and the extension is connected to the rotating surface of the rotating member. The other end of the arc segment has a contact portion, and the contact portion is in contact with the contact surface of the base.
在一些實施例中,導電彈性體為一圓弧段。圓弧段包含位於相對二端的二延伸部及位於此二延伸部之間的接觸部。此二延伸部端連接於旋轉件的旋轉面。接觸部接觸於基座的接觸面。 In some embodiments, the conductive elastomer is a circular arc segment. The arc segment includes two extension portions located at two opposite ends and a contact portion located between the two extension portions. The ends of the two extensions are connected to the rotating surface of the rotating member. The contact portion is in contact with the contact surface of the base.
在一些實施例中,電路板搭接結構更包含導電構件,位於座體及旋轉件之間,使得旋轉件經由導電構件電連接座體。 In some embodiments, the circuit board overlap structure further includes a conductive member located between the base and the rotating part, so that the rotating part is electrically connected to the base via the conductive member.
在一些實施例中,導電構件包含至少一導電彈片。導電彈片呈卷繞狀的抵接旋轉件。 In some embodiments, the conductive member includes at least one conductive elastic sheet. The conductive elastic sheet is in the shape of a coil and abuts against the rotating member.
在一些實施例中,導電構件包含複數導電彈片。此些導電彈片呈拱形柵狀而環繞且浮凸於座體。 In some embodiments, the conductive member includes a plurality of conductive elastic sheets. These conductive elastic sheets are arc-shaped grids around and embossed on the base.
在一些實施例中,旋轉件呈筒狀而罩覆於座體外側,並具有環側壁,環側壁與導電構件相連接。 In some embodiments, the rotating member is cylindrical and covers the outside of the seat body, and has a ring side wall that is connected to the conductive member.
在一些實施例中,基座包含相疊合的導電座及隔離座。導電座具有導電凸塊,隔離座具有透孔。導電凸塊經過透孔顯露於隔離座表面而形成導電部。 In some embodiments, the base includes a conductive base and an isolation base that are overlapped. The conductive seat has a conductive bump, and the isolation seat has a through hole. The conductive bump is exposed on the surface of the isolation seat through the through hole to form a conductive portion.
在一些實施例中,隔離座還具有定位槽,以形成隔離部。 In some embodiments, the isolation seat further has a positioning groove to form an isolation portion.
在一些實施例中,該導電座包含相疊合的第一導電座及第二導電座。第一導電座具有導電柱,第二導電座具有開口。導電柱通過開口而凸出以形成導電凸塊。 In some embodiments, the conductive seat includes a first conductive seat and a second conductive seat that are overlapped. The first conductive seat has a conductive pillar, and the second conductive seat has an opening. The conductive pillar protrudes through the opening to form a conductive bump.
依據本發明一些實施例之電路板搭接結構,可將二電路板搭接在一起,並且可選擇此二電路板是否透過此搭接結構電性導通。如此一來,無需因應電性導通與否準備不同的搭接材料,可節省備料成本。另一方面,也能降低組裝複雜度與生產錯誤率。 According to the circuit board overlap structure of some embodiments of the present invention, two circuit boards can be overlapped together, and it can be selected whether the two circuit boards are electrically connected through the overlap structure. In this way, there is no need to prepare different lap materials according to whether the electrical conduction or not, and the material preparation cost can be saved. On the other hand, it can also reduce assembly complexity and production error rate.
1:第一電路板 1: The first circuit board
11:通孔 11: Through hole
2:第二電路板 2: The second circuit board
21:通孔 21: Through hole
3:底座 3: base
4:搭接柱 4: lap post
41:螺柱 41: Stud
42:螺帽 42: Nut
100:基座 100: Pedestal
110:導通部 110: Conduction part
120:接觸面 120: contact surface
121:導電部 121: conductive part
122:隔離部 122: Isolation Department
130:導電座 130: Conductive seat
131:導電凸塊 131: conductive bump
132:立柱 132: Column
140:隔離座 140: isolation seat
141:透孔 141: Through Hole
142:定位槽 142: positioning slot
143:窗口 143: Window
144:空心柱 144: Hollow Column
150:第一導電座 150: The first conductive seat
151:導電柱 151: Conductive column
160:第二導電座 160: second conductive seat
161:開口 161: open
162:立柱 162: Column
200:座體 200: seat body
210:導通部 210: Conduction part
220:抵接面 220: contact surface
221:凹槽 221: Groove
230:連接部 230: connecting part
300:支撐柱 300: support column
310:卡接部 310: Card connector
400:旋轉件 400: Rotating parts
410:旋轉面 410: Rotating Surface
420:導電彈性體 420: conductive elastomer
421:延伸部 421: Extension
422:接觸部 422: Contact
430:貫孔 430: Through hole
440:環側壁 440: Ring sidewall
500:導電構件 500: conductive member
510:導電彈片 510: conductive shrapnel
520:導電彈片 520: conductive shrapnel
530:導電帶 530: Conductive tape
610:第一電路板 610: The first circuit board
620:第二電路板 620: second circuit board
[圖1]為習知電路板搭接結構之示意圖。 [Figure 1] is a schematic diagram of a conventional circuit board lap structure.
[圖2]為本發明一實施例之電路板搭接結構之立體剖視圖。 [Figure 2] is a perspective cross-sectional view of a circuit board lap structure according to an embodiment of the present invention.
[圖3]為本發明一實施例之電路板搭接結構之剖面圖。 [Figure 3] is a cross-sectional view of a circuit board lap structure according to an embodiment of the present invention.
[圖4]為本發明一實施例之電路板搭接結構之另一狀態之剖面圖。 [Figure 4] is a cross-sectional view of another state of the circuit board overlap structure of an embodiment of the present invention.
[圖5]為本發明一實施例之電路板搭接結構之立體分解圖(一)。 [Figure 5] is a three-dimensional exploded view (1) of the circuit board lap structure according to an embodiment of the present invention.
[圖6]為本發明一實施例之電路板搭接結構之立體分解圖(二)。 [Figure 6] is a three-dimensional exploded view (2) of the circuit board lap structure according to an embodiment of the present invention.
[圖7]及[圖8]為本發明一些實施例之導電彈性體之立體示意圖。 [Fig. 7] and [Fig. 8] are three-dimensional schematic diagrams of conductive elastomers according to some embodiments of the present invention.
[圖9]為本發明另一實施例之基座之立體分解圖。 [Figure 9] is a perspective exploded view of a base of another embodiment of the present invention.
[圖10]為本發明另一實施例之電路板搭接結構之剖面圖。 [Figure 10] is a cross-sectional view of a circuit board lap structure according to another embodiment of the present invention.
合併參照圖2至圖6。圖2為本發明一實施例之電路板搭接結構之立體剖視圖。圖3為本發明一實施例之電路板搭接結構之剖面圖。圖4為本發明一實施例之電路板搭接結構之另一狀態之剖面圖。圖5為本發明一實施例之電路板搭接結構之立體分解圖(一)。圖6為本發明一實施例之電路板搭接結構之立體分解圖(二)。電路板搭接結構可適於連接第一電路板610及第二電路板620。電路板搭接結構包含有基座100、座體200、支撐柱300及旋轉件400。
Refer to Figure 2 to Figure 6 together. 2 is a perspective cross-sectional view of a circuit board overlap structure according to an embodiment of the invention. 3 is a cross-sectional view of a circuit board overlap structure according to an embodiment of the invention. 4 is a cross-sectional view of another state of the circuit board overlap structure according to an embodiment of the present invention. Fig. 5 is a three-dimensional exploded view (1) of the circuit board overlap structure according to an embodiment of the present invention. Fig. 6 is a three-dimensional exploded view (2) of the circuit board overlap structure according to an embodiment of the present invention. The circuit board overlap structure may be suitable for connecting the
基座100用於設置於第一電路板610。基座100包含有導通部110及接觸面120。接觸面120具有導電部121及隔離部122。導通部110與導電部121電性連接,導通部110與隔離部122電性隔絕。基座100設置於第一電路板610時,導電部121可經由導通部110和第一電路板610電性導通。在本實施例中,導通部110還可供透過表面黏著技術(Surface Mount Technology,SMT)固定設置於第一電路板610,但本發明非以此為限。在一些實施例中,基座100可透過其他方式(如插接、螺接、卡接等)固定設置於第一電路板610。
The
基座100由多個構件組成。在此,基座100包含相疊合的導電座130及隔離座140。導電座130由導電材質構成,隔離座140由電性絕緣材質構成。導電座130具有導電凸塊131,隔離座140具有透孔141。導電凸塊131經過透孔141顯露於隔離座140表面而形成導電部121。隔
離座140還具有一定位槽142,以形成隔離部122。導電座130還具有立柱132,隔離座140還具有窗口143及空心柱144。窗口143與空心柱144的內部空間連通,空心柱144的內部空間與立柱132相應。藉此,立柱132可通過窗口143伸入空心柱144的內部空間中,以形成支撐柱300。
The
在一些實施例中,隔離座140透過射出成型方式形成。
In some embodiments, the
在一些實施例中,導電部121由導電材質構成,隔離部122由電性絕緣材質構成。在一些實施例中,隔離部122由導電材質構成,並透過其他電性絕緣元件與導通部110電性隔絕。
In some embodiments, the
座體200設置於第二電路板620。座體200包含導通部210、抵接面220及連接部230。導通部210與連接部230電性連接。連接部230電性連接旋轉件400。在本實施例中,電路板搭接結構還包含有導電構件500。導電構件500由導電材質構成。導電構件500位於座體200與旋轉件400之間,而分別電性連接於旋轉件400及座體200的連接部230。藉此,旋轉件400可經由導電構件500電性連接座體200。在一些實施例中,連接部230可透過其他方式電性連接旋轉件400,例如添加導電劑(如導電油)在緊密疊套的旋轉件400與座體200之間。
The
參照圖4,支撐柱300連接於基座100與座體200之間,使得基座100與座體200保持有一間距。在本實施例中,支撐柱300的一端是固定連接基座100,支撐柱300的另一端抵接於座體200的抵接面220。在此,抵接面220是與導通部210相對,但本發明不以此為限。需說明的是,為了清楚呈現旋轉件400,圖2及圖3呈現的是支撐柱300尚未抵接座體200的抵接面220的狀態示意圖。
4, the
如圖2及圖5所示,在一些實施例中,座體200的抵接面220包含一凹槽221,可容接部分的支撐柱300,以輔助穩固地抵接支撐柱300。在此,凹槽221的開口形狀是以圓形為例,但本發明非限於此。當支撐柱300抵接於座體200,基座100與旋轉件400相接觸(為了呈現導電彈性體420,圖4並未明顯繪示)。基座100與旋轉件400提供支撐力量來維持第一電路板610與第二電路板620之間的間距。
As shown in FIGS. 2 and 5, in some embodiments, the abutting
旋轉件400包含有旋轉面410及導電彈性體420。旋轉面410上具有貫孔430,可供支撐柱300穿設旋轉件400,使得旋轉件400的旋轉面410可以支撐柱300為軸心旋轉。導電彈性體420連接於旋轉面410,並朝基座100延伸。因此,透過旋轉件400相對於基座100旋轉,而可使導電彈性體420接觸導電部121或隔離部122。當導電彈性體420接觸導電部121時,基座100的導通部110和座體200的導通部210電性連接,使得第一電路板610與第二電路板620可經由此搭接結構電性導通。當導電彈性體420接觸隔離部122時,基座100的導通部110和座體200的導通部210電性隔絕,使得第一電路板610與第二電路板620不經由此搭接結構電性導通。
The
在一些實施例中,支撐柱300固定連接基座100與座體200中的至少一者。
In some embodiments, the
在一些實施例中,支撐柱300是分別可卸式連接基座100與座體200,旋轉件400相對於支撐柱300可為可旋轉。
In some embodiments, the
在本實施例中,支撐柱300的一端具有卡接部310。在此卡接部310為箭矢狀的彈性扣爪,用於扣勾旋轉件400,以避免旋轉件400
脫離支撐柱300。支撐柱300的位於末端的箭矢狀部位(即卡接部310的末端)可供容接於座體200的抵接面220的凹槽221(如圖4所示)。
In this embodiment, one end of the
在本實施例中,旋轉件400還包含有環側壁440,連接於旋轉面410,使得旋轉件400呈一筒狀。旋轉件400罩覆於座體200外側。也就是說,筒狀的內部空間用以容置導電構件500及座體200。環側壁440與導電構件500相連接,使得座體200與旋轉件400之間經由導電構件500電性連接。
In this embodiment, the rotating
在一些實施例中,導電構件500可例如是以導線或導電彈片等形式實現。在本實施例中,導電構件500包含有複數導電彈片510、520。導電彈片520呈拱形柵狀而環繞且浮凸於座體200。也就是說,導電彈片520環繞於座體200側面間隔排列,且每一導電彈片520呈拱形而朝向遠離座體200的方向凸起。導電彈片520之凸起部位抵頂旋轉件400的環側壁440,以保持導電構件500與旋轉件400之間的電性連接,此外還可使旋轉件400保持穩固。導電構件500還包含二導電帶530,分別連接導電彈片520的兩端。在本實施例中,導電彈片510是以二個為例,但本發明不限於此,亦可為更多或更少的數量。導電彈片510的一端與導電構件500的其他構件相連(在此是連接導電帶530)以電性連接於座體200。導電彈片510呈卷繞狀而具彈性回復力,可充分抵頂旋轉件400,以保持導電構件500與旋轉件400之間的電性連接。導電彈片510朝向座體200的方向卷繞。導電彈片510除了抵接旋轉件400之外,其末端還可與座體200接觸。
In some embodiments, the
座體200還包含連接部230,以供連接導電構件500。在本
實施例中,連接部230位於座體200的側面並相對導通部210及抵接面220呈凹陷狀,使得導電構件500的柵狀導電彈片520及二導電帶530可夾卡於其中。
The base 200 further includes a connecting
在本實施例中,導電彈性體420為一圓弧段,包含分別位於相對二端的二延伸部421及位於延伸部421之間的接觸部422。延伸部421連接於旋轉件400的旋轉面410。接觸部422接觸於基座100的接觸面120。藉此,可透過將旋轉件400左旋(順時針)或右旋(逆時針)來改變導電彈性體420接觸於基座100的位置。
In this embodiment, the conductive
參照圖7及圖8,係為本發明一些實施例之導電彈性體420之立體示意圖。有別於前述實施例之導電彈性體420具有二延伸部421,在此導電彈性體420僅有一延伸部421,延伸部421位於導電彈性體420的一端,導電彈性體420的另一端具有用於接觸於基座100的接觸面120的一接觸部422。如圖7所示之旋轉件400適於以左旋來改變導電彈性體420接觸於基座100的位置;如圖8所示之旋轉件400適於以右旋來改變導電彈性體420接觸於基座100的位置。
7 and 8 are three-dimensional schematic diagrams of the
在一些實施例中,接觸部422具有一凸點,可供定位於導電部121或隔離部122,但本發明不以此為限。
In some embodiments, the
在一些實施例中,是透過對旋轉件400的旋轉面410沖切來形成為圓弧段的導電彈性體420。
In some embodiments, the conductive
參照圖3及圖6。在一些實施例中,相應於為圓弧段的導電彈性體420,基座100的導電部121及隔離部122分別與支撐柱300接觸於接觸面120的位置相距有相同距離。也就是說,導電部121及隔離部122
位於以支撐柱300接觸於接觸面120的位置為圓心的一圓周上。
Refer to Figure 3 and Figure 6. In some embodiments, corresponding to the conductive
參照圖9及圖10。圖9為本發明另一實施例之基座100之立體分解圖。圖10為本發明另一實施例之電路板搭接結構之剖面圖。相較於前述實施例之差異在於,導電座130可由多個構件組成。在此,導電座130包含相疊合的第一導電座150及第二導電座160。第一導電座150具有導電柱151,第二導電座160具有開口161及立柱162。導電柱151通過開口161而凸出,以形成導電凸塊131。立柱162可伸入空心柱144的內部空間中,以形成前述支撐柱300。相較於以單一構件來形成導電座130,透過多個構件來組成導電座130,可降低每一構件成形的製作難度。
Refer to Figure 9 and Figure 10. FIG. 9 is an exploded perspective view of a base 100 according to another embodiment of the present invention. 10 is a cross-sectional view of a circuit board overlap structure according to another embodiment of the invention. Compared with the foregoing embodiment, the difference is that the
在一些實施例中,第一導電座150及第二導電座160之間透過膠合方式固定。
In some embodiments, the first
在一些實施例中,座體200及旋轉件400是由導電材質構成。
In some embodiments, the
上述之實施例之基座100、座體200、支撐柱300、旋轉件400及導電構件500的形狀僅為例示,本發明不以此為限。
The shapes of the
依據本發明一些實施例之電路板搭接結構,可將二電路板搭接在一起,並且可選擇此二電路板是否透過此搭接結構電性導通。如此一來,無需因應電性導通與否準備不同的搭接材料,可節省備料成本。另一方面,也能降低組裝複雜度與生產錯誤率。此外,依據本發明一些實施例之電路板搭接結構,透過SMT設置在電路板上,可節省電路板的走線空間。 According to the circuit board overlap structure of some embodiments of the present invention, two circuit boards can be overlapped together, and it can be selected whether the two circuit boards are electrically connected through the overlap structure. In this way, there is no need to prepare different lap materials according to whether the electrical conduction or not, and the material preparation cost can be saved. On the other hand, it can also reduce assembly complexity and production error rate. In addition, the circuit board lap structure according to some embodiments of the present invention is arranged on the circuit board through SMT, which can save the wiring space of the circuit board.
100:基座 100: Pedestal
110:導通部 110: Conduction part
120:接觸面 120: contact surface
121:導電部 121: conductive part
122:隔離部 122: Isolation Department
130:導電座 130: Conductive seat
131:導電凸塊 131: conductive bump
140:隔離座 140: isolation seat
142:定位槽 142: positioning slot
200:座體 200: seat body
210:導通部 210: Conduction part
220:抵接面 220: contact surface
230:連接部 230: connecting part
300:支撐柱 300: support column
310:卡接部 310: Card connector
400:旋轉件 400: Rotating parts
410:旋轉面 410: Rotating Surface
420:導電彈性體 420: conductive elastomer
440:環側壁 440: Ring sidewall
500:導電構件 500: conductive member
510:導電彈片 510: conductive shrapnel
520:導電彈片 520: conductive shrapnel
530:導電帶 530: Conductive tape
610:第一電路板 610: The first circuit board
620:第二電路板 620: second circuit board
Claims (11)
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TW109132478A TWI726814B (en) | 2020-09-18 | 2020-09-18 | Circuit board fastening structure |
CN202110901603.9A CN114205999A (en) | 2020-09-18 | 2021-08-06 | Circuit board lapping structure |
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TW109132478A TWI726814B (en) | 2020-09-18 | 2020-09-18 | Circuit board fastening structure |
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TWI828515B (en) * | 2023-01-11 | 2024-01-01 | 康揚企業股份有限公司 | Spacer columns with conductive function (2) |
Citations (3)
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US20090111297A1 (en) * | 2007-10-31 | 2009-04-30 | Quanta Computer Inc. | Connecting apparatus adapted in a board module |
TWM484833U (en) * | 2014-01-08 | 2014-08-21 | Wistron Corp | Circuit board adapter and fixing structure thereof |
TWM538266U (en) * | 2016-08-04 | 2017-03-11 | Molex Taiwan Ltd | Power connection device assembly and power connection device |
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KR100402448B1 (en) * | 1994-04-07 | 2003-10-22 | 가부시끼가이샤 엠푸라스 | Socket assembly |
JPH07336004A (en) * | 1994-06-15 | 1995-12-22 | Sony Corp | Connecting structure of circuit boards |
JPH09106868A (en) * | 1995-10-11 | 1997-04-22 | Sumitomo Wiring Syst Ltd | Electric connection structure between circuit board |
JP5596633B2 (en) * | 2010-08-30 | 2014-09-24 | ミック電子工業株式会社 | Switch device |
DE102011005173A1 (en) * | 2011-03-07 | 2012-09-13 | Robert Bosch Gmbh | Contacting plug for direct contacting of a printed circuit board |
WO2012171565A1 (en) * | 2011-06-16 | 2012-12-20 | Siemens Aktiengesellschaft | Electrical contact device for connecting circuit boards |
CN202818859U (en) * | 2012-09-05 | 2013-03-20 | 台湾扣具工业股份有限公司 | Spacing pillar with conductive shrapnel |
WO2015119257A1 (en) * | 2014-02-07 | 2015-08-13 | 日本発條株式会社 | Connection structure for semiconductor mounting substrate and connection unit for semiconductor mounting substrate |
JP2017199626A (en) * | 2016-04-28 | 2017-11-02 | 第一精工株式会社 | Terminal |
CN108346874B (en) * | 2017-01-24 | 2024-04-02 | 泰科电子(上海)有限公司 | Electric connector |
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Publication number | Priority date | Publication date | Assignee | Title |
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US20090111297A1 (en) * | 2007-10-31 | 2009-04-30 | Quanta Computer Inc. | Connecting apparatus adapted in a board module |
TWM484833U (en) * | 2014-01-08 | 2014-08-21 | Wistron Corp | Circuit board adapter and fixing structure thereof |
TWM538266U (en) * | 2016-08-04 | 2017-03-11 | Molex Taiwan Ltd | Power connection device assembly and power connection device |
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TW202213873A (en) | 2022-04-01 |
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